WO2017077852A1 - 分波装置及びその設計方法 - Google Patents
分波装置及びその設計方法 Download PDFInfo
- Publication number
- WO2017077852A1 WO2017077852A1 PCT/JP2016/080810 JP2016080810W WO2017077852A1 WO 2017077852 A1 WO2017077852 A1 WO 2017077852A1 JP 2016080810 W JP2016080810 W JP 2016080810W WO 2017077852 A1 WO2017077852 A1 WO 2017077852A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- transmission
- band
- amplifier
- reception
- signal
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 17
- 230000005540 biological transmission Effects 0.000 claims abstract description 188
- 238000004891 communication Methods 0.000 claims abstract description 117
- 239000003990 capacitor Substances 0.000 claims description 15
- 230000004048 modification Effects 0.000 description 53
- 238000012986 modification Methods 0.000 description 53
- 230000000052 comparative effect Effects 0.000 description 20
- 230000035945 sensitivity Effects 0.000 description 19
- 238000002955 isolation Methods 0.000 description 17
- 238000010586 diagram Methods 0.000 description 15
- 238000013461 design Methods 0.000 description 11
- 230000000694 effects Effects 0.000 description 10
- 230000006866 deterioration Effects 0.000 description 9
- 239000000758 substrate Substances 0.000 description 7
- 239000000470 constituent Substances 0.000 description 5
- 230000001902 propagating effect Effects 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 230000002776 aggregation Effects 0.000 description 2
- 238000004220 aggregation Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 101150083317 Shox2 gene Proteins 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000005549 size reduction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/005—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges
- H04B1/0053—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges with common antenna for more than one band
- H04B1/0057—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges with common antenna for more than one band using diplexing or multiplexing filters for selecting the desired band
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F1/00—Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
- H03F1/56—Modifications of input or output impedances, not otherwise provided for
- H03F1/565—Modifications of input or output impedances, not otherwise provided for using inductive elements
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/189—High-frequency amplifiers, e.g. radio frequency amplifiers
- H03F3/19—High-frequency amplifiers, e.g. radio frequency amplifiers with semiconductor devices only
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/20—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers
- H03F3/21—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers with semiconductor devices only
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/20—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers
- H03F3/24—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers of transmitter output stages
- H03F3/245—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers of transmitter output stages with semiconductor devices only
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/72—Gated amplifiers, i.e. amplifiers which are rendered operative or inoperative by means of a control signal
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H11/00—Networks using active elements
- H03H11/02—Multiple-port networks
- H03H11/34—Networks for connecting several sources or loads working on different frequencies or frequency bands, to a common load or source
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/005—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges
- H04B1/0053—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges with common antenna for more than one band
- H04B1/006—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges with common antenna for more than one band using switches for selecting the desired band
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/40—Circuits
- H04B1/401—Circuits for selecting or indicating operating mode
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/40—Circuits
- H04B1/50—Circuits using different frequencies for the two directions of communication
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F2200/00—Indexing scheme relating to amplifiers
- H03F2200/111—Indexing scheme relating to amplifiers the amplifier being a dual or triple band amplifier, e.g. 900 and 1800 MHz, e.g. switched or not switched, simultaneously or not
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F2200/00—Indexing scheme relating to amplifiers
- H03F2200/171—A filter circuit coupled to the output of an amplifier
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F2200/00—Indexing scheme relating to amplifiers
- H03F2200/387—A circuit being added at the output of an amplifier to adapt the output impedance of the amplifier
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F2200/00—Indexing scheme relating to amplifiers
- H03F2200/451—Indexing scheme relating to amplifiers the amplifier being a radio frequency amplifier
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F2203/00—Indexing scheme relating to amplifiers with only discharge tubes or only semiconductor devices as amplifying elements covered by H03F3/00
- H03F2203/72—Indexing scheme relating to gated amplifiers, i.e. amplifiers which are rendered operative or inoperative by means of a control signal
- H03F2203/7209—Indexing scheme relating to gated amplifiers, i.e. amplifiers which are rendered operative or inoperative by means of a control signal the gated amplifier being switched from a first band to a second band
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/38—Impedance-matching networks
Definitions
- the present invention relates to a demultiplexing device and a design method thereof, and more particularly to a demultiplexing device and a design method thereof that can cope with three or more multibands.
- a demultiplexer used in a communication device is required to support a plurality of communication bands (band bands), so-called multiband.
- the present invention has been made to solve the above-mentioned problem, and while reducing the number of bands, it is possible to suppress the deterioration of the isolation between the transmission and reception terminals and make it difficult to generate a communication band in which the reception sensitivity deteriorates.
- An object of the present invention is to provide a demultiplexing device and a design method thereof.
- a branching apparatus in common to an amplifier that amplifies transmission signals of three or more communication bands having different frequency bands from each other, and an output terminal of the amplifier. And a plurality of signal paths for propagating signals in communication bands corresponding to each of the plurality of communication bands, and transmission signals and reception signals in communication bands corresponding to the plurality of signal paths, each provided in the plurality of signal paths. And a plurality of transmission / reception filters for separating the amplifiers, wherein each of the gains of the amplifiers in a plurality of frequency bands of the received signals is smaller than each of the gains of the amplifiers in a plurality of frequency bands of the transmission signals.
- the signal amplified by the amplifier is smaller than any of the frequency bands of the plurality of transmission signals in any of the frequency bands of the plurality of reception signals. For this reason, the signal of the frequency band of the received signal which leaks to the receiving side via a transmission / reception filter can be suppressed. That is, it is possible to suppress the deterioration of the isolation between the transmission and reception terminals and to make it difficult to generate a communication band in which the reception sensitivity is deteriorated while achieving multiband.
- a branching device includes an amplifier that amplifies transmission signals in three or more communication bands having different frequency bands, and an output terminal of the amplifier. And a plurality of signal paths that propagate signals in communication bands corresponding to each of the plurality of communication bands, and transmission signals in communication bands that are provided in the plurality of signal paths and that correspond to each other.
- All the first load impedances in the frequency band of the signal may be located in a region whose phase is different by 45 degrees or more from the maximum gain point of the amplifier.
- the first load impedance is located in a region where the phase differs by 45 degrees or more from the maximum point of the gain of the amplifier, so that any of the gains of the amplifiers in the frequency bands of the plurality of received signals can be obtained. Can be made smaller than any of the gains of the amplifiers in the frequency bands of a plurality of transmission signals. Therefore, the same effect as described above is achieved. That is, it is possible to suppress the deterioration of the isolation between the transmission and reception terminals and to make it difficult to generate a communication band in which the reception sensitivity is deteriorated while achieving multiband.
- the first load impedance may be located in a region where the phase differs by 90 degrees or more from the maximum point.
- the first load impedance is located in a region where the phase differs by 90 degrees or more from the maximum gain point of the amplifier, thereby suppressing the gain of the amplifier within the frequency band of the received signal.
- the gain can be made uniform. For this reason, fluctuations in reception sensitivity within the same communication band can be suppressed.
- the gain of the amplifier in the frequency band of the plurality of reception signals may be smaller than the gain of the amplifier in the frequency band of the plurality of transmission signals.
- a common matching circuit provided between the output terminal and a common node of the plurality of signal paths, and a plurality of signal paths between the common node and the plurality of transmission / reception filters are provided.
- a plurality of individual matching circuits may be provided.
- the load impedance in the frequency band of the received signal seen from the output terminal of the common matching circuit in the frequency band of the received signal can be adjusted with high accuracy by using a plurality of individual matching circuits individually provided in a plurality of signal paths. Can do. For this reason, the load impedance can be adjusted to a phase that facilitates impedance matching by the common matching circuit.
- the second load impedance in the frequency band of the plurality of received signals when the plurality of transmission / reception filter sides are viewed from the common node is The phases may be substantially matched.
- the impedance of the frequency band can be matched under the same conditions for a plurality of communication bands. That is, impedance matching can be achieved for a plurality of communication bands by the same matching circuit. For this reason, the impedance matching in a wide band including the frequency band of the received signal in a plurality of communication bands can be achieved by the common matching circuit.
- each of the plurality of individual matching circuits is configured to reduce the phase rotation amount of the second load impedance by providing the individual matching circuit in the second Smith chart. Also good.
- the individual matching circuit by configuring the individual matching circuit so that the amount of phase rotation becomes small, good impedance matching can be easily achieved, and the individual matching circuit can be downsized.
- each of the one or more individual matching circuits among the plurality of individual matching circuits includes a high-pass filter type and a low-pass filter type in which the phase rotation amount of the second load impedance is reduced in the second Smith chart. It may be configured by any one of the matching circuits.
- each of the one or more individual matching circuits among the plurality of individual matching circuits may be constituted by a wiring or an inductor.
- the circuit configuration can be simplified and downsized.
- each of the common matching circuit and the plurality of individual matching circuits includes one or more stages of LC filters including inductors and capacitors, and each of the plurality of individual matching circuits is more than the common matching circuit. You may decide to have LC filter with many stages.
- the common matching circuit can be simplified and miniaturized while adjusting the load impedance with high accuracy.
- each of one or more individual matching circuits among the plurality of individual matching circuits may be incorporated in a corresponding transmission / reception filter.
- a switch is provided between the common matching circuit and the plurality of individual matching circuits and selectively connects or opens each of the plurality of signal paths with the common node. Good.
- the switch may connect two or more signal paths among the plurality of signal paths to the common node.
- CA carrier aggregation
- the branching device design method is the following branching device design method. That is, the demultiplexing device is provided in common to an amplifier that amplifies transmission signals in a plurality of communication bands of three or more different in frequency band, and an output terminal of the amplifier, and each of the plurality of communication bands includes A plurality of signal paths for propagating signals in corresponding communication bands, a plurality of transmission / reception filters provided in the plurality of signal paths, each separating a transmission signal and a reception signal in a corresponding communication band, and the output terminal A common matching circuit provided between a common node of the plurality of signal paths, and a plurality of individual matching circuits provided in the plurality of signal paths between the common node and the plurality of transmission / reception filters.
- the design method of the branching device is the Smith chart normalized by the impedance of the plurality of signal paths, and the load in the frequency band of the plurality of received signals when the plurality of transmission / reception filter sides are viewed from the common node.
- the load impedance in the frequency band of the plurality of received signals when viewed from the output terminal side from the output terminal is located in a region where the phase differs by 45 degrees or more from the maximum point of the gain of the amplifier,
- a second adjustment step of adjusting an element value of the common matching circuit is located in a region where the phase differs by 45 degrees or more from the maximum point of the gain of the amplifier.
- the demultiplexing device and the like it is possible to suppress the deterioration of isolation between the transmission and reception terminals and to make it difficult to generate a communication band in which the reception sensitivity deteriorates while achieving multiband.
- FIG. 1 is a circuit configuration diagram of a PA module according to an embodiment.
- FIG. 2A is a Smith chart showing the load impedance and the equal gain circle in the transmission signal band on the output terminal end face of the amplifier in the embodiment.
- FIG. 2B is a Smith chart showing the load impedance in the transmission signal band on the selection terminal end face of the switch in the embodiment.
- FIG. 3A is a Smith chart showing the load impedance and the equal gain circle in the reception signal band on the output terminal end face of the amplifier in the embodiment.
- FIG. 3B is a Smith chart illustrating the load impedance in the reception signal band on the selection terminal end face of the switch in the embodiment.
- FIG. 4 is a circuit configuration diagram of a PA module according to a comparative example of the embodiment.
- FIG. 4 is a circuit configuration diagram of a PA module according to a comparative example of the embodiment.
- FIG. 5A is a Smith chart showing the load impedance and the equal gain circle in the transmission signal band on the output terminal end face of the amplifier in the comparative example of the embodiment.
- FIG. 5B is a Smith chart showing the load impedance in the transmission signal band on the selection terminal end face of the switch in the comparative example of the embodiment.
- FIG. 6A is a Smith chart showing the load impedance and the equal gain circle in the reception signal band on the output terminal end face of the amplifier in the comparative example of the embodiment.
- FIG. 6B is a Smith chart showing the load impedance in the reception signal band on the selection terminal end face of the switch in the comparative example of the embodiment.
- FIG. 7 is a graph showing isolation characteristics at Band 20 in the embodiment and the comparative example.
- FIG. 8 is a circuit configuration diagram of a PA module according to the first modification.
- FIG. 9 is a circuit configuration diagram of a PA module according to the second modification.
- FIG. 10 is a circuit configuration diagram of a PA module according to the third modification.
- FIG. 11 is a circuit configuration diagram of a PA module according to the fourth modification.
- FIG. 12 is a circuit configuration diagram of a PA module according to Modification 5.
- FIG. 13 is a flowchart illustrating a method of designing a branching device.
- a PA (Power Amplifier) module will be described as an example of a demultiplexing device including an amplifier that amplifies transmission signals in a plurality of communication bands of three or more different frequency bands.
- the PA module according to the present embodiment is a module that amplifies a transmission signal input from an RFIC (Radio Frequency Integrated Circuit) or the like and outputs the amplified signal to an antenna or the like.
- the PA module is a module that can amplify transmission signals of a plurality of communication bands of 3 or more, and is a small-sized mobile phone that conforms to a communication standard such as LTE (Long Term Evolution). Installed in wireless communication equipment.
- FIG. 1 is a circuit configuration diagram of a PA module 1 according to the present embodiment.
- the transmission input terminal Ptx, the antenna terminal Pant. , And signals input to or output from the reception output terminals Prx1 to Prx4 are surrounded by a broken line.
- the PA module 1 shown in the figure is a multi-band compatible PA module capable of switching a transmission / reception communication band (Band).
- the PA module 1 amplifies a transmission signal of three or more communication bands input to the transmission input terminal Ptx to amplify the antenna terminal Pant. Output from. Further, the PA module 1 includes an antenna terminal Pant. The reception signals of the three or more communication bands input to are output from the reception output terminals Prx1 to Prx4.
- the PA module 1 includes, for example, Band 26 (transmission signal band: 814-849 MHz, reception signal band: 859-894 MHz), Band 8 (transmission signal band: 880-915 MHz, reception signal band: 925-960 MHz), Band 20 (transmission signal band: 832-862 MHz, reception signal band: 791-821 MHz), and Band 12 (transmission signal band: 699-716 MHz, reception signal band: 729-746 MHz). It corresponds to one communication band.
- Band 26 transmission signal band: 814-849 MHz, reception signal band: 859-894 MHz
- Band 8 transmission signal band: 880-915 MHz, reception signal band: 925-960 MHz
- Band 20 transmission signal band: 832-862 MHz, reception signal band: 791-821 MHz
- Band 12 transmission signal band: 699-716 MHz, reception signal band: 729-746 MHz. It corresponds to one communication band.
- the transmission signals of the four communication bands are input to the transmission input terminal Ptx.
- a signal (transmission signal) input to the transmission input terminal Ptx is shown in a rectangular shape surrounded by a broken line.
- a transmission signal of Band 26 is represented as “B26Tx”.
- the antenna terminal Pant From, the transmission signals of the four communication bands are output, and the reception signals of the four communication bands are input.
- a signal output from or an input signal (a transmission signal or a reception signal, that is, a transmission / reception signal) is enclosed by a double broken line having a rectangular shape and a rounded rectangular shape.
- the transmission / reception signal of Band 26 is “B26TRx”. It is written.
- reception signals of the four communication bands are output from the reception output terminals Prx1 to Prx4.
- signals (reception signals) output from each of the reception output terminals Prx1 to Prx4 are surrounded by a rounded rectangular broken line.
- a reception signal of Band26 is represented as “B26Rx”. .
- the description of the transmission signal, the reception signal, and the transmission / reception signal has been described by using Band 26 as an example, the description of the signal of the communication band other than this is similarly expressed by using numbers corresponding to the communication band. Yes.
- the other figures shown below are similarly described. In other figures shown below, the above signal notation may be used as the frequency band of the transmission signal and the reception signal.
- the PA module 1 includes an amplifier 10, a common matching circuit 20, a switch 30, an individual matching circuit group 40G having a plurality of individual matching circuits 40, and a plurality of transmission / receptions.
- a filter 50, a switch 60, and a plurality of signal paths 70 are provided.
- the amplifier 10 is, for example, a multi-band compatible PAIC that amplifies transmission signals of three or more communication bands having different frequency bands.
- the amplifier 10 amplifies transmission signals in four communication bands (here, Band 26, Band 4, Band 20, and Band 12).
- the amplifier 10 includes a power amplifier circuit such as a broadband amplifier circuit manufactured using a semiconductor substrate such as Si or GaAs.
- the power amplifier circuit includes, for example, amplifying elements such as FETs (Field-Effect-Transistors) and HBTs (Heterojunction-Bipolar-Transistors) connected in multiple stages, and is formed on a semiconductor substrate.
- the power amplifier circuit may include a matching circuit disposed between the stages of the plurality of amplifier elements, or at the input end or the output end.
- the common matching circuit 20 is a matching circuit provided between the output terminal of the amplifier 10 and a common node of a plurality of signal paths 70 (four signal paths 71 to 74 in the present embodiment).
- the common node is a node in which a plurality of signal paths 70 are bundled, and is a common terminal of the switch 30 in the present embodiment.
- the common matching circuit 20 is a circuit that performs impedance matching (matching) between the output impedance of the amplifier 10 and the common node.
- the common matching circuit 20 is configured (designed) so as to satisfy a predetermined condition. Since this condition will be described later, an example of a specific configuration of the common matching circuit 20 will be described below. Note that the configuration of the common matching circuit 20 described below is an example, and any configuration may be used as long as a predetermined condition described later is satisfied.
- a matching circuit has a series reactance element and a parallel reactance element.
- the common matching circuit 20 of the present embodiment includes an inductor L1 and a capacitor C2 in order from the amplifier 10 side as the series reactance element, and a shunt of the connection node between the inductor L1 and the capacitor C2 as the parallel reactance element to the ground. It is comprised by the T-type circuit which has the capacitor
- the switch 30 is provided between the common matching circuit 20 and a plurality of individual matching circuits 40 (four individual matching circuits 41 to 44 in the present embodiment), and selectively selects each of the plurality of signal paths 70 as a common node.
- This is a duplexer that is connected to or opened. That is, the switch 30 switches the connection between the output terminal of the common matching circuit 20 and the individual matching circuit group 40G.
- the switch 30 has, for example, one common terminal and four selection terminals.
- One common terminal is connected to the output terminal of the common matching circuit 20, and the four selection terminals are connected to the individual matching circuits 41 to 41, respectively. 44 is connected to one terminal.
- the switch 30 connects any one of the four selection terminals to the common terminal in accordance with an RFIC control signal.
- the switch 60 together with the switch 60, functions as a band change switch that switches the communication band of the PA module 1.
- the individual matching circuit 40 is a matching circuit provided in a plurality of signal paths 70 between the common node and the plurality of transmission / reception filters 50.
- four individual matching circuits 40 are provided in four signal paths 70 (signal paths 71 to 74).
- each of the plurality of individual matching circuits 40 is configured (designed) so as to satisfy a predetermined condition. Since the predetermined condition will be described later, an example of a specific configuration of the individual matching circuit 40 will be described below. Note that the configuration of the individual matching circuit 40 described below is an example, and any configuration may be used as long as a predetermined condition described later is satisfied.
- Each of the plurality of individual matching circuits 40 corresponds to each communication band of the transmission signal input to the PA module 1.
- the individual matching circuit 41 is a matching circuit provided in the signal path 71 corresponding to the Band 26 and is a circuit for matching the impedance between the switch 30 and the transmission / reception filter 51.
- the individual matching circuit 41 includes, in order from the switch 30 side, an inductor L11 that is a series reactance element, C11 that is a parallel reactance element, L12 that is a series reactance element, and C12 that is a parallel reactance element.
- the individual matching circuit 41 is an LPF type (low-pass filter type) matching circuit composed of two stages of LC filters.
- the individual matching circuit 42 is a matching circuit provided in the signal path 72 corresponding to Band 8 and is a circuit for matching impedance between the switch 30 and the transmission / reception filter 52.
- the individual matching circuit 42 is an LPF type (low-pass filter type) matching circuit composed of two stages of LC filters, and includes inductors L21 and L22, a capacitor C21, C22.
- the individual matching circuit 43 is a matching circuit provided in the signal path 73 corresponding to the Band 20, and is a circuit for matching impedance between the switch 30 and the transmission / reception filter 53.
- the individual matching circuit 43 includes, in order from the switch 30 side, an inductor L31 that is a parallel reactance element, a capacitor C31 that is a series reactance element, and an inductor L32 that is a parallel reactance element. That is, the individual matching circuit 43 is an HPF type (high-pass filter type) matching circuit configured by a ⁇ -type LC filter.
- the individual matching circuit 44 is a matching circuit provided in the signal path 74 corresponding to the Band 12, and is a circuit for matching impedance between the switch 30 and the transmission / reception filter 54.
- the individual matching circuit 44 is an LPF type (low-pass filter type) matching circuit composed of two stages of LC filters, and includes inductors L41 and L42 and capacitors C41, C42.
- each of the individual matching circuits 41, 42, and 44 may be configured by a single stage LC filter.
- the above LC filter may be used.
- the individual matching circuit 43 is not limited to a ⁇ -type configuration, and may be a T-type configuration or an L-type configuration.
- the number of stages of the LC filters constituting each individual matching circuit 40 may be the same or different.
- the plurality of transmission / reception filters 50 are, for example, duplexers configured by SAW filters or the like that are provided in the plurality of signal paths 70 and each separate a transmission signal and a reception signal in a corresponding communication band.
- each transmission / reception filter 50 includes a transmission terminal connected to the individual matching circuit 40 and an antenna terminal Pant. And a reception terminal connected to the reception output terminals Prx1 to Prx4 of the corresponding communication band.
- four transmission / reception filters 50 (transmission / reception filters 51 to 54) are provided in four signal paths 70 (signal paths 71 to 74).
- the transmission / reception filter 51 is provided in the signal path 71 corresponding to the Band 26 and separates the transmission signal and the reception signal of the Band 26. Specifically, the transmission / reception filter 51 filters the transmission signal input from the individual matching circuit 41 to the transmission terminal in the band 26 transmission signal band and outputs the filtered signal from the common terminal.
- the transmission / reception filter 51 includes an antenna terminal Pant. The received signal input to the common terminal via the switch 60 is filtered by the band of the received signal of Band 26 and output to the reception output terminal Prx1.
- Each of the transmission / reception filters 52 to 54 is substantially the same as the transmission / reception filter 51 except that the signal path 70 provided with the transmission / reception filters 52 to 54 and the communication band of the transmission signal and reception signal to be separated are different. Therefore, detailed description is omitted.
- Switch 60 includes a plurality of transmission / reception filters 50 and an antenna terminal Pant. And each of the plurality of signal paths 70 is connected to the antenna terminal Pant. Select to connect or release.
- the switch 60 has four selection terminals and one common terminal, and the four selection terminals are connected to the transmission terminals of the four transmission / reception filters 51 to 54, respectively. For example, the switch 60 connects any one of the four selection terminals to the common terminal in accordance with an RFIC control signal.
- the plurality of signal paths 70 are transmission paths (wirings) such as microstrip lines that are provided in common at the output terminal of the amplifier 10 and propagate signals in the communication bands corresponding to the plurality of communication bands. .
- the plurality of signal paths 70 are provided so as to be connectable to the output terminal of the amplifier 10 by the switch 30.
- the PA module 1 as described above is configured as a composite module as follows, for example.
- the composite module has a circuit board such as a low-temperature sintered ceramic substrate (LTCC substrate: Low Temperature Co-fired Ceramic substrate) or a resin multilayer substrate formed by laminating a glass epoxy substrate.
- LTCC substrate Low Temperature Co-fired Ceramic substrate
- a resin multilayer substrate formed by laminating a glass epoxy substrate.
- an amplifier 10 a common matching circuit 20, a switch 30, an individual matching circuit group 40G, a switch 60, and the like are mounted as an IC or a chip component.
- these ICs or chip parts are sealed with a sealing resin such as an epoxy resin.
- the transmission / reception filter 50 composed of a SAW filter or the like may be mounted on the circuit board or the sealing resin.
- FIG. 2A is a Smith chart showing the load impedance and the equal gain circle in the transmission signal band at the output terminal end face of the amplifier 10 in the PA module 1 according to the present embodiment.
- the transmission signal band refers to the transmission signal band of each communication band (band).
- the transmission signal band of Band 26 is 814-849 MHz.
- the equal gain circle is a line in which points where the gain of the amplifier 10 is constant in the transmission signal band are plotted. In the figure, equal gain circles are shown at intervals of 1 dB from the maximum gain point (Max Gain in the figure) from 38.4 dB.
- the Smith chart shown in the figure is a first Smith chart normalized by the output impedance of the amplifier 10 (3 ⁇ in the present embodiment).
- the load impedance shown in the figure is a first load impedance (load impedance Z (PAout) in FIG. 1) when the plurality of transmission / reception filter 50 sides are viewed from the output terminal of the amplifier 10.
- the figure shows the load impedance in the frequency bands of a plurality of transmission signals (that is, transmission signals in a plurality of communication bands).
- the load impedance Z (PAout) in the transmission signal band is located at the center of the first Smith chart in any communication band.
- the amplifier 10 amplifies the transmission signal of any communication band with the same gain.
- FIG. 2B is a Smith chart showing the load impedance in the transmission signal band at the selection terminal end face of the switch 30 in the PA module 1 according to the present embodiment.
- the Smith chart shown in the figure is a second Smith chart normalized by the characteristic impedance of the plurality of signal paths 70 (50 ⁇ in the present embodiment).
- the load impedance shown in the figure is a second load impedance (load impedance Z (SW) in FIG. 1) when the plurality of transmission / reception filter 50 sides are viewed from the selection terminal end face of the switch 30.
- the figure shows the load impedance in the frequency bands of a plurality of transmission signals (that is, transmission signals in a plurality of communication bands).
- the load impedance Z (SW) in the transmission signal band is located at the center of the second Smith chart in any communication band.
- FIG. 3A is a Smith chart showing the load impedance and the equal gain circle in the received signal band at the output terminal end face of the amplifier 10 in the PA module 1 according to the present embodiment.
- the reception signal band refers to the reception signal band of each communication band (band).
- the reception signal band of Band 26 is 859-894 MHz.
- the equal gain circle is a line in which the points at which the gain of the amplifier 10 is constant in the received signal band are plotted. In the figure, equal gain circles are shown at intervals of 1 dB from the maximum gain point (Max Gain in the figure) 39 dB.
- the Smith chart and the load impedance shown in the same figure are the first Smith chart and the first load impedance as in FIG. 2A.
- the figure shows the load impedance Z (PAout) in the frequency bands of a plurality of received signals (that is, received signals in a plurality of communication bands).
- each of the gains of the amplifier 10 in the frequency band of the plurality of reception signals shown in FIG. 3A (the reception signals of Band 26, Band 8, Band 20, and Band 12 in this embodiment) is shown in FIG. 2A. It is smaller than each of the gains of the amplifier 10 in the frequency band of a plurality of transmission signals (transmission signals of Band 26, Band 8, Band 20, and Band 12 in this embodiment). That is, all gains in the reception signal band (Rx band gain) are smaller than all gains in the transmission signal band (Tx band gain).
- the common matching circuit 20 described above is configured such that the Rx band gain and the Tx gain satisfy such a relationship.
- the locus of the load impedance Z (PAout) in the frequency band of a plurality of received signals is the gain of the amplifier 10. Is located in an area of less than 31 dB.
- the locus of the load impedance Z (PAout) in the frequency band of a plurality of transmission signals is the gain of the amplifier 10. Is located in an area of 33 dB or more.
- any of the gain ranges of the amplifier 10 ranging from the lower limit frequency to the upper limit frequency in the frequency band of each of the plurality of received signals from any of the gain ranges of the amplifier 10 ranging from the lower limit frequency to the upper limit frequency of each of the plurality of transmission signals. Is also getting smaller. That is, all gain ranges of the reception signal band are smaller than all gain ranges of the transmission signal band.
- all load impedances Z (PAout) in the frequency bands of a plurality of received signals are the gains of the amplifier 10. Is located in a region where the phase differs by 45 degrees or more from the maximum point (maximum gain point).
- the common matching circuit 20 described above is such that the load impedance Z (PAout) in the frequency band of a plurality of received signals is such as to the maximum gain of the amplifier 10. It is configured to satisfy the relationship.
- the locus of the load impedance Z (PAout) in the frequency band of the plurality of received signals is ⁇ + 45 ° or more and ⁇ It is located in a phase region of 45 ° or less.
- the locus of the load impedance Z (PAout) becomes longer as the frequency band of the received signal is wider.
- all of the locus is located in the phase region of ⁇ + 45 degrees or more and ⁇ 45 degrees or less.
- the load impedance Z (PAout) is located in a region where the phase differs from the maximum gain point by 45 degrees or more from the lower limit frequency to the upper limit frequency in each frequency band of the plurality of received signals. To do.
- the load impedance Z (PAout) is preferably located in a region where the phase differs by 90 degrees or more from the maximum point of gain of the amplifier 10 (maximum gain point). .
- the locus is preferably located in the phase region of ⁇ + 90 ° or more and ⁇ 90 ° or less in the first Smith chart.
- FIG. 3B is a Smith chart showing the load impedance in the reception signal band at the selection terminal end face of the switch 30 in the PA module 1 according to the present embodiment.
- the Smith chart and the load impedance shown in the figure are the second Smith chart and the second load impedance as in FIG. 2B.
- the figure shows the load impedance Z (SW) in the frequency bands of a plurality of received signals (that is, received signals in a plurality of communication bands).
- the phases of the load impedances Z (SW) in the frequency bands of the plurality of received signals substantially coincide. That is, in the second Smith chart, the phases of the load impedances in the frequency bands of the plurality of received signals when the plurality of transmission / reception filters 50 are viewed from the common terminal of the switch 30 also substantially coincide with each other.
- substantially match includes not only completely matching but also approximately matching, for example, not matching completely due to error or difference in bandwidth of frequency band. It is.
- the plurality of individual matching circuits 40 described above are such that the phase of the load impedance Z (SW) in the frequency band of the received signal in the corresponding communication band substantially matches. It consists of That is, each of the plurality of individual matching circuits 40 is configured such that the phase condition of the load impedance Z (SW) is in an arbitrary phase range in the second Smith chart.
- the individual matching circuit 40 the amount of phase rotation by the individual matching circuit 40 increases as the element values of the series reactance element and the parallel reactance element increase. For this reason, when the phase rotation amount for moving the phase of the load impedance Z (SW) to an arbitrary phase range is large, the individual matching circuit 40 may be provided with a series reactance element and a parallel reactance element having a large element value. .
- each of the plurality of individual matching circuits 40 includes a load impedance Z (( SW) is configured to reduce the phase rotation amount.
- each of the plurality of individual matching circuits 40 is one of the HPF type and LPF type matching circuits in which the phase rotation amount of the load impedance Z (SW) is small in the second Smith chart. It is configured.
- the phase rotation direction of the load impedance Z (SW) due to the provision of the individual matching circuit 40 is counterclockwise in the second Smith chart when the individual matching circuit 40 is of the HPF type, and is first when the individual matching circuit 40 is of the LPF type. It turns right in the second Smith chart.
- the individual matching circuit 40 is either an HPF type or an LPF type so that the phase rotation amount to be moved to the above arbitrary phase range is small in the right rotation and the left rotation. It consists of
- the load impedance Z (SW) of the Band 26, Band 8, and Band 12 has a phase rotation amount up to the above-described arbitrary phase range to the right of the left rotation. The rotation is located in a smaller area. Therefore, the individual matching circuits 41, 42, and 44 corresponding to Band 26, Band 8, and Band 12 are configured as an LPF type as described above.
- the load impedance Z (SW) of the Band 20 is located in a region where the amount of phase rotation up to the above arbitrary phase range is smaller in the left rotation than in the right rotation. Yes. Therefore, the individual matching circuit 43 corresponding to the Band 20 is configured as an HPF type as described above.
- the inventor of the present application provides a reception signal caused by a transmission signal output from the amplifier 10 by providing a phase adjustment circuit for each of a plurality of communication bands as in the conventional branching device described in Patent Document 1.
- the structure which suppresses the noise component of was considered.
- FIG. 4 is a circuit configuration diagram of a PA module 1A according to a comparative example configured based on such an idea.
- the PA module 1A shown in the figure is different in the configurations of the common matching circuit 20A and the plurality of individual matching circuits 40A from the PA module 1 according to the embodiment.
- a plurality of individual matching circuits 40A (here, four individual matching circuits 41A to 44A) shown in the figure are inductors for adjusting the phase of the signal output from the amplifier 10.
- the common matching circuit 20A shown in the figure includes an inductor LA1 that is a series reactance element, a capacitor CA1 that is a parallel reactance element, an inductor LA2 that is a series reactance element, and a capacitor CA2 that is a parallel reactance element in order from the switch 30 side. And a capacitor CA3 which is a series reactance element.
- FIG. 5A is a Smith chart showing the load impedance and the equal gain circle in the transmission signal band on the output terminal end face of the amplifier 10 in the PA module 1A according to the comparative example.
- the Smith chart shown in the figure is the first Smith chart normalized by the output impedance of the amplifier 10 as in FIG. 2A.
- the load impedance shown in the figure is the load impedance (load impedance Z ′ (PAout) in FIG. 4) when the plurality of transmission / reception filters 50 are viewed from the output terminal of the amplifier 10 in this comparative example.
- the figure shows the load impedance in the frequency bands of a plurality of transmission signals (that is, transmission signals in a plurality of communication bands).
- the load impedance Z ′ (PAout) in the transmission signal band is located at the center of the first Smith chart.
- the amplifier 10 amplifies the transmission signal of any communication band with the same gain.
- FIG. 5B is a Smith chart showing the load impedance in the transmission signal band at the selection terminal end face of the switch 30 in the PA module 1A according to the comparative example.
- the Smith chart shown in the figure is a second Smith chart normalized by the characteristic impedances (50 ⁇ in the present embodiment) of the plurality of signal paths 70, as in FIG. 2B.
- the load impedance shown in the figure is the load impedance (load impedance Z ′ (SW) in FIG. 4) when the plurality of transmission / reception filters 50 are viewed from the selection terminal end face of the switch 30.
- the figure shows the load impedance in the frequency bands of a plurality of transmission signals (that is, transmission signals in a plurality of communication bands).
- the load impedance Z ′ (SW) in the transmission signal band is located at the center of the second Smith chart.
- the inventor of the present application has noticed that the reception sensitivity may deteriorate in the PA module 1A such as the comparative example when developing the multi-band compatible PA module.
- the present inventor measured the load impedances Z ′ (PAout) and Z ′ (SW) in the reception signal band for a plurality of communication bands in order to identify the factors that deteriorate the reception sensitivity.
- FIG. 6A and 6B are Smith charts showing such load impedance. That is, FIG. 6A is a Smith chart showing the load impedance and the equal gain circle in the reception signal band at the output terminal end face of the amplifier 10 in the PA module 1A according to the comparative example. FIG. 6B is a Smith chart showing the load impedance in the reception signal band on the selection terminal end face of the switch 30 in the PA module 1A according to the comparative example.
- the Smith chart shown in FIG. 6A is a first Smith chart normalized by the output impedance of the amplifier 10 as in FIG. 2A.
- 6B is a second Smith chart normalized by the characteristic impedance (50 ⁇ in the present embodiment) of the plurality of signal paths 70, as in FIG. 2B.
- the load impedance Z ′ (PAout) in the received signal band is located in the periphery of the first Smith chart. This is no problem from the viewpoint of transmission characteristics.
- the inventor of the present application has the load impedance Z ′ (PAout) in the region where the gain of the amplifier 10 is large. Noticed that there may be a communication band where) is located. For example, focusing on Band 20, the load impedance Z ′ (PAout) in the received signal band is located in a relatively close region of the maximum gain point (Max Gain in FIG. 6A).
- the inventors of the present application have come to the idea that a large gain of the amplifier 10 in the reception signal band can be a factor of deterioration in reception sensitivity.
- the inventor of the present application has obtained the first idea of the PA module 1 according to the embodiment.
- the idea is to make any of the gains of the amplifier 10 in the frequency bands of the plurality of reception signals smaller than any of the gains of the amplifier 10 in the frequency bands of the plurality of transmission signals.
- the inventor of the present application has noticed the following as a factor that a communication band in which the load impedance Z ′ (PAout) is located in a region where the gain of the amplifier 10 is large.
- the load impedance Z ′ (PAout) in the reception signal band in the plurality of communication bands varies in phase.
- the present inventor obtained the second idea of the PA module 1 according to the embodiment. That is, the idea has been obtained that the load impedance Z ′ (PAout) in the reception signal band in the plurality of communication bands is positioned in a predetermined phase region on the first Smith chart.
- the load impedance Z ′ (SW) in the reception signal band when the plurality of transmission / reception filter 50 sides are viewed from the selection terminal end face of the switch 30 is plural.
- the phases of the communication bands are different from each other.
- the phase of the load impedance Z ′ (PAout) in which the common matching circuit 20A is provided and the phase is rotated in the same manner for a plurality of communication bands varies as much as the phase variation of the load impedance Z ′ (SW). Will be.
- the inventor of the present application has the idea of suppressing the variation in the phase of the load impedance Z ′ (SW) in the second Smith chart, that is, making the phase condition uniform as a mode for realizing the second idea. It was.
- the frequency bands of a plurality of received signals (the received signals of Band26, Band8, Band20, and Band12 in the present embodiment).
- Each of the gains of the amplifier 10 is smaller than each of the gains of the amplifier 10 in the frequency band of a plurality of transmission signals (transmission signals of Band 26, Band 8, Band 20, and Band 12 in this embodiment).
- the signal amplified by the amplifier 10 becomes smaller than any of the frequency bands of the plurality of transmission signals in any of the frequency bands of the plurality of reception signals. For this reason, the signal (Rx band noise) of the frequency band of the received signal leaking to the receiving side through the transmission / reception filter 50 can be suppressed. That is, it is possible to suppress the deterioration of the isolation between the transmission and reception terminals and to make it difficult to generate a communication band in which the reception sensitivity is deteriorated while achieving multiband.
- the isolation between the transmission / reception terminals refers to the isolation between the terminal to which the transmission signal is input and the terminal to which the reception signal is output.
- FIG. 7 is a graph showing isolation characteristics at Band 20 in the present embodiment and the comparative example. Specifically, this figure shows the isolation between the transmission input terminal Ptx and the reception output terminal Prx3 in Band 20 during the small signal operation.
- the isolation is improved by 11 dB or more in the received signal band of Band 20 (791 to 821 MHz) as compared with the comparative example.
- the reception sensitivity of the Band 20 can be improved. That is, in the comparative example, the reception sensitivity is deteriorated in Band 20, but in the present embodiment, since the deterioration can be suppressed, it is possible to make it difficult to generate a communication band in which the reception sensitivity is deteriorated.
- the transmission characteristics can be maintained without deteriorating as compared with the comparative example. That is, according to the present embodiment, it is possible to suppress the signal (Rx band noise) in the frequency band of the reception signal leaking to the reception side while maintaining good transmission characteristics.
- the first Smith chart normalized by the output impedance of the amplifier 10 3 ⁇ in the present embodiment
- a plurality of transmission / reception filter sides when viewed from the output terminal of the amplifier 10
- the first load impedance Z (PAout) in the frequency band of the received signal is located in a region where the phase differs by 45 degrees or more from the maximum gain of the amplifier 10 (see FIG. 3A).
- the first load impedance Z (PAout) is located in a region where the phase differs by 45 degrees or more from the maximum point of the gain of the amplifier 10, so that in the frequency band of a plurality of received signals.
- Any of the gains of the amplifier 10 can be made smaller than any of the gains of the amplifier 10 in the frequency bands of a plurality of transmission signals. Therefore, the same effect as described above is achieved. That is, it is possible to suppress the deterioration of the isolation between the transmission and reception terminals and to make it difficult to generate a communication band in which the reception sensitivity is deteriorated while achieving multiband.
- all the first load impedances Z (PAout) in the frequency bands of the plurality of received signals are different in phase by 90 degrees or more from the maximum gain point of the amplifier 10. It is preferably located in the region (see FIG. 3A).
- the first load impedance Z (PAout) is located in a region where the phase differs by 90 degrees or more from the maximum gain of the amplifier 10, so that the frequency within the frequency band of the received signal While the gain of the amplifier 10 is suppressed, the gain is made uniform. For this reason, fluctuations in reception sensitivity within the same communication band can be suppressed.
- a common matching circuit 20 and a plurality of signal paths 70 provided between the amplifier 10 and a common node of the plurality of signal paths (a common terminal of the switch 30 in the present embodiment) are provided.
- Individual matching circuit 40 Individual matching circuit 40.
- the frequency band of the received signal viewed from the output terminal of the common matching circuit 20 to the individual matching circuit 40 side.
- the load impedance can be adjusted with high accuracy. For this reason, the load impedance can be adjusted to a phase that facilitates impedance matching by the common matching circuit 20.
- the second load impedance Z in the frequency band of the plurality of received signals is used.
- SW has substantially the same phase (see FIG. 3B).
- the phase of the load impedance in the frequency band (received signal band) of the received signal when the individual matching circuit 40 side is viewed from the output terminal of the common matching circuit 20 substantially matches.
- the impedance of the frequency band can be matched under the same conditions for a plurality of communication bands. That is, impedance matching can be achieved for a plurality of communication bands by the same matching circuit.
- the common matching circuit 20 can achieve impedance matching in a wide band including frequency bands of received signals in a plurality of communication bands.
- each of the plurality of individual matching circuits 40 is configured such that the amount of phase rotation is small in the second Smith chart.
- the transmission loss (loss) by the matching circuit increases.
- the frequency band for impedance matching is a wide band
- the element value of the reactance element that constitutes the matching circuit also increases, so that the matching circuit may be increased in size.
- the individual matching circuit 40 so as to reduce the amount of phase rotation, good impedance matching can be easily achieved and the individual matching circuit 40 can be downsized.
- each of one or more individual matching circuits 40 (all of the plurality of individual matching circuits 40 in the present embodiment) out of the plurality of individual matching circuits 40 is the above-described phase rotation. It is composed of either an HPF type or LPF type matching circuit whose amount is small.
- the individual matching circuit 40 is configured as an HPF type or an LPF type is not limited to the configuration according to the amount of phase rotation described above, and for example, the frequency between the frequency band of the transmission signal and the frequency band of the reception signal It may be configured according to the size relationship.
- the individual matching circuit 40 in the present embodiment, the individual matching circuit 40 corresponding to a communication band whose band frequency is lower than the center frequency of the frequency band of the received signal (for example, Band 26, Band 8, Band 12, etc.)
- the matching circuits 41, 42, and 44 are configured by LPF type matching circuits.
- the individual matching circuit 40 (in this embodiment, the individual matching circuit 43) corresponding to a communication band (for example, Band 20 or the like) in which the center frequency of the frequency band of the transmission signal is equal to or higher than the center frequency of the frequency band of the reception signal
- a communication band for example, Band 20 or the like
- An HPF type matching circuit may be used.
- the configuration of the PA module may be different from the above embodiment. That is, the PA module only needs to be configured to satisfy at least one of the following (i) and (ii), and the detailed configuration is not limited to the above embodiment.
- Any of the gains of the amplifiers 10 in the frequency bands of the plurality of reception signals is smaller than any of the gains of the amplifiers 10 in the frequency bands of the plurality of transmission signals.
- the first load impedance Z (PAout) is located in a region where the phase differs from the maximum point of the gain of the amplifier 10 by 45 degrees or more.
- each of the plurality of individual matching circuits 40 is a two-stage LC filter, but each of the plurality of individual matching circuits may be a one-stage LC filter.
- the PA module configured as described above will be described.
- FIG. 8 is a circuit configuration diagram of the PA module 2 according to the first modification.
- the PA module 2 shown in the figure includes an individual matching circuit group 240G having a plurality of individual matching circuits 240 instead of the individual matching circuit group 40G, as compared with the PA module 1 of the embodiment.
- each of the plurality of individual matching circuits 240 (four individual matching circuits 241 to 244 in this modification) is composed of one stage LC filter.
- each of the individual matching circuits 241, 242, and 244 includes an LPF type LC filter including an inductor that is a series reactance element and a capacitor that is a parallel reactance element.
- the individual matching circuit 243 includes an HPF-type LC filter including a capacitor that is a series reactance element and an inductor that is a parallel reactance element.
- a plurality of individual matching circuits 240 are configured so as to satisfy at least one of the above (i) and (ii). The same effect as in the first mode is obtained.
- each of the plurality of individual matching circuits 240 is configured by a single-stage LC filter, so that the circuit configuration can be simplified and reduced in size.
- each of the plurality of individual matching circuits is an LC filter, but each of one or more individual matching circuits among the plurality of individual matching circuits is configured by a wiring or an inductor. It doesn't matter.
- the PA module configured as described above will be described.
- FIG. 9 is a circuit configuration diagram of the PA module 3 according to the second modification.
- the PA module 3 shown in the figure includes an individual matching circuit group 340G having a plurality of individual matching circuits 340 instead of the individual matching circuit group 240G, as compared with the PA module 2 according to the first modification.
- one or more individual matching circuits 340 among the plurality of individual matching circuits 340 are configured by inductors.
- the individual matching circuit 343 is configured by an inductor L331 that is a series reactance element. That is, the individual matching circuit 343 rotates the phase of the load impedance Z (SW) by the inductor L331 and moves it to an arbitrary phase range.
- a plurality of individual matching circuits 340 are configured so as to satisfy at least one of the above (i) and (ii). The same effect as in the first mode is obtained.
- one or more individual matching circuits 340 are configured by the inductor L331, whereby the circuit configuration can be simplified and reduced in size.
- one or more individual matching circuits 340 are configured by the inductor L331.
- the individual matching circuit 340 may be a wiring.
- the individual matching circuit 340 configured by such wiring can move the phase of the load impedance Z (SW) to an arbitrary phase range by rotating the phase rotation amount defined by the electrical length of the wiring.
- one individual matching circuit 340 among the plurality of individual matching circuits 340 is configured by an inductor or a wiring.
- the number of individual matching circuits configured in this way is not limited, There may be more than one.
- the common matching circuit 20 is configured by a T-type circuit.
- the configuration of the common matching circuit 20 is not limited to this, and is configured by, for example, a one-stage LC filter. It doesn't matter.
- the PA module configured as described above will be described.
- FIG. 10 is a circuit configuration diagram of the PA module 4 according to the third modification.
- the PA module 4 shown in the figure includes a common matching circuit 420 configured by a single-stage LC filter instead of the common matching circuit 20 as compared with the PA module 1 according to the embodiment.
- the common matching circuit 420 includes, in order from the amplifier 10 side, an inductor L401 and a capacitor C402 that are series reactance elements. That is, the common matching circuit 420 rotates the phase of the load impedance Z (PAout) by the inductor L401 and the capacitor C402.
- each of the plurality of individual matching circuits 40 is constituted by a two-stage LC filter. That is, each of the plurality of individual matching circuits 40 includes an LC filter having a larger number of stages than the common matching circuit 420.
- the common matching circuit 420 is configured to satisfy at least one of the above (i) and (ii), so that the first embodiment The same effect is produced.
- the common matching circuit 420 by providing a plurality of individual matching circuits 40 having more LC filter stages than the common matching circuit 420, a received signal when the individual matching circuit 40 side is viewed from the output terminal of the common matching circuit 420.
- the common matching circuit 420 can be simplified and miniaturized while adjusting the load impedance in the frequency band (received signal band) with high accuracy.
- Modification 4 Next, Modification 4 will be described.
- the individual matching circuit is provided separately from the transmission / reception filter 50.
- the individual matching circuit may be included in the transmission / reception filter.
- the PA module configured as described above will be described.
- FIG. 11 is a circuit configuration diagram of the PA module 5 according to the fourth modification.
- the PA module 5 shown in the figure does not include the individual matching circuit group 40G, and instead of the plurality of transmission / reception filters 50, a plurality of transmission / reception filters 550 (in this modification, four transmission / reception filters) are provided. Filters 551 to 554).
- the plurality of transmission / reception filters 550 are, for example, duplexers with a built-in matching circuit. Specifically, each of the plurality of individual matching circuits 40 in the embodiment is incorporated in a corresponding transmission / reception filter 550. For example, the individual matching circuit 41 corresponding to the Band 26 in the embodiment is built in the transmission / reception filter 551 corresponding to the Band 26 in this modification. Similarly, the other individual matching circuits 42 to 44 are also incorporated in the corresponding transmission / reception filters 552 to 554.
- a plurality of transmission / reception filters 550 are configured so as to satisfy at least one of the above (i) and (ii). 1 has the same effect.
- each of the plurality of individual matching circuits 40 in the first embodiment is built in the corresponding transmission / reception filter 550. Thereby, simplification and size reduction of the PA module 6 are achieved.
- each of the plurality of individual matching circuits 40 in the first embodiment is built in the corresponding transmission / reception filter 550, but the number of built-in individual matching circuits 40 may be one or more. There may be an individual matching circuit 40 that is not included in the transmission / reception filter 550.
- the PA module includes the switch 30 and the switch 60.
- the PA module may be configured without such a switch.
- the PA module has a multi-band configuration corresponding to four communication bands (Band), but the PA module has a multi-band configuration corresponding to three communication bands. It does not matter.
- the PA module configured as described above will be described.
- FIG. 12 is a circuit configuration diagram of the PA module 6 according to the fifth modification.
- the PA module 6 shown in the figure is a module that amplifies transmission signals in three communication bands. Further, the PA module 6 does not include the switch 30 and the switch 60 compared to the PA module 1 according to the embodiment. That is, in the above-described embodiment, the plurality of signal paths 70 are bundled with the common node by the switch 30, but in the present modification, the plurality of signal paths 70 are directly bundled with the common node.
- the PA module 6 according to this modification configured as described above is configured to satisfy at least one of (i) and (ii) by the common matching circuit 20, the individual matching circuit 40, and the like. The same effects as those of the first embodiment are exhibited.
- the PA module has been described as an example.
- the present invention may be applied to a demultiplexer in which each component constituting the PA module is not modularized.
- the PA module may satisfy at least one of these. However, by satisfying both of these, it is possible to further reduce the occurrence of a communication band in which the reception sensitivity deteriorates.
- the switches 30 and 60 connect any one of the plurality of selection terminals (four selection terminals in the above description) to the common terminal.
- the present invention is not limited to this.
- the switches 30 and 60 may connect two or more of the plurality of selection terminals with the common terminal. That is, the switch 30 may connect two or more signal paths 70 among the plurality of signal paths 70 to the common node.
- Such a configuration can be applied to a so-called carrier aggregation method in which different communication bands are used simultaneously.
- a plurality of signal paths 70 are bundled to form one antenna terminal Pant.
- the number of antenna terminals is not limited to this, and a plurality of antenna terminals may be used. That is, the branching device such as the PA module may be connected to a plurality of antennas corresponding to the communication band, for example.
- the present invention may also be realized as a method for designing a branching device such as a PA module.
- the demultiplexing device is provided in common to an amplifier that amplifies transmission signals in a plurality of communication bands of three or more having different frequency bands, and an output terminal of the amplifier, and each of the plurality of communication bands includes A plurality of signal paths for propagating a signal in a corresponding communication band; a plurality of transmission / reception filters provided in the plurality of signal paths, each separating a transmission signal and a reception signal in a corresponding communication band; an output terminal; A common matching circuit provided between the common nodes of the signal path and a plurality of individual matching circuits provided in a plurality of signal paths between the common node and the plurality of transmission / reception filters.
- FIG. 13 is a flowchart showing a method of designing such a branching device.
- the design method of such a demultiplexing device is a Smith chart normalized by the impedance of a plurality of signal paths, and the frequencies of a plurality of received signals when a plurality of transmission / reception filter sides are viewed from a common node.
- the output impedance of the amplifier In the Smith chart normalized in step 1, the load impedance in the frequency band of the plurality of received signals when viewed from the plurality of transmission / reception filter sides from the output terminal is located in a region where the phase differs by 45 degrees or more from the maximum gain point of the amplifier.
- a second adjustment step (S20) for adjusting the element value of the common matching circuit is located in a region where the phase differs by 45 degrees or more from the maximum gain point of the amplifier.
- Such a design method of the branching device is executed in a computer such as a CAD device.
- the design method may be executed on the computer by an interactive operation with the computer by the designer.
- the present invention can be widely used in communication devices such as mobile phones as a PA module that can support multi-band.
- PA module 10 Amplifier 20, 20A, 420 Common matching circuit 30, 60 Switch 40, 40A, 41-44, 41A-44A, 240-244, 340-344 Individual matching Circuit 40G, 240G, 340G Individual matching circuit group 50-54, 550-554 Transmission / reception filter 70-74 Signal path Pant.
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Amplifiers (AREA)
- Transceivers (AREA)
Abstract
Description
[1. 構成]
本実施の形態に係るPAモジュールは、RFIC(Radio Frequency Integrated Circuit)等から入力された送信信号を増幅してアンテナ等に出力するモジュールである。具体的には、当該PAモジュールは、3以上の複数の通信帯域の送信信号を増幅可能なモジュールであって、例えば、LTE(Long Term Evolution)等の通信規格に準拠した携帯電話等の小型の無線通信機器に搭載される。
次に、このように構成されたPAモジュール1の特性について、説明する。
次に、本実施の形態に係るPAモジュール1の効果について、本実施の形態の比較例に係るPAモジュールを用いて、本願発明者が本発明に至った経緯に基づいて説明する。
まず、変形例1について説明する。上記実施の形態では、複数の個別整合回路40の各々は2段のLCフィルタであったが、複数の個別整合回路の各々は1段のLCフィルタであってもかまわない。以下、本変形例では、このように構成されたPAモジュールについて説明する。
次に、変形例2について説明する。上記実施の形態及び変形例1では、複数の個別整合回路の各々はLCフィルタであったが、複数の個別整合回路のうち1以上の個別整合回路の各々は、配線またはインダクタにより構成されていてもかまわない。以下、本変形例では、このように構成されたPAモジュールについて説明する。
次に、変形例3について説明する。上記実施の形態及び変形例では、共通整合回路20はT型回路で構成されているとしたが、共通整合回路20の構成はこれに限定されず、例えば、1段のLCフィルタで構成されていてもかまわない。以下、本変形例では、このように構成されたPAモジュールについて説明する。
次に、変形例4について説明する。上記実施の形態及び変形例では、個別整合回路は送受信フィルタ50と別に設けられていたが、個別整合回路は送受信フィルタに内蔵されていてもかまわない。以下、本変形例では、このように構成されたPAモジュールについて説明する。
次に、変形例5について説明する。上記実施の形態及び変形例では、PAモジュールはスイッチ30及びスイッチ60を備えたが、PAモジュールはこのようなスイッチを備えない構成であってもかまわない。また、上記実施の形態及び変形例では、PAモジュールは4つの通信帯域(Band)に対応するマルチバンド対応の構成であったが、PAモジュールは3つの通信帯域に対応するマルチバンド対応の構成であってもかまわない。以下、本変形例では、このように構成されたPAモジュールについて説明する。
以上、本発明の実施の形態及びその変形例に係るPAモジュールについて説明したが、本発明は、個々の実施の形態及びその変形例には限定されない。本発明の趣旨を逸脱しない限り、当業者が思いつく各種変形を本実施の形態及びその変形例に施したものや、異なる実施の形態及びその変形例における構成要素を組み合わせて構築される形態も、本発明の一つ又は複数の態様の範囲内に含まれてもよい。
10 増幅器
20、20A、420 共通整合回路
30、60 スイッチ
40、40A、41~44、41A~44A、240~244、340~344 個別整合回路
40G、240G、340G 個別整合回路群
50~54、550~554 送受信フィルタ
70~74 信号経路
Pant. アンテナ端子
Ptx 送信入力端子
Prx1~Prx4 受信出力端子
Claims (14)
- 互いに周波数帯域が異なる3以上の複数の通信帯域の送信信号を増幅する増幅器と、
前記増幅器の出力端子に共通に設けられ、かつ、前記複数の通信帯域のうち各々が対応する通信帯域の信号を伝搬する複数の信号経路と、
前記複数の信号経路に設けられ、各々が対応する通信帯域の送信信号と受信信号とを分離する複数の送受信フィルタとを備え、
複数の前記受信信号の周波数帯域における前記増幅器の利得の各々が、複数の前記送信信号の周波数帯域における前記増幅器の利得の各々よりも小さい
分波装置。 - 互いに周波数帯域が異なる3以上の複数の通信帯域の送信信号を増幅する増幅器と、
前記増幅器の出力端子に共通に設けられ、かつ、前記複数の通信帯域のうち各々が対応する通信帯域の信号を伝搬する複数の信号経路と、
前記複数の信号経路に設けられ、各々が対応する通信帯域の送信信号と受信信号とを分離する複数の送受信フィルタとを備え、
前記増幅器の出力インピーダンスで正規化した第一のスミスチャートにおいて、前記出力端子から前記複数の送受信フィルタ側を見た場合の複数の前記受信信号の周波数帯域における全ての第一の負荷インピーダンスは、前記増幅器の利得の最大点から位相が45度以上異なる領域に位置する
分波装置。 - 前記第一のスミスチャートにおいて、前記第一の負荷インピーダンスは前記最大点から位相が90度以上異なる領域に位置する
請求項2に記載の分波装置。 - さらに、複数の前記受信信号の周波数帯域における前記増幅器の利得は、複数の前記送信信号の周波数帯域における前記増幅器の利得よりも小さい
請求項2または3に記載の分波装置。 - さらに、
前記出力端子と前記複数の信号経路の共通ノードとの間に設けられた共通整合回路と、
前記共通ノードと前記複数の送受信フィルタとの間の前記複数の信号経路に設けられた複数の個別整合回路とを備える
請求項1~4のいずれか1項に記載の分波装置。 - 前記複数の信号経路のインピーダンスで正規化した第二のスミスチャートにおいて、前記共通ノードから前記複数の送受信フィルタ側を見た場合の複数の前記受信信号の周波数帯域における第二の負荷インピーダンスは、位相が略一致する
請求項5に記載の分波装置。 - 前記複数の個別整合回路の各々は、前記第二のスミスチャートにおいて、当該個別整合回路を設けることによる前記第二の負荷インピーダンスの位相回転量が小さくなるように構成されている
請求項6に記載の分波装置。 - 前記複数の個別整合回路のうち1以上の個別整合回路の各々は、前記第二のスミスチャートにおいて前記第二の負荷インピーダンスの前記位相回転量が小さくなるようなハイパスフィルタ型及びローパスフィルタ型の整合回路のうちのいずれかで構成されている
請求項7に記載の分波装置。 - 前記複数の個別整合回路のうち1以上の個別整合回路の各々は、配線またはインダクタにより構成されている
請求項5~8のいずれか1項に記載の分波装置。 - 前記共通整合回路及び前記複数の個別整合回路の各々は、インダクタ及びコンデンサから構成される1段以上のLCフィルタを有し、
前記複数の個別整合回路の各々は、前記共通整合回路よりも段数の多いLCフィルタを有する
請求項5~8のいずれか1項に記載の分波装置。 - 前記複数の個別整合回路のうち1以上の個別整合回路の各々は、対応する送受信フィルタに内蔵されている
請求項5~10のいずれか1項に記載の分波装置。 - さらに、前記共通整合回路と前記複数の個別整合回路との間に設けられ、前記複数の信号経路の各々を前記共通ノードと選択的に接続または開放状態にするスイッチを備える
請求項5~11のいずれか1項に記載の分波装置。 - 前記スイッチは、前記複数の信号経路のうち2以上の信号経路を前記共通ノードと接続する
請求項12に記載の分波装置。 - 分波装置の設計方法であって、
前記分波装置は、
互いに周波数帯域が異なる3以上の複数の通信帯域の送信信号を増幅する増幅器と、
前記増幅器の出力端子に共通に設けられ、かつ、前記複数の通信帯域のうち各々が対応する通信帯域の信号を伝搬する複数の信号経路と、
前記複数の信号経路に設けられ、各々が対応する通信帯域の送信信号と受信信号とを分離する複数の送受信フィルタと、
前記出力端子と前記複数の信号経路の共通ノードとの間に設けられた共通整合回路と、
前記共通ノードと前記複数の送受信フィルタとの間の前記複数の信号経路に設けられた複数の個別整合回路とを備え、
前記複数の信号経路のインピーダンスで正規化したスミスチャートにおいて、前記共通ノードから前記複数の送受信フィルタ側を見た場合の複数の前記受信信号の周波数帯域における負荷インピーダンスについての位相が略一致するように、前記複数の個別整合回路の素子値を調整する第一の調整ステップと、
前記第一の調整ステップの後、前記増幅器の出力インピーダンスで正規化したスミスチャートにおいて、前記出力端子から前記複数の送受信フィルタ側を見た場合の複数の前記受信信号の周波数帯域における負荷インピーダンスが前記増幅器の利得の最大点から位相が45度以上異なる領域に位置するように、前記共通整合回路の素子値を調整する第二の調整ステップとを含む
分波装置の設計方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201680064206.8A CN108352853B (zh) | 2015-11-04 | 2016-10-18 | 分波装置及其设计方法 |
JP2017548700A JP6471810B2 (ja) | 2015-11-04 | 2016-10-18 | 分波装置及びその設計方法 |
KR1020187007867A KR102060406B1 (ko) | 2015-11-04 | 2016-10-18 | 분파 장치 및 그 설계 방법 |
US15/964,970 US10298273B2 (en) | 2015-11-04 | 2018-04-27 | Demultiplexing apparatus and method of designing the apparatus |
US16/377,646 US10879942B2 (en) | 2015-11-04 | 2019-04-08 | Demultiplexing apparatus and method of designing the apparatus |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015-217124 | 2015-11-04 | ||
JP2015217124 | 2015-11-04 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US15/964,970 Continuation US10298273B2 (en) | 2015-11-04 | 2018-04-27 | Demultiplexing apparatus and method of designing the apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2017077852A1 true WO2017077852A1 (ja) | 2017-05-11 |
Family
ID=58661966
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2016/080810 WO2017077852A1 (ja) | 2015-11-04 | 2016-10-18 | 分波装置及びその設計方法 |
Country Status (5)
Country | Link |
---|---|
US (2) | US10298273B2 (ja) |
JP (1) | JP6471810B2 (ja) |
KR (1) | KR102060406B1 (ja) |
CN (1) | CN108352853B (ja) |
WO (1) | WO2017077852A1 (ja) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108880489A (zh) * | 2017-05-16 | 2018-11-23 | 株式会社村田制作所 | 功率放大电路 |
WO2019004152A1 (ja) * | 2017-06-28 | 2019-01-03 | 株式会社村田製作所 | スイッチモジュール |
WO2019174805A1 (en) * | 2018-03-15 | 2019-09-19 | RF360 Europe GmbH | Gain control filter circuit, power module comprising a filter circuit and method of adjusting an rf filter circuit to provide a controllable gain |
US10608603B2 (en) | 2017-05-16 | 2020-03-31 | Murata Manufacturing Co., Ltd. | Multi-band power amplifier module |
TWI713828B (zh) * | 2017-05-16 | 2020-12-21 | 日商村田製作所股份有限公司 | 多頻帶功率放大模組 |
WO2022209740A1 (ja) * | 2021-03-31 | 2022-10-06 | 株式会社村田製作所 | 高周波モジュール |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106160756B (zh) * | 2016-06-25 | 2019-12-10 | 唯捷创芯(天津)电子技术股份有限公司 | 射频前端发射方法及发射模块、芯片和通信终端 |
US11277165B2 (en) * | 2017-06-23 | 2022-03-15 | Vanchip (Tianjin) Technology Co., Ltd. | Radio frequency front-end transmission module, chip, and communications terminal |
JP2019068194A (ja) * | 2017-09-29 | 2019-04-25 | 株式会社村田製作所 | フロントエンドモジュールおよび通信装置 |
KR102435743B1 (ko) * | 2018-03-29 | 2022-08-24 | 가부시키가이샤 무라타 세이사쿠쇼 | 고주파 모듈 |
WO2020054388A1 (ja) * | 2018-09-11 | 2020-03-19 | 株式会社村田製作所 | 高周波フロントエンドモジュールおよび通信装置 |
US10483946B1 (en) | 2019-04-26 | 2019-11-19 | Palstar, Inc. | Single solution impedance matching system, method and apparatus |
US10680574B1 (en) | 2019-04-26 | 2020-06-09 | Palstar, Inc. | Automatic impedance matching system, method and apparatus |
CN110138412A (zh) * | 2019-06-03 | 2019-08-16 | 维沃移动通信有限公司 | 一种电子设备 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004166248A (ja) * | 2002-10-25 | 2004-06-10 | Hitachi Metals Ltd | 高周波部品及び高周波モジュール並びにこれらを用いた通信機 |
JP2007181021A (ja) * | 2005-12-28 | 2007-07-12 | Murata Mfg Co Ltd | 電力増幅回路部およびそれを用いた無線通信機 |
JP2007267319A (ja) * | 2006-03-30 | 2007-10-11 | Kyocera Corp | マルチバンド無線通信方法およびマルチバンド無線通信装置 |
WO2011001769A1 (ja) * | 2009-07-02 | 2011-01-06 | 株式会社村田製作所 | 無線通信用高周波回路及び無線通信機 |
Family Cites Families (59)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20010108226A (ko) * | 1999-12-15 | 2001-12-07 | 다니구찌 이찌로오, 기타오카 다카시 | 임피던스 정합 회로 및 이것을 사용한 안테나 장치 |
US7046749B2 (en) * | 2001-05-01 | 2006-05-16 | Ipr Licensing, Inc. | Narrowband gain control of receiver with digital post filtering |
TW486861B (en) * | 2001-07-04 | 2002-05-11 | Ind Tech Res Inst | Impedance matching circuit for a multi-band power amplifier |
US7076216B2 (en) * | 2002-09-17 | 2006-07-11 | Hitachi Metals, Ltd. | High-frequency device, high-frequency module and communications device comprising them |
KR100533641B1 (ko) * | 2004-03-04 | 2005-12-06 | 삼성전기주식회사 | 필터링 커플러를 갖는 듀얼밴드 송신기 |
US7379714B2 (en) * | 2004-04-02 | 2008-05-27 | Interdigital Technology Corporation | Method and apparatus for dynamically adjusting a transmitter's impedance |
US7440729B2 (en) * | 2004-04-16 | 2008-10-21 | M/A-Com Eurotec B.V. | Apparatus, methods and articles of manufacture for output impedance matching using multi-band signal processing |
CN1981407A (zh) * | 2004-05-21 | 2007-06-13 | 株式会社村田制作所 | 携带电话装置 |
US8000737B2 (en) * | 2004-10-15 | 2011-08-16 | Sky Cross, Inc. | Methods and apparatuses for adaptively controlling antenna parameters to enhance efficiency and maintain antenna size compactness |
US20060217082A1 (en) * | 2005-03-22 | 2006-09-28 | Georg Fischer | Shaping noise in power amplifiers of duplex communication systems |
US20070085754A1 (en) * | 2005-10-18 | 2007-04-19 | Nokia Corporation | RF front-end architecture for a separate non-50 ohm antenna system |
JP4838572B2 (ja) * | 2005-11-24 | 2011-12-14 | 株式会社エヌ・ティ・ティ・ドコモ | 安定化回路、マルチバンド増幅回路 |
US7711337B2 (en) * | 2006-01-14 | 2010-05-04 | Paratek Microwave, Inc. | Adaptive impedance matching module (AIMM) control architectures |
JP4678408B2 (ja) * | 2006-01-31 | 2011-04-27 | 株式会社村田製作所 | 複合高周波部品および移動体通信装置 |
JP4618461B2 (ja) * | 2006-05-08 | 2011-01-26 | 日立金属株式会社 | 高周波回路、高周波部品及び通信装置 |
JP4825582B2 (ja) * | 2006-05-24 | 2011-11-30 | 富士通株式会社 | 無線タグ及び無線タグ用アンテナ |
US7969372B2 (en) * | 2006-08-03 | 2011-06-28 | Panasonic Corporation | Antenna apparatus utilizing small loop antenna element having minute length and two feeding points |
JP2008236608A (ja) | 2007-03-23 | 2008-10-02 | Taiyo Yuden Co Ltd | 無線通信回路及び無線通信機 |
US8269686B2 (en) * | 2007-11-27 | 2012-09-18 | Uti Limited Partnership | Dual circularly polarized antenna |
WO2010053131A1 (ja) * | 2008-11-05 | 2010-05-14 | 日立金属株式会社 | 高周波回路、高周波部品、及びマルチバンド通信装置 |
US8644197B2 (en) * | 2008-12-24 | 2014-02-04 | Hollinworth Fund, L.L.C. | RF front-end module and antenna systems |
EP2226948B1 (en) | 2009-03-03 | 2015-07-29 | Qualcomm Technologies, Inc. | Communication system and method for transmitting and receiving signals |
AU2009208140B1 (en) * | 2009-08-13 | 2010-05-06 | Barry John Simpson | Vehicle mud flaps and mud guards |
US9325282B2 (en) * | 2009-09-08 | 2016-04-26 | California Institute Of Technology | Self-healing technique for high frequency circuits |
JP2012095222A (ja) * | 2010-10-28 | 2012-05-17 | Nec Casio Mobile Communications Ltd | Gsm無線端末装置、gsm無線端末状態切り替え制御方法およびgsm無線端末状態切り替え制御プログラム |
US9391650B2 (en) * | 2011-02-11 | 2016-07-12 | Qualcomm Incorporated | Front-end RF filters with embedded impedance transformation |
WO2012125657A2 (en) * | 2011-03-15 | 2012-09-20 | Skyworks Solutions, Inc. | Apparatus and methods for capacitive load reduction |
JP5672098B2 (ja) * | 2011-03-18 | 2015-02-18 | 富士通株式会社 | 無線端末装置 |
WO2012177045A2 (ko) * | 2011-06-20 | 2012-12-27 | 엘지전자 주식회사 | 무선 접속 시스템에서 전송 전력 제어 방법 및 이를 위한 장치 |
JP5651548B2 (ja) * | 2011-06-30 | 2015-01-14 | 株式会社日立製作所 | 局側装置、光ネットワークシステム |
CN102571655B (zh) | 2012-01-21 | 2014-12-17 | 华为技术有限公司 | 一种干扰对消的方法、装置和一种滤波器 |
US8803615B2 (en) * | 2012-01-23 | 2014-08-12 | Qualcomm Incorporated | Impedance matching circuit with tunable notch filters for power amplifier |
US9002278B2 (en) * | 2012-02-29 | 2015-04-07 | Htc Corporation | Simple automatic antenna tuning system and method |
US9214718B2 (en) * | 2012-03-08 | 2015-12-15 | Apple Inc. | Methods for characterizing tunable radio-frequency elements |
US9048524B2 (en) * | 2012-03-26 | 2015-06-02 | Google Technology Holdings LLC | Method and apparatus for compensating for phase shift in a communication device |
US9276527B2 (en) * | 2013-09-30 | 2016-03-01 | Peregrine Semiconductor Corporation | Methods and devices for impedance matching in power amplifier circuits |
US9419667B2 (en) * | 2013-04-16 | 2016-08-16 | Skyworks Solutions, Inc. | Apparatus and methods related to conformal coating implemented with surface mount devices |
WO2015001828A1 (ja) * | 2013-07-01 | 2015-01-08 | 株式会社村田製作所 | フロントエンド回路 |
KR102105130B1 (ko) * | 2013-07-05 | 2020-04-28 | 삼성전자주식회사 | 고조파 정합을 위한 방법 및 장치 |
US9136800B2 (en) * | 2013-07-23 | 2015-09-15 | Peregrine Semiconductor Corporation | Methods and devices for improving power amplifier efficiency |
US9252722B2 (en) * | 2013-12-20 | 2016-02-02 | Telefonaktiebolaget L M Ericsson (Publ) | Enhanced and versatile N-way doherty power amplifier |
US9595933B2 (en) * | 2013-12-30 | 2017-03-14 | Lansus Technologies Inc. | Power amplifier device and circuits |
JP2015146529A (ja) * | 2014-02-03 | 2015-08-13 | 富士通株式会社 | 増幅装置、及び増幅方法 |
JP6251414B2 (ja) * | 2014-02-20 | 2017-12-20 | テレフオンアクチーボラゲット エルエム エリクソン(パブル) | 調整可能なインピーダンスを提供するための回路及び方法 |
US10224184B2 (en) * | 2014-03-24 | 2019-03-05 | Aes Global Holdings, Pte. Ltd | System and method for control of high efficiency generator source impedance |
US9641201B2 (en) * | 2014-04-29 | 2017-05-02 | Infineon Technologies Ag | System and method for a radio frequency integrated circuit |
US9599739B2 (en) * | 2014-09-09 | 2017-03-21 | Texas Instruments Incorporated | Material-discerning sensing by measurement of different points of impedance |
DE102014013605A1 (de) * | 2014-09-12 | 2016-03-17 | Dialog Semiconductor B.V. | Impedanzdetektor mit geringer Leistung auf einem Chip |
CN204131527U (zh) * | 2014-10-28 | 2015-01-28 | 西安邮电大学 | 一种基于As-S和As-Se光纤级联的拉曼放大器 |
CN104378136A (zh) * | 2014-11-14 | 2015-02-25 | 中国科学院微电子研究所 | 无线收发机 |
KR102273799B1 (ko) * | 2014-12-05 | 2021-07-06 | 삼성전자주식회사 | 통신 기능을 지원하는 통신 회로 및 이를 포함하는 전자 장치 |
US9882538B2 (en) * | 2015-03-24 | 2018-01-30 | Skyworks Solutions, Inc. | Distributed output matching network for a radio frequency power amplifier module |
US9748902B2 (en) * | 2015-05-15 | 2017-08-29 | Nxp Usa, Inc. | Phase correction in a Doherty power amplifier |
US10284235B2 (en) * | 2015-07-22 | 2019-05-07 | Skyworks Solutions, Inc. | Wireless transceiver with switch to reduce harmonic leakage |
WO2017062427A1 (en) * | 2015-10-05 | 2017-04-13 | Skyworks Solutions, Inc. | Power amplification system with adaptive bias control |
US9525393B1 (en) * | 2015-11-13 | 2016-12-20 | Resonant Inc. | Technique for designing acoustic microwave filters using lcr-based resonator models |
US10601655B2 (en) * | 2015-12-04 | 2020-03-24 | Skyworks Solutions, Inc. | Dynamic multiplexer configuration process |
US10263647B2 (en) * | 2016-04-09 | 2019-04-16 | Skyworks Solutions, Inc. | Multiplexing architectures for wireless applications |
US10396714B2 (en) * | 2016-09-23 | 2019-08-27 | Qorvo Us, Inc. | Reconfigurable low-noise amplifier (LNA) |
-
2016
- 2016-10-18 CN CN201680064206.8A patent/CN108352853B/zh active Active
- 2016-10-18 WO PCT/JP2016/080810 patent/WO2017077852A1/ja active Application Filing
- 2016-10-18 JP JP2017548700A patent/JP6471810B2/ja active Active
- 2016-10-18 KR KR1020187007867A patent/KR102060406B1/ko active IP Right Grant
-
2018
- 2018-04-27 US US15/964,970 patent/US10298273B2/en active Active
-
2019
- 2019-04-08 US US16/377,646 patent/US10879942B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004166248A (ja) * | 2002-10-25 | 2004-06-10 | Hitachi Metals Ltd | 高周波部品及び高周波モジュール並びにこれらを用いた通信機 |
JP2007181021A (ja) * | 2005-12-28 | 2007-07-12 | Murata Mfg Co Ltd | 電力増幅回路部およびそれを用いた無線通信機 |
JP2007267319A (ja) * | 2006-03-30 | 2007-10-11 | Kyocera Corp | マルチバンド無線通信方法およびマルチバンド無線通信装置 |
WO2011001769A1 (ja) * | 2009-07-02 | 2011-01-06 | 株式会社村田製作所 | 無線通信用高周波回路及び無線通信機 |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108880489A (zh) * | 2017-05-16 | 2018-11-23 | 株式会社村田制作所 | 功率放大电路 |
US10608603B2 (en) | 2017-05-16 | 2020-03-31 | Murata Manufacturing Co., Ltd. | Multi-band power amplifier module |
TWI713828B (zh) * | 2017-05-16 | 2020-12-21 | 日商村田製作所股份有限公司 | 多頻帶功率放大模組 |
CN108880489B (zh) * | 2017-05-16 | 2022-04-29 | 株式会社村田制作所 | 功率放大电路 |
US11451198B2 (en) | 2017-05-16 | 2022-09-20 | Murata Manufacturing Co., Ltd. | Multi-band power amplifier module |
US11689164B2 (en) | 2017-05-16 | 2023-06-27 | Murata Manufacturing Co., Ltd. | Multi-band power amplifier module |
WO2019004152A1 (ja) * | 2017-06-28 | 2019-01-03 | 株式会社村田製作所 | スイッチモジュール |
JPWO2019004152A1 (ja) * | 2017-06-28 | 2020-01-23 | 株式会社村田製作所 | スイッチモジュール |
US11558073B2 (en) | 2017-06-28 | 2023-01-17 | Murata Manufacturing Co., Ltd. | Switch module |
WO2019174805A1 (en) * | 2018-03-15 | 2019-09-19 | RF360 Europe GmbH | Gain control filter circuit, power module comprising a filter circuit and method of adjusting an rf filter circuit to provide a controllable gain |
WO2022209740A1 (ja) * | 2021-03-31 | 2022-10-06 | 株式会社村田製作所 | 高周波モジュール |
Also Published As
Publication number | Publication date |
---|---|
US10879942B2 (en) | 2020-12-29 |
JP6471810B2 (ja) | 2019-02-20 |
KR102060406B1 (ko) | 2019-12-30 |
JPWO2017077852A1 (ja) | 2018-08-09 |
US20190238164A1 (en) | 2019-08-01 |
KR20180044330A (ko) | 2018-05-02 |
US10298273B2 (en) | 2019-05-21 |
CN108352853A (zh) | 2018-07-31 |
CN108352853B (zh) | 2020-07-31 |
US20180248569A1 (en) | 2018-08-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6471810B2 (ja) | 分波装置及びその設計方法 | |
JP5316544B2 (ja) | 高周波回路、高周波部品、及びマルチバンド通信装置 | |
CN107689778B (zh) | 高频模块以及通信装置 | |
US10270485B2 (en) | Switch module and radio-frequency module | |
US9979379B2 (en) | Multiplexer, radio frequency front-end circuit, communication device, and multiplexer design method | |
US11411545B2 (en) | Multiplexer, and radio frequency front-end circuit and communication device that use the same | |
US20180227008A1 (en) | Power amplification module, front-end circuit, and communication device | |
WO2018123972A1 (ja) | 高周波モジュール及び通信装置 | |
JP2010056735A (ja) | 分波器、半導体集積回路装置および通信用携帯端末 | |
US10340959B2 (en) | Front-end module and communication device | |
JP2008301525A (ja) | 高周波スイッチモジュール | |
US20140306780A1 (en) | Duplexers | |
JPWO2008088040A1 (ja) | 高周波部品 | |
US20090128254A1 (en) | High frequency electronic component | |
JPWO2008088038A1 (ja) | 高周波部品 | |
US10847306B2 (en) | High-frequency module | |
US20230163803A1 (en) | Radio-frequency circuit and communication apparatus | |
US20220311455A1 (en) | Radio-frequency circuit and communication device | |
JP6798521B2 (ja) | マルチプレクサ、高周波フロントエンド回路および通信装置 | |
US20220385273A1 (en) | Switchable acoustic wave filter and related multiplexers | |
JP3982683B2 (ja) | 無線通信回路 | |
US7795992B2 (en) | Electrical circuit comprising a differential signal path and component with such a circuit | |
US20090128253A1 (en) | High frequency electronic component | |
JP2019161309A (ja) | マルチプレクサ、および、通信装置 | |
US20230253937A1 (en) | Power amplifier circuit and communication device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 16861918 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2017548700 Country of ref document: JP Kind code of ref document: A |
|
ENP | Entry into the national phase |
Ref document number: 20187007867 Country of ref document: KR Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 16861918 Country of ref document: EP Kind code of ref document: A1 |