WO2017065073A1 - Tête d'assemblage et dispositif de montage - Google Patents

Tête d'assemblage et dispositif de montage Download PDF

Info

Publication number
WO2017065073A1
WO2017065073A1 PCT/JP2016/079713 JP2016079713W WO2017065073A1 WO 2017065073 A1 WO2017065073 A1 WO 2017065073A1 JP 2016079713 W JP2016079713 W JP 2016079713W WO 2017065073 A1 WO2017065073 A1 WO 2017065073A1
Authority
WO
WIPO (PCT)
Prior art keywords
heater
bonding head
heat
cooling
groove
Prior art date
Application number
PCT/JP2016/079713
Other languages
English (en)
Japanese (ja)
Inventor
寺田　勝美
Original Assignee
東レエンジニアリング株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東レエンジニアリング株式会社 filed Critical 東レエンジニアリング株式会社
Publication of WO2017065073A1 publication Critical patent/WO2017065073A1/fr

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers

Definitions

  • the present invention relates to a bonding head used when heat-pressing an electronic component such as a semiconductor chip to a wiring board or the like, and a mounting apparatus including the same.
  • a flip chip method As a method for mounting an electronic component such as a semiconductor chip on a substrate such as a wiring substrate, a flip chip method is known.
  • the flip-chip method an electronic component electrode and a substrate electrode are bonded by thermocompression bonding using a mounting apparatus 1 as shown in FIG.
  • the electronic component C is arranged at the tip of the bonding head 2 by an electronic component delivery mechanism (not shown) and is held by the bonding head 2. Thereafter, the alignment mark provided on the substrate B held on the substrate stage 4 and the alignment mark provided on the electronic component C are recognized by the image recognition means 5 to perform alignment.
  • the alignment is performed by moving at least one of the bonding head 2 and the substrate stage 4 in an in-plane direction (XY direction and ⁇ direction) parallel to the substrate B.
  • the bonding head 2 is lowered by the bonding unit 3 and the electronic component C is pressure-bonded to the substrate B while heating and heating, and the electrode of the electronic component C and the electrode of the substrate B are joined.
  • the bonding head 2 releases the holding of the electronic component C, moves up by the bonding unit 3, holds the electronic component C to be mounted next at the tip portion, and the above-described series of operations is performed.
  • the bonding head 2 is configured as shown in FIG. That is, the bonding head 2 includes an attachment tool 20 that sucks and holds the electronic component C on the lower surface, a heater 21 that is disposed above the attachment tool 20, and a heat insulating block 22 that is disposed above the heater 21.
  • the electronic component C is heated by heating the heater 21 having a function of raising the temperature of the attachment tool 20.
  • Insulation block 22 is arranged to suppress this. Further, the heat insulating block 22 is connected to the head main body 24 via the holder 23.
  • thermosetting adhesive layer is provided in advance on the electrode side surface of an electronic component, and a method of curing the thermosetting adhesive layer at the time of thermocompression bonding is also being adopted.
  • the temperature of the attachment tool must be lower than the curing start temperature of the thermosetting adhesive layer in the stage of holding the electronic component. For this reason, in the series of tact times, the ratio of the time for cooling the heated attachment tool (and the heater) is increasing, and an effective cooling means is required from the viewpoint of shortening the tact time.
  • Patent Document 1 introduces a method of air cooling using a cooling blow nozzle provided with an attachment tool and a heater around.
  • a temperature difference is generated between the air-cooled surface and the inside, and the time for cooling to the inside cannot be expected to be greatly shortened.
  • Patent Document 2 a method of cooling a heater by providing a plurality of grooves in the heater and flowing cooling air from the inside of the heater through a flow path formed by overlapping the heater and the heat insulating block has been proposed (for example, Patent Document 2).
  • FIG. 7 shows the heater 21 and the heat insulating block 22 in the bonding head 2 shown in FIG.
  • FIG. 8 and 9 are three views showing the shapes of the heater 21 and the heat insulating block 22 that constitute the portion shown in FIG.
  • a plurality of grooves 21U are provided on the upper surface of the heater 21, and a plurality of tubular flow paths 21P are formed by overlapping the heat insulating block 22 and the heater 21 shown in FIG.
  • the heat insulation block 22 is formed with a recess 22D in a range extending over all the grooves 21U of the heater 21, and is provided with a vent hole 22V connected to the recess 22D.
  • the cooling air flows from the vicinity of the center of the heater 21 to both side surfaces (forward and backward in FIG. 7), and the heater 21 is cooled from the inside. 7 and 8, the groove 21U and the tubular flow path 21P are drawn larger for the sake of explanation, but in practice, a large number of grooves 21U (tubular flow paths 21P) each having a piece of less than 1 mm are formed.
  • the method of forming the flow path by forming the groove 21U on the upper surface of the heater 21 and overlapping the lower surface 22S of the heat insulating block 22 allows the heater 21 to be cooled from the inside, and therefore, compared with the case of blowing cooling air from the outside. This is an advantageous cooling method.
  • the tubular flow path 21P formed by the groove 21U of the heater 21 and the lower surface 22S of the heat insulating block 22 is free from air leakage between each other. There is no state. For this reason, if there is a variation in the shape of the tubular flow path 21P (due to variations in processing accuracy when forming the groove 21U, etc.), the cooling effect differs between the individual tubular flow paths 21P, resulting in uneven cooling within the heater surface. .
  • This adverse effect is caused by the difference in the material of the heater 21 and the heat insulation block 22, and a temperature difference due to the difference in thermal conductivity can be produced at the interface between the heater and the heat insulation member during temperature rise / cooling. It relates to the generated stress.
  • the thermal expansion coefficient is about 5 ⁇ 10 ⁇ 6 / K, but the thermal conductivity is 100 times higher. Because of these differences, a large temperature difference is created at the interface between the two materials, resulting in a difference in elongation due to thermal expansion.
  • the thin wall 21W (forming the groove 21U) is easily affected by stress, and the upper portion 21T of the wall 21W is deformed or generates friction. . Even if such deformation and friction are negligible, the upper portion 21T of the wall 21W is scraped as shown in FIG. 10 while the temperature of the heater 21 is repeatedly raised and cooled (AB in FIG. 10). In some cases, the bottom surface 22S of the heat insulating block 22 may be scraped or damaged (BR in FIG. 10). In particular, in the case of ceramic, since it is a hard and brittle material, the corner portion of the upper portion 21 of the wall 21 ⁇ / b> W has a drawback that stress concentrates and is easily chipped.
  • the wear powder PW and debris BP enter the groove 21U, and a part is produced outside together with the cooling air. Remains in the groove 21U and closes the tubular channel 21P.
  • the wear powder PW and debris BP discharged to the outside become foreign matters in the mounting atmosphere and adversely affect the mounting quality of the electronic component C. Further, the wear remaining in the groove 21U obstructs the flow of the cooling air by closing the tubular flow path 21P and causes uneven cooling.
  • the present invention has been made in view of the above problems, and provides a bonding head that is excellent in cooling performance and does not adversely affect mounting quality even if heating and cooling are repeated, and a mounting apparatus using the same. It is.
  • a bonding head used for thermocompression bonding of electronic components An attachment tool for holding electronic components on the bottom surface; A heater disposed on top of the attachment tool; A heat insulation block disposed on top of the heater; A plurality of grooves are formed on the upper surface of the heater, In the bonding head, a gap is provided in a range including the region in which the groove is provided at an interface between the upper surface of the heater and the lower surface of the heat insulating block.
  • the invention according to claim 2 is the bonding head according to claim 1,
  • the bonding head is characterized in that an interval of the gap is not less than 0.3% and not more than 40% of the depth of the groove.
  • Claim 3 is the bonding head of Claim light 1 or Claim 2, Comprising:
  • the bonding head is characterized in that the gap is formed by providing a recess on a lower surface of the heat insulating block.
  • the invention according to claim 4 is a mounting apparatus comprising the bonding head according to any one of claims 1 to 3.
  • the bonding head of the present invention and the mounting apparatus using the same can mount electronic components that have excellent cooling performance and do not adversely affect mounting quality even if heating and cooling are repeated.
  • FIG. 1 is an enlarged view of FIG.
  • FIG. 2 shows a three-sided view of the heat insulation block 22 shown in FIG.
  • the material of the heater 21 is ceramics, and a heating resistor is embedded inside.
  • ceramics those having high thermal conductivity (50 W / m ⁇ K or more) and excellent electrical insulation are desirable, and aluminum nitride or the like is preferable.
  • ceramic is also used as the material of the heat insulating block 22, but the thermal conductivity is preferably 5 W / m ⁇ K or less, preferably 1.5 W / m ⁇ K or less.
  • the heater 21 in FIG. 1 has the same shape as that shown in the three-view diagram in FIG. 8, and a plurality of grooves 21U having a width WU and a depth HU are formed from one side surface of the upper surface to the opposite side surface. is there.
  • a plurality of comb-like walls 21W are formed by forming a plurality of grooves 21U.
  • the upper portion 21T of the wall 21W is the same height as the upper surface 21S of the heater 21, and the height of the wall 21W is HU.
  • the wall 21W has a width WT, but the width WT is determined by the width WU of the groove 21U and the formation pitch.
  • the heat insulation block 22 of FIG. 1 has the shape of the three views shown in FIG. Unlike the one shown in FIG. 9, the heat insulating block 22 shown in FIG. 2 has a second lower surface 22C.
  • the second lower surface 22C is flat and parallel to the lower surface 22S, but has a step height HG with respect to the lower surface 22S.
  • the gap 22G has a tunnel shape.
  • the second lower surface 22C has a width that forms a gap 22G in a range including all the grooves 21U, with the longitudinal direction of the tunnel shape being parallel to the grooves 21U when the heat insulating block 22 is superimposed on the heater 21. Yes.
  • cooling air is sent into the vent hole 22V by a blower system (not shown), and the sent cooling air passes through the recess 22D and passes through the groove 21U.
  • the heater 21 is cooled from the inside.
  • the cooling air also passes through the gap 22G, but at that time, the cooling air also contacts the upper surface 21T of the wall 21W, so that the heater 21 is cooled from the upper surface. This is an effect that the upper surface 21T is hard to cool because the upper surface 21T of the wall 21W is in close contact with the lower surface 22S of the heat-insulating block 22, which is an effect not found in the prior art.
  • the gap HG of the gap formed by the step between the lower surface 22S of the heat insulation block 22 and the second lower surface 22C is determined as follows. That is, the lower limit value is a value at which the upper portion 21T of the wall 21W does not contact the second lower surface of the heat insulation block 22 even when the heater 21 and the heat insulation block 22 are deformed as the heater 21 is heated and cooled.
  • the upper limit is determined by the ratio of the cross-sectional area of the gap 22G to the cross-sectional area of the groove 21U from the viewpoint of cooling efficiency and the like.
  • the interval HG satisfies the following formula (1) so that the upper portion 21T does not contact the second lower surface 22C of the heat insulating block 22 even if the wall 21W is thermally expanded to the maximum.
  • ⁇ is a coefficient of thermal expansion of the material constituting the heater 21
  • ⁇ T is a temperature difference between when the heater 21 is heated and when it is cooled.
  • Conditions satisfying such conditions vary depending on the shape and arrangement of the groove 21U, but a specific value is preferably in the range of 0.3% to 40% of the depth HU of the groove 21U.
  • the cooling effect can be expected as the number of the grooves 21U in the heater 21 increases, it is desirable to form as many grooves as possible according to the processing accuracy. Further, since the cooling effect can be expected as the depth HU of the groove 21U is increased, it is desirable to increase the depth within a range in which the heating resistor is not hindered.
  • increasing the number of grooves 21U and increasing the depth HU decreases the mechanical strength of the wall 21W, but the upper portion 21T of the wall 21W does not contact the heat insulating block 22 as described above. So it will not be stressed. For this reason, as compared with the prior art, the groove 21U can be formed deeper and deeper, which is effective in improving the cooling effect.
  • the cooling efficiency of the heater 21 can be improved, and the wall 21W of the heater 21 can be prevented from being scraped or damaged.
  • the tact time of electronic component mounting can be shortened without adversely affecting the mounting quality.
  • the present invention is not particularly limited as long as the upper portion 21T of the wall 21W does not contact the heat insulating block 22. That is, as in another embodiment shown in FIG. 3, a gap 21 ⁇ / b> G that lowers the upper portion 21 ⁇ / b> T of the wall 21 ⁇ / b> W may be provided with respect to the upper surface 22 ⁇ / b> S of the heater 21. That is, the same effect as the configuration of FIG. 1 can be obtained by using the heater 21 shown in FIG. 4 in combination with the heat insulating block 22 shown in FIG.
  • the gap 21G of the heater 21 is also preferably set in the same range as the gap HG of the gap formed by the step between the lower surface 22S of the heat insulation block 22 and the second lower surface 22C shown in FIG.
  • the present invention may be used not only for the bonding head 2 but also for the substrate stage 4 that holds and heats the substrate B side, or may be used for both the bonding head 2 and the substrate stage 4 to perform heating and cooling from both sides. good.
  • the electronic component C is small and the volume on the substrate B side is large and the amount of heat from the head side cannot be sufficiently transmitted, it is effective to heat from the substrate B side with a heater, and both the electronic component C and the substrate B are very small. In such a case, it is effective to heat from both sides with a heater.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)

Abstract

L'invention concerne une tête d'assemblage qui offre une excellente performance de refroidissement, même après un chauffage et un refroidissement répétés, et qui n'influence pas négativement la qualité de montage, et un dispositif de montage l'utilisant. Plus particulièrement, l'invention concerne une tête d'assemblage et un dispositif de montage l'utilisant, la tête d'assemblage étant pourvue : d'un outil de fixation qui maintient un composant électronique sur une surface inférieure de celui-ci ; d'un élément chauffant disposé sur une partie supérieure de l'outil de fixation ; et d'un bloc d'isolation thermique disposé sur une partie supérieure de l'élément chauffant, lequel élément chauffant comporte une pluralité de rainures formées dans une surface supérieure de celui-ci, et, dans une interface entre la surface supérieure de l'élément chauffant et une surface inférieure du bloc d'isolation thermique, un espace est ménagé dans une zone comprenant la région dans laquelle sont disposées les rainures.
PCT/JP2016/079713 2015-10-16 2016-10-06 Tête d'assemblage et dispositif de montage WO2017065073A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015204941A JP6836317B2 (ja) 2015-10-16 2015-10-16 ボンディングヘッドおよび実装装置
JP2015-204941 2015-10-16

Publications (1)

Publication Number Publication Date
WO2017065073A1 true WO2017065073A1 (fr) 2017-04-20

Family

ID=58518167

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2016/079713 WO2017065073A1 (fr) 2015-10-16 2016-10-06 Tête d'assemblage et dispositif de montage

Country Status (2)

Country Link
JP (1) JP6836317B2 (fr)
WO (1) WO2017065073A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111816614A (zh) * 2020-02-28 2020-10-23 浙江集迈科微电子有限公司 一种芯片贴装方式

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002134906A (ja) * 2000-10-20 2002-05-10 Matsushita Electric Ind Co Ltd 電子部品の熱圧着装置および熱圧着方法
JP2004063947A (ja) * 2002-07-31 2004-02-26 Kyocera Corp 加熱装置
JP2014022629A (ja) * 2012-07-20 2014-02-03 Shinkawa Ltd ボンディング装置用ヒータ及びその冷却方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3809125B2 (ja) * 2002-04-11 2006-08-16 新光電気工業株式会社 半導体チップボンディング用ヘッドおよび半導体チップボンディング方法
JP6038783B2 (ja) * 2011-05-27 2016-12-07 東レエンジニアリング株式会社 実装方法および実装装置
KR101543864B1 (ko) * 2013-11-13 2015-08-11 세메스 주식회사 본딩 헤드 및 이를 포함하는 다이 본딩 장치

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002134906A (ja) * 2000-10-20 2002-05-10 Matsushita Electric Ind Co Ltd 電子部品の熱圧着装置および熱圧着方法
JP2004063947A (ja) * 2002-07-31 2004-02-26 Kyocera Corp 加熱装置
JP2014022629A (ja) * 2012-07-20 2014-02-03 Shinkawa Ltd ボンディング装置用ヒータ及びその冷却方法

Also Published As

Publication number Publication date
JP6836317B2 (ja) 2021-02-24
JP2017076757A (ja) 2017-04-20

Similar Documents

Publication Publication Date Title
TWI259570B (en) Cooling an integrated circuit die with coolant flow in a microchannel and a thin film thermoelectric cooling device in the microchannel
JP7022901B2 (ja) 半導体レーザ装置
WO2013118478A1 (fr) Dispositif à semi-conducteurs
JP2007019203A (ja) 放熱装置
JP2013021254A (ja) 半導体装置および半導体装置の製造方法
JP2012028674A (ja) 半導体装置および半導体装置の製造方法
JP2008016515A (ja) 半導体モジュール
JP6391527B2 (ja) パワー半導体モジュール
JP6366723B2 (ja) 半導体装置およびその製造方法
WO2016158020A1 (fr) Module à semi-conducteur
JP6344477B2 (ja) 半導体モジュール
JP6850854B2 (ja) ボンディングヘッドおよび実装装置
WO2017065073A1 (fr) Tête d'assemblage et dispositif de montage
JP2008294282A (ja) 半導体装置及び半導体装置の製造方法
JP6632856B2 (ja) ボンディングヘッドおよび実装装置
JP5065202B2 (ja) 半導体装置
JP5061740B2 (ja) パワーモジュール用基板
JP7130928B2 (ja) 半導体装置
JP6320347B2 (ja) 半導体装置
KR101878035B1 (ko) 회로 기판
JP4573467B2 (ja) パワー半導体装置
JP6436247B2 (ja) 半導体装置及びその製造方法
US10276464B2 (en) Semiconductor device
JP7179613B2 (ja) デバイス
US20150364440A1 (en) Rapid cooling system for a bond head heater

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 16855327

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 16855327

Country of ref document: EP

Kind code of ref document: A1