WO2016165226A1 - 显示面板、其制作方法及显示装置 - Google Patents

显示面板、其制作方法及显示装置 Download PDF

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Publication number
WO2016165226A1
WO2016165226A1 PCT/CN2015/084450 CN2015084450W WO2016165226A1 WO 2016165226 A1 WO2016165226 A1 WO 2016165226A1 CN 2015084450 W CN2015084450 W CN 2015084450W WO 2016165226 A1 WO2016165226 A1 WO 2016165226A1
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Prior art keywords
sealant
array substrate
pattern
region
black matrix
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Application number
PCT/CN2015/084450
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English (en)
French (fr)
Inventor
肖文俊
陈小川
李月
Original Assignee
京东方科技集团股份有限公司
北京京东方光电科技有限公司
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Application filed by 京东方科技集团股份有限公司, 北京京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US15/030,637 priority Critical patent/US10285296B2/en
Publication of WO2016165226A1 publication Critical patent/WO2016165226A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/062—Hermetically-sealed casings sealed by a material injected between a non-removable cover and a body, e.g. hardening in situ
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509—Filters, e.g. light shielding masks
    • G02F1/133512—Light shielding layers, e.g. black matrix
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1339—Gaskets; Spacers; Sealing of cells
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1341—Filling or closing of cells
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13454—Drivers integrated on the active matrix substrate
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136209—Light shielding layers, e.g. black matrix, incorporated in the active matrix substrate, e.g. structurally associated with the switching element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0017—Casings, cabinets or drawers for electric apparatus with operator interface units
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C08K5/18—Amines; Quaternary ammonium compounds with aromatically bound amino groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer

Definitions

  • Embodiments of the present invention relate to a display panel, a method of fabricating the same, and a display device.
  • the narrow bezel design has become an important trend in the development of the display field. Because of its beautiful design and low cost, it plays a very important role in the large-size splicing design. Therefore, many manufacturers of display devices are pursuing narrow bezel design.
  • GOA Gate Driver on Array
  • the structure of the display panel is as shown in FIG. 1 , and includes an array substrate 1 and a color filter substrate 2 .
  • the array substrate 1 is provided with a GOA driving circuit 3 and peripheral traces (not shown in FIG. 1 ) in the frame region, and the color filter substrate 2
  • a black matrix 4 located in the display area and the frame area, and the sealant 5 is disposed in the frame area and between the array substrate 1 and the color filter substrate 2.
  • the sealant 5 is cured by irradiating the sealant 5 with ultraviolet light.
  • the black matrix 4 for preventing light leakage of the display panel is provided in the frame region of the color filter substrate 2, it is necessary to irradiate ultraviolet light from the side of the array 1 to cure the sealant 5 .
  • a wider gap is provided between the lines, which results in a wider space occupied by the GOA driving circuit 3 and the peripheral wiring, which is disadvantageous for realizing a narrow border of the display panel.
  • a display panel has a display area and a bezel area.
  • the display panel includes an array substrate and an opposite substrate disposed opposite to each other; the array substrate has a pattern of peripheral circuits and wires in a frame region facing the opposite substrate side, and the array substrate faces the opposite substrate Side and/or the opposite substrate faces the side of the array substrate a pattern having a black matrix; and the orthographic projection of the peripheral circuit and the pattern of the wire on the array substrate does not overlap with the orthographic projection of the pattern of the black matrix on the array substrate; and the array substrate and the pair Between the substrates, there is a frame sealant located in the frame region and cured, and the frame sealant comprises a substance formed by the thermochromic material undergoing discoloration during the curing process.
  • the sealant contains a black substance formed by a thermochromic material that undergoes discoloration during the curing process.
  • thermochromic material includes a color former and a color developer.
  • the color former is an organic black fluoran functional material.
  • the organic black fluoran functional material is 2-phenylamino-3-methyl-6-diethylaminofluoran.
  • the developer is boric acid.
  • the black matrix is located only in the display area; or the black matrix is located in an area other than the area where the peripheral circuit and the pattern of the electric wire are located.
  • the curing treatment includes: a heat curing treatment to discolor the thermochromic material in the sealant; and a photocuring treatment to cure the sealant.
  • the photocuring treatment of the heat-cured frame sealant by ultraviolet light comprises: irradiating the seal from the opposite substrate side with ultraviolet light when the black matrix is only located in the display area.
  • the frame sealant is subjected to photocuring treatment; when the black matrix is located in a region other than the region where the peripheral circuit and the wire pattern are located and the black matrix is located on the side of the opposite substrate facing the array substrate, the ultraviolet film is used.
  • the light illuminates the sealant in the region where the pattern of the peripheral circuit and the electric wire is located from the side of the opposite substrate, and irradiates the other side of the region other than the region where the pattern of the peripheral circuit and the electric wire is located from the side of the array substrate by ultraviolet light.
  • the ultraviolet light is irradiated from the side of the opposite substrate
  • the frame sealant in the area where the peripheral circuit and the wire pattern are located, and the ultraviolet light is irradiated from the opposite substrate side in addition to the peripheral circuit Sealant in other regions other than the region where the wire pattern.
  • the temperature at which the sealant is thermally cured is 100 to 180 °C.
  • the temperature at which the sealant is subjected to a heat curing treatment is 130 °C.
  • a display device comprising the display panel as described above.
  • a method of fabricating a display panel includes: forming an array substrate and an opposite substrate disposed opposite to each other; wherein the array substrate faces a pattern of peripheral circuits and wires in a frame region on a side of the opposite substrate, the array substrate facing the opposite direction a side of the substrate and/or a side of the opposite substrate facing the array substrate having a black matrix, and an image of the peripheral circuit and the pattern of the wire on the array substrate and the black matrix are in the An orthographic projection of the array substrate does not overlap; a frame sealant is applied to a frame region of the array substrate facing the opposite substrate side, or a frame region of the opposite substrate facing the array substrate side, wherein The sealant comprises a thermochromic material; curing the sealant to discolor the thermochromic material in the sealant and curing the sealant.
  • the sealant contains a black substance formed by a thermochromic material that undergoes discoloration during the curing process.
  • thermochromic material includes a color former and a color developer.
  • the color former is an organic black fluoran functional material.
  • the organic black fluoran functional material is 2-phenylamino-3-methyl-6-diethylaminofluoran.
  • the developer is boric acid.
  • the black matrix is located only in the display area; or the black matrix is located in an area other than the area where the peripheral circuit and the pattern of the electric wire are located.
  • the curing treatment includes: a heat curing treatment to discolor the thermochromic material in the sealant; and a photocuring treatment to cure the sealant.
  • the photocuring treatment of the heat-cured frame sealant by ultraviolet light comprises: irradiating the seal from the opposite substrate side with ultraviolet light when the black matrix is only located in the display area.
  • the frame sealant is subjected to photocuring treatment; when the black matrix is located in a region other than the region where the peripheral circuit and the wire pattern are located and the black matrix is located on the side of the opposite substrate facing the array substrate, the ultraviolet film is used.
  • the light illuminates the sealant in the region where the pattern of the peripheral circuit and the electric wire is located from the side of the opposite substrate, and irradiates the other side of the region other than the region where the pattern of the peripheral circuit and the electric wire is located from the side of the array substrate by ultraviolet light.
  • the ultraviolet light is irradiated from the side of the opposite substrate
  • the frame sealant in the area where the peripheral circuit and the wire pattern are located, and the ultraviolet light is irradiated from the opposite substrate side in addition to the peripheral circuit Sealant in other regions other than the region where the wire pattern.
  • the temperature at which the sealant is thermally cured is 100 to 180 °C.
  • the temperature at which the sealant is subjected to a heat curing treatment is 130 °C.
  • FIG. 1 is a schematic structural view of a conventional display panel
  • FIG. 2 is a schematic cross-sectional structural view of a display panel according to an embodiment of the present invention.
  • FIG. 3 is a schematic top plan view of a display panel according to an embodiment of the present invention.
  • 3b is a second schematic structural view of a display panel according to an embodiment of the present invention.
  • FIG. 4 is a schematic flow chart of a method for manufacturing a display panel according to an embodiment of the present invention.
  • Embodiments of the present invention provide a display panel.
  • the display panel includes a display area 100 and a bezel area 200 surrounding the display area.
  • the display panel includes an array substrate 01 and an opposite substrate 02 disposed opposite to each other; wherein the array substrate 01 faces the frame on the side of the opposite substrate 02, and has a pattern of peripheral circuits and wires 03.
  • the substrate 01 faces the opposite substrate 02 side and/or the opposite substrate 02 faces the array substrate 01 side with a pattern of the black matrix 04, and the pattern of the peripheral circuit and the wire 03 on the array substrate 01 and the black matrix 04
  • the front projection of the array substrate does not overlap; the array substrate 01 and the opposite substrate 02 have a framed rubber 05 which is cured in the frame region, wherein the sealant 05 contains the thermochromic material in the A substance formed after discoloration occurs during the curing process.
  • peripheral circuitry and wires 03 include drive circuitry and/or perimeter traces.
  • the front projection of the peripheral circuit and the wire pattern in the frame area on the array substrate does not overlap with the front projection of the black matrix pattern on the array substrate, that is, the graphics of the peripheral circuit and the wire are located.
  • the black matrix is not set in the area.
  • the ultraviolet light may not be irradiated from the side of the array substrate for the area where the peripheral circuit and the wire pattern are located, so that the gap width in the pattern of the peripheral circuit and the wire can be reduced. To reduce the width of the border and realize the design of the narrow border display panel.
  • the sealant contains a substance formed by the discoloration of the thermochromic material during the curing process, the display panel does not have a black matrix in the region where the peripheral circuit and the wire pattern are located, but the curing process is performed.
  • the rear sealant itself can prevent the display panel from leaking light.
  • the black matrix 04 may be located only in the display area, that is, the black matrix 04 is not disposed in the entire frame area.
  • the black matrix in the display area is in the form of a grid; however, the graphics of the black matrix in the display area are not limited thereto, and the embodiment of the present invention does not limit this.
  • the black matrix 04 is not disposed in the area where the peripheral circuit and the pattern of the electric wire 03 are located, and other frame areas and display area settings are set.
  • the graphic of the black matrix in the display area is not limited herein.
  • the thermochromic material includes a color former and a color developer.
  • the material of the coloring agent determines the color
  • the content of the coloring agent determines the color depth.
  • the content of the coloring agent and the color developing agent is determined according to the actual situation.
  • the coloring agent is an organic black fluoran functional material, or other similar functional materials, which are not limited herein.
  • the organic black fluoran functional material may be 2-phenylamino-3-methyl-6-diethylaminofluoran, that is, organic black fluoran TF-BL1, specifically
  • the chemical structural formula is as shown in Equation 1:
  • the material of the color developer may be boric acid, and the specific chemical structural formula is as shown in Formula 2:
  • the sealant is heated.
  • the chemical reaction formula of 2-phenylamino-3-methyl-6-diethylaminofluoran and boric acid after heating is as shown in Formula 3:
  • the colorless 2-phenylamino-3-methyl-6-diethylaminofluoran and boric acid in the sealant are discolored into a black material after heat curing, thereby making the sealant black into black, which is effective. Prevent light leakage from the display panel.
  • the curing treatment includes: a heat curing treatment to discolor the thermochromic material in the sealant; and a photocuring treatment to cure the sealant.
  • the frame sealant is first subjected to heat curing treatment in order to ensure that the thermochromic material fully reacts during the heat curing process to discolor the thermochromic material, and then the heat-cured frame sealant is irradiated with ultraviolet light.
  • the photocuring treatment cures the frame sealant after the heat curing treatment.
  • the heat curing treatment refers to a process of heating the sealant containing the thermochromic material, and may be heated in any manner, which is not limited herein.
  • the temperature during the thermal curing treatment of the sealant is controlled between 100 ° C and 180 ° C, because when the temperature is too low, the thermochromic material cannot be obtained.
  • the reaction temperature of discoloration is high, and although the reaction speed can be accelerated, the temperature is too high and the surface of the sealant is easily uneven.
  • the temperature at which the sealant is thermally cured is controlled to be about 130 °C.
  • the photocuring treatment of the framed adhesive after the heat curing treatment is performed by using ultraviolet light, and specifically includes:
  • the frame sealant is light-cured by ultraviolet light from the side of the opposite substrate, thereby ensuring that the sealant can be sufficiently irradiated by ultraviolet light to make the sealant Solidified completely;
  • ultraviolet light is used to illuminate the side of the opposite substrate from the peripheral circuit and the wire.
  • the sealant in the area where the graphic is located, and ultraviolet light is used to illuminate the sealant located in the area other than the area where the peripheral circuit and the wire pattern are located from the side of the array substrate; thereby ensuring that the sealant can be sufficiently covered by ultraviolet light. Irradiating to cure the sealant; and
  • the ultraviolet light is used to illuminate the side of the opposite substrate from the peripheral circuit and the wire.
  • the sealant in the area where the graphic is located, and ultraviolet light is used to illuminate the side of the opposite substrate from the side of the opposite circuit and the area of the wire, thereby ensuring that the sealant can be UV-coated.
  • the light is sufficiently irradiated to completely cure the sealant.
  • the embodiment of the invention further provides a display device, which comprises the above display panel provided by the embodiment of the invention.
  • the principle of the display device is similar to that of the foregoing display panel. Therefore, the implementation of the display device can be referred to the implementation of the foregoing display panel, and the repeated description is omitted.
  • the display device provided by the embodiment of the present invention may be any product or component having a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, and the like, which are not limited herein.
  • a display function such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, and the like, which are not limited herein.
  • the embodiment of the invention further provides a method for manufacturing a display panel, as shown in FIG.
  • the method includes the following steps:
  • the array substrate has a pattern of peripheral circuits and wires in a frame region facing the opposite substrate side, and the array substrate has a black matrix pattern facing the opposite substrate side or the opposite substrate facing the array substrate side; and the peripheral circuit and the wire pattern
  • the orthographic projection of the array substrate does not overlap with the orthographic projection of the pattern of the black matrix on the array substrate;
  • the orthographic projection of the peripheral circuit and the pattern of the wire in the frame area on the array substrate does not overlap with the orthographic projection of the pattern of the black matrix on the array substrate, that is, the graphic of the peripheral circuit and the wire is located.
  • the black matrix is not set in the area.
  • the ultraviolet light may not be irradiated from the side of the array substrate for the area where the peripheral circuit and the wire pattern are located, so that the gap width in the pattern of the peripheral circuit and the wire can be reduced. To reduce the width of the border and realize the design of the narrow border display panel.
  • the sealant contains a substance formed by the discoloration of the thermochromic material during the curing process, the display panel does not have a black matrix in the region where the peripheral circuit and the wire pattern are located, but the curing process is performed.
  • the rear sealant itself can prevent the display panel from leaking light.
  • the curing process of the sealant in step S403 is performed after the array substrate and the opposite substrate are disposed opposite each other.
  • the curing process of the sealant at step S403 may include:
  • the framed adhesive after the heat curing treatment is subjected to photocuring treatment by ultraviolet light to cure the frame sealant after the heat curing treatment.
  • the sealant is heat-cured first, in order to ensure that the thermochromic material fully reacts during the thermal curing process, discolor the thermochromic material, and then use the UV-cured frame sealant after heat curing.
  • the photocuring treatment is performed to cure the frame sealant after the heat curing treatment.
  • heat curing treatment refers to a process of heating a sealant containing a thermochromic material, It can be heated by any means existing, and is not limited herein.
  • the photocuring treatment of the frame sealant after the heat curing treatment is performed by using ultraviolet light, and specifically includes:
  • the frame sealant is light-cured by ultraviolet light from the side of the opposite substrate, thereby ensuring that the sealant can be sufficiently irradiated by ultraviolet light to make the sealant Solidified completely;
  • ultraviolet light is used to illuminate the side of the opposite substrate from the peripheral circuit and the wire.
  • the sealant in the area where the graphic is located, and ultraviolet light is used to illuminate the sealant located in the area other than the area where the peripheral circuit and the wire pattern are located from the side of the array substrate; thereby ensuring that the sealant can be sufficiently covered by ultraviolet light. Irradiating to cure the sealant; and
  • the ultraviolet light is used to illuminate the side of the opposite substrate from the peripheral circuit and the wire.
  • the sealant in the area where the graphic is located, and ultraviolet light is used to illuminate the side of the opposite substrate from the side of the opposite circuit and the area of the wire, thereby ensuring that the sealant can be UV-coated.
  • the light is sufficiently irradiated to completely cure the sealant.
  • the thermochromic material includes a color former and a color developer.
  • the material of the coloring agent determines the color
  • the content of the coloring agent determines the color depth.
  • the content of the coloring agent and the color developing agent is determined according to the actual situation.
  • the coloring agent is an organic black fluoran functional material, which is not limited herein.
  • the organic black fluoran functional material may be 2-phenylamino-3-methyl-6-diethylaminofluoran, that is, organic black fluoran TF-BL1.
  • the material of the developer may be boric acid, which is not limited herein.
  • the temperature of the sealant is thermally controlled to be between 100 ° C and 180 ° C. This is because when the temperature is too low, the reaction temperature at which the thermochromic material is discolored cannot be reached, and the temperature is high. Although the reaction speed can be accelerated, the temperature is too high and the surface of the sealant is easily uneven. Further, for example, heat the sealant The temperature at the time of curing treatment is controlled at about 130 °C.
  • the sealant is heated.
  • the colorless 2-phenylamino-3-methyl-6-diethylaminofluoran and boric acid in the sealant are discolored into a black material after heat curing, thereby making the sealant black It can effectively prevent light leakage from the display panel.
  • the array substrate faces the opposite substrate side and the opposite substrate faces the array substrate.
  • a flattening layer is provided on each side. For example, no flattening layer is provided in the frame area to ensure that the ultraviolet light can be sufficiently irradiated on the sealant.
  • the front projection of the peripheral circuit and the wire pattern in the frame region on the array substrate does not overlap with the orthographic projection of the black matrix pattern on the array substrate. That is, no black matrix is set in the area where the peripheral circuit and the wire pattern are located.
  • the ultraviolet light may not be irradiated from the side of the array substrate for the area where the peripheral circuit and the wire pattern are located, so that the gap width in the pattern of the peripheral circuit and the wire can be reduced.
  • the sealant contains a substance formed by the discoloration of the thermochromic material during the curing process, the display panel does not have a black matrix in the region where the peripheral circuit and the wire pattern are located, but the curing process is performed.
  • the rear sealant itself can prevent the display panel from leaking light.

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Abstract

显示面板、制作方法及显示装置，显示面板具有显示区域（100）和边框区域（200）。显示面板包括相对设置的阵列基板（01）和对向基板（02），阵列基板（01）面向对向基板（02）一侧的边框区域（100）内具有周边电路和电线（03）图形，阵列基板（01）面向对向基板（02）一侧和/或对向基板（02）面向阵列基板（01）一侧具有黑矩阵（04）图形；周边电路和电线（03）的图形在阵列基板（01）的正投影与黑矩阵（04）的图形在阵列基板（01）的正投影不重叠；阵列基板（01）与对向基板（02）之间具有位于边框区域（200）且经过固化处理后的封框胶（05），封框胶（05）中含有由热致变色材料在固化处理过程中发生变色后形成的物质。

Description

显示面板、其制作方法及显示装置 技术领域
本发明的实施例涉及一种显示面板、其制作方法及显示装置。
背景技术
如今，窄边框设计已成为显示领域发展的重要趋势，由于其设计美观，成本较低，对大尺寸拼接设计起到非常核心的作用，因此，很多显示装置的制造厂商都在追求窄边框设计。
目前大多数显示面板都为阵列基板行驱动(Gate Driver on Array,GOA)面板，即在显示面板的阵列基板的左右两侧的边框区域分布着用来驱动栅线的GOA驱动电路，并且在边框区域一般还分布有一些周边走线。
例如，显示面板的结构如图1所示，包括阵列基板1和彩膜基板2，阵列基板1在边框区域设置有GOA驱动电路3和周边走线(图1中未示出)，彩膜基板2在面向阵列基板1一侧具有位于显示区域和边框区域的黑矩阵4，封框胶5设置在边框区域中且位于阵列基板1和彩膜基板2之间。通过紫外光照射封框胶5使封框胶5固化。
在上述结构的显示面板中，由于在彩膜基板2的边框区域设置有防止显示面板发生漏光的黑矩阵4，因此需要从阵列1一侧照射紫外光以对封框胶5进行固化处。为了在采用紫外光从阵列基板1一侧对封框胶5进行固化处理时保证有足够的光透过以使封框胶5完全固化，需要在GOA驱动电路3所在的区域中以及在周边走线之间设置较宽的间隙，从而导致GOA驱动电路3以及周边走线整体占用的空间变宽，不利于实现显示面板的窄边框。
发明内容
根据本发明的实施例，提供一种显示面板。所述显示面板具有显示区域和边框区域。所述显示面板包括相对设置的阵列基板和对向基板；所述阵列基板面向所述对向基板一侧的边框区域内具有周边电路和电线的图形，所述阵列基板面向所述对向基板一侧和/或所述对向基板面向所述阵列基板一侧 具有黑矩阵的图形；且所述周边电路和电线的图形在所述阵列基板的正投影与所述黑矩阵的图形在所述阵列基板的正投影不重叠；并且所述阵列基板与所述对向基板之间具有位于所述边框区域且经过固化处理后的封框胶，所述封框胶中包含有由热致变色材料在所述固化处理过程中发生变色后形成的物质。
例如，所述封框胶中包含有由热致变色材料在所述固化处理过程中发生变色后形成的黑色物质。
例如，所述热致变色材料包括发色剂和显色剂。
例如，所述发色剂为有机黑色荧烷功能材料。
例如，所述有机黑色荧烷功能材料为2-苯氨基-3-甲基-6-二乙氨基荧烷。
例如，所述显色剂为硼酸。
例如，所述黑矩阵仅位于所述显示区域；或所述黑矩阵位于除了所述周边电路和电线的图形所在的区域之外的其它区域。
例如，所述固化处理包括：热固化处理，以使封框胶中的热致变色材料变色；以及光固化处理，以使封框胶固化。
例如，采用紫外光对经过热固化处理后的封框胶进行光固化处理，包括：当所述黑矩阵仅位于所述显示区域时，采用紫外光从所述对向基板一侧照射所述封框胶，对所述封框胶进行光固化处理；当黑矩阵位于除了周边电路和电线的图形所在的区域之外的其它区域且黑矩阵位于对向基板面向阵列基板的一侧时，采用紫外光从对向基板一侧照射位于周边电路和电线的图形所在的区域内的封框胶，并且采用紫外光从阵列基板一侧照射位于除了周边电路和电线的图形所在区域之外的其它区域的封框胶；并且当黑矩阵位于除了周边电路和电线的图形所在的区域之外的其它区域且黑矩阵位于阵列基板面向对向基板的一侧时，采用紫外光从对向基板一侧照射位于周边电路和电线的图形所在的区域内的封框胶，并且采用紫外光从对向基板一侧照射位于除了周边电路和电线的图形所在区域之外的其它区域内的封框胶。
例如，对所述封框胶进行热固化处理时的温度为100℃～180℃。
例如，对所述封框胶进行热固化处理时的温度为130℃。
根据本发明的实施例，提供一种显示装置，该显示装置包括如上所述的显示面板。
根据本发明的实施例，提供一种显示面板的制作方法。该方法包括：形成相对设置的阵列基板和对向基板；其中，所述阵列基板面向所述对向基板一侧的边框区域内具有周边电路和电线的图形，所述阵列基板面向所述对向基板一侧和/或所述对向基板面向所述阵列基板一侧具有黑矩阵的图形，且所述周边电路和电线的图形在所述阵列基板的正投影与所述黑矩阵的图形在所述阵列基板的正投影不重叠；在所述阵列基板面向所述对向基板一侧的边框区域，或在所述对向基板面向所述阵列基板一侧的边框区域涂覆封框胶，其中所述封框胶中包含有热致变色材料；对所述封框胶进行固化处理，使所述封框胶中的所述热致变色材料变色，并使所述封框胶固化。
例如，所述封框胶中包含有由热致变色材料在所述固化处理过程中发生变色后形成的黑色物质。
例如，所述热致变色材料包括发色剂和显色剂。
例如，所述发色剂为有机黑色荧烷功能材料。
例如，所述有机黑色荧烷功能材料为2-苯氨基-3-甲基-6-二乙氨基荧烷。
例如，所述显色剂为硼酸。
例如，所述黑矩阵仅位于所述显示区域；或所述黑矩阵位于除了所述周边电路和电线的图形所在的区域之外的其它区域。
例如，所述固化处理包括：热固化处理，以使封框胶中的热致变色材料变色；以及光固化处理，以使封框胶固化。
例如，采用紫外光对经过热固化处理后的封框胶进行光固化处理，包括：当所述黑矩阵仅位于所述显示区域时，采用紫外光从所述对向基板一侧照射所述封框胶，对所述封框胶进行光固化处理；当黑矩阵位于除了周边电路和电线的图形所在的区域之外的其它区域且黑矩阵位于对向基板面向阵列基板的一侧时，采用紫外光从对向基板一侧照射位于周边电路和电线的图形所在的区域内的封框胶，并且采用紫外光从阵列基板一侧照射位于除了周边电路和电线的图形所在区域之外的其它区域的封框胶；并且当黑矩阵位于除了周边电路和电线的图形所在的区域之外的其它区域且黑矩阵位于阵列基板面向对向基板的一侧时，采用紫外光从对向基板一侧照射位于周边电路和电线的图形所在的区域内的封框胶，并且采用紫外光从对向基板一侧照射位于除了周边电路和电线的图形所在区域之外的其它区域内的封框胶。
例如，对所述封框胶进行热固化处理时的温度为100℃～180℃。
例如，对所述封框胶进行热固化处理时的温度为130℃。
附图说明
为了更清楚地说明本发明实施例的技术方案，下面将对实施例的附图作简单地介绍，显而易见地，下面描述中的附图仅仅涉及本发明的一些实施例，而非对本发明的限制。
图1为现有的显示面板的结构示意图；
图2为本发明实施例提供的显示面板的剖面结构示意图；
图3a为本发明实施例提供的显示面板的俯视结构示意图之一；
图3b为本发明实施例提供的显示面板的俯视结构示意图之二；
图4为本发明实施例提供的显示面板的制作方法的流程示意图。
具体实施方式
为使本发明实施例的目的、技术方案和优点更加清楚，下面将结合附图，对本发明实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本发明的一部分实施例，而不是全部的实施例。基于所描述的本发明的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例，都属于本发明保护的范围。
附图中各区域的形状大小不反映显示面板的真实比例，目的只是示意说明本发明实施例的内容。
本发明实施例提供一种显示面板。如图2所示，该显示面板包括显示区域100和围绕显示区域的边框区域200。进一步地，如图2所示，显示面板包括相对设置的阵列基板01和对向基板02；其中，阵列基板01面向对向基板02一侧的边框区域内具有周边电路和电线03的图形，阵列基板01面向对向基板02一侧和/或对向基板02面向阵列基板01一侧具有黑矩阵04的图形，且周边电路和电线03的图形在阵列基板01的正投影与黑矩阵04的图形在阵列基板的正投影不重叠；阵列基板01与对向基板02之间具有位于边框区域且经过固化处理后的封框胶05，其中封框胶05中包含有由热致变色材料在所述固化处理过程中发生变色后形成的物质。
例如，周边电路和电线03包括驱动电路和/或周边走线。
本发明实施例提供的上述显示面板，由于边框区域中的周边电路和电线的图形在阵列基板的正投影与黑矩阵的图形在阵列基板的正投影不重叠，即在周边电路和电线的图形所在的区域中不设置黑矩阵。如此设计，对封框胶进行固化处理时，对于周边电路和电线的图形所在的区域而言可以不从阵列基板一侧照射紫外光，从而可以将周边电路和电线的图形中的间隙宽度减小，使边框的宽度减小，实现窄边框显示面板的设计。并且，由于封框胶中包含有由热致变色材料在固化处理过程中发生变色后形成的物质，因此上述显示面板虽然在周边电路和电线的图形所在的区域中没有设置黑矩阵，但是固化处理后的封框胶自身就可以起到防止显示面板漏光的效果。
例如，在本发明实施例提供的上述显示面板中，如图3a所示，黑矩阵04可以仅位于显示区域，即在整个边框区域均不设置黑矩阵04。在图3a中，显示区域中黑矩阵为网格状；然而黑矩阵在显示区域的图形不限于此，本发明实施例对此不作限定。
例如，在本发明实施例提供的上述显示面板中，如图3b所示，在边框区域中，仅在周边电路和电线03的图形所在的区域不设置黑矩阵04，其它边框区域和显示区域设置黑矩阵04。黑矩阵在显示区域的图形在此不作限定。
例如，在本发明实施例提供的上述显示面板中，热致变色材料包括发色剂和显色剂。这里发色剂的材料决定颜色，显色剂的含量决定颜色深浅，在具体实施时，根据实际情况决定发色剂和显色剂的含量。
例如，在本发明实施例提供的上述显示面板中，发色剂为有机黑色荧烷功能材料，或者为其他类似功能材料，在此不作限定。
例如，在本发明实施例提供的上述显示面板中，有机黑色荧烷功能材料可以为2-苯氨基-3-甲基-6-二乙氨基荧烷，即有机黑色荧烷TF-BL1，具体化学结构式如式1所示：
Figure PCTCN2015084450-appb-000001
例如，在本发明实施例提供的上述显示面板中，显色剂的材料可以为硼酸，具体化学结构式如式2所示：
Figure PCTCN2015084450-appb-000002
例如，在本发明实施例提供的上述显示面板中，当变色剂为2-苯氨基-3-甲基-6-二乙氨基荧烷，显色剂为硼酸时，在对封框胶进行热固化处理时，2-苯氨基-3-甲基-6-二乙氨基荧烷和硼酸在受热后发生的化学反应式如式3所示：
Figure PCTCN2015084450-appb-000003
封框胶中无色的2-苯氨基-3-甲基-6-二乙氨基荧烷和硼酸，在进行热固化处理后变色为黑色材料，从而使封框胶变成黑色，可以有效的防止显示面板发生漏光。
例如，所述固化处理包括：热固化处理，以使封框胶中的热致变色材料变色；以及光固化处理，以使封框胶固化。先对封框胶进行热固化处理，目的是为了保证热致变色材料在热固化的过程中充分反应，使热致变色材料变色，之后再采用紫外光对经过热固化处理后的封框胶进行光固化处理，使经过热固化处理后的封框胶固化。
例如，热固化处理是指对包含有热致变色材料的封框胶进行加热的过程，可以采用任何方式加热，在此不作限定。
例如，在本发明实施例提供的上述显示面板中，对封框胶进行热固化处理时的温度控制在100℃～180℃之间，这是因为当温度太低，不能达到热致变色材料发生变色的反应温度，温度高，虽然可以加快反应速度，但是温度太高容易封框胶表面变得凹凸不平。进一步地，例如，对封框胶进行热固化处理时的温度控制在130℃左右。
例如，在本发明实施例提供的上述显示面板中，采用紫外光对经过热固化处理后的封框胶进行光固化处理，具体包括：
当黑矩阵仅位于显示区域时，采用紫外光从对向基板一侧照射封框胶，对封框胶进行光固化处理；从而保证封框胶能够被紫外光充分照射到，以使封框胶固化完全；
当黑矩阵位于除了周边电路和电线的图形所在的区域之外的其它区域且黑矩阵位于对向基板面向阵列基板的一侧时，采用紫外光从对向基板一侧照射位于周边电路和电线的图形所在的区域内的封框胶，并且采用紫外光从阵列基板一侧照射位于除了周边电路和电线的图形所在区域之外的其它区域的封框胶；从而保证封框胶能够被紫外光充分照射到，以使封框胶固化完全；并且
当黑矩阵位于除了周边电路和电线的图形所在的区域之外的其它区域且黑矩阵位于阵列基板面向对向基板的一侧时，采用紫外光从对向基板一侧照射位于周边电路和电线的图形所在的区域内的封框胶，并且采用紫外光从对向基板一侧照射位于除了周边电路和电线的图形所在区域之外的其它区域内的封框胶；从而保证封框胶能够被紫外光充分照射到，以使封框胶固化完全。
本发明实施例还提供了一种显示装置，包括本发明实施例提供的上述显示面板。由于该显示装置解决问题的原理与前述显示面板相似，因此该显示装置的实施可以参见前述显示面板的实施，重复之处不再赘述。
例如，本发明实施例提供的显示装置可以为：手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件，在此不作限定。
本发明实施例还提供了一种显示面板的制作方法，如图4所示，该制作 方法包括以下步骤：
S401、形成相对设置的阵列基板和对向基板；
阵列基板面向对向基板一侧的边框区域内具有周边电路和电线的图形，阵列基板面向对向基板一侧或对向基板面向阵列基板一侧具有黑矩阵的图形；且周边电路和电线的图形在阵列基板的正投影与黑矩阵的图形在阵列基板的正投影不重叠；
S402、在阵列基板面向对向基板一侧的边框区域，或在对向基板面向阵列基板一侧的边框区域涂覆封框胶，其中封框胶中包含有热致变色材料；
S403、对封框胶进行固化处理，使封框胶中的热致变色材料变色，并使封框胶固化。
本发明实施例提供的上述制作方法，由于边框区域中的周边电路和电线的图形在阵列基板的正投影与黑矩阵的图形在阵列基板的正投影不重叠，即在周边电路和电线的图形所在的区域中不设置黑矩阵。如此设计，对封框胶进行固化处理时，对于周边电路和电线的图形所在的区域而言可以不从阵列基板一侧照射紫外光，从而可以将周边电路和电线的图形中的间隙宽度减小，使边框的宽度减小，实现窄边框显示面板的设计。并且，由于封框胶中包含有由热致变色材料在固化处理过程中发生变色后形成的物质，因此上述显示面板虽然在周边电路和电线的图形所在的区域中没有设置黑矩阵，但是固化处理后的封框胶自身就可以起到防止显示面板漏光的效果。
例如，在本发明实施例提供的上述制作方法中，步骤S403对封框胶进行固化处理是在阵列基板与对向基板相对设置之后进行的。
例如，在本发明实施例提供的上述显示面板中，步骤S403对封框胶进行固化处理可以包括：
对封框胶进行热固化处理，使封框胶中的热致变色材料变色；
采用紫外光对经过热固化处理后的封框胶进行光固化处理，使经过热固化处理后的封框胶固化。这里先对封框胶进行热固化处理，目的是为了保证热致变色材料在热固化的过程中充分反应，使热致变色材料变色，之后再采用紫外光对经过热固化处理后的封框胶进行光固化处理，使经过热固化处理后的封框胶固化。
例如，热固化处理是指对包含有热致变色材料的封框胶进行加热的过程， 可以采用现有的任何方式加热，在此不作限定。
例如，在本发明实施例提供的上述制作方法中，采用紫外光对经过热固化处理后的封框胶进行光固化处理，具体包括：
当黑矩阵仅位于显示区域时，采用紫外光从对向基板一侧照射封框胶，对封框胶进行光固化处理；从而保证封框胶能够被紫外光充分照射到，以使封框胶固化完全；
当黑矩阵位于除了周边电路和电线的图形所在的区域之外的其它区域且黑矩阵位于对向基板面向阵列基板的一侧时，采用紫外光从对向基板一侧照射位于周边电路和电线的图形所在的区域内的封框胶，并且采用紫外光从阵列基板一侧照射位于除了周边电路和电线的图形所在区域之外的其它区域的封框胶；从而保证封框胶能够被紫外光充分照射到，以使封框胶固化完全；并且
当黑矩阵位于除了周边电路和电线的图形所在的区域之外的其它区域且黑矩阵位于阵列基板面向对向基板的一侧时，采用紫外光从对向基板一侧照射位于周边电路和电线的图形所在的区域内的封框胶，并且采用紫外光从对向基板一侧照射位于除了周边电路和电线的图形所在区域之外的其它区域内的封框胶；从而保证封框胶能够被紫外光充分照射到，以使封框胶固化完全。
例如，在本发明实施例提供的上述制作方法中，热致变色材料包括发色剂和显色剂。这里发色剂的材料决定颜色，显色剂的含量决定颜色深浅，在具体实施时，根据实际情况决定发色剂和显色剂的含量。
例如，在本发明实施例提供的上述制作方法中，发色剂为有机黑色荧烷功能材料，在此不作限定。
例如，在本发明实施例提供的上述制作方法中，有机黑色荧烷功能材料可以为2-苯氨基-3-甲基-6-二乙氨基荧烷，即有机黑色荧烷TF-BL1。
例如，在本发明实施例提供的上述制作方法中，显色剂的材料可以为硼酸，在此不作限定。
例如，在本发明实施例提供的上述制作方法中，对封框胶进行热固化处理时的温度控制在100℃～180℃之间为佳。这是因为当温度太低，不能达到热致变色材料发生变色的反应温度，温度高，虽然可以加快反应速度，但是温度太高容易封框胶表面变得凹凸不平。进一步地，例如，对封框胶进行热 固化处理时的温度控制在130℃左右。
例如，在本发明实施例提供的上述制作方法中，当变色剂为2-苯氨基-3-甲基-6-二乙氨基荧烷，显色剂为硼酸时，在对封框胶进行热固化处理时，封框胶中无色的2-苯氨基-3-甲基-6-二乙氨基荧烷和硼酸，在进行热固化处理后变色为黑色材料，从而使封框胶变成黑色，可以有效的防止显示面板发生漏光。
例如，在本发明实施例提供的上述显示面板中，在步骤S401形成相对设置的阵列基板和对向基板的过程中，一般还在阵列基板面向对向基板一侧和对向基板面向阵列基板一侧分别设置平坦化层。例如，在边框区域不设置平坦化层，从而保证紫外光能够充分的照射在封框胶上。
在本发明实施例提供的一种显示面板、其制作方法及显示装置中，由于边框区域中的周边电路和电线的图形在阵列基板的正投影与黑矩阵的图形在阵列基板的正投影不重叠，即在周边电路和电线的图形所在的区域中不设置黑矩阵。如此设计，对封框胶进行固化处理时，对于周边电路和电线的图形所在的区域而言可以不从阵列基板一侧照射紫外光，从而可以将周边电路和电线的图形中的间隙宽度减小，使边框的宽度减小，实现窄边框显示面板的设计。并且，由于封框胶中包含有由热致变色材料在固化处理过程中发生变色后形成的物质，因此上述显示面板虽然在周边电路和电线的图形所在的区域中没有设置黑矩阵，但是固化处理后的封框胶自身就可以起到防止显示面板漏光的效果。
以上所述仅是本发明的示范性实施方式，而非用于限制本发明的保护范围，本发明的保护范围由所附的权利要求确定。
本申请要求于2015年4月15日递交的第201510179076.X号中国专利申请的优先权，在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。

Claims (23)

  1. 一种显示面板，所述显示面板具有显示区域和边框区域，其中
    所述显示面板包括相对设置的阵列基板和对向基板；
    所述阵列基板面向所述对向基板一侧的边框区域内具有周边电路和电线的图形，所述阵列基板面向所述对向基板一侧和/或所述对向基板面向所述阵列基板一侧具有黑矩阵的图形；且所述周边电路和电线的图形在所述阵列基板的正投影与所述黑矩阵的图形在所述阵列基板的正投影不重叠；并且
    所述阵列基板与所述对向基板之间具有位于所述边框区域且经过固化处理后的封框胶，所述封框胶中包含有由热致变色材料在所述固化处理过程中发生变色后形成的物质。
  2. 如权利要求1所述的显示面板，其中所述封框胶中包含有由热致变色材料在所述固化处理过程中发生变色后形成的黑色物质。
  3. 如权利要求2所述的显示面板，其中所述热致变色材料包括发色剂和显色剂。
  4. 如权利要求3所述的显示面板，其中所述发色剂为有机黑色荧烷功能材料。
  5. 如权利要求4所述的显示面板，其中所述有机黑色荧烷功能材料为2-苯氨基-3-甲基-6-二乙氨基荧烷。
  6. 如权利要求5所述的显示面板，其中所述显色剂为硼酸。
  7. 如权利要求1所述的显示面板，其中
    所述黑矩阵仅位于所述显示区域；或
    所述黑矩阵位于除了所述周边电路和电线的图形所在的区域之外的其它区域。
  8. 如权利要求1-7任一项所述的显示面板，其中所述固化处理包括：热固化处理，以使封框胶中的热致变色材料变色；以及光固化处理，以使封框胶固化。
  9. 如权利要求8所述的显示面板，其中采用紫外光对经过热固化处理后的封框胶进行光固化处理，包括：
    当所述黑矩阵仅位于所述显示区域时，采用紫外光从所述对向基板一侧 照射所述封框胶，对所述封框胶进行光固化处理；
    当黑矩阵位于除了周边电路和电线的图形所在的区域之外的其它区域且黑矩阵位于对向基板面向阵列基板的一侧时，采用紫外光从对向基板一侧照射位于周边电路和电线的图形所在的区域内的封框胶，并且采用紫外光从阵列基板一侧照射位于除了周边电路和电线的图形所在区域之外的其它区域的封框胶；并且
    当黑矩阵位于除了周边电路和电线的图形所在的区域之外的其它区域且黑矩阵位于阵列基板面向对向基板的一侧时，采用紫外光从对向基板一侧照射位于周边电路和电线的图形所在的区域内的封框胶，并且采用紫外光从对向基板一侧照射位于除了周边电路和电线的图形所在区域之外的其它区域内的封框胶。
  10. 如权利要求8所述的显示面板，其中对所述封框胶进行热固化处理时的温度为100℃～180℃。
  11. 如权利要求10所述的显示面板，其中对所述封框胶进行热固化处理时的温度为130℃。
  12. 一种显示装置，其中包括如权利要求1-11任一项所述的显示面板。
  13. 一种显示面板的制作方法，包括：
    形成相对设置的阵列基板和对向基板；其中，所述阵列基板面向所述对向基板一侧的边框区域内具有周边电路和电线的图形，所述阵列基板面向所述对向基板一侧和/或所述对向基板面向所述阵列基板一侧具有黑矩阵的图形，且所述周边电路和电线的图形在所述阵列基板的正投影与所述黑矩阵的图形在所述阵列基板的正投影不重叠；
    在所述阵列基板面向所述对向基板一侧的边框区域，或在所述对向基板面向所述阵列基板一侧的边框区域涂覆封框胶，其中所述封框胶中包含有热致变色材料；
    对所述封框胶进行固化处理，使所述封框胶中的所述热致变色材料变色，并使所述封框胶固化。
  14. 如权利要求13所述的制作方法，其中所述封框胶中包含有由热致变色材料在所述固化处理过程中发生变色后形成的黑色物质。
  15. 如权利要求14所述的制作方法，其中所述热致变色材料包括发色剂 和显色剂。
  16. 如权利要求15所述的制作方法，其中所述发色剂为有机黑色荧烷功能材料。
  17. 如权利要求16所述的制作方法，其中所述有机黑色荧烷功能材料为2-苯氨基-3-甲基-6-二乙氨基荧烷。
  18. 如权利要求17所述的制作方法，其中所述显色剂为硼酸。
  19. 如权利要求13所述的制作方法，其中
    所述黑矩阵仅位于所述显示区域；或
    所述黑矩阵位于除了所述周边电路和电线的图形所在的区域之外的其它区域。
  20. 如权利要求13-19任一项所述的制作方法，其中所述固化处理包括：热固化处理，以使封框胶中的热致变色材料变色；以及光固化处理，以使封框胶固化。
  21. 如权利要求20所述的制作方法，其中采用紫外光对经过热固化处理后的封框胶进行光固化处理，包括：
    当所述黑矩阵仅位于所述显示区域时，采用紫外光从所述对向基板一侧照射所述封框胶，对所述封框胶进行光固化处理；
    当黑矩阵位于除了周边电路和电线的图形所在的区域之外的其它区域且黑矩阵位于对向基板面向阵列基板的一侧时，采用紫外光从对向基板一侧照射位于周边电路和电线的图形所在的区域内的封框胶，并且采用紫外光从阵列基板一侧照射位于除了周边电路和电线的图形所在区域之外的其它区域的封框胶；并且
    当黑矩阵位于除了周边电路和电线的图形所在的区域之外的其它区域且黑矩阵位于阵列基板面向对向基板的一侧时，采用紫外光从对向基板一侧照射位于周边电路和电线的图形所在的区域内的封框胶，并且采用紫外光从对向基板一侧照射位于除了周边电路和电线的图形所在区域之外的其它区域内的封框胶。
  22. 如权利要求20所述的制作方法，其中对所述封框胶进行热固化处理时的温度为100℃～180℃。
  23. 如权利要求22所述的制作方法，其中对所述封框胶进行热固化处理 时的温度为130℃。
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CN104730739A (zh) * 2015-04-15 2015-06-24 京东方科技集团股份有限公司 一种显示面板、其制作方法及显示装置
CN106249488B (zh) * 2016-10-31 2019-11-15 京东方科技集团股份有限公司 一种显示面板及其制备方法
CN107065290B (zh) * 2017-06-06 2019-08-27 京东方科技集团股份有限公司 彩膜基板及其制备方法、显示面板
DE102017126215A1 (de) * 2017-11-09 2019-05-09 Delo Industrie Klebstoffe Gmbh & Co. Kgaa Verfahren zur Erzeugung opaker Beschichtungen, Verklebungen und Vergüsse sowie härtbare Masse zur Verwendung in dem Verfahren
TWI694286B (zh) * 2019-02-25 2020-05-21 友達光電股份有限公司 顯示裝置
CN110205037A (zh) * 2019-05-30 2019-09-06 深圳市华星光电技术有限公司 封框胶及液晶显示装置
KR20210034977A (ko) 2019-09-23 2021-03-31 삼성전자주식회사 디스플레이 장치 및 그 제조 방법
US11061294B1 (en) * 2019-12-18 2021-07-13 Tcl China Star Optoelectronics Technology Co., Ltd. Black matrix composition, liquid crystal display panel and manufacturing method thereof
CN111090218B (zh) * 2019-12-18 2021-08-24 Tcl华星光电技术有限公司 黑矩阵组合物、液晶显示面板及其制备方法
CN116057144A (zh) * 2020-09-10 2023-05-02 日东电工株式会社 可变色粘合片
WO2022054636A1 (ja) * 2020-09-10 2022-03-17 日東電工株式会社 可変色粘着シート
CN113710033B (zh) * 2021-09-03 2022-09-23 联想(北京)有限公司 基材及其制作方法及电子设备
CN115275043A (zh) * 2022-07-18 2022-11-01 武汉华星光电半导体显示技术有限公司 一种显示装置的制作方法和显示装置

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200530327A (en) * 2004-03-09 2005-09-16 Sekisui Chemical Co Ltd Light shielding sealing agent for liquid crystal display element, vertical conducting material, and liquid crystal display element
CN1797078A (zh) * 2004-12-30 2006-07-05 群康科技(深圳)有限公司 液晶显示面板
JP2006317520A (ja) * 2005-05-10 2006-11-24 Sekisui Chem Co Ltd 液晶滴下工法用シール剤、液晶滴下工法用遮光性シール剤、上下導通材料及び液晶表示素子
US7336337B2 (en) * 2001-12-22 2008-02-26 Lg.Philips Lcd Co., Ltd Liquid crystal display device and method of fabricating the same
JP2012088412A (ja) * 2010-10-18 2012-05-10 Sekisui Chem Co Ltd 液晶表示素子用遮光シール剤、上下導通材料及び液晶表示素子
TW201400952A (zh) * 2012-06-29 2014-01-01 Innocom Tech Shenzhen Co Ltd 液晶顯示裝置
CN104267526A (zh) * 2014-09-01 2015-01-07 友达光电股份有限公司 一种显示面板及其制造方法
CN104730739A (zh) * 2015-04-15 2015-06-24 京东方科技集团股份有限公司 一种显示面板、其制作方法及显示装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5138245B2 (zh) * 1973-05-22 1976-10-20
JPS5793197A (en) * 1980-12-03 1982-06-10 Ricoh Co Ltd Heat-sensitive recording material
US7253866B2 (en) * 2001-10-27 2007-08-07 Lg.Philips Lcd Co., Ltd. Method of fabricating liquid crystal display device
JP2006243018A (ja) * 2005-02-28 2006-09-14 Sekisui Chem Co Ltd 液晶表示素子用遮光シール剤、上下導通材料、及び、液晶表示素子
CN103135282B (zh) * 2013-02-07 2016-03-16 北京京东方光电科技有限公司 一种显示基板、显示面板和制造显示基板的方法
CN104020587A (zh) * 2014-05-26 2014-09-03 京东方科技集团股份有限公司 一种阵列基板及其制作方法、以及显示装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7336337B2 (en) * 2001-12-22 2008-02-26 Lg.Philips Lcd Co., Ltd Liquid crystal display device and method of fabricating the same
TW200530327A (en) * 2004-03-09 2005-09-16 Sekisui Chemical Co Ltd Light shielding sealing agent for liquid crystal display element, vertical conducting material, and liquid crystal display element
CN1797078A (zh) * 2004-12-30 2006-07-05 群康科技(深圳)有限公司 液晶显示面板
JP2006317520A (ja) * 2005-05-10 2006-11-24 Sekisui Chem Co Ltd 液晶滴下工法用シール剤、液晶滴下工法用遮光性シール剤、上下導通材料及び液晶表示素子
JP2012088412A (ja) * 2010-10-18 2012-05-10 Sekisui Chem Co Ltd 液晶表示素子用遮光シール剤、上下導通材料及び液晶表示素子
TW201400952A (zh) * 2012-06-29 2014-01-01 Innocom Tech Shenzhen Co Ltd 液晶顯示裝置
CN104267526A (zh) * 2014-09-01 2015-01-07 友达光电股份有限公司 一种显示面板及其制造方法
CN104730739A (zh) * 2015-04-15 2015-06-24 京东方科技集团股份有限公司 一种显示面板、其制作方法及显示装置

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