WO2016159548A1 - Prise de test - Google Patents

Prise de test Download PDF

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Publication number
WO2016159548A1
WO2016159548A1 PCT/KR2016/002799 KR2016002799W WO2016159548A1 WO 2016159548 A1 WO2016159548 A1 WO 2016159548A1 KR 2016002799 W KR2016002799 W KR 2016002799W WO 2016159548 A1 WO2016159548 A1 WO 2016159548A1
Authority
WO
WIPO (PCT)
Prior art keywords
main body
hooking
floating
floating member
socket main
Prior art date
Application number
PCT/KR2016/002799
Other languages
English (en)
Inventor
Sang Duck Park
Original Assignee
Leeno Industrial Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Leeno Industrial Inc. filed Critical Leeno Industrial Inc.
Publication of WO2016159548A1 publication Critical patent/WO2016159548A1/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding

Definitions

  • the present invention relates to a test socket for testing electric properties of a test object.
  • a semiconductor chip, where fine electronic circuits are high-densely integrated, is subject to a test about whether each electronic circuit is normal during a manufacturing process.
  • a contact probe for testing a semiconductor has been used.
  • Such a contact probe electrically connects terminals of the semiconductor chip and contact points (i.e. a pad) of a test circuit board for applying test signals.
  • This probe is supported in a socket main body.
  • the semiconductor chip is accommodated in the socket main body and tested while being accommodated in a floating member for elastically keeping a floating state.
  • the semiconductor chip is pressed by a pusher while being mounted to the floating member so that a bump terminal of the semiconductor chip can be in contact with the probe of the socket main body.
  • elastic restoring force prevents the floating member from separating from the socket main body even when the floating member shakes in the floating state with regard to the socket main body.
  • the disclosed separation preventing structure includes two pairs of projections elastically protruding from both opposite inner walls of a floating-member accommodating part in the socket main body, and two pairs of grooves formed on both outer walls of the floating member so as to lock the two pairs of the projections.
  • the conventional structure for preventing the floating member from separation is complicated and may have a problem that an error between the floating member and the floating-member accommodator of the socket main body causes a misalignment between the bump terminal of the semiconductor chip and the probe of the socket main body.
  • One or more exemplary embodiments are to provide a test socket having a simple structure for preventing a floating member from separation.
  • Another exemplary embodiment is to provide a test socket in which a terminal of a test object mounted to a floating member is more exactly aligned with a probe of a socket main body.
  • a test socket for testing electric properties of a test object
  • the test socket including: a socket main body configured to mount a plurality of probes, each of which has opposite ends exposed up and down, and have a floating-member accommodating cavity recessed from a top surface thereof; a floating member configured to include a test-object mounting portion to which the test object is mounted, and be accommodated in the floating-member accommodating cavity; and a separation preventer configured to prevent the floating member from separating from the socket main body in a state that the floating member is accommodated in the floating-member accommodating cavity of the socket main body, the separation preventer including: a hooking projection which protrudes from one of the floating member and the socket main body toward the other one, is elastically transformable in a direction transverse to its protruding direction, and has a hooking protrusion transversely protruding from its free end portion; and a locking protrusion which is provided in the other one of the floating member and the socket main body, and engage
  • the other one of the floating member and the socket main body may include a hooking-projection receiving hole to receive the hooking projection, and the locking protrusion may be formed on an inner wall of the hooking-projection receiving hole.
  • the hooking projection may include at least two hooking projections branched by a lengthwise cutting groove.
  • the test socket has the simple separation-preventing structure for the floating member, thereby reducing manufacturing costs.
  • this separation-preventing structure for the floating member is used to achieve more exact alignment between the terminal of the test object mounted to the floating member and the probe of the socket main body.
  • FIG. 1 is a perspective view of a test socket according to an exemplary embodiment
  • FIG. 2 is a bottom view of the floating member
  • FIGs. 3 to 5 are partial cross-section views showing operations of preventing the floating member from separating from the socket main body.
  • a test socket 1 for testing electric properties of a test object for example, a semiconductor chip
  • a test socket 1 for testing electric properties of a test object for example, a semiconductor chip
  • the floating member 200 is accommodated in a floating-member accommodating cavity 101 of the socket main body 100 while accommodating the test object.
  • the socket main body 100 has the floating-member accommodating cavity 101 recessed from the top thereof.
  • the floating-member accommodating cavity 101 is provided to mount a plurality of probes 120 on a center portion of a bottom 140 so that both ends of each probe 120 can be vertically exposed with respect to the bottom 140.
  • the probe 120 is supported on the socket main body 100 in a state that upper and lower ends of the probe 120 are protrudingly exposed.
  • FIG. 1 shows that only the upper end of the probe 120 protrudes.
  • the upper end of the probe 120 contacts a terminal, e.g. a bump, of a test object to be mounted to the floating member 200.
  • the lower end of the probe 120 contacts a pad of a test circuit board (not shown).
  • At least one of the upper and lower ends of the probe 120 is elastically retractable in its lengthwise direction.
  • the socket main body 100 according to this exemplary embodiment is applicable to many probes having various shaped and structures without limitation.
  • each ball plunger 110 includes a ball and a spring (not shown) arranged inside a cylindrical container 112 having a narrow upper mouth so that the ball can be elastically moved without separation. Therefore, the floating member 200 put on the four ball plungers 110 can elastically float corresponding to the elastic movement of the ball plunger 110.
  • the floating member 200 includes first openings 210 formed on a bottom 220 thereof as shown in FIG. 2 to receive the ball plungers 110 respectively.
  • the ball plunger 110 supports the floating member 200 while being inserted in the first opening 210.
  • the structure for floating the floating member 200 is not limited to those shown in FIGs. 1 and 2.
  • the socket main body 100 includes four separation-preventing pins 130 arranged protruding upward on the bottom 140 of the floating-member accommodating cavity 101.
  • the number of separation-preventing pins 130 is not limited to four.
  • a single or a plurality of separation-preventing pins may be provided in accordance with designs.
  • the separation-preventing pin 130 prevents the floating member 200 from separating from the socket main body 100 while the floating member 200 is being accommodated in the floating-member accommodating cavity 101 of the socket main body 100.
  • the floating member 200 has to be forcibly separable when proper force is applied thereto for replacement or cleaning.
  • the separation-preventing pin 130 protrudes toward the floating member 200.
  • the separation-preventing pin 130 includes a flange end portion 131 transversely extended from a pillar portion 133, and hooking projections 132-1 and 132-2 having hooking protrusion 134 transversely protruding from a free end portion opposite to the flange end portion 131.
  • the hooking projections 132-1 and 132-2 are branched into two by a cutting groove 136 formed in a longitudinal direction. Alternatively, the hooking projections may be branched into three or more in accordance with shapes of the cutting groove. Further, a single hooking projection may be provided without the cutting groove.
  • the hooking projections 132-1 and 132-2 may be elastically transformed with respect to the cutting groove 136.
  • Each of the hooking projections 132-1 and 132-2 has a tapered free end. With this tapered structure, each of the hooking projections 132-1 and 132-2 can be easily inserted in a hooking-projection receiving hole 230 of the floating member 200.
  • the separation-preventing pin 130 is inserted in a separation-preventing pin receiving hole 142 formed on the bottom 140 of the floating-member accommodating cavity 101 so that the hooking projections 132-1 and 132-2 is protruded into the floating-member accommodating cavity 101.
  • the separation-preventing pin receiving hole 142 is designed to allow the received separation-preventing pin 130 to move up and down and prevent the received separation-preventing pin 130 from separating by the flange end portion 131.
  • the separation-preventing pin 130 may be designed not to be moved up and down from the separation-preventing pin receiving hole 142 when the flange end portion 131 has a more height.
  • the floating member 200 has a test object accommodating cavity 201 opened upward.
  • the test object accommodating cavity 201 includes terminal holes 222 on the bottom thereof to receive bump terminals of the test object like a semiconductor chip by way of example.
  • the terminal holes 222 are generally formed by full penetration, but not limited thereto. Alternatively, the terminal holes may be filled with an electric conductor.
  • the bottom 220 of the floating member 200 includes four first openings 210 arranged at positions corresponding to the ball plungers 110 supported on the socket main body 100, and four hooking-projection receiving holes 230 to receive the hooking projections 132-1 and 132-2 of the separation-preventing pin 130.
  • the hooking-projection receiving hole 230 is formed with a locking protrusion 234 on an inner wall thereof to engage with the hooking protrusions 134 of the hooking projections 132-1 and 132-2. Therefore, the hooking projections 132-1 and 132-2 are inserted together with alignment between the four ball plungers 110 and the four first openings 210 and alignment between the four separation-preventing pins 130 and the four hooking-projection receiving holes 230, so that the terminals of the test object mounted to the floating member 200 can be more exactly aligned with the probe 120 supported on the the socket main body 100.
  • FIG. 3 shows a state before the floating member 200 is accommodated in the floating-member accommodating cavity 101 of the socket main body 100. At this time, the separation-preventing pin 130 is put on the bottom of the separation-preventing pin receiving hole 142 by its own weight.
  • FIG. 4 shows that the hooking projections 132-1 and 132-2 of the separation-preventing pin 130 are received in the hooking-projection receiving hole 230 as the floating member 200 is accommodated in the floating-member accommodating cavity 101 of the socket main body 100.
  • the hooking protrusions 134 of the hooking projections 132-1 and 132-2 are engaged with the locking protrusion 234 of the hooking-projection receiving hole 230.
  • the protruding ball plungers 110 are inserted in the first opening 210, and the floating member 200 is elastically pressing the ball plunger 110.
  • FIG. 5 shows that the floating member 200 is moved upward by the elastic restoring force of the ball plunger 110 when the pressure of the floating member 200 in FIG. 4 is released.
  • the separation-preventing pin 130 coupled to the floating member 200 is also lifted up by the engagement between the hooking protrusion 134 and the locking protrusion 234.
  • the floating member 200 is elastically movable within an allowable range of the separation-preventing pin 130 but prevented from separating from the socket main body 100. If the floating member 200 is lifted up by force stronger than a predetermined threshold, the hooking projections 132-1 and 132-2 are elastically transformed, for example, with respect to the cutting groove 136, to thereby release the hooking protrusion 134 from the locking protrusion 234.
  • the floating member 200 is separable from the socket main body 100 for replacement, repairing, cleaning, etc. Therefore, the hooking projections 132-1, 132-2 are elastically transformed not to be separated by vertical movement for the test but to be forcibly separated by proper force.
  • the test socket 1 may have a width of 15.0mm to 100.0 mm and a length of 15.0mm to 150.0mm. Therefore, the width of the hooking protrusion 134 may be designed to range from 0.1mm to 0.2mm by taking the elastic transformation of the hooking projections 132-1, 132-2 into account. That is, if the width of the hooking protrusion 134 is smaller than the range, the floating member 200 is separated at the test. On the other hand, if the width of the hooking protrusion 134 is greater than the range, the hooking protrusion 134 or the locking protrusion 234 may be broken when the floating member 200 is forcibly separated.
  • the separation preventing structure 130, 230 is not limited to the foregoing structure.
  • the separation-preventing pin may be provided in the floating member, and the hooking-projection receiving hole may be provided in the socket main body 100.
  • a groove having a locking protrusion may be formed on an outer side of the floating member as a hooking-projection receiving groove, and a hooking projection having a hooking protrusion to engage with the locking protrusion may be provided in an outer side of the bottom of the floating-member accommodating cavity of the socket main body.
  • a lateral wall of the floating-member accommodating cavity may be provided with a configuration in which the hooking protrusion is protruded therefrom with being accommodated the hooking projection in the groove.
  • the hooking-projection receiving groove has to be designed to elastically deform the hooking projection accommodated therein.
  • the test socket has the simple separation-preventing structure for the floating member, thereby reducing manufacturing costs.
  • this separation-preventing structure for the floating member is used to achieve more exact alignment between the terminal of the test object mounted to the floating member and the probe of the socket main body.
  • the test socket may be used in manufacturing process of the semiconductor chip.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Connecting Device With Holders (AREA)

Abstract

L'invention concerne une prise de test dans laquelle un élément flottant destiné à accueillir un objet de test lors d'un test est empêché de se séparer d'un corps principal de prise. Le dispositif anti-séparation de la prise de test comprend des saillies d'accrochage qui dépassent de l'un parmi l'élément flottant et le corps principal de prise vers l'autre, sont élastiquement transformables dans une direction transversale à leur direction de saillie, et ont des saillies d'accrochage dépassant transversalement depuis leurs parties d'extrémité libre ; et une saillie de verrouillage qui est prévue dans l'autre parmi l'élément flottant et le corps principal de prise, et qui vient en prise avec la saillie d'accrochage de telle sorte que l'élément flottant puisse flotter à l'intérieur d'une plage verticale prédéfinie par rapport au corps principal de prise.
PCT/KR2016/002799 2015-04-03 2016-03-21 Prise de test WO2016159548A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020150047520A KR20160118796A (ko) 2015-04-03 2015-04-03 테스트 소켓
KR10-2015-0047520 2015-04-03

Publications (1)

Publication Number Publication Date
WO2016159548A1 true WO2016159548A1 (fr) 2016-10-06

Family

ID=57005204

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2016/002799 WO2016159548A1 (fr) 2015-04-03 2016-03-21 Prise de test

Country Status (3)

Country Link
KR (1) KR20160118796A (fr)
TW (1) TW201637312A (fr)
WO (1) WO2016159548A1 (fr)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI669509B (zh) * 2016-11-03 2019-08-21 台灣福雷電子股份有限公司 晶片測試基座及晶片測試基座的靜電消散能力的判定方法
KR102119862B1 (ko) 2019-02-20 2020-06-05 (주)티에스이 테스트 소켓
KR102105874B1 (ko) * 2019-02-21 2020-04-29 주식회사 티에프이 반도체패키지 테스트용 소켓모듈 및 그를 구비하는 반도체패키지 도킹플레이트
KR102043646B1 (ko) * 2019-07-02 2019-11-14 주식회사 경성금형 반도체칩 접합장치
KR102192919B1 (ko) 2019-11-19 2020-12-18 (주)티에스이 테스트 소켓 장치 및 그 제조방법
KR102192764B1 (ko) 2019-11-19 2020-12-18 (주)티에스이 테스트 소켓 장치
KR102193447B1 (ko) 2019-12-09 2020-12-21 (주)티에스이 테스트 소켓
KR102223445B1 (ko) 2020-01-22 2021-03-05 (주)티에스이 테스트 소켓
KR102519846B1 (ko) 2020-03-26 2023-04-11 (주)티에스이 반도체 패키지의 테스트 장치
TWI760155B (zh) 2020-03-26 2022-04-01 南韓商Ｔｓｅ有限公司 半導體封裝的測試裝置
KR102644471B1 (ko) 2021-08-27 2024-03-07 주식회사 티에스이 반도체 패키지의 테스트 장치
KR102666185B1 (ko) 2022-09-30 2024-05-16 주식회사 티에스이 번인 소켓

Citations (5)

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Publication number Priority date Publication date Assignee Title
JP2002156408A (ja) * 2000-11-20 2002-05-31 Advantest Corp ソケット接続端子クリーニングキット、ソケット接続端子クリーニング方法および電子部品試験装置
KR101094826B1 (ko) * 2011-01-14 2011-12-16 하이콘 주식회사 Ｉｃ 안착 플레이트를 구비한 소켓
KR20130123193A (ko) * 2012-05-02 2013-11-12 리노공업주식회사 테스트 소켓
KR101442704B1 (ko) * 2013-10-23 2014-09-23 주식회사 하나엔-텍 반도체소자 검사용 인서트 소켓
KR20140147207A (ko) * 2013-06-18 2014-12-30 주식회사 아이에스시 검사용 인서트

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002156408A (ja) * 2000-11-20 2002-05-31 Advantest Corp ソケット接続端子クリーニングキット、ソケット接続端子クリーニング方法および電子部品試験装置
KR101094826B1 (ko) * 2011-01-14 2011-12-16 하이콘 주식회사 Ｉｃ 안착 플레이트를 구비한 소켓
KR20130123193A (ko) * 2012-05-02 2013-11-12 리노공업주식회사 테스트 소켓
KR20140147207A (ko) * 2013-06-18 2014-12-30 주식회사 아이에스시 검사용 인서트
KR101442704B1 (ko) * 2013-10-23 2014-09-23 주식회사 하나엔-텍 반도체소자 검사용 인서트 소켓

Also Published As

Publication number Publication date
KR20160118796A (ko) 2016-10-12
TW201637312A (zh) 2016-10-16

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