WO2017143882A1 - 一种散热装置和功能板组件 - Google Patents
一种散热装置和功能板组件 Download PDFInfo
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- WO2017143882A1 WO2017143882A1 PCT/CN2017/071059 CN2017071059W WO2017143882A1 WO 2017143882 A1 WO2017143882 A1 WO 2017143882A1 CN 2017071059 W CN2017071059 W CN 2017071059W WO 2017143882 A1 WO2017143882 A1 WO 2017143882A1
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- heat sink
- heat
- floating
- mounting hole
- heat dissipation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Definitions
- the present invention relates to the field of electronic communications, and in particular, to a heat sink and a function board assembly.
- radiators are widely used.
- the power consumption of the chip is getting larger and larger, and the heat dissipation capability of the heat sink is becoming higher and higher.
- traditional ordinary radiators and heat pipe radiators encounter bottlenecks.
- the heat sinks currently used on the market are large-substrate buried heat pipes and hard-connected. fixed.
- this kind of heat sink has certain defects: on the one hand, the flatness cannot be guaranteed; on the other hand, in order to ensure the contact between the heat sink and each chip, the gap is filled with the heat conductive mud, the heat resistance coefficient is increased, and the heat dissipation is affected.
- the invention provides a heat dissipating device and a function board assembly, which solves the problem of poor heat dissipation in the prior art due to insufficient contact between the heat sink and the heat source.
- the present invention provides a heat dissipation device including a heat dissipation plate and at least one floating heat sink; the heat dissipation plate is provided with a notch corresponding to the floating heat sink, and the floating heat sink is located at a corresponding gap Upper, movably connected to the heat sink.
- the heat dissipation plate is provided with a whole plate heat sink; a heat pipe is disposed between the floating heat sink and the whole plate heat sink.
- the method further includes at least one auxiliary heat sink disposed outside the heat dissipation plate, and the auxiliary heat sink is disposed between the floating heat sink and/or the whole plate heat sink Heat pipe.
- a heat pipe is disposed between at least two of the floating heat sinks.
- the floating heat sink and the heat dissipation plate are movably connected by a first screw assembly: the floating heat sink is provided with at least one first mounting hole, and the heat dissipation plate is correspondingly provided with a second mounting hole,
- the first screw assembly includes a first screw and a retaining ring; when installed, the first screw sequentially passes through the first mounting hole, the second mounting hole, and is mated with the retaining ring.
- the first screw assembly further includes a first elastic component disposed between the first screw and the floating heat sink.
- the first elastic component comprises a spring, and the first screw sequentially passes through the spring, the first mounting hole, the second mounting hole, and is mated with the retaining ring.
- the heat dissipation device further includes a second elastic member disposed between the floating heat sink and the heat dissipation plate.
- the present invention also provides a function board assembly including a function board and the above-described heat sink, the function board including at least one heat source, the heat sink including a heat sink and a float corresponding to the heat source a heat sink, the heat dissipation plate includes a notch corresponding to the heat source and the floating heat sink; the function board and the heat sink are fixedly connected, and the notch and the corresponding floating heat sink are disposed corresponding to the corresponding heat source s position.
- the function board and the heat dissipating device are fixedly connected by a second screw assembly: the heat dissipating plate of the heat dissipating device is provided with at least one third mounting hole, and the function board is provided with a corresponding third mounting hole
- the fourth mounting hole includes a second screw and a nut. The second screw passes through the third mounting hole and the fourth mounting hole in sequence, and is mated with the nut.
- the invention provides a heat dissipating device and a function board assembly including the heat dissipating device.
- the heat dissipating device comprises a heat dissipating plate and a floating heat sink.
- the heat dissipating plate is provided with a notch, and the floating heat sink is located above the notch and is movably connected with the heat dissipating plate.
- the floating heat sink can float on the notch relative to the heat sink, so that the floating heat sink can adapt to the heat source of different heights and can fully contact with it to achieve an excellent heat dissipation effect.
- FIG. 1 is a schematic diagram of a heat dissipation device according to Embodiment 1 of the present invention.
- FIG. 2 is a schematic view showing a notch of a heat dissipating device according to Embodiment 1 of the present invention
- FIG. 3 is a schematic view showing the installation of a heat sink according to Embodiment 1 of the present invention.
- FIG. 4 is a schematic diagram of a functional board assembly according to Embodiment 2 of the present invention.
- FIG. 5 is a schematic diagram of the installation of a functional board assembly according to Embodiment 2 of the present invention.
- the idea of the invention is that the heat sink and the floating heat sink are movably connected; a gap is formed on the heat sink board, so that the floating heat sink can float on the heat sink board through the gap, and the floating heat sink can adapt to different heat source heights during installation, Achieve the best heat dissipation.
- This embodiment provides a heat dissipation device. Referring to FIG. 1 and FIG. 2, the method includes:
- the heat source 110 corresponding to the position of the notch 2110 of the function board 11 is in contact with the floating heat sink 211 through the notch 2110, and floats when the heat sink 21 is mounted on the function board 11 when the heat sink 21 is movably connected to the function board 11 .
- the heat sink 211 floats according to the height of the heat source 110, so that the floating heat sink 211 sufficiently absorbs the heat generated by the heat source 110.
- the number of floating heat sinks 211 depends on the number of heat sources 110 on the function board 11, and the number of floating heat sinks 211 generally coincides with the number of heat sources 110 on the function board 11, or the heat generated on the function board 11 reaches a certain level.
- the number of heat sources 110 is the same.
- the heat sink 210 is further provided with a whole board heat sink 212; the whole board heat sink 212 may be detachably disposed in the heat dissipation
- the plate 210 may also be non-removable, such as soldered on the heat sink 210; a heat pipe 213 is disposed between the floating heat sink 211 and the whole plate heat sink 212, and the floating heat sink 211 is in contact with the heat source 110 during operation.
- the temperature of the floating heat sink 211 can be self-heated on the one hand, and the heat can be transferred to the whole plate heat sink 212 through the heat pipe 213 on the other hand, and further heat is dissipated by the whole plate heat sink 212, so that the heat dissipation effect can be further improved.
- the number of the entire board heat sinks 212 is arbitrary.
- the plurality of floating heat sinks 211 may share one whole board heat sink 212; or may be used for the heat source 110 having a large heat generation amount.
- a plurality of whole plate heat sinks 212 are used to assist heat dissipation, thereby increasing the heat dissipation area and ensuring a good heat dissipation effect.
- the heat pipe 213 may be disposed between the different floating heat sinks 211 except that the heat sink 210 may be disposed on the heat sink 210 to assist heat dissipation.
- the arrangement here is preferably corresponding to the heat source 110 having a large heat generation.
- the floating heat sink 211 is disposed between the floating heat sinks 211 corresponding to the heat source 110 having a small amount of heat generation, and utilizes the floating heat sink 211 having a small heat generation amount to share the heat generated by the heat source 110 having a large heat generation amount.
- the arrangement can also be combined with the whole plate heat sink 212 described above, that is, the heat pipe 213 is disposed between the floating heat sink 211 and the whole plate heat sink 212 at the same time, so that the heat dissipation of the entire heat sink 21 is uniform.
- auxiliary heat sink 214 may be additionally disposed outside the heat sink 210.
- the auxiliary heat sink 214 may not be directly connected to the heat sink 210, but may be connected to the whole board heat sink 212 and/or the floating heat sink 211 through the heat pipe 213.
- the heat of the heat dissipation plate 210 is led to the auxiliary heat sink 214 through the heat pipe 213; the auxiliary heat sink 214 can even be placed in a low temperature environment such as a cold storage, so that the heat dissipation effect is better.
- the movable connection between the floating heat sink 211 and the heat dissipation plate 210 can be connected in various manners, such as by using a sliding slot.
- the key point is that after the floating heat sink 211 and the entire heat dissipation plate 210 are connected, the floating heat sink 211 can be a certain degree. The upper portion is changed between the upper surface and the heat dissipation plate 210.
- the first screw assembly 31 is preferably connected. Referring to FIG. 3, the floating heat sink 211 is provided with at least one first mounting hole 2111. A second mounting hole 2101 is disposed on the 210.
- the first screw assembly 31 includes a first screw 310 and a retaining ring 312.
- the floating heat sink 211 can slide between the nut of the first screw 310 and the top surface of the heat dissipation plate 210, that is, the floating heat sink 211 can be adapted to the height of the different heat sources 110, the respective heat source and the heat source. 110 close contact, achieving good heat dissipation.
- the number of the first mounting holes 2111 and the second mounting holes 2101 are equal, and each is at least one. Generally, four first mounting holes and a second mounting are respectively disposed on the floating heat sink 211 and the heat dissipation plate 210. Hole 2101 to ensure a stable and beautiful installation.
- the first elastic member may be added when the floating heat sink 211 and the heat dissipation plate 210 are installed.
- the purpose is to enable the floating heat sink 211 to be automatically attached when the heat sink 21 is mounted on the function board 11.
- Heat source 110 is generally a spring 311, which is disposed in the first screw assembly 31, that is, the first screw assembly 31 further includes a spring 311.
- the first screw 310 sequentially passes through the spring 311.
- the first mounting hole 2111 and the second mounting hole 2101 are fixedly connected to the retaining ring 312.
- the movable connection, the floating heat sink 211 and the heat dissipation plate 210 have a certain binding force.
- the floating heat sink 211 can automatically adhere to the heat source 110, and the floating heat sink 211 is taken into consideration.
- the relative floating between the heat sink 210 and the heat sink 210 ensures a good heat dissipation effect.
- a second elastic member may be disposed between the floating heat sink 211 and the heat dissipation plate 210, which functions similarly to the first elastic member.
- Both the first elastic member and the second elastic member may be other materials than the spring 311, such as rubber, spring sheets, and the like.
- the heat sink in this embodiment including the floating heat sink 211, the whole board heat sink 212, and the auxiliary heat sink 214, may all be the same or different types of heat sinks, and may specifically be a finned heat sink and a finned tube heat sink. , insert heat sink and other radiators.
- the function board 11 refers to any single board with a heat source 110, and the heat source 110 refers to various heat generating devices, mainly referring to individual chips.
- the heat pipes connecting the heat sinks may all be the same heat pipe, and a considerable contact area is maintained between the heat pipes and the heat sinks.
- the heat pipes may be annealed before use to increase thermal conductivity.
- This embodiment provides a functional board 11 component. Referring to FIG. 4, the method includes:
- the function board 11 includes at least one heat source 110; the function board 11 and the heat sink 21 are fixedly connected, and the notch 2110 in the heat sink 21 and the corresponding floating heat sink 211 It is disposed at a position corresponding to the heat source 110, that is, the heat source 110 is in contact with the corresponding floating heat sink 211 through the notch 2110. Since the heights of the different heat sources 110 are different, after the heat sink 21 and the function board 11 are installed, each floating heat sink 211 adjusts the relative position between itself and the heat sink 210 according to the heat source 110 of different heights, so that the floating heat sink The 211 is in full contact with the heat source 110.
- the function board 11 and the heat sink 21 are fixedly mounted, including any manner of fixed mounting, such as the manner of the connectors or welding.
- the preferred mounting method in this embodiment is to use the second screw assembly 41 for installation.
- the board 210 is provided with at least one third mounting hole
- the function board 11 is provided with a fourth mounting hole corresponding to the third mounting hole.
- the second screw assembly 41 includes a second screw 410 and a nut 411, and when installed, the second The screw 410 sequentially passes through the third mounting hole, the fourth mounting hole, and is mated with the nut 411.
- the number of the third mounting hole and the fourth mounting hole are equal, and at least one.
- four third mounting holes and four corresponding fourth mounting holes are provided to ensure the stability and appearance of the installation.
- a limiting post is disposed at the bottom of the 210; when the limiting post contacts the top of the functional panel 11, the functional panel 11 and the heat sink 21 are considered to have been installed; similarly, a limiting post may be disposed at the top of the functional panel 11. When the limit post contacts the bottom of the heat sink 210, it is considered that the function board 11 and the heat sink 21 have been installed.
- the elastic member is disposed between the heat dissipation plate 210 of the heat dissipation device 21 and the floating heat sink 211, the heat source 110 on the function board 11 is in close contact with the corresponding floating heat sink 211, and the floating heat sink is gradually formed.
- the 211 is pushed up to a certain extent, which increases the elastic deformation of the elastic member, so that the elastic force applied to the floating heat sink 211 is greater, so that the floating heat sink 211 is in close contact with the heat source 110 to achieve the best heat dissipation effect.
- This embodiment provides a functional board 11 assembly, including:
- the heat dissipating device 21 includes a heat dissipating plate 210 and a plurality of floating heat sinks 211; the heat dissipating plate 210 is provided with a whole plate heat sink 212, and a heat pipe 213 is disposed between the floating heat sink 211 and the whole plate heat sink 212; Each of the floating heat sinks 211 is mounted on each of the corresponding notches 2110; each of the floating heat sinks 211 is provided with four first mounting holes 2111, each floating heat sink.
- the corresponding heat dissipation plate 210 of the 211 is disposed with four corresponding second mounting holes 2101.
- the floating heat sink 211 and the heat dissipation plate 210 are movably connected by the first screw assembly 31.
- the first screw assembly 31 includes a first screw 310 and a spring. 311, the retaining ring 312, when installed, the first screw 310 sequentially passes through the spring 311, the first mounting hole 2111, the second mounting hole 2101, and is cooperatively connected with the retaining ring 312.
- the floating heat sink 211 and the corresponding notch 2110 respectively correspond to the heat source 110 on the function board 11.
- the heat pipe 213 is annealed to make the heat dissipation effect better.
- the function board 11 includes a plurality of chips, each of which corresponds to the floating heat sink 211 in the heat sink 21; the function board 11 and the heat sink 21 are fixedly connected by the second screw assembly 41, wherein the heat sink 210 of the heat sink 21 is provided with a plurality of a third mounting hole, the function board 11 is provided with a fourth mounting hole corresponding to the third mounting hole, the second screw assembly 41 includes a second screw 410 and a nut 411; when installed, the second screw 410 sequentially passes through the third The mounting hole and the fourth mounting hole are coupled to the nut 411.
- the spacing between the function board 11 and the heat sink 210 of the heat sink 21 is gradually reduced.
- the floating heat sink 211 is gradually jacked up, so that the spring 311 between the floating heat sink 211 and the heat sink 210 is more and more compressed, and the spring 311 After being compressed, a greater spring force is generated, which acts on the floating heat sink 211 to make it more closely attached to the corresponding chip.
- the bottom of the heat dissipation plate 210 is provided with a plurality of limiting posts; when the limiting post contacts the top of the functional panel 11, the installation between the functional panel 11 and the heat sink 21 is completed, and the installation of the functional panel 11 assembly is completed.
- the invention provides a heat dissipating device and a function board assembly including the heat dissipating device.
- the heat dissipating device comprises a heat dissipating plate and a floating heat sink.
- the heat dissipating plate is provided with a notch, and the floating heat sink is located above the notch and is movably connected with the heat dissipating plate.
- the floating heat sink can float on the notch relative to the heat sink, so that the floating heat sink can adapt to the heat source of different heights and can fully contact with it to achieve an excellent heat dissipation effect.
Abstract
本发明提供了一种散热装置和功能板组件，散热装置包括散热板和浮动散热器，散热板设有缺口，浮动散热器位于缺口上方且与散热板活动连接；功能板组件包括散热装置和功能板，功能板上包括热源，浮动散热器可以在缺口上相对于散热板浮动，使浮动散热器适应不同高度的热源且能与之充分接触，达到极佳的散热效果。
Description
本发明涉及电子通信领域，尤其涉及一种散热装置和功能板组件。
在电子设备、通讯设备中，散热器应用比较广泛。尤其是，随着电子、通讯行业的不断发展，芯片功耗越来越大，对散热器的散热能力要求越来越高。特别是对于一些高功耗芯片，传统的普通散热器及热管散热器遇到瓶颈，为了增加散热器的换热面积，目前市场上应用较多的散热器是大基板埋热管、靠硬连接方式固定。
但是，这种散热器存在一定的缺陷：一方面平面度无法保证；另一方面为了保证散热器与每个芯片之间的接触，采用导热泥填充间隙，增加阻热系数，影响散热。
发明内容
本发明提供了一种散热装置和功能板组件，解决了现有技术中由于散热器和热源之间接触不充分而导致的散热不佳的问题。
为了解决上述技术问题，本发明提供了一种散热装置，包括散热板和至少一个浮动散热器；所述散热板设有与所述浮动散热器对应的缺口，所述浮动散热器位于对应的缺口上，与所述散热板活动连接。
进一步的，所述散热板设有整板散热器；所述浮动散热器和整板散热器之间设有热管。
进一步的，还包括至少一个辅助散热器，所述辅助散热器设置于所述散热板之外，且所述辅助散热器与所述浮动散热器和/或所述整板散热器之间设有热管。
进一步的，至少两个所述浮动散热器之间设有热管。
进一步的，所述浮动散热器与所述散热板通过第一螺钉组件活动连接：所述浮动散热器上设置有至少一个第一安装孔，所述散热板上对应设置有第二安装孔，所述第一螺钉组件包括第一螺钉和挡圈；安装时，所述第一螺钉依次穿过所述第一安装孔、第二安装孔，并与挡圈配合连接。
进一步的，所述第一螺钉组件还包括第一弹性部件，所述第一弹性部件设置于所述第一螺钉和所述浮动散热器之间。
进一步的，所述第一弹性部件包括弹簧，安装时，所述第一螺钉依次穿过所述弹簧、第一安装孔、第二安装孔，并与挡圈配合连接。
进一步的，散热装置还包括第二弹性部件，所述第二弹性部件设置于所述浮动散热器和所述散热板之间。
为了解决上述技术问题，本发明还提供了一种功能板组件，包括功能板和上述的散热装置，所述功能板包括至少一个热源，所述散热装置包括散热板和与所述热源对应的浮动
散热器，所述散热板包括与所述热源和所述浮动散热器对应的缺口；所述功能板和所述散热装置固定连接，且所述缺口和对应的浮动散热器设置于对应的热源相应的位置。
进一步的，所述功能板和所述散热装置通过第二螺钉组件固定连接：所述散热装置的散热板上设有至少一个第三安装孔，所述功能板上设有与第三安装孔对应的第四安装孔，所述第二螺钉组件包括第二螺钉和螺母，安装时，所述第二螺钉依次穿过所述第三安装孔、第四安装孔，并与所述螺母配合连接。
本发明的有益效果：
本发明提供了一种散热装置和包括该散热装置的功能板组件，散热装置包括散热板和浮动散热器，散热板设有缺口，浮动散热器位于缺口上方且与散热板活动连接。浮动散热器可以在缺口上相对于散热板浮动，使浮动散热器适应不同高度的热源且能与之充分接触，达到极佳的散热效果。
图1是本发明实施例一提供的一种散热装置的示意图；
图2是本发明实施例一提供的一种散热装置的缺口示意图；
图3是本发明实施例一提供的散热装置安装示意图；
图4是本发明实施例二提供的一种功能板组件的示意图；
图5是本发明实施例二提供的一种功能板组件安装的示意图。
本发明的构思在于：散热板和浮动散热器活动连接；在散热板上开设缺口，使浮动散热器可以通过该缺口在散热板上浮动，安装时，浮动散热器可以适应不同的热源高度，以达到最好的散热效果。
下面结合具体附图对本发明的具体实施方式作进一步说明。
实施例一
本实施例提供了一种散热装置，请参考图1和图2，包括：
散热板210和至少一个浮动散热器211；散热板210上设置有与浮动散热器211对应的缺口2110，浮动散热器211位于对应的缺口2110上，且浮动散热器211和散热板210之间活动连接。由于浮动散热器211和散热板210之间活动连接，所以在散热装置21安装在功能板11上时，功能板11上对应缺口2110位置的热源110通过该缺口2110与浮动散热器211接触，浮动散热器211则根据热源110的高度进行浮动，使浮动散热器211充分吸收热源110所产生的热量。浮动散热器211的数量根据功能板11上热源110的数量而定，浮动散热器211的数量一般与功能板11上的热源110的数量一致，或者说，与功能板11上的发热量达到一定程度的热源110的数量一致。
散热板210上还设置有整板散热器212；整板散热器212可以是可拆卸的设置在散热
板210上，也可以是不可拆卸的，如焊接在散热板210上；浮动散热器211和整板散热器212之间设置有热管213，在工作时，由于浮动散热器211与热源110接触则温度较高，浮动散热器211一方面可以自行散热，另一方面，可以将热量通过热管213传递给整板散热器212，利用整板散热器212进一步散热，这样可以进一步提高散热的效果。整板散热器212的个数是任意的，在热源110不多、热量不大的情况下，可以让多个浮动散热器211共用一个整板散热器212；也可以针对发热量大的热源110，用多个整板散热器212辅助散热，增大了散热面积，保证良好的散热效果。
此外，除了可以在散热板210上设置整板散热器212辅助散热，也可以在不同的浮动散热器211之间设置热管213；当然，此处的设置方式优选的在发热量大的热源110对应的浮动散热器211和发热量小的热源110对应的浮动散热器211之间设置，充分利用发热量小的浮动散热器211，分担发热量大的热源110所产生的热量。该设置方式还可以结合上述的整板散热器212一起，即同时在浮动散热器211和整板散热器212之间均设置热管213，使整个散热装置21的散热均匀。
不管是浮动散热器211还是散热板210上的整板散热器212，安装之后其都是位于散热板210上；如果功能板11的发热量过大，散热板210的散热情况可能就比较窘迫；可以在散热板210之外，额外设置至少一个辅助散热器214，辅助散热器214可以不与散热板210直接相连，而是通过热管213和整板散热器212和/或浮动散热器211相连，通过热管213把散热板210的热量导出至辅助散热器214；辅助散热器214甚至可以置于冷库等低温环境中，使散热效果更好。
浮动散热器211和散热板210之间的活动连接可以通过多种方式，如采用滑槽的方式连接，其关键在于浮动散热器211和整散热板210连接后，浮动散热器211可以在一定程度上改变和散热板210之间的相对位置；本实施例中优选的采用第一螺钉组件31的连接方式，请参考图3：浮动散热器211上设置有至少一个第一安装孔2111，散热板210上对应设置有第二安装孔2101，第一螺钉组件31包括第一螺钉310和挡圈312，安装时，第一螺钉310依次穿过第一安装孔2111、第二安装孔2101后与挡圈312配合连接。这样连接之后，浮动散热器211就可以在第一螺钉310的螺帽和散热板210的顶面之间滑动，也就是可以实现让浮动散热器211适应不同的热源110的高度、能各自和热源110紧密接触，达到良好的散热效果。第一安装孔2111和第二安装孔2101的数量是相等的，且分别至少为一个，一般而言，在浮动散热器211和散热板210上会分别设置四个第一安装孔和第二安装孔2101，以保证安装的稳定和美观。
为了后续安装的简便，还可以在浮动散热器211和散热板210安装时，增加第一弹性部件，其目的是使散热装置21安装在功能板11上时，可以使浮动散热器211自动的贴合热源110。在本实施例中，第一弹性部件一般是弹簧311，其设置在第一螺钉组件31中，即第一螺钉组件31中还包括弹簧311，安装时，第一螺钉310依次穿过弹簧311、第一安装孔2111、第二安装孔2101后与挡圈312固定连接。这样，浮动散热器211和散热板210
既是活动连接，浮动散热器211和散热板210之间又有一定的约束力，在散热装置21和功能板11连接之后，浮动散热器211能够自动紧贴热源110，且兼顾了浮动散热器211和散热板210之间的相对浮动，保证了良好的散热效果。
此外，还可以在浮动散热器211和散热板210之间设置第二弹性部件，其作用与第一弹性部件类似。第一弹性部件和第二弹性部件均可以是除弹簧311以外的其他材料，如橡胶、弹簧片等均可。
本实施例中的散热器，包括浮动散热器211、整板散热器212、辅助散热器214均可以是相同或不同类型的散热器，其具体可以是翅片式散热器、翅片管散热器、插片散热器等等散热器。功能板11是指任何带有热源110的单板，其热源110则指的是各种发热的器件，主要是指各个芯片。本实施例中连接各个散热器的热管均可以是同一种热管，且热管和各个散热器之间保持相当程度的接触面积，热管在使用前可以经过退火处理，增大导热性能。
实施例二
本实施例提供了一种功能板11组件，请参考图4，包括：
功能板11和实施例一中所提供的散热装置21，功能板11上包括至少一个热源110；功能板11和散热装置21固定连接，且散热装置21中的缺口2110和对应的浮动散热器211设置于与热源110相应的位置，即热源110通过缺口2110和相应的浮动散热器211接触。由于不同的热源110的高度会不同，所以在散热装置21和功能板11安装之后，各个浮动散热器211会根据不同高度的热源110调节自身与散热板210之间的相对位置，使浮动散热器211和热源110接触充分。
功能板11和散热装置21之间是固定安装，其包括了任何固定安装的方式，例如连接件的方式或者焊接等方式。为了使功能板11和散热装置21之间的安装是可拆卸的，以便于维护，本实施例中优选的安装方式是采用第二螺钉组件41进行安装，请参考图5：散热装置21的散热板210上设置有至少一个第三安装孔，而功能板11上设置有与第三安装孔相应的第四安装孔，第二螺钉组件41包括第二螺钉410和螺母411，安装时，第二螺钉410依次穿过第三安装孔、第四安装孔，并与螺母411配合连接。第三安装孔和第四安装孔的数目相等，且至少为一个，一般来说会设置四个第三安装孔和对应的四个第四安装孔，保证安装的稳定性和美观。
出于安全性的考虑，安装时，功能板11和散热装置21之间不宜过近，应该在功能板11和散热装置21之间预留一定的空间，因此，可以在散热装置21的散热板210的底部设置限位柱；当限位柱接触到功能板11的顶部时，则认为功能板11和散热装置21已经安装完成；同样的，也可以在功能板11的顶部设置限位柱，当限位柱接触到散热板210的底部时，则认为功能板11和散热装置21已经安装完成。
在安装时，由于散热装置21的散热板210和浮动散热器211之间设置有弹性部件，所以功能板11上的热源110与相应的浮动散热器211紧密接触后，会逐渐将浮动散热器
211在一定程度上顶起，这会增大弹性部件的弹性形变，使其施加给浮动散热器211的弹性力更大，令浮动散热器211紧贴热源110，达到最好的散热效果。
实施例三
本实施例提供了一种功能板11组件，包括：
散热装置21和功能板11，其中：
散热装置21包括散热板210和若干个浮动散热器211；散热板210上设置有整板散热器212，浮动散热器211和整板散热器212之间设有热管213；散热板210上设置有与浮动散热器211对应的缺口2110，每个浮动散热器211安装时即安装于各个对应的缺口2110上方；每个浮动散热器211上设有四个第一安装孔2111，每个浮动散热器211对应安装位置的散热板210上设置有对应的四个第二安装孔2101，浮动散热器211和散热板210通过第一螺钉组件31活动连接：第一螺钉组件31包括第一螺钉310、弹簧311、挡圈312，安装时，第一螺钉310依次穿过弹簧311、第一安装孔2111、第二安装孔2101，并与挡圈312配合连接。浮动散热器211和对应的缺口2110分别与功能板11上的热源110相对应。其中的热管213经过退火处理，使得散热效果更佳。
功能板11包括若干个芯片，各个芯片对应散热装置21中的浮动散热器211；功能板11和散热装置21通过第二螺钉组件41固定连接，其中，散热装置21的散热板210上设有若干个第三安装孔，功能板11上设置有与第三安装孔对应的第四安装孔，第二螺钉组件41包括第二螺钉410和螺母411；安装时，第二螺钉410依次穿过第三安装孔和第四安装孔，并与螺母411配合连接。
随着螺母411和螺钉之间的旋紧，功能板11和散热装置21的散热板210之间的间距逐渐减小。功能板11上的芯片在与对应的浮动散热器211紧贴后，逐渐将浮动散热器211顶起，从而使浮动散热器211和散热板210之间的弹簧311越来越被压缩，弹簧311被压缩后，产生了更大的弹力，该弹力作用于浮动散热器211，使其更加紧贴对应的芯片。
散热板210的底部设置有若干个限位柱；当限位柱接触到功能板11的顶部时，功能板11和散热装置21之间的安装结束，功能板11组件的安装完成。
以上内容是结合具体的实施方式对本发明所作的进一步详细说明，不能认定本发明的具体实施只局限于这些说明。对于本发明所属技术领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干简单推演或替换，都应当视为属于本发明的保护范围。
本发明提供了一种散热装置和包括该散热装置的功能板组件，散热装置包括散热板和浮动散热器，散热板设有缺口，浮动散热器位于缺口上方且与散热板活动连接。浮动散热器可以在缺口上相对于散热板浮动，使浮动散热器适应不同高度的热源且能与之充分接触，达到极佳的散热效果。
Claims (10)
- 一种散热装置，其特征在于，包括散热板和至少一个浮动散热器；所述散热板设有与所述浮动散热器对应的缺口，所述浮动散热器位于对应的缺口上，与所述散热板活动连接。
- 如权利要求1所述的散热装置，其特征在于，所述散热板设有整板散热器；所述浮动散热器和整板散热器之间设有热管。
- 如权利要求2所述的散热装置，其特征在于，还包括至少一个辅助散热器，所述辅助散热器设置于所述散热板之外，所述辅助散热器与所述浮动散热器和/或所述整板散热器之间设有热管。
- 如权利要求1所述的散热装置，其特征在于，至少两个所述浮动散热器之间设有热管。
- 如权利要求1-4任一项所述的散热装置，其特征在于，所述浮动散热器与所述散热板通过第一螺钉组件活动连接：所述浮动散热器上设置有至少一个第一安装孔，所述散热板上对应设置有第二安装孔，所述第一螺钉组件包括第一螺钉和挡圈；安装时，所述第一螺钉依次穿过所述第一安装孔、第二安装孔，并与挡圈配合连接。
- 如权利要求5所述的散热装置，其特征在于，所述第一螺钉组件还包括第一弹性部件，所述第一弹性部件设置于所述第一螺钉和所述浮动散热器之间。
- 如权利要求6所述的散热装置，其特征在于，所述第一弹性部件包括弹簧，安装时，所述第一螺钉依次穿过所述弹簧、第一安装孔、第二安装孔，并与挡圈配合连接。
- 如权利要求5所述的散热装置，其特征在于，还包括第二弹性部件，所述第二弹性部件设置于所述浮动散热器和所述散热板之间。
- 一种功能板组件，其特征在于，包括功能板和如权利要求1-8任一项所述的散热装置，所述功能板包括至少一个热源，所述散热装置包括散热板和与所述热源对应的浮动散热器，所述散热板包括与所述热源和所述浮动散热器对应的缺口；所述功能板和所述散热装置固定连接，且所述缺口和对应的浮动散热器设置于对应的热源相应的位置。
- 如权利要求9所述的功能板组件，其特征在于，所述功能板和所述散热装置通过第二螺钉组件固定连接：所述散热装置的散热板上设有至少一个第三安装孔，所述功能板上设有与第三安装孔对应的第四安装孔，所述第二螺钉组件包括第二螺钉和螺母，安装时，所述第二螺钉依次穿过所述第三安装孔、第四安装孔，并与所述螺母配合连接。
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