WO2016147390A1 - Ligne de montage de composants et procédé de configuration de ligne de montage de composants - Google Patents

Ligne de montage de composants et procédé de configuration de ligne de montage de composants Download PDF

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Publication number
WO2016147390A1
WO2016147390A1 PCT/JP2015/058296 JP2015058296W WO2016147390A1 WO 2016147390 A1 WO2016147390 A1 WO 2016147390A1 JP 2015058296 W JP2015058296 W JP 2015058296W WO 2016147390 A1 WO2016147390 A1 WO 2016147390A1
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WIPO (PCT)
Prior art keywords
component
stage
component mounting
substrate
transfer device
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PCT/JP2015/058296
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English (en)
Japanese (ja)
Inventor
哲也 大森
Original Assignee
富士機械製造株式会社
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Application filed by 富士機械製造株式会社 filed Critical 富士機械製造株式会社
Priority to JP2017505984A priority Critical patent/JP6553709B2/ja
Priority to PCT/JP2015/058296 priority patent/WO2016147390A1/fr
Publication of WO2016147390A1 publication Critical patent/WO2016147390A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components

Definitions

  • the present invention relates to a component mounting line in which a plurality of component mounting machines are arranged in series, and a setup method for changing the type of a board produced on the component mounting line.
  • Equipment that produces boards with a large number of components mounted on them includes solder printers, component mounters, reflow machines, and board inspection machines. It has become common to configure a substrate production line by connecting these facilities. Furthermore, a component mounting line is often configured by arranging a plurality of component mounting machines in series.
  • the component mounter includes a board transfer device, a component supply device, a component transfer device, and a control device. In order to mount various components having different sizes and shapes, in the component transfer apparatus, a plurality of types of mounting nozzles are used by being replaced with mounting heads.
  • Patent Document 1 discloses a technique in which two mounting heads of a component mounting machine automatically interchange mounting nozzles.
  • the electronic component mounting apparatus disclosed in Patent Document 1 is a dual lane dual head type component mounting machine having first and second nozzle changers (nozzle stations) for exchanging nozzles mounted on the first and second heads, respectively. is doing. And when switching the kind of board
  • the first and second heads can accommodate a plurality of nozzles.
  • the required number of nozzles increases, it becomes impossible to cope with them.
  • various types of nozzles have been developed in order to improve production efficiency in addition to diversification of types of parts. For this reason, the necessity to use properly the nozzle exceeding the accommodation number of the 1st and 2nd nozzle change machine (nozzle station) is increasing. In this case, when changing the kind of board
  • the present invention has been made in view of the problems of the background art described above, and reduces the time and labor required for setting up and removing exchange members such as mounting nozzles when changing the type of substrate to be produced. It is an object to be solved to provide a component mounting line with improved performance and a component mounting line setup method.
  • the component mounting line of the present invention that solves the above-described problems includes a substrate transfer device that carries a substrate into a mounting execution position, positions and unloads, and first and first components that are arranged on both sides of the substrate transfer device and sequentially supply components. Between a two-component supply device, a component transfer device that picks up the components from the first and second component supply devices and places them on a positioned substrate, and the substrate transfer device and the first component supply device. A first stage that detachably holds a replacement member that is disposed and used for replacement, and a first stage that is detachably held for replacement and disposed between the substrate transfer device and the second component supply device.
  • a component mounting line in which a plurality of component mounting machines including two stages are arranged in series, and are held on the second stage using the component transfer device of the component mounting machine. To transfer the exchange member that are no longer to the first stage, and a control device for transferring the exchange member carried into the first stage to the second stage.
  • the component transfer device when changing the type of board to be produced, the component transfer device is used to transfer the replacement member that is held on the second stage and is no longer used to the first stage. . And the replacement member carried in the 1st stage is moved to the 2nd stage using a component transfer device. For this reason, the operator can perform the setup work for carrying out and carrying in the replacement member only on the first stage. In other words, the operator only needs to perform setup work from one side of the component mounting machine, and does not need to go to the opposite side. Therefore, in a component mounting line in which a plurality of component mounting machines are arranged in series, an operator only needs to move one side of the component mounting line, and there is no need to go back and forth between both sides. It is reduced and workability is improved.
  • FIG. 1 is a plan view illustrating a configuration of a component mounting line 1 according to the first embodiment.
  • a solder printer 93 is arranged on the upstream side of the component mounting line 1 (left side in FIG. 1).
  • the board K on which the printing process has been performed by the solder printer 93 is carried into the component mounting line 1 by the board conveying device 91.
  • a board inspection machine 94 and a reflow machine 95 are disposed downstream of the component mounting line 1 (on the right side in FIG. 1).
  • the board K subjected to the mounting process in the component mounting line 1 is carried into the board inspection machine 94 by the board transfer device 92.
  • the direction from the left side to the right side of the drawing is the X-axis direction for transporting the substrate K.
  • the component mounting line 1 includes first and second component mounters 2 and 3 for mounting relatively small components, and a third component mounter 4 for mounting relatively large components in series in the order described. It is arranged and configured.
  • the substrate K is linearly conveyed through the three component mounting machines 2 to 4 so that a predetermined plurality of types of components are mounted.
  • FIG. 2 is a plan view illustrating the configuration of the first component mounter 2 as an example.
  • the first component mounting machine 2 includes a substrate transfer device 21, a first component supply device 22, a second component supply device 23, a component transfer device 25, a first stage 26, a second stage 27, a control device 28, and the like. It is arranged on the machine base 29.
  • the substrate transfer device 21 includes a pair of guide rails 211, a conveyor belt, a backup device, and the like.
  • the pair of guide rails 211 extend in the transport direction (X-axis direction) and are arranged in parallel to form a transport path.
  • the conveyor belt is an endless ring and is stretched along the conveyance path.
  • the conveyor belt places the substrate K, rotates and conveys the substrate K.
  • the backup device is disposed below the conveyor belt, and positions the substrate K at the mounting position at the approximate center of the transport path. 1 and 2 show the substrate K positioned at the mounting position.
  • the first component supply device 22 is disposed on one side (the lower side of FIGS. 1 and 2) of the substrate transfer device 21.
  • the first component supply device 22 includes a movable pallet base 221 and a plurality of feeder devices 222.
  • the movable pallet base 221 is detachably disposed on the upper surface of the main body base 29.
  • the movable pallet base 221 can be pulled out away from the main body base 29 using a cart 98 having casters 99.
  • the movable pallet base 221 has a plurality of groove-like slots formed on the upper surface thereof. In each slot, the bottom of the feeder device 222 is detachably inserted. Each feeder device 222 has a supply reel (not shown) around which a long and narrow tape in which components are stored at a predetermined pitch is wound. The tape is pulled out from the supply reel at a predetermined pitch, and the parts are sequentially supplied.
  • the first component supply device 22 can be detached from the main body base 29.
  • the second component supply device 23 is disposed on the other side (upper side in FIG. 1) of the substrate transfer device 21.
  • the second component supply device 23 includes a fixed pallet base 231 and a plurality of feeder devices 232.
  • the fixed pallet base 231 is fixed to the upper surface of the main body base 29. Similar to the movable pallet table 221, the fixed pallet table 231 also has a plurality of slots formed on the upper surface thereof, and a plurality of feeder devices 232 are removably inserted.
  • the second component supply device 23 cannot be removed from the main unit base 29.
  • the component transfer device 25 is a dual head type device, and includes a pair of X-axis direction rails, first and second beams 251 and 252, first and second mounting heads 253 and 254, and the like.
  • a pair of unillustrated X-axis direction rails are arranged above the substrate transport device 21 and extend in the X-axis direction.
  • the first beam 251 is spanned on the side closer to the second component mounting machine 3 of the pair of X-axis direction rails, and is movable in the X-axis direction.
  • the second beam 252 is bridged on the side near the solder printer 93 of the pair of X-axis direction rails and is movable in the X-axis direction.
  • the first mounting head 253 is held by the first beam 251 and can move in the Y-axis direction.
  • the second mounting head 254 is held by the second beam 252 and can move in the Y-axis direction.
  • the first and second mounting heads 253 and 254 are controlled to move by a head driving mechanism so as not to interfere with each other.
  • the first and second mounting heads 253 and 254 respectively hold the suction nozzle 51 in a detachable manner on the lower side.
  • the suction nozzle 51 sucks and collects parts using negative pressure and mounts the parts using positive pressure.
  • a plurality of types of suction nozzles 51 are prepared according to the size and shape of the parts.
  • the suction nozzle 51 corresponds to an exchange member of the present invention that is used after being exchanged.
  • the component transfer device 25 uses the suction nozzle 51 of the first mounting head 253 to collect components from the feeder devices 222 and 232 close to the second component mounter 3 of the first and second component supply devices 22 and 23. Is mounted on the substrate K. Further, the component transfer device 25 collects components from the feeder devices 222 and 232 close to the solder printer 93 of the first and second component supply devices 22 and 23 using the suction nozzle 51 of the second mounting head 254. Is mounted on the substrate K.
  • the first stage 26 is disposed on the upper surface of the main body base 29 between the substrate transfer device 21 and the first component supply device 22.
  • a nozzle station 61 is placed on the first stage 26 in a replaceable manner.
  • the second stage 27 is disposed on the upper surface of the main body base 29 between the substrate transfer device 21 and the second component supply device 23.
  • the nozzle station 61 is also placed on the second stage 27 in a replaceable manner.
  • the nozzle station 61 placed on the second stage 27 has the same shape as the nozzle station 61 placed on the first stage 26, and is not limited to this, and may have different shapes.
  • the nozzle station 61 is a substantially box-shaped member, and has a total of five nozzle holding portions 62 on the upper surface.
  • the nozzle station 61 detachably holds the suction nozzle 51 in each nozzle holding portion 62.
  • the nozzle station 61 of the first stage 26 of the first component mounting machine 2 shown in FIG. 2 holds the suction nozzles 51 in the four nozzle holding parts 62 and leaves the nozzle holding parts 62 in the empty state.
  • maintenance part 62 is not limited to five places, and in many cases, actually exceeds five places.
  • the suction nozzle 51 for the first mounting head 253 is held at the nozzle station 61 of the first stage 26.
  • the nozzle station 61 of the second stage 27 holds the suction nozzle 51 for the second component supply device 23 for the second mounting head 254.
  • this restriction does not apply during setup work. That is, in the present embodiment, the suction nozzle 51 for the second mounting head 254 is temporarily held in the nozzle station 61 of the first stage 26.
  • the component transfer device 25 has a function of automatically replacing the suction nozzle 51 while the substrate K is being produced.
  • the component transfer device 25 moves the first or second mounting heads 253 and 254 above the nozzle station 61 mounted on the first stage 26 or the second stage 27.
  • the component transfer device 25 places the suction nozzle 51 that is no longer used in accordance with a predetermined replacement procedure on the vacant nozzle holder 62, and sets the suction nozzle 51 to be used to the first or second mounting head 253, Held at 254.
  • the worker When accessing the first stage 26, the worker can pull out the carriage 98 and remove the first component supply device 22 from the main body base 29. Therefore, the operator can approach the first stage 26, and the setup work for carrying out and carrying in the nozzle station 61 is easy. The operator can carry out and carry in only the specific suction nozzle 51 instead of carrying out and carrying in the entire nozzle station 61.
  • the control device 28 is incorporated in the main unit base 29, and the arrangement position thereof is not particularly limited.
  • the control device 28 incorporates mounting job data corresponding to the type of substrate K to be produced and operates with software.
  • the mounting job data includes a command for replacing the suction nozzles 51 of the first and second mounting heads 253 and 254.
  • the control device 28 controls the operation of the mounting process in cooperation with the host computer of the host and the control unit of each of the lower devices 21, 22, 23, 25.
  • the control device 28 also counts the number of boards K that have completed the mounting process and the number of components used by the first and second component supply devices 22 and 23, and exchanges information with the host computer when a component breakage occurs. And contact the operator.
  • the control device 28 includes a display unit for displaying information to the operator and an input unit for performing input settings by the operator.
  • the second component mounter 3 has the same function as the first component mounter 2 and the same function. That is, the second component mounter 3 includes a substrate transfer device 31, a first component supply device 32, a second component supply device 33, a component transfer device 35, a first stage 36, a second stage 37, a control device 38, and the like. Is arranged on the main machine base 39.
  • the first component supply device 32 is disposed on one side (the lower side in FIG. 1) of the substrate transfer device 31 and can be detached from the main body base 39. Therefore, when accessing the first stage 36 and the nozzle station 61 on the first stage 36, the operator can easily perform the setup work by removing the first component supply device 32 from the main body base 39.
  • the second component supply device 33 is disposed on the other side (upper side in FIG. 1) of the substrate transport device 31 and is fixed to the upper surface of the main body base 39. For this reason, it is difficult and troublesome for the operator to access the second stage 37 and the nozzle station 61 on the second stage 37.
  • the third component mounting machine 4 includes a substrate transfer device 41, a first component supply device 42, a second component supply device 43, a component transfer device 45, a first stage 46, a second stage 47, a control device 48, and the like. It is arranged on the machine base 49.
  • the configuration of the second component supply device 43 is different from that of the first and second component mounters 2, 3, and the configurations of the other parts 41, 42, 45 to 48 are the first and second components.
  • the first component supply device 42 is disposed on one side (the lower side in FIG. 1) of the substrate transfer device 41 and can be detached from the main body base 49. Therefore, when accessing the first stage 46 and the nozzle station 61 on the first stage 46, the operator can remove the first component supply device 42 from the main body base 49 and easily perform the setup work.
  • the second component supply device 43 of the third component mounting machine 4 is disposed on the other side (upper side in FIG. 1) of the substrate transfer device 41.
  • the second component supply device 43 includes a fixed pallet base 431, a plurality of feeder devices 432, and a tray device 433.
  • the fixed pallet base 431 is fixed to the upper surface of the main body base 49.
  • a plurality of slots are formed on the side of the fixed pallet table 431 close to the board inspection machine 94, and a feeder device 432 is detachably inserted into each slot.
  • a tray device 433 is disposed on the side of the fixed pallet table 431 close to the second component mounting machine 3.
  • the tray device 433 places and supplies large components on a replaceable tray 434.
  • the tray device 433 is formed larger in the Y-axis direction than the feeder device 432.
  • the nozzle station 61 placed on the second stage 47 of the third component mounting machine detachably holds a large suction nozzle for large diameter in addition to the suction nozzle 51 for small diameter.
  • the large suction nozzle picks up and collects a large part from the tray device 433.
  • the nozzle station 61 may detachably hold a sandwiching nozzle that is picked up by sandwiching a large component.
  • FIG. 3 is a diagram illustrating and explaining the procedure of the first setup work when changing the type of substrate to be produced. 4 to 6, only the first stage 26, the second stage 27, the suction nozzle 51, and the nozzle station 61 of the first component mounter 2 are shown in order to simplify the description.
  • FIG. 4 is a diagram showing the state of the first and second stages 26 and 27 at the time when the first setup operation is started. As shown in the figure, when the production of the first substrate type K1 is completed and the first setup operation is started, the first nozzle station 611 placed on the first stage 26 and the second stage 27 are placed. The placed second nozzle station 612 does not hold the suction nozzle 51.
  • the suction nozzle 51 used for production is specified in the mounting job data of the second substrate type K2. Specifically, A-shaped, B-shaped, and C-shaped suction nozzles 51A, 51B, and 51C are designated for the first mounting head 253, and A-shaped, D-shaped, and E-shaped suction nozzles 51A for the second mounting head 254. , 51D, 51E are designated. Then, in the first step S1 of FIG. 3, the control device 28 replenishes the first stage 26 with the B-type and C-type suction nozzles 51B and 51C for the first mounting head 253 and the second stage 27 with the second mounting. The guidance display is performed so that the D-type and E-type suction nozzles 51D and 51E for the head 254 are replenished.
  • FIG. 5 is a diagram showing the state of the first and second stages 26 and 27 at the time when the second step S2 of the first setup operation is completed.
  • the control device 28 issues a command to transfer the D-type and E-type suction nozzles 51 ⁇ / b> D and 51 ⁇ / b> E of the third nozzle station 613 to the second nozzle station 612 of the second stage 26.
  • the component transfer apparatus 25 performs a part of the setup work by using one mounting head (hereinafter referred to as a first mounting head 253). That is, the component transfer device 25 first places the A-shaped suction nozzle 51A held by the first mounting head 253 on the vacant component holder 62 of the third nozzle station 613 (shown by a broken line in FIG. 5). .
  • the component transfer device 25 moves the first mounting head 253 in accordance with the command and transfers the D-shaped and E-shaped suction nozzles 51D and 51E (see broken line arrows M1 and M2 in FIG. 5). Thereafter, the component transfer device 25 holds the A-shaped suction nozzle 51 ⁇ / b> A in the first mounting head 253 again.
  • FIG. 6 is a diagram showing the state of the first and second stages 26 and 27 at the time when the fourth step S4 of the first setup operation is completed. At this time, the setup of the A-type to E-type suction nozzles 51A to 51E is completed.
  • next fifth step S5 the worker attaches the first component supply device 22 to the main body base 29. As a result, the production of the second substrate type K2 can be started.
  • FIG. 7 is a diagram illustrating the procedure of the second setup operation when changing the type of substrate to be produced.
  • first stage 26, the second stage 27, the suction nozzle 51, and the nozzle station 61 of the first component mounter 2 are shown in FIGS.
  • the suction nozzle 51 used for production is specified. Specifically, A-type, B-type, and F-type suction nozzles 51A, 51B, 51F are designated for the first mounting head 253, and A-type, D-type, and G-type suction nozzles 51A are specified for the second mounting head 254. , 51D, 51G are designated. Then, in the first stage 26, the C-type suction nozzle 51C is not used, and the F-type suction nozzle 51F needs to be replenished. On the other hand, in the second stage 27, the E-type suction nozzle 51E is not used, and the G-type suction nozzle 51G needs to be replenished.
  • the control device 28 displays the C-shaped suction nozzle 51C that is no longer used on the first stage 26 and the E-shaped suction nozzle 51E that is no longer used on the second stage 27. To do. Further, the control device 28 displays a guidance for the F-type suction nozzle to be supplied to the first stage 26 and the G-type suction nozzle 51G to be supplied to the second stage 27.
  • the control device 28 sends a command to transfer the E-shaped suction nozzle 51 ⁇ / b> E from the second nozzle station 612 of the second stage 27 to the fourth nozzle station 614 of the first stage 26.
  • the component transfer device 25 performs a part of the setup work by using one mounting head (second mounting head 254 in the following description). That is, the component transfer device 25 first places the A-shaped suction nozzle 51A held by the second mounting head 254 on the vacant component holder 62 of the second nozzle station 612 (shown by a broken line in FIG. 8). .
  • FIG. 8 is a diagram showing the states of the first and second stages 26 and 27 at the time when the twelfth step S12 of the second setup operation is completed.
  • FIG. 9 is a diagram showing the states of the first and second stages 26 and 27 at the time when the fifteenth step S15 of the second setup operation is completed.
  • the control device 28 issues a command for transferring the G-shaped suction nozzle 51G of the fourth nozzle station 614 to the second nozzle station 612 of the second stage 26 to the component transfer device 25.
  • the component transfer device 25 moves the second mounting head 254 according to the command and transfers the G-shaped suction nozzle 51G (see the broken line arrow M8 in FIG. 10). Thereafter, the component transfer device 25 holds the A-shaped suction nozzle 51 ⁇ / b> A in the second mounting head 254 again.
  • FIG. 10 is a diagram showing the states of the first and second stages 26 and 27 at the time when the sixteenth step S16 of the second setup operation is completed. At this time, the setup of the A-type to C-type, F-type, and G-type suction nozzles 51A to 51C, 51F, and 51G is completed.
  • step S ⁇ b> 17 the worker attaches the first component supply device 22 to the main body base 29.
  • the production of the third substrate type K3 can be started.
  • the operator performs the setup work only with the first stage 26 and does not access the second stage 27.
  • the nozzle station 61 of the second stage 27 is set up by transferring the suction nozzle 51 between the first stage 26 and the second stage 27 using the component transfer device 25.
  • the loading / unloading work to the first stage 26, 36, 46 is performed from the first component supply device 22, 32, 42 side, and from the second component supply device 23, 33, 43 side. Carrying in / out operations to the second stages 27, 37, and 47 were performed. Therefore, on the side of the second component supply devices 23, 33, and 43, the worker gets out of the side to the upper part of the second component supply devices 23, 33, and 43 and extends his arms to the second stages 27, 37, and 47. It was necessary and it was difficult to carry in and out. Furthermore, since the operator goes back and forth between the both sides of the component mounting line 1 many times, workability has been significantly reduced.
  • suction nozzle 51 and the sandwiching nozzle have been described as replacement members to be used by replacement, the present invention is not limited to this. That is, as a replacement member that is detachably held on the first and second stages 26, 27, 36, 37, 46, and 47, there are a nozzle tool, a calibration jig, a backup pin, and the like.
  • the nozzle tool is a member that is detachably held on the mounting head 252 and has a plurality of suction nozzles.
  • the calibration jig is a member that is detachably held on the mounting head 252 and is used for calibration of position control of the head drive mechanism.
  • the backup pin is a member that is placed on the backup plate of the backup device provided in the substrate transfer devices 21, 31, 41 and presses the substrate K from the back side. Carrying in and carrying out these replacement members can be performed only by the first stage 26, similarly to the suction nozzle 51.
  • the component mounting line 1 according to the first embodiment is disposed on both sides of the substrate transfer devices 21, 31, 41 that carry the substrate K into the mounting execution position, position it, and carry it out, and the substrate transfer devices 21, 31, 41. Parts are collected from the first and second component supply devices 22, 23, 32, 33, 42, 43 and the first and second component supply devices 22, 23, 32, 33, 42, 43. An exchange member (placed between the component transfer devices 25, 35, and 45 to be mounted on the positioned substrate, and the substrate transfer devices 21, 31, and 41 and the first component supply devices 22, 32, and 42).
  • the component mounting line 1 of the first embodiment when changing the type of the substrate K to be produced, it is held by the second stages 27, 37, 47 using the component transfer devices 25, 35, 45.
  • the replacement member that is no longer used is transferred to the first stage 26, 36, 46.
  • the replacement members carried in the first stages 26, 36, 46 are transferred to the second stages 27, 37, 47 using the component transfer devices 25, 35, 45.
  • the operator can perform the setup work for carrying out and carrying in the replacement member (suction nozzle 51) only by the first stages 26, 36, and 46. In other words, the worker only needs to perform setup work from one side of the component mounting machines 2, 3, and 4, and does not need to go to the opposite side.
  • the operator only needs to move one side of the component mounting line 1, and need to go back and forth between both sides. This eliminates the trouble of setup work and improves workability.
  • the first stages 26, 36, 46 of the component mounting machines 2, 3, 4 can easily carry in and carry out the replacement member (suction nozzle 51), and the second stages of the component mounting machines 2, 3, 4 are easy to carry out. It is difficult for the stages 27, 37, and 47 to carry in and carry out the replacement member (suction nozzle 51).
  • the first component supply devices 22, 32, 42 are removable from the main body bases 28, 88, 48 to facilitate access to the first stages 26, 36, 46.
  • the two-part supply devices 23, 33, and 43 are fixed to the main body bases 28, 38, and 48, making it difficult for the 27, 37, and 47 to approach the second stage.
  • the second component supply device 43 of the third component mounting machine 4 is formed larger than the first component supply device 42, making it difficult to approach the second stage 47.
  • the replacement member is detachably held by the mounting head 252 and is sucked and picked up by a component.
  • the holding nozzle detachably held by the mounting head 252 and the pinch nozzle that picks up the component and is detachable from the mounting head 252.
  • a nozzle tool having a plurality of suction nozzles, a calibration jig which is detachably held by the mounting head 252 and used for calibration of position control of the head drive mechanism, and the substrate transport devices 21, 31, 41. It includes at least one member of a backup pin that is placed on the backup plate of the backup device and presses the substrate K from the back.
  • the present invention is not limited to changing the type of substrate to be produced, and the labor of various setup operations is reduced in various scenes, thereby improving workability.
  • the nozzle station 61 that holds the plurality of suction nozzles 51 in a detachable manner is carried into and out of the first stages 26, 36, and 46 from the first component supply devices 22, 32, and 42 sides.
  • one nozzle station 61 may be carried out and carried in. Therefore, the workability of the setup work is further remarkably improved.
  • the component mounting line 1 of the first embodiment can be implemented as a component mounting line setup method. That is, the component mounting line setup method according to the embodiment is arranged on both sides of the board transfer devices 21, 31, 41 for loading, positioning and unloading the board K at the mounting execution position, and the board transfer devices 21, 31, 41.
  • the first and second component supply devices 22, 23, 32, 33, 42, 43 and the first and second component supply devices 22, 23, 32, 33, 42, 43 are sequentially collected. Exchange between the component transfer devices 25, 35, 45 to be mounted on the substrate positioned in this way, the substrate transfer devices 21, 31, 41, and the first component supply devices 22, 32, 42.
  • the member (suction nozzle 51) is detachably held between the first stage 26, 36, 46, the substrate transport device 21, 31, 41, and the second component supply device 23, 33, 43.
  • a component mounting line 1 in which a plurality of component mounting machines 2, 3, and 4, each having a second stage 27, 37, and 47 that detachably hold a replacement member (suction nozzle 51) to be detachable, are arranged in series.
  • the component transfer device 25 of the component mounter 2 carries in the replacement member (D-type, E-type, G-type suction nozzles 51D, 51E, 51G) carried into the first stage 26 to the second stage 27. And a process.
  • the effect of the component mounting line setup method of the embodiment is the same as the effect of the component mounting line 1 of the first embodiment described above.
  • FIG. 11 is a plan view illustrating the configuration of a component mounting line 1A according to the second embodiment.
  • a solder printer 93 and a board transfer device 91 are arranged on the upstream side of the component mounting line 1A, and a board transfer device 92, a board inspection machine 94, and a reflow machine 95 are arranged on the downstream side. Yes.
  • the component mounting line 1A is configured by first to third component mounting machines 2A, 3A, and 4A having the same structure arranged in series in the described order.
  • the first component mounting machine 2A includes a board transfer device 21, a first component supply device 22A, a second component supply device 23A, a component transfer device 25, a first stage 26, a second stage 27, a control device 28, and the like. It is arranged on the machine base 29.
  • the first component mounting machine 2 ⁇ / b> A is configured substantially symmetrically with the substrate transfer device 21 at the center, except for the control device 28. That is, both the first component supply device 22 ⁇ / b> A and the second component supply device 23 ⁇ / b> A can be detached from the main body base 29 using the carriage 98.
  • the second and third component mounting machines 3A and 4A are also configured substantially symmetrically with the board transfer devices 31 and 41 at the center.
  • the second and third component mounting machines 3A and 4A are simply denoted by the same reference numerals and will not be described in detail.
  • the component mounting line 1A of the second embodiment is substantially symmetrical on both sides through the line.
  • the component mounting line 1A differs in the difficulty of the setup work on both sides due to the positional relationship with the passage 96 arranged on one side.
  • a passage 96 through which an operator always passes is disposed in the vicinity of the first component supply devices 22A, 32A, and 42A of the component mounting machines 2A, 3A, and 4A.
  • the passage 96 leads to a storage for storing the replacement nozzle station 61 and the suction nozzle 51. For this reason, the operator can easily approach the first part supply devices 22A, 32A, 42A and the first stages 26, 36, 46 through the passage 96 from the storage.
  • the first nozzle station 611 is carried out by the first stage 26, the third nozzle station 613 is carried in, and the fourth nozzle station 614 is carried in.
  • the C-type and E-type suction nozzles 51C and 51E are carried out by the first stage 26, and the F-type and G-type suction nozzles 51F and 51G are carried in.
  • the present invention is not limited to this, and which of the nozzle station 61 and the suction nozzle 51 is carried in / out can be appropriately determined in consideration of the number of suction nozzles 51 to be set up.
  • the C-type and E-type suction nozzles 51C and 51E are carried out in the second setup operation, but there is room in the component holding portions 62 of the second and fourth nozzle stations 612 and 614. You may leave it.
  • the difficulty of the setup work differs on both sides of the component mounting line 1 due to the asymmetric configuration of the component mounting line 1.
  • the difficulty level of the setup work differs on both sides of the component mounting line 1A due to the positional relationship with the passage 96.
  • other factors can also affect the difficulty of the setup work.
  • the arrangement of other production facilities, the position of the storage for storing the replacement nozzle station 61 and the suction nozzle 51, and the like also affect the difficulty of the setup work.
  • the present invention can be carried out to improve the workability of the setup work.
  • Various other applications and modifications are possible for the present invention.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

La présente invention concerne une ligne de montage de composants (1) dans laquelle une pluralité de machines de montage de composants (2) sont disposées en série. Chacune des machines de montage de composants comprend un dispositif de transport de substrat (21), des premier et deuxième dispositifs de fourniture de composants (22, 23), un dispositif de transfert de composants (25), un premier étage (26) disposé entre le dispositif de transport de substrat et un premier dispositif de fourniture de composants, et un deuxième étage (27) disposé entre le dispositif de transport de substrat et un deuxième dispositif de fourniture de composants. La ligne de montage de composants (1) est également équipée d'un dispositif de commande (28), qui utilise le dispositif de transfert de composants de la machine de montage de composants pour : transporter un élément de remplacement (buse d'adsorption de type E 51E), qui est maintenu par le deuxième étage et n'est plus utilisé, vers le premier étage ; et transporter des éléments de remplacement (buses d'adsorption de type D, de type E et de type G 51D, 51E, 51G), qui ont été installés sur le premier étage, vers le deuxième étage. Lors d'un changement du type du substrat (K) à produire, la maniabilité peut être améliorée par réduction des efforts dans l'opération de configuration de retrait et d'installation d'éléments de remplacement telle que le montage de buses.
PCT/JP2015/058296 2015-03-19 2015-03-19 Ligne de montage de composants et procédé de configuration de ligne de montage de composants WO2016147390A1 (fr)

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JP2017505984A JP6553709B2 (ja) 2015-03-19 2015-03-19 部品実装ライン、および部品実装ラインの段取り方法
PCT/JP2015/058296 WO2016147390A1 (fr) 2015-03-19 2015-03-19 Ligne de montage de composants et procédé de configuration de ligne de montage de composants

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Cited By (4)

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JP2018088522A (ja) * 2016-11-16 2018-06-07 エーエスエム・アセンブリー・システムズ・ゲーエムベーハー・ウント・コ・カーゲー 基板に構造要素を実装する方法、制御装置、コンピュータープログラム製品、及び自動実装機
CN113348736A (zh) * 2019-02-18 2021-09-03 株式会社富士 换产调整作业设定装置
CN114868466A (zh) * 2020-01-14 2022-08-05 株式会社富士 元件供给单元的换产调整系统
WO2022269771A1 (fr) * 2021-06-22 2022-12-29 株式会社Fuji Machine de montage de composants et procédé de commande de processus d'étalonnage

Families Citing this family (1)

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Publication number Priority date Publication date Assignee Title
US11856707B2 (en) * 2019-09-06 2023-12-26 Fuji Corporation Automatic backup pin arrangement system for component mounting machine

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JP2002141642A (ja) * 2000-11-02 2002-05-17 Matsushita Electric Ind Co Ltd 電子部品実装方法
JP2006114624A (ja) * 2004-10-13 2006-04-27 Yamagata Casio Co Ltd 電子部品搭載装置
JP2013254781A (ja) * 2012-06-05 2013-12-19 Juki Corp 電子部品実装装置

Patent Citations (3)

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Publication number Priority date Publication date Assignee Title
JP2002141642A (ja) * 2000-11-02 2002-05-17 Matsushita Electric Ind Co Ltd 電子部品実装方法
JP2006114624A (ja) * 2004-10-13 2006-04-27 Yamagata Casio Co Ltd 電子部品搭載装置
JP2013254781A (ja) * 2012-06-05 2013-12-19 Juki Corp 電子部品実装装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018088522A (ja) * 2016-11-16 2018-06-07 エーエスエム・アセンブリー・システムズ・ゲーエムベーハー・ウント・コ・カーゲー 基板に構造要素を実装する方法、制御装置、コンピュータープログラム製品、及び自動実装機
CN113348736A (zh) * 2019-02-18 2021-09-03 株式会社富士 换产调整作业设定装置
CN113348736B (zh) * 2019-02-18 2022-11-18 株式会社富士 换产调整作业设定装置
CN114868466A (zh) * 2020-01-14 2022-08-05 株式会社富士 元件供给单元的换产调整系统
CN114868466B (zh) * 2020-01-14 2024-02-06 株式会社富士 元件供给单元的换产调整系统
WO2022269771A1 (fr) * 2021-06-22 2022-12-29 株式会社Fuji Machine de montage de composants et procédé de commande de processus d'étalonnage

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JPWO2016147390A1 (ja) 2017-12-28

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