WO2016107059A1 - 无芯板制造构件、无芯板以及无芯板制作方法 - Google Patents

无芯板制造构件、无芯板以及无芯板制作方法 Download PDF

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Publication number
WO2016107059A1
WO2016107059A1 PCT/CN2015/080251 CN2015080251W WO2016107059A1 WO 2016107059 A1 WO2016107059 A1 WO 2016107059A1 CN 2015080251 W CN2015080251 W CN 2015080251W WO 2016107059 A1 WO2016107059 A1 WO 2016107059A1
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WIPO (PCT)
Prior art keywords
copper foil
coreless
prepreg
inner layer
layer copper
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PCT/CN2015/080251
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English (en)
French (fr)
Inventor
张志强
李志东
谢添华
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广州兴森快捷电路科技有限公司
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Publication of WO2016107059A1 publication Critical patent/WO2016107059A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Definitions

  • the invention relates to the field of coreless board technology, in particular to a coreless board manufacturing component, a coreless board and a coreless board manufacturing method.
  • the coreless thin-substrate technology has been developed. Since the coreless board is too thin, it will encounter more serious warpage problems, and it is easy to cause board damage during the manufacturing process. The problem of card scrapping.
  • a coreless plate manufacturing member comprising: a support carrier; and a coreless plate disposed on both sides of the support carrier; the coreless plate comprising: an inner prepreg, an outer prepreg, an inner layer copper foil and an outer layer copper foil; The inner prepreg is disposed on both sides of the inner layer copper foil, the outer prepreg is disposed on the innermost copper foil of the outermost layer, and the outer layer copper foil is disposed on the outer layer; the inner layer copper foil The border is opened.
  • the inner layer of the inner copper foil is provided with a round pad which is laid around the frame of the inner layer copper foil.
  • the outer copper foil has a gap formed by a frame.
  • the frame opening gap of the inner layer copper foil and the frame opening gap of the outer layer copper foil are on the same longitudinal plane.
  • the thickness of the bezel of the inner layer copper foil and the outer layer copper foil is greater than the thickness of the middle portion.
  • the support carrier comprises: an insulating sheet, a carrier copper foil disposed on both sides of the insulating sheet.
  • the surface of the carrier copper foil is roughened.
  • a coreless plate comprising: an inner prepreg, an outer prepreg, an inner layer copper foil and an outer layer copper foil; the inner prepreg is disposed on both sides of the inner layer copper foil, and the inner layer copper foil is disposed on the outermost layer
  • the outer prepreg is provided with an outer layer copper foil on the outer curing sheet; a gap is formed in a frame of the inner layer copper foil.
  • the inner layer of the inner copper foil is provided with a round pad which is laid around the frame of the inner layer copper foil.
  • a method for manufacturing a coreless board comprising: S100: providing a support carrier; S200: laminating an inner layer of copper foil on the support carrier, and providing an inner prepreg between the inner copper foil layers, and an inner layer copper foil An outer prepreg is disposed on the outer side, and then an outer layer copper foil is disposed on the outer side of the prepreg and a coreless plate is formed, and a gap is formed in the frame of the inner layer copper foil; S300: separating the coreless plate from the support carrier.
  • the supporting carrier is skillfully provided, which can effectively overcome the problem of the coreless plate warping and improve the yield of the coreless plate.
  • FIG. 1 is a schematic structural view of a coreless plate manufacturing member according to the present invention.
  • FIG. 2 is a schematic structural view of a support carrier in an embodiment
  • Figure 3 is a structural diagram of the coreless plate of Figure 1;
  • Figure 4 is a schematic view showing the pattern of the outer layer copper foil of Figure 1;
  • Figure 5 is a schematic view showing the pattern of the inner layer copper foil of Figure 1;
  • Figure 6 is a schematic view showing the structure of the glass fiber of Figure 1;
  • Figure 7 is a schematic view showing the structure of a double-layer glass fiber in an embodiment
  • Figure 8 is a flow chart of a manufacturing method proposed by the present invention.
  • Figure 9 is a flow chart of a manufacturing method in an embodiment
  • Figure 10 is a flow chart of a manufacturing method in another embodiment
  • Figure 11 is a schematic view of the positioning hole design.
  • the coreless board manufacturing member of this embodiment includes a support carrier, and a coreless plate disposed on both sides of the support carrier. specifically:
  • the support carrier is an insulator, and the insulator may be a material such as BT resin, epoxy resin, ABF, polytetrafluoroethylene, hydrocarbon ceramics or the like. Since the coreless plate is thin and the plate loss or warpage is likely to occur, the support carrier of the present embodiment can be provided to support the coreless plate.
  • the support carrier comprises: an insulating sheet, a carrier copper foil disposed on both sides of the insulating sheet, and the carrier copper foil is thick and has a thickness of 12-15 ⁇ m, which can better provide force for the manufacture of the coreless board. stand by.
  • the both sides of the carrier copper foil are roughened to increase the bonding force after pressing.
  • an outer layer copper foil is disposed on the outer side of the carrier copper foil, and the entire support carrier may be bonded together by pre-compression, and the opposite side of the carrier copper foil and the outer layer copper foil is roughened, that is, the surface Roughening can increase the bonding force after pressing, and it is more convenient to separate the carrier copper foil from the outer copper foil.
  • the structure of the outer copper foil can be applied to the coreless plate, that is, the structure of the outer copper foil is disposed on the insulating sheet in advance, and the composition of the outer core copper foil can be separated by the separation process. Copper foil.
  • the support carrier can be replaced with ice.
  • ice In the process of manufacturing a coreless board, firstly, it is made in an operating space below 0°, and then the coreless board is pressed in turn on both sides of the ice. After the pressing is completed, the temperature of the operating space is increased, and the ice is automatically melted. The two coreless plates can be automatically separated. The ice is made of pure water, and the ice does not leave marks after melting, and does not affect the coreless board.
  • Coreless board including: inner prepreg, outer prepreg, inner copper foil and outer copper foil.
  • an inner layer copper foil is disposed on both sides of the inner prepreg, and a plurality of layers may be disposed according to design requirements, that is, a plurality of inner layer copper foils are disposed, and a plurality of inner prepregs are also disposed between the plurality of inner layer copper foils.
  • the laminate is pressed together.
  • an outer prepreg is placed on the outermost inner copper foil, and then the outer prepreg peripheral Set the outer copper foil.
  • the thickness of the inner layer copper foil and the outer layer copper foil may be the same, and is also 2 to 5 ⁇ m.
  • the inner layer copper foil is provided with a gap, and the gap is disposed around the edge of the inner layer copper foil, and the direction in which the gap is opened can be perpendicular to the border of the inner layer copper foil, or can be set at an angle, and the gap design can be effective. Reduce the problem of voiding in the laminate.
  • a round pad may be provided inside the inner layer copper foil, and the round pad is uniformly disposed inside the frame of the inner layer copper foil and arranged in a ring shape. The use of a round pad design can more effectively reduce the voids in the laminate fill.
  • the gap is 0.5 to 1.5 mm, and the gap of the round pad is between 0.2 and 0.5 mm.
  • the inner surface of the outer copper foil may also be patterned to form small bumps that effectively squeeze the air bubbles in the fill during the lamination process.
  • the outer copper foil is placed on the outermost side and has two outer copper foils.
  • the outer copper foil is provided with a gap, and the gap is disposed around the inner layer copper foil, and the gap can be opened in a direction perpendicular to the outer copper foil frame, or can be disposed at an angle, and the gap design can be effectively reduced.
  • the gaps formed by the inner layer copper foil and the outer layer copper foil are all disposed on the same longitudinal plane, which can better reduce the problem of no void in the laminated glue.
  • the thickness of the frame of the inner layer copper foil and the outer layer copper foil is thicker than the thickness of the middle portion, which can effectively increase the strength of the coreless plate.
  • the inner prepreg and the outer prepreg of the coreless manufacturing member both contain glass fibers.
  • the main component of the inner-cured sheet and the outer-cured sheet is a resin, and the glass fiber layer is contained in the resin.
  • the thickness of the glass fiber layer of the inner curing sheet is 10 to 25 ⁇ m, and the rubber content of the resin is more than 75%; the thickness of the glass fiber of the outer curing sheet is at least 8 ⁇ m larger than the thickness of the glass fiber of the inner curing sheet, and the resin content of the outer curing sheet is less than that of the resin. 65%.
  • the warpage height refers to the height difference between the two ends of the coreless board; the warpage is the height difference divided by the length of the board to represent the degree of warpage of the board.
  • the difference in glass fiber thickness between the outer curing sheet and the inner curing sheet is controlled to be greater than 8 ⁇ m, and the warpage curvature can be effectively controlled to be less than 1%, and the warpage height difference is not higher than 5 mm. And the greater the difference in glass fiber thickness, the lower the warpage.
  • the coreless plate warpage can be reduced simply and at low cost.
  • a double-layered glass structure can also be provided in the outer curing sheet.
  • the double-layer fiberglass structure comprises a first glass fiber layer and a second glass fiber layer, wherein the first glass fiber layer is on the outer side, the second glass fiber layer is on the inner side, and the first glass fiber layer is thicker than the second glass fiber layer. And the thickness difference is greater than 8 ⁇ m.
  • the difference in thickness of the glass fiber can be adjusted according to the number and distribution density of the laser blind holes. The more the number of holes, the larger the distribution density, and the greater the difference in thickness. Double-layer glass fiber is more effective than single-layer glass fiber, which can effectively reduce the warpage of coreless board.
  • a coreless board manufacturing method including:
  • the support carrier comprises: an insulating sheet, a carrier copper foil disposed on two sides of the insulating sheet, wherein the carrier copper foil comprises a carrier copper foil and an outer layer copper foil combined, and an outer layer copper foil thickness ratio carrier The thickness of the copper foil is small.
  • the addition of the support carrier can increase the supply of the force-receiving body when the coreless board is produced, and can better support the manufacture of the coreless board.
  • S200 laminating a copper foil on a support carrier, and providing an inner prepreg between the copper foil layers, Coreless board.
  • two coreless plates can be produced at one time, which is doubled compared with the conventional production efficiency, and a thick support body is prepared for the thinner coreless plate, thereby alleviating the problem of warpage of the coreless plate.
  • the coreless plate comprises an inner prepreg, an outer prepreg, an inner layer copper foil and an outer layer copper foil.
  • an outer curing sheet is first attached to the copper layer supporting both sides of the carrier, and then the inner layer copper foil is attached, and the number of the inner copper foil layers to be added is controlled according to the required number of layers, and the two inner layers are connected. At least one inner solidified sheet is sandwiched between the layers of copper foil.
  • the support carrier is provided with an outer layer of copper foil on both sides, and an outer prepreg is applied on the outer copper foil for one press-fitting; and then three inner layers of copper foil are sequentially added, in each of the two layers. There is an inner prepreg between the layers of copper foil, and each time a layer of inner copper foil is added, a press-fit is performed. Finally, an outer solidified sheet is laid on the inner layer of the third layer of copper foil, and an outer layer of copper foil is placed on the outer solidified sheet, and then the final pressing is performed. After pressing, the support carrier is peeled off by a separation process to obtain two five-layer boards having the same structure.
  • An inner layer copper foil is disposed on both sides of the inner prepreg, and a plurality of layers may be disposed according to design requirements, that is, a plurality of inner layer copper foils are disposed, and at the same time, a plurality of inner prepregs are disposed between the plurality of inner layer copper foils, and the laminated layers may be laminated. put them together. Finally, an outer prepreg is further disposed on the outermost inner copper foil, and then an outer copper foil is disposed on the outer prepreg.
  • the inner copper foil is not bonded to the outer copper foil.
  • the maximum temperature of the press-bonded inner layer copper foil and the inner solidified sheet is 140-180 ° C
  • the pressing time is 60 min-100 min
  • the highest pressure value is 30-50 kgf/cm 2
  • the outermost copper foil has a maximum temperature of 220 to 260 ° C, a pressing time of more than 110 min, and a maximum pressure of 30 to 50 kgf/cm 2 .
  • the inner prepreg and the inner layer copper foil are pre-compressed, and the outer layer is fully pressed, and the pressing temperature and the pressing time are both increased.
  • the internal prepreg after pressing with the compression parameters in this scheme only accounts for 70-95% of the conventional parameters, and is pressed by the full press-fit parameter in the final outer layer press-bonding process. In combination, the residual stress of the entire inner layer prepreg is reduced, and the warpage of the coreless plate is reduced.
  • the inner layer copper foil is provided with a gap, and the gap is disposed around the inner layer copper foil, and the gap opening direction may be perpendicular to the inner layer of the copper foil frame, or may be set at an angle, and the gap design may be Effectively reduce the problem of voiding in the laminated glue.
  • a round pad may be provided inside the inner layer copper foil, and the round pad is uniformly disposed inside the frame of the inner layer copper foil and arranged in a ring shape. Using a circle The pad design is more effective in reducing voids in the laminate fill.
  • the gap is 0.5 to 1.5 mm, and the gap of the round pad is between 0.2 and 0.5 mm.
  • the inner surface of the outer layer copper foil may also be patterned, which is a small protrusion, which effectively squeezes the bubbles in the glue during the lamination process.
  • the outer copper foil is placed on the outermost side and has two outer copper foils. Specifically, the outer copper foil is provided with a gap, and the gap is disposed around the inner layer copper foil, and the gap can be opened in a direction perpendicular to the outer copper foil frame, or can be disposed at an angle, and the gap design can be effectively reduced. There is no hole in the lamination.
  • the thickness of the frame of the inner layer copper foil and the outer layer copper foil can be set thicker, and the strength of the coreless board can be effectively increased.
  • the support carrier is directly formed by superposing a carrier copper foil and an outer layer copper foil, and the structure of the outer copper foil can be applied to the coreless board, that is, in advance
  • the structure of the outer copper foil is disposed on the insulating sheet as a constituent structure of the coreless plate; the carrier copper foil can also be applied to the coreless plate on the other side as the outermost outer copper foil.
  • step S400 is further included: copper reduction is performed on the carrier copper foil.
  • the support carrier is located in one of the two coreless plates, and the coreless plate with the support carrier needs to be reduced in copper, generally 2 to 5 mm, which is two coreless plates. The thickness is consistent.
  • the insulating sheet in the supporting carrier is omitted, the extra material waste is avoided, and the economic benefit is improved.
  • step S300A before step S400: providing a laser range finder, respectively measuring the thickness of the two coreless plates, the thicker is a coreless plate having a supporting carrier, and then entering the coreless plate into step S400 .
  • the laser range finder includes a laser emitting end and a laser receiving end, and the laser emitting end and the laser receiving end are respectively disposed at two ends of the coreless board, and emit laser light from the laser emitting end from a preset height, and the laser receiving end The end receives the laser.
  • the laser receiving end does not receive the laser signal, this time is the thickness of the coreless board.
  • another coreless panel uses the same method for its thickness detection.
  • step S200 specifically includes:
  • S200A Pattern transfer is performed on the outer copper foil on both sides of the support carrier, wherein the pattern on one side is a pattern after the other side is rotated by 180 degrees.
  • S200C The inner prepreg and the inner layer copper foil are added on both outer sides of the support carrier, and the pattern is transferred on the inner layer copper foil on both sides, and the pattern on the support side is the pattern on the other side rotated by 180 degrees, and is pressed. .
  • Step S200D Step S200B is repeated until the set number of layers is reached.
  • the coreless board is used to carry the semiconductor elemental gas, so the corresponding circuit trace is required on the coreless board.
  • the circuit layer of the coreless board is an inner layer copper foil and an outer layer copper foil of each layer, and each layer of copper foil is electrically connected by a drilling process. Since the upper and lower coreless structures are in a flip-chip relationship, the circuit layout on the two coreless structures peeled off from the support carrier is a mirror image relationship, and the circuit layout of the two coreless boards is different in any case. It is produced in two sets of processes, and the production efficiency is slow. By inverting the image referenced by the production circuit in advance, only one of the coreless plates needs to be flipped in the following, and the two coreless plates obtain the same pattern, and the subsequent processing can be performed simultaneously.
  • step S200A the method further includes:
  • step S200B a positioning hole is formed on the board.
  • step S200C is specifically: adding an inner prepreg and an inner layer copper foil on both outer sides of the support carrier, and performing pattern transfer on the inner layer copper foil on both sides, and the pattern on the support carrier side is rotated 180 degrees on the other side.
  • the graphic is transferred with the positioning hole as the alignment reference and pressed.
  • the positioning hole can be used to facilitate the pattern alignment during the pattern transfer, and can be used for marking after separating the coreless board, so that the pattern direction of the board can be discriminated by the distribution of the positioning holes.
  • the inner copper foil needs to be milled before starting the positioning hole.
  • the size of the milling edge is less than 2-6 mm, and the outer copper foil size is 5-15 mm larger than the inner copper foil.
  • the positioning holes are asymmetrically distributed.
  • the positioning hole may also be a positioning reference such as a specific positioning mark, mainly serving as a reference, and is not limited to the form of the positioning hole.

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  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

无芯板制造构件，包括：支撑载体，以及设置在所述支撑载体两侧的无芯板；所述无芯板包括：内半固化片、外半固化片、内层铜箔和外层铜箔；所述内层铜箔两侧设置所述内半固化片，在所述最外层的内层铜箔设置所述外半固化片，在所述外固化片设置外层铜箔；所述内层铜箔的边框开设间隙。采用本申请的无芯板制造构件、无芯板和一种无芯板制作方法，巧妙的设置了支撑载体，能够有效的克服无芯板翘曲的问题，提高生产无芯板的良品率。

Description

无芯板制造构件、无芯板以及无芯板制作方法 技术领域
本发明涉及无芯板技术领域，特别是涉及一种无芯板制造构件、无芯板以及无芯板制作方法。
背景技术
随着半导体封装产品朝高性能、薄型化及低成本方向发展，催生了无芯薄基板技术；由于无芯板太薄，会遇到较严重的翘曲问题，制作过程中容易造成板损、卡板报废的问题。
发明内容
基于此，有必要针对翘曲问题，提供一种无芯板制造构件。另外，还有必要提供一种无芯板和一种无芯板制作方法。
一种无芯板制造构件，包括：支撑载体，以及设置在所述支撑载体两侧的无芯板；所述无芯板包括：内半固化片、外半固化片、内层铜箔和外层铜箔；所述内层铜箔两侧设置所述内半固化片，在所述最外层的内层铜箔设置所述外半固化片，在所述外固化片设置外层铜箔；所述内层铜箔的边框开设间隙。
在其中的一实施例中，所述内层铜箔的内部设置圆焊盘，所述圆焊盘绕所述内层铜箔的边框布设。
在其中的一实施例中，所述外层铜箔的边框开设间隙。
在其中的一实施例中，所述内层铜箔的边框开设间隙与所述外层铜箔的边框开设间隙处于同一纵面。
在其中的一实施例中，所述内层铜箔和所述外层铜箔的边框的厚度大于其中部的厚度。
在其中的一实施例中，所述支撑载体包括：绝缘片，分设在所述绝缘片两侧的载体铜箔。
在其中的一实施例中，所述载体铜箔的表面粗化处理。
一种无芯板，包括：内半固化片、外半固化片、内层铜箔和外层铜箔；所述内层铜箔两侧设置所述内半固化片，在所述最外层的内层铜箔设置所述外半固化片，在所述外固化片设置外层铜箔；所述内层铜箔的边框开设间隙。
在其中的一实施例中，所述内层铜箔的内部设置圆焊盘，所述圆焊盘绕所述内层铜箔的边框布设。
一种无芯板制作方法，包括：S100：提供支撑载体；S200：在支撑载体上积层压合内层铜箔，各内层铜箔层之间设有内半固化片，在内层铜箔的外侧设置外半固化片，然后在半固化片外侧设置外层铜箔并制成无芯板，所述内层铜箔的边框开设间隙；S300：把无芯板从支撑载体分离。
采用本申请的无芯板制造构件、无芯板和一种无芯板制作方法，巧妙的设置了支撑载体，能够有效的克服无芯板翘曲的问题，提高生产无芯板的良品率。
附图说明
图1为本发明提出的无芯板制造构件结构示意图；
图2为一种实施例中的支撑载体结构示意图；
图3为图1中无芯板结构图；
图4为图1中外层铜箔的图案示意图；
图5为图1中内层铜箔的图案示意图；
图6为图1中玻纤结构示意图；
图7为一种实施例中的双层玻纤结构示意图；
图8为本发明提出的制造方法流程图；
图9为一种实施例中的制造方法流程图；
图10为另一种实施例中的制造方法流程图；
图11为定位孔设计示意图。
具体实施方式
为使本发明的目的、特征和优点能够更加明显易懂，下面结合附图对本发 明的具体实施方式做详细的说明。在下面的描述中阐述了很多具体细节以便于充分理解本发明。但是本发明能够以很多不同于在此描述的其它方式来实施，本领域技术人员可以在不违背本发明内涵的情况下做类似改进，因此本发明不受下面公开的具体实施的限制。
本实施例的无芯板制造构件，包括支撑载体，以及设置在支撑载体两侧的无芯板。具体地：
支撑载体，为绝缘体，该绝缘体可以是BT树脂、环氧树脂、ABF、聚四氟乙烯、碳氢化合物陶瓷等材料。由于无芯板较薄，容易发生板损或翘曲，设置本方案的支撑载体，可以在制造无芯板的时候起到支撑作用。
在一本实施例中，支撑载体包括：绝缘片，分设在绝缘片两侧的载体铜箔，载体铜箔较厚，厚度为12～15μm，可更好的为无芯板的制造提供受力支持。另外，载体铜箔的两侧进行粗化处理，可增加压合后的结合力。
在其它的实施例中，在载体铜箔的外侧设置外层铜箔，整个支撑载体可通过预压合粘结在一起，载体铜箔与外层铜箔的相反面经过粗化处理，即表面粗糙化，可增加压合后的结合力，更加方便载体铜箔与外层铜箔的分离。
该外层铜箔的结构可应用在无芯板中，即提前把外层铜箔的结构设置在绝缘片上，作为无芯板的组成结构，后续可通过分离工艺分离该外层铜箔与载体铜箔。
在其它实施例中，支撑载体可以采用冰替换。在无芯板制造的过程中，首先要在低于0°的操作空间进行制作，然后在冰的两侧依次压合无芯板，压合完成后，提高操作空间的温度，冰自动融化后，两无芯板可自动分离。该冰采用的是纯水制成的冰，冰融化后不留痕，不会对无芯板造成影响。
无芯板，包括：内半固化片、外半固化片、内层铜箔和外层铜箔。具体地，内半固化片的两侧设置内层铜箔，根据设计需要可以设置多层，即设置多个内层铜箔，同时也要在多个内层铜箔之间设置多个内半固化片，可叠层压合在一起。最后在最外侧的内层铜箔上再设置外半固化片，然后在该外半固化片外设 置外层铜箔。内层铜箔与外层铜箔的厚度可以一样，同为2～5μm。
进一步地，内层铜箔开设有间隙，该间隙均设在内层铜箔的边缘四周，间隙开设的方向可以垂直内层铜箔的边框，也可以成角度设置，这种间隙设计可以有效的减少层压填胶无空洞的问题。另外，还可以在内层铜箔的内部设置圆焊盘，该圆焊盘均匀的设置在内层铜箔的边框的内侧，呈环形设置。采用圆焊盘的设计，可更有效的减少层压填胶的空洞。在本实施例中，间隙为0.5～1.5mm，圆焊盘的间隙为0.2～0.5mm之间。
在其它实施例中，还可以在外层铜箔的内表面进行图案化处理，该图案化为小凸起，在层压填胶的过程中，有效地挤压填胶中的气泡。
外层铜箔，设置在最外侧，共有两个外层铜箔。具体地，外层铜箔开设有间隙，该间隙均设在内层铜箔的四周，间隙开设的方向可以垂直外层铜箔的边框，也可以成角度设置，这种间隙设计可以有效的减少层压填胶无空洞的问题。另外，在内层铜箔和外层铜箔所开设的间隙都设置在同一纵面，可更好的减少层压填胶无空洞的问题。
在其它实施例中，内层铜箔和外层铜箔的边框的厚度较之中部的厚度更厚一些，可有效的增加无芯板的强度。
在一实施例中，无芯板制造构件的内半固化片、外半固化片均含有玻纤。
由于支撑载体两侧的结构相同，为了更为清楚的描述本方案的结构，以其中一侧的结构进行描述。
具体地，内固化片与外固化片的主要成分为树脂，在树脂中含有玻纤层。内固化片的玻纤层厚度为10～25μm，树脂的含胶量超过75％；外固化片的玻纤厚度至少比内固化片的玻纤厚度大8μm，且外固化片的树脂含胶量小于65％。通过差异化的树脂含量和，可有效控制板内应力分布，降低翘曲度。
实施例一
Figure PCTCN2015080251-appb-000001
实施例二
Figure PCTCN2015080251-appb-000002
实施例三
Figure PCTCN2015080251-appb-000003
其中翘曲高度是指无芯板板两端的高度差；翘曲率为高度差除以板长的值，以代表板的翘曲程度。
以上实施例均表示，控制外固化片与内固化片的玻纤厚度差大于8μm，能有效控制翘曲率在1％以下，翘曲高度差不高于5mm。且玻纤厚度差异越大，翘曲率越低。
通过对不同层半固化片的玻纤厚度和树脂含胶量以不对称调节匹配，可简单、低成本地实现无芯板翘曲的降低。
此外，外固化片内也可以设有双层玻纤结构。双层玻纤结构包括第一玻纤层与第二玻纤层，其中第一玻纤层在外侧，第二玻纤层在内侧，第一玻纤层的厚度比第二玻纤层厚度大，且厚度差异大于8μm。
玻纤厚度差异大小可根据激光盲孔的数量和分布密度来调节，钻孔数量越多，分布密度越大，厚度差异应该越大。双层玻纤较单层玻纤，能更有效降低无芯板的翘曲度。
基于上述无芯板及无芯板制造构件，还提出一种无芯板制作方法，包括：
S100：提供支撑载体，该支撑载体包括：绝缘片，分设在绝缘片两侧的载体铜箔，其中载体铜箔包括组合在一起的载体铜箔与外层铜箔，外层铜箔厚度比载体铜箔厚度小。加设支撑载体可增加无芯板制作时的提供受力体，可更好的为无芯板的制造提供支持。
S200：在支撑载体上积层压合铜箔，各铜箔层之间设有内半固化片，制成 无芯板。
S300：把无芯板从支撑载体分离。
采用本方法，可一次制作两个无芯板，较之传统生产效率提高一倍，且为较薄的无芯板制作一厚的支撑体，缓解无芯板翘曲问题。
在上述步骤S200中，该无芯板包括内半固化片、外半固化片、内层铜箔和外层铜箔。具体地，在支撑载体两面的铜层上先贴上一层外固化片，再贴上内层铜箔，并且根据需要的层数来控制加设的内层铜箔层数，且相连两内层铜箔之间夹有至少一层内固化片。
以制造五层无芯板为例，支撑载体两面为外层铜箔，在外层铜箔上加设一层外半固化片，进行一次压合；再依次添加三层内层铜箔，每两层内层铜箔之间均有一层内半固化片，且每加设一层内层铜箔，就进行一次压合。最后，在第三层内层铜箔上铺一层外固化片，并在外固化片上铺上一层外层铜箔，然后进行最后一次压合。压合后，通过分离工艺，在支撑载体剥离，得到上下结构相同的两块五层板。
内半固化片的两侧设置内层铜箔，根据设计需要可以设置多层，即设置多个内层铜箔，同时也要在多个内层铜箔之间设置多个内半固化片，可叠层压合在一起。最后在最外侧的内层铜箔上再设置外半固化片，然后在该外半固化片设置外层铜箔。
在一个实施例中，内层铜箔与外层铜箔的压合条件不相同。
具体地，压合内层铜箔与内固化片的压合最高温度为140～180℃，压合时间为60min～100min，且最高压力值在30～50kgf/cm2；压合外固化片与外层铜箔的最高温度为220～260℃，压合时间大于110min，最高压力值在30～50kgf/cm2。以下为依据本方案压合的具体实验数据：
实施例四
Figure PCTCN2015080251-appb-000004
Figure PCTCN2015080251-appb-000005
实施例5
Figure PCTCN2015080251-appb-000006
实施例6
Figure PCTCN2015080251-appb-000007
压合过程中，内半固化片与内层铜箔采用预压合，外层采用全压合，压合温度与压合时间均提高。与常规的压合相比，采用本方案中的压合参数压合后的内半固化片固化程度只占常规参数的70～95％，在最终外层的压合过程再采用全压合参数进行压合，降低各内层半固化片整体的残留应力，降低无芯板的翘曲。
在一个实施例中，内层铜箔开设有间隙，该间隙均设在内层铜箔的四周，间隙开设的方向可以垂直内层铜箔的边框，也可以成角度设置，这种间隙设计可以有效的减少层压填胶无空洞的问题。另外，还可以在内层铜箔的内部设置圆焊盘，该圆焊盘均匀的设置在内层铜箔的边框的内侧，呈环形设置。采用圆 焊盘的设计，可更有效的减少层压填胶的空洞。在本实施例中，间隙为0.5～1.5mm，圆焊盘的间隙为0.2～0.5mm之间。
在其它实施例中，还可以在外层铜箔的内表面进行图案化处理，该图案化为小凸起，在层压填胶的过程中，有效的挤压填胶中的气泡。
外层铜箔，设置在最外侧，共有两个外层铜箔。具体地，外层铜箔开设有间隙，该间隙均设在内层铜箔的四周，间隙开设的方向可以垂直外层铜箔的边框，也可以成角度设置，这种间隙设计可以有效的减少层压填胶无空洞的问题。
另外，内层铜箔和外层铜箔的边框的厚度可以设置厚些，可有效的增加无芯板的强度。
在一实施例中，步骤S100所提供的支撑载体中，该支撑载体直接由载体铜箔与外层铜箔叠加制成，该外层铜箔的结构可应用在无芯板中，即提前把外层铜箔的结构设置在绝缘片上，作为无芯板的组成结构；载体铜箔也可应用在另一边的无芯板中，作为最外层的外层铜箔。
该实施例中，在步骤S300之后还包括步骤S400：对载体铜箔进行减铜。具体地，当对支撑载体进行分离后，支撑载体处在两个无芯板之一，需要对有支撑载体的无芯板进行减铜，一般为2～5mm，是的两个无芯板的厚度一致。
采用本方案，省去了支撑载体中的绝缘片，避免了额外的材料浪费，提高了经济效益。
另外，在分离两无芯板时，无法确认支撑载体是在哪一块无芯板，因此需要人工目测确认，大大降低了工作效率。为此，还有必要在步骤S400之前增加步骤S300A：提供激光测距仪，分别测量两无芯板的厚度，较厚的为具有支撑载体的无芯板，然后把该无芯板进入步骤S400。
具体地，该激光测距仪包括激光发射端和激光接收端组成，激光发射端和激光接收端分别设置在无芯板的两端，并从预设的高度从激光发射端发射激光，激光接收端接收激光。当激光接收端未收到激光信号时，此时为无芯板的厚度。相似的，另外一无芯板才采用相同的方法对其厚度检测。最后通过比较，即可确认哪一无芯板是较厚的无芯板，是有支撑载体的无芯板。
在一个实施例中，步骤S200具体包括：
S200A：在支撑载体两面的外层铜箔上进行图形转移，其中一面的图形为另一面调转180度后的图形。
S200C：支撑载体两外侧添加内半固化片与内层铜箔，并在两侧的内层铜箔上进行图形转移，支撑载体一侧的图形为另一侧调转180度后的图形，并进行压合。
S200D：重复步骤S200B，直到达到设定的层数。
无芯板用以承载半导体元气件，因此无芯板上需有相应的电路走线。无芯板的电路层为每一层的内层铜箔与外层铜箔，各层铜箔之间通过钻孔工艺来实现导通。而由于上下的无芯板结构为倒装关系，从支撑载体上剥离下来的两块无芯板结构上的电路布局为镜像关系，无论如何翻转两块无芯板的电路布局均不相同，需分两套流程来制作，生产效率较慢。而通过预先将制作电路参照的图像翻转，后续仅需翻转其中一块无芯板，两块无芯板得到的图形即相同，可同时进行后续处理工艺。
进一步地，步骤S200A后还包括：
S200B，在板上开设定位孔。相应地，步骤S200C具体为：支撑载体两外侧添加内半固化片与内层铜箔，并在两侧的内层铜箔上进行图形转移，支撑载体一侧的图形为另一侧旋转180度后的图形，图形以定位孔为对位基准进行转移，并进行压合。
开设定位孔可有助于图形转移时的图形对准，且可在分离无芯板后起到标识作用，便于通过定位孔的分布辨别板的图形方向。在开始定位孔之前需要对内层铜箔进行铣边，铣边的尺寸小于2～6mm，同时，外层铜箔尺寸比内层铜箔的尺寸大5～15mm。
定位孔为不对称分布。此外，定位孔还可以是例如特定的定位标记等定位基准，主要起参照作用，而不局限于定位孔的形式。
以上所述实施例仅表达了本发明的几种实施方式，其描述较为具体和详细， 但并不能因此而理解为对本发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。因此，本发明专利的保护范围应以所附权利要求为准。

Claims (10)

  1. 一种无芯板制造构件，其特征在于，包括：支撑载体，以及设置在所述支撑载体两侧的无芯板；
    所述无芯板包括：内半固化片、外半固化片、内层铜箔和外层铜箔；所述内层铜箔两侧设置所述内半固化片，在所述最外层的内层铜箔设置所述外半固化片，在所述外固化片设置外层铜箔；所述内层铜箔的边框开设间隙。
  2. 根据权利要求1所述的无芯板制造构件，其特征在于，所述内层铜箔的内部设置圆焊盘，所述圆焊盘绕所述内层铜箔的边框布设。
  3. 根据权利要求2所述的无芯板制造构件，其特征在于，所述外层铜箔的边框开设间隙。
  4. 根据权利要求3所述的无芯板制造构件，其特征在于，所述内层铜箔的边框开设间隙与所述外层铜箔的边框开设间隙处于同一纵面。
  5. 根据权利要求4所述的无芯板制造构件，其特征在于，所述内层铜箔和所述外层铜箔的边框的厚度大于其中部的厚度。
  6. 根据权利要求1～5任意一项所述的无芯板制造构件，其特征在于，所述支撑载体包括：绝缘片，分设在所述绝缘片两侧的载体铜箔。
  7. 根据权利要求6所述的无芯板制造构件，其特征在于，所述载体铜箔的表面粗化处理。
  8. 一种无芯板，其特征在于，包括：内半固化片、外半固化片、内层铜箔和外层铜箔；所述内层铜箔两侧设置所述内半固化片，在所述最外层的内层铜箔设置所述外半固化片，在所述外固化片设置外层铜箔；所述内层铜箔的边框开设间隙。
  9. 根据权利要求8所述的无芯板制造构件，其特征在于，所述内层铜箔的内部设置圆焊盘，所述圆焊盘绕所述内层铜箔的边框布设。
  10. 一种无芯板制作方法，包括：
    S100：提供支撑载体；
    S200：在支撑载体上积层压合内层铜箔，各内层铜箔层之间设有内半固化片，在内层铜箔的外侧设置外半固化片，然后在所述外半固化片外侧设置外层 铜箔并制成无芯板，所述内层铜箔的边框开设间隙；
    S300：把无芯板从支撑载体分离。
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