WO2016187884A1 - 电子元件的冲压装置 - Google Patents

电子元件的冲压装置 Download PDF

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Publication number
WO2016187884A1
WO2016187884A1 PCT/CN2015/080120 CN2015080120W WO2016187884A1 WO 2016187884 A1 WO2016187884 A1 WO 2016187884A1 CN 2015080120 W CN2015080120 W CN 2015080120W WO 2016187884 A1 WO2016187884 A1 WO 2016187884A1
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WIPO (PCT)
Prior art keywords
elastic member
accommodating cavity
electronic component
balancing valve
electrically connected
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PCT/CN2015/080120
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English (en)
French (fr)
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项磊
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华为技术有限公司
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Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to PCT/CN2015/080120 priority Critical patent/WO2016187884A1/zh
Priority to CN201580031211.4A priority patent/CN106460899B/zh
Publication of WO2016187884A1 publication Critical patent/WO2016187884A1/zh

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
    • F16B11/00—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding
    • F16B11/006—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding by gluing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure

Definitions

  • the present invention relates to the field of electronic technologies, and in particular, to a stamping device for an electronic component.
  • the component to be attached is usually placed in a press-fit jig, the press-fit jig is mounted on the press-fit jig, and the component is pressed by a press-fit jig.
  • the case where the clamp clamps the crushed component may occur.
  • the bonding surface of the pressing jig is generally flat.
  • the TP press is very demanding on the flatness of the fixture, and the quality of the fixture processing is strict.
  • multi-cylinder press-fit clamps or multi-faceted slides are required, and the fixture design is complicated.
  • Embodiments of the present invention provide a stamping apparatus for an electronic component, which improves the ease of use of a press-fit jig by adding an elastic member in a press-fit jig and filling a gas or other non-fixed matter to press the component.
  • the method has the advantages of simple operation, convenient implementation, high pressing efficiency and good pressing effect.
  • the present invention provides a stamping apparatus for an electronic component, the apparatus comprising:
  • the upper mold includes: a first elastic member and an upper sealing carrier;
  • the first inlet port is electrically connected to the first accommodating cavity, and the first accommodating cavity is when the fixed form substance enters the first accommodating cavity through the first inlet port
  • the pressure increases, the first elastic member expands in the direction of the lower mold
  • a first balancing valve is electrically connected to the first accommodating cavity, and when the pressure of the first accommodating cavity needs to be changed, the non-fixed form substance passes through the first balancing valve from the first accommodating Discharged within the chamber;
  • the lower mold abuts against the upper mold to form a closed space
  • the lower mold includes: a boss, a second elastic member, and a lower sealing carrier;
  • the boss is configured to rest the electronic component to be processed
  • the second elastic member forms a second receiving cavity with the lower sealing carrier
  • a second inlet opening is electrically connected to the second accommodating cavity, and the second accommodating material enters the second accommodating cavity through the second inlet port when the non-fixed form substance enters the second accommodating cavity
  • the pressure of the cavity is increased, the second elastic member is expanded toward the upper mold such that the second elastic member is fitted to the electronic component to be processed; the first elastic member is directed to the lower mold
  • the direction of expansion also causes the first elastic member to conform to the electronic component to be processed;
  • a second balancing valve is electrically connected to the second accommodating cavity, and when the pressure of the second accommodating cavity needs to be changed, the non-fixed form substance passes through the second balancing valve from the second accommodating valve Discharge in the chamber.
  • the apparatus further includes a third balancing valve, the first balancing member, the first elastic member, the second elastic member, and the upper mold And a third accommodating cavity formed tightly between the two side walls of the lower mold is electrically connected, and when the upper mold and the lower mold need to be opened, the external gas enters the third balancing valve Said in the third housing cavity.
  • the apparatus further includes a one-way exhaust valve, the one-way exhaust valve
  • the first elastic member, the second elastic member, and the third accommodating cavity formed in a sealed manner between the two side walls of the upper mold and the lower mold are electrically connected, and the lower mold and the upper mold are abutted during operation.
  • the gas is discharged through the one-way exhaust valve.
  • the first elastic component is an elastic rubber film.
  • the second elastic member is an elastic rubber film.
  • the plurality of electronic components to be processed are disposed in a plurality of horizontally side by side.
  • the partially inaccessible portion of the electronic component to be processed is shielded by using a rigid fixture.
  • the embodiment of the invention provides a stamping device for an electronic component.
  • an elastic component in the pressing fixture By adding an elastic component in the pressing fixture, filling the gas or other non-fixed matter to press the component, the pressing effect is good, the realization is simple, the operation is convenient, and There is no need to make a press fixture according to each component.
  • the fixture has a high degree of generality and can be easily pressed on the side. It does not need to adopt a slider or a multi-cylinder method, which saves cost and can simultaneously press multiple components and increase the pressure. Efficiency.
  • FIG. 1 is a schematic structural view of a stamping device for an electronic component according to Embodiment 1 of the present invention
  • FIG. 2 is a schematic structural view of a non-touchable partial area on a touch screen module using a rigid jig
  • FIG. 3 is a schematic structural view of a non-touchable partial area on a flexible printed circuit using a rigid jig
  • FIG. 4 is a schematic view showing the working state of a stamping device for an electronic component according to Embodiment 1 of the present invention.
  • the stamping device for the electronic component provided by the invention adopts an elastic component, so that the elastic component is attached to the electronic component when filled with gas, water or other non-fixed matter, so that the pressure is uniformly applied to the surface of the electronic component, so that the paste is more For stability and reliability.
  • Electronic components use pressure-sensitive double-sided tape for connecting or fixing scenes.
  • FIG. 1 is a schematic structural view of a stamping device for an electronic component according to a first embodiment of the present invention. As shown in FIG. 1, the apparatus includes an upper mold 1 and a lower mold 2.
  • the upper mold 1 includes: a first elastic member 5 and an upper sealing carrier 6;
  • the first elastic member 5 forms a first receiving cavity with the upper sealing carrier 6;
  • the first inlet port 3 is electrically connected to the first accommodating cavity, and when the fixed form substance enters the first accommodating cavity through the first inlet port 3, the pressure of the first accommodating cavity Increasing, the first elastic member 5 expands in the direction of the lower mold 2;
  • the first balancing valve 11 is electrically connected to the first accommodating cavity. When the pressure of the first accommodating cavity needs to be changed, no fixed-form substance is discharged from the first accommodating cavity through the first balancing valve 11;
  • the lower mold 2 and the upper mold 1 abut against the top to form a closed space
  • the lower mold 2 includes: a boss 10, a second elastic member 7 and a lower sealing carrier 8;
  • the second elastic member 7 forms a second receiving cavity with the lower sealing carrier 8;
  • the second inlet port 4 is electrically connected to the second accommodating cavity.
  • the pressure of the second accommodating cavity increases, and the second After the elastic member 7 is expanded in the direction of the upper mold 1, the second elastic member is brought into conformity with the electronic component 9 to be processed; at the same time, The first elastic member 5 expands in the direction of the lower mold 2, and also causes the first elastic member 5 to conform to the electronic component 9 to be processed;
  • the second balancing valve 12 is electrically connected to the second accommodating cavity. When the pressure of the second accommodating cavity needs to be changed, no fixed form substance is discharged from the second accommodating cavity through the second balancing valve 12.
  • the apparatus further includes a third balancing valve 13, a third balancing valve 13 and a first elastic member 5, a second elastic member 7, and a seal formed between the two side walls of the upper mold 1 and the lower mold 2
  • the three-capacity cavity is turned on.
  • the external gas enters the third receiving cavity through the third balancing valve 13, wherein the electronic component is placed in the cavity.
  • the first elastic member 5 is an elastic rubber film.
  • the second elastic member 7 is an elastic rubber film.
  • the apparatus further includes a one-way exhaust valve 14 that is sealed with the first elastic member 5, the second elastic member 7, and the two side walls of the upper mold 1 and the lower mold 2
  • the third accommodating cavity is electrically connected.
  • the lower die 2 and the upper die 1 abut against each other to form a closed space, and the gas is discharged through the one-way exhaust valve 14 so that the first elastic member and the second elastic member respectively Closer fit with electronic components.
  • the partially non-touchable portion of the electronic component 9 to be processed is shielded using a rigid jig.
  • a TP touch area (AA)
  • the surface layer is glass
  • the bottom layer is glass.
  • the plating sensor Touch Panel sensor, TP senor for short
  • a rigid shielding jig in the process of bonding and pressing, since the TP sensor cannot be pressed, a rigid shielding jig must be made to block the area, and the rigid shielding jig is mounted on the lower mold of the pressing machine. It can be prevented from being crushed when pressed.
  • FIG. 3 is a structural schematic view of a non-touchable partial area on a flexible printed circuit board (FPC) using a rigid jig.
  • FPC flexible printed circuit board
  • FIG. 3 is a structural schematic view of a non-touchable partial area on a flexible printed circuit board (FPC) using a rigid jig.
  • the FPC component needs to be pressed after being attached to the component, but the device on the FPC cannot be pressed, so it is rigid.
  • the shielding clamp is mounted on the upper die of the press, which prevents the device from being pressed when pressed.
  • FIG. 4 is a schematic view showing an operation state of a stamping device for an electronic component according to a first embodiment of the present invention. As shown in FIG. 4, when the press machine is in the working state (that is, after the upper mold 1 and the lower mold 2 form a closed space), the first balancing valve 11 is closed, and no fixed form substance enters through the first inlet port 3.
  • the first elastic member 5 When the first cavity is received, the pressure of the first accommodating cavity increases, the first elastic member 5 (not shown) expands in the direction of the lower die 2; the second balancing valve 12 is closed, and the fixed substance is not passed through
  • the second inlet port 4 enters the second accommodating cavity, the pressure of the second accommodating cavity increases, and the second elastic member 7 (not shown) expands in the direction of the upward mold, so that the second elastic member 7 and the waiting portion
  • the processing electronic component 9 is attached, and after the first elastic component 5 is expanded in the direction of the lower die 2, the first elastic component 5 is also brought into contact with the electronic component 9 to be processed; and the one-way exhaust valve 14 is opened, which will be first.
  • the elastic member 5, the second elastic member 7, and the gas in the third accommodating cavity that is hermetically formed between the two side walls of the upper mold 1 and the lower mold 2 are exhausted, and the first elastic member 5 and the second elastic member 7 are expanded.
  • the pressure acts evenly on the electronic component 9 to be pressed for pressing.
  • the first balancing valve 11 is opened, and the non-fixed form substance is discharged from the first accommodating cavity through the first balancing valve 11, so that the pressure in the first accommodating cavity is reduced, and the second balancing valve 12 is opened.
  • the non-fixed form substance is discharged from the second accommodating cavity through the second balancing valve 12, and the pressure in the second accommodating cavity is reduced, so that the first elastic member 5 and the second elastic member 7 are reduced to the tightened state, and are opened.
  • the third balancing valve 13 allows the external gas to enter the third accommodating cavity through the third balancing valve 13 to balance the respective chambers and the external air pressure, thereby opening the pressing fixture and taking out the processed electronic components.
  • the first balancing valve 11 and the second balancing valve 12 are closed, the first elastic member 5 and the second elastic member 7 And a sidewall between the upper mold 1 and the lower mold 2 forms a third accommodating cavity.
  • the electronic component 9 is placed in the third accommodating cavity and placed laterally on the boss 10.
  • the gas enters the first accommodating cavity through the first inlet port 3, so that the pressure in the first accommodating cavity increases, and the first elastic member 5 expands in the direction of the lower die 1.
  • the gas also needs to enter the second accommodating cavity through the second inlet port 4, so that the pressure in the second accommodating cavity is increased, and the second elastic member 7 is expanded in the direction of the upper die 1 to make the second elastic
  • the component 7 is in conformity with the electronic component 9 to be processed;
  • the first elastic component 5 is expanded in the direction of the lower die 2, so that the first elastic component 5 is also bonded to the electronic component 9 to be processed;
  • the device includes
  • the one-way exhaust valve 14 is electrically connected to the third accommodating chamber, and the gas in the third accommodating chamber is discharged outward through the one-way venting valve 14 when the ram is in the working state.
  • the first balancing valve 11 and the second balancing valve 12 are also required to be opened, so that the gases in the first accommodating cavity and the second accommodating cavity are discharged through the first balancing valve 11 and the second balancing valve 12, respectively.
  • the pressure in the first accommodating cavity and the second accommodating cavity is changed, and the first elastic member 5 and the second elastic component 7 are restored to the original state to ensure that the pressed product is in the original position.
  • Electronic component is also required to be opened, so that the gases in the first accommodating cavity and the second accommodating cavity are discharged through the first balancing valve 11 and the second balancing valve 12, respectively.
  • the pressure in the first accommodating cavity and the second accommodating cavity is changed, and the first elastic member 5 and the second elastic component 7 are restored to
  • the stamping device for an electronic component presses a component by pressing a gas or other non-fixed matter in the pressing fixture, and the pressing effect is good, the implementation is simple, the operation is convenient, and the method is not required.
  • Each component is specially made with press-fit clamps.
  • the fixtures are highly versatile and can be easily pressed on the side. It eliminates the need for sliders or multi-cylinders, saves costs, and enables multiple components to be pressed at the same time, improving press-fit efficiency. .

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Mechanical Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

一种电子元件的冲压装置，包括：上模（1）和下模（2），所述上模和下模分别设置有弹性部件（5，7）、进物口（3，4）和平衡阀（11，12，13）。该装置通过在压合夹具内增加弹性部件，充入气体或其他无固定形态物质来压合元件，提高了压合夹具的易用性，压合效率高，压合效果好。

Description

电子元件的冲压装置 技术领域
本发明涉及电子技术领域，尤其涉及一种电子元件的冲压装置。
背景技术
随着电子通讯产业的迅速发展，电子元件等使用压敏双面胶来进行连接或固定的场景越来越多，如手机触摸屏(Touch Panel，TP)粘贴，软性印刷电路板(Flexible Print Circuit,FPC)天线粘贴等。压敏双面胶粘贴后，需要施加一定压力才能完全激活其粘贴能力，使被粘贴元件稳定牢固。
现有技术中，通常把被粘贴元件置于压合夹具中，把压合夹具安装在压合夹具上，通过压合夹具来对元件进行压合。在实际操作中，会出现压合夹具压伤元件的情况。另外，由于曲面压合夹具制作困难，一般压合夹具的粘贴面为平面。对于元件的弧形曲面，经常存在某些区域压不到位的情况，导致FPC天线等粘贴件起翘或者无法通过可靠性测试。而且，TP压合对夹具平面度要求很高，夹具加工质量要求严格。对于需要多面压合的元件，需要用到多气缸压合夹具或者多面滑块，夹具设计制作复杂。
发明内容
本发明实施例提供了一种电子元件的冲压装置，通过在压合夹具内增加弹性部件，充入气体或其他无固定形态物质来压合元件，提高了压合夹具的易用性。方法操作简单，实现方便，压合效率高，压合效果好。
第一方面，本发明提供了一种电子元件的冲压装置，所述装置包括：
上模和下模；
所述上模包括：第一弹性部件和上密封载板；
第一弹性部件，与所述上密封载板形成第一容置腔；
第一进物口，与所述第一容置腔相导通，当有无固定形态物质通过所述第一进物口进入到所述第一容置腔时，所述第一容置腔的压力增大，所述第一弹性部件向所述下模的方向膨胀；
第一平衡阀，与所述第一容置腔相导通，当需要改变所述第一容置腔的压力时，所述无固定形态物质通过所述第一平衡阀从所述第一容置腔内排出；
在工作时，所述下模与所述上模抵顶以形成密闭空间，所述下模包括：凸台、第二弹性部件以及下密封载板；
所述凸台，用于搁置待加工电子元件；
所述第二弹性部件，与所述下密封载板形成第二容置腔；
第二进物口，与所述第二容置腔相导通，当所述无固定形态物质通过所述第二进物口进入到所述第二容置腔时，所述第二容置腔的压力增大，所述第二弹性部件向所述上模的方向膨胀，使得所述第二弹性部件与所述待加工电子元件相贴合；所述第一弹性部件向所述下模的方向膨胀，也使得所述第一弹性部件与所述待加工电子元件相贴合；
第二平衡阀，与所述第二容置腔相导通，当需要改变所述第二容置腔的压力时，所述无固定形态物质通过所述第二平衡阀从所述第二容置腔内排出。
结合第一方面，在第一方面的第一种可能的实现方式中，所述装置还包括第三平衡阀，所述第三平衡阀与所述第一弹性部件、第二弹性部件以及上模和下模的两个侧壁之间密闭形成的第三容置腔相导通，当需要将所述上模和所述下模打开时，外部的气体通过所述第三平衡阀进入到所述第三容置腔内。
结合第一方面或第一方面的第一种可能的实现方式，在第一方面第二种可能的实现方式中，所述装置还包括单向排气阀，所述单向排气阀与所 述第一弹性部件、第二弹性部件以及上模和下模的两个侧壁之间密闭形成的第三容置腔相导通，在工作时，所述下模与所述上模抵顶以形成密闭空间，所述气体通过所述单向排气阀排出。
结合上述任意一种可能的实施方式，在第一方面的第三种可能的实现方式中，所述第一弹性部件为弹性橡胶膜。
结合第一方面至第一方面的第二种可能的实施方式，在第一方面的第四种实现方式中，所述第二弹性部件为弹性橡胶膜。
结合第一方面至第一方面的第二种可能的实施方式，在第一方面的第五种实现方式中，所述待加工电子元件为多个，横向并排放置。
结合上述任意一种可能的实施方式，在第一方面的第六种实现方式中，所述待加工电子元件局部不可触碰部分使用刚性夹具进行遮蔽。
本发明实施例提供了一种电子元件的冲压装置，通过在压合夹具内增加弹性部件，充入气体或其他无固定形态物质来压合元件，压合效果好，实现简单，操作方便，而且无需根据每个元件专门制作压合夹具，夹具通用程度高，能够轻松实现侧面压合，无需采用滑块或者多气缸的方式，节约了成本，并且能够实现同时压合多个元件，提升了压合效率。
附图说明
图1为本发明实施例一提供的电子元件的冲压装置结构示意图；
图2为采用刚性夹具对触摸屏模组上不可触碰的局部区域进行遮蔽的结构示意图；
图3为采用刚性夹具对软性印刷电路上不可触碰的局部区域进行遮蔽的结构示意图；
图4为本发明实施例一提供的电子元件的冲压装置工作状态示意图。
具体实施方式
下面通过附图和实施例，对本发明的技术方案做进一步的详细描述。为使本发明实施例的目的、技术方案和优点更加清楚，下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
本发明提供的电子元件的冲压装置采用弹性部件，使得弹性部件在充入气体、水或其它无固定形态物质的情况下贴合在电子元件，使得压力均匀施加在电子元件的表面，使得粘贴更为稳定可靠。电子元件使用压敏双面胶来进行连接或固定的场景。
图1为本发明实施例一提供的电子元件的冲压装置结构示意图。如图1所示，所述装置包括：上模1和下模2。
具体地，上模1包括：第一弹性部件5和上密封载板6；
第一弹性部件5，与上密封载板6形成第一容置腔；
第一进物口3，与第一容置腔相导通，当有无固定形态物质通过所述第一进物口3进入到所述第一容置腔时，第一容置腔的压力增大，第一弹性部件5向下模2的方向膨胀；
第一平衡阀11，与第一容置腔相导通，当需要改变第一容置腔的压力时，无固定形态物质通过第一平衡阀11从第一容置腔内排出；
在工作时，下模2与上模1抵顶以形成密闭空间，下模2包括：凸台10、第二弹性部件7以及下密封载板8；
凸台10，用于搁置待加工电子元件9；
第二弹性部件7，与下密封载板8形成第二容置腔；
第二进物口4，与第二容置腔相导通，当无固定形态物质通过第二进物口4进入到第二容置腔时，第二容置腔的压力增大，第二弹性部件7向上模1的方向膨胀后，使得第二弹性部件与待加工电子元件9相贴合；与此同时， 第一弹性部件5向下模2的方向膨胀，也使得第一弹性部件5与待加工电子元件9相贴合；
第二平衡阀12，与第二容置腔相导通，当需要改变所述第二容置腔的压力时，无固定形态物质通过第二平衡阀12从第二容置腔内排出。
进一步地，所述装置还包括第三平衡阀13，第三平衡阀13与第一弹性部件5、第二弹性部件7以及上模1和下模2的两个侧壁之间密闭形成的第三容置腔相导通，当需要将下模2和上模1打开时，外部的气体通过第三平衡阀13进入到第三容置腔内，其中，电子元件置于该腔体中。
优选地，第一弹性部件5为弹性橡胶膜。
优选地，第二弹性部件7为弹性橡胶膜。
进一步地，所述装置还包括单向排气阀14，单向排气阀14与第一弹性部件5、第二弹性部件7以及上模1和下模2的两个侧壁之间密闭形成的第三容置腔相导通，在工作时，下模2与上模1抵顶以形成密闭空间，气体通过单向排气阀14排出，以便于第一弹性部件与第二弹性部件分别与电子元件更加紧密的贴合。
优选地，待加工电子元件9为多个，横向并排放置。
优选地，待加工电子元件9局部不可触碰部分使用刚性夹具进行遮蔽。
需要说明的是，对于待压合电子元件上不可触碰的局部区域，例如TP触摸区域(Active Area,A-A)，如图2所示，TP模组进行粘贴压合时，表层为玻璃，底层为电镀传感器(Touch Panel sensor，简称TP senor)，在粘贴压合过程中，由于TP sensor不能承压，所以必须制作一个刚性遮蔽夹具挡住该区域，刚性遮蔽夹具安装在压合机下模上，可以避免压合时被压坏。
图3为采用刚性夹具对软性印刷电路板(Flexible Print Circuit，简称FPC)上不可触碰的局部区域进行遮蔽的结构示意图。如图3所示，FPC组件粘贴到构件上后需要压合，但是FPC上的器件不能承压,故做一个刚性 遮蔽夹具安装在压合机上模，压合时能避免器件被压到。
图4为本发明实施例一提供的电子元件的冲压装置工作状态的示意图。如图4所示，当压合机处于工作状态时(即上模1和下模2形成一个密闭空间后)，关闭第一平衡阀11，无固定形态物质通过第一进物口3进入到第一容置腔时，第一容置腔的压力增大，第一弹性部件5(图中未示出)向下模2的方向膨胀；关闭第二平衡阀12，无固定形态物质通过第二进物口4进入到第二容置腔，第二容置腔的压力增大，第二弹性部件7(图中未示出)向上模的方向膨胀后，使得第二弹性部件7与待加工电子元件9相贴合，第一弹性部件5向下模2的方向膨胀后，也使得第一弹性部件5与待加工电子元件9相贴合；打开单向排气阀14，将第一弹性部件5、第二弹性部件7以及上模1和下模2的两个侧壁之间密闭形成的第三容置腔内的气体排出，第一弹性部件5和第二弹性部件7扩张后压力均匀作用在待压合电子元件9上来进行压合。
压合完成后，打开第一平衡阀11，使无固定形态物质通过第一平衡阀11从第一容置腔内排出，使第一容置腔内的压力减小，打开第二平衡阀12，无固定形态物质通过第二平衡阀12从第二容置腔内排出，第二容置腔内的压力减小，使第一弹性部件5和第二弹性部件7还原为缩紧状态，打开第三平衡阀13，使外部的气体通过第三平衡阀13进入到第三容置腔内，平衡各腔体和外部气压，从而打开压合夹具，取出加工后的电子元件。
在一个具体的例子中，将结合气体的情形来描述本发明，本领域的普通技术人员意识到，本发明同样适用于其它无固定形态物质的情形。
当压合机处于工作状态时(上模1和下模2抵顶后形成一个密闭的空间)，关闭第一平衡阀11和第二平衡阀12，第一弹性部件5、第二弹性部件7以及上模1和下模2之间的侧壁形成第三容置腔。电子元件9处于第三容置腔中，横向放置在凸台10上。这里的电子元件9可以为多个，并排横放在凸台10上(例如凸台的宽度为10厘米，电子元件的宽度为2厘米， 如此一个凸台可以同时放置5个电子元件)。气体通过第一进物口3进入到第一容置腔中，使第一容置腔内的压力增大，第一弹性部件5向下模1的方向膨胀。同时，气体还需要通过第二进物口4进入到第二容置腔内，使第二容置腔内的压力增大，第二弹性部件7向上模1的方向膨胀后，使得第二弹性部件7与待加工电子元件9相贴合；第一弹性部件5向下模2的方向膨胀，也使得第一弹性部件5也与待加工电子元件9相贴合；另外，该装置中还包括了单向排气阀14，与第三容置腔相导通，在压合机处于工作状态时，将第三容置腔内的气体通过单向排气阀14向外排出。使第三容置腔内部形成一个近似真空的腔体，以便于第一弹性部件5与第二弹性部件7分别与电子元件9更加紧密的贴合，在压合的过程中，对于待加工电子元件局部不可触碰部分还需要使用刚性夹具进行遮蔽。
压合完成后，还需要打开第一平衡阀11和第二平衡阀12，使第一容置腔和第二容置腔内的气体分别通过第一平衡阀11和第二平衡阀12排放出去，用以改变第一容置腔内和第二容置腔内的压力，并使第一弹性部件5和第二弹性部件7恢复为原来的状态，保证被压合产品处于原本的位置。同时还需要打开第三平衡阀13，使外部空气进入到第三容置腔内，确保第三容置腔内部气压与外部气压平衡，方便打开上模1和下模2，取出压合后的电子元件。
本发明实施例提供的电子元件的冲压装置，通过在压合夹具内增加弹性部件，充入气体或其他无固定形态物质来压合元件，压合效果好，实现简单，操作方便，而且无需根据每个元件专门制作压合夹具，夹具通用程度高，能够轻松实现侧面压合，无需采用滑块或者多气缸的方式，节约了成本，并且能够实现同时压合多个元件，提升了压合效率。
以上所述的具体实施方式，对本发明的目的、技术方案和有益效果进行了进一步详细说明，所应理解的是，以上所述仅为本发明的具体实施方式而已，并不用于限定本发明的保护范围，凡在本发明的精神和原则之内，所做的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。

Claims (7)

  1. 一种电子元件的冲压装置，其特征在于，所述装置包括：上模和下模；
    所述上模包括：第一弹性部件和上密封载板；
    第一弹性部件，与所述上密封载板形成第一容置腔；
    第一进物口，与所述第一容置腔相导通，当有无固定形态物质通过所述第一进物口进入到所述第一容置腔时，所述第一容置腔的压力增大，所述第一弹性部件向所述下模的方向膨胀；
    第一平衡阀，与所述第一容置腔相导通，当需要改变所述第一容置腔的压力时，所述无固定形态物质通过所述第一平衡阀从所述第一容置腔内排出；
    在工作时，所述下模与所述上模抵顶以形成密闭空间，所述下模包括：凸台、第二弹性部件以及下密封载板；
    所述凸台，用于搁置待加工电子元件；
    所述第二弹性部件，与所述下密封载板形成第二容置腔；
    第二进物口，与所述第二容置腔相导通，当所述无固定形态物质通过所述第二进物口进入到所述第二容置腔时，所述第二容置腔的压力增大，所述第二弹性部件向所述上模的方向膨胀，使得所述第二弹性部件与所述待加工电子元件相贴合；所述第一弹性部件向所述下模的方向膨胀，也使得所述第一弹性部件与所述待加工电子元件相贴合；
    第二平衡阀，与所述第二容置腔相导通，当需要改变所述第二容置腔的压力时，所述无固定形态物质通过所述第二平衡阀从所述第二容置腔内排出。
  2. 根据权利要求1所述的装置，其特征在于，所述装置还包括第三平衡阀，所述第三平衡阀与所述第一弹性部件、第二弹性部件以及上模和下模的两个侧壁之间密闭形成的第三容置腔相导通，当需要将所述上模和所述下模打开时，外部的气体通过所述第三平衡阀进入到所述第三容置腔内。
  3. 根据权利要求1或2所述的装置，其特征在于，所述装置还包括单向排气阀，所述单向排气阀与所述第一弹性部件、第二弹性部件以及上模和下 模的两个侧壁之间密闭形成的第三容置腔相导通，在工作时，所述下模与所述上模抵顶以形成密闭空间，所述气体通过所述单向排气阀排出。
  4. 根据权利要求1-3任一项所述的装置，其特征在于，所述第一弹性部件为弹性橡胶膜。
  5. 根据权利要求1-3任一项所述的装置，其特征在于，所述第二弹性部件为弹性橡胶膜。
  6. 根据权利要求1-3任一项所述的装置，其特征在于，所述待加工电子元件为多个，横向并排放置。
  7. 根据权利要求1-6任一项所述的装置，其特征在于，所述待加工电子元件局部不可触碰部分使用刚性夹具进行遮蔽。
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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001341147A (ja) * 2000-06-01 2001-12-11 Nichigo Morton Co Ltd 真空積層装置及び積層方法
CN201439257U (zh) * 2009-08-14 2010-04-21 阳程科技股份有限公司 贴覆装置
CN201979782U (zh) * 2011-02-18 2011-09-21 富葵精密组件(深圳)有限公司 压合装置
CN102529284A (zh) * 2010-12-23 2012-07-04 富葵精密组件(深圳)有限公司 压合装置及使用该压合装置的电路板压合方法
US20120168086A1 (en) * 2005-08-30 2012-07-05 Rockwell Collins, Inc. System and method for completing lamination of rigid-to-rigid substrates by the controlled application of pressure
TW201302474A (zh) * 2011-03-31 2013-01-16 Sumitomo Bakelite Co 積層片之製造裝置及積層片之製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3051381B2 (ja) * 1998-11-06 2000-06-12 ニチゴー・モートン株式会社 積層方法
JP5554667B2 (ja) * 2010-09-13 2014-07-23 クレハエラストマー株式会社 太陽電池モジュール製造用ダイヤフラムおよびその評価方法ならびに太陽電池モジュールの製造方法
CN202579510U (zh) * 2012-05-30 2012-12-05 惠州大亚湾光弘科技电子有限公司 一种定位压合治具

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001341147A (ja) * 2000-06-01 2001-12-11 Nichigo Morton Co Ltd 真空積層装置及び積層方法
US20120168086A1 (en) * 2005-08-30 2012-07-05 Rockwell Collins, Inc. System and method for completing lamination of rigid-to-rigid substrates by the controlled application of pressure
CN201439257U (zh) * 2009-08-14 2010-04-21 阳程科技股份有限公司 贴覆装置
CN102529284A (zh) * 2010-12-23 2012-07-04 富葵精密组件(深圳)有限公司 压合装置及使用该压合装置的电路板压合方法
CN201979782U (zh) * 2011-02-18 2011-09-21 富葵精密组件(深圳)有限公司 压合装置
TW201302474A (zh) * 2011-03-31 2013-01-16 Sumitomo Bakelite Co 積層片之製造裝置及積層片之製造方法

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