WO2016185262A1 - 接着性樹脂層及び接着性樹脂フィルム - Google Patents
接着性樹脂層及び接着性樹脂フィルム Download PDFInfo
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- WO2016185262A1 WO2016185262A1 PCT/IB2016/000191 IB2016000191W WO2016185262A1 WO 2016185262 A1 WO2016185262 A1 WO 2016185262A1 IB 2016000191 W IB2016000191 W IB 2016000191W WO 2016185262 A1 WO2016185262 A1 WO 2016185262A1
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- adhesive resin
- resin layer
- adhesive
- acrylate
- temperature
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
- B32B2307/412—Transparent
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2475/00—Presence of polyurethane
Definitions
- the present invention relates to an adhesive resin layer and an adhesive resin film that can prevent the generation of bubbles even when bonded to a substrate having a step.
- This application claims the priority based on Japanese Patent Application No. 2015-100644 for which it applied on May 18, 2015, and uses the content here.
- an acrylic pressure-sensitive adhesive As a pressure-sensitive adhesive that can easily peel off a pressure-sensitive adhesive after use, an acrylic pressure-sensitive adhesive, a photocurable acrylate compound such as urethane acrylate, an isocyanate-based curing agent (crosslinking agent), and a photopolymerization initiator
- the adhesive which contains is used (for example, refer patent documents 1-3).
- This type of pressure-sensitive adhesive has pressure-sensitive adhesive properties at room temperature, and can be re-peeled by reducing the pressure-sensitive adhesive properties by light irradiation. Therefore, this type of pressure-sensitive adhesive is widely used for pressure-sensitive adhesive tapes for semiconductor processing or transportation.
- acrylic pressure-sensitive adhesives are also widely used for laminating and bonding transparent or translucent substrates such as touch panels, mobile phones, displays, and laminated glass.
- the surface of the base material may have a step due to a printed layer, wiring, electrodes, a frame, or the like.
- the present invention has been made in view of the above circumstances, and can prevent the generation of bubbles even when bonded to a substrate having a high level difference.
- the substrate, the adhesive resin layer, and the substrate are sequentially arranged.
- the present invention provides a single-layer adhesive resin layer containing a transparent acrylic adhesive resin composition, wherein the adhesive resin composition is at least (A) acrylic A polymer, (B) urethane acrylate, and (C) a thermal polymerization initiator, and the adhesive resin layer has adhesiveness on both sides at room temperature, a temperature of 100 to 250 ° C., and 30 seconds to 10 Provided is an adhesive resin layer which can be thermally cured by heating for a minute time.
- the amount of the (B) urethane acrylate added is preferably 2 to 50 parts by weight with respect to 100 parts by weight of the (A) acrylic polymer.
- the thermal polymerization initiator is preferably a peroxide.
- the temperature at which the peroxide has a half-life of 1 minute is preferably 100 ° C. or higher.
- the (A) acrylic polymer is preferably an acrylic polymer crosslinked with a curing agent. It is preferable that the curing agent contains at least one of an isocyanate compound or an epoxy compound.
- the adhesive resin composition may contain (D) an acrylic monomer other than the (B) urethane acrylate.
- the present invention also provides an adhesive resin film, wherein the adhesive resin layer is laminated between two separators. Moreover, this invention provides the laminated body characterized by laminating
- the adhesive resin layer is heated in a state where two substrates are laminated via the adhesive resin layer, and the obtained laminate is sandwiched between two molds.
- a method for producing a laminate, which is cured is provided.
- the boiling point of the solvent contained in the raw material composition of the adhesive resin layer is temperature A
- the temperature at which the thermal polymerization initiator has a half-life of 1 minute is temperature B
- the solvent is removed in the manufacturing process of the adhesive resin layer.
- the temperatures are in the order of the following formula (1), where temperature C is the temperature during heating and temperature D is the mold pressing temperature in the step of heat curing the adhesive resin layer.
- At least one of the two substrates may include one or more steps of 5 ⁇ m to 1 mm in the surface in contact with the adhesive resin layer.
- the step is preferably 50 ⁇ m to 1 mm.
- the adhesive resin layer of the present invention is preferably thicker than the step.
- the adhesive resin layer of the present invention has a thickness of 1.1 to 3 times the step, for example, preferably 5.5 ⁇ m to 3 mm, more preferably 55 ⁇ m to 3 mm, and still more preferably 1.2 to 2 times the thickness of the step. 6 ⁇ m to 2 mm is preferable, and 60 ⁇ m to 2 mm is more preferable.
- the mold temperature during the heat curing is preferably 150 to 300 ° C.
- the present invention is characterized in that it contains an acrylic polymer, urethane acrylate, and a thermal polymerization initiator, and a transfer tape-like adhesive resin layer can be produced from the above components.
- the adhesive resin layer has a substrate followability to a substrate having a step due to urethane acrylate. It is possible to provide an adhesive resin layer in which urethane acrylate is cured by reaction initiation conditions such as heat, and no bubbles enter even if there is a step, and a method for producing the same. In particular, by adjusting the addition amount of urethane acrylate, it is possible to maintain the followability to the substrate and the strength of the adhesive resin layer itself in the form of a transfer tape.
- the adhesive resin layer can be forced to follow the substrate forcibly, particularly by hot pressing.
- the laminated body it is not hardening by electron beam irradiation or energy beam irradiation via air, but a heat press that applies both heat and pressure to the laminated body without air is used to suppress bubble generation and durability Is preferable.
- an adhesive resin layer and an adhesive resin film that can prevent the generation of bubbles even when bonded to a substrate having a high level difference and can maintain transparency. Can do.
- FIG. 1 sectional drawing of an example of the adhesive resin film 10 is shown.
- the adhesive resin film 10 has two separators 12 and 13 and an adhesive resin layer 11 laminated therebetween.
- the adhesive resin composition constituting the adhesive resin layer 11 contains (A) an acrylic polymer, (B) urethane acrylate, and (C) a thermal polymerization initiator. Both surfaces 11a and 11b of the adhesive resin layer 11 have adhesiveness at normal temperature (becomes adhesive surfaces).
- “normal temperature” is about 3 ° C. to about 40 ° C., preferably about 10 ° C. to about 30 ° C., more preferably about 15 ° C. to about 25 ° C., and most preferably. Is about 23 ° C.
- the adhesive resin layer 11 includes an adhesive resin composition throughout the thickness direction. If the adhesive resin composition satisfying the requirements is included, the adhesive resin layer 11 may be composed of two or more layers including the same type or different types of adhesive resin compositions. When the adhesive resin layer 11 is composed of a single adhesive resin layer, it is preferable because the layer configuration can be simplified and the cost can be reduced.
- the adhesive resin composition contains an acrylic adhesive resin (polymer) and has transparency.
- the separators 12 and 13 have peelability on the surfaces 12a and 13a on the side in contact with the adhesive resin layer 11 (becomes a peel surface).
- Examples of the configuration of the separators 12 and 13 include a configuration in which a release agent layer is provided on one side or both sides of a resin film, and a configuration in which a release agent is included in the resin of the resin film.
- the separators 12 and 13 have transparency because the adhesive resin layer 11 can be optically inspected with the adhesive resin film 10 in which the separators 12 and 13 are not peeled off.
- FIG. 3 shows an example of a laminate 20 in which the adhesive resin layer 11 is laminated between two substrates 21 and 22. At least one of the two substrates 21 and 22 (here, the substrate 21) has a step due to the convex portion 23 as shown in FIG.
- the level difference due to the convex portion 23 may exist on one of the surfaces 21 a and 22 a on the side where the two base materials 21 and 22 are in contact with the adhesive resin layer 11, or may exist on both.
- the convex portion 23 is illustrated separately from the base material 21, but the convex portion 23 may be integrated with the base material 21.
- a step is formed between the bottom of the recess and the top of the protrusion (height difference).
- the steps provided on the surfaces 21a and 22a on the side in contact with the adhesive resin layer 11 may be mixed in size, but may include steps of 5 ⁇ m to 1 mm, preferably 50 ⁇ m to 1 mm.
- the base materials 21 and 22 are adherends bonded by the adhesive resin layer 11.
- Each of the substrates 21 and 22 may be a rigid plate or may be flexible like a film.
- a single plate made of glass, polycarbonate, acrylic, various resins, ceramics, metal, or the like may be used, or a composite made of a plurality of materials such as a liquid crystal panel, a touch panel, a cover glass, or a wiring board may be used.
- the outer surfaces 21b and 22b of the base materials 21 and 22 may be flat or may have irregularities.
- the order in which the separators 12 and 13 are peeled when the laminate 20 as shown in FIG. 3 is formed is not particularly limited. After pasting one separator on one adhesive surface exposed by peeling one separator, the other substrate is pasted on the other adhesive surface exposed by peeling the other separator. May be. After peeling both separators and exposing both adhesive surfaces, you may bond a base material, respectively.
- the adhesive resin layer 11 contains (B) urethane acrylate having fluidity, the adhesive resin layer 11 has high flexibility and can be wetted with the adhesive resin composition up to the stepped corner 24 of the convex portion 23. For this reason, even if a level
- the laminate 20 obtained by laminating the two base materials 21 and 22 through the adhesive resin layer 11 is heated while being sandwiched between the two dies 31 and 32 as shown in FIG. By doing so, the adhesive resin layer 11 can be hardened. Thereby, the reaction (polymerization, crosslinking, etc.) of (A) acrylic polymer and (B) urethane acrylate proceeds, and the adhesive force between the base materials 21 and 22 increases. Further, by applying pressure with heating, even if bubbles remain around the step, the gap is filled and the bubbles can be removed. At the time of heat curing, at least one of the molds 31 and 32 is heated.
- the molds 31 and 32 do not cover the side surfaces of the stacked body 20, but one or both of the molds 31 and 32 are provided with irregularities so that the side surfaces of the stacked body 20 are covered with the molds. It may be configured.
- one mold may be a convex mold
- the other mold may be a concave mold
- the laminate 20 may be accommodated in the concave recess, and then the convex protrusion may approach the concave recess.
- FIG. 5 shows an example of a laminate 30 obtained by heat curing.
- the adhesive layer 25 including the thermosetting adhesive resin is laminated between the two substrates 21 and 22. Since the adhesive layer 25 after thermosetting has increased in hardness, even if the adhesive resin layer 11 before heating is flexible, it is difficult to peel again. Thereby, as the adhesive resin layer 11, even if the adhesive force is low, a resin having excellent step followability can be used.
- the laminated body 30 when the base material 21 has an unevenness
- the adhesive resin layer 11 is laminated on the substrate 21 having unevenness, and then autoclave treatment is performed, and a flat substrate 22 is laminated on the adhesive resin layer 11 to obtain a laminate.
- a method of heat-curing the adhesive resin layer 11 using the molds 31 and 32 after laminating 20 or while laminating the base material 22 is mentioned.
- the adhesive resin layer 11 is laminated on the flat base material 22, and then the autoclave treatment is performed. After the base material 21 having unevenness is laminated on the adhesive resin layer 11, Or the method of heat-hardening the adhesive resin layer 11 using the metal mold
- the adhesive resin layer 11 is used by using the molds 31 and 32 after simultaneously or simultaneously laminating the uneven substrate 21, the adhesive resin layer 11, and the flat substrate 22. The method of heat-curing is mentioned.
- the third lamination method is the most cost-effective method because the manufacturing process can be shortened.
- the steps of the base materials 21 and 22 are provided in advance on the base material before hot pressing, but when the adhesive resin layer 11 is laminated between the base materials 21 and 22 and hot pressing is performed.
- the pressing surfaces 31a and 32a of the molds 31 and 32 are provided with irregularities, the flexible base materials 21 and 22 such as a resin film can be deformed.
- the steps of the base materials 21 and 22 can be followed. Further, as the thermal polymerization proceeds during the hot pressing, the adhesive resin layer 11 is cured and the generation of voids and bubbles can be suppressed.
- the convex portion is formed on the inner surface of the substrate, the concave portion may be formed on the outer surface on the back side.
- the adhesive resin layer 11 is preferably thermoset by heating at a temperature of 100 to 250 ° C. and a time of 30 seconds to 10 minutes. It is preferable to perform thermosetting under the conditions of at least a part of these temperatures and time ranges, and it is more preferable that thermosetting is possible over the entire range. The thermosetting conditions during actual use may be outside the above range. However, from the viewpoint of storability, it is preferable that thermosetting does not proceed substantially at room temperature. For example, at a temperature of 100 ° C. or lower, it is preferable that the resin does not thermoset by heating within 10 minutes.
- the storage elastic modulus at a temperature of 23 ° C. is preferably 1 ⁇ 10 4 to 1 ⁇ 10 6 Pa. Further, after the adhesive resin layer 11 is thermally cured by heating, the storage elastic modulus at a temperature of 23 ° C. is preferably 1 ⁇ 10 4 to 1 ⁇ 10 9 Pa. It is preferable that the storage elastic modulus at a temperature of 23 ° C. after thermosetting by heating is higher than the storage elastic modulus at a temperature of 23 ° C. before heating.
- These storage elastic moduli are set so that the temperature of the adhesive resin layer in an uncured state (before heating) and the temperature of the adhesive resin layer after heat curing by heating (adhesive layer after heat curing) are 23 ° C. Can be measured.
- the vibration frequency when measuring the storage elastic modulus is, for example, 1 Hz.
- the adhesive raw material composition used in the production of the adhesive resin layer of the present invention preferably contains an organic solvent because it can be applied with higher accuracy when dissolved in an organic solvent.
- an adhesive resin layer is obtained. That is, the composition of the adhesive raw material composition may be obtained by adding a solvent to the composition of the adhesive resin composition constituting the adhesive resin layer.
- the adhesive resin layer can function as a pressure-sensitive adhesive layer at room temperature (before thermosetting).
- the monomer constituting the acrylic polymer is an acrylic monomer having an ester group (—COO—), an acrylic monomer having a carboxyl group (—COOH), an amide group (—CONR 2 , R is a hydrogen atom or an alkyl group)
- Non-acrylic monomers such as an acrylic monomer having a substituent such as a group, an acrylic monomer having a nitrile group (—CN), olefins, styrene, vinyl esters, vinyl ethers, vinyl silane.
- the acrylic polymer is preferably a copolymer composed of two or more monomers.
- the number average molecular weight of the (A) acrylic polymer before photopolymerization is preferably about 50,000 to 1,000,000, for example.
- the viscosity is, for example, about 1,000 to 10,000 mPa ⁇ s.
- an acrylic monomer having an ester group (—COO—) an alkyl (meth) acrylate, a (meth) acrylate having a hydroxyl group (hydroxyl group), a (meth) acrylate having an alkoxy group or a polyether group, an amino group, or a substituent
- examples thereof include (meth) acrylate having an amino group.
- (meth) acrylate is a general term for acrylate and methacrylate.
- acrylic monomer having a carboxyl group examples include acrylic acid, methacrylic acid, (meth) acrylate having a carboxyl group (—COOH), and the like.
- acrylic monomer having an amide group examples include acrylamide and methacrylamide.
- acrylic monomer having a nitrile group examples include acrylonitrile and methacrylonitrile.
- an acrylic polymer it is preferable that 50 weight% or more of a structural monomer consists of an acrylic monomer.
- alkyl (meth) acrylate examples include methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) acrylate, n-butyl (meth) acrylate, and isobutyl (meth) acrylate.
- an alkyl (meth) acrylate having an alkyl group R 2 having 4 to 12 carbon atoms as an essential component (for example, 50 to 100 mol%).
- Examples of the (meth) acrylate containing a hydroxyl group include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, and 4-hydroxybutyl (meth).
- the number of urethane bonds in one molecule may be one or two or more.
- the number of (meth) acryloyloxy groups in one molecule may be one or two or more.
- urethane acrylate for example, a compound obtained by reacting a (meth) acrylate compound having a hydroxyl group and an isocyanate compound, a urethane prepolymer obtained by reacting a polyol compound and a polyisocyanate compound, has a hydroxyl group.
- examples thereof include compounds obtained by reacting (meth) acrylate compounds.
- the polyol compound include polyester polyol and polyether polyol.
- the addition amount of (B) urethane acrylate is preferably 2 to 50 parts by weight with respect to 100 parts by weight of (A) acrylic polymer. The amount added may be 40 parts by weight or less.
- Urethane acrylate is preferably a liquid (fluid) that becomes part of the polymer by thermal curing with (C) a thermal polymerization initiator and has a lower viscosity than the polymer.
- An acrylate oligomer such as a urethane acrylate oligomer can also be used as the urethane acrylate.
- the number of polymerizable functional groups of urethane acrylate is, for example, 1 to 5.
- the adhesive raw material composition of the present invention in addition to (B) urethane acrylate, other (D) acrylic monomers can be added.
- the (D) acrylic monomer include the same monomers as those constituting the (A) acrylic polymer, for example, alkyl (meth) acrylate, (meth) acrylate containing a hydroxyl group, acrylamide, and the like.
- the number of polymerizable functional groups such as a (meth) acryloyl group in one molecule may be one or two or more.
- the hydroxyl group having polarity is easily dispersed throughout the adhesive resin layer. This is preferable because moisture hardly aggregates even in a high humidity (higher temperature) environment and white turbidity of the adhesive resin layer is suppressed.
- the addition amount of the (D) acrylic monomer is preferably 30 parts by weight or less with respect to 100 parts by weight of the acrylic polymer. If the amount of urethane acrylate (or the total of urethane acrylate and acrylic monomer) is too large, the adhesive strength of the adhesive resin layer may be excessively reduced when thermal polymerization is performed.
- the total addition amount of (B) urethane acrylate and (D) acrylic monomer is preferably 2 to 50 parts by weight. The amount added may be 40 parts by weight or less.
- the thermal polymerization initiator includes a radical initiator that decomposes by heat to start polymerization of a monomer (radical polymerization) and curing of a resin.
- a radical initiator that decomposes by heat to start polymerization of a monomer (radical polymerization) and curing of a resin.
- a redox initiator and an organometallic compound that act at a low temperature are also known.
- an (organic) peroxide type, an azo compound that acts at a higher temperature. A system or the like is preferable.
- the thermal polymerization initiator is a temperature at which the half-life of the thermal polymerization initiator becomes 1 minute in the manufacturing process of the transfer tape, in particular, in the solvent drying step, so that the half-life of the thermal polymerization initiator is 1 minute (hereinafter referred to as “1 minute half-life temperature”). Is preferably higher than the boiling point of the organic solvent contained in the adhesive raw material composition.
- the thermal polymerization initiator is preferably a material having a half-life temperature of 1 minute that is 50 ° C. or more lower than the hot press set temperature in order to sufficiently react at a temperature at the time of hot press for a certain period of time.
- (organic) peroxide-based thermal polymerization initiators include benzoyl peroxide, acetyl peroxide, decanoyl peroxide, lauroyl peroxide, and other diacyl peroxides, dicumyl peroxide, and di-t-butyl peroxide.
- alkylperoxy esters such as dialkyl peroxide, t-butylperoxybenzoate, and t-butylperoxy-2-ethylhexanoate
- hydroperoxides such as cumene hydroperoxide and t-butylhydroperoxide.
- organic peroxides having a 1-minute half-life temperature of 100 ° C.
- organic peroxides having a 1-minute half-life temperature in the range of 100 ° C. to 200 ° C. are more preferable.
- organic peroxides include t-hexyl peroxyneodecanoate, t-butyl peroxyneodecanoate, t-butyl peroxyneoheptanoate, t-hexyl peroxypivalate, and t-butyl peroxypivalate.
- 2,2′-azobis isobutyronitrile
- 2,2'-azobis (4-methoxy-2,4-dimethylvaleronitrile) 2,2'-azobis (methylisobutyrate) 1,1′-azobis (1-cyclohexanecarbonitrile) and the like.
- the addition amount of the thermal polymerization initiator (C) is preferably 0.001 to 0.5 parts by weight with respect to 100 parts by weight of the (A) acrylic polymer.
- a polymerization retarder can be added to the adhesive resin layer of the present invention.
- Use of a polymerization retarder facilitates control of the degree of polymerization. Moreover, it is preferable from a viewpoint of improving level
- the adhesive resin composition can further contain optional components other than (A) to (C).
- (E) cross-linking agent (curing agent) such as isocyanate cross-linking agent, epoxy-based cross-linking agent, metal chelate compound cross-links (A) acrylic polymer or (B) polymer produced by polymerization of urethane acrylate. Therefore, it is preferably used.
- a polymer or monomer having a functional group that reacts with the crosslinking agent (E) is used as at least part of (A) the acrylic polymer or (B) the urethane acrylate.
- the functional group that reacts with the crosslinking agent is, for example, a hydroxyl group or a carboxyl group in the case of an isocyanate crosslinking agent.
- the addition amount of a crosslinking agent 1.5 equivalent or less is preferable with respect to the functional group of a polymer.
- Curing of the (A) acrylic polymer by the crosslinking agent may be advanced by aging at the stage of producing an adhesive resin layer before being bonded to the adherend.
- the adhesive raw material composition used in the production of the adhesive resin layer may contain a solvent such as water or an organic solvent, or may be a solvent-free syrup-like composition.
- a solvent such as water or an organic solvent
- the material of the adhesive resin composition is corrosion of acid or the like.
- the urethane acrylate oligomer component that is a component to be cured in the production of the adhesive resin layer of the present invention.
- acrylic polymers and urethane acrylate oligomer components often have large molecular weights and often have poor compatibility as paints. Therefore, it is desirable to add a compatibilizer.
- a non-reactive compatibilizer may be used, but there is a possibility that it can be separated in the pressure-sensitive adhesive layer, so there is a high possibility that the usable materials are limited, and depending on the type or addition amount, foaming in a durability test, etc. This can cause problems and is less versatile.
- a compatibilizer that cures together with the urethane acrylate oligomer component at the time of a thermal reaction is polymerized and therefore leads to suppression of foaming and the like. Therefore, it is preferable to select a material having a reactive group. Furthermore, when an acrylic monomer that becomes hard after thermal reaction is used as a compatibilizer, the effect of hardening the pressure-sensitive adhesive layer after curing can be expected as well as the stability of the paint. In addition to good compatibility with acrylic monomers, the viscosity is low compared to acrylic polymers or urethane acrylate oligomers, so it can be adjusted to the optimum viscosity during film formation by adding when the viscosity of the paint is too high. It becomes possible and contributes to productivity improvement. There may be a case where more acrylic monomer is added than the urethane acrylate oligomer.
- the adhesive resin layer (transfer tape) in this invention can be manufactured by apply
- the adhesive raw material composition is preferably applied using a die or a pipe doctor.
- drying the solvent drying with a dryer or the like is preferable.
- the drying time of the solvent considering productivity, it is preferably 10 minutes or less, more preferably 2 to 5 minutes.
- the laminate may have an adhesive resin layer between three or more substrates. It is preferable that one or more (preferably all) of the two or more adhesive resin layers included in the laminate are the adhesive resin layer of the present embodiment.
- two or more laminates When the laminate is hot-pressed, two or more laminates may be disposed between a pair of molds. This arrangement is not particularly limited, and two or more laminates may be stacked in the compression direction of the mold, and two or more laminates may be stacked in a plane perpendicular to the compression direction (for example, on the pressing surface of any mold). May be arranged. The above-described inclusions may be interposed between two or more laminates.
- a laminated structure as shown in FIG. 3 is produced, and heat treatment is performed in the configuration as shown in FIG. Make it.
- the temperature of the mold is preferably 100 to 300 ° C, more preferably 150 to 300 ° C.
- the heating temperature during hot pressing is preferably 180 ° C. or lower.
- the temperature may be 100 to 300 ° C.
- the reaction is preferably completed within 2 minutes from the viewpoint of productivity. Further, the press temperature and time can be set so that the strength of the laminate is sufficient.
- Example 1 As a polymer solution containing an acrylic polymer, SK Dyne (registered trademark) 2094 (Soken Chemical Co., Ltd., acid value: 33, number average molecular weight 70,000, solid content concentration 25%), E-AX (as a crosslinking agent) Soken Chemical Co., Ltd.) was added at a ratio of 0.56 parts by weight of a crosslinking agent to 100 parts by weight of an acrylic polymer.
- SK Dyne registered trademark
- E-AX as a crosslinking agent
- the adhesive raw material composition contains ethyl acetate (boiling point: 77 ° C.) as a solvent, and properties such as viscosity are improved as a coating material for coating.
- ethyl acetate boiling point: 77 ° C.
- properties such as viscosity are improved as a coating material for coating.
- the adhesive raw material composition was dried. After applying so as to have a thickness of 50 ⁇ m, the solvent was dried at 90 ° C. for 2 minutes in a drying step to produce a laminate in which an adhesive resin layer was laminated.
- a separator manufactured by Fujimori Kogyo Co., Ltd .; product name; 38E-0010BDAS, thickness 38 ⁇ m
- the adhesive resin film of Example 1 is bonded.
- the reaction between the acrylic polymer and the crosslinking agent is terminated, and there are three types of adhesive properties: a crosslinked acrylic polymer, a urethane acrylate, and a thermal polymerization initiator.
- a resin layer was formed.
- E-AX represents an epoxy curing agent (Soken Chemical Co., Ltd.)
- TD-75 represents an isocyanate curing agent (Soken Chemical Co., Ltd.).
- UV-3310B and UV-1700 represent urethane acrylate trade names (Nippon Synthetic Chemical Industry Co., Ltd.).
- 4HBA represents 4-hydroxybutyl acrylate.
- Perhexa (registered trademark) V is a thermal polymerization initiator containing n-butyl 4,4-bis (t-butylperoxy) valerate as an active ingredient.
- Prorocta® O is a thermal polymerization initiator containing 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanoate as an active ingredient.
- Perbutyl (registered trademark) O is a thermal polymerization initiator containing t-butylperoxy-2-ethylhexanoate as an active ingredient.
- Perhexa (registered trademark) HC is a thermal polymerization initiator containing 1,1-bis (t-hexylperoxy) cyclohexane as an active ingredient.
- Perhexyl (registered trademark) Z is a thermal polymerization initiator containing t-hexyl peroxybenzoate as an active ingredient.
- Irg651 is a photopolymerization initiator containing 2,2-dimethoxy-2-phenylacetophenone (also known as benzyldimethyl ketal) as an active ingredient.
- one flat polyethylene terephthalate (PET) film was prepared, and the other sheet was prepared a polyethylene terephthalate (PET) film having a printing step of 20 ⁇ m on the surface.
- PET polyethylene terephthalate
- the mold molds having mutually smooth surfaces were used so that the outer surface of the base material after pressing (the outer surface of the laminate) was smooth.
- the separator on one side is peeled off from the adhesive resin film in advance and bonded to a PET film on which a printing step is formed, and the smooth PET film on which the printing step is not formed is pasted with a hot press machine. A hot press was performed between the sheets.
- Comparative Examples 1 to 3 foaming was confirmed on the entire surface when released from the hot press.
- Comparative Example 1 since the adhesive raw material composition containing a photopolymerization initiator but not containing a thermal polymerization initiator was heated by a hot press, Comparative Example 2 contains urethane acrylate but does not contain a thermal polymerization initiator. This is probably because the polymerization of the acrylic monomer is difficult to proceed because the adhesive raw material composition was heated with a hot press. Although it is possible to cure by ultraviolet irradiation if it is the formulation of the adhesive raw material composition of Comparative Example 1, it is currently impossible to irradiate ultraviolet rays while being pressed with an opaque mold. It will foam when it is released.
- the adhesive resin layer is bonded to a bonded substrate such as PET in a state of high fluidity, it can be firmly adhered to fine irregularities.
- a highly fluid monomer flows by hot pressing and follows the deformation, and then the thermal polymerization reaction proceeds gradually with heat, and the monomer component becomes polymerized, so the fluidity of the adhesive resin layer decreases. Since it hardens in a deformed state, it is considered that not only bubbles in the deformed portion did not occur, but also foaming between the substrates did not occur.
- Addition of 4HBA having good compatibility as in Example 13 has an effect of ensuring the stability of the paint.
- Example 14 by adding an acrylic monomer having fluidity compared to Example 1, the leveling property at the time of forming the adhesive resin layer was good, and the uniformity of the film thickness tended to be improved. .
- the same evaluation was performed by changing various peroxides.
- the one-minute half-life temperature of the peroxide was about 100 to 200 ° C.
- heat was similarly applied. It was found that it can be bonded with a press.
- the 1-minute half-life temperature was lower than 100 ° C., decomposition of peroxide progressed before hot pressing, and sufficient adhesive strength could not be obtained, and foaming sometimes occurred.
- the one-minute half-life temperature of the peroxide is too high, shrinkage and deterioration of the film base to be used proceed, and heat treatment must be performed in a short time, but this is not preferable because the reaction does not proceed sufficiently.
- Adhesive resin film 11 ... Adhesive resin layer, 11a, 11b ... Both surfaces (adhesive surface) of adhesive resin layer, 12, 13 ... Separator, 12a, 13a ... Surface of separator (peeling surface), 20, 30 ... Laminate, 21, 22 ... Base material, 21a, 22a ... Inner surface, 21b, 22b ... Outer surface, 23 ... Projection, 24 ... Corner of step, 25 ... Adhesive layer after thermosetting, 31, 32 ... Mold , 31a, 32a ... pressing surfaces.
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
本願は、2015年5月18日に出願された日本国特願2015−100644号に基づく優先権を主張し、その内容をここに援用する。
前記熱重合開始剤が過酸化物であることが好ましい。
前記過酸化物が、1分間の半減期を有する温度が100℃以上であることが好ましい。
前記(A)アクリル系ポリマーが、硬化剤により架橋したアクリル系ポリマーであることが好ましい。
前記硬化剤が、イソシアネート系化合物又はエポキシ系化合物の少なくとも1種類を含むことが好ましい。
前記接着性樹脂組成物が、前記(B)ウレタンアクリレート以外の(D)アクリル系モノマーを含有することができる。
また、本発明は、前記接着性樹脂層を介して、2枚の基材が積層されてなることを特徴とする積層体を提供する。
式(1) 温度A<温度C<温度B<温度D
前記段差が、50μm~1mmであることが好ましい。
本発明の接着性樹脂層はその厚みが段差よりも厚いことが好ましい。本発明の接着性樹脂層は厚みが段差の1.1~3倍、例えば5.5μm~3mmが好ましく、55μm~3mmがより好ましく、さらに好ましくは段差の厚みの1.2~2倍、例えば6μm~2mmが好ましく、60μm~2mmがより好ましい。
前記加熱硬化する際の金型の温度が、150~300℃の温度であることが好ましい。
図1に、接着性樹脂フィルム10の一例の断面図を示す。接着性樹脂フィルム10は、2枚のセパレーター12,13と、これらの間に積層された接着性樹脂層11とを有する。接着性樹脂層11を構成する接着性樹脂組成物は、(A)アクリル系ポリマーと、(B)ウレタンアクリレートと、(C)熱重合開始剤とを含有する。接着性樹脂層11の両面11a,11bは、常温で粘着性を有する(粘着面となっている)。
なお、本明細書中において「常温」とは、約3℃~約40℃であり、好ましくは約10℃~約30℃であり、より好ましくは約15℃~約25℃であり、最も好ましくは約23℃である。
第2の積層方法として、平坦な基材22に接着性樹脂層11を積層し、その後オートクレーブ処理を実施し、接着性樹脂層11の上に、凹凸を有した基材21を積層した後、もしくは基材21を積層させながら、金型31,32を用いて接着性樹脂層11を加熱硬化させる方法が挙げられる。
第3の積層方法として、凹凸を有した基材21、接着性樹脂層11、平坦な基材22を同時に積層した後、もしくは積層すると同時に、金型31,32を用いて接着性樹脂層11を加熱硬化させる方法が挙げられる。
本発明の接着性樹脂層の製造に用いる接着剤原材料組成物は、有機溶剤に溶解している方が、より厚みの精度良く塗布することが可能となるため、有機溶剤を含むことが好ましい。接着剤原材料組成物から溶剤を乾燥することで、接着性樹脂層が得られる。つまり、接着剤原材料組成物の組成は、接着性樹脂層を構成する接着性樹脂組成物の組成に、溶剤を加えたものであってもよい。接着性樹脂層は、常温では(熱硬化前)、粘着剤層として機能することができる。
アミド基(−CONR2,Rは水素原子又はアルキル基等の置換基)を有するアクリル系モノマーとしては、アクリルアミド、メタクリルアミド等が挙げられる。
ニトリル基(−CN)を有するアクリル系モノマーとしては、アクリロニトリル、メタクリロニトリル等が挙げられる。
(A)アクリル系ポリマー100重量部に対して、(B)ウレタンアクリレートの添加量が2~50重量部であることが好ましい。当該添加量は、40重量部以下とすることもできる。
(E)架橋剤(硬化剤)による(A)アクリル系ポリマーの硬化は、被着体に貼合する前の接着性樹脂層を製造する段階で、エージングにより進行させてもよい。
本発明における接着性樹脂層(トランスファーテープ)は、接着剤原材料組成物をセパレーターフィルムに溶媒を含んだ状態で塗布し、乾燥し、さらにセパレーターフィルムにより保護されることで製造することができる。接着剤原材料組成物は、ダイ又はパイプドクターを用いて塗布することが好ましい。溶剤の乾燥においては、ドライヤー等で乾燥させることが好ましい。溶媒の乾燥時間に関しては、生産性を考慮すると、10分間以下であることが好ましく、2~5分間であることがさらに好ましい。また、有機溶媒を十分に乾燥することが必要なため、有機溶媒の沸点以上の温度で乾燥させることが好ましく、熱重合開始剤の1分間半減期温度以下での乾燥をすることが好ましい。
本発明のプレス時において、積層体への加熱温度が100~250℃となる熱をかけるために、金型の温度は所望の加熱温度よりも高い温度で加熱することが必要である。金型の温度は100~300℃が好ましく、さらに好ましくは150~300℃である。基材もしくは基材の一部にポリエチレンテレフタレートを含み、そのポリエチレンテレフタレートを例えば180℃、10分間程度で加熱したときに、エチレンテレフタレートオリゴマー成分が析出し、析出した成分により外観不良が起こる場合は、熱プレス時の加熱温度を180℃以下とすることが好ましい。
基材にポリエチレンテレフタレートを含まず、エチレンテレフタレートオリゴマー成分の析出のない素材を用いたときは100~300℃とすればよい。本発明においてのプレス時間に関しては生産性の観点から2分間以内で反応が終わることが好ましい。また、プレス温度・時間に関しては、積層体の強度が十分になるように設定することができる。
(A)アクリル系ポリマーを含むポリマー溶液として、SKダイン(登録商標)2094(綜研化学株式会社、酸価:33、数平均分子量7万、固形分濃度25%)、架橋剤としてE−AX(綜研化学株式会社)を用い、アクリル系ポリマー100重量部に対して、架橋剤0.56重量部の割合で配合した。得られた混合物に、(B)ウレタンアクリレートとして、UV−3310B(日本合成化学工業株式会社、60℃での粘度:40000~70000mPa・s、重量平均分子量Mw:5000、オリゴマー官能基数:2)20重量部と、(C)熱重合開始剤として、n−ブチル4,4−ビス(t−ブチルペルオキシ)バレレート(日油株式会社製;製品名:パーヘキサ(登録商標)V)0.04重量部とを加えて、接着剤原材料組成物を調製した。接着剤原材料組成物は、溶媒として、酢酸エチル(沸点77℃)を含み、コーティングするための塗料として、粘度等の性状が改善されている。
その接着剤原材料組成物を、セパレーター(藤森工業株式会社製;製品名:125E−0010DG2.5AS、厚み125μm)の上面に、アプリケーターを用いて、乾燥後における接着剤樹脂層(粘着剤層)の厚みが50μmとなるように塗布した後、乾燥工程において90℃、2分間の条件で溶剤を乾燥させて接着性樹脂層が積層された積層体を作製した。
次に、得られた積層体の接着性樹脂層の上面に、セパレーター(藤森工業株式会社製;製品名;38E−0010BDAS、厚み38μm)を貼合して、実施例1の接着性樹脂フィルムを作製した。
その後、1週間のエージングを行うことで、アクリル系ポリマーと架橋剤との反応を終了させて、架橋されたアクリル系ポリマーと、ウレタンアクリレートと、熱重合開始剤との3種類が存在する接着性樹脂層を形成した。
次に、評価方法及びその結果について、説明する。
基材として、1枚は平坦なポリエチレンテレフタレート(PET)フィルムを用意し、もう1枚には表面に20μmの印刷段差を形成したポリエチレンテレフタレート(PET)フィルムを用意した。金型には、プレス後の基材の外面(積層体の外面)が平滑になるように金型がお互いに平滑な表面を持つ金型を使用した。事前に接着性樹脂フィルムから片側のセパレーターを剥離して印刷段差を形成したPETフィルムに貼合し、その貼合フィルムと印刷段差が形成されていない平滑なPETフィルムを熱プレス機で金型の間にはさみ、熱プレスを行った。熱プレス直後に貼合後の積層体(貼合品)の外観を目視にて確認し、外観は、下記のように評価を行った。
○:積層体面上に気泡、欠陥が目視にて観察されず外観が良好であった。
△:積層体面上に気泡、もしくは欠陥がわずかに目視にて観察されたが、実害のないレベルの外観であった。
×:積層体面上に気泡、もしくは欠陥が目視にて観察され、外観が許容範囲外であった。
また、段差追従性は、下記のように評価を行った。
○:印刷段差部分に気泡が確認できない。
△:印刷段差部分にごくわずかに気泡が確認できる。
×:印刷段差部分に気泡が確認できる。
接着強度の評価は、熱プレス後の積層体(貼合品)の接着強度の測定値に基づき、下記のように評価を行った。接着性樹脂フィルムの一方のセパレーターを剥離して、接着性樹脂層の片面を厚さ100μmのポリエチレンテレフタレート(PET)フィルムに貼合し、さらに他方のセパレーターを剥離して、粘着剤層の逆面を被着体とする厚み1mmのソーダライムガラスに貼合後23℃、50%RH環境下に1時間放置後、剥離速度300mm/minで剥離させ、その180°剥離強度を測定した。
○:接着強度が20N/25mm以上。
△:接着強度が5N/25mm以上20N/25mm未満。
×:接着強度が5N/25mm未満。
◎:外観、段差追従性及び接着強度のすべてが「○」である。
○:外観、段差追従性及び接着強度のすべてが「△」又は「○」で、少なくともひとつが「△」で、「△」より「○」の数が多い。
△:外観、段差追従性及び接着強度のすべてが「△」又は「○」で、「○」より「△」の数が多い。
×:外観、段差追従性及び接着強度の少なくともひとつが「×」である。
実施例では、印刷段差に追従していることが確認できた。これは、(A)アクリル系ポリマー以外に、流動性の高い成分として(B)ウレタンアクリレートを接着剤原材料組成物に添加したためと考えられる。
比較例1の接着剤原材料組成物の処方であれば紫外線照射により硬化させることも可能だが、不透明な金型でプレスされた状態のまま紫外線を照射することが現時点では不可能であり、プレス状態が解放された時点で発泡してしまう。そのため熱プレス中に反応を進める必要があり、この思想を実現できる手法であれば何でも構わないが、新しい製造設備投資が不必要でかつ工程も増やす必要がない、熱反応開始剤を使用する方法が一番有効であると考えられる。
Claims (8)
- 透明性を有するアクリル系の接着性樹脂組成物を含む単層の接着性樹脂層であって、
前記接着性樹脂組成物が、少なくとも(A)アクリル系ポリマーと、(B)ウレタンアクリレートと、(C)熱重合開始剤とを含有し、
前記接着性樹脂層が、常温で両面に粘着性を有し、100~250℃の温度及び30秒~10分の時間の加熱により熱硬化することができることを特徴とする接着性樹脂層。 - 前記(A)アクリル系ポリマー100重量部に対して、前記(B)ウレタンアクリレートの添加量が2~50重量部であることを特徴とする請求項1に記載の接着性樹脂層。
- 前記熱重合開始剤が過酸化物であることを特徴とする請求項1又は2に記載の接着性樹脂層。
- 前記過酸化物が、1分間の半減期を有する温度が100℃以上であることを特徴とする請求項3に記載の接着性樹脂層。
- 前記(A)アクリル系ポリマーが、硬化剤により架橋したアクリル系ポリマーであることを特徴とする請求項1~4のいずれかに記載の接着性樹脂層。
- 前記硬化剤が、イソシアネート系化合物又はエポキシ系化合物の少なくとも1種類を含むことを特徴とする請求項5に記載の接着性樹脂層。
- 前記接着性樹脂組成物が、前記(B)ウレタンアクリレート以外の(D)アクリル系モノマーを含有することを特徴とする請求項1~6のいずれかに記載の接着性樹脂層。
- 請求項1~7のいずれかに記載の接着性樹脂層が、2枚のセパレーターの間に積層されてなることを特徴とする接着性樹脂フィルム。
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KR1020177021575A KR101978149B1 (ko) | 2015-05-18 | 2016-02-29 | 접착성 수지층 및 접착성 수지 필름 |
CN202410421249.3A CN118185501A (zh) | 2015-05-18 | 2016-02-29 | 粘接性树脂层以及粘接性树脂膜 |
CN201680008028.7A CN108473830A (zh) | 2015-05-18 | 2016-02-29 | 粘接性树脂层以及粘接性树脂膜 |
US15/548,307 US10604683B2 (en) | 2015-05-18 | 2016-02-29 | Adhesive resin layer and adhesive resin film |
EP16795956.8A EP3239259B1 (en) | 2015-05-18 | 2016-02-29 | Adhesive resin layer and adhesive resin film |
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JP6632115B2 (ja) * | 2015-07-17 | 2020-01-15 | 藤森工業株式会社 | 接着性樹脂層及び接着性樹脂フィルム |
JP2017061676A (ja) * | 2015-09-25 | 2017-03-30 | 日本合成化学工業株式会社 | 接着剤組成物、それを用いた積層体及びその製造方法 |
JP6926602B2 (ja) * | 2017-03-31 | 2021-08-25 | 大日本印刷株式会社 | 耐チッピング性を備えた加飾成形体 |
JP2019025900A (ja) * | 2017-07-28 | 2019-02-21 | 株式会社ダイセル | 積層体、及び前記積層体を備えたフレキシブルデバイス |
WO2019021557A1 (ja) * | 2017-07-28 | 2019-01-31 | 株式会社ダイセル | 積層体、及び前記積層体を備えたフレキシブルデバイス |
JP6914156B2 (ja) * | 2017-09-19 | 2021-08-04 | 藤森工業株式会社 | 積層構造体の製造方法 |
JP6999339B2 (ja) * | 2017-09-19 | 2022-01-18 | 藤森工業株式会社 | 成形体の製造方法 |
KR102239210B1 (ko) * | 2018-06-04 | 2021-04-09 | 주식회사 엘지화학 | 백 그라인딩 테이프 |
TW202124549A (zh) * | 2019-12-25 | 2021-07-01 | 日商Dic股份有限公司 | 預浸體及成形品 |
KR102271763B1 (ko) * | 2020-02-18 | 2021-07-01 | 한국기술교육대학교 산학협력단 | 열경화성 급속 경화 접착제 조성물 |
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US20180022971A1 (en) | 2018-01-25 |
EP3239259A1 (en) | 2017-11-01 |
KR101978149B1 (ko) | 2019-05-14 |
JP6583991B2 (ja) | 2019-10-02 |
JP2016216554A (ja) | 2016-12-22 |
CN118185501A (zh) | 2024-06-14 |
TW201641648A (zh) | 2016-12-01 |
US10604683B2 (en) | 2020-03-31 |
EP3239259A4 (en) | 2018-06-27 |
CN108473830A (zh) | 2018-08-31 |
KR20170102327A (ko) | 2017-09-08 |
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TWI687498B (zh) | 2020-03-11 |
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