WO2016141650A1 - 一种盘状物夹持装置 - Google Patents

一种盘状物夹持装置 Download PDF

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Publication number
WO2016141650A1
WO2016141650A1 PCT/CN2015/083725 CN2015083725W WO2016141650A1 WO 2016141650 A1 WO2016141650 A1 WO 2016141650A1 CN 2015083725 W CN2015083725 W CN 2015083725W WO 2016141650 A1 WO2016141650 A1 WO 2016141650A1
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WIPO (PCT)
Prior art keywords
disc
ring gear
support pin
holding device
main body
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PCT/CN2015/083725
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English (en)
French (fr)
Inventor
王锐廷
张豹
姬丹丹
王浩
李伟
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北京七星华创电子股份有限公司
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Application filed by 北京七星华创电子股份有限公司 filed Critical 北京七星华创电子股份有限公司
Publication of WO2016141650A1 publication Critical patent/WO2016141650A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches

Definitions

  • the present invention relates to the field of semiconductor manufacturing equipment, and more particularly to a disc holding device.
  • a disk having a circular shape such as a semiconductor wafer or a wafer is usually subjected to a plurality of processes such as thin film deposition, etching, cleaning, and polishing. In these processes, it is necessary to support and hold the disc by the clamping device.
  • U.S. Patent No. 4,903,717 A discloses a clamping device comprising a jaw and a chuck, the jaw comprising a body portion and a clamping portion that are offset from each other such that the radial position of the clamping portion changes as the body portion rotates.
  • the silicon wafer can be taken when the clamping portion is moved radially outward to the open position, and contacts the peripheral edge of the silicon wafer when the clamping portion is moved radially inward to the clamping position, thereby preventing lateral displacement of the silicon wafer.
  • the lower end of the main body portion is provided with gear teeth that mesh with the teeth of the common toothed ring, and the common toothed ring is disposed coaxially with the rotating shaft of the chuck. Rotation of the ring gear relative to the chuck results in self-rotation of the body portion and radial movement of the clamping portion to effect pick-and-place and clamping action of the wafer.
  • the above conventional disc holding device has the following problems: the actuator at the end of the robot is at a distance from the upper surface of the chuck when the wafer is taken and placed, and the wafer is from the upper surface of the chuck when the wafer is processed.
  • the distance is equal; that is, when the silicon wafer is in the pick-and-place state and the process state, the distance between the silicon wafer and the upper surface of the chuck is constant.
  • the silicon wafer is kept at a certain distance from the upper surface of the chuck (usually about 10 mm), but if the process is at a large distance from the upper surface of the chuck during the process, It is easy to cause the treatment liquid on the upper surface of the silicon wafer to contaminate the back surface, that is, It is impossible to completely avoid the contamination of the back side of the silicon wafer by the backside jet method. If the distance between the silicon wafer and the surface of the chuck is reduced in order to avoid contamination, it is not convenient for the robot end effector to take and place the sheet.
  • the object of the present invention is to overcome the above-mentioned drawbacks of the prior art, and to provide a novel disc rotating device, which can make the silicon wafers at different heights in the pick-and-place state and the process state, which is not only advantageous for pick-and-place of the end effector of the robot.
  • the film action while avoiding the contamination of the back side of the silicon wafer, has the advantages of simple structure and convenient and reliable operation control mode.
  • a disc holding device comprising a rotating chuck on which a disc is placed; a rotating shaft that drives the rotating chuck to rotate; and a driving mechanism that drives the rotating shaft to rotate, wherein the rotating chuck includes :
  • the claws include a main body portion and a clamping portion protruding from the main body portion and offset from each other by an axis, the main body portion being rotated to cause the clamping Moving between a radially outwardly open position that is non-contacting the peripheral edge of the disk and a radially inwardly facing clamping position that contacts the peripheral edge of the disk;
  • a ring gear disposed coaxially with the base body and forming an engaging surface with the main body portion of the claw, the engaging surface being configured to enable the claw when the base body and the ring gear rotate relative to each other The main body portion is engaged with the ring gear to rotate automatically;
  • a plurality of support pins disposed on a periphery of the base body for carrying a disc, the support pin being driven by a stroke changing mechanism to perform a lifting movement; wherein, when the main body portion of the claw is rotated outward, The clamping portion of the claw releases the disk while the support pin carries the disk upward; when the body portion of the claw rotates inward, the support pin moves downward while the claw The clamping portion clamps the disc.
  • the disc holding device further includes a jack through which the ring gear is restricted and the driving mechanism drives the rotating shaft to rotate, so that the base body and the ring gear generate Relative rotation.
  • the stroke changing mechanism includes a swinging member, a sliding groove and a pulley, an inner end of the swinging member is coupled to the base shaft, and an outer end of the swinging member is provided with an upwardly extending front end, and the front end is Pushing the support pin to perform a lifting movement, a sliding groove and a pulley are disposed under the swinging member, and the pulley is mounted on a push rod of an inner side of the ring gear, and the axial direction of the push rod is perpendicular to The direction of the chute.
  • the base body is provided with a limiting surface for limiting the angle at which the swinging member swings.
  • the front end of the swinging member is provided with a rotating member for pushing the support pin.
  • the support pin is installed in a cylindrical groove, and the support pin comprises a support pin main body and a limit baffle, and the support pin main body passes through the base body for lifting movement.
  • an elastic compression spring is disposed between the limiting baffle of the support pin and the cylindrical groove.
  • the chuck is provided with a blowing assembly, and the blowing assembly is in communication with the rotating shaft for continuously blowing air to the back of the disc.
  • the edge of the ring gear is provided with a ring gear, and the lower end of the body portion of the claw forms a tooth that meshes with the ring gear.
  • the inside of the ring gear is a cavity, and the cavity is provided with a plurality of spokes.
  • the disc clamping device proposed by the present invention can cooperate with each other through the claw and the supporting pin.
  • the supporting pin can be raised and moved away from the chuck to ensure the end of the robot.
  • the pick-and-place action of the device when the disc is in the process state, the support pin is lowered, and the chuck is attached to prevent the back side of the silicon wafer from being contaminated.
  • the invention controls the distance between the disc and the chuck reasonably.
  • the utility model has the advantages of simple structure, convenient and reliable action control mode, and compatibility with various process processing chambers.
  • FIG. 1 is a schematic structural view of an embodiment of a disc holding and rotating device of the present invention
  • FIG. 2 is a perspective view showing the structure of the disc holding and rotating device in the pick-and-place state in a preferred embodiment of the present invention
  • FIG. 3 is a schematic structural view of a disc-shaped rotating device in a process state according to a preferred embodiment of the present invention
  • Figure 4 is a schematic view showing the structure of a preferred embodiment of the claw in the disc holding and rotating device of the present invention
  • Figure 5 is a schematic view showing the structure of a chuck in the disc holding and rotating device of the present invention.
  • Figure 6 is a schematic view showing the structure of a stroke changing mechanism in the disc holding and rotating device of the present invention.
  • the disc holding device includes a rotating chuck 10, a disc 20 is placed on the rotating chuck 10, a rotating shaft 30 for rotating the rotating chuck 10, and a rotating shaft 30 are driven to rotate.
  • Drive mechanism 40 In the present embodiment, the disk 20 is a silicon wafer, and the driving unit 40 is a driving motor.
  • the spin chuck 10 includes a base 60, a plurality of claws 70, and a ring gear 80.
  • the base 10 is rotated about the axis of the rotating shaft 30 by the rotating shaft 30, and the plurality of claws 70 are mounted on the periphery of the base 60, specifically, for example, in the through hole located at the periphery of the base 60, when the base 60 is When the rotation is driven by the rotary shaft 30, the claws 70 also rotate together.
  • the specific structure of the claw 70 is as shown in FIG. 4.
  • the claw 70 includes a main body portion 71 and a clamping portion 72 protruding from the main body portion.
  • the main body portion 71 and the clamping portion 72 are offset from each other, so that the main body portion 71 is wound around the main body portion 71.
  • the clamping portion 72 moves between a radially outwardly open position that is non-contacting the peripheral edge of the silicon wafer and a clamped position that is radially inwardly in contact with the peripheral edge of the silicon wafer.
  • the ring gear 80 is disposed coaxially with the base 60 and can be mounted to the base 60 by bearings.
  • the ring gear 80 is rotatable relative to the base 60.
  • the disc holding device may include a jack 110 through which the ring gear 80 is restricted from rotating, and the rotating shaft 30 is still driven by the driving mechanism 40.
  • the base 60 rotates
  • the base 60 and the ring gear 80 rotate relative to each other.
  • the ring gear 80 forms a meshing surface with the main body portion of the claw 70. Through the engagement surface, when the pawl 70 rotates relative to the ring gear 80 with the base 60 and the ring gear 80, the claw 70 meshes with the ring gear 80 to cause self-rotation.
  • the clamping portion 72 moves between the open position and the clamping position, and the wafer can be taken up or removed or clamped.
  • the ring gear 80 and the main body portion 71 of the claw are meshed by gears, and the ring gear 80 is provided with a ring gear 81 at the edge of the ring gear 80.
  • the inside of the ring gear 80 is a cavity, and the cavity is provided in a large number.
  • the spokes 84 have a tooth at the lower end of the main body portion of the claw 70 that meshes with the ring gear 81.
  • FIG. 2 is a schematic view showing the structure of the silicon wafer in the pick-and-place state.
  • FIG. 3 is a schematic structural view of the silicon wafer in a process state; when the main body portion 71 of the claw rotates inward, the support pin 90 moves downward, and the clamping portion 72 of the claw clamps the disc. 20.
  • FIG. 6 is a schematic structural view of a stroke changing mechanism according to the present invention.
  • the stroke changing mechanism 100 includes a swinging member 101, a chute 102, and a pulley 103.
  • the inner end of the swinging member 101 is axially coupled to the base 60.
  • the outer end of the swinging member 101 is provided with an upwardly extending front end 108 for pushing the supporting pin. 90 is used for lifting movement, the front end 108 is provided with a rotating member 104 for pushing the supporting pin 90;
  • the sliding member 101 is provided with a sliding groove 102 and a pulley 103.
  • the pulley 103 is mounted on the push rod 82 on the inner side of the ring gear 80, and is pushed.
  • the axial direction of the rod 82 is perpendicular to the direction of the chute 102.
  • the base 60 may also be provided with a limiting surface 107.
  • Those skilled in the art can set the distance between the shaft joint and the front end 108 of the swinging member and the mounting position of the pulley 103 according to actual needs to meet the requirements of different stroke changes.
  • the support pin 90 is mounted in the cylindrical groove 105.
  • the support pin 90 includes a support pin main body 91 and a limit baffle 92.
  • the support pin main body 91 passes through the base body 60 for lifting movement, and the support pin limit baffle
  • An elastic compression spring 106 is disposed between the 92 and the cylindrical groove 105, and the elastic compression spring 106 is used for supporting Pin 90 fell smoothly to a low level.
  • the top of the support pin 90 is a spherical body to reduce the contact area with the silicon wafer.
  • the air blowing component 120 may be disposed on the chuck 10, and the air blowing component 120 communicates with the rotating shaft 30 for continuously blowing air to the back surface of the disk 20 to prevent the surface of the silicon wafer from being blown.
  • the liquid contaminates the back of the solution.
  • the disc clamping device of the present invention works on the principle that when the wafer end of the actuator end 50 is taken and removed, the rotation of the base 60 forms a relative rotation angle between the base 60 and the ring gear 80.
  • the pulley 103 in the stroke changing mechanism 100 moves along the chute 102, the swinging member 101 rotates relative to the base 60, the front end 108 of the swinging member 101 moves upward, the rotating member 104 of the swinging member pushes the supporting pin 90 upward, and the plurality of supporting pins 90 rise simultaneously.
  • the silicon wafer 20 is carried and pushed up to the preset position, the action of the wafer end effector 50 to take and place the silicon wafer is performed.
  • the silicon wafer 20 When the silicon wafer is in a state to be processed, the silicon wafer 20 is placed on the support pin 90. Since the base 60 and the ring gear 80 are in opposite relative movements, the support pin 90 moves downward, and the silicon wafer 20 is held by the claw 70. The support pin 90 continues to move downward and is thus detached from the lower surface of the silicon wafer 20. At this time, the distance between the silicon wafer 20 and the chuck 10 is reduced, thereby preventing contamination of the back surface of the silicon wafer 20.
  • the disc holding device proposed by the present invention can be matched with each other by the claw 70 and the supporting pin 90.
  • the supporting pin 90 is raised and moved away from the chuck 10 to ensure the robot.
  • the pick-and-place action of the end effector 50 when the disc 20 is in the process state, the support pin 90 is lowered, and the chuck 10 is attached to prevent contamination of the back side of the silicon wafer.
  • the present invention controls the disc 20 reasonably.
  • the distance from the chuck 10 has the advantages of simple structure, convenient and reliable operation control mode, and compatibility with various process processing chambers.

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
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Abstract

一种盘状物夹持旋转装置，在基体的周缘设置多个支撑销（90），支撑销（90）由行程变换机构（100）驱动做升降运动，通过卡爪（70）和支撑销（90）相互配合，在取放盘状物（20）时，支撑销（90）做上升运动，远离卡盘（10），保证机械手末端执行器的取放片动作，在盘状物（20）处于工艺状态时，支撑销（90）做下降运动，贴合卡盘（10），避免盘状物（20）的背面受到污染。由于合理地控制了盘状物（20）与卡盘（10）之间的距离，使得具备结构简单、动作控制方式便捷可靠、可与各类工艺处理腔体相兼容的优点。

Description

一种盘状物夹持装置 技术领域
本发明涉及半导体制造设备技术领域，更具体地，涉及一种盘状物夹持装置。
技术背景
在集成电路的生产加工工艺过程中，半导体硅片或晶片等具有圆形形状的盘状物，通常都会经过诸如薄膜沉积、刻蚀、清洗、抛光等多道工艺制程。而在这些过程中，都需要通过夹持装置来支撑并夹持盘状物。例如美国专利US4903717A揭露了一种夹持装置，其包括卡爪和卡盘，卡爪包括轴线相互偏离的主体部和夹持部，因此主体部旋转时夹持部的径向位置随之变化。当夹持部向外径向移动至打开位置时可取放硅片，当夹持部向内径向移动至夹持位置时接触硅片的外围边缘，从而可防止硅片的横向位移。主体部下端设有轮齿，该轮齿与公用齿环的齿相啮合，而该公用齿环与卡盘的旋转轴同轴设置。该齿环相对于卡盘的旋转导致主体部的自旋转以及夹持部的径向移动，以实现硅片的取放和夹紧动作。
然而，上述传统的盘状物夹持装置存在以下问题：机械手末端的执行器在取放硅片时，硅片距卡盘上表面的距离与硅片工艺时，硅片距卡盘上表面的距离相等；即硅片在取放状态时与工艺状态时，硅片与卡盘上表面的距离是恒定不动的。然而，为实现机械手末端执行器的取放片，需保证硅片距离卡盘上表面保持一定距离(通常为10mm左右)，但是，如果在工艺时，硅片距卡盘上表面较大的距离容易使得硅片上表面的处理药液污染其背面，即 使是采用背面喷气方法也无法完全避免硅片背面被污染的现象。如为了避免污染，减小硅片距卡盘表面的距离，则不便于机械手末端执行器进行取放片。
发明概要
本发明的目的在于克服现有技术存在的上述缺陷，提供一种新型盘状物旋转装置，使硅片在取放状态和工艺状态时可处于不同高度，不仅有利于机械手末端执行器的取放片动作，同时避免硅片的背面受到污染，具有结构简单、动作控制方式便捷可靠的优点。
为实现上述目的，本发明的技术方案如下：
一种盘状物夹持装置，包括旋转卡盘，其上放置盘状物；旋转轴，带动所述旋转卡盘旋转；以及驱动机构，驱动所述旋转轴旋转，其中所述旋转卡盘包括：
基体，由所述旋转轴带动旋转；
多个卡爪，设于所述基体的周缘；所述卡爪包括主体部及从所述主体部突出且彼此轴线相偏移的夹持部，所述主体部自旋转而使所述夹持部在径向向外的与所述盘状物外围边缘非接触的打开位置和径向向内的与所述盘状物外围边缘接触的夹持位置之间移动；
齿圈，与所述基体同轴线设置且与所述卡爪的主体部形成啮合面，所述啮合面用于当所述基体与所述齿圈发生相对转动时，使所述卡爪的主体部与所述齿圈啮合而自转动；
多个支撑销，设于所述基体的周缘，用于承载盘状物，所述支撑销由行程变换机构驱动做升降运动；其中，当所述卡爪的主体部向外转动时，所 述卡爪的夹持部松开盘状物，同时所述支撑销承载盘状物向上运动；当所述卡爪的主体部向内转动时，所述支撑销向下运动，同时所述卡爪的夹持部夹紧盘状物。
优选的，所述盘状物夹持装置还包括顶杆，通过所述顶杆限制所述齿圈转动且所述驱动机构驱动所述旋转轴转动，使所述基体与所述齿圈产生所述相对转动。
优选的，所述行程变换机构包括摆动件、滑槽以及滑轮，所述摆动件的内侧端与所述基体轴连接，所述摆动件的外侧端设有向上伸出的前端，所述前端用于推动所述支撑销做升降运动，所述摆动件的下方设有滑槽以及滑轮，所述滑轮安装在所述齿圈的内侧面的推杆上，所述推杆的轴向方向垂直于所述滑槽的方向。
优选的，所述基体上设有限位面，所述限位面用于限制所述摆动件摆动的角度。
优选的，所述摆动件的前端设有用于推动所述支撑销的转动件。
优选的，所述支撑销安装在柱形槽内，所述支撑销包括支撑销主体以及限位挡板，所述支撑销主体穿过所述基体做升降运动。
优选的，所述支撑销的限位挡板与所述柱形槽之间设有弹性压簧。
优选的，所述卡盘上设有的吹气组件，所述吹气组件与所述旋转轴连通，用于向盘状物背面持续吹气。
优选的，所述齿圈的边缘设有环形齿轮，所述卡爪的主体部的下端形成与所述环形齿轮啮合的齿。
优选的，所述齿圈内部为空腔，所述空腔中设有多个辐条。
从上述技术方案可以看出，本发明提出的盘状物夹持装置，可通过卡爪和支撑销相互配合，在取放盘状物时，支撑销做上升运动，远离卡盘，保证机械手末端执行器的取放片动作，在盘状物处于工艺状态时，支撑销做下降运动，贴合卡盘，避免硅片的背面受到污染，本发明合理的控制盘状物与卡盘之间的距离，具有结构简单、动作控制方式便捷可靠、可与各类工艺处理腔体相兼容的优点。
附图说明
图1是本发明盘状物夹持旋转装置一实施例的结构示意图；
图2是本发明一较佳实施例中的盘状物夹持旋转装置在取放状态时的结构立体示意图；
图3是本发明一较佳实施例中的盘状物夹持旋转装置在工艺状态时的结构示意图；
图4是本发明盘状物夹持旋转装置中卡爪一较佳实施例的结构示意图；
图5是本发明盘状物夹持旋转装置中的卡盘一实施例的结构示意图；
图6是本发明盘状物夹持旋转装置中行程变换机构一较佳实施例的结构示意图。
发明内容
下面结合附图，对本发明的具体实施方式作进一步的详细说明。
需要说明的是，在下述的具体实施方式中，在详述本发明的实施方式时，为了清楚地表示本发明的结构以便于说明，特对附图中的结构不依照一般比 例绘图，并进行了局部放大、变形及简化处理，因此，应避免以此作为对本发明的限定来加以理解。
请结合参考图1-图5，盘状物夹持装置包括旋转卡盘10，旋转卡盘10上放置盘状物20，带动旋转卡盘10旋转的旋转轴30，以及驱动旋转轴30旋转的驱动机构40。在本实施例中，盘状物20为硅片，驱动单元40为驱动电机。其中，旋转卡盘10包括基体60，多个卡爪70以及齿圈80。其中，基体10由旋转轴30带动绕旋转轴30的轴线旋转，多个卡爪70安装在基体60的周缘，具体来说，例如是穿设于位于基体60周缘的通孔中，当基体60由旋转轴30带动转动时，这些卡爪70也随着一起转动。
卡爪70的具体结构如图4所示，卡爪70包括主体部71及从主体部突出的夹持部72，主体部71和夹持部72的轴线相偏移，因此当主体部71绕其轴线自旋转时，夹持部72在径向向外、与硅片外围边缘非接触的打开位置和径向向内、与硅片外围边缘接触的夹持位置之间移动。
如图5所示，齿圈80与基体60同轴设置，可通过轴承安装在基体60上。齿圈80可相对于基体60转动，具体来说，盘状物夹持装置可包括一顶杆110，通过该顶杆110限制齿圈80转动，而旋转轴30则仍由驱动机构40驱动带动着基体60旋转，则该基体60与齿圈80就发生了相对转动。另一方面，齿圈80与卡爪70的主体部形成啮合面。通过该啮合面，当卡爪70随着基体60与齿圈80发生相对转动时，卡爪70与齿圈80相啮合而发生自转动。如此一来，夹持部72在打开位置和夹持位置之间移动，可进行硅片的取放或夹持操作。在本实施例中，齿圈80和卡爪的主体部71通过齿轮啮合，齿圈80的边缘设有环形齿轮81，齿圈80内部为空腔，空腔中设置了多 个辐条84，卡爪70的主体部下端具有和环形齿轮81相啮合的齿。
为了使硅片在取放状态和工艺状态时可处于不同高度，不仅有利于机械手末端执行器的取放片动作，同时避免硅片的背面受到污染，在基体的边缘设有多个用于承载盘状物的支撑销90，支撑销90由行程变换机构驱动做升降运动。请参考图2，图2是硅片在取放状态时的结构示意图，当卡爪的主体部71向外转动时，卡爪70的夹持部72松开盘状物20，同时支撑销90承载盘状物20向上运动；此时，盘状物20远离卡盘10，保证机械手末端执行器的取放片动作。请参考图3，图3为硅片在工艺状态时的结构示意图；当卡爪的主体部71向内转动时，支撑销90向下运动，同时卡爪的夹持部72夹紧盘状物20。
具体请参考图6，图6为本发明中行程变换机构的结构示意图。行程变换机构100包括摆动件101、滑槽102以及滑轮103，摆动件101的内侧端与基体60轴连接，摆动件101的外侧端设有向上伸出的前端108，前端108用于推动支撑销90做升降运动，前端108设有用于推动支撑销90的转动件104；摆动件101的下方设有滑槽102以及滑轮103，滑轮103安装在齿圈80的内侧面的推杆82上，推杆82的轴向方向垂直于滑槽102的方向。为了限制摆动件101摆动的角度，基体60上还可设有限位面107。本领域技术人员可以根据实际需要设定轴连接处与摆动件前端108的距离，以及滑轮103的安装位置，以满足不同行程变换的要求。
本实施例中，支撑销90安装在柱形槽105内，支撑销90包括支撑销主体91以及限位挡板92，支撑销主体91穿过基体60做升降运动，支撑销的限位挡板92与柱形槽105之间设有弹性压簧106，弹性压簧106用于使支撑 销90顺利下降至低位。较佳的，支撑销90的顶部为球面体，以减少其与硅片之间的接触面积。
为进一步防止硅片的背面受到污染，卡盘10上可设有的吹气组件120，吹气组件120与旋转轴30连通，用于向盘状物20背面持续吹气，防止硅片表面的药液污染其背面。
本发明的盘状物夹持装置的工作原理为：在机械手末端执行器50的取放硅片时，基体60的转动使得基体60与齿圈80之间形成一相对转角，该相对转动角度使行程变换机构100中的滑轮103沿滑槽102移动，摆动件101相对基体60转动，摆动件101的前端108向上运动，摆动件的转动件104推动支撑销90上升，多个支撑销90同时上升承载并推动硅片20上升至预设位置，则机械手末端执行器50的取放硅片的动作。在硅片处于待工艺状态时，硅片20放置于支撑销90上，由于基体60和齿圈80为反向的相对运动，则支撑销90向下运动，硅片20由卡爪70夹持，支撑销90继续向下运动，进而脱离硅片20的下表面，此时，硅片20与卡盘10之间的距离缩小，从而避免硅片20的背面受到污染。
综上所述，本发明提出的盘状物夹持装置，可通过卡爪70和支撑销90相互配合，在取放盘状物20时，支撑销90做上升运动，远离卡盘10，保证机械手末端执行器50的取放片动作，在盘状物20处于工艺状态时，支撑销90做下降运动，贴合卡盘10，避免硅片的背面受到污染，本发明合理的控制盘状物20与卡盘10之间的距离，具有结构简单、动作控制方式便捷可靠、可与各类工艺处理腔体相兼容的优点。
以上所述的仅为本发明的优选实施例，所述实施例并非用以限制本发明 的专利保护范围，因此凡是运用本发明的说明书及附图内容所作的等同结构变化，同理均应包含在本发明的保护范围内。

Claims (10)

  1. 一种盘状物夹持装置，包括旋转卡盘，其上放置盘状物；旋转轴，带动所述旋转卡盘旋转；以及驱动机构，驱动所述旋转轴旋转，其中所述旋转卡盘包括：
    基体，由所述旋转轴带动旋转；
    多个卡爪，设于所述基体的周缘；所述卡爪包括主体部及从所述主体部突出且彼此轴线相偏移的夹持部，所述主体部自旋转而使所述夹持部在径向向外的与所述盘状物外围边缘非接触的打开位置和径向向内的与所述盘状物外围边缘接触的夹持位置之间移动；
    齿圈，与所述基体同轴线设置且与所述卡爪的主体部形成啮合面，所述啮合面用于当所述基体与所述齿圈发生相对转动时，使所述卡爪的主体部与所述齿圈啮合而自转动；
    多个支撑销，设于所述基体的周缘，用于承载盘状物，所述支撑销由行程变换机构驱动做升降运动；其中，当所述卡爪的主体部向外转动时，所述卡爪的夹持部松开盘状物，同时所述支撑销承载盘状物向上运动；当所述卡爪的主体部向内转动时，所述支撑销向下运动，同时所述卡爪的夹持部夹紧盘状物。
  2. 根据权利要求1所述的盘状物夹持装置，其特征在于，所述盘状物夹持装置还包括顶杆，通过所述顶杆限制所述齿圈转动且所述驱动机构驱动所述旋转轴转动，使所述基体与所述齿圈产生所述相对转动。
  3. 根据权利要求1所述的盘状物夹持装置，其特征在于，所述行程变换机构包括摆动件、滑槽以及滑轮，所述摆动件的内侧端与所述基体轴连接，所述摆动件的外侧端设有向上伸出的前端，所述前端用于推动所述支撑销做升降运动，所述摆动件的下方设有滑槽以及滑轮，所述滑轮安装在所述齿圈的内侧面的推杆上，所述推杆的轴向方向垂直于所述滑槽的方向。
  4. 根据权利要求3所述的盘状物夹持装置，其特征在于，所述基体上设 有限位面，所述限位面用于限制所述摆动件摆动的角度。
  5. 根据权利要求3所述的盘状物夹持装置，其特征在于，所述摆动件的前端设有用于推动所述支撑销的转动件。
  6. 根据权利要求1所述的盘状物夹持装置，其特征在于，所述支撑销安装在柱形槽内，所述支撑销包括支撑销主体以及限位挡板，所述支撑销主体穿过所述基体做升降运动。
  7. 根据权利要求6所述的盘状物夹持装置，其特征在于，所述支撑销的限位挡板与所述柱形槽之间设有弹性压簧。
  8. 根据权利要求1所述的盘状物夹持装置，其特征在于，所述旋转卡盘上设有的吹气组件，所述吹气组件与所述旋转轴连通，用于向盘状物背面持续吹气。
  9. 根据权利要求1所述的盘状物夹持装置，其特征在于，所述齿圈的边缘设有环形齿轮，所述卡爪的主体部的下端形成与所述环形齿轮啮合的齿。
  10. 根据权利要求1所述的盘状物夹持装置，其特征在于，所述齿圈内部为空腔，所述空腔中设有多个辐条。
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