WO2017028008A1 - Silicone de conditionnement de del à indice de réfraction élevé, à grande dureté et résistant à la vulcanisation - Google Patents

Silicone de conditionnement de del à indice de réfraction élevé, à grande dureté et résistant à la vulcanisation Download PDF

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Publication number
WO2017028008A1
WO2017028008A1 PCT/CN2015/086958 CN2015086958W WO2017028008A1 WO 2017028008 A1 WO2017028008 A1 WO 2017028008A1 CN 2015086958 W CN2015086958 W CN 2015086958W WO 2017028008 A1 WO2017028008 A1 WO 2017028008A1
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Prior art keywords
component
parts
refractive index
silica gel
sio
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PCT/CN2015/086958
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English (en)
Chinese (zh)
Inventor
陈维
庄恒冬
陈田安
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烟台德邦先进硅材料有限公司
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Priority to PCT/CN2015/086958 priority Critical patent/WO2017028008A1/fr
Publication of WO2017028008A1 publication Critical patent/WO2017028008A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives

Definitions

  • the invention relates to a high refractive index LED package silica gel, in particular to a high refractive index, sulfurization resistant, cold and thermal shock resistant LED package silica gel, belonging to the technical field of adhesives.
  • the current packaging materials used in LEDs mainly include epoxy resin and silicone materials.
  • the internal stress of epoxy resin is too large, yellowing, poor resistance to high and low temperature, poor aging resistance, and silicone materials, low internal stress, high and low temperature resistance. Good, not yellow, the overall performance is significantly better than epoxy resin, so it quickly replaces epoxy resin and is widely used in the field of LED packaging.
  • the high refractive index organic silica gel having a refractive index higher than 1.50 has an increasing use rate with higher light extraction efficiency.
  • the refractive index of high-refractive-index LED packaged silica gel in China can reach between 1.50 and 1.55.
  • silicone resin vinyl silicone oil and hydrogen-containing silicone oil
  • the relative content of silicone resin is low and the crosslinking density is low.
  • the bonding effect is not ideal, so the resistance to vulcanization is poor, the bonding interface is easily broken, and the high-silicone resin content and high cross-linking density of the LED package silica gel have improved resistance to vulcanization, but due to its excessive internal stress. It will lead to a decrease in the toughness of the material, and the reaction may occur in the use of high and low temperature thermal shock lamps, cracking of the encapsulating material, and failure of the bonding interface.
  • the present invention provides a high refractive index LED packaged silica gel with the advantages of the prior art, and has the advantages of high hardness, excellent resistance to vulcanization, excellent adhesion, and excellent cold and thermal shock resistance.
  • a high refractive index LED package silica gel comprising A component and B component, the weight ratio of the A component to the B component is 10:1;
  • composition and composition of the raw materials of the component A are as follows:
  • composition and composition of the raw materials of the B component are as follows:
  • the inhibitor is 0.1 to 0.3 parts by weight.
  • the present invention can also be improved as follows.
  • the advantageous effect of the above further embodiment is that, as the matrix resin, it is a silicone resin containing vinyl, which improves the strength and hardness of the product and improves the vulcanization resistance.
  • the adhesive of the present invention contains an epoxy group and an alkoxy group, and its structural formula is as shown above.
  • the addition of the adhesive improves the adhesion of the encapsulating material to the plastic and the metal substrate, and the presence of the ring further improves the vulcanization resistance of the polymer.
  • the platinum-based catalyst is a platinum-methylphenylpolysiloxane complex or a platinum-olefin complex.
  • the platinum-based catalyst is a platinum-methylphenylpolysiloxane complex and has a platinum content of from 3,000 to 10,000 ppm.
  • the molecular formula of the methylphenyl hydrogen-containing silicone resin is: (HMe 2 SiO 1/2 ) 3 (MePhSiO 1/2 ) n (PhSiO 3/2 ) 4 , wherein the Me is a methyl group, Ph It is a phenyl group, 4 ⁇ n ⁇ 6.
  • the beneficial effect of using the above further embodiment is that the methylphenyl hydrogen-containing silicone resin of the present invention as a crosslinking agent is also a hydrogen-containing silicone resin, which not only provides active hydrogen to participate in the crosslinking reaction, but also increases the crosslinking density.
  • the presence of the D chain link (MePhSiO 1/2 ) improves the toughness of the entire system, improves the thermal shock resistance, and has a low viscosity, which reduces the viscosity, strength and toughness of the entire system.
  • the terminal hydrogen-containing diphenylpolysiloxane has the formula: (HMe 2 SiO 1/2 ) 1 (Ph 2 SiO 1/2 ) m , wherein the Me is a methyl group and the Ph is a phenyl group. , 4 ⁇ m ⁇ 6.
  • the beneficial effect of using the above further embodiment is that the hydrogen-containing diphenyl polysiloxane of the present invention acts as a chain extender, which not only provides active hydrogen to participate in the chain extension reaction, but also increases the crosslinking density and improves the toughness of the polymer.
  • the cold and thermal shock resistance is improved, and the viscosity is low, which lowers the viscosity, improves the strength and toughness of the entire system.
  • the inhibitor is selected from the group consisting of ethynylcyclohexanol or 1,1,3-triphenyl-2-propyn-1-ol.
  • the inhibitor is 1,1,3-triphenyl-2-propyn-1-ol, and the structural formula is:
  • the second aspect of the present invention discloses a method for preparing the foregoing high refractive index LED packaged silica gel, comprising the steps of preparing the component A and the step of preparing the component B;
  • the preparation step of the component A is as follows: 80 to 90 parts of methylphenylvinyl silicone resin, 8 to 18 parts of vinyl dimethyl diphenyl polysiloxane, and 0.1 to 0.3 parts of platinum catalyst. 1 to 5 parts of the binder are sequentially added to the mixer, stirred for 3 to 5 hours, and uniformly mixed to obtain the A component;
  • the preparation step of the B component is as follows: 40 to 60 parts of the methylphenyl hydrogen-containing silicone resin, 40 to 60 parts of the hydrogen diphenyl polysiloxane, and 0.1 to 0.3 parts of the inhibitor are sequentially added to the mixer. The mixture was stirred for 3 to 5 hours, and uniformly mixed to obtain a component B.
  • a third aspect of the present invention discloses a method for using the high-refractive-index LED packaged silicon, in which the A component and the B component are uniformly mixed in a weight ratio of 10:1, and vacuum defoamed for 20 to 40 minutes. Dispensing or potting on the package to be packaged, first heating at 100 ⁇ 120 ° C for 0.5 ⁇ 1.5 hours, then heating at 100 ⁇ 200 ° C for 3 ⁇ 5 hours, curing.
  • the high refractive index LED packaged silica gel of the invention is composed of components A and B, and the component A provides high strength resin, vinyl, catalyst and binder in the reaction, and the B component provides high.
  • Strength resin, crosslinking agent, chain extender and inhibitor, high refractive index LED of the present invention Encapsulated silica gel, in addition to vinyl silicone resin, the curing agent is methyl phenyl hydrosilane resin combined with hydrogen diphenyl polysiloxane, the content of silicone resin increases, and at the same time, the silicone resin is added.
  • the combination of silicone resin and suitable silicone, the combination of crosslinking agent and chain extender reduces the internal stress of the cured material, good interfacial adhesion, and improves the thermal shock resistance and resistance of the product. High temperature performance.
  • Methylphenyl vinyl silicone resin (ViMe 2 SiO 1/2 ) (PhSiO 3/2 ) 5 ;
  • Vinyl dimethyl diphenyl polysiloxane (ViMe 2 SiO 1/2 ) 10 ( ViMePh 2 SiO 1/2 ) 10 ;
  • the platinum-based catalyst is a platinum-methylphenyl polysiloxane complex
  • Methylphenyl hydrogen-containing silicone resin (HMe 2 SiO 1/2 ) 3 (MePhSiO 1/2 ) 5 (PhSiO 3/2 ) 4 ;
  • Hydrogenated diphenyl polysiloxane (HMe 2 SiO 1/2 ) 1 (Ph 2 SiO 1/2 ) 4 ;
  • the inhibitor is ethynylcyclohexanol.
  • component A 80 parts of methyl phenyl vinyl silicone resin, 18 parts of vinyl dimethyl diphenyl polysiloxane, 0.1 part of platinum catalyst, and 2.9 parts of binder were added to the mixer for mixing. Stir well for 3h to obtain the A component;
  • component B Weigh 40 parts of dimethyldiphenyl hydrogen-containing silicone resin, 59.8 parts of hydrogen diphenylpolysiloxane, and inhibitor 1,1,3-triphenyl-2-propyne 1-propanol 0.2 parts. Adding to the mixer in turn, mixing for 3 hours and stirring uniformly, that is, the B component is obtained;
  • the A component and the B component are uniformly mixed in a weight ratio of 10:1, vacuum defoamed for 20 minutes, dispensed or potted on the package to be packaged, and first heated at 120 ° C for 1 hour. Then, heat at 150 ° C for 4 hours.
  • Methylphenyl vinyl silicone resin (ViMe 2 SiO 1/2 ) (PhSiO 3/2 ) 3.5 ;
  • Vinyl dimethyl diphenyl polysiloxane (ViMe 2 SiO 1/2 ) 70 ( ViMePh 2 SiO 1/2 ) 70 ;
  • the platinum-based catalyst is a platinum-olefin complex
  • Methylphenyl hydrogen silicone resin (HMe 2 SiO 1/2 ) 3 (MePhSiO 1/2 ) 4 (PhSiO 3/2 ) 4 ;
  • Hydrogenated diphenyl polysiloxane (HMe 2 SiO 1/2 ) 1 (Ph 2 SiO 1/2 ) 5 ;
  • the inhibitor is 1,1,3-triphenyl-2-propyn-1-ol.
  • component A Preparation of component A: Weigh 90 parts of methyl phenyl vinyl silicone resin, 8 parts of vinyl dimethyl diphenyl polysiloxane, 0.3 parts of platinum catalyst, and 1.0 part of binder are sequentially added to the mixer for mixing. Stir well for 5h to obtain the A component;
  • component B 60 parts of dimethyldiphenyl hydrogen-containing silicone resin was weighed, and 39.7 parts of hydrogen diphenylpolysiloxane was contained, and 0.3 parts of inhibitor. Adding to the mixer in turn, mixing for 5 hours and stirring uniformly, that is, the B component is obtained;
  • the A component and the B component are uniformly mixed in a weight ratio of 10:1, vacuum defoamed for 40 minutes, dispensed or potted on the package to be packaged, and first heated at 100 ° C for 1.5 hours. Then, heat at 100 ° C for 5 hours.
  • Methylphenyl vinyl silicone resin (ViMe 2 SiO 1/2 ) 2 (PhSiO 3/2 ) 8 ;
  • Vinyl dimethyl diphenyl polysiloxane (ViMe 2 SiO 1/2 ) 40 ( ViMePh 2 SiO 1/2 ) 40 ;
  • the platinum-based catalyst is a platinum-methylphenyl polysiloxane complex
  • Methylphenyl hydrogen-containing silicone resin (HMe 2 SiO 1/2 ) 3 (MePhSiO 1/2 ) 6 (PhSiO 3/2 ) 4 ;
  • Hydrogenated diphenyl polysiloxane (HMe 2 SiO 1/2 ) 1 (Ph 2 SiO 1/2 ) 6 ;
  • the inhibitor is 1,1,3-triphenyl-2-propyn-1-ol.
  • component A 85 parts of methyl phenyl vinyl silicone resin, 9.8 parts of vinyl dimethyl diphenyl polysiloxane, 0.2 parts of platinum catalyst, and 5 parts of binder were sequentially added to a mixer. Mixing for 4 hours and stirring to obtain the A component;
  • component B 50 parts of dimethyldiphenyl hydrogen-containing silicone resin was weighed, 49.9 parts of hydrogen diphenylpolysiloxane was contained, and 0.1 part of inhibitor was weighed. Adding to the mixer in turn, mixing for 4 hours and stirring evenly, that is, the B component is obtained;
  • the A component and the B component are uniformly mixed in a weight ratio of 10:1, vacuum defoamed for 20 minutes, dispensed or potted on the package to be packaged, and first heated at 120 ° C for 0.5 hour. Then, heat at 200 ° C for 3 hours.
  • Methylphenyl vinyl silicone resin (ViMe 2 SiO 1/2 ) (PhSiO 3/2 ) 5 ;
  • the platinum-based catalyst is a platinum-methylphenyl polysiloxane complex
  • Adhesive (adhesive of the present invention)
  • Methylphenyl hydrogen-containing silicone resin (HMe 2 SiO 1/2 ) 3 (MePhSiO 1/2 ) 5 (PhSiO 3/2 ) 4 ;
  • the inhibitor is ethynylcyclohexanol.
  • component A Weigh 97 parts of methyl phenyl vinyl silicone resin, 0.2 parts of platinum-based catalyst, and 2.8 parts of binder are sequentially added to the mixer, and mixed and stirred to obtain the A component;
  • component B 98.8 parts of dimethyldiphenylhydrogensilicone resin and 0.2 parts of inhibitor were weighed. Adding to the mixer in turn, mixing and stirring evenly, that is, the B component;
  • the A component and the B component are uniformly mixed in a weight ratio of 10:1, vacuum defoamed for 20 minutes, dispensed or potted on the package to be packaged, and first heated at 120 ° C for 1 hour. Then, heat at 150 ° C for 4 hours.
  • Vinyl dimethyl diphenyl polysiloxane (ViMe 2 SiO 1/2 ) 70 ( ViMePh 2 SiO 1/2 ) 70 ;
  • the platinum-based catalyst is a platinum-olefin complex
  • Adhesive (adhesive of the present invention)
  • Hydrogenated diphenyl polysiloxane (HMe 2 SiO 1/2 ) 1 (Ph 2 SiO 1/2 ) 5 ;
  • the inhibitor is 1,1,3-triphenyl-2-propyn-1-ol.
  • component A Preparation of component A: Weigh 97 parts of vinyl dimethyl diphenyl polysiloxane, 0.2 parts of platinum-based catalyst, and 2.8 parts of binder are sequentially added to the mixer, and the mixture is uniformly stirred to obtain the component A;
  • component B 98.8 parts of hydrogen diphenylpolysiloxane and 0.2 parts of inhibitor were weighed. Adding to the mixer in turn, mixing and stirring evenly, that is, the B component;
  • the A component and the B component are uniformly mixed in a weight ratio of 10:1, vacuum defoamed for 20 minutes, dispensed or potted on the package to be packaged, and first heated at 120 ° C for 1 hour. Then, heat at 150 ° C for 4 hours.
  • Methylphenyl vinyl silicone resin (ViMe 2 SiO 1/2 ) 2 (PhSiO 3/2 ) 8 ;
  • Vinyl dimethyl diphenyl polysiloxane (ViMe 2 SiO 1/2 ) 40 ( ViMePh 2 SiO 1/2 ) 10 ;
  • the platinum-based catalyst is a platinum-methylphenyl polysiloxane complex
  • Methylphenyl hydrogen-containing silicone resin (HMe 2 SiO 1/2 ) 3 (MePhSiO 1/2 ) 6 (PhSiO 3/2 ) 4 ;
  • Hydrogenated diphenyl polysiloxane (HMe 2 SiO 1/2 ) 1 (Ph 2 SiO 1/2 ) 6 ;
  • the inhibitor is 1,1,3-triphenyl-2-propyn-1-ol.
  • component A 85 parts of methyl phenyl vinyl silicone resin, 14.8 parts of vinyl dimethyl diphenyl polysiloxane, 0.2 parts of platinum catalyst were added to the mixer in sequence, and the mixture was stirred and evenly obtained.
  • component B 50 parts of dimethyldiphenyl hydrogen-containing silicone resin was weighed, 49.8 parts of hydrogen diphenylpolysiloxane was contained, and 0.2 part of inhibitor was weighed. Adding to the mixer in turn, mixing and stirring evenly, that is, the B component;
  • the A component and the B component are uniformly mixed in a weight ratio of 10:1, vacuum defoamed for 20 minutes, dispensed or potted on the package to be packaged, and first heated at 120 ° C for 1 hour. Then, heat at 150 ° C for 4 hours.
  • Test method First, according to GB2411-1980 (1989) plastic Shore hardness test method to make test pieces; Second, package 2835 bracket, keep the color temperature range between 5500 ⁇ 6000K. Curing conditions: heating at 120 ° C for 1 hour and then heating at 150 ° C for 4 hours.
  • Test 1 According to GB2411-1980 (1989) plastic Shore hardness test method to test the hardness of the test piece; Test 2: use 50% ethanol solution red ink, put into the packaged 2835 stent, placed at 80 ° C for 2 hours, Observe the red ink penetration phenomenon; Test 3: 2g sulfur powder at the bottom of the closed glass bottle, place the 2835 stent in the center of the bottle, test the luminous flux before and after 8 hours at 80 °C, calculate the luminous flux retention rate; Test 4: Pack the cured 2835 stent Into the cold and hot shock box, temperature -40 ⁇ 125 ° C, 3min / 30min, 1 cycle per hour, test 200 cycles after the dead light rate.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

La présente invention appartient au domaine technique des adhésifs, concernant des silicones de conditionnement de DEL, et plus particulièrement une silicone de conditionnement de DEL à indice de réfraction élevé. Une silicone de conditionnement de DEL à indice de réfraction élevé selon la présente invention comprend un constituant A et un constituant B, un rapport en poids entre le constituant A et le constituant B étant de 10:1. Le constituant A comprend les constituants de matières premières suivants en parties en poids : de 80 à 90 parties d'une résine de silicone méthylphénylvinylique, de 8 à 18 parties de polysiloxane de diméthyl-diphényle vinylique, de 0,1 à 0,3 partie d'un catalyseur à base de platine, et de 1 à 5 parties d'un liant. Le constituant B comprend les constituants de matières premières suivants en parties en poids : de 40 à 60 parties d'une résine de silicone méthylphényle hydrogénée, de 40 à 60 parties de polysiloxane de diphényle à terminaison hydrogène, et de 0,1 à 0,3 partie d'un inhibiteur. La silicone de conditionnement de DEL à indice de réfraction élevé de la présente invention présente les effets avantageux d'une dureté élevée, d'une résistance à la vulcanisation, d'un pouvoir d'adhésion remarquable, d'une résistance remarquable au froid, à la chaleur et aux chocs, etc.
PCT/CN2015/086958 2015-08-14 2015-08-14 Silicone de conditionnement de del à indice de réfraction élevé, à grande dureté et résistant à la vulcanisation WO2017028008A1 (fr)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107674207A (zh) * 2017-09-22 2018-02-09 山东盛宇新材料有限公司 一种高折led封装用苯基乙烯基甲基mq硅树脂的制备方法
CN107955582A (zh) * 2017-12-26 2018-04-24 烟台德邦先进硅材料有限公司 一种光伏太阳能用高粘接高韧性有机硅导电胶
CN109054731A (zh) * 2018-08-03 2018-12-21 广东新翔星科技股份有限公司 一种粘接性高折射率加成型有机硅封装胶及其制备方法
CN109370235A (zh) * 2018-11-02 2019-02-22 绵阳惠利电子材料有限公司 一种双组份加成型有机硅凝胶及其制备方法
CN111748315A (zh) * 2020-07-10 2020-10-09 浙江鑫钰新材料有限公司 一种高粘接耐水煮有机硅绝缘密封胶及其制备方法
CN112251190A (zh) * 2020-09-10 2021-01-22 烟台德邦科技有限公司 一种led封装胶组合物
CN112552691A (zh) * 2020-12-16 2021-03-26 上海阿莱德实业股份有限公司 一种单组分固化型导热凝胶组合物及其应用
CN112680182A (zh) * 2020-12-29 2021-04-20 睿合科技有限公司 一种改善贴合一体黑的硅胶ocr制备方法
CN113265222A (zh) * 2021-05-27 2021-08-17 河南守真电子科技有限公司 高分子防潮防火封堵组合材料及其使用方法
CN113480566A (zh) * 2021-07-22 2021-10-08 广州星光有机硅科技有限公司 一种含二苯基甲烷的有机硅单体及其制备的超高折射率半导体led封装材料
CN114686160A (zh) * 2022-04-28 2022-07-01 成都硅宝科技股份有限公司 一种光伏叠瓦组件用无溶剂高韧性有机硅导电胶及其制备方法
CN115466487A (zh) * 2022-10-27 2022-12-13 道生天合材料科技(上海)股份有限公司 环氧树脂灌封胶及其制备方法和应用

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102070996A (zh) * 2010-12-14 2011-05-25 东莞市永固绝缘材料有限公司 一种Led大功率封装硅胶
CN103013431A (zh) * 2012-12-03 2013-04-03 烟台德邦先进硅材料有限公司 一种高折射率的led封装硅胶
US20130161686A1 (en) * 2010-06-29 2013-06-27 Dow Corning Toray Co., Ltd. Curable Organopolysiloxane Composition And Optical Semiconductor Device
CN103665879A (zh) * 2013-11-04 2014-03-26 北京石油化工学院 一种大功率led封装用有机硅凝胶组合物
CN104449551A (zh) * 2014-11-18 2015-03-25 烟台德邦先进硅材料有限公司 一种高折耐黄变led封装硅胶

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130161686A1 (en) * 2010-06-29 2013-06-27 Dow Corning Toray Co., Ltd. Curable Organopolysiloxane Composition And Optical Semiconductor Device
CN102070996A (zh) * 2010-12-14 2011-05-25 东莞市永固绝缘材料有限公司 一种Led大功率封装硅胶
CN103013431A (zh) * 2012-12-03 2013-04-03 烟台德邦先进硅材料有限公司 一种高折射率的led封装硅胶
CN103665879A (zh) * 2013-11-04 2014-03-26 北京石油化工学院 一种大功率led封装用有机硅凝胶组合物
CN104449551A (zh) * 2014-11-18 2015-03-25 烟台德邦先进硅材料有限公司 一种高折耐黄变led封装硅胶

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CN107674207B (zh) * 2017-09-22 2021-09-03 山东盛宇新材料有限公司 一种高折led封装用苯基乙烯基甲基mq硅树脂的制备方法
CN107674207A (zh) * 2017-09-22 2018-02-09 山东盛宇新材料有限公司 一种高折led封装用苯基乙烯基甲基mq硅树脂的制备方法
CN107955582A (zh) * 2017-12-26 2018-04-24 烟台德邦先进硅材料有限公司 一种光伏太阳能用高粘接高韧性有机硅导电胶
CN109054731A (zh) * 2018-08-03 2018-12-21 广东新翔星科技股份有限公司 一种粘接性高折射率加成型有机硅封装胶及其制备方法
CN109370235A (zh) * 2018-11-02 2019-02-22 绵阳惠利电子材料有限公司 一种双组份加成型有机硅凝胶及其制备方法
CN109370235B (zh) * 2018-11-02 2021-01-26 绵阳惠利电子材料有限公司 一种双组份加成型有机硅凝胶及其制备方法
CN111748315A (zh) * 2020-07-10 2020-10-09 浙江鑫钰新材料有限公司 一种高粘接耐水煮有机硅绝缘密封胶及其制备方法
CN112251190A (zh) * 2020-09-10 2021-01-22 烟台德邦科技有限公司 一种led封装胶组合物
CN112251190B (zh) * 2020-09-10 2022-08-19 烟台德邦科技股份有限公司 一种led封装胶组合物
CN112552691A (zh) * 2020-12-16 2021-03-26 上海阿莱德实业股份有限公司 一种单组分固化型导热凝胶组合物及其应用
CN112680182A (zh) * 2020-12-29 2021-04-20 睿合科技有限公司 一种改善贴合一体黑的硅胶ocr制备方法
CN113265222A (zh) * 2021-05-27 2021-08-17 河南守真电子科技有限公司 高分子防潮防火封堵组合材料及其使用方法
CN113480566A (zh) * 2021-07-22 2021-10-08 广州星光有机硅科技有限公司 一种含二苯基甲烷的有机硅单体及其制备的超高折射率半导体led封装材料
CN114686160A (zh) * 2022-04-28 2022-07-01 成都硅宝科技股份有限公司 一种光伏叠瓦组件用无溶剂高韧性有机硅导电胶及其制备方法
CN114686160B (zh) * 2022-04-28 2023-08-15 成都硅宝科技股份有限公司 一种光伏叠瓦组件用无溶剂高韧性有机硅导电胶及其制备方法
CN115466487A (zh) * 2022-10-27 2022-12-13 道生天合材料科技(上海)股份有限公司 环氧树脂灌封胶及其制备方法和应用

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