JP7216953B2 - X線ctにおけるctボリュームの表面抽出方法 - Google Patents
X線ctにおけるctボリュームの表面抽出方法 Download PDFInfo
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- JP7216953B2 JP7216953B2 JP2018226040A JP2018226040A JP7216953B2 JP 7216953 B2 JP7216953 B2 JP 7216953B2 JP 2018226040 A JP2018226040 A JP 2018226040A JP 2018226040 A JP2018226040 A JP 2018226040A JP 7216953 B2 JP7216953 B2 JP 7216953B2
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T17/00—Three dimensional [3D] modelling, e.g. data description of 3D objects
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0012—Biomedical image inspection
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T17/00—Three dimensional [3D] modelling, e.g. data description of 3D objects
- G06T17/20—Finite element generation, e.g. wire-frame surface description, tesselation
- G06T17/205—Re-meshing
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
- G01N23/04—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material
- G01N23/046—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material using tomography, e.g. computed tomography [CT]
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T11/00—2D [Two Dimensional] image generation
- G06T11/003—Reconstruction from projections, e.g. tomography
- G06T11/008—Specific post-processing after tomographic reconstruction, e.g. voxelisation, metal artifact correction
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/10—Different kinds of radiation or particles
- G01N2223/101—Different kinds of radiation or particles electromagnetic radiation
- G01N2223/1016—X-ray
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/30—Accessories, mechanical or electrical features
- G01N2223/33—Accessories, mechanical or electrical features scanning, i.e. relative motion for measurement of successive object-parts
- G01N2223/3306—Accessories, mechanical or electrical features scanning, i.e. relative motion for measurement of successive object-parts object rotates
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/40—Imaging
- G01N2223/419—Imaging computed tomograph
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/40—Imaging
- G01N2223/42—Imaging image digitised, -enhanced in an image processor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/60—Specific applications or type of materials
- G01N2223/646—Specific applications or type of materials flaws, defects
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/60—Specific applications or type of materials
- G01N2223/648—Specific applications or type of materials voids
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/10—Image acquisition modality
- G06T2207/10072—Tomographic images
- G06T2207/10081—Computed x-ray tomography [CT]
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- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- General Health & Medical Sciences (AREA)
- Radiology & Medical Imaging (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- Pulmonology (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Medical Informatics (AREA)
- Quality & Reliability (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
- Apparatus For Radiation Diagnosis (AREA)
- Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
Description
12…X線源
14…X線検出器
16…回転テーブル
20…コントローラ
22…制御PC
g…CT値勾配ベクトル
M…等値面メッシュ
N、Nm…勾配ノルム
p…頂点
S、Sm…サンプル点
W…ワーク
Claims (2)
- X線CTにおけるCTボリュームの表面抽出に際して、
X線CTで取得したボリュームデータからCT値が一定のボクセルを抽出して等値面メッシュを生成し、
生成した等値面メッシュの頂点を抽出し、
抽出した頂点におけるCT値をフェルドカンプ法(FDK法)を用いて計算し、
計算したCT値の勾配情報を使って等値面メッシュの頂点を修正することを特徴とするX線CTにおけるCTボリュームの表面抽出方法。 - 前記等値面メッシュの頂点の修正を、
頂点のCT値の勾配ベクトルを計算し、
計算された勾配ベクトルの正負方向に複数のサンプル点を生成し、
生成された各サンプル点におけるCT値の勾配ノルムを計算し、
計算された勾配ノルムが最大のサンプル点に頂点を移動することにより行うことを特徴とする請求項1に記載のX線CTにおけるCTボリュームの表面抽出方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018226040A JP7216953B2 (ja) | 2018-11-30 | 2018-11-30 | X線ctにおけるctボリュームの表面抽出方法 |
US16/676,943 US11170572B2 (en) | 2018-11-30 | 2019-11-07 | Surface extraction method and apparatus for X-ray CT volume |
DE102019007840.3A DE102019007840A1 (de) | 2018-11-30 | 2019-11-12 | Oberflächenextraktionsverfahren und Vorrichtung für Röntgen-CT-Volumen |
CN201911199992.4A CN111340751A (zh) | 2018-11-30 | 2019-11-29 | X射线ct中的ct体积的表面提取方法和装置 |
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JP2018226040A JP7216953B2 (ja) | 2018-11-30 | 2018-11-30 | X線ctにおけるctボリュームの表面抽出方法 |
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JP2020085870A JP2020085870A (ja) | 2020-06-04 |
JP7216953B2 true JP7216953B2 (ja) | 2023-02-02 |
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JP2018226040A Active JP7216953B2 (ja) | 2018-11-30 | 2018-11-30 | X線ctにおけるctボリュームの表面抽出方法 |
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US (1) | US11170572B2 (ja) |
JP (1) | JP7216953B2 (ja) |
CN (1) | CN111340751A (ja) |
DE (1) | DE102019007840A1 (ja) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008257333A (ja) | 2007-04-02 | 2008-10-23 | Shimadzu Corp | 3次元画像化方法およびx線断層撮像装置 |
WO2013005455A1 (ja) | 2011-07-06 | 2013-01-10 | 国立大学法人東京大学 | 形状抽出方法及び形状抽出システム |
JP2018040790A (ja) | 2016-09-01 | 2018-03-15 | 国立大学法人 東京大学 | 部品形状抽出システム |
Family Cites Families (8)
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JP3427046B2 (ja) | 2000-08-29 | 2003-07-14 | 株式会社日立製作所 | 3次元寸法計測装置及びその計測方法 |
JP2004012407A (ja) | 2002-06-11 | 2004-01-15 | Hitachi Ltd | 透過画像提供システムおよびx線ct・dr撮影サービスシステム |
JP5794752B2 (ja) * | 2007-07-24 | 2015-10-14 | 株式会社東芝 | X線コンピュータ断層撮影装置及び画像処理装置 |
WO2015137011A1 (ja) * | 2014-03-14 | 2015-09-17 | 株式会社日立メディコ | X線ct装置、及び処理装置 |
WO2017117517A1 (en) * | 2015-12-30 | 2017-07-06 | The Johns Hopkins University | System and method for medical imaging |
CN106651977B (zh) * | 2016-09-30 | 2020-03-31 | 重庆大学 | 基于重建图像梯度的l0范数最小化的锥束ct旋转中心标定方法 |
JP7154535B2 (ja) | 2018-07-04 | 2022-10-18 | 国立大学法人 東京大学 | X線ct装置により得られる投影像を用いた寸法測定方法 |
JP7138858B2 (ja) | 2018-07-04 | 2022-09-20 | 国立大学法人 東京大学 | フィルタ逆投影法によるct再構成処理方法 |
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- 2018-11-30 JP JP2018226040A patent/JP7216953B2/ja active Active
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- 2019-11-07 US US16/676,943 patent/US11170572B2/en active Active
- 2019-11-12 DE DE102019007840.3A patent/DE102019007840A1/de active Pending
- 2019-11-29 CN CN201911199992.4A patent/CN111340751A/zh active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2008257333A (ja) | 2007-04-02 | 2008-10-23 | Shimadzu Corp | 3次元画像化方法およびx線断層撮像装置 |
WO2013005455A1 (ja) | 2011-07-06 | 2013-01-10 | 国立大学法人東京大学 | 形状抽出方法及び形状抽出システム |
JP2018040790A (ja) | 2016-09-01 | 2018-03-15 | 国立大学法人 東京大学 | 部品形状抽出システム |
Also Published As
Publication number | Publication date |
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US11170572B2 (en) | 2021-11-09 |
DE102019007840A1 (de) | 2020-06-04 |
US20200175758A1 (en) | 2020-06-04 |
JP2020085870A (ja) | 2020-06-04 |
CN111340751A (zh) | 2020-06-26 |
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