WO2016197602A1 - 光模块散热装置 - Google Patents

光模块散热装置 Download PDF

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Publication number
WO2016197602A1
WO2016197602A1 PCT/CN2016/070138 CN2016070138W WO2016197602A1 WO 2016197602 A1 WO2016197602 A1 WO 2016197602A1 CN 2016070138 W CN2016070138 W CN 2016070138W WO 2016197602 A1 WO2016197602 A1 WO 2016197602A1
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WO
WIPO (PCT)
Prior art keywords
optical module
heat dissipation
hole
heat
medium layer
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PCT/CN2016/070138
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English (en)
French (fr)
Inventor
姬升涛
李帅
鲁进
徐战波
任紫菊
Original Assignee
中兴通讯股份有限公司
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Application filed by 中兴通讯股份有限公司 filed Critical 中兴通讯股份有限公司
Publication of WO2016197602A1 publication Critical patent/WO2016197602A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present application relates to a heat dissipation technology for components on a communication device and a service module, and more particularly to a heat dissipation device for an optical module.
  • the optical module is a key component used by communication equipment to transmit signals. It is widely used as a carrier for transmission between switches and devices to realize data processing and transmission.
  • the high-speed and long-distance optical modules selected for the service module of the communication equipment have a width of 12 mm to 14 mm and a depth of 140 mm to 150 mm, which respectively account for 52% and 75% of the width and depth of the conventional service module.
  • the printed circuit board (PCB) has an upper surface and a lower surface.
  • the device mounting space above the upper surface 31 of the PCB is 15 mm to 17 mm, and the lower surface 32 of the PCB is spaced from the protective lining.
  • the upper surface 40 of the plate 4 is 2 mm to 4 mm.
  • the prior art uses a conventional heat sink for an optical module in a service module as shown in FIG. 1a and FIG. 1b, which includes an optical module 1, a heat sink 2, a PCB board 3, and a backing plate 4.
  • the lining 4 is fixed on the PCB board 3.
  • the inner surface 40 of the lining 4 is opposite to the lower surface 32 of the PCB 3.
  • the optical module 1 is mounted on the upper surface 31 of the PCB 3.
  • the upper surface of the optical module 1 is provided with heat dissipation.
  • the heat sink 2 is disposed on the heat sink 2; the light module 1 uses the heat sink 2 to dissipate heat.
  • the top of the service module is marked as shown in FIG. 1a, and the direction in which the heat dissipating teeth 20 are disposed along the heat sink 2 is defined as the direction in which the heat sink 20 is disposed behind the heat sink 20, that is, the heat dissipating teeth are disposed.
  • the surface is the upper surface, and the surface of the heat sink away from the heat dissipating teeth is the lower surface, and the definitions of the upper and lower surfaces of the remaining components are based on this.
  • the structure shown in FIG. 1a and FIG. 1b has the following disadvantages: at the upper surface of the optical module 1, there is actually only 3 mm of space for air to flow; the optical module 1 The heat generation is large and the temperature is strict, and it is a heat sensitive device; the high power consumption device on the PCB board 3 is distributed around the optical module 1 to generate a thermal cascade effect on the optical module 1; in addition, the PCB board 3 is compactly arranged. Therefore, the heat dissipation space of the optical module 1 is insufficient. In summary, the above factors cause the optical module 1 to be difficult to dissipate heat, and become one of the heat dissipation bottlenecks of the service module.
  • the purpose of the present application is to solve the above problems, and provide a heat dissipation device for an optical module, which uses a through hole on a PCB to optimize heat dissipation by using a lower surface of the optical module, or directly or indirectly places a heat conductive medium layer on the liner.
  • the lining plate is used for heat dissipation optimization; or the optical module is embedded in the through hole, and the heat dissipation area of the heat sink of the upper surface of the optical module is added to optimize the heat dissipation, thereby improving the heat dissipation efficiency of the optical module.
  • the optical module heat dissipation device of the present application includes: a PCB board on which the optical module is disposed; a heat sink mounted on an upper end of the optical module; a lining assembly disposed under the PCB for increasing heat dissipation of the optical module; wherein a position of the PCB corresponding to the optical module is open A through hole, the through hole and the backing plate assembly constitute an additional heat dissipation structure for increasing heat dissipation of the optical module.
  • the backing plate assembly includes a backing plate whose upper surface is in contact with the lower surface of the optical module.
  • the additional heat dissipation structure includes the through hole and the backing plate.
  • the backing plate assembly includes: a heat conductive medium layer whose upper surface is in contact with the lower surface of the light module; and a backing plate whose upper surface is in contact with the lower surface of the heat conductive medium layer.
  • the additional heat dissipation structure includes the through hole, the heat conductive medium layer, and the backing plate.
  • the backing plate assembly includes a backing having a spacing between an upper surface thereof and a lower surface of the light module.
  • the additional heat dissipation structure includes the through hole and the backing plate.
  • the backing plate assembly includes: a metal block whose upper surface is in contact with a lower surface of the optical module; a heat conductive medium layer whose upper surface is in contact with a lower surface of the metal block; and an upper surface thereof and a heat conductive medium layer The lower surface is in contact with the liner.
  • the additional heat dissipation structure includes the through hole, the metal block, the heat conductive medium layer, and the backing plate.
  • the lining plate assembly includes: a heat conductive medium layer whose upper surface is in contact with a lower surface of the light module; a metal block whose upper surface is in contact with a lower surface of the heat conductive medium layer; and an upper surface thereof and a metal block The lower surface is in contact with the liner.
  • the additional heat dissipation structure includes the through hole, the heat conductive medium layer, the metal block, and the backing plate.
  • the lower end surface of the lining plate is provided with heat dissipating teeth.
  • the size of the through hole corresponds to the size of the optical module; the optical module is embedded in the through hole.
  • the size of the through hole is smaller than the size of the optical module; the optical module is placed above the through hole of the PCB board.
  • a boss is provided at a position of the lining corresponding to the through hole.
  • the optical module heat dissipation device of the present application has a simple structure, and has the advantages of improving the heat dissipation efficiency of the optical module by increasing the heat dissipation area, or utilizing the lower surface of the optical module, or optimizing the heat dissipation by using the lining plate.
  • 1a is an assembled structural view of a heat dissipation device for a light module in the prior art
  • Figure 1b is an exploded view of the structure shown in Figure 1a;
  • FIG. 2 is a first structural schematic view of a heat dissipation device for an optical module of the present application
  • Figure 3 is an exploded view of the structure shown in Figure 2;
  • FIG. 4 is a second schematic structural view of a heat dissipation device for an optical module of the present application.
  • FIG. 5 is a third structural schematic diagram of a heat dissipation device for an optical module of the present application.
  • FIG. 6 is a fourth structural diagram of a heat dissipation device for an optical module of the present application.
  • Figure 7 is a view taken along line A-A of Figure 6;
  • Figure 8 is an exploded view of the structure shown in Figure 6;
  • FIG. 9 is a fifth structural schematic diagram of a heat dissipation device for an optical module of the present application.
  • FIG. 10 is a sixth structural diagram of a heat dissipation device for an optical module of the present application.
  • FIG. 2 is a schematic diagram of the structure of the heat dissipation device of the optical module of the present application.
  • the heat dissipation device of the optical module of the present application includes: a PCB board 3 for arranging the optical module 1; a heat sink 2 at an upper end of the optical module 1; a lining plate assembly disposed under the PCB board 3 for increasing heat dissipation of the optical module 1; wherein a through hole is formed at a position corresponding to the optical module 1 of the PCB board, the through hole And the lining plate assembly constitutes an additional heat dissipation structure for increasing the heat dissipation of the optical module 1; wherein the optical module 1 can be embedded in the through hole (as shown in FIG. 2 to FIG. 5), or can be placed on the PCB board 3 Above the hole (as shown in Figure 6-10).
  • FIG. 2 and FIG. 3 are schematic diagrams showing a first structure of the heat dissipation device for the optical module of the present application.
  • the heat dissipation device of the structure includes a PCB board 3.
  • the heat sink 2 and the additional heat dissipation structure for increasing the heat dissipation of the optical module 1 wherein the additional heat dissipation structure comprises a liner assembly and a through hole 30 formed on the PCB board 3 , and the liner assembly is a liner disposed under the PCB board 3 Board 4.
  • the through hole 30 is opened at a position corresponding to the optical module 1 of the PCB board 3, that is, the through hole 30 is sized such that the optical module 1 can be embedded in the through hole 30 to make the upper surface of the optical module
  • the space is increased, which in turn allows the height of the heat sink of the upper surface of the optical module to be increased, thereby increasing the heat dissipation area and improving the heat dissipation efficiency.
  • the embodiment Since the optical module 1 can be embedded in the through hole 30, the space above the upper surface of the optical module 1 is increased, compared to the prior art device (as shown in FIGS. 1a and 1b), the embodiment is
  • the heat dissipating teeth 21 of the heat sink 2 can be higher than the height of the heat dissipating teeth 20 shown in FIGS. 1a and 1b, thereby increasing the heat dissipating area of the heat sink, and therefore, the heat dissipating effect of the optical module 1 can be improved.
  • a heat conductive medium layer 5 (a third structure as shown in FIG. 5) formed by a heat conductive medium is disposed between the upper surfaces 40, and the upper and lower surfaces of the heat conductive medium layer 5 are respectively associated with the lower surface of the optical module 1 and the backing plate 4
  • the upper surface 40 is in contact.
  • the lower surface of the optical module 1 may also be in direct hard contact with the upper surface 41 of the lining 4 (the second structure shown in FIG. 4).
  • the heat of the optical module 1 can be transmitted to the lining 4, and then the lining 4 can be utilized.
  • the thermal characteristics and the temperature field and the velocity field are used for heat dissipation to increase the heat dissipation of the optical module 1.
  • the through hole 30 formed in the PCB board 3 is provided, except that the size of the through hole 30 formed in the PCB board 3 corresponds to the size of the optical module 1 so that the optical module 1 can be embedded in the through hole 30.
  • the size of the optical module 1 may be smaller than the size of the optical module 1 (ie, the through hole 33 is opened at a position corresponding to the optical module 1 of the PCB 3), so that the optical module 1 is placed above the through hole 33 of the PCB 3. (As shown in FIGS. 6-10, a portion of the optical module 1 is disposed above the through hole 33 of the PCB board, and other portions of the optical module 1 are placed on a portion of the PCB board located around the through hole 33).
  • the heat dissipation device of the optical module of the present application may also adopt a schematic diagram of a fourth structure as shown in FIG. 6, FIG. 7, and FIG. 8.
  • the heat dissipation device of the structure includes: a PCB having a through hole 33.
  • the board 3 the heat sink 2 and an additional heat dissipation structure for increasing the heat dissipation of the optical module 1.
  • the additional heat dissipation structure is composed of a through hole and a lining plate assembly
  • the lining plate assembly comprises: a metal block 6 whose upper surface is in contact with the lower surface of the optical module 1, and is disposed in the through hole 33 of the PCB board 3; a heat conductive medium layer 5 in contact with the lower surface of the metal block 6, the upper portion of the heat conductive medium layer 5 is embedded in the through hole 33, the lower portion protrudes from the PCB board; and the upper surface thereof is in contact with the lower surface of the heat conductive medium layer 5 Lining board 4.
  • the position of the metal block 6 and the heat conductive medium layer 5 in the liner assembly in the apparatus shown in FIGS. 6-8 is reversed (not shown), that is, the lower surface of the optical module 1 and the heat conductive medium layer are The upper surfaces of 5 are in contact such that the lower surface of the heat conductive medium layer 5 is in contact with the upper surface of the metal block 6, and the upper surface of the backing plate 4 is in contact with the lower surface of the metal block 6.
  • the method of using the optical module 1 to be placed over the through hole 33 of the PCB board 3 can reduce the size of the through hole formed by the PCB board 1 to facilitate the routing; and the metal block 6 and the heat conductive medium layer 5 are used in the lining assembly.
  • the heat of the optical module 1 can be conducted to the backing plate 4 through the metal block 6 and the heat conductive medium layer 5, and then the heat dissipation of the lining plate 4 and the temperature field and the velocity field are used for heat dissipation.
  • the lining plate assembly adopts the metal block 6, it is disposed above the lining plate 4 corresponding to the region of the PCB board 3 where the through hole 33 is opened, and is filled between the metal block 6 and the lining plate 4.
  • the heat medium layer 5 is heated, and the upper surface of the metal block 6 is in contact with the lower surface of the optical module 1 (ie, a fourth structure as shown in FIGS. 6-8), thereby forming a relationship between the optical module 1 and the backing plate 4.
  • the heat conduction path is beneficial to the heat of the optical module 1 to the lining 4 for heat dissipation, and the metal block 6 is a floating structure, which can solve the problem of insertion and removal of the pluggable optical module 1.
  • the heat conductive medium layer 5 may be embedded in the through hole 33 such that the upper surface of the heat conductive medium layer 5 and a part of the lower surface of the optical module 1
  • the lower surface of the heat conductive medium layer 5 is in contact with the lining 4, and the upper surface of the heat conductive medium layer 5 embedded in the through hole 33 is flush with the upper surface of the PCB board 3, and the heat conductive medium layer 5 is
  • the lower surface protrudes from the lower surface of the PCB board 3 (as shown in the fifth structure of FIG. 9) or is flush with the lower surface of the PCB board 3 (as shown in FIG. 10).
  • a boss 7 (shown in the sixth structure of FIG. 10) may be disposed at a position of the backing plate 4 corresponding to the through hole 33 on the PCB board 3, and the upper portion of the boss 7 may be embedded.
  • the upper surface of the lead hole 33 or the upper surface of the land 7 is flush with the lower surface of the PCB board 3.
  • the boss 7 can be formed by stamping or the like.
  • heat dissipating teeth 42 or the like for heat dissipation may be provided on the lower surface of the lining plate 4 (as shown in Fig. 3).
  • the light module heat dissipation device of the present application has a through hole at a position of the corresponding optical module 1 of the PCB board 3, so that the optical module 1 can be embedded in the through hole, thereby increasing the upper space thereof and increasing the heat sink.
  • Dimensions, reducing the wind resistance of the slot, can be optimized by using the lower surface of the optical module 1 or the lining 4 to improve the temperature of the optical module by 20%, thereby effectively improving the heat dissipation efficiency of the optical module.
  • the application provides a heat dissipation device for an optical module, which can be applied to a service module of a communication device, and can improve heat dissipation efficiency of the optical module.

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Abstract

本申请公开了一种光模块散热装置，其包括：安置光模块（1）的印刷线路（PCB）板（3）；安装在所述光膜块（1）的上端的散热器（2）；安置于PCB板（3）下方的用于增加所述光模块（1）散热的衬板组件；其中所述PCB板（3）的与所述光模块（1）相对应的位置处开设有通孔（30、33），所述通孔（30、33）与所述衬板组件构成了用来增加所述光模块散热的附加散热结构。本申请的光模块散热装置，可增大光模块的上表面的散热器的散热面积，或利用光模块的下表面或衬板进行散热优化，提高了光膜的散热效率。

Description

光模块散热装置 技术领域
本申请涉及通讯设备及业务模块上元器件的散热技术，尤其涉及一种光模块散热装置。
背景技术
光模块是通讯设备用来传输信号的关键元器件，广泛用作交换机与设备之间传输的载体，实现数据的处理、传输等功能。
通讯设备的业务模块所选用的高速率、长距离的光模块宽度尺寸为12mm～14mm，深度尺寸为140mm～150mm，分别占常规业务模块宽度、深度的52％、75％。业务模块印制电路板(Printed Circuit Board，以下简称PCB板3)具有上表面和下表面，在PCB板的上表面31上方的器件安装空间为15mm～17mm，PCB板的下表面32距防护衬板4的上表面40为2mm～4mm。
一般情况下，现有技术采用如图1a、图1b所示的用于业务模块中光模块的常规散热装置，其包括光模块1、散热器2、PCB板3和衬板4。衬板4固定在PCB板3上，衬板4的内表面40与PCB板3的下表面32正对；光模块1安装在PCB板3的上表面31上；光模块1的上表面设置散热器2；散热器2上设置散热齿20；光模块1利用散热器2进行散热。
其中，如图1a所示标注出业务模块的顶部，并定义沿散热器2设置散热齿20的方向为上，以散热器2背离散热齿20的方向为下，即，散热器的设置散热齿的表面为上表面，散热器远离散热齿的表面为下表面，其余元器件各上、下表面的定义均以此为基准。
由于光模块1安装在业务模块PCB板的上表面31，使得如图1a、图1b所示的结构存在如下缺点：光模块1的上表面处实际仅有3mm的空间供空气流动；光模块1的发热量较大，且温度要求严格，为热敏感器件；PCB板3上的高功耗器件分布在光模块1的周围，对光模块1产生热级联影响；此外，PCB板3布局紧凑，使得光模块1的散热空间不足等。综上，上述各因素导致光模块1散热困难，成为业务模块的散热瓶颈之一。
发明内容
本申请的目的就是为了解决上述问题，提供一种光模块散热装置，其通过在PCB板上开设通孔，利用光模块下表面进行散热优化；或在衬板上直接或间接安置导热介质层等，利用衬板进行散热优化；或光模块嵌入到通孔内，通过增加光模块的上表面的散热器的散热面积进行散热优化，从而达到提高光模块散热效率的目的。
为实现本申请的上述目的，本申请的光模块散热装置包括：安置光模块的PCB板； 安装在所述光模块的上端的散热器；安置于PCB板下方的用于增加所述光模块散热的衬板组件；其中，所述PCB板的与所述光模块相对应的位置处开设有通孔，所述通孔与所述衬板组件构成了用来增加所述光模块的散热的附加散热结构。
其中，所述衬板组件包括其上表面与所述光模块的下表面相接触的衬板。所述附加散热结构包括所述通孔和所述衬板。
或者，所述衬板组件包括：其上表面与所述光模块的下表面相接触的导热介质层；和其上表面与导热介质层的下表面相接触的衬板。所述附加散热结构包括所述通孔、所述导热介质层和所述衬板。
或者，所述衬板组件包括其上表面与所述光模块的下表面之间具有间距的衬板。所述附加散热结构包括所述通孔和所述衬板。
或者，所述衬板组件包括：其上表面与所述光模块的下表面相接触的金属块；其上表面与金属块的下表面相接触的导热介质层；和其上表面与导热介质层的下表面相接触的衬板。所述附加散热结构包括所述通孔、所述金属块、所述导热介质层和所述衬板。
或者，所述衬板组件包括：其上表面与所述光模块的下表面相接触的导热介质层；其上表面与导热介质层的下表面相接触的金属块；和其上表面与金属块的下表面相接触的衬板。所述附加散热结构包括所述通孔、所述导热介质层、所述金属块和所述衬板。
优选地，所述衬板的下端面设置散热齿。
其中，所述通孔的尺寸对应于所述光模块的尺寸；所述光模块嵌装于所述通孔内。
或者，所述通孔的尺寸小于所述光模块的尺寸；所述光模块搭放于所述PCB板的所述通孔的上方。
优选的，所述衬板的与所述通孔相对应的位置处设置有凸台。
与现有技术相比，本申请的光模块散热装置结构简单，通过增大散热面积、或利用光模块下表面、或利用衬板进行散热优化，具有提高光模块散热效率的优点。
下面结合附图对本申请进行详细说明。
附图说明
图1a是现有技术中的光模块散热装置的组装结构图；
图1b是如图1a所示结构的爆炸视图；
图2是本申请的光模块散热装置的第一种结构示意图；
图3是图2所示结构的爆炸视图；
图4是本申请的光模块散热装置的第二种结构示意图；
图5是本申请的光模块散热装置的第三种结构示意图；
图6是本申请的光模块散热装置的第四种结构示意图；
图7是图6所示的A-A向视图；
图8是图6所示结构的爆炸视图；
图9是本申请的光模块散热装置的第五种结构示意图；
图10是本申请的光模块散热装置的第六种结构示意图。
附图标记说明：1-光模块；2-散热器；3-PCB板；4-衬板；5-导热介质层；6-金属块；7-凸台；20、21-散热齿；30、33-通孔；31-PCB板的上表面；32-PCB板的下表面；40、41-衬板的上表面；42-散热齿。
具体实施方式
如图2-图10所示，分别为本申请的光模块散热装置的六种结构示意图，由图可知，本申请的光模块散热装置包括：用于安置光模块1的PCB板3；安装在光模块1的上端的散热器2；安置于PCB板3下方的用于增加光模块1散热的衬板组件；其中，PCB板的与光模块1相对应的位置处开设有通孔，通孔与衬板组件构成了用来增加光模块1散热的附加散热结构；其中，光模块1可以嵌装于通孔内(如图2-图5所示)，或者搭放于PCB板3的通孔的上方(如图6-图10所示)。
需要说明的是，本文中各元器件的关于上、下表面的定义以图1a的为基准。
具体的，如图2和图3所示，图2和图3示出为本申请的光模块散热装置的第一种结构的示意图，由图可知，该种结构的散热装置包括PCB板3、散热器2和用来增加光模块1散热的附加散热结构，其中，附加散热结构包括衬板组件和开设在PCB板3上的通孔30，衬板组件为设置在PCB板3的下方的衬板4。
其中，通孔30开设在PCB板3的与光模块1完全对应的位置处，即，通孔30的尺寸被设置为使得光模块1可以嵌装于通孔30内，以使光模块上表面的空间增大，进而允许增高光模块的上表面的散热器的高度等，从而增大散热面积，提高散热效率。而光模块1的下表面穿过通孔30下沉到PCB板的下表面32之下以后，光模块1的下表面与衬板4的上表面41之间尚可以保持一定间距(如图2所示)。
由于光模块1可以嵌装于通孔30内，使得光模块1的上表面以上的空间增大，相比于现有技术的装置(如图1a、1b所示)来说，本实施例的散热器2的散热齿21可以高于图1a、1b所示的散热齿20的高度，从而增大了散热器的散热面积，因此，可以改善光模块1的散热效果。
另外，光模块1的下表面穿过通孔30下沉到PCB板的下表面32以下之后，光模块1的下表面与衬板的上表面41之间尚具有一定间距，光模块1与衬板4之间具有一定的空气流动，达到利用光模块的下表面进行对流散热的目的。
而当光模块1嵌装于通孔30内时，由于光模块1的下表面与衬板4的上表面41之间具有一定间距，因此，还可以在光模块1的下表面与衬板的上表面40之间安置由导热介质形成的导热介质层5(如图5所示的第三种结构)，该导热介质层5的上、下表面分别与光模块1的下表面和衬板4的上表面40相接触。或者，当光模块1嵌装于通孔30内时，光模块1的下表面还可以与衬板4的上表面41直接硬性接触(如图4所示的第二种结构)。
无论光模块1与衬板4之间采用直接的硬性接触，还是采用填充导热介质层5的方式进行间接接触，都可以将光模块1的热量传导到衬板4上，再利用衬板4的热特性及所处温度场、速度场进行散热，增加对光模块1的散热。
除了上述的开设在PCB板3上的通孔30的尺寸与光模块1的尺寸相对应、以使光模块1可以嵌装于通孔30内之外，开设在PCB板3上的通孔30的尺寸还可以小于光模块1的尺寸(即，在PCB板3的与光模块1部分对应的位置处开设通孔33)，从而使光模块1搭放于PCB板3的通孔33的上方(如图6-图10所示，光模块1的一部分安置于PCB板的通孔33上方，而光模块1的其它部分搭置于PCB板的位于通孔33周围的部分上)。
具体的，本申请的光模块散热装置还可以采用如图6、图7、图8所示的第四种结构的示意图，由图可知，该种结构的散热装置包括：具有通孔33的PCB板3、散热器2和用来增加光模块1散热的附加散热结构。其中，附加散热结构由通孔和衬板组件构成，衬板组件包括：其上表面与光模块1的下表面相接触的金属块6，安置在PCB板3的通孔33内；其上表面与金属块6的下表面相接触的导热介质层5，导热介质层5的上部嵌装于通孔33内、下部伸出于PCB板；以及其上表面与导热介质层5的下表面相接触的衬板4。
或者，将图6-图8所示装置中的衬板组件中的金属块6和导热介质层5的位置对调(图中未示出)，即，使光模块1的下表面与导热介质层5的上表面相接触，使导热介质层5的下表面与金属块6的上表面相接触，而衬板4的上表面与金属块6的下表面相接触。
采用光模块1搭放于PCB板3的通孔33上方的方法，可以减小PCB板1开设的通孔的尺寸，利于走线；而衬板组件中采用金属块6与导热介质层5相组合的方式，可以将光模块1的热量通过金属块6、导热介质层5传导到衬板4上，再利用衬板4的热特性及所处温度场、速度场进行散热。
优选地，当衬板组件采用金属块6时，将其设置在与PCB板3的开设通孔33的区域所对应的衬板4的上方，并且，在金属块6与衬板4之间填充导热介质层5，而金属块6的上表面与光模块1的下表面相接触(即采用如图6-图8所示的第四种结构)，从而形成光模块1与衬板4之间的导热通路，利于将光模块1的热量传导到衬板4上进行散热，并且，金属块6为浮动结构，可以解决可插拔光模块1的插拔及接触问题。
此外，当光模块1搭放于PCB板3的通孔33的上方时，还可以在通孔33内嵌装导热介质层5，使得导热介质层5的上表面与光模块1下表面的一部分相接触、导热介质层5的下表面与衬板4相接触，并且，嵌装于通孔33内的导热介质层5的上表面与PCB板3的上表面相平齐、导热介质层5的下表面伸出于PCB板3的下表面(如图9的第五种结构所示)或与PCB板3的下表面平齐(如图10所示)。
优选的，还可以在衬板4的与PCB板3上的通孔33相对应的位置处设置一凸台7(如图10的第六种结构所示)，该凸台7的上部可以嵌装于通孔33内或凸台7的上表面与PCB板3的下表面相平齐。制作时，该凸台7可以通过冲压等方式形成，通过在凸台7与光模块1之间填充导热介质层5(请参考图10)，可以减少界面热阻，优化散热。
另外，为了增大散热表面积，还可以在衬板4的下表面设置用于散热的散热齿42等(如图3所示)。
本申请的光模块散热装置，通过在PCB板3的对应光模块1的位置处开设通孔，使得光模块1可以嵌装在通孔内，从而使得其上部空间增大，可以增加散热器的尺寸，减小槽位风阻，可以利用光模块1下表面或衬板4进行散热优化，使得光模块温度改善20％，从而达到有效提高光模块散热效率的目的。
尽管上文对本申请作了详细说明，但本申请不限于此，本技术领域的技术人员可以根据本申请的原理进行修改，因此，凡按照本申请的原理进行的各种修改都应当理解为落入本申请的保护范围。
工业适用性
本申请提供一种光模块散热装置，其可以应用于通讯设备的业务模块，能够提高光模块的散热效率。

Claims (10)

  1. 一种光模块散热装置，其特征在于，包括：
    安置光模块的PCB板；
    安装在所述光模块的上端的散热器；
    安置于PCB板下方的用于增加所述光模块散热的衬板组件；
    其中，所述PCB板的与所述光模块相对应的位置处开设有通孔，所述通孔与所述衬板组件构成了用来增加所述光模块的散热的附加散热结构。
  2. 根据权利要求1所述的光模块散热装置，其特征在于：
    所述衬板组件包括其上表面与所述光模块的下表面相接触的衬板；
    所述附加散热结构包括所述通孔和所述衬板。
  3. 根据权利要求1所述的光模块散热装置，其特征在于：
    所述衬板组件包括：其上表面与所述光模块的下表面相接触的导热介质层；和其上表面与所述导热介质层的下表面相接触的衬板；
    所述附加散热结构包括所述通孔、所述导热介质层和所述衬板。
  4. 根据权利要求1所述的光模块散热装置，其特征在于：
    所述衬板组件包括其上表面与所述光模块的下表面之间具有间距的衬板；
    所述附加散热结构包括所述通孔和所述衬板。
  5. 根据权利要求1所述的光模块散热装置，其特征在于：
    所述衬板组件包括：其上表面与所述光模块的下表面相接触的金属块；其上表面与所述金属块的下表面相接触的导热介质层；和其上表面与所述导热介质层的下表面相接触的衬板；
    所述附加散热结构包括所述通孔、所述金属块、所述导热介质层和所述衬板。
  6. 根据权利要求1所述的光模块散热装置，其特征在于：
    所述衬板组件包括：其上表面与所述光模块的下表面相接触的导热介质层；其上表面与所述导热介质层的下表面相接触的金属块；和其上表面与所述金属块的下表面相接触的衬板；
    所述附加散热结构包括所述通孔、所述导热介质层、所述金属块和所述衬板。
  7. 根据权利要求2-6中任一项所述的光模块散热装置，其特征在于，所述衬板的下端面设置散热齿。
  8. 根据权利要求2-4任一项所述的光模块散热装置，其特征在于：
    所述通孔的尺寸被设置为使得所述光模块能够嵌装于所述通孔内，以允许增高所述光模块的上端的所述散热器的高度。
  9. 根据权利要求3或5或6中任一项所述的光模块散热装置，其特征在于：
    所述通孔的尺寸小于所述光模块的尺寸；
    所述光模块搭放于所述PCB板的所述通孔的上方。
  10. 根据权利要求9所述的光模块散热装置，其特征在于，所述衬板的与所述通孔相对应的位置处设置有凸台。
PCT/CN2016/070138 2015-06-11 2016-01-05 光模块散热装置 WO2016197602A1 (zh)

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