WO2016170648A1 - 回転検出装置および回転検出装置の製造方法 - Google Patents
回転検出装置および回転検出装置の製造方法 Download PDFInfo
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- WO2016170648A1 WO2016170648A1 PCT/JP2015/062407 JP2015062407W WO2016170648A1 WO 2016170648 A1 WO2016170648 A1 WO 2016170648A1 JP 2015062407 W JP2015062407 W JP 2015062407W WO 2016170648 A1 WO2016170648 A1 WO 2016170648A1
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- composite magnetic
- magnetic wire
- circuit board
- rotation
- detection device
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
- G01D5/14—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage
- G01D5/20—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying inductance, e.g. by a movable armature
- G01D5/2006—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying inductance, e.g. by a movable armature by influencing the self-induction of one or more coils
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
- G01D5/244—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing characteristics of pulses or pulse trains; generating pulses or pulse trains
- G01D5/245—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing characteristics of pulses or pulse trains; generating pulses or pulse trains using a variable number of pulses in a train
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P3/00—Measuring linear or angular speed; Measuring differences of linear or angular speeds
- G01P3/42—Devices characterised by the use of electric or magnetic means
- G01P3/44—Devices characterised by the use of electric or magnetic means for measuring angular speed
- G01P3/48—Devices characterised by the use of electric or magnetic means for measuring angular speed by measuring frequency of generated current or voltage
- G01P3/481—Devices characterised by the use of electric or magnetic means for measuring angular speed by measuring frequency of generated current or voltage of pulse signals
- G01P3/4815—Devices characterised by the use of electric or magnetic means for measuring angular speed by measuring frequency of generated current or voltage of pulse signals using a pulse wire sensor, e.g. Wiegand wire
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P3/00—Measuring linear or angular speed; Measuring differences of linear or angular speeds
- G01P3/42—Devices characterised by the use of electric or magnetic means
- G01P3/44—Devices characterised by the use of electric or magnetic means for measuring angular speed
- G01P3/48—Devices characterised by the use of electric or magnetic means for measuring angular speed by measuring frequency of generated current or voltage
- G01P3/481—Devices characterised by the use of electric or magnetic means for measuring angular speed by measuring frequency of generated current or voltage of pulse signals
- G01P3/487—Devices characterised by the use of electric or magnetic means for measuring angular speed by measuring frequency of generated current or voltage of pulse signals delivered by rotating magnets
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/0052—Manufacturing aspects; Manufacturing of single devices, i.e. of semiconductor magnetic sensor chips
Definitions
- the present invention relates to a rotation detection device and a method for manufacturing the rotation detection device, and is a rotation detection device used in various fields including industrial FA equipment or in-vehicle use, and more particularly, a composite magnetic wire and a pickup coil.
- the present invention relates to a rotation detection device using self-power generation.
- a composite magnetic wire is formed by solidifying a double-structured magnetic body having a core portion and a shell portion, repeating drawing and heat treatment, and then twisting, near the S / N pole boundary of the magnet. It is known to have a so-called large Barkhausen effect, which is a phenomenon of simultaneous magnetization reversal.
- a constant power generation pulse can always be obtained regardless of the rotational speed of the object to be detected such as a motor. Therefore, the composite magnetic wire is widely used in rotation detection devices. It has been.
- Patent Document 1 As a rotation speed detector by self-power generation using a composite magnetic wire and a pickup coil, techniques shown in Patent Document 1 to Patent Document 3 are disclosed.
- the rotational speed detector of Patent Document 1 uses a power generator that combines a magnet with one S / N pole, a composite magnetic wire having a large Barkhausen effect, and a pickup coil.
- a technique for performing power backup of the detector by supply is disclosed.
- two power generation elements having a phase difference of 90 degrees with respect to one rotation are arranged.
- JP 2008-14799 A Japanese Utility Model Publication No. 63-117504 International Publication No. 2014-128937
- the power generation element takes a form in which a coil made of a metal wire is wound around a composite magnetic wire, and the power generation element is arranged on a circuit board as a rotation detector, The current generated by the element is detected.
- the diameter of the composite magnetic wire is generally about 0.5 mm
- the diameter of the pickup coil wound around the composite magnetic wire is about 5 mm.
- a space for a thickness of 5 mm or more is required, and the thickness of the detector increases.
- the length of the composite magnetic wire and the pickup coil is generally required to be about 10 mm or more and 20 mm or less in order to secure the amount of power generation, and the power generation element is arranged on the circuit board. In order to achieve this, it is necessary to secure a mounting space of about 5 mm ⁇ 10 mm to 20 mm on the circuit board.
- the detector needs to be downsized with the miniaturization of machine tools and the like and the high density arrangement of equipment every year, and the above two problems are obstacles to downsizing of the thickness or outer dimensions of the detector. .
- the present invention has been made in view of the above, and an object of the present invention is to obtain a thin, yet small and highly accurate rotation detection device.
- the present invention provides a detection magnet attached to a rotating body that rotates about a rotation axis, and a rotating magnet that is disposed opposite the detection magnet. And a detecting unit for detecting.
- the detection unit is provided in a multilayer circuit board and an intermediate layer of the circuit board, and has a groove part having a center on the extension line of the rotation axis and perpendicular to the rotation axis, and a large Barkhausen effect incorporated in the groove part. It is composed of a composite magnetic wire, and a pickup coil that is formed of a wiring conductor on a circuit board and a conductor filled in a through hole and surrounds the composite magnetic wire.
- FIG. 3 is a perspective view showing a schematic configuration of the rotation detection device according to the first embodiment.
- 1 is an exploded perspective view of a rotation detection device according to a first embodiment.
- Top view showing an upper substrate of the circuit board of the rotation detection device of the first embodiment
- Top view showing an intermediate layer substrate of the circuit board of the rotation detecting device of the first embodiment
- the bottom view which shows the lower layer board
- FIGS. 4A to 4F are cross-sectional views showing a manufacturing process of a circuit board of the rotation detection device according to the first embodiment.
- Sectional drawing of the circuit board of the rotation detection apparatus of Embodiment 2. A perspective view showing a schematic configuration of a rotation detection device according to a third embodiment.
- FIG. 4 is an exploded perspective view of the rotation detection device according to the third embodiment.
- 4 is an exploded perspective view of a rotation detection device according to a fourth embodiment.
- (A) And (b) is process sectional drawing which shows the manufacturing process of the composite magnetic wire used at the manufacturing process of the rotation detector of Embodiment 5.
- (A) to (e) is a process cross-sectional view illustrating a manufacturing process of a circuit board of the rotation detection device of the fifth embodiment.
- FIG. 1 is a perspective view of a schematic configuration of the rotation detection device according to the first embodiment.
- 2 is an exploded perspective view of the rotation detection device of the first embodiment
- FIG. 3 is a top view showing an upper layer substrate of the circuit board of the rotation detection device of the first embodiment
- FIG. 4 is a rotation of the first embodiment.
- FIG. 5 is a bottom view showing a lower layer substrate of the circuit board of the rotation detection device according to the first embodiment.
- FIG. 6 is a cross-sectional view of the circuit board of the rotation detection device according to the first embodiment
- FIG. 7 is a diagram showing a mounting state of the composite magnetic coil of the rotation detection device according to the first embodiment.
- FIGS. 8A to 8F are cross-sectional views showing the circuit board manufacturing process of the rotation detection device of the first embodiment.
- the rotation detection device of the present invention is opposed to a detection magnet 200 attached to a rotation shaft 100 that is a rotating body that rotates about a rotation axis X 0 , and the detection magnet 200.
- a detection unit 300 that detects the number of rotations of the rotary shaft 100.
- the detection unit 300 includes a circuit board 301 having a three-layer structure including an upper layer part 310, an intermediate layer 320, and a lower layer part 330.
- the detection unit 300 is provided in the intermediate layer 320 of the circuit board 301, and is embedded in the groove 340 having a center O 0 and perpendicular to the rotation axis X 0 on the extension line of the rotation axis X 0.
- the composite magnetic wire 350 having a large Barkhausen effect and a pickup coil 360 surrounding the composite magnetic wire 350 are configured.
- the pickup coil 360 is formed by wirings 312 and 332 on the circuit board 301 and a conductor 333 filled in the through hole TH.
- a circuit element 410 constituting the signal processing circuit 400 is mounted on the circuit board 301.
- the detection magnet 200 is attached to the rotary shaft 100 and rotates integrally.
- the composite magnetic wire 350 has a core part 350a of picalloy and a shell part 350b of a reminder, and a double structure in which the contact part between the core part 350a and the shell part 350b is plated with nickel.
- the magnetic material was made into a solid solution, and the wire drawing and heat treatment were repeated, and 96% wire drawing and twisting of 5 or 6 revolutions per meter were performed.
- the composite magnetic wire 350 is disposed inside the circuit board 301 disposed to face the detection magnet 200, and causes magnetization reversal due to the large Barkhausen effect as the detection magnet 200 rotates.
- the pickup coil 360 is a built-in coil formed of wiring and through-holes TH in a multilayer circuit board, and converts the magnetization reversal of the composite magnetic wire 350 into a voltage pulse.
- the signal processing circuit 400 processes the pulse voltage from the pickup coil 360 by the circuit element 410 mounted on the circuit board 301.
- the signal processing circuit 400 includes, for example, a magnetic sensor for determining the rotation direction using voltage pulses generated from the pickup coil 360, a counter for processing the pulse voltage generated from the pickup coil 360 and counting the number of rotations, and a count value.
- a memory for storage, a power generation circuit for driving these circuits using the power of the pulse voltage generated from the pickup coil 360, and the like are included.
- the detection magnet 200 is a radially magnetized magnet in which one S pole and one N pole are magnetized, and is attached so that the rotation axis X 0 of the rotary shaft 100 and the center O 1 of the detection magnet 200 substantially coincide. It has been.
- the circuit board 301 is disposed above the detection magnet 200 and is positioned so that the center O 0 of the composite magnetic wire 350 disposed in the center of the circuit board 301 is above the rotation axis X 0 of the rotation shaft 100.
- the circuit board 301 is formed in a disk shape, but a polygonal board such as a quadrangle or an octagon may be used.
- the circuit board 301 has three layers. 3 to 5 are top views showing an upper layer part 310 that is an upper layer substrate, an intermediate layer 320 that is an intermediate layer substrate, and a lower layer part 330 that is a lower layer substrate.
- the upper layer portion 310 corresponding to the first layer of the circuit board 301 is formed by patterning a glass epoxy substrate which is an insulating substrate 311 and a copper foil formed on the insulating substrate 311 as shown in FIG. Wiring 312.
- the second layer that is, the intermediate layer 320 includes a glass epoxy substrate which is an insulating substrate 321, a concave groove 340 formed in the insulating substrate 321, and a composite magnetic mounted in the concave groove 340. And a wire 350.
- the lower layer portion 330 corresponding to the third layer is a wiring formed by patterning a glass epoxy substrate which is an insulating substrate 331 and a copper foil formed on the insulating substrate 331. 332.
- the wiring 312 of the upper layer part 310 and the through hole TH for connecting the wiring 332 formed on the lower surface of the lower layer part 330 of the third layer through the intermediate layer 320 are constituted.
- the wiring pattern 312-1 constituting the upper layer wiring 312 connects the through holes TH-1 and TH-2
- the wiring pattern 312-2 includes the through holes TH-3 and TH-2. -4.
- a wiring pattern 332-1 constituting the wiring 332 of the insulating substrate 331 in the lower layer part 330 connects the through holes TH-1 and TH-3.
- the wiring patterns of the upper layer portion 310 that is the first layer and the lower layer portion 330 that is the third layer are connected to each other by the through-hole TH to form the pickup coil 360.
- FIG. 4 is a top view of an intermediate layer which is an intermediate layer substrate.
- a concave groove 340 having a U-shaped cross section is formed at the center of the second-layer circuit board 301, and a composite magnetic wire 350 is disposed therein.
- the U-shape is half of the length L of the composite magnetic wire 350, that is, L / 2, from the center O 2 of the intermediate layer 320 to the end surface in the longitudinal direction of the concave groove 340 having a U-shaped cross section.
- the composite magnetic wire 350 is abutted against the end surface of the U-shaped concave groove 340 in the longitudinal direction so that the center of the substrate and the longitudinal center of the composite magnetic wire 350 can be accurately positioned. .
- the composite magnetic wire 350 is fixed by filling the remaining space with resin or the like.
- FIG. 6 is a cross-sectional view showing a cross section of the circuit board 301 in the thickness direction.
- Wirings 312 and 332 are formed on the upper surface of the upper layer portion 310 that is the first layer and the lower surface of the lower layer portion 330 that is the third layer, and the first and third wiring layers 312 and 332 are connected through the through holes TH.
- the pickup coil 360 is formed.
- a composite magnetic wire 350 is disposed in the U-shaped portion of the second layer.
- the insulating substrate 311 of the upper layer portion 310 and the insulating substrate 331 of the lower layer portion 330 are desirably as thin as possible.
- a stopper 370 made of a soft magnetic material such as ferrite may be attached to both ends of the pickup coil 360.
- a stopper 370 is embedded and formed only at one end and used as a stopper when the composite magnetic wire 350 is inserted. Accuracy can be increased.
- the other end may be covered with a stopper 370 made of a soft magnetic material until the composite magnetic wire 350 is reached after the composite magnetic wire 350 is inserted.
- FIG. 8A to 8F are process cross-sectional views illustrating the manufacturing process of the rotation detection device according to the first embodiment.
- a copper foil 312S to be a wiring 312 is attached to an insulating substrate 311 made of a glass epoxy substrate.
- the copper foil is patterned by photolithography to form the wiring 312.
- a copper foil 332 ⁇ / b> S that becomes the wiring 332 is similarly attached to the insulating substrate 331 constituting the lower layer portion 330.
- the copper foil is patterned by photolithography to form the wiring 332.
- an insulating substrate 321 made of a glass epoxy substrate is prepared as shown in FIG. 8C, and a concave groove 340 is formed by laser processing as shown in FIG. 8D.
- the concave groove 340 may be formed through the intermediate layer 320.
- middle layer 320, and the lower layer part 330 are laminated
- the circuit board 301 is irradiated with laser so as to penetrate the upper layer portion 310, the intermediate layer 320, and the lower layer portion 330, thereby forming the through hole TH.
- the through hole TH is filled with a metal film.
- the composite magnetic coil 350 is inserted into the concave groove 340 of the circuit board 301 thus formed. At the time of insertion, it is inserted until it hits a stopper 370 made of ferrite on the back side, and a stopper 370 made of ferrite is mounted on the opening side. After that, positioning is performed with respect to the detection magnet 200 formed on the top surface of the rotation shaft 100, and the circuit board 301 constituting the detection unit is fixed with a fixture (not shown), and the rotation detection device shown in FIG. can get.
- the circuit board 301 having a multilayer wiring structure is formed by using the intermediate layer 320 in which the concave groove 340 is formed, and then the composite magnetic wire 350 is inserted into the concave groove 340. Therefore, it is possible to perform highly reliable rotation detection without degrading measurement accuracy due to characteristic breakage. Further, since the composite magnetic wire 350 is disposed in the concave groove 340, it can be protected from external force not only during manufacture but also during use, and characteristic deterioration can be suppressed. Further, the positional relationship with the pickup coil 360 can be reliably controlled only by aligning the concave groove 340 and arranging the composite magnetic wire 350.
- the pickup coil 360 since the pickup coil 360 has a configuration built as a combination of wiring patterns on the circuit board 301 having a multilayer wiring structure, it is in a fixed state, and the positional accuracy can be maintained extremely well.
- the rotation detection device it is necessary to mount a large number of electronic components on the surface of the circuit board 301.
- the rotation detection devices shown in Patent Documents 1 to 3 the mounting area of the electronic components is ensured. Was extremely difficult.
- the rotation detection device of the first embodiment has a structure in which the pickup coil 360 and the composite magnetic wire 350 are formed in the circuit board 301, a large number of mounting parts can be mounted on the surface, and the thickness is thin. And miniaturization can be achieved.
- the rotation detection device of the first embodiment it is possible to significantly reduce the thickness as compared with a detection unit in which a coil is wound around a conventional composite magnetic wire. Since the pickup coil is formed by the wiring pattern of the board, it is possible to save the component mounting space on the board. There is no need to separately mount a power generation element as a detection unit, and the mounting failure factor is reduced, and thus the reliability is improved.
- the circuit board 301 has three layers, but the present embodiment is not limited to three layers, and may be, for example, a substrate having four or more layers.
- the circuit element 410 constituting the signal processing circuit 400 is composed of a general electronic component, and the height of a semiconductor integrated circuit (IC: Integrated Circuit) constituting the electronic component is generally about 1 mm or more and less than 2 mm.
- IC Integrated Circuit
- a power generation element having an outer diameter of about 5 mm is mounted on the substrate, so that the thickness direction dimension of the rotation detector increases due to the effect of the power generation element that is taller than other components.
- the thickness direction dimension of the detection unit which is a power generation portion, is almost equal to the substrate thickness, and the thickness direction dimension of the detection unit can be greatly reduced. it can.
- the power generation element that constitutes the conventional detection unit is fixed on the circuit board by soldering, there is a concern that the size is large and the weight is low, so there is a concern about a decrease in reliability with respect to vibration or the like. Since the circuit board and the detection unit, which is the power generation unit, are integrated, there is almost no increase in volume, and the weight is an increase of only the composite magnetic wire 350, there is almost no connection due to soldering, etc. Since it can be realized, it is possible to improve reliability against vibration and impact. In addition, although it is difficult to make a surface mounting component from the viewpoint of weight and volume with the conventional power generation element, in this embodiment, since it is integrated with the circuit board 301, all the ICs of the signal processing circuit 400 are surface mounted. By configuring with components, it is possible to simplify board mounting.
- the power generation efficiency is highest when the composite magnetic wire is arranged on the rotation center line of the magnet, and in order to realize this, a groove is provided in the groove where the composite magnetic wire is arranged, and the magnet and the composite magnetic wire are positioned. Do. As a specific method, it is desirable that a U-shaped groove is provided on the substrate and a composite magnetic wire is abutted on the groove and positioned. However, it is not always necessary to dispose the composite magnetic wire on the rotation center line of the magnet, and it goes without saying that it may be slightly shifted for the purpose of mounting other components.
- the depth of the groove 340 can be selected as appropriate, but the thickness should be set so that the total thickness of the three layers of the insulating substrates 311, 321, and 331 becomes the diameter of the composite magnetic wire. Thus, the play of the composite magnetic wire can be reduced. This point will be described later.
- FIG. 9 is a cross-sectional view of the circuit board of the rotation detection device according to the second embodiment, and particularly shows a cross-section of the power generation unit constituting the detection unit.
- the rotation detection device according to the second embodiment is different from the first embodiment in a circuit board 301S that constitutes a detection unit.
- the circuit board 301S is composed of five layers, and wiring is arranged in the first layer, the second layer, the fourth layer, and the fifth layer, and the composite magnetic wire 350 is arranged in the third layer. ing.
- An inner pickup coil 360 i formed of the second and fourth layers and an outer pickup coil 360 o formed of the first and fifth layers are serially connected to the composite magnetic wire 350 through a through hole (not shown) at the coil end. It is connected to the.
- a larger amount of pulse voltage is obtained by winding the pickup coil twice around the composite magnetic wire 350.
- the composite magnetic wire 350 includes a core part 350a and a shell part 350b.
- the second layer corresponds to the upper layer portion 310
- the third layer corresponds to the intermediate layer 320
- the fourth layer corresponds to the lower layer portion 330
- the first layer corresponds to the uppermost layer portion 380
- the fifth layer corresponds to the lowermost layer portion 390.
- the uppermost layer portion 380 and the lowermost layer portion 390 are further laminated outside the upper layer portion 310 and the lower layer portion 330 of the rotation detection device of the first embodiment.
- the uppermost layer portion 380 includes a wiring 382 formed by patterning a copper foil formed on the insulating substrate 381.
- the lowermost layer portion 390 includes a wiring 392 formed by patterning a copper foil formed on the insulating substrate 391.
- an outer pickup coil 360 o is formed by a metal conductor 393 filled in an outer through hole TH O that penetrates the wiring 382 of the uppermost layer portion 380 and the wiring 392 of the lowermost layer portion 390.
- a material substrate constituting two layers of the uppermost layer part 380 and the lowermost layer part 390 is bonded to the outside. Then, patterning is performed by photolithography. Thereafter, an outer through hole TH O penetrating from the uppermost layer portion 380 to the lowermost layer portion 390 is formed. Finally, the metal conductor 393 is filled in the outer through hole TH O and the composite magnetic wire 350 is inserted into the concave groove 340 to form the detection unit shown in FIG.
- the pickup coil is constituted by a double coil, but it can be constituted by a multilayer coil such as a triple coil or a quadruple coil.
- a multilayer coil such as a triple coil or a quadruple coil.
- FIG. 10 is a perspective view illustrating a schematic configuration of the rotation detection device according to the third embodiment
- FIG. 11 is an exploded perspective view of the rotation detection device according to the third embodiment
- FIG. 12 is a diagram illustrating the rotation detection device according to the third embodiment. It is sectional drawing of a circuit board.
- the rotation detection device according to the third embodiment incorporates a first composite magnetic wire 350A and a second composite magnetic wire 350B that are orthogonal to each other on the central axis of the circuit board 301SS.
- a circuit board 301SS surrounding the first composite magnetic wire 350A and the second composite magnetic wire 350B is a disk-shaped substrate having a center O 0 on an extension line of the rotation axis X 0 . Then, the first pickup coil 360A and the second pickup coil 360B, which are formed of the wiring in the circuit board 301SS and the metal conductor filled in the through hole, are connected to the first composite magnetic wire 350A and the second composite coil.
- the magnetic wire 350B is uniformly wound over the entire length direction.
- the detection unit has a two-layer structure, and another composite magnetic wire orthogonal to the composite magnetic wire 350 is placed below the detection unit having the composite magnetic wire 350 shown in the first embodiment.
- the stacked point is different from that of the first embodiment. That is, the first composite magnetic wire 350A and the second composite magnetic wire 350B orthogonal to the first composite magnetic wire 350A are stacked below the first composite magnetic wire 350A.
- Other portions are formed in the same manner as the rotation detection device of the first embodiment. Although the description is omitted here, the same parts are denoted by the same reference numerals.
- the first layer is the upper layer portion 310
- the second layer is the intermediate layer 320
- the third layer is the lower layer portion 330
- the fourth layer is the connection layer 500
- the fifth layer is the lower upper layer portion 510
- the sixth layer Corresponds to the lower intermediate layer 520
- the seventh layer corresponds to the lower lower layer portion 530.
- the circuit board 301SS is composed of seven layers, and the pattern wiring is provided in the first layer, the third layer, the fifth layer, and the seventh layer, and the first and second layers are provided in the second layer and the sixth layer.
- Composite magnetic wires 350A and 350B are disposed.
- the reversal magnetic field of the first composite magnetic wire 350A in the second layer is converted into a pulse voltage by the first pickup coils 360A in the first and third layers, and the second composite magnetic wire 350B in the sixth layer is converted into a pulse voltage.
- the reversed magnetic field is converted into a pulse voltage by the second pickup coil 360B in the fifth and seventh layers.
- the first composite magnetic wire 350A and the second composite magnetic wire 350B are arranged to be orthogonal to each other by 90 ° when viewed from above.
- connection layer 500 is composed of an insulating substrate.
- the lower upper layer portion 510 is composed of a wiring 512 formed by patterning a copper foil formed on the insulating substrate 511, similarly to the upper substrate used in the first embodiment.
- the lower intermediate layer 520 is formed by forming a groove 540 in the insulating substrate 521.
- the lower lower layer portion 530 includes a wiring 532 formed by patterning a copper foil formed on the insulating substrate 531. And the laminated body of the lower upper layer part 510, the lower intermediate layer 520, and the lower lower layer part 530 is connected via the connection layer 500. Further, a second pickup coil 360 ⁇ / b> B is formed by a metal conductor 533 filled in the through hole TH that penetrates the wiring 512 of the lower upper layer portion 510 and the wiring 532 of the lower lower layer portion 530.
- the first pickup coil 360A is formed by the metal conductor 333 filled in the through hole TH that penetrates the wiring 312 of the upper layer portion 310 and the wiring 332 of the lower layer portion 330. Has been.
- the first pickup coil 360A on the upper layer side and the second pickup coil 360B on the lower layer side are arranged in directions orthogonal to each other.
- the first and second detectors formed in the same manner as in the process of FIG. 8 are combined in the circuit board 301SS obtained by connecting them in a direction orthogonal to each other via the connection layer 500.
- the detection part shown in FIG. 12 is formed by inserting the wires 350A and 350B.
- a rotation direction can be discriminate
- the pickup coil can be wound to the center with respect to the two first and second composite magnetic wires 350A and 350B.
- the magnetization reversal can be picked up by the pickup coil, and the amount of power generation can be obtained efficiently and the thickness of the entire detection device can be reduced.
- the rotation detection device of the third embodiment it is possible to efficiently generate power generation pulses from a plurality of power generation elements by arranging a plurality of composite magnetic wires above the rotation center of the detection magnet, and easily rotate. Direction detection can be performed.
- the rotation detection device of the third embodiment there is no need to dispose the magnetic sensor such as the Hall element for determining the rotation direction as in the first embodiment, and it is not necessary to determine the rotation direction. You can save.
- the two-channel type using a seven-layer substrate and two composite magnetic wires has been described.
- the present embodiment is not limited to this, and for example, as disclosed in Patent Document 3, a pulse is used.
- a three-channel type using three composite magnetic wires and an 11-layer substrate can be realized.
- the two composite magnetic wires are arranged so as to be orthogonal to each other, but the present embodiment is not limited to this, and the above is not necessary unless the relative positional relationship between the two composite magnetic wires is parallel. You can achieve your purpose.
- FIG. 4 A configuration of the rotation detection device according to the fourth embodiment of the present invention will be described with reference to an exploded perspective view of FIG.
- the power generation portion which is a detection unit is different from the first embodiment.
- the circuit board 301N has a second main surface 301B facing the detection magnet and a soft magnetic layer 371 on the first main surface 301A facing the second main surface 301B.
- stoppers 370 made of a soft magnetic material such as cylindrical ferrite are provided at both ends of the composite magnetic wire 350, and the intermediate layer 320 as the second layer and the lower layer portion as the third layer are provided.
- 330 has a U-shaped opening with a dimension matching the outer shape of the stopper 370 made of a soft magnetic material.
- a stopper 370 made of a cylindrical soft magnetic material is attached to both ends of the composite magnetic wire, thereby obtaining a larger pulse voltage than the composite magnetic wire alone due to the effect of collecting the magnetic field from the magnet. And an increase in power generation can be obtained.
- soft magnetic layers 371 are formed on both sides of the circuit board.
- FIG. FIG. 14 is a cross-sectional view of the circuit board of the rotation detection device according to the fifth embodiment.
- 15A and 15B are process cross-sectional views illustrating the manufacturing process of the composite magnetic wire used in the manufacturing process of the rotation detecting device of the fifth embodiment.
- 16 (a) to 16 (e) are process cross-sectional views illustrating the manufacturing process of the circuit board of the rotation detection device according to the fifth embodiment.
- the rotation detection device of the fifth embodiment has a configuration in which the depth of the concave groove 340 is adjusted, the distance between the composite magnetic wire 350 and the pickup coil is reduced, and the power generation efficiency is increased.
- the depth of the concave groove 340 can be selected as appropriate, but by setting the thickness so that the total thickness of the three layers of the insulating substrates 311, 321, and 331 becomes the diameter of the composite magnetic wire 350. It is possible to reduce the backlash of the composite magnetic wire 350 and obtain a sensor with high power generation efficiency.
- a circuit board 301G is obtained by applying a green sheet laminate and applying a release agent DR to the surface of a dummy rod D having the same diameter as the composite magnetic wire 350. What formed the ditch
- the composite magnetic wire a composite magnetic wire 350 with a coating layer whose surface is covered with an insulating layer 350i is used. It is desirable that the diameter of the dummy rod D is approximately the same as the diameter of the composite magnetic wire 350 and is formed to be slightly large enough to be inserted when the composite magnetic wire 350 is inserted by extracting the dummy rod D.
- the circuit board 301G is configured by laminating and firing green sheets, and includes an upper layer part 310 that is an upper layer substrate, an intermediate layer 320 that is an intermediate layer substrate, and a lower layer part 330 that is a lower layer substrate.
- the concave groove 340 ⁇ / b> S is formed large across the upper layer portion 310, the middle layer portion 320, and the lower layer portion 330.
- the upper layer portion 310 corresponding to the first layer of the circuit board 301 ⁇ / b> G includes a ceramic substrate that is the insulating substrate 311 and a wiring 312 that is formed by patterning a copper foil formed on the insulating substrate 311.
- the second layer, that is, the intermediate layer 320 is formed of a ceramic substrate which is the insulating substrate 321.
- the lower layer portion 330 corresponding to the third layer includes a ceramic substrate as the insulating substrate 331 and a wiring 332 formed by patterning a copper foil formed on the insulating substrate 331. Then, the wiring 312 of the upper layer part 310 and the through hole TH for connecting the wiring 332 formed on the lower surface of the lower layer part 330 of the third layer through the intermediate layer 320 are constituted.
- each layer constituting the circuit board 301G is the same as that of the circuit board 301 of the first embodiment, but the concave groove 340S for inserting the composite magnetic wire has a shape along the outer diameter of the dummy rod D. Therefore, the distance between the composite magnetic wire 350 and the pickup coil 360 can be minimized.
- the shell part 350b of the reminder is formed around the core part 350a of the picoloy, the nickel plating is applied to the contact part between the core part 350a and the shell part 350b, and the double structure is formed.
- the magnetic material is solidified, and the drawing process and the heat treatment are repeated, and the drawing process and the torsion process are performed to form the composite magnetic wire 350.
- an insulating coating layer that is, an insulating layer 350 i is formed outside the composite magnetic wire 350.
- a wiring pattern 312n using a conductive paste such as a silver paste is printed on an insulating layer 311n made of a ceramic green sheet, and as shown in FIG. 310n is formed.
- a recess 340S for forming a recess is formed in the insulating layer 321n made of a ceramic green sheet to form a desired shape, and an intermediate layer green sheet 320n is formed as shown in FIG.
- a wiring pattern 332n using a conductive paste such as a silver paste is printed on the insulating layer 331n made of a ceramic green sheet to form a lower layer green sheet 330n as shown in FIG.
- the step of forming a laminated body includes a step of laminating and firing a plurality of ceramic green sheets on which wiring layers are formed, sandwiching a dummy rod, and a dummy after the firing step. And a step of forming a hole to be a concave groove.
- the step of inserting the composite magnetic wire includes a step of covering the periphery of the composite magnetic wire with an insulating film, and a step of inserting the composite magnetic wire covered with the insulating film into the punched hole.
- the diameter of the dummy bar is set to be approximately the same as the diameter of the composite magnetic wire 350, and the dummy bar D can be inserted so that the composite magnetic wire 350 can be inserted when the dummy bar D is extracted and inserted.
- the distance between the composite magnetic wire and the pickup coil can be increased. Uniform and minimal.
- the through hole for forming the pickup coil as close as possible to the position of the dummy bar, it is possible to form a pickup coil closer to the composite magnetic wire 350.
- the distance between the composite magnetic wire 350 and the pickup coil can be minimized, and it is possible to obtain a small, high-accuracy and reliable rotation detection device. .
- the composite magnetic wire 350 is disposed on the extended line of the rotary shaft of the rotary shaft 100 in the groove portion having the center and orthogonal to the rotary shaft. It may be eccentric, and the deviation can be compensated by the processing circuit.
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Abstract
Description
図1は、実施の形態1における回転検出装置の概略構成の斜視図を示している。図2は、実施の形態1の回転検出装置の分解斜視図、図3は、実施の形態1の回転検出装置の回路基板の上層基板を示す上面図、図4は、実施の形態1の回転検出装置の回路基板の中間層層基板を示す上面図、図5は、実施の形態1の回転検出装置の回路基板の下層基板を示す下面図である。図6は、実施の形態1の回転検出装置の回路基板の断面図、図7は、実施の形態1の回転検出装置の複合磁気コイルの装着状態を示す図である。図8(a)から(f)は、実施の形態1の回転検出装置の回路基板の製造工程を示す断面図である。
実施の形態2における回転検出装置の構成を図9を用いて以下に説明する。図9は、実施の形態2の回転検出装置の回路基板の断面図であり、特に検出部を構成する発電部の断面を示している。実施の形態2の回転検出装置は、検出部を構成する回路基板301Sが実施の形態1と異なる。
本発明の実施の形態3における回転検出装置について説明する。図10は、実施の形態3の回転検出装置の概略構成を示す斜視図、図11は、実施の形態3の回転検出装置の分解斜視図、図12は、実施の形態3の回転検出装置の回路基板の断面図である。実施の形態3の回転検出装置では、回路基板301SSの中心軸上で直交する第1の複合磁気ワイヤ350Aおよび第2の複合磁気ワイヤ350Bを内蔵している。これら第1の複合磁気ワイヤ350Aおよび第2の複合磁気ワイヤ350Bを囲む回路基板301SSは、回転軸X0の延長線上に中心O0を持つ、円盤状基板である。そして、回路基板301SS内の配線とスルーホールに充填された金属導体とで形成された、第1のピックアップコイル360Aおよび第2のピックアップコイル360Bが、第1の複合磁気ワイヤ350Aおよび第2の複合磁気ワイヤ350Bの長さ方向全体にわたって均一に巻回されている。
本発明の実施の形態4における回転検出装置の構成について図13の分解斜視図を参照しつつ説明する。実施の形態4は検出部である発電部分が実施の形態1と異なる。回路基板301Nは、検出用磁石に対向する第2主面301Bおよび第2主面301Bに対向する第1主面301Aに軟磁性層371を有する。また、中間層320においては、複合磁気ワイヤ350の両端に円筒状のフェライトなどの軟磁性体からなるストッパ370が設けられており、2層目である中間層320、3層目である下層部330は、コの字の開口が軟磁性体からなるストッパ370の外形に合わせた寸法で形成されている。
図14は、実施の形態5の回転検出装置の回路基板の断面図である。図15(a)および(b)は、実施の形態5の回転検出装置の製造工程で用いられる複合磁気ワイヤの製造工程を示す工程断面図である。図16(a)から(e)は、実施の形態5の回転検出装置の回路基板の製造工程を示す工程断面図である。実施の形態5の回転検出装置は、凹溝340の深さを調整し、複合磁気ワイヤ350とピックアップコイルとの距離を低減し発電効率を高める構成である。凹溝340の深さについては、適宜選択可能であるが、絶縁性基板311,321,331の3層の厚さの合計が複合磁気ワイヤ350の径になるように厚さを設定することで、複合磁気ワイヤ350のガタツキを低減するとともに、発電効率の高いセンサを得ることが可能となる。実施の形態5では、図14に断面図を示すように、回路基板301Gをグリーンシートの積層体を、複合磁気ワイヤ350と同径のダミー棒Dの表面に離型剤DRを塗布したものを焼成することによって形成した、複合磁気ワイヤ挿通用の凹溝340Sを形成したものを用いる。一方複合磁気ワイヤとしては、表面に絶縁層350iで被覆した被覆層付きの複合磁気ワイヤ350を用いる。なおダミー棒Dの径は、複合磁気ワイヤ350の径と同程度とし、ダミー棒Dを抜き出して複合磁気ワイヤ350を挿入する際、挿入できる程度に若干大きく形成するのが望ましい。
Claims (13)
- 回転軸を中心として回転する回転体に取り付けられた検出用磁石と、
前記検出用磁石に対向して配置され、前記回転体の回転を検出する検出部とを備え、
前記検出部が、
多層の回路基板と、
前記回路基板の中間層内に設けられ、前記回転軸の延長線上に、中心を有し前記回転軸に直交する溝部と、
前記溝部に内蔵された大バルクハウゼン効果を有する複合磁気ワイヤと、
回路基板上の配線とスルーホールに充填された導体とから形成され、前記複合磁気ワイヤを囲む、ピックアップコイルと、
で、構成されることを特徴とする回転検出装置。 - 前記ピックアップコイルは、
前記回路基板上の配線とスルーホールに充填された導体とから形成され、前記複合磁気ワイヤを囲む、内層コイルと、
前記回路基板上の配線とスルーホールに充填された導体とから形成され、前記内層コイルを囲む、外層コイルと、を備え、
前記内層コイルと前記外層コイルとが、直列接続されたことを特徴とする請求項1に記載の回転検出装置。 - 前記溝部は、中心が前記回転軸の延長線上にあり、前記回転軸の延長線上で一定の間隔を隔てて形成され、互いに直交する方向に伸長する第1の溝部と第2の溝部とを備え、
前記第1の溝部に内蔵された第1の複合磁気ワイヤと、
前記第2の溝部に内蔵された第2の複合磁気ワイヤと、
前記回路基板上の配線とスルーホールに充填された導体とから形成され、前記第1の複合磁気ワイヤを囲む、第1のピックアップコイルと、
前記回路基板上の配線とスルーホールに充填された導体とから形成され、前記第2の複合磁気ワイヤを囲む、第2のピックアップコイルと、
を備えた請求項1または2に記載の回転検出装置。 - 前記回路基板は、配線層と絶縁層とが交互に積層された多層配線基板で構成され、
前記溝部は、前記絶縁層に形成され、少なくとも一端にストッパが装着され、
前記溝部の長さは複合磁気ワイヤの長さをLとしたときに前記回路基板の中心から前記ストッパまでの長さがL/2であることを特徴とする請求項1から3のいずれか1項に記載の回転検出装置。 - 前記ストッパは、フェライト埋め込み層であることを特徴とする請求項4に記載の回転検出装置。
- 前記複合磁気ワイヤの両端に円筒状の軟磁性体が装着されたことを特徴とする請求項1から5のいずれか1項に記載の回転検出装置。
- 前記回路基板は、前記回転軸の延長線上に中心軸を持つ、円盤状基板であり、
前記回路基板の中心軸上で直交する前記第1の複合磁気ワイヤおよび前記第2の複合磁気ワイヤを囲む、前記ピックアップコイルが、前記第1の複合磁気ワイヤおよび前記第2の複合磁気ワイヤの長さ方向全体にわたって均一に巻回されたことを特徴とする請求項3から6のいずれか1項に記載の回転検出装置。 - 前記回路基板は、前記検出用磁石に対向する第1主面に軟磁性層を有することを特徴とする請求項3から7のいずれか1項に記載の回転検出装置。
- 前記回路基板は、両面に軟磁性層を有することを特徴とする請求項3から7のいずれか1項に記載の回転検出装置。
- 前記回路基板は、前記ピックアップコイルから発生したパルス電圧を処理して回転数をカウントする処理回路を搭載したことを特徴とする請求項1から9のいずれか1項に記載の回転検出装置。
- 回転軸を中心として回転する回転体に取り付けられた検出用磁石と、
前記検出用磁石に対向して配置され、前記回転体の回転を検出する検出部とを備え、
前記検出部が、
多層の回路基板と、
前記回路基板の中間層内に設けられ、前記回転軸の延長線上に、中心を有し前記回転軸に直交する溝部と、
前記溝部に内蔵された大バルクハウゼン効果を有する複合磁気ワイヤと、
前記回路基板上の配線とスルーホールに充填された導体とから形成され、前記複合磁気ワイヤを囲む、ピックアップコイルとで構成されることを特徴とする回転検出装置の製造方法であって、
前記回路基板の製造工程が、
配線とスルーホールに充填される導体とによってピックアップコイルを形成するとともに、前記複合磁気ワイヤを挿通する挿通用の凹溝を有する積層体を形成する工程と、
前記積層体の前記凹溝に前記複合磁気ワイヤを挿入する工程とを含む回転検出装置の製造方法。 - 前記積層体を形成する工程が、
配線層の形成された複数のセラミックグリーンシートを、ダミー棒を挟んで積層し、焼成する工程と、
前記焼成工程後に、前記ダミー棒を抜き、前記凹溝となる、抜き穴を形成する工程とを含む請求項11に記載の回転検出装置の製造方法。 - 前記複合磁気ワイヤを挿入する工程は、
前記複合磁気ワイヤの周りを絶縁膜で被覆する工程と、
前記絶縁膜で被覆された前記複合磁気ワイヤを前記抜き穴に挿入する工程とを含む請求項12に記載の回転検出装置の製造方法。
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- 2015-04-23 CN CN201580051506.8A patent/CN107076582B/zh not_active Expired - Fee Related
- 2015-04-23 KR KR1020177007398A patent/KR101809425B1/ko active IP Right Grant
- 2015-04-23 WO PCT/JP2015/062407 patent/WO2016170648A1/ja active Application Filing
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2016
- 2016-04-21 TW TW105112409A patent/TWI621835B/zh not_active IP Right Cessation
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JP2018132432A (ja) * | 2017-02-16 | 2018-08-23 | 株式会社ニコン | エンコーダ装置、駆動装置、ステージ装置、及びロボット装置 |
WO2021200361A1 (ja) * | 2020-04-01 | 2021-10-07 | 三菱電機株式会社 | 発電素子、これを用いた磁気センサ、エンコーダおよびモータ |
JP7378586B2 (ja) | 2020-04-01 | 2023-11-13 | 三菱電機株式会社 | 発電素子、これを用いた磁気センサ、エンコーダおよびモータ |
WO2022230651A1 (ja) * | 2021-04-26 | 2022-11-03 | パナソニックIpマネジメント株式会社 | 発電素子、エンコーダおよび磁性部材の製造方法 |
Also Published As
Publication number | Publication date |
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KR101809425B1 (ko) | 2017-12-14 |
TW201706573A (zh) | 2017-02-16 |
KR20170037671A (ko) | 2017-04-04 |
CN107076582A (zh) | 2017-08-18 |
JP5955490B1 (ja) | 2016-07-20 |
US9869565B2 (en) | 2018-01-16 |
JPWO2016170648A1 (ja) | 2017-04-27 |
CN107076582B (zh) | 2019-04-26 |
US20170227380A1 (en) | 2017-08-10 |
TWI621835B (zh) | 2018-04-21 |
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