WO2016129035A1 - X線計測装置の画像再構成方法、構造物の製造方法、x線計測装置の画像再構成プログラムおよびx線計測装置 - Google Patents
X線計測装置の画像再構成方法、構造物の製造方法、x線計測装置の画像再構成プログラムおよびx線計測装置 Download PDFInfo
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
- G01N23/04—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material
- G01N23/044—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material using laminography or tomosynthesis
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
- G01N23/04—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/40—Imaging
- G01N2223/401—Imaging image processing
Definitions
- the present invention relates to an image reconstruction method for an X-ray measurement apparatus, a structure manufacturing method, an image reconstruction program for an X-ray measurement apparatus, and an X-ray measurement apparatus.
- an X-ray apparatus that irradiates an object with X-rays and detects X-rays passing through the object is known as an apparatus that acquires information inside the object nondestructively.
- This X-ray apparatus has an X-ray source that irradiates X-rays, and can detect X-rays passing through an object and observe the inside (see Patent Document 1). Thereby, information inside the object is acquired.
- an object is to provide an image reconstruction method for an X-ray measurement apparatus, a method for manufacturing a structure, an image reconstruction program for an X-ray measurement apparatus, and an X-ray measurement apparatus that can suppress a decrease in inspection accuracy. To do.
- the image reconstruction method of the X-ray measurement apparatus can be applied to a plurality of different irradiation directions with respect to the measurement object by rotating the measurement object and / or changing the irradiation direction of the X-ray.
- Irradiating X-rays detecting X-rays transmitted through the object to be measured in a plurality of different irradiation directions, generating a plurality of detection data relating to the transmitted X-ray intensity of the object to be measured, and the shape of the object to be measured
- the intensity of transmitted X-rays for each of a plurality of different irradiation directions is estimated to generate a plurality of estimation data
- difference data indicating the difference between the estimation data and the detection data is detected from the detection data.
- the image reconstruction method of the X-ray measurement apparatus can be applied to a plurality of different irradiation directions with respect to the measurement object by rotating the measurement object and / or changing the irradiation direction of the X-ray.
- Irradiating X-rays detecting X-rays transmitted through the object to be measured in a plurality of different irradiation directions, generating a plurality of detection data relating to the transmitted X-ray intensity of the object to be measured, and the shape of the object to be measured
- the intensity of transmitted X-rays for each of a plurality of different irradiation directions is estimated to generate a plurality of estimation data
- difference data indicating the difference between the estimation data and the detection data is detected from the detection data.
- the structure manufacturing method creates design information related to the shape of the structure, creates the structure based on the design information, and creates the shape of the created structure as described above.
- the shape information is obtained by measurement using the image reconstruction method of the X-ray measurement apparatus of any aspect, and the obtained shape information is compared with the design information.
- the image reconstruction program of the X-ray measurement apparatus can be applied to a plurality of different irradiation directions with respect to the measurement object by rotating the measurement object and / or changing the irradiation direction of the X-ray.
- the X-ray measurement apparatus irradiates the measurement object with X-rays in a plurality of different irradiation directions by rotating the measurement object and / or changing the X-ray irradiation direction.
- An acquisition unit for acquiring a plurality of detection data relating to the transmitted X-ray intensity of the object to be measured, which is generated by detecting X-rays transmitted through the object for each of a plurality of different irradiation directions, and a shape of the object to be measured
- a plurality of estimated data is generated by estimating the intensity of transmitted X-rays for each of a plurality of different irradiation directions when an estimated structure whose shape is estimated based on information is irradiated with X-rays from a plurality of different irradiation directions.
- an image generation unit for extracting difference data indicating a difference between the detection data acquired by the acquisition units corresponding to each other with respect to the X-ray irradiation direction and the estimated data.
- the figure explaining the structure of the X-ray apparatus by embodiment of this invention The figure which shows the concept for producing
- generating the three-dimensional image in 1st, 2nd embodiment The flowchart explaining the process for producing
- the X-ray apparatus irradiates the object to be measured with X-rays and detects transmitted X-rays transmitted through the object to be measured, thereby acquiring non-destructive internal information (for example, internal structure) of the object to be measured.
- an object to be measured is an industrial part such as a machine part or an electronic part
- the X-ray apparatus is called an industrial X-ray CT (Computed Tomography) inspection apparatus that inspects an industrial part.
- the subject to be measured may be an organism such as a human body, an animal, or a plant.
- a part of the tissue of the organism may be targeted.
- the embodiments are specifically described for understanding the gist of the invention, and do not limit the invention unless otherwise specified.
- FIG. 1 is a diagram showing an example of the configuration of an X-ray apparatus 100 according to the present embodiment.
- the X-ray apparatus 100 includes a housing 1, an X-ray source 2, a placement unit 3, a detector 4, a control device 5, a display monitor 6, and a frame 8.
- the housing 1 is disposed on a floor surface of a factory or the like so as to be substantially parallel (horizontal) to the XZ plane, and inside the X-ray source 2, the placement unit 3, the detector 4, and the frame 8. And is housed.
- the housing 1 contains lead as a material in order to prevent X-rays from leaking to the outside.
- the X-ray source 2 is an X-ray that spreads in a conical shape along the optical axis Zr parallel to the Z-axis with the emission point Q shown in FIG. (A so-called cone beam) is emitted.
- the exit point Q corresponds to the focal spot of the X-ray source 2. That is, the optical axis Zr connects the exit point Q, which is the focal spot of the X-ray source 2, and the center of the imaging region of the detector 4 described later.
- the X-ray source 2 is not limited to one that emits X-rays in a conical shape, but one that emits fan-shaped X-rays (so-called fan beams) or linear X-rays (so-called pencil beams) is also one aspect of the present invention. Included in embodiments.
- the X-ray source 2 emits at least one of, for example, an ultra soft X-ray of about 50 eV, a soft X-ray of about 0.1 to 2 keV, an X-ray of about 2 to 20 keV, and a hard X-ray of about 20 to 100 keV Can do.
- the X-ray source 2 may emit X-rays of 1 to 10 Mev, for example.
- the mounting unit 3 includes a mounting table 30 on which the object to be measured S is mounted, and a manipulator unit 36 including a rotation driving unit 32, a Y-axis moving unit 33, an X-axis moving unit 34, and a Z-axis moving unit 35.
- the X-ray source 2 is provided on the Z axis + side.
- the mounting table 30 is rotatably provided by the rotation driving unit 32, and moves together when the manipulator unit 36 moves in the X-axis, Y-axis, and Z-axis directions.
- the rotation drive unit 32 is configured to include, for example, an electric motor, and is parallel to the Y-axis and the center of the mounting table 30 by a rotational force generated by an electric motor controlled and driven by the control device 5 described later.
- the mounting table 30 is rotated with the axis passing through the rotation axis Yr. That is, the rotation drive unit 32 rotates the mounting table 30 to change the relative direction of the mounting table 30 and the object S to be measured on the mounting table 30 with respect to the X-rays radiated from the X-ray source 2. Change.
- the Y-axis moving unit 33, the X-axis moving unit 34, and the Z-axis moving unit 35 are controlled by the control device 5 so that the measured object S is positioned within the irradiation range of the X-rays emitted from the X-ray source 2. Then, the mounting table 30 is moved in the X-axis direction, the Y-axis direction, and the Z-axis direction, respectively.
- the Z-axis moving unit 35 is controlled by the control device 5 so that the distance from the X-ray source 2 to the object S to be measured is Z so that the projected image of the object S has a desired magnification. Move in the axial direction.
- the Y position detector 331, the X position detector 341, and the Z position detector 351 are moved in the X axis direction, the Y axis direction, and the Z axis direction by the Y axis moving unit 33, the X axis moving unit 34, and the Z axis moving unit 35. It is an encoder that detects the position of the mounting table 30 and outputs a signal indicating the detected position (hereinafter referred to as a detected movement position) to the control device 5.
- the rotation position detector 321 detects the position of the mounting table 30 that is rotated about the rotation axis Yr by the rotation drive unit 32, and outputs a signal indicating the detected position (hereinafter referred to as a detected rotation position) to the control device 5.
- the detected rotation position represents the relative direction of the measurement object S on the mounting table 30 with respect to the X-rays emitted from the X-ray source 2.
- the detector 4 is provided on the Z axis + side from the X-ray source 2 and the mounting table 30. That is, the mounting table 30 is provided between the X-ray source 2 and the detector 4 in the Z-axis direction.
- the detector 4 has an incident surface 41 parallel to the XY plane, and X-rays including transmitted X-rays emitted from the X-ray source 2 and transmitted through the measurement object S placed on the mounting table 30 are incident. Incident on the surface 41.
- the detector 4 includes a scintillator section containing a known scintillation substance, a photomultiplier tube, a light receiving section, and the like.
- the detector 4 converts the energy of the X-rays incident on the incident surface 41 of the scintillator unit into light energy such as visible light or ultraviolet light, amplifies it with a photomultiplier tube, and the amplified light energy is received by the above-described light reception. This is converted into electric energy by the unit and output to the controller 5 as an electric signal.
- the detector 4 has a structure in which a scintillator section, a photomultiplier tube, and a light receiving section are each divided into a plurality of pixels, and these pixels are two-dimensionally arranged. Thereby, the intensity distribution of the X-rays radiated from the X-ray source 2 and passed through the object to be measured S can be acquired at once.
- the detector 4 may convert the incident X-ray energy into electric energy without converting it into light energy, and output it as an electric signal.
- the detector 4 is not limited to one in which pixels are arranged two-dimensionally.
- the detector 4 has an incident surface 41 extending in the X direction on a plane parallel to the XY plane, but the incident surface 41 may be configured by a line sensor in which one pixel is arranged in the Y direction.
- the arrangement direction of the pixels of the line sensor is not limited to the Y direction, and may be arranged in the X direction and the Z direction.
- the detector 4 may have a structure in which a scintillator portion is formed directly on a light receiving portion (photoelectric conversion portion) without providing a photomultiplier tube.
- the frame 8 supports the X-ray source 2, the placement unit 3, and the detector 4.
- the frame 8 is manufactured with sufficient rigidity. Therefore, it is possible to stably support the X-ray source 2, the placement unit 3, and the detector 4 while acquiring the projection image of the measurement object S.
- the frame 8 is supported by a vibration isolation mechanism 81 and prevents vibration generated outside from being transmitted to the frame 8 as it is.
- the control device 5 includes a microprocessor, peripheral circuits, and the like.
- the control device 5 reads and executes a control program stored in advance in a storage medium (not shown) (for example, a flash memory), thereby executing the control of the X-ray device 100. Control each part.
- the control device 5 includes an X-ray control unit 51, a movement control unit 52, an image generation unit 53, and a work memory 55.
- the X-ray control unit 51 controls the operation of the X-ray source 2
- the movement control unit 52 controls the movement operation of the manipulator unit 36.
- the image generation unit 53 outputs an electrical signal output from the detector 4 according to the intensity of the X-ray transmitted through the measurement object S every time the measurement object S rotates every predetermined angle according to the rotation of the mounting table 30.
- An image reconstruction process is performed on the object to generate a three-dimensional image of the object S to be measured.
- the image generation unit 53 differs from the process of generating X-ray projection image data (detection data) of the object S to be measured from the electrical signal output from the detector 4 as the image reconstruction process, and the projection direction, that is, the detection rotation position.
- a process of generating a back projection image from the X-ray projection image data of the object to be measured S and generating a three-dimensional image that is an internal structure (cross-sectional structure) of the object to be measured S is performed.
- processing for generating a backprojection image there are a backprojection method, a filter-corrected backprojection method, a successive approximation method, and the like.
- the work memory 55 is composed of, for example, a volatile storage medium, and temporarily stores the X-ray projection image data generated by the image generation unit 53.
- FIG. 2 is a conceptual diagram schematically showing a process for generating a three-dimensional image according to the present embodiment.
- FIG. 2A schematically shows a stereoscopic image of the measurement object S based on detection data generated based on the electrical signal output from the detector 4.
- a three-dimensional image of the object S to be measured is detected each time X-rays irradiated from a plurality of different irradiation directions with respect to the object S are transmitted through the object S by rotating the mounting table 30. It is obtained by using multiple data. Since the stereoscopic image of the object S to be measured is based on the transmission intensity of X-rays actually transmitted through the object to be measured S, the stereoscopic image of the object S to be measured has defects such as nests inside the object to be measured S. If included, information due to defects such as a nest inside the object to be measured S is included. As a result, a difference occurs in the measured object S with respect to the predetermined design information.
- FIG. 2A shows a three-dimensional image of the defect S1 inside the DUT as an example of the error.
- FIG. 3A schematically shows transmission intensity of X-rays used for generating a stereoscopic image of the measurement object S, that is, one detection data D1 among a plurality of detection data.
- FIG. 3A shows X-rays in a cross section (surface P indicated by a broken line in FIG. 2A) passing through the defect S1 inside the DUT when the mounting table 30 is at a certain detection movement position and detection rotation position. The transmission intensity is shown.
- the intensity on the vertical axis is a value obtained by dividing the X-ray transmission intensity by the X-ray transmission length (distance).
- the X-ray absorption coefficient is different between the defect S1 and the DUT S, there is a difference between the transmission intensity of the X-ray transmitted through the defect S1 and the transmission intensity of the X-ray not transmitted through the defect S1.
- FIG. 3 (a) shows that the defect S1 has a smaller absorption rate than the X-ray absorption rate around the defect S1, so that the defect intensity is smaller than the X-ray transmission intensity transmitted through the object S to be measured.
- An example in which the transmission intensity of X-rays transmitted through S1 is increased will be described.
- FIG. 2B schematically shows a three-dimensional image of the fictitious estimated structure S2 based on shape information and material information as design information such as CAD of the object S to be measured.
- the three-dimensional image of the estimated structure S2 corresponds to an ideal state in which the DUT S is created as designed. Therefore, the defect S1 is not included.
- FIG. 3B schematically shows transmission intensity of X-rays estimated to be detected when X-rays are transmitted through the estimated structure S2, that is, estimated data D2.
- the estimated data D2 is transmitted through the estimated structure S2 when X-rays are irradiated to the estimated structure S2 corresponding to the case where the measured object S is in a state (ideal state) produced according to the design value.
- the estimation data D2 is generated under the same conditions as when the detection data D1 is obtained. That is, the estimated data D2 is a case where the estimated structure S2 is irradiated with X-rays at the same detection movement position and detection rotation position as the detection movement position and detection rotation position of the mounting table 30 when the detection data D1 is generated. Is generated.
- the estimated data D2 is generated by estimating the case where the estimated structure S2 is irradiated with X-rays with the same output as the X-ray output output from the X-ray source 2 when the detection data D1 is generated. Is done. Therefore, estimated data D2 corresponding to each of a plurality of detection data D1 detected for each irradiation direction of different X-rays is generated.
- the difference between the stereoscopic image of the measurement object S and the stereoscopic image of the estimated structure S2 is extracted.
- a defect S1 that is a difference between the object to be measured S and the estimated structure S2 is extracted.
- difference data D3 that is a difference between the detection data D1 and the estimation data D2 is calculated.
- strength is shown.
- the difference data D3 includes a defect S1 such as a nest inside the object to be measured S and a shape error between the object to be measured S and the estimated structure S2.
- the difference data D3 is obtained by extracting a difference from the estimated data D2 having a corresponding relationship for each of the plurality of detection data D1. Therefore, a plurality of difference data D3 is also generated corresponding to each of the plurality of detection data D1 detected for each X-ray irradiation direction with respect to the measurement object S.
- the extracted stereoscopic image of the defect S1 and the stereoscopic image of the estimated structure S2 are combined.
- the stereoscopic image of the estimated structure S2 corresponds to an ideal state in which the object to be measured S has a shape as designed and does not include defects. Therefore, a stereoscopic image is generated by combining the stereoscopic image of the estimated structure S2 in which the generation of the false image is suppressed and the defect S1 extracted from the stereoscopic image of the object S to be measured. That is, the three-dimensional image of the defect S1 is reproduced as a three-dimensional image having substantially the same shape as the object S to be measured but in which the generation of false images is suppressed.
- the plurality of calculated difference data D3 is back-projected to generate a back-projected image Im1 relating to the difference between the measured object S and the estimated structure S2.
- the back-projected image Im1 and the image Im2 corresponding to the estimated structure S2 are combined to generate an image Im3. That is, the image Im3 has a shape substantially the same as the measured object S, but a defect or the like existing in the actual measured object S is reproduced in the image Im2 of the estimated structure S2 in which generation of a false image is suppressed. 3D image. Therefore, in the image Im3, generation of false images due to beam hardening is suppressed.
- an image obtained from the image Im3 is set as an estimated structure S2.
- Estimated data D2 is calculated as the estimated structure S2.
- Difference data D3 is extracted from the calculated estimated data D2 and detected data D1.
- a three-dimensional image of the defect S1 is created using the extracted difference data D3.
- a new image Im3 is generated by combining the created stereoscopic image of the defect S1 and the image once obtained as the image Im3. In this way, by performing the step of FIG.
- the image Im3 obtained for the second time is more suppressed from generating false images due to beam hardening than the image Im3 obtained first.
- the This is because the difference between the estimated data D2 and the detected data D1 of the estimated structure S2 is small.
- the repeating step is not limited to once, and may be repeated a plurality of times. You may determine the frequency
- the entire measured object S is obtained by performing back projection using a plurality of transmitted X-ray intensity data groups corresponding to different positions in the Y direction of the measured object S.
- a three-dimensional image showing the internal structure is generated.
- the image generation unit 53 generates estimated data D2 using the following equations (1) and (1) ′, and extracts difference data D3 from the detection data D1 based on the output from the detector 4. ... (1) ... (1) '
- ⁇ 0 (X, Y, Z, ⁇ ) in the expression (1) ′ is obtained when the X-ray having the photon energy amount ⁇ passes through the fictitious estimated structure S2 using the design information of the object S to be measured.
- ⁇ (X, Y, Z, ⁇ ) in the equation (1) is the X-ray at the position (X, Y, Z) when the X-ray having the photon energy amount ⁇ passes through the inside of the measured object S. Is the attenuation coefficient.
- Equation (1) and (1) ′ are derived from equation (2) as follows.
- the amount of X-ray attenuation when the X-ray travels a minute distance ⁇ l of the object S to be measured is expressed as the following equation (3).
- ⁇ (X, Y, Z, ⁇ ) ⁇ l ⁇ 0 (X, Y, Z, ⁇ ) ⁇ l + ⁇ (X, Y, Z) ⁇ l ... (3)
- the X-ray having the intensity Ii ( ⁇ ) incident on the minute distance ⁇ l has the intensity represented by the equation (4) when it passes through the minute distance ⁇ l. (4)
- i indicates the position of one of the plurality of detection pixels included in the detector 4.
- yi represents the intensity of X-rays incident on the detection pixel arranged i-th from the end.
- ri represents a noise component such as dark current included in the output from the i-th arranged detection pixel of the detector 4. That is, in Expression (5), the intensity yi corresponding to the number of detection pixels of the detector 4 is generated for each detection rotation position.
- the attenuation coefficient ⁇ 0 (X, Y, Z, ⁇ ) is the X-ray attenuation coefficient at the position (X, Y, Z) inside the estimated structure S2, and the design information of the object S to be measured. It depends on.
- the design information for example, material information regarding the material constituting the DUT S is used.
- the material information of the measurement object S may be, for example, the ratio of the substance information included in the measurement object S.
- the material information of the object to be measured S may be information on whether the substance contained in the object to be measured S is a metal or a nonmetal, for example.
- the material information of the object to be measured S may be, for example, element information included for each member constituting the object to be measured S, or may be compound information.
- the design information for example, shape information regarding the external shape information and / or the internal shape information of the measurement object S is used.
- the intensity Ii ( ⁇ ) is determined by the X-ray intensity and spectrum irradiated to the object S to be measured, which are measurement conditions of the measuring apparatus. Therefore, Bi represented by Expression (1) ′ corresponds to the detection intensity detected by the i-th detection pixel of the detector 4 calculated based on the design information, material information, and measurement conditions.
- Bi corresponds to the transmission intensity of X-rays that have passed through the estimated structure S2 when the estimated structure S2 is irradiated with X-rays according to the measurement conditions.
- the image generation unit 53 generates estimated data D2 by applying design information, material information, and measurement conditions to the equation (1) ′.
- ⁇ (X, Y, Z) is an error between the attenuation coefficient ⁇ (X, Y, Z, ⁇ ) and the attenuation coefficient ⁇ 0 (X, Y, Z, ⁇ ), and photons Since it is assumed that it does not depend on the energy amount ⁇ , the error term ⁇ (X, Y, Z) can be calculated.
- ⁇ (X, Y, Z) is a difference in distance through which X-rays passing through the object to be measured S and the estimated structure S2 pass through each of the plurality of detection pixels of the detector 4. Based on the value. That is, it corresponds to the difference between the projection data D1 and the estimated data D2. That is, the image generation unit 53 sets ⁇ (X, Y, Z) for the detection intensity output from each of the plurality of detection pixels arranged in the detector 4 for each X-ray irradiation position on the object S to be measured. By calculating, the image generation unit 53 extracts a plurality of difference data D3 for each X-ray irradiation position with respect to the measurement object S.
- the image generation unit 53 increases the magnitude of each ⁇ (X, Y, Z) corresponding to the number of detection pixels of the detector 4 calculated by the equation (1) at an arbitrary X-ray irradiation position. Evaluate. When all the calculated ⁇ (X, Y, Z) do not exceed the first predetermined value, the image generation unit 53 determines that the difference data D3 is a difference due to a nest or the like inside the object to be measured S (for example, FIG. It is evaluated that it corresponds to the defect S1).
- the image generation unit 53 When the calculated ⁇ (X, Y, Z) is greater than or equal to the first predetermined value, the image generation unit 53 has a large shape error between the measured object S1 and the estimated structure S2, that is, It is evaluated that the dimension of the measurement object S is greatly different from the design value.
- the image generation unit 53 back-projects the difference data D3 to generate the back-projected image Im1, and the estimated structure S2
- the image Im3 is generated in combination with the image Im2.
- the image generation unit 53 determines the estimated structure based on the size of ⁇ (X, Y, Z).
- the shape of the estimated structure S2 is corrected so that the shape of the object S2 approaches the shape of the object to be measured S, and the image generation unit 53 is similar to the above description based on the dimensional shape of the estimated structure S2.
- ⁇ (X, Y, Z) is obtained by the procedure and its size is evaluated. This procedure is repeated until all the calculated ⁇ (X, Y, Z) are below the first predetermined value.
- FIG. 4 schematically shows the concept of correcting the estimated structure S2.
- the X-ray source 2 irradiates the measurement object S having the defect S ⁇ b> 1 inside, it is detected by the detector 4.
- the X-ray detection intensity L1 that is, the X-ray detection intensity corresponding to the detection data D1
- L2 X-ray detection intensity corresponding to the detection data D1
- L3 and L4 estimated to be detected by the detector 4 when it is assumed that the estimated structure S2 corresponding to the measurement object S is irradiated with X-rays, that is, estimated data
- the X-ray detection intensity corresponding to D2 is indicated by a broken line.
- L2 indicates the estimated X-ray intensity before the first process, that is, before correcting the dimensional shape of the estimated structure S2.
- L1 has a higher X-ray transmission intensity than L2. That is, the transmission distance of the X-rays that pass through the measurement object S is shorter than the design dimension, that is, the dimension of the measurement object is smaller than the design value.
- L3 and L4 indicate the intensities of X-rays estimated after the second processing and after the dimensional shape of the estimated structure S2 is corrected.
- the X-ray transmission intensity from the detection pixels included in the region ir is higher than the X-ray transmission intensity from the other detection pixels. This indicates that an influence of the defect S1 inside the object to be measured S appears in this detection pixel.
- the difference in intensity between L1 and L2, L3 or L4 shown in FIG. 4 corresponds to ⁇ (X, Y, Z).
- the image generation unit 53 changes the shape of the estimated structure S2 to change the estimated X-ray transmission intensity from L2 in the direction of arrow A, that is, in the direction in which the intensity increases in FIG. Modifying the shape of the estimated structure S2 corresponds to changing the distance through which the X-rays pass through the estimated structure S.
- the image generation unit 53 changes the shape of the estimated structure S2 in a direction in which the shape of the estimated structure S2 approaches the shape of the DUT S.
- the image generation unit 53 corresponds to the regions ir of L3 and L4. The intensity is greater than the intensity outside the region ir.
- the value of ⁇ (X, Y, Z) newly calculated as the difference in transmission intensity between L1 and L4 is equal to or less than the first predetermined value.
- the estimated data D2 passes through the object S to be measured. Represents that the transmitted intensity of X-rays was reproduced.
- the image generating unit 53 may align the measured object S indicated by the detection data D1 and the estimated structure S2 indicated by the estimated data D2 on the data. For example, the image generation unit 53 detects the position (pixel position i) of the boundary (edge) between the DUT S and the background indicated by the detection data D1. The image generation unit 53 detects the position i + a of the pixel corresponding to this boundary on the estimation data D2. The image generation unit 53 calculates Expression (1) using the detection data D1 (that is, yi) at the pixel i and the estimated data D2 (that is, Bi + a) at the pixel i + a. As a result, since the value of ⁇ (X, Y, Z) can be calculated as a relatively small value at the time of the first processing, ⁇ (X, Y, Z) needs to be corrected thereafter. Even so, the number of processes can be reduced.
- the image generation unit 53 performs the above-described processing on each of a plurality of detection data D1 and estimation data D2 having different X-ray projection directions on the measurement object S, that is, detection rotation positions, and then performs alignment.
- the back projection image Im1 and the image Im2 related to the estimated structure S2 are combined to generate an image Im3.
- the image generation unit 53 displays the generated image Im3 on the display monitor 6 as a three-dimensional image.
- step S1 the shape information and material information that are design information of the measurement object S and the measurement conditions of the measurement object S that are measurement device information are acquired, and the process proceeds to step S2.
- step S2 Bi is calculated (that is, estimated data D2 is generated) for each pixel based on the shape information, material information, and measurement information, and the process proceeds to step S3.
- step S3 transmission images are acquired for all irradiation directions, and the process proceeds to step S4.
- step S3 transmission images are acquired for all measurement directions for use in image reconstruction. For example, in FIG. 1, a transmission image acquired when the object to be measured S is rotated 360 ° once using the stage 30 is used.
- step S4 ⁇ (X, Y) is used for each pixel by back projection using the detected value actually detected by transmitting the X-rays to the measured object S, the calculated Bi, and Equation (1).
- Z) is calculated (that is, the difference data D3 is extracted), and the process proceeds to step S5.
- step S5 it is determined whether or not all of the position-dependent ⁇ (X, Y, Z) calculated for each detected pixel are equal to or less than the first predetermined value. If all ⁇ (X, Y, Z) are equal to or smaller than the first predetermined value, an affirmative determination is made in step S5 and the process proceeds to step S7. If there is ⁇ (X, Y, Z) exceeding the first predetermined value, a negative determination is made in step S5 and the process proceeds to step S6. In step S6, the shape of the estimated structure S2 is corrected, and the process proceeds to step S2. In this case, in step S2, the shape of the estimated structure S2 corrected in step S6 is used as design information (shape information) of the object S to be measured.
- step S7 since the backprojection image Im1 of the difference data D3 is 0, the shape of the estimated structure S2 that has been corrected so far matches the actual shape of the object to be measured S (structure). To do.
- the image of the estimated structure S2 is displayed on the display monitor 6 as a three-dimensional image of the object S to be measured, and the process ends.
- the image displayed on the display monitor 6 is not limited to the image Im3 of the estimated structure S2.
- the image generation unit 53 applies a plurality of detection data D1 related to the transmission intensity of X-rays transmitted through the measurement object S and a fictitious estimated structure S2 configured based on the design information to the measurement object.
- a plurality of pieces of estimated data D2 relating to the X-ray transmission intensity estimated when it is assumed that irradiation is performed under the same X-ray irradiation conditions as S is transmitted.
- the image generation unit 53 extracts difference data D3 indicating a difference between the detection data D1 and the estimation data D2, using the detection data D1 and the estimation data D2 corresponding to each other with respect to the X-ray irradiation direction.
- the defect S1 such as a nest inside the object to be measured S that is not included in the estimated structure S2 estimated based on the design information, and the object to be measured S are estimated.
- Information on the shape error with the structure S2 can be acquired.
- the image generating unit 53 backprojects the extracted difference data D3 to generate a backprojected image Im1 related to the difference, and the backprojected image Im1 and the estimated structure S2 are combined to form the internal structure of the object S to be measured.
- An image Im3 is generated. Therefore, an image Im3 in which generation of a false image due to beam hardening is suppressed is generated as compared with a backprojected image of the measurement object S generated by backprojecting the detection data D1. As a result, it becomes easy to grasp the internal defect of the measurement object S in the image Im3.
- the image generation unit 53 Based on the material information of the measurement object S and the X-ray spectrum information that is the measurement condition of the measurement object S, the image generation unit 53 applies X-rays when the estimated structure S2 is irradiated with X-rays.
- Estimated data D2 is generated by estimating the transmission intensity of the line. Therefore, the estimated data D2 can be generated without requiring a large processing load.
- the X-ray attenuation coefficient ⁇ (X, Y, Z, ⁇ ) is expressed by the attenuation coefficient ⁇ 0 (X, Y, Z, ⁇ ), which is the first element depending on the photon energy amount ⁇ , and the second element. It is represented by a certain error term ⁇ (X, Y, Z).
- the image generation unit 53 extracts the difference data D3 by calculating the value of ⁇ (X, Y, Z) using the detection data D1 and the estimation data D2.
- the generated back-projection image is not affected by a false image due to beam hardening, and the generated image Im3
- the effect of the false image due to the beam hardening in can be reduced, and a high-quality image Im3 can be provided.
- the image generation unit 53 backprojects the difference data D3 when the values of all the plurality of ⁇ (X, Y, Z) calculated for a certain X-ray irradiation direction do not exceed the first predetermined value.
- the back projection image Im1 is generated. Therefore, the backprojection image Im1 can be generated so that a small nest or the like included in the measurement object S can be observed.
- the image generation unit 53 determines ⁇ (X, Y, Z). Based on the above, the estimated data D2 is modified to newly generate estimated data D2. Therefore, it is possible to accurately evaluate defects such as small nests included in the measurement object S after sufficiently reducing the shape error between the measurement object S and the estimated structure S2.
- the image generation unit 53 extracts new difference data D3 using the detection data D1 and the new estimation data D2.
- the image generation unit 53 backprojects the new difference data D3 to generate a backprojected image Im1. Thereafter, the image generation unit 53 combines the backprojected image Im1 and the image Im2 related to the estimated structure S2 to generate an image Im3 related to the internal structure of the measurement object S.
- the back projection image Im1 showing a defect or the like is combined with an image in which the shape of the estimated structure S2 is substantially the same as the measured object S, a shape that can be regarded as the same as the actually measured measured object S is It can be reproduced on an image with reduced generation of false images due to beam hardening. That is, it is possible to easily grasp internal defects or the like for the measured object S actually measured.
- the image generation unit 53 generates estimated data D2 using the following equations (7) and (7) ′ based on the concept described in the first embodiment. Then, the difference data D3 is extracted from the detection data D1 based on the output from the detector 4. As will be described later, the image generation unit 53 generates estimated data D2 by calculating Ai using Expression (7) ′, and substitutes the calculated Ai into Expression (7) to obtain ⁇ (X, Y, The difference data D3 is extracted by calculating Z). ... (7) ... (7) '
- ⁇ 1 (X, Y, Z) represents the spatial distribution of X-rays attenuated by photoelectric absorption in the object S to be measured
- ⁇ 2 (X, Y, Z) represents X-rays attenuated by the Compton effect in the object S to be measured. The spatial distribution of is shown.
- ⁇ 1 (X, Y, Z) and ⁇ 2 (X, Y, Z) are both known values determined by the material of the device under test S, and are stored in advance in a memory (not shown).
- Both f PE ( ⁇ ) and f KN ( ⁇ ) are expressed as the following equations (9) to (11) as functions depending on the photon energy amount ⁇ . ... (9) (10) ... (11)
- 511.975 keV in equation (11) corresponds to the static energy of electrons
- ⁇ 0 represents the photon energy of X-rays normalized by the static energy of electrons.
- ⁇ 1 (X, Y, Z) f PE ( ⁇ ) + ⁇ 2 (X, Y, Z) f KN ( ⁇ ) in Expression (8) is estimated based on the material information of the object S to be measured. This is information relating to attenuation of X-rays when X-rays having a photon energy amount ⁇ pass through the estimated structure S2 which is the measured object S in an ideal state.
- ⁇ (X, Y, Z) is the attenuation coefficient ⁇ (X, Y, Z) of the X-ray at the position (X, Y, Z) when the X-ray of the photon energy amount ⁇ passes through the object S to be measured.
- Z, ⁇ ) and the error term between the above attenuation information is the attenuation coefficient ⁇ (X, Y, Z) of the X-ray at the position (X, Y, Z) when the X-ray of the photon energy amount ⁇ passes through the object S to be measured.
- the attenuation coefficient ⁇ (X, Y, Z, ⁇ ), the functions f PE ( ⁇ ), and f KN ( ⁇ ) are elements that depend on the photon energy amount ⁇ .
- ⁇ (X, Y, Z) is an element assumed not to depend on the photon energy amount ⁇ .
- Equation (13) i indicates the position of one pixel among a plurality of pixels included in the detector 4. Also, ri represents a noise component such as dark current included in the output from the i-th arrayed pixel of the detector 4.
- Ai is the transmission intensity of X-rays that have passed through the estimated structure S2 when the estimated structure S2 is irradiated with X-rays according to the measurement conditions, that is, estimated data, similarly to Bi in the first embodiment. It corresponds to D2. Therefore, the image generation unit 53 generates the estimation data D2 by applying the design information and the measurement conditions to Expression (7) ′.
- the image generation unit 53 performs the same processing as in the case of the first embodiment. That is, the image generation unit 53 evaluates the magnitude relationship between the calculated ⁇ (X, Y, Z) and the first predetermined value, and generates a backprojection image and displays a three-dimensional image according to the evaluation result, or After correcting the estimated data D2, a back projection image is generated and a three-dimensional image is displayed.
- the image generation unit 53 generates a three-dimensional image by performing each process shown in the flowchart of FIG. 5 of the first embodiment.
- the image generation unit 53 generates the estimation data D ⁇ b> 2 by calculating Ai using Expression (7) ′.
- the image generation unit 53 calculates ⁇ (X, Y, Z) using Expression (7).
- the image generation unit 53 uses ⁇ 1 (X, Y, Z) that is information about photoelectric absorption and ⁇ 2 (X, Y, Z) that is information about the Compton effect.
- ⁇ (X, Y, Z, ⁇ ) is expressed, and attenuation coefficient ⁇ (X, Y, Z) is expressed by using either ⁇ 1 (X, Y, Z) or ⁇ 2 (X, Y, Z).
- Z, ⁇ ) may be expressed.
- the image generation unit 53 uses the information ⁇ 1 (X, Y, Z) regarding photoelectric absorption, and the photon energy amount ⁇ is large.
- information ⁇ 2 (X, Y, Z) related to the Compton effect can be used.
- the image generation unit 53 includes X-ray spectrum information incident on the measurement object S, ⁇ 1 (X, Y, Z) that is information relating to photoelectric absorption of X-rays when passing through the measurement object S, Based on at least one piece of information of ⁇ 2 (X, Y, Z), which is information related to the Compton effect of X-rays when passing through the measurement object S, estimated data D2 is generated. That is, the image generation unit 53 calculates Ai using the above equation (7) ′. Therefore, the estimated data D2 can be generated without requiring a large processing load.
- the third embodiment of the present invention will be described with reference to the drawings.
- the same components as those in the first embodiment are denoted by the same reference numerals, and different points will be mainly described. Points that are not particularly described are the same as those in the first embodiment.
- the present embodiment is different from the first embodiment in that a non-defective product is determined for an object to be measured using the extracted difference data.
- the image generation unit 53 calculates ⁇ (X, Y, Z) using Expression (1), that is, extracts the difference data D3, as in the case of the first embodiment.
- the image generation unit 53 compares the magnitude relationship between the calculated ⁇ (X, Y, Z) and the second predetermined value.
- the second predetermined value for example, a tolerance value of the measurement object S can be used.
- ⁇ (X, Y, Z) is equal to or smaller than the second predetermined value, it is determined that the shape of the measured object S is within the allowable tolerance range with respect to the shape of the estimated structure S2.
- the image generation unit 53 determines that the device under test S does not have a large shape error with respect to the design dimension, and determines this device under test S as a non-defective product.
- the image generation unit 53 generates the backprojection image Im1, combines with the image Im2 related to the estimated structure S2, and the image Im3 in the same manner as in the first embodiment. Generate.
- a three-dimensional image is generated using the image Im3 and displayed on the monitor 6. That is, since the back projection image Im1 of the difference data D3 is 0, it is assumed that the estimated structure S2 that has been corrected repeatedly matches the actual shape of the object to be measured S (structure), and the image Im3 is used. To generate a three-dimensional image.
- the image Im3 may be displayed in comparison with the design image, or only the difference image between the image Im3 and the design image may be displayed.
- the image generation unit 53 determines that the device under test S is defective and does not perform subsequent processing. Note that the image generation unit 53 may not display the three-dimensional image of the device under test S on the display monitor 6 but may display a warning on the display monitor 6 that the device under test S is defective. Even when it is determined that the device under test S is defective, the image generation unit 53 may generate a three-dimensional image of the device under test S and display it on the display monitor 6.
- the image generation unit 53 may display a warning that the image is defective by being superimposed on the three-dimensional image of the measurement object S displayed on the display monitor 6.
- the image generation unit 53 calculates ⁇ (X, Y, Z) in the same manner as in the first embodiment. However, ⁇ (in the same manner as in the second embodiment). X, Y, Z) may be calculated.
- a process for generating a three-dimensional image of the object S to be measured by the image generation unit 53 will be described with reference to the flowchart of FIG.
- the processing shown in FIG. 5 is performed by executing a program in the image processing unit 53.
- This program is stored in a memory (not shown) in the control device 5, and is activated and executed by the image generation unit 53.
- Each process from step S11 (design information and measurement condition acquisition) to step S14 (difference data extraction) is the same as each process from step S1 (design information and measurement condition acquisition) to step S4 (difference data extraction) in FIG. Similar processing is performed.
- step S15 it is determined whether or not all ⁇ (X, Y, Z) depending on the position calculated for each pixel is equal to or smaller than the second predetermined value. If all ⁇ (X, Y, Z) are equal to or smaller than the second predetermined value, an affirmative determination is made in step S15 and the process proceeds to step S17. If there is ⁇ (X, Y, Z) exceeding the second predetermined value, a negative determination is made in step S15 and the process proceeds to step S16. In step S16, the device under test S is determined to be defective, and the process is terminated. In step S16, a display indicating that the device under test S is defective may be displayed on the display monitor 6.
- step S17 size determination between all ⁇ (X, Y, Z) and the first predetermined value
- step S19 the corrected estimated structure shape is changed to the actual measured object (structure) shape
- step S5 determination of size between all ⁇ (X, Y, Z) and the first predetermined value
- step S7 actually correct the shape of the estimated structure.
- the shape of the object to be measured (structure) is the same as each process. However, when the process of step S13 is performed again via step S18, the determination in step S15 is skipped and the process proceeds to step S17.
- the image generation unit 53 determines the device under test S as a non-defective product. Accordingly, ⁇ (X, Y, Z) can be used for purposes other than image generation, and convenience can be improved.
- the image generation unit 53 determines the measurement object S as a non-defective product based on the difference data D3, the image generation unit 53 back-projects the difference data D3 to generate a back-projection image Im1, and an image Im2 related to the estimated structure S2 And the image Im3 of the internal structure of the object S to be measured is generated. Therefore, since Im3 related to the internal structure of the measurement object S can be generated when the measurement object S does not have a large shape error, the necessity for the measurement object S determined to be defective is necessary. It is possible to prevent an increase in load due to the generation of an image with a low value.
- the structure manufacturing system of the present embodiment creates a molded product such as an electronic component including, for example, an automobile door portion, an engine portion, a gear portion, and a circuit board.
- FIG. 7 is a block diagram showing an example of the structure of the structure manufacturing system 600 according to this embodiment.
- the structure manufacturing system 600 includes an X-ray apparatus 100, a design apparatus 610, a forming apparatus 620, a control system 630, and a repair apparatus 640 described in any one of the first to third embodiments or modifications. With.
- the design device 610 is a device used by a user when creating design information related to the shape of a structure, and performs design processing for creating and storing design information.
- the design information is information indicating the coordinates of each position of the structure.
- the design information is output to the molding apparatus 620 and a control system 630 described later.
- the molding apparatus 620 performs a molding process for creating and molding a structure using the design information created by the design apparatus 610.
- the molding apparatus 620 includes an apparatus that performs at least one of laminating, casting, forging, and cutting represented by 3D printer technology.
- the X-ray apparatus 100 performs a measurement process for measuring the shape of the structure formed by the forming apparatus 620.
- the X-ray apparatus 100 outputs information (hereinafter referred to as shape information) indicating the coordinates of the structure, which is a measurement result of the structure, to the control system 630.
- the control system 630 includes a coordinate storage unit 631 and an inspection unit 632.
- the coordinate storage unit 631 stores design information created by the design apparatus 610 described above.
- the inspection unit 632 determines whether the structure molded by the molding device 620 is molded according to the design information created by the design device 610. In other words, the inspection unit 632 determines whether or not the molded structure is a non-defective product. In this case, the inspection unit 632 reads the design information stored in the coordinate storage unit 631 and performs an inspection process for comparing the design information with the shape information input from the image measurement apparatus 100. For example, the inspection unit 632 compares the coordinates indicated by the design information with the coordinates indicated by the corresponding shape information as the inspection process, and if the coordinates of the design information and the coordinates of the shape information match as a result of the inspection process.
- the inspection unit 632 determines whether or not the coordinate difference is within a predetermined range, and if it is within the predetermined range, it can be restored. Judged as a defective product.
- the inspection unit 632 When it is determined that the defective product can be repaired, the inspection unit 632 outputs repair information indicating the defective portion and the repair amount to the repair device 640.
- the defective part is the coordinate of the shape information that does not match the coordinate of the design information
- the repair amount is the difference between the coordinate of the design information and the coordinate of the shape information in the defective part.
- the repair device 640 performs a repair process for reworking a defective portion of the structure based on the input repair information.
- the repair device 640 performs the same process as the molding process performed by the molding apparatus 620 in the repair process again.
- step S111 the design apparatus 610 is used when the structure is designed by the user.
- the design information on the shape of the structure is created and stored by the design process, and the process proceeds to step S112.
- the present invention is not limited to only the design information created by the design apparatus 610. If design information already exists, the design information is acquired by inputting the design information, and is included in one aspect of the present invention. It is.
- step S112 the molding apparatus 620 creates and molds a structure based on the design information by a molding process, and proceeds to step S113.
- step S113 the image measuring apparatus 100 performs a measurement process, measures the shape of the structure, outputs shape information, and proceeds to step S114.
- step S114 the inspection unit 632 performs inspection processing for comparing the design information created by the design apparatus 610 with the shape information measured and output by the image measurement apparatus 100, and the process proceeds to step S115.
- step S115 based on the result of the inspection process, the inspection unit 632 determines whether the structure molded by the molding apparatus 620 is a non-defective product. If the structure is a non-defective product, that is, if the coordinates of the design information coincide with the coordinates of the shape information, an affirmative determination is made in step S115 and the process ends.
- step S115 If the structure is not a non-defective product, that is, if the coordinates of the design information do not match the coordinates of the shape information, or if coordinates that are not in the design information are detected, a negative determination is made in step S115 and the process proceeds to step S116.
- step S116 the inspection unit 632 determines whether or not the defective portion of the structure can be repaired. If the defective part cannot be repaired, that is, if the difference between the coordinates of the design information and the coordinates of the shape information in the defective part exceeds the predetermined range, a negative determination is made in step 116 and the process ends. If the defective part can be repaired, that is, if the difference between the coordinates of the design information and the shape information in the defective part is within a predetermined range, an affirmative determination is made in step S116 and the process proceeds to step S117. In this case, the inspection unit 632 outputs repair information to the repair device 640.
- step S117 the repair device 640 performs a repair process on the structure based on the input repair information, and returns to step S113. As described above, the repair device 640 performs the same process as the molding process performed by the molding apparatus 620 in the repair process.
- the X-ray apparatus 100 of the structure manufacturing system 600 performs a measurement process for acquiring shape information of the structure created by the molding apparatus 620 based on the design process of the design apparatus 610, and performs an inspection unit of the control system 630.
- Reference numeral 632 performs an inspection process for comparing the shape information acquired in the measurement process with the design information created in the design process. Therefore, it is possible to determine whether a structure is a non-defective product created according to the design information by acquiring defect inspection of the structure or information inside the structure by nondestructive inspection. Contribute to.
- the repair device 640 performs the repair process for performing the molding process again on the structure based on the comparison result of the inspection process. Therefore, when the defective portion of the structure can be repaired, the same processing as the molding process can be performed again on the structure, which contributes to the manufacture of a high-quality structure close to design information.
- the image generation unit 53 has been described as estimating the shape of the estimated structure S2 using the shape information included in the design information.
- the estimated data D2 may be generated based on the detection data D1 of the object S to be measured.
- the image generation unit 53 generates an image by back projecting the detection data D1 of the object to be measured S using, for example, filtered back projection (FBP).
- FBP filtered back projection
- the image generation unit 53 estimates a substance, that is, a material constituting the object to be measured S based on the shading.
- the image generation unit 53 has data in which the image density and the material are associated in advance, and estimates the material from the generated image density, that is, the intensity of transmitted X-rays.
- the image generation unit 53 may generate the estimated data D2 by calculating Bi based on Expression (1) ′ using the estimated material as material information.
- the material information of the measured object S is acquired from the projection image of the measured object S in step S1 of FIG. 5 or step S11 of FIG. Therefore, the estimated data D2 can be generated even when the material information cannot be obtained as the design information of the object S to be measured.
- the image generation unit 53 may extract the shape information of the measurement object S by performing edge detection or the like using the back projection image of the measurement object S.
- the number of detection data generated by setting the X-ray irradiation direction for each small rotation angle is increased, and the number of detected edges, that is, the number of external shapes of the object S to be measured is increased, thereby accurately measuring the object to be measured.
- the shape of the object S can be obtained.
- the irradiation direction is preferably increased so that the number of detection data increases.
- the outer shape of the measurement object S may be extracted using an image obtained by imaging the measurement object S with an imaging device such as a camera and used as the shape of the estimation structure S2.
- the X-ray apparatus 100 has an imaging apparatus (not shown) including an imaging element constituted by a CMOS, a CCD, or the like.
- the imaging device is provided on the mounting portion 30 from the Y-axis direction substantially orthogonal to the X-ray projection direction (Z-axis) provided on the ceiling portion (Y-axis + side inner wall surface) of the housing 1.
- the image signal generated by imaging the outer shape of the measured object S is output to the control device 5.
- the image generation unit 53 performs a known edge detection process or the like on the input image signal, and extracts the contour of the measurement object S on the image signal.
- the imaging apparatus can image a wide range so that the entire object to be measured S can be imaged regardless of the position of the object to be measured S that is changed by the Y-axis moving unit 33 and the X-axis moving unit 34. It is preferable.
- the imaging device may be provided so as to be able to move in synchronization with the movement of the Y-axis moving unit 33 and the X-axis moving unit 34.
- the shape information is not limited to that obtained by the imaging device.
- measurement is performed using a projector that projects an optical image of the object S to be measured on a screen, a contact-type or scanning laser probe using a touch probe, or an optical non-contact type three-dimensional measurement apparatus. Information obtained by measuring the object S is also included.
- the mounting table 30 on which the measurement object S is mounted is moved in the X-axis, Y-axis, and Z-axis directions by the Y-axis moving unit 33, the X-axis moving unit 34, and the Z-axis moving unit 35. It is not limited to things.
- the mounting table 30 does not move in the X-axis, Y-axis, and Z-axis directions, and the X-ray source 2 and the detector 4 are moved in the X-axis, Y-axis, and Z-axis directions, so that What relatively moves the radiation source 2 and the detector 4 is also included in one aspect of the present invention.
- the table 30 does not rotate, and the X-ray source 2 and the detector 4 rotate about the rotation axis Yr. Included in embodiments. In the above-described embodiment, for example, even when the difference data D3 is generated by using only a part of the transmission image after acquiring the transmission images in a plurality of irradiation directions in step S3 of FIG. I do not care.
- the interface for inputting the detection data D1, design information of the object to be measured S, and measurement conditions, and the function of the image generation unit 53 may be realized by a computer.
- a program for realizing the function of the image generation processing is recorded on a computer-readable recording medium, and the above-described image generation program recorded on the recording medium is read into the computer system and executed. It may be realized by.
- the “computer system” includes an OS (Operating System) and peripheral hardware.
- the “computer-readable recording medium” refers to a portable recording medium such as a flexible disk, a magneto-optical disk, an optical disk, and a memory card, and a storage device such as a hard disk built in the computer system.
- the “computer-readable recording medium” dynamically holds a program for a short time like a communication line when transmitting a program via a network such as the Internet or a communication line such as a telephone line.
- a volatile memory in a computer system serving as a server or a client in that case may be included and a program that holds a program for a certain period of time.
- the above program may be for realizing a part of the functions described above, or may be realized by a combination with the program already recorded in the computer system. .
- FIG. 9 shows the state.
- the personal computer 950 is provided with a program via the CD-ROM 953.
- the personal computer 950 has a function of connecting to the communication line 951.
- a computer 952 is a server computer that provides the program, and stores the program in a recording medium such as a hard disk.
- the communication line 951 is a communication line such as the Internet or personal computer communication, or a dedicated communication line.
- the computer 952 reads the program using the hard disk and transmits the program to the personal computer 950 via the communication line 951. That is, the program is transmitted as a data signal by a carrier wave and transmitted via the communication line 951.
- the program can be supplied as a computer-readable computer program product in various forms such as a recording medium and a carrier wave.
- the present invention is not limited to the above embodiments and / or modifications as long as the characteristics of the present invention are not impaired, and other forms conceivable within the scope of the technical idea of the present invention are not limited thereto. Included in range.
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Abstract
Description
本発明の態様では、検査精度の低下を抑制できるX線計測装置の画像再構成方法、構造物の製造方法、X線計測装置の画像再構成プログラムおよびX線計測装置を提供することを目的とする。
本発明の第2の態様によると、X線計測装置の画像再構成方法は、被測定物の回転および/またはX線の照射方向の変更により、被測定物に対して複数の異なる照射方向にX線を照射し、複数の異なる照射方向ごとに被測定物を透過したX線を検出して、被測定物の透過X線強度に関する複数の検出データを生成することと、被測定物の形状情報に基づいて形状を推定した推定構造物に複数の異なる照射方向からX線を照射する場合の、複数の異なる照射方向ごとの透過X線の強度を推定して、複数の推定データを生成することと、複数の検出データのそれぞれに対して、X線の照射方向に関して互いに対応する検出データと推定データとを用いて、推定データと検出データとの間の差異を示す差異データを検出データから抽出することと、抽出された差異データの示す差異が所定値を超えない場合には、被測定物を良品と判定することと、を有する。
本発明の第3の態様によると、構造物の製造方法は、構造物の形状に関する設計情報を作成し、設計情報に基づいて構造物を作成し、作成された構造物の形状を、上記の何れかの態様のX線計測装置の画像再構成方法を用いて計測して形状情報を取得し、取得された形状情報と設計情報とを比較する。
本発明の第4の態様によると、X線計測装置の画像再構成プログラムは、被測定物の回転および/またはX線の照射方向の変更により、被測定物に対して複数の異なる照射方向にX線を照射し、複数の異なる照射方向ごとに被測定物を透過したX線を検出して、被測定物の透過X線強度に関する複数の検出データをそれぞれ生成する検出データ生成処理と、被測定物の形状情報に基づいて形状を推定した推定構造物に複数の異なる照射方向からX線を照射する場合の、複数の異なる照射方向ごとの透過X線の強度を推定して複数の推定データをそれぞれ生成する推定データ生成処理と、複数の検出データのそれぞれに対して、X線の照射方向に関して互いに対応する検出データと推定データとを用いて、推定データと検出データとの間の差異を示す差異データを検出データから抽出する抽出処理と、をコンピュータに実行させる。
本発明の第5の態様によると、X線計測装置は、被測定物の回転および/またはX線の照射方向の変更により、被測定物に対して複数の異なる照射方向にX線を照射し、複数の異なる照射方向ごとに被測定物を透過したX線を検出することによって生成された、被測定物の透過X線強度に関する複数の検出データを取得する取得部と、被測定物の形状情報に基づいて形状を推定した推定構造物に複数の異なる照射方向からX線を照射する場合の複数の異なる照射方向ごとに透過X線の強度を推定して複数の推定データを生成し、複数の検出データのそれぞれに対して、X線の照射方向に関して互いに対応する取得部により取得された検出データと推定データとの間の差異を示す差異データを抽出する画像生成部と、を有する。
図面を参照しながら、第1の実施の形態によるX線装置について説明する。X線装置は、被測定物にX線を照射して、被測定物を透過した透過X線を検出することにより、被測定物の内部情報(たとえば内部構造)等を非破壊で取得する。被測定物が、たとえば機械部品や電子部品等の産業用部品が対象である場合には、X線装置は産業用部品を検査する産業用X線CT(Computed Tomography)検査装置と呼ばれる。なお、被測定物の検査対象として、人体、動物、植物などの生物を対象としても構わない。また、その生物の一部の組織を対象としても構わない。また、生物と産業用部品のような非生物とを組み合わせても構わない。
本実施の形態は、発明の趣旨の理解のために具体的に説明するためのものであり、特に指定の無い限り、本発明を限定するものではない。
X線装置100は、筐体1、X線源2、載置部3、検出器4、制御装置5、表示モニタ6およびフレーム8を備えている。筐体1は、工場等の床面上にXZ平面と実質的に平行(水平)となるように配置され、内部にX線源2と、載置部3と、検出器4と、フレーム8とが収容される。筐体1はX線が外部に漏洩しないようにするために、材料として鉛を含む。
--3次元画像を生成する概念--
図2および図3を用いて、3次元画像を生成する概念について説明する。図2は、本実施の形態による3次元画像を生成するための過程を模式的に示す概念図である。図2(a)は、検出器4から出力された電気信号に基づいて生成された検出データに基づく被測定物Sの立体像を模式的に示す。被測定物Sの立体像は、載置台30を回転させることにより、被測定物Sに対して異なる複数の照射方向から照射されたX線が被測定物Sを透過するごとに得られた検出データを複数用いることにより得られる。被測定物Sの立体像は被測定物Sを実際に透過したX線の透過強度に基づいているので、被測定物Sの立体像には、被測定物Sの内部に巣等の欠陥が含まれる場合には、被測定物Sの内部の巣等の欠陥による情報が含まれる。これにより、被測定物Sには所定の設計情報に対して差が生じることとなるため、被測定物Sの立体像には誤差が含まれることとなる。図2(a)では、誤差の一例として被測定物Sの内部の欠陥S1の立体像を示している。図3(a)は、被測定物Sの立体像を生成するために用いるX線の透過強度、すなわち複数の検出データのうちのある1つの検出データD1を模式的に示す。図3(a)は、載置台30がある検出移動位置および検出回転位置にあるときに被測定物S内部の欠陥S1を通る断面(図2(a)の破線で示す面P)におけるX線の透過強度を示している。なお、説明を簡単にするため、縦軸の強度はX線の透過強度をX線の透過長さ(距離)で除した値として示している。図3(b)、(c)についても同様である。欠陥S1と被測定物Sとの間ではX線の吸収係数が異なるため、欠陥S1を透過したX線の透過強度と欠陥S1を透過していないX線の透過強度との間で差異が生じる。図3(a)は、欠陥S1がその周囲で吸収されるX線の割合に対して、吸収される割合が小さいために、被測定物Sを透過したX線の透過強度と比べて、欠陥S1を透過したX線の透過強度が高くなった場合を例として示す。
なお、推定データD2は、検出データD1が得られた場合と同一の条件にて生成される。すなわち、推定データD2は、検出データD1が生成されるときの載置台30の検出移動位置および検出回転位置と同一の検出移動位置および検出回転位置にて推定構造物S2にX線を照射する場合を推定して生成される。また、推定データD2は、検出データD1が生成されるときにX線源2から出力されるX線の出力と同一の出力にてX線を推定構造物S2に照射した場合を推定して生成される。したがって、異なるX線の照射方向ごとに検出された複数の検出データD1のそれぞれに対応する推定データD2が生成される。
この場合、算出された複数の差異データD3を逆投影して、被測定物Sと推定構造物S2との差異に関する逆投影画像Im1を生成する。次に、逆投影画像Im1と推定構造物S2に相当する画像Im2とを組み合わせて、画像Im3を生成する。すなわち、画像Im3は、被測定物Sとほぼ同一の形状を有するが偽像の発生が抑制された推定構造物S2の画像Im2に実際の被測定物Sの内部に存在する欠陥等が再現された3次元画像となる。したがって、画像Im3では、ビームハードニングによる偽像の発生が抑制される。
なお、検出器4としてラインセンサを用いる場合には、被測定物SのY方向における異なる位置に対応する複数の透過X線強度データ群を用いて逆投影を行うことで、被測定物S全体の内部構造を示す3次元画像が生成される。
画像生成部53が、上述した3次元画像Im3を生成する際に実行する処理について説明する。画像生成部53は、以下の式(1)、(1)’を用いて、推定データD2を生成し、また、検出器4からの出力に基づく検出データD1から差異データD3を抽出する。
…(1)
…(1)’
μ(X,Y,Z,ε)=μ0(X,Y,Z,ε)+δμ(X,Y,Z) …(2)
ここで、δμ(X,Y,Z)は、両者の誤差である。
μ(X,Y,Z,ε)Δl=μ0(X,Y,Z,ε)Δl+δμ(X,Y,Z)Δl
…(3)
(即ち、式(1)’)とおくことにより、式(1)が得られる。上述したように減弱係数μ0(X,Y,Z,ε)は、推定構造物S2の内部の位置(X,Y,Z)におけるX線の減弱係数であり、被測定物Sの設計情報により決まる。設計情報は、例えば、被測定物Sを構成している材料に関する材料情報を用いる。被測定物Sの材料情報とは、例えば、被測定物Sに含まれる物質情報の割合でも構わない。また、被測定物Sの材料情報とは、例えば、被測定物Sに含まれる物質が、金属もしくは非金属かの情報でも構わない。また、被測定物Sの材料情報とは、例えば、被測定物Sを構成する部材ごとに含まれる元素情報でも構わないし、化合物情報でも構わない。また、設計情報は、例えば、被測定物Sの外部形状情報及び/又は内部形状情報に関する形状情報を用いる。強度Ii(ε)は、測定装置の測定条件である、被測定物Sに照射するX線強度とスペクトルにより決まる。したがって、式(1)’で表されるBiは、設計情報、材料情報、測定条件に基づいて算出される検出器4のi番目の検出画素により検出される検出強度に相当する。即ち、Biは、推定構造物S2に対して測定条件に従ってX線を照射した場合に推定構造物S2を通過したX線の透過強度に相当し、このBiを検出器4の検出画素の個数分配列すると、上述した推定データD2に相当するものとなる。したがって、画像生成部53は、設計情報、材料情報、測定条件を式(1)’に適用して推定データD2を生成する。
ステップS1において、被測定物Sの設計情報である形状情報および材料情報と、測定装置情報である被測定物Sの測定条件とを取得してテップS2へ進む。ステップS2では、形状情報、材料情報および測定情報に基づいて、上記の式(1)’を用いて各画素毎にBiを算出(すなわち推定データD2を生成)してステップS3へ進む。
(1)画像生成部53は、被測定物Sを透過したX線の透過強度に関する複数の検出データD1と、設計情報に基づいて構成された架空の推定構造物S2に対して、被測定物Sを透過させたのと同じX線の照射条件で照射したと仮定した場合に推定されるX線の透過強度に関する複数の推定データD2とを生成する。画像生成部53は、X線の照射方向に関して互いに対応する検出データD1と推定データD2とを用いて、検出データD1と推定データD2との差異を示す差異データD3を抽出する。したがって、被測定物Sの検出データD1から、設計情報に基づいて推定された推定構造物S2には含まれない被測定物Sの内部の巣等の欠陥S1、および、被測定物Sと推定構造物S2との形状誤差に関する情報を取得することができる。
図面を参照して、本発明の第2の実施の形態について説明する。以下の説明では、第1の実施の形態と同じ構成要素には同じ符号を付して相違点を主に説明する。特に説明しない点については、第1の実施の形態と同じである。
…(7)
…(7)’
本実施の形態においては、光子エネルギー量εのX線が被測定物Sを通過する際の位置(X,Y,Z)でのX線の減弱係数μ(X,Y,Z,ε)を以下の式(8)のように仮定する。
…(8)
α1(X,Y,Z)は被測定物Sにおいて光電吸収により減弱するX線の空間分布を示し、α2(X,Y,Z)は被測定物Sにおいてコンプトン効果により減弱するX線の空間分布を示す。α1(X,Y,Z)およびα2(X,Y,Z)は共に被測定物Sの材料により決まる既知の値であり、予めメモリ(不図示)に記憶されている。fPE(ε)およびfKN(ε)は共に光子エネルギー量εに依存する関数として次の式(9)~(11)のように表される。
…(9)
…(10)
…(11)
なお、式(11)における510.975keVは電子の静止エネルギーに対応し、ε0は電子の静止エネルギーで規格化したX線の光子エネルギーを表す。
…(12)
この式(12)に対して、第1の実施の形態において、式(4)を導いた場合と同様に検出器4の画素に入射するX線のスペクトルIi(ε)を用いて表し、式(5)を導いた場合と同様にして、本実施の形態における検出器4に入射するX線の強度yiを式(13)のようになる。
…(13)
をAiとおくことにより、式(7)’が導かれる。上述したようにα1(X,Y,Z)、α2(X,Y,Z)は被測定物Sの設計情報により決まる値である。強度Ii(ε)は、測定装置の測定条件である、被測定物Sに照射するX線強度とスペクトルにより決まる。したがって、式(7)’で表されるAiは、設計情報、測定条件に基づいて算出される検出器4のi番目の検出画素により検出される検出強度に相当する。即ち、Aiは、第1の実施の形態におけるBiと同様に、推定構造物S2に対して測定条件に従ってX線を照射した場合に推定構造物S2を通過したX線の透過強度、すなわち推定データD2に相当するものとなる。したがって、画像生成部53は、設計情報、測定条件を式(7)’に適用して推定データD2を生成する。
画像生成部53は、被測定物Sに入射するX線のスペクトル情報と、被測定物Sを透過する際のX線の光電吸収に関する情報であるα1(X,Y,Z)と、被測定物Sを透過する際のX線のコンプトン効果に関する情報であるα2(X,Y,Z)の少なくとも1つの情報に基づいて、推定データD2を生成する。すなわち、画像生成部53は、上記の式(7)’を用いてAiを算出する。したがって、大きな処理負荷を必要とすることなく推定データD2を生成することができる。
図面を参照して、本発明の第3の実施の形態について説明する。以下の説明では、第1の実施の形態と同じ構成要素には同じ符号を付して相違点を主に説明する。特に説明しない点については、第1の実施の形態と同じである。本実施の形態では、抽出した差異データを用いて被測定物に対する良品判定を行う点が第1の実施の形態と異なる。
なお、上述の説明では、画像生成部53は第1の実施の形態と同様にしてδμ(X,Y,Z)を算出するものとしたが、第2の実施の形態と同様にしてδμ(X,Y,Z)を算出しても良い。
ステップS11(設計情報、測定条件取得)からステップS14(差異データ抽出)までの各処理は、図5のステップS1(設計情報、測定条件取得)からステップS4(差異データ抽出)までの各処理と同様の処理を行う。
(1)画像生成部53は、差異データD3に対応するδμ(X,Y,Z)が第2所定値を超えない場合には、被測定物Sを良品として判定する。したがって、δμ(X,Y,Z)を画像の生成以外に用いることが可能となり、利便性を向上できる。
図面を参照して、本発明の実施の形態による構造物製造システムを説明する。本実施の形態の構造物製造システムは、たとえば自動車のドア部分、エンジン部分、ギア部分および回路基板を備える電子部品等の成型品を作成する。
ステップS111では、設計装置610はユーザによって構造物の設計を行う際に用いられ、設計処理により構造物の形状に関する設計情報を作成し記憶してステップS112へ進む。なお、設計装置610で作成された設計情報のみに限定されず、既に設計情報がある場合には、その設計情報を入力することで、設計情報を取得するものについても本発明の一態様に含まれる。ステップS112では、成形装置620は成形処理により、設計情報に基づいて構造物を作成、成形してステップS113へ進む。ステップS113においては、画像測定装置100は測定処理を行って、構造物の形状を計測し、形状情報を出力してステップS114へ進む。
(1)構造物製造システム600のX線装置100は、設計装置610の設計処理に基づいて成形装置620により作成された構造物の形状情報を取得する測定処理を行い、制御システム630の検査部632は、測定処理にて取得された形状情報と設計処理にて作成された設計情報とを比較する検査処理を行う。従って、構造物の欠陥の検査や構造物の内部の情報を非破壊検査によって取得し、構造物が設計情報の通りに作成された良品であるか否かを判定できるので、構造物の品質管理に寄与する。
また、次のような変形も本発明の範囲内であり、変形例の一つ、もしくは複数を上述の実施形態と組み合わせることも可能である。
(1)第1~第4の実施の形態におけるX線装置100では、画像生成部53は、設計情報に含まれる形状情報を用いて推定構造物S2の形状を推定するものとして説明したが、被測定物Sの検出データD1に基づいて推定データD2を生成しても良い。この場合、画像生成部53は、被測定物Sの検出データD1を、たとえばフィルタ補正逆投影(FBP)等を用いて逆投影して画像を生成する。この画像は被測定物Sを透過したX線の強度に応じて濃淡により表されるので、画像生成部53は、この濃淡に基づいて被測定物Sを構成する物質、すなわち材料を推定する。たとえば、画像生成部53は、画像の濃度と材料とが関連付けられたデータを予め有し、生成した画像の濃度、すなわち透過したX線の強度から材料を推定する。画像生成部53は、この推定した材料を材料情報として使用して、式(1)’に基づいてBiを算出することにより、推定データD2を生成すれば良い。この場合、図5のステップS1または図6のステップS11にて被測定物Sの投影画像から被測定物Sの材料情報を取得する。したがって、被測定物Sの設計情報として材料情報が得られない場合であっても推定データD2を生成することができる。
なお、上述の実施の形態では、例えば、図5のステップS3において、複数の照射方向について透過像を取得した後の、その一部のみの透過像を用いて、差異データD3を生成しても構わない。
600…構造物製造システム、610…設計装置、620…成形装置、
630…制御システム、632…検査部、640…リペア装置
Claims (19)
- 被測定物の回転および/またはX線の照射方向の変更により、前記被測定物に対して複数の異なる前記照射方向に前記X線を照射し、前記複数の異なる照射方向ごとに前記被測定物を透過したX線を検出して、前記被測定物の透過X線強度に関する複数の検出データを生成することと、
前記被測定物の形状情報に基づいて形状を推定した推定構造物に前記複数の異なる照射方向から前記X線を照射する場合の、前記複数の異なる照射方向ごとの透過X線の強度を推定して、複数の推定データを生成することと、
前記複数の検出データのそれぞれに対して、前記X線の照射方向に関して互いに対応する前記検出データと前記推定データとを用いて、前記推定データと前記検出データとの間の差異を示す差異データを前記検出データから抽出することと、を有するX線計測装置の画像再構成方法。 - 請求項1に記載のX線計測装置の画像再構成方法において、
前記抽出された複数の差異データを逆投影して画像を生成し、前記逆投影して生成した画像と前記推定構造物とを組み合わせて、前記被測定物の内部構造の画像を生成するX線計測装置の画像再構成方法。 - 請求項1または2に記載のX線計測装置の画像再構成方法において、
前記被測定物の材料情報と前記被測定物に入射するX線のスペクトル情報とに基づいて、前記推定構造物に前記X線を照射する場合の前記透過X線の強度を推定して、前記推定データを生成するX線計測装置の画像再構成方法。 - 請求項1または2に記載のX線計測装置の画像再構成方法において、
前記被測定物に入射するX線のスペクトル情報と、前記被測定物を透過する際のX線の光電吸収に関する情報と、前記被測定物を透過する際のX線のコンプトン効果に関する情報との少なくとも1つの情報に基づいて、前記推定構造物に前記X線を照射する場合の前記透過X線の強度を推定するX線計測装置の画像再構成方法。 - 請求項3または4に記載のX線計測装置の画像再構成方法において、
前記X線の減弱係数は、前記X線の光子エネルギーに依存する第1要素と前記X線の光子エネルギーに依存しない第2要素とを含むと仮定し、
前記検出データと前記推定データとを用いて前記第2要素の値を算出することにより、前記差異データを抽出するX線計測装置の画像再構成方法。 - 請求項1乃至5の何れか一項に記載のX線計測装置の画像再構成方法において、
前記形状情報は、前記被測定物の設計情報であるX線計測装置の画像再構成方法。 - 請求項1乃至5の何れか一項に記載のX線計測装置の画像再構成方法において、
前記形状情報は、前記複数の検出データを逆投影した画像を用いて生成されるX線計測装置の画像再構成方法。 - 請求項1乃至7の何れか一項に記載のX線計測装置の画像再構成方法において、
前記抽出された差異データの示す差異が第1閾値を超えない場合には、前記複数の差異データを逆投影して、前記差異データの逆投影画像を生成し、前記差異データの逆投影画像と前記推定構造物とを組み合わせて、前記被測定物の内部構造の画像を生成するX線計測装置の画像再構成方法。 - 請求項8に記載のX線計測装置の画像再構成方法において、
前記抽出された差異データの示す差異が前記第1閾値よりも大きい場合には、前記複数の差異データの示す差異に基づいて、前記推定データを修正して修正後推定データを生成するX線計測装置の画像再構成方法。 - 請求項9に記載のX線計測装置の画像再構成方法において、
前記検出データと前記修正後推定データとを用いて、前記検出データと前記修正後推定データとの間の差異を示す新たな差異データを前記検出データから抽出し、
前記新たな差異データの示す差異が前記第1閾値を超えない場合には、前記新たな差異データを逆投影して、前記差異データの逆投影画像を生成し、前記差異データの逆投影画像と前記推定構造物とを組み合わせて、前記被測定物の内部構造の画像を生成するX線計測装置の画像再構成方法。 - 被測定物の回転および/またはX線の照射方向の変更により、前記被測定物に対して複数の異なる前記照射方向に前記X線を照射し、前記複数の異なる照射方向ごとに前記被測定物を透過したX線を検出して、前記被測定物の透過X線強度に関する複数の検出データを生成することと、
前記被測定物の形状情報に基づいて形状を推定した推定構造物に前記複数の異なる照射方向から前記X線を照射する場合の、前記複数の異なる照射方向ごとの透過X線の強度を推定して、複数の推定データを生成することと、
前記複数の検出データのそれぞれに対して、前記X線の照射方向に関して互いに対応する前記検出データと前記推定データとを用いて、前記推定データと前記検出データとの間の差異を示す差異データを前記検出データから抽出することと、
前記抽出された差異データの示す差異が所定値を超えない場合には、前記被測定物を良品と判定することと、を有するX線計測装置の画像再構成方法。 - 請求項11に記載のX線計測装置の画像再構成方法において、
前記被測定物が良品と判定された場合には、前記差異データを逆投影して画像を生成し、前記逆投影して生成した画像と前記推定構造物とを組み合わせて、前記被測定物の内部構造の画像を生成するX線計測装置の画像再構成方法。 - 構造物の形状に関する設計情報を作成し、
前記設計情報に基づいて前記構造物を作成し、
作成された前記構造物の形状を、請求項1乃至12の何れか一項に記載のX線計測装置の画像再構成方法を用いて計測して形状情報を取得し、
前記取得された前記形状情報と前記設計情報とを比較する構造物の製造方法。 - 請求項13に記載の構造物の製造方法において、
前記形状情報と前記設計情報との比較結果に基づいて実行され、前記構造物の再加工を行う構造物の製造方法。 - 請求項14に記載の構造物の製造方法において、
前記構造物の再加工は、前記設計情報に基づいて前記構造物の作成を再度行う構造物の製造方法。 - 被測定物の回転および/またはX線の照射方向の変更により、前記被測定物に対して複数の異なる前記照射方向に前記X線を照射し、前記複数の異なる照射方向ごとに前記被測定物を透過したX線を検出して、前記被測定物の透過X線強度に関する複数の検出データをそれぞれ生成する検出データ生成処理と、
前記被測定物の形状情報に基づいて形状を推定した推定構造物に前記複数の異なる照射方向から前記X線を照射する場合の、前記複数の異なる照射方向ごとの透過X線の強度を推定して複数の推定データをそれぞれ生成する推定データ生成処理と、
前記複数の検出データのそれぞれに対して、前記X線の照射方向に関して互いに対応する前記検出データと前記推定データとを用いて、前記推定データと前記検出データとの間の差異を示す差異データを前記検出データから抽出する抽出処理と、をコンピュータに実行させるX線計測装置の画像再構成プログラム。 - 請求項16に記載のX線計測装置の画像再構成プログラムにおいて、
前記抽出された複数の差異データを逆投影して画像を生成し、前記逆投影して生成した画像と前記推定構造物とを組み合わせて、前記被測定物の内部構造の画像を生成する画像生成処理を更にコンピュータに実行させるX線計測装置の画像再構成プログラム。 - 被測定物の回転および/またはX線の照射方向の変更により、前記被測定物に対して複数の異なる前記照射方向に前記X線を照射し、前記複数の異なる照射方向ごとに前記被測定物を透過したX線を検出することによって生成された、前記被測定物の透過X線強度に関する複数の検出データを取得する取得部と、
前記被測定物の形状情報に基づいて形状を推定した推定構造物に前記複数の異なる照射方向から前記X線を照射する場合の前記複数の異なる照射方向ごとに透過X線の強度を推定して複数の推定データを生成し、前記複数の検出データのそれぞれに対して、前記X線の照射方向に関して互いに対応する前記取得部により取得された前記検出データと前記推定データとの間の差異を示す差異データを抽出する画像生成部と、を有するX線計測装置。 - 請求項18に記載のX線計測装置において、
前記画像生成部は、前記抽出した前記差異データを逆投影して画像を生成し、前記逆投影により生成した画像と前記推定構造物とを組み合わせて、前記被測定物の内部構造の画像を生成するX線計測装置。
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2018198242A1 (ja) * | 2017-04-26 | 2020-03-05 | 株式会社ニコン | 検査装置、検査方法および検査対象物の製造方法 |
JP2020531328A (ja) * | 2017-08-30 | 2020-11-05 | エコール・ポリテクニーク・フェデラル・ドゥ・ローザンヌ (ウ・ペ・エフ・エル)Ecole Polytechnique Federale De Lausanne (Epfl) | 断層逆投影による三次元造形の方法および装置 |
CN114334201A (zh) * | 2022-01-11 | 2022-04-12 | 西安热工研究院有限公司 | 基于x射线断层扫描的高温气冷堆燃料球完整性检测装置 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7186019B2 (ja) * | 2017-06-20 | 2022-12-08 | 株式会社ミツトヨ | 三次元形状計測装置及び三次元形状計測方法 |
EP4251981A1 (en) * | 2020-11-25 | 2023-10-04 | Shenzhen Xpectvision Technology Co., Ltd. | Apparatus and method for biological analyte studying using x-ray fluorescence |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050123089A1 (en) * | 2003-12-09 | 2005-06-09 | Man Bruno D. | Method and apparatus for reduction of artifacts in computed tomography images |
JP2009122043A (ja) * | 2007-11-16 | 2009-06-04 | Ihi Corp | 材質識別検査装置および方法 |
JP2013217775A (ja) * | 2012-04-09 | 2013-10-24 | Nikon Corp | X線装置、方法、及び構造物の製造方法 |
JP2013217797A (ja) * | 2012-04-10 | 2013-10-24 | Nikon Corp | 装置、判定方法、及び構造物の製造方法 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4852131A (en) * | 1988-05-13 | 1989-07-25 | Advanced Research & Applications Corporation | Computed tomography inspection of electronic devices |
US5436829A (en) | 1992-11-05 | 1995-07-25 | General Electric Company | Method of achieving reduced dose X-ray fluoroscopy by employing transform-based estimation of Poisson noise |
JP2002248344A (ja) * | 2001-02-26 | 2002-09-03 | Nikon Corp | 極端紫外光発生装置並びにそれを用いた露光装置及び半導体製造方法 |
US6823044B2 (en) * | 2001-11-21 | 2004-11-23 | Agilent Technologies, Inc. | System for collecting multiple x-ray image exposures of a sample using a sparse configuration |
JP3909048B2 (ja) * | 2003-09-05 | 2007-04-25 | ジーイー・メディカル・システムズ・グローバル・テクノロジー・カンパニー・エルエルシー | X線ct装置およびx線管 |
EP1700137B1 (en) * | 2003-12-16 | 2008-09-10 | Philips Intellectual Property & Standards GmbH | Correction of artifacts caused by the heel effect |
WO2006070316A1 (en) * | 2004-12-29 | 2006-07-06 | Philips Intellectual Property & Standards Gmbh | Apparatus and method for artifact correction of x-ray projections |
US7310403B2 (en) * | 2006-03-20 | 2007-12-18 | Moshe Ein-Gal | Target reconstruction |
CN105161392B (zh) | 2007-01-26 | 2018-10-23 | 皇家飞利浦电子股份有限公司 | 由与阳极板相同的材料制成的光谱保持足跟效应补偿过滤器 |
CN101266216A (zh) * | 2007-03-14 | 2008-09-17 | 清华大学 | 标定双能ct系统的方法和图像重建方法 |
CN101801271B (zh) * | 2007-08-07 | 2013-06-05 | 株式会社岛津制作所 | X射线透视摄影装置 |
CN101726503B (zh) * | 2008-10-17 | 2012-08-29 | 清华大学 | 用于x射线相衬层析成像的系统和方法 |
US8180138B2 (en) * | 2009-03-23 | 2012-05-15 | Morpho Detection, Inc. | Method and system for inspection of containers |
US20120093287A1 (en) * | 2010-10-18 | 2012-04-19 | Satpal Singh | Two unit portable x-ray scanner |
JP5834584B2 (ja) | 2011-07-25 | 2015-12-24 | ソニー株式会社 | 情報処理装置、情報処理方法、プログラム及び蛍光スペクトルの強度補正方法 |
JP2014016239A (ja) * | 2012-07-09 | 2014-01-30 | Tokyo Electron Ltd | X線検査方法及びx線検査装置 |
US9928619B2 (en) * | 2013-05-29 | 2018-03-27 | Tokyo Metropolitan Industrial Technology Research Institute | Device and method for image reconstruction at different X-ray energies, and device and method for X-ray three-dimensional measurement |
CN104240270B (zh) * | 2013-06-14 | 2017-12-05 | 同方威视技术股份有限公司 | Ct成像方法和系统 |
CN103489223A (zh) * | 2013-09-29 | 2014-01-01 | 华南理工大学 | 一种面向3d封装ic的3d断层扫描成像方法 |
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050123089A1 (en) * | 2003-12-09 | 2005-06-09 | Man Bruno D. | Method and apparatus for reduction of artifacts in computed tomography images |
JP2009122043A (ja) * | 2007-11-16 | 2009-06-04 | Ihi Corp | 材質識別検査装置および方法 |
JP2013217775A (ja) * | 2012-04-09 | 2013-10-24 | Nikon Corp | X線装置、方法、及び構造物の製造方法 |
JP2013217797A (ja) * | 2012-04-10 | 2013-10-24 | Nikon Corp | 装置、判定方法、及び構造物の製造方法 |
Non-Patent Citations (1)
Title |
---|
HIROYUKI ISHII ET AL.: "Three-Dimensional Shape Measurement with X-Ray CT-Scan", JOURNAL OF THE JAPAN SOCIETY OF PRECISION ENGINEERING, vol. 69, no. 4, 5 April 2003 (2003-04-05), pages 473 - 476, XP055463541 * |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2018198242A1 (ja) * | 2017-04-26 | 2020-03-05 | 株式会社ニコン | 検査装置、検査方法および検査対象物の製造方法 |
JP2020531328A (ja) * | 2017-08-30 | 2020-11-05 | エコール・ポリテクニーク・フェデラル・ドゥ・ローザンヌ (ウ・ペ・エフ・エル)Ecole Polytechnique Federale De Lausanne (Epfl) | 断層逆投影による三次元造形の方法および装置 |
CN114334201A (zh) * | 2022-01-11 | 2022-04-12 | 西安热工研究院有限公司 | 基于x射线断层扫描的高温气冷堆燃料球完整性检测装置 |
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US20180024079A1 (en) | 2018-01-25 |
CN107209130B (zh) | 2021-07-09 |
JP6658552B2 (ja) | 2020-03-04 |
US11860111B2 (en) | 2024-01-02 |
EP3258251B1 (en) | 2021-03-24 |
US20200284735A1 (en) | 2020-09-10 |
EP3258251A1 (en) | 2017-12-20 |
CN107209130A (zh) | 2017-09-26 |
EP3258251A4 (en) | 2018-10-17 |
JPWO2016129035A1 (ja) | 2017-11-24 |
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