CN109526138A - 一种刚性无玻纤光电印制板及其加工方法 - Google Patents

一种刚性无玻纤光电印制板及其加工方法 Download PDF

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CN109526138A
CN109526138A CN201811429102.XA CN201811429102A CN109526138A CN 109526138 A CN109526138 A CN 109526138A CN 201811429102 A CN201811429102 A CN 201811429102A CN 109526138 A CN109526138 A CN 109526138A
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piece
hole
glass
copper
printed board
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CN109526138B (zh
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唐宏华
陈春
林映生
卫雄
范思维
吴军权
唐殿军
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Huizhou King Brother Circuit Technology Co Ltd
Shenzhen Jinbaize Electronic Technology Co Ltd
Xian King Brother Circuit Technology Co Ltd
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Huizhou King Brother Circuit Technology Co Ltd
Shenzhen Jinbaize Electronic Technology Co Ltd
Xian King Brother Circuit Technology Co Ltd
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    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
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    • B32B17/067—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of fibres or filaments
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    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
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    • B32B7/08—Interconnection of layers by mechanical means
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    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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    • B32B2457/00—Electrical equipment
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Abstract

本发明涉及一种刚性无玻纤光电印制板可满足无玻纤光电产品的低反射加工要求，包括层叠设置第一PI片、N张无玻纤胶片和第二PI片，两块PI单面覆铜，两块PI片和无玻纤胶片预钻孔加工形成导气孔，在压合时可减少层间气泡残留，降低层压工艺难度，提升良品率。

Description

一种刚性无玻纤光电印制板及其加工方法
技术领域
本发明涉及PCB制造领域，特别是涉及一种刚性无玻纤光电印制板及其加工方法。
背景技术
传统的刚性印制板基材，主要由增强材料、树脂及功能性填料组成，一般根据增强材料的不同，可分为纸基、玻离纤维布基、复合基（CM系列）和特殊材料基（陶瓷、金属芯基）等几大类，其中以玻离纤维布基为增强材料的应用最为广泛。
玻离纤维布具有良好的耐化性、电绝缘性及尺寸稳定性，可以为基材提供良好的机械支撑力，是刚性印制板加工中最核心的组成部分，但在某些特殊的光电应用领域，其玻璃布会带来光电反射，造成信号干扰，无法达到高精度的质量传输要求。
采用无玻纤胶片压合制刚性印制板，由于无玻纤胶片非常薄，需多张压制在一起才能满足厚度及刚性要求，由于单张无玻纤胶片材质软，预叠时易粘附在一起造成层间排气困难，压合时易产生气泡导致层压分层；而且无玻纤的材质相对较软会导致机械钻孔时易产生毛刺，影响孔径大小及孔铜连接的可靠性。
发明内容
现有的刚性印制板基材含有玻璃纤维布，对光电信号有较强的反射及干扰，无法达到低反射的质量要求。针对该技术问题，本发明提供一种刚性无玻纤光电印制板，本发明采用如下技术方案：一种刚性无玻纤光电印制板，包括层叠设置第一PI片、N张无玻纤胶片和第二PI片。第一PI片、第二PI片远离无玻纤胶片的端面涂覆有金属层。第一PI片、N张无玻纤胶片和第二PI片上下贯通，形成用于导气的导气孔，导气孔设置于非图形区域。第一PI片、N张无玻纤胶片和第二PI片上下贯通，形成金属化的通孔，通孔设置于图形区域。第一PI片、N张无玻纤胶片和第二PI片的边缘上下贯通，形成定位孔。
优选的，金属层为铜层。单面覆铜的PI片可以采用现有的双面覆铜的PI片开料后蚀刻去除其中一覆铜面制成。
进一步的，通孔的孔壁上设置有铜层。
进一步的，N不低于13。
一种刚性无玻纤光电印制板的加工方法，包括如下步骤：
S1：将两块单面覆铜PI片进行钻孔加工形成导气孔、定位孔；
S2：将两块单面覆铜PI片进行棕化处理；
S3：将N张无玻纤胶片进行钻孔加工形成导气孔、定位孔；
S4：将两块单面覆铜PI片与无玻纤胶片叠合，形成待压合结构，通过定位孔铆合对位后进行压合处理；
S5：在单面覆铜PI片的图形区域进行第一次钻孔形成通孔；
S6：依次进行第一次沉铜和第一次板电，第一次沉铜使通孔的孔壁金属化，使其表面覆盖有铜层，第一次板电使覆盖的铜层加厚并同时使通孔的孔壁上的毛刺电镀硬化；
S7：在通孔上进行第二次钻孔，第二次钻孔加工的孔径比第一次钻孔加工的孔径大0.1mm，可以去除孔壁上的毛刺；
S8：依次进行第二次沉铜和第二次板电，第二次板电后可进行切片检测，若孔壁上无毛刺、无空洞则合格；
S9：进行镀一铜，将通孔及PI片的覆铜面电镀到指定的厚度；
S10：进行酸性蚀刻，在PI片的覆铜面制成导电图形，后续按PCB常规工艺进行加工即可。
本发明的有益效果为：
1. 刚性无玻纤光电印制板可满足无玻纤光电产品的低反射加工要求。
2. 在单面覆铜PI片和无玻纤胶片预钻孔加工形成导气孔，在压合时可减少层间气泡残留，降低层压工艺难度，提升良品率。
3. 二次钻孔去毛刺技术，有效改善孔内毛刺，提高孔铜连接的可靠性。
附图说明
附图对本发明作进一步说明，但附图中的实施例不构成对本发明的任何限制。
图1为本发明一实施例提供的刚性无玻纤光电印制板结构示意图。
图2为本发明一实施例提供的刚性无玻纤光电印制板的顶端面示意图。
图3为本发明一实施例提供的刚性无玻纤光电印制板的制造流程图。
具体实施方式
应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。
如图1-2中所示，本发明一实施例提供的一种刚性无玻纤光电印制板，包括层叠设置的第一PI片b、13张无玻纤胶片c和第二PI片。第一PI片a、第二PI片远离无玻纤胶片的端面涂覆有铜箔层a。第一PI片a、无玻纤胶片c和第二PI片上下贯通，形成用于导气的导气孔e，导气孔设置于非图形区域。第一PI片、N张无玻纤胶片和第二PI片上下贯通，形成金属化的通孔d，通孔d设置于图形区域。第一PI片b、无玻纤胶片c和第二PI片的边缘上下贯通，形成定位孔f。压合前第一PI片b和第二PI片厚度为0.05mm，无玻纤胶片c的厚度为1.0mm，铜箔层的厚度为0.5OZ ，压合后刚性无玻纤光电印制板的厚度为1.1mm～1.2mm。
如图3所示，一种刚性无玻纤光电印制板的加工方法，包括如下步骤：
S1：将两块常规双面覆铜PI片进行开料和单面蚀刻去除铜层后制成单面覆铜的PI片，将两块单面覆铜PI片进行钻孔加工形成导气孔e、定位孔f；
S2：将两块单面覆铜PI片进行棕化处理；
S3：将13张无玻纤胶片c进行钻孔加工形成导气孔e、定位孔f；
S4：将两块单面覆铜PI片与无玻纤胶片c叠合，形成待压合结构，通过定位孔f铆合对位后进行热压合；
S5：在单面覆铜PI片的图形区域进行第一次钻孔形成通孔d；
S6：依次进行第一次沉铜和第一次板电，第一次沉铜使通孔d的孔壁金属化，使其表面覆盖有铜层，第一次板电使覆盖的铜层加厚并同时使通孔d的孔壁上的毛刺电镀硬化；
S7：在通孔d上进行第二次钻孔，第二次钻孔加工的孔径比第一次钻孔加工的孔径大0.1mm，可以去除孔壁上的毛刺；
S8：依次进行第二次沉铜和第二次板电；
S9：进行镀一铜，将通孔d及PI片的覆铜面电镀加厚；
S10：进行酸性蚀刻，在PI片的覆铜面制成导电图形，后续按PCB常规工艺进行加工即可。
以上所述实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。
以上所述实施例仅表达了本发明的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。因此，本发明专利的保护范围应以所附权利要求为准。

Claims (6)

1.一种刚性无玻纤光电印制板，其特征在于：
包括层叠设置第一PI片、N张无玻纤胶片和第二PI片；
所述第一PI片、第二PI片远离所述无玻纤胶片的端面涂覆有金属层；
所述第一PI片、N张无玻纤胶片和第二PI片上下贯通，形成用于导气的导气孔，所述导气孔设置于非图形区域；
所述第一PI片、N张无玻纤胶片和第二PI片上下贯通，形成金属化的通孔，所述通孔设置于图形区域；
所述第一PI片、N张无玻纤胶片和第二PI片的边缘上下贯通，形成定位孔。
2.根据权利要求1所述刚性无玻纤光电印制板，其特征在于：所述金属层为铜层。
3.根据权利要求1所述刚性无玻纤光电印制板，其特征在于：所述通孔的孔壁上设置有铜层。
4.根据权利要求1所述刚性无玻纤光电印制板，其特征在于：所述N不低于13。
5.一种制造权利要求1-4任一权利要求所述刚性无玻纤光电印制板的方法，其特征在于，包括如下步骤：
S1：将两块单面覆铜PI片进行钻孔加工形成所述导气孔、定位孔；
S2：将所述两块单面覆铜PI片进行棕化处理；
S3：将N张无玻纤胶片进行钻孔加工形成所述导气孔、定位孔；
S4：将所述两块单面覆铜PI片与所述无玻纤胶片叠合，形成待压合结构，通过定位孔铆合对位后进行压合处理；
S5：在所述单面覆铜PI片的图形区域进行第一次钻孔形成所述通孔；
S6：依次进行第一次沉铜和第一次板电，使所述通孔的孔壁金属化；
S7：在所述通孔上进行第二次钻孔；
S8：依次进行第二次沉铜和第二次板电；
S9：进行镀一铜；
S10：进行酸性蚀刻，在所述PI片的覆铜面制成导电图形。
6.根据权利要求5所述方法，其特征在于：所述第二次钻孔加工的孔径比所述第一次钻孔加工的孔径大0.1mm。
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