WO2016204306A1 - パワー半導体モジュールの端子接続構造 - Google Patents
パワー半導体モジュールの端子接続構造 Download PDFInfo
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- WO2016204306A1 WO2016204306A1 PCT/JP2016/072164 JP2016072164W WO2016204306A1 WO 2016204306 A1 WO2016204306 A1 WO 2016204306A1 JP 2016072164 W JP2016072164 W JP 2016072164W WO 2016204306 A1 WO2016204306 A1 WO 2016204306A1
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- power semiconductor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/03—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the relationship between the connecting locations
- H01R11/05—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the relationship between the connecting locations the connecting locations having different types of direct connections
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
- H01R13/405—Securing in non-demountable manner, e.g. moulding, riveting
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M3/00—Conversion of dc power input into dc power output
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/42—Conversion of dc power input into ac power output without possibility of reversal
- H02M7/44—Conversion of dc power input into ac power output without possibility of reversal by static converters
- H02M7/48—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
- H05K7/1432—Housings specially adapted for power drive units or power converters
- H05K7/14329—Housings specially adapted for power drive units or power converters specially adapted for the configuration of power bus bars
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/115—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/28—Clamped connections, spring connections
- H01R4/30—Clamped connections, spring connections utilising a screw or nut clamping member
- H01R4/34—Conductive members located under head of screw
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T10/00—Road transport of goods or passengers
- Y02T10/60—Other road transportation technologies with climate change mitigation effect
- Y02T10/62—Hybrid vehicles
Definitions
- the present invention relates to a terminal connection structure of a power semiconductor module capable of suppressing a decrease in reliability of connection through a connecting member between a plurality of pin output terminals for power of the power semiconductor module and a connection terminal of a power cable.
- a hybrid work vehicle in which an engine and a rotating electrical machine are mounted as drive sources is provided with a power storage device such as a battery that stores power generated by the rotating electrical machine while supplying power to the rotating electrical machine.
- the hybrid work vehicle having such a configuration has an inverter that drives the rotating electrical machine.
- the inverter performs power conversion using a power semiconductor module.
- Patent Document 1 discloses a laminated unit in which a plurality of power modules including switching elements for power conversion, a plurality of refrigerant flow paths through which a refrigerant for cooling the power module flows, and a case for housing the laminated unit
- a resin fixing member fixed to the outer surface of the case, a control board fixed to the fixing member and attached to the case via the fixing member, and connected to the plurality of power modules;
- the power conversion device is a value closer to the linear expansion coefficient of the control board than the rate, and the first fixing part and the second fixing part are arranged at different positions in the fixing member. It has been mounting. According to this, the linear expansion coefficient of the fixing member is closer to the linear expansion coefficient of the control board than the linear expansion coefficient of the case, and the first fixing portion and the second fixing portion are located at different positions in the fixing member. Since it is arrange
- connection terminal of the power cable may be connected to the terminal block, but the terminal of the power semiconductor module is a pin output terminal It is necessary to provide a separate terminal block.
- the terminal block provided separately has a pin connection part for connecting the pin output terminal and a cable connection part for connecting the connection terminal of the power cable, and a conductive pattern between the pin connection part and the cable connection part. It is necessary to provide a connection member such as a bus bar, or a connection board on which is formed.
- a hybrid work vehicle having a structure in which the power pin output terminal of the power semiconductor module and the connection terminal of the power cable are connected using a connection board, a bus bar, etc.
- the temperature fluctuation of the power semiconductor module due to repeated work under high load In addition, a load that causes the pin output terminal portion of the power semiconductor module and the connection terminal portion of the power cable to be relatively displaced due to repeated vibration shock is applied, so stress is applied to the pin connection portion and the cable connection portion, and the power semiconductor The connection reliability between the module and the power cable is reduced.
- the present invention has been made in view of the above, and suppresses a decrease in reliability of connection between a plurality of pin output terminals for power of a power semiconductor module and a connection terminal of a power cable via a connection member.
- An object of the present invention is to provide a terminal connection structure of a power semiconductor module capable of achieving the above.
- the terminal connection structure of the power semiconductor module according to the present invention has a plurality of pin output terminals erected on the side end portion of the upper surface and is mounted on the housing.
- a conductive bush provided with a flange portion on a substrate body in which a power semiconductor module, a resin bracket disposed on a side of the power semiconductor module and attached to the housing, and a terminal hole through which the pin output terminal is inserted are formed
- the pin output terminal is inserted into the terminal hole and conductively connected to the terminal hole, and the connection terminal of the power cable is
- the serial bolt is conductively connected to the conductive bush by screwing between the resin bracket
- the pin output terminal is characterized by connecting a conductive connection terminal of the power cable.
- the terminal connection structure of the power semiconductor module according to the present invention is characterized in that, in the above invention, the resin bracket is provided with an insert nut for the bolt.
- the difference between the linear expansion coefficient of the casing of the power semiconductor module and the linear expansion coefficient of the resin bracket is within a predetermined range. It is characterized by.
- the pin output terminal is soldered in a state of being inserted into the terminal hole and is conductively connected to the terminal hole.
- the pin output terminal is connected to the terminal hole in a state where the conductive bush is in contact with the upper surface of the resin bracket. It is characterized by that.
- terminal connection structure of the power semiconductor module according to the present invention is the above-described invention, wherein the conductive bush is in contact with the upper surface of the resin bracket when the bolt is not sandwiched between the power cable connection terminals. Is formed by temporary fixing to be fixed to the resin bracket.
- the terminal connection structure of the power semiconductor module according to the present invention is removed every time the bolt that has been temporarily fixed is removed in the above-described invention, when the main fixing is performed with the connection terminal of the power cable interposed therebetween. The point is permanently fixed with the bolt.
- the present invention it is possible to suppress a reduction in the reliability of the connection between the plurality of pin output terminals for power of the power semiconductor module and the connection terminals of the power cable via the connection member.
- FIG. 1 is a diagram showing an arrangement configuration in an inverter including a terminal connection structure of a power semiconductor module according to an embodiment of the present invention.
- FIG. 2 is an enlarged view of a portion A in FIG. 3 is a cross-sectional view taken along line BB in FIG.
- FIG. 4 is an explanatory diagram showing the stress applied to the solder portion due to the deformation of the connection board with the bush due to the difference in the linear expansion coefficient between the resin bracket and the casing of the power semiconductor module.
- FIG. 5 is a diagram illustrating a state in which the terminal block is preliminarily fixed and assembled in advance.
- FIG. 6 is a diagram illustrating a state in which the power semiconductor module is attached to the inverter housing.
- FIG. 7 is a diagram showing a state where the temporarily fixed terminal block is attached to the inverter housing.
- FIG. 8 is a diagram showing a state in which the pin output terminals are soldered and the control board is attached.
- FIG. 9 is a diagram showing a fixed state in which the connection terminal of the capacitor is connected to the terminal block.
- FIG. 10 is a diagram showing the fixed state in which the connection terminal of the power cable is connected to the terminal block.
- FIG. 11 is a flowchart showing a terminal connection procedure of the power semiconductor module according to the present embodiment.
- 12 is a cross-sectional view taken along the line CC of FIG. 2 showing the terminal block when not temporarily fixed with a fixing bolt.
- FIG. 13 is a cross-sectional view taken along the line BB of FIG.
- FIG. 14 is a cross-sectional view taken along the line CC of FIG. 2 showing the terminal block when temporarily fixed with fixing bolts.
- 15 shows the terminal block when temporarily fixed with fixing bolts and the state of the terminal block when the terminal of the power cable is permanently fixed with fixing bolts with this terminal block. It is sectional drawing.
- FIG. 1 is a diagram showing an arrangement configuration in an inverter 1 including a terminal connection structure of a power semiconductor module 10 according to an embodiment of the present invention.
- the inverter 1 includes three power semiconductor modules 10 having pin output terminals 2 and a terminal block 20a integrally formed in an inverter housing 1a (the housing of the present invention).
- the power semiconductor module 20 is arranged in parallel.
- a wiring space 1b in which a power cable and a smoothing capacitor are arranged is formed in the inverter casing 1a.
- the inverter 1 also has a cooling mechanism (not shown).
- the power semiconductor modules 10 and 20 are each fixed to the inverter casing 1a by bolting at four corners.
- a portion of the casing in which the power semiconductor modules 10 and 20 are arranged in the inverter casing 1a is a cooling unit that is cooled by the above-described cooling mechanism.
- the pin output terminal 2 is arranged on the side end portion of the upper surface of the power semiconductor module 10 and is connected to a capacitor with a positive DC terminal 2p, a negative terminal 2n, a three-phase output U-phase terminal 2u, a V-phase terminal 2v, and W. It has a phase terminal 2w.
- Each pin output terminal 2 has three terminals and performs current distribution.
- the terminal blocks 3 are provided to connect a power cable.
- the terminal blocks 3a and 3b connect a U-phase terminal 2u, a V-phase terminal 2v, and a W-phase terminal 2w, respectively.
- the terminal block 3c connects two plus terminals 2p and two minus terminals 2n.
- Each terminal block 3 (3a, 3b, 3c) is configured such that a connection board 5 (5a, 5b, 5c) with a bush is disposed on a resin bracket 4 (4a, 4b, 4c).
- a power cable to be connected is omitted.
- the terminal block 3 is disposed on the side of the power semiconductor module 10. That is, in the drawing, the power semiconductor modules are arranged on the right side, the left side, and the upper side of the two power semiconductor modules arranged in parallel.
- FIG. 2 is an enlarged view of part A in FIG.
- FIG. 3 is a sectional view taken along line BB of FIG.
- the terminal block 3 is disposed on the side of the power semiconductor module 10.
- the power semiconductor module 10 is fixed to the inverter housing 1a by the bolts 42 at the four corners.
- the terminal block 3 is fixed to the inverter housing 1a by bolts 40 at both ends.
- a control board 11 is attached to the upper surface of the power semiconductor module 10.
- the connection board 5 with the bush is fixed to the resin bracket 4 by bolts 41 at both ends.
- connection board 5 with a bush is formed of a conductive bush 15 that penetrates a fixing bolt 18 screwed into an insert nut 13 in a board body 14 in which a terminal hole 16 through which the pin output terminal 2 of the power semiconductor module 10 is inserted is formed. Is attached.
- the conductive bush 15 is a bush with a flange, and is attached so as to penetrate the substrate body 14 from the upper surface side of the substrate body 14 and slightly protrude from the lower surface of the substrate body 14.
- the substrate body 14 is formed with a conductive pattern PT that electrically connects the terminal hole 16 and the conductive bush 15.
- the connection substrate 5 with the bush is disposed on the upper side of the side end portion of the power semiconductor module 10 where the resin bracket 4 and the pin output terminal 2 are disposed.
- connection terminal 31 of the power cable 30 is disposed on the upper surface of the conductive bush 15, and the connection terminal 31 is screwed into the insert nut 13 of the bolt 18 while being sandwiched between the conductive bush 15 and the bolt 18.
- the conductive bush 15 is connected.
- the bolt 18 is a fixing member for connecting the connection terminal 31 of the power cable 30 to the conductive bush 15.
- a material is used in which the difference in linear expansion coefficient between the housing of the power semiconductor module 10 and the resin bracket 4 is within a predetermined range.
- the material of the resin bracket body 12 is selected so that the difference in linear expansion coefficient with respect to the material of the housing of the power semiconductor module 10 is within a predetermined range.
- the linear expansion coefficient of the material of the resin bracket main body 12 is selected to be not more than twice the linear expansion coefficient of the material of the casing of the power semiconductor module 10. The closer the linear expansion coefficient of the resin bracket body 12 and the linear expansion coefficient of the housing of the power semiconductor module 10 are, the better.
- connection board 5 with the bush is attached to the resin bracket 4 with the bolt 41, and the lower surface of the conductive bush 15 and the upper surface of the insert nut 13 are brought into contact with the fixing bolt 18.
- the terminal block 3 is assembled in advance by temporarily fixing to (step S101).
- the power semiconductor module 10 is attached with the bolts 42 in the inverter housing 1a (step S102).
- the assembly of the terminal block 3 in step S101 and the attachment of the power semiconductor module 10 in step S102 may be performed in the reverse order or in parallel.
- the three terminal blocks 3 assembled in advance are attached to the inverter housing 1a with the bolts 40 (step S103).
- the pin output terminal 2 is inserted into the terminal hole 16 of the connection board 5 with the bush.
- the terminal hole 16 is provided at a position where the pin output terminal 2 is inserted when the terminal block 3 is installed.
- the pin output terminal 2 inserted through the terminal hole 16 in the region E is soldered to form a solder portion 17, and the pin output terminal 2 is connected to the connection substrate 5 with the bush.
- the control board 11 for controlling the power semiconductor module 10 is attached to the upper surface of the power semiconductor module (step S105).
- step S106 the fixing bolt 18 temporarily fixed by the terminal block 3c on the DC input side is removed (step S106), and the connection terminal 51 connected to the capacitor 50 on the conductive bush 15 is removed. And the removed fixing bolt 18 is screwed into the insert nut 13 again to fix the connection terminal 51 (step S107).
- the fixing bolt 18 temporarily fixed by the terminal blocks 3a and 3b on the three-phase output side is removed (step S108), and the connection terminal of the power cable 30 is placed on the conductive bush 15. 31 is disposed, and the removed fixing bolt 18 is screwed into the insert nut 13 again to fix the connection terminal 31 (step S109).
- FIG. 12 is a cross-sectional view taken along the line CC of FIG. 2 showing the terminal block 3 when not temporarily fixed with the fixing bolt 18.
- 13 shows a state of the terminal block 3 when not temporarily fixed by the fixing bolt 18 and the terminal block 3 when the connection terminal 31 of the power cable 30 is connected by this terminal block 3. It is B line sectional drawing.
- the conductive bush 15 and the insert nut 13 can be changed depending on manufacturing errors and component tolerances between the connecting board 5 with the bush and the resin bracket 4. There may be a gap d between the two.
- soldering is performed in a state in which the gap d is generated, and the connection terminal 31 of the power cable 30 is connected with the fixing bolt 18 in the state in which the gap d is generated as illustrated in FIG.
- the substrate body 14 is lowered and deformed, and stress is applied to the soldered solder portion 17, and the reliability of the connection of the solder portion 17 is lowered.
- FIG. 14 is a cross-sectional view taken along the line CC of FIG. 2 showing the terminal block 3 when temporarily fixed with the fixing bolt 18.
- FIG. 15 shows the state of the terminal block 3 when temporarily fixed with the fixing bolt 18 and the terminal block 3 when the connection terminal 31 of the power cable 30 is permanently fixed with the fixing bolt 18.
- FIG. 3 is a sectional view taken along line BB in FIG.
- the conductive bush 15 of the connection board 5 with the bush is temporarily fixed by the fixing bolt 18, so that the conductive bush 15 and the insert nut are fixed. No gap is formed between the two and the contact state. That is, even when the gap d shown in FIG. 12 occurs between the conductive bush 15 and the insert nut 13 due to component tolerances and manufacturing errors, the substrate body 14 is deformed by temporary fixing as shown in FIG. Therefore, as shown in FIG. 15A, the conductive bush 15 and the insert nut 13 are in contact with each other. In this temporarily fixed state, the pin output terminal 2 is soldered, and the solder portion 17 is formed. After that, as shown in FIG.
- the fixing bolt 18 is used for temporary fixing.
- the fixing bolt 18 is not limited thereto, and temporary fixing may be performed using a bolt dedicated for temporary fixing.
- the pin output terminal 2 may be soldered in this state. You may solder the pin output terminal 2 in a state. In short, the pin output terminal 2 may be soldered in a state where the contact state between the conductive bush 15 and the insert nut 13 is formed.
- the pins of the power semiconductor module 10 include power pins and control pins, and the pin output terminal 2 connected to the terminal block 3 of the present embodiment is a power pin.
- the control pins are connected to the control board 11 shown in FIG.
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inverter Devices (AREA)
- Connector Housings Or Holding Contact Members (AREA)
- Connections By Means Of Piercing Elements, Nuts, Or Screws (AREA)
Abstract
Description
図4に示すように、常温時、例えば25℃のときにピン出力端子2とブッシュ付き接続基板5とをはんだ付けした場合(図4(a)参照)、ピン出力端子2とブッシュ付き接続基板5とは直角に交わっているが、高温時、例えば125℃になると(図4(b)参照)、樹脂ブラケット4の線膨張率がパワー半導体モジュール10の筐体(樹脂ケース)の線膨張率に比して大きいため、ブッシュ付き接続基板5の導電性ブッシュ15側が相対的に浮き上がり、ブッシュ付き接続基板5が変形する。この変形によってピン出力端子2のはんだ部17に応力がかかり、はんだ部17における接続の信頼性が低下する。特に、ハイブリッド作業車両の場合には、同じ様な作業が繰り返し行われるため、温度変動が繰り返される。この温度変動に伴う応力変動は、はんだ部17における接続の信頼性を低下させてしまう。
つぎに、図5~図10及び図11に示したフローチャートを参照して、端子台3を介したピン出力端子2と電力ケーブル30の接続端子31との接続処理について説明する。まず、図5に示すように、ボルト41で樹脂ブラケット4にブッシュ付き接続基板5を取り付け、さらに固定用のボルト18で導電性ブッシュ15の下面とインサートナット13の上面とが接触状態となるように仮固定して予め端子台3を組み立てておく(ステップS101)。
1a インバータ筐体(筐体)
1b 配線空間
2 ピン出力端子
2p プラス端子
2n マイナス端子
2u U相端子
2v V相端子
2w W相端子
3,3a,3b,3c 端子台
4 樹脂ブラケット
5 ブッシュ付き接続基板
10,20 パワー半導体モジュール
11 制御基板
12 樹脂ブラケット本体
13 インサートナット
14 基板本体
15 導電性ブッシュ
16 端子孔
17 はんだ部
18 固定用のボルト
20a 端子台
30 電力ケーブル
31、51 接続端子
40,41,42 ボルト
50 コンデンサ
d 隙間
E 領域
PT 導電性パターン
Claims (7)
- 上面の側端部に立設した複数のピン出力端子を有するとともに筐体に装着されたパワー半導体モジュールと、
前記パワー半導体モジュールの側方に配置され前記筐体に装着された樹脂ブラケットと、
前記ピン出力端子を挿通する端子孔が形成された基板本体にフランジ部を備えた導電性ブッシュが配置され、前記端子孔と前記導電性ブッシュとが導電接続されたブッシュ付き接続基板と、
電力ケーブルの接続端子及び前記ブッシュ付き接続基板の前記導電性ブッシュを貫通して前記樹脂ブラケットに螺合するボルトと、
を備え、前記ピン出力端子は前記端子孔に挿通して前記端子孔に導電接続され、前記電力ケーブルの接続端子は前記ボルトと前記樹脂ブラケットとの螺合によって前記導電性ブッシュに導電接続され、前記ピン出力端子が前記電力ケーブルの接続端子に導電接続することを特徴とするパワー半導体モジュールの端子接続構造。 - 前記樹脂ブラケットは、前記ボルトに対するインサートナットが設けられることを特徴とする請求項1に記載のパワー半導体モジュールの端子接続構造。
- 前記パワー半導体モジュールの筐体の線膨張率と前記樹脂ブラケットとの線膨張率との差は所定範囲内であることを特徴とする請求項1または2に記載のパワー半導体モジュールの端子接続構造。
- 前記ピン出力端子は、前記端子孔に挿通された状態ではんだ付けされて前記端子孔に導通接続されることを特徴とする請求項1~3のいずれか一つに記載のパワー半導体モジュールの端子接続構造。
- 前記ピン出力端子の前記端子孔への接続は、前記導電性ブッシュを前記樹脂ブラケットの上面に接触させた状態で行うことを特徴とする請求項1~4のいずれか一つに記載のパワー半導体モジュールの端子接続構造。
- 前記導電性ブッシュを前記樹脂ブラケットの上面に接触させた状態は、前記電力ケーブルの接続端子を挟まずに、前記ボルトを前記樹脂ブラケットに固定する仮固定によって形成することを特徴とする請求項5に記載のパワー半導体モジュールの端子接続構造。
- 前記電力ケーブルの接続端子を挟んで固定する本固定を行う場合、仮固定した前記ボルトの取り外し毎に、取り外された箇所を前記ボルトで本固定することを特徴とする請求項6に記載のパワー半導体モジュールの端子接続構造。
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PCT/JP2016/072164 WO2016204306A1 (ja) | 2016-07-28 | 2016-07-28 | パワー半導体モジュールの端子接続構造 |
DE112016000036.7T DE112016000036T5 (de) | 2016-07-28 | 2016-07-28 | Anschlussverbindungsstruktur eines Leistungshalbleitermoduls |
CN201680001006.8A CN106463876A (zh) | 2016-07-28 | 2016-07-28 | 功率半导体模块的端子连接结构 |
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Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5482353U (ja) * | 1977-11-24 | 1979-06-11 | ||
JPS60121665U (ja) * | 1984-01-27 | 1985-08-16 | 三菱電機株式会社 | 印刷配線板 |
JPH0621161U (ja) * | 1992-08-25 | 1994-03-18 | 光洋電子工業株式会社 | プリント基板と端子盤との接続構造 |
JP2005183644A (ja) * | 2003-12-19 | 2005-07-07 | Hitachi Ltd | 電気回路モジュール |
JP2009289734A (ja) * | 2008-04-30 | 2009-12-10 | Daikin Ind Ltd | 電気回路の接続部材 |
JP2011198817A (ja) * | 2010-03-17 | 2011-10-06 | Keihin Corp | 半導体装置 |
JP2012227038A (ja) * | 2011-04-21 | 2012-11-15 | Mitsubishi Electric Corp | バスバー端子台構造 |
JP2013235757A (ja) * | 2012-05-10 | 2013-11-21 | Mitsubishi Electric Corp | 基板装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4423462B2 (ja) * | 2003-12-22 | 2010-03-03 | 富士電機システムズ株式会社 | 半導体パワーモジュール |
JP5002568B2 (ja) * | 2008-10-29 | 2012-08-15 | 日立オートモティブシステムズ株式会社 | 電力変換装置 |
JP2012005301A (ja) * | 2010-06-18 | 2012-01-05 | Fuji Electric Co Ltd | パワー半導体モジュール |
JP2014078564A (ja) * | 2012-10-09 | 2014-05-01 | Toyota Industries Corp | 電極の接続構造 |
CN103779348A (zh) * | 2014-01-24 | 2014-05-07 | 嘉兴斯达微电子有限公司 | 一种平板式功率半导体模块 |
-
2016
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Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5482353U (ja) * | 1977-11-24 | 1979-06-11 | ||
JPS60121665U (ja) * | 1984-01-27 | 1985-08-16 | 三菱電機株式会社 | 印刷配線板 |
JPH0621161U (ja) * | 1992-08-25 | 1994-03-18 | 光洋電子工業株式会社 | プリント基板と端子盤との接続構造 |
JP2005183644A (ja) * | 2003-12-19 | 2005-07-07 | Hitachi Ltd | 電気回路モジュール |
JP2009289734A (ja) * | 2008-04-30 | 2009-12-10 | Daikin Ind Ltd | 電気回路の接続部材 |
JP2011198817A (ja) * | 2010-03-17 | 2011-10-06 | Keihin Corp | 半導体装置 |
JP2012227038A (ja) * | 2011-04-21 | 2012-11-15 | Mitsubishi Electric Corp | バスバー端子台構造 |
JP2013235757A (ja) * | 2012-05-10 | 2013-11-21 | Mitsubishi Electric Corp | 基板装置 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021019682A1 (ja) * | 2019-07-30 | 2021-02-04 | 東芝三菱電機産業システム株式会社 | 素子モジュール |
JPWO2021019682A1 (ja) * | 2019-07-30 | 2021-09-30 | 東芝三菱電機産業システム株式会社 | 素子モジュール |
JP7019092B2 (ja) | 2019-07-30 | 2022-02-17 | 東芝三菱電機産業システム株式会社 | 素子モジュール |
US11908773B2 (en) | 2019-07-30 | 2024-02-20 | Toshiba Mitsubishi-Electric Industrial Systems Corporation | Element module |
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