WO2017067220A1 - 一种移动终端的中框和移动终端 - Google Patents

一种移动终端的中框和移动终端 Download PDF

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WO2017067220A1
WO2017067220A1 PCT/CN2016/088392 CN2016088392W WO2017067220A1 WO 2017067220 A1 WO2017067220 A1 WO 2017067220A1 CN 2016088392 W CN2016088392 W CN 2016088392W WO 2017067220 A1 WO2017067220 A1 WO 2017067220A1
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middle frame
mobile terminal
heat
functional module
present
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PCT/CN2016/088392
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English (en)
French (fr)
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常继增
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乐视控股（北京）有限公司
乐视移动智能信息技术（北京）有限公司
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Priority to US15/236,280 priority Critical patent/US20170118867A1/en
Publication of WO2017067220A1 publication Critical patent/WO2017067220A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components

Definitions

  • the present invention relates to the field of mobile communication technologies, and in particular, to a middle frame and a mobile terminal of a mobile terminal.
  • each functional module generates a large amount of heat during operation, and if it cannot be dissipated in time, it may cause the mobile terminal to generate heat.
  • the operation of the central processor, the operation of the battery, and the operation of the display are getting thinner and thinner, and the spacing of various functional modules is getting smaller and smaller.
  • each functional module generates a large amount of heat during operation, and if it cannot be dissipated in time, it may cause the mobile terminal to generate heat.
  • the operation of the central processor, the operation of the battery, and the operation of the display are getting thinner and thinner, and the spacing of various functional modules is getting smaller and smaller.
  • a heat pipe is disposed between each functional module and the middle frame, one end of the heat pipe is inlaid or attached to the middle frame, and the other end is welded on the shield of each functional module.
  • the number of heat pipes to be installed is correspondingly increased.
  • the heat pipe is difficult to install and the installation efficiency is low; on the other hand, the number of heat pipes installed increases, and the mobile terminal is increased.
  • the overall thickness is increased.
  • the embodiments of the present invention provide a middle frame and a mobile terminal of a mobile terminal, which are used to solve the technical problem that the heat dissipation effect of each functional module is not good and the mobile terminal is easy to be hot when the thickness of the mobile terminal is not increased in the prior art.
  • an embodiment of the present invention discloses a middle frame of a mobile terminal, comprising: hollowing out a middle frame having a plurality of heat dissipation conduits, wherein the heat dissipation conduit is filled with a heat conductive medium, Absorbing heat emitted by each functional module in the mobile terminal.
  • an embodiment of the present invention further discloses a mobile terminal, including the middle frame according to any one of the above.
  • the middle frame and the mobile terminal of the mobile terminal provided by the embodiment of the present invention can reduce the heat radiated by each functional module by the heat conductive medium filled in the heat dissipation conduit without increasing the thickness of the mobile terminal, thereby reducing the function modules.
  • the temperature meets the heat dissipation requirements of each functional module to ensure that each functional module operates at a normal temperature.
  • FIG. 1 is a perspective view showing a structure of a middle frame of a mobile terminal according to an embodiment of the present invention
  • FIG. 2 is a cross-sectional view showing the structure of a middle frame of a mobile terminal according to an embodiment of the present invention.
  • FIG. 1 is a perspective view showing the structure of a middle frame of a mobile terminal according to an embodiment of the present invention
  • FIG. 2 is a cross-sectional view showing the structure of a middle frame of a mobile terminal according to an embodiment of the present invention.
  • the middle frame includes:
  • a heat sink can be formed in the middle frame using laser engraving, corrosion engraving or other microchannel fabrication processes.
  • the diameter of the heat dissipation heat pipe can be one-half of the thickness of the middle frame to ensure that the middle frame has sufficient strength to carry each functional module.
  • the ratio of the diameter of the heat-dissipating heat pipe to the thickness of the middle frame may also be other values.
  • the heat-dissipating ducts may be disposed in the upper portion of the middle frame, and the heat-dissipating ducts may be arranged in parallel in the middle frame or in the middle frame.
  • the manufacturing process of the heat-dissipating duct with a curved shape is complicated.
  • the flow velocity of the liquid at the corner is weakened, which affects the heat-dissipating effect. Therefore, the present invention preferably uses a linear heat-dissipating duct, and of course, other shapes of heat-dissipating ducts may be used. .
  • a heat dissipation conduit is formed in the middle frame by the above microchannel fabrication process, and then the heat conduction medium is filled in the heat dissipation conduit, and finally the heat dissipation conduit can be closed by a thermoplastic process.
  • the heat transfer medium may include, but is not limited to, water, alcohol, and a refrigerant, or any other liquid that can be used for heat conduction.
  • the middle frame of the mobile terminal provided by the embodiment of the present invention further includes: a shielding cover disposed on the middle frame for fixing each functional module. Thereby, the movement of each functional module on the middle frame is prevented, and the stability of each functional module is improved.
  • each of the above functional modules includes, but is not limited to, a central processing unit, a battery, and a display screen.
  • the middle frame of the mobile terminal provided by the embodiment of the present invention can reduce the temperature of each functional module by the heat transfer medium filled in the heat dissipation conduit without increasing the thickness of the mobile terminal, thereby satisfying the temperature of each functional module.
  • the heat dissipation requirements of each functional module ensure that each functional module operates at a normal temperature.
  • an embodiment of the present invention provides a mobile terminal, including the foregoing middle frame, due to various functions.
  • the module works at normal temperature, so there is no hot condition in the mobile terminal.
  • the device embodiments described above are merely illustrative, wherein the units illustrated as separate components may or may not be physically separate, and the components displayed as units may or may not be physical units, ie may be located in one place. Or it can be distributed to multiple network elements. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of the embodiment. Those of ordinary skill in the art can understand and implement without deliberate labor.

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Thermal Sciences (AREA)
  • Telephone Set Structure (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种移动终端的中框（1）和移动终端，该移动终端的中框（1）包括：镂空有若干条散热导管（2）的中框（1），散热导管（2）中填充有导热介质，以吸收移动终端中的各个功能模块散发的热量。因此，可以在不增加移动终端厚度的情况下，通过填充在散热导管（2）中的导热介质吸收各个功能模块散发的热量来降低各个功能模块的温度，满足各个功能模块的散热需求，保证各个功能模块工作在正常的温度下。

Description

一种移动终端的中框和移动终端
本申请要求在2015年10月22日提交中国专利局、申请号为201510694444.4、发明名称为“一种移动终端的中框和移动终端”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本发明涉及移动通信技术领域，特别是涉及一种移动终端的中框和移动终端。
背景技术
目前，手机、平板电脑和便携式阅读器等移动终端越来越薄，各个功能模块的间距越来越小。但是各个功能模块在运行中产生大量热量，若不能及时散热，会造成移动终端发热。例如，中央处理器的运行，电池的运行，显示屏的运行。
目前，为了解决各个功能模块的散热问题，在各个功能模块和中框之间设置有导热管，导热管的一端镶嵌或贴在中框上，另一端焊接在各个功能模块的屏蔽罩上。但是移动终端中功能模块众多，因此需要安装的热导管数量也就相应增多，一方面热导管的安装难度较大，安装效率较低；另一方面，安装的导热管数量增多，会增加移动终端的整体厚度。
因此，目前需要本领域技术人员迫切解决的一个技术问题就是：如何在不增加移动终端厚度的情况下，对各个功能模块进行降温，保证各个功能模块工作在正常的温度下。
发明内容
本发明实施例提供一种移动终端的中框和移动终端，用以解决现有技术中不增加移动终端厚度时，各个功能模块散热效果不好，移动终端容易发烫的技术问题。
根据本发明的一个方面，本发明实施例公开了一种移动终端的中框，包括：镂空有若干条散热导管的中框，所述散热导管中填充有导热介质，以 吸收移动终端中的各个功能模块散发的热量。
根据本发明的另一个方面，本发明实施例还公开了一种移动终端，包括上述任意一项所述的中框。
本发明实施例提供的一种移动终端的中框和移动终端，可以在不增加移动终端厚度的情况下，通过填充在散热导管中的导热介质吸收各个功能模块散发的热量来降低各个功能模块的温度，满足各个功能模块的散热需求，保证各个功能模块工作在正常的温度下。
上述说明仅是本发明技术方案的概述，为了能够更清楚了解本发明的技术手段，而可依照说明书的内容予以实施，并且为了让本发明的上述和其它目的、特征和优点能够更明显易懂，以下特举本发明的具体实施方式。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作一简单地介绍，显而易见地，下面描述中的附图是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本发明实施例提供的一种移动终端的中框的结构的透视图；
图2为本发明实施例提供的一种移动终端的中框的结构的横截面示意图。
具体实施例
为使本发明实施例的目的、技术方案和优点更加清楚，下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
图1，示出了本发明实施例一种移动终端的中框的结构的透视图；
图2，示出了本发明实施例一种移动终端的中框的结构的横截面示意图。
为了在不增加移动终端厚度的情况下，降低各个功能模块的温度，满足各个功能模块之间的散热需求，保证各个功能模块工作在正常的温度下，本发明实施例提供了一种移动终端的中框，如图1和图2所示，包括：
镂空有若干条散热导管2的中框1，散热导管2中填充有导热介质，以吸收移动终端中的各个功能模块散发的热量。
在本发明实施例中，可以采用激光雕刻、腐蚀雕刻或其他微槽道制造工艺在中框中形成散热导管。需要说明的是，散热导热管的直径可以为中框厚度的二分之一，以保证中框具有足够的强度承载各个功能模块。当然散热导热管的直径与中框厚度的比值也可以是其他数值。
中框上温度较高的区域均可以设置上述散热导管，各个散热导管可以平行分布于中框中，也可以有弯曲设置于中框中。一方面弯曲形状的散热导管制造工艺较为复杂，另一方面，液体在转角处的流速会减弱，影响散热效果，因此，本发明优选地使用直线型散热导管，当然也可以采用其他形状的散热导管。
首先通过上述微槽道制作工艺在中框中形成散热导管，然后将导热介质灌装在散热导管内，最后可以通过热塑工艺封闭散热导管。
其中，导热介质可以包括但不限于：水、酒精和制冷剂，或者采用其他任何可以用于导热的液体。
为了增强各个功能模块的稳定性，本发明实施例提供的一种移动终端的中框，还包括：设置于中框上的屏蔽罩，用于固定各个功能模块。从而防止各个功能模块在中框上发生移动，提高了各个功能模块的稳定性。
中框和屏蔽罩之间会存在缝隙，影响热传导的进行，为了增强热传导的效率，可以中框和屏蔽罩之间敷设有导热胶，各个功能模块散发出来的热量经屏蔽罩和导热胶传导至中框。需要进行说明的是，上述各个功能模块包括但不限于中央处理器、电池和显示屏。
本发明实施例提供的一种移动终端的中框，可以在不增加移动终端厚度的情况下，通过填充在散热导管中的导热介质吸收各个功能模块散发的热量来降低各个功能模块的温度，满足各个功能模块的散热需求，保证各个功能模块工作在正常的温度下。
另外本发明实施例提供了一种移动终端，包括上述中框，由于各个功能 模块工作在正常的温度下，因此不会出现移动终端发烫的情况。
以上所描述的装置实施例仅仅是示意性的，其中作为分离部件说明的单元可以是或者也可以不是物理上分开的，作为单元显示的部件可以是或者也可以不是物理单元，即可以位于一个地方，或者也可以分布到多个网络单元上。可以根据实际的需要选择其中的部分或者全部模块来实现本实施例方案的目的。本领域普通技术人员在不付出创造性的劳动的情况下，即可以理解并实施。
最后应说明的是：以上实施例仅用以说明本发明的技术方案，而非对其限制；尽管参照前述实施例对本发明进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本发明各实施例技术方案的精神和范围。

Claims (8)

  1. 一种移动终端的中框，其特征在于，包括：镂空有若干条散热导管的中框，所述散热导管中填充有导热介质，以吸收移动终端中的各个功能模块散发的热量。
  2. 根据权利要求1所述的中框，其特征在于，所述散热导管通过微槽道制作工艺形成于所述中框中。
  3. 根据权利要求1所述的中框，其特征在于，所述导热介质包括：水、酒精和制冷剂。
  4. 根据权利要求1所述的中框，其特征在于，各个所述散热导管平行分布于所述中框中。
  5. 根据权利要求1所述的中框，其特征在于，还包括：设置于所述中框上的屏蔽罩，用于固定所述各个功能模块。
  6. 根据权利要求5所述的中框，其特征在于，所述中框和所述屏蔽罩之间敷设有导热胶，所述各个功能模块散发出来的热量经所述屏蔽罩和所述导热胶传导至所述中框。
  7. 根据权利要求1所述的中框，其特征在于，所述各个功能模块包括：中央处理器、电池和显示屏。
  8. 一种移动终端，其特征在于，包括上述权利要求1-7任意一项所述的中框。
PCT/CN2016/088392 2015-10-22 2016-07-04 一种移动终端的中框和移动终端 WO2017067220A1 (zh)

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Families Citing this family (3)

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Publication number Priority date Publication date Assignee Title
CN107734090B (zh) * 2017-10-12 2019-08-23 东莞市映宁轩电子科技有限公司 一种高效散热的手机中框架
WO2019140764A1 (zh) * 2018-01-17 2019-07-25 广东长盈精密技术有限公司 金属中框加工工艺
CN111163200A (zh) * 2020-02-26 2020-05-15 努比亚技术有限公司 一种终端散热风管及终端

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020079087A1 (en) * 1999-08-06 2002-06-27 Kambiz Vafai Two-layered micro channel heat sink, devices and systems incorporating same
US20100091447A1 (en) * 2008-10-10 2010-04-15 Dell Products, Lp System and Method for Providing Liquid Cooling of Memory Devices
CN203523173U (zh) * 2013-09-23 2014-04-02 北京国科环宇空间技术有限公司 支持OpenVPX标准的通信模块及使用其的电子设备
CN203882256U (zh) * 2014-02-28 2014-10-15 深圳垒石热管理技术有限公司 一种智能手机的石墨散热结构
CN104902727A (zh) * 2015-05-26 2015-09-09 华为技术有限公司 一种移动终端的中框及移动终端
CN205005428U (zh) * 2015-10-22 2016-01-27 乐视致新电子科技（天津）有限公司 一种移动终端的中框和移动终端

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013017917A1 (en) * 2011-08-04 2013-02-07 Sony Ericsson Mobile Communications Ab Semiconductor assembly
US8899787B2 (en) * 2011-11-02 2014-12-02 Tsmc Solid State Lighting Ltd. Thermal protection structure for multi-junction LED module
KR20140132128A (ko) * 2013-05-07 2014-11-17 엘지전자 주식회사 이동 단말기
JP6121854B2 (ja) * 2013-09-18 2017-04-26 東芝ホームテクノ株式会社 シート型ヒートパイプまたは携帯情報端末
CN103702549A (zh) * 2013-12-26 2014-04-02 苏州天脉导热科技有限公司 一种用于超薄电子产品的热管

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020079087A1 (en) * 1999-08-06 2002-06-27 Kambiz Vafai Two-layered micro channel heat sink, devices and systems incorporating same
US20100091447A1 (en) * 2008-10-10 2010-04-15 Dell Products, Lp System and Method for Providing Liquid Cooling of Memory Devices
CN203523173U (zh) * 2013-09-23 2014-04-02 北京国科环宇空间技术有限公司 支持OpenVPX标准的通信模块及使用其的电子设备
CN203882256U (zh) * 2014-02-28 2014-10-15 深圳垒石热管理技术有限公司 一种智能手机的石墨散热结构
CN104902727A (zh) * 2015-05-26 2015-09-09 华为技术有限公司 一种移动终端的中框及移动终端
CN205005428U (zh) * 2015-10-22 2016-01-27 乐视致新电子科技（天津）有限公司 一种移动终端的中框和移动终端

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