WO2016103472A1 - 電子部品供給システム - Google Patents
電子部品供給システム Download PDFInfo
- Publication number
- WO2016103472A1 WO2016103472A1 PCT/JP2014/084583 JP2014084583W WO2016103472A1 WO 2016103472 A1 WO2016103472 A1 WO 2016103472A1 JP 2014084583 W JP2014084583 W JP 2014084583W WO 2016103472 A1 WO2016103472 A1 WO 2016103472A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- component
- electronic component
- pallet
- electronic
- job
- Prior art date
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/043—Feeding one by one by other means than belts
- H05K13/0434—Feeding one by one by other means than belts with containers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
- H05K13/0857—Product-specific machine setup; Changeover of machines or assembly lines to new product type
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/086—Supply management, e.g. supply of components or of substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
Definitions
- This specification relates to an electronic component supply system.
- the present invention relates to a system for supplying electronic components to an electronic component mounting machine by exchanging a component pallet on which a plurality of component cartridges containing electronic components are mounted.
- Patent Document 1 discloses a supply system for supplying a component pallet to an electronic component mounting machine when a plurality of types of mounting boards are manufactured.
- the component pallet of Patent Document 1 can mount a plurality of component cartridges.
- Patent Document 1 specifies the types of electronic components to be mounted on the mounting board to be manufactured, and groups the mounting boards to be manufactured from now on using the same component pallet. In other words, Patent Document 1 groups the mounting boards to be manufactured so that the number of operations for replacing the component pallet is minimized when a plurality of types of mounting boards are manufactured. That is, Patent Document 1 minimizes the number of times of changeover for switching the type of mounting board to be manufactured, and minimizes the number of times the apparatus is stopped.
- Patent Document 1 adjusts the manufacturing order (groups mounting boards to be manufactured), thereby minimizing the number of component pallet changeovers and improving the operating rate of the electronic component mounting machine.
- Patent Document 1 does not consider the number of component pallets to be prepared.
- the number of component pallets to be replaced is not minimum. For an operator who prepares a component pallet prior to the production of a board, the more man-hours are prepared in a day, the more man-hours are required and the process becomes complicated.
- This specification aims at providing the electronic component supply system which can simplify the process which prepares a component pallet conventionally.
- the electronic component supply system disclosed in this specification determines the type of electronic component to be mounted on the component pallet when the electronic component is mounted on the component pallet.
- the electronic component supply system minimizes the number of component pallets to be replaced when jobs are switched based on a plurality of jobs scheduled to be continuously executed by a plurality of electronic component mounting machines to which the component pallets are attached and the execution order thereof.
- the type of electronic component to be mounted on the component pallet is determined.
- the type of electronic component to be mounted on the component pallet is determined so that the number of component pallets to be replaced is minimized when the job is switched.
- the process of preparing the component pallets can be simplified.
- FIG. 3 is a diagram illustrating a relationship between a job executed by the electronic component mounting system and a component pallet to be used.
- the electronic component supply system determines the type of electronic component to be mounted on the component pallet when the electronic component is mounted on the component pallet.
- a plurality of electronic components of the same type may be accommodated in a component cartridge, and the component cartridge may be mounted on a component pallet.
- the component pallet may include a plurality of slots for receiving electronic components.
- the component supply system may be a control device housed inside an electronic component mounting machine (or an electronic component mounting system including a plurality of electronic component mounting machines). Alternatively, the component supply system may determine the mounting position of the electronic component on the component pallet outside the electronic component mounting machine.
- the types of electronic components to be mounted on the parts pallet are the types of parts pallet to be replaced when the jobs are switched based on the multiple jobs scheduled to be executed continuously by the plurality of electronic component mounting machines to which the parts pallet is attached and the order of execution.
- the type of electronic component to be mounted on the component pallet may be determined so that the number is minimized.
- the type of electronic component to be mounted on the component pallet may be determined based on the job scheduled to be executed before the driving of the electronic component mounting machine (production of the mounting board) is started, or the job scheduled to be executed has been changed. Sometimes it may be determined based on the changed job.
- the type of electronic component to be mounted on the component pallet may be determined so that more jobs are executed after the component pallet replacement.
- the type of electronic component to be mounted on the component pallet to be replaced may be determined so that the electronic component not used in the job before switching and the electronic component used in the job after switching are mounted on one component pallet. .
- the component pallet When replacing a component pallet, the component pallet is based on the electronic component mounted on the component pallet attached to each of the plurality of electronic component mounting machines and the electronic component used in the job executed after the component pallet replacement.
- the electronic component mounting machine to be replaced may be determined.
- the electronic component placement machine for replacing the component pallet may be determined so that more jobs are executed after the component pallet replacement.
- the electronic components When electronic components are accommodated in the component pallet, the electronic components may be accommodated in the slots in the order of jobs to be executed, and the electronic components may be accommodated so that the slots in which the electronic components are not accommodated are minimized.
- the electronic component used in the next job when a job is switched, if an electronic component used in the next job is not stored in any component pallet and any of the component pallets has a slot that does not store an electronic component, the component pallet Without replacement, the electronic component used in the next job may be accommodated in the slot not accommodating the electronic component.
- the electronic component mounting system 100 includes four electronic component mounting machines 10a, 10b, 10c and 10d.
- Each of the electronic component mounting machines 10a to 10d is a device for mounting (mounting) electronic components on a printed circuit board.
- the electronic component mounting machines 10a to 10d (or the electronic component mounting system 100) may be referred to as surface mounters or chip mounters.
- the direction in which the electronic component mounting machines 10a to 10d are arranged is the X direction
- the horizontal direction perpendicular to the X direction is the Y direction.
- the electronic component mounting machines 10a to 10d have substantially the same structure. Therefore, in the following description, the electronic component mounting machine 10a will be described, and the description of the electronic component mounting machines 10b to 10d may be omitted. In the following description, when the same component is described, the alphabet attached to the reference number may be omitted. Moreover, about the electronic component mounting machine 10a, in order to show an internal structure, the figure which abbreviate
- the electronic component mounting machine 10a includes a substrate transport device 26, a component supply device 12a, and a mounting head 22 that receives components from the component supply device 12a and mounts them on a substrate held by the substrate transport device 26.
- the component supply device 12a includes a component pallet 34a that detachably holds a plurality of component cartridges 30a.
- the component pallet 34a has a plurality of slots, and a component cartridge 30a is detachably mounted in each slot.
- a plurality of component reels 36a are detachably mounted on the component cartridge 30a.
- Each component reel 36a accommodates a plurality of electronic components.
- the component cartridge 30 a supplies electronic components to the mounting head 22.
- the electronic component mounting machines 10b to 10d include component cartridges 30b to 30d, component pallets 34b to 34d, and component reels 36b to 36d.
- the electronic component mounting machine 10a includes two board transfer devices 26. Each board conveyance device 26 conveys a printed circuit board in the X direction. Each substrate transfer device 26 is connected in series with the substrate transfer device 26 of the electronic component mounting machines 10b to 10d.
- the electronic component mounting machine 10a includes a mounting head 22 and a head moving device 24 that moves the mounting head 22 in the X direction and the Y direction. The head moving device 24 moves the mounting head 22 in a predetermined order with respect to the component cartridge 30 and the printed circuit board on the substrate transport device 26.
- the mounting head 22 is provided with a suction nozzle. The suction nozzle picks up and holds an electronic component from the component cartridge 30 and transports and mounts the electronic component on a printed circuit board on the substrate transport device 26.
- the board transfer device 26 sends out the printed circuit board on which the electronic component has been mounted to the board transfer device of the electronic component mounting machine 10b.
- the electronic component mounting machine 10b performs the same operation as that of the electronic component mounting machine 10a, and sends out the printed circuit board on which the electronic component has been mounted to the board transfer device of the electronic component mounting machine 10c.
- the electronic component mounting machine 10c performs the same operation as the electronic component mounting machines 10a and 10b, and sends the printed circuit board on which the electronic component mounting is completed to the board transport device of the electronic component mounting machine 10d.
- the electronic component mounting machine 10a also includes a component imaging device (camera) 28.
- a component imaging device camera 28.
- the camera 28 captures an image of the suction nozzle attached to the mounting head 22 and the shape of the electronic component held by the suction nozzle.
- a monitor 32 which is an input / output device, is provided above the electronic component mounting machine 10a (see the electronic component mounting machines 10b to 10d).
- Various settings for the electronic component mounting machine 10 a can be input to the control device using the monitor 32.
- the control device is accommodated inside the electronic component mounting machine 10a (not shown).
- the electronic component mounting system 100 by replacing the component cartridges 30a to 30d supplied to the electronic component mounting machines 10a to 10d, different types of mounting substrates (printed substrates on which electronic components are mounted) can be manufactured.
- the type of mounting board to be manufactured is changed (hereinafter sometimes referred to as “job switching”), the electronic components used by the electronic component mounting machines 10a to 10d after the job switching. Is not provided, any one of the component pallets 34a to 34d can be replaced for each component pallet.
- FIG. 2 shows the types of component pallets supplied to the electronic component mounting machines 10a to 10d when the job 1 to job 10 are executed using the electronic component mounting system 100.
- component pallets 1 to 4 are supplied to electronic component mounting machines 10a to 10d.
- the electronic component mounting machine 10a uses the component pallet 1 until the job 10 is completed.
- the electronic component mounting machine 10b uses the component pallet 2 until the job 10 is completed.
- the electronic component mounting machine 10 c uses the component pallet 3 until the job 3 is completed, replaces the component pallet 5 after the job 3 is completed, and uses the component pallet 5 until the job 10 is completed.
- the electronic component mounting machine 10d uses the component pallet 4 until the job 7 is completed, replaces the component pallet 6 after the job 7 is completed, and uses the component pallet 6 until the job 10 is completed.
- the parts pallet is exchanged twice. In other words, six parts pallets are prepared to execute job 1 to job 10.
- the electronic component mounting machines 10a to 10d have substantially the same structure. Therefore, after job 3 and job 7 are completed, the component pallets of the electronic component mounting machines other than the electronic component mounting machines 10c and 10d can be exchanged.
- the electronic component mounting machine for replacing the component pallet and the type of the component cartridge mounted on the component pallet are determined as follows, and the process of preparing the component pallet is simplified.
- the type of parts cartridge to be mounted on the parts pallet is determined so that the number of parts pallets to be replaced is minimized. That is, the electronic component placement machine for replacing the component pallet and the type of the component cartridge mounted on the component pallet are determined so that the number of component pallets to be prepared for executing jobs 1 to 10 is minimized.
- pallets 1 to 4 are selected as component pallets to be used at the start of production by the electronic component mounting machines 10a to 10d.
- the component cartridge used in job 1 is to be mounted in any one of the pallets 1 to 4.
- a component cartridge that contains an electronic component of a type that is used in job 2 and is not yet mounted in any slot of pallets 1 to 4 is mounted in one of the empty slots.
- the process of mounting the component cartridge containing the unmounted electronic component in the empty slot is sequentially repeated.
- the empty slot for mounting the component cartridge used in the job is insufficient in any job (job 4 corresponds in FIG. 2). ).
- any one of the pallets used by the electronic component mounting machines 10a to 10d is replaced with a new component pallet (pallet 5) on which no component cartridge is mounted.
- the case where the pallet 1 is replaced with the bullet 5 is confirmed.
- the position determination process for the parts cartridge to be used in job 4 and later is performed, and up to which job the electronic parts can be mounted is confirmed. .
- the electronic component mounting machine for replacing the component pallet and the type of the component cartridge mounted on the component pallet may be determined off-line, or information on the mounting board manufactured in the electronic component mounting system 100 (electronics to be used). The type of component, the job execution order, etc.) may be input and determined by the control device in the electronic component mounting system 100.
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
Claims (5)
- 電子部品を部品パレットに搭載するときの、部品パレットに搭載する電子部品の種類を決定する電子部品供給システムであって、
部品パレットが取り付けられる複数の電子部品装着機が連続して実行する予定の複数のジョブとその実行順に基づいて、ジョブが切り替わるときに交換する部品パレットの数が最小になるように、部品パレットに搭載する電子部品の種類を決定する電子部品供給システム。 - 切り替え前のジョブで使用しない電子部品であるとともに切り替え後のジョブで使用する電子部品が1個の部品パレットに搭載されるように、交換する部品パレットに搭載する電子部品の種類を決定する請求項1に記載の電子部品供給システム。
- 部品パレットを交換するときに、部品パレットの交換後により多くのジョブが実施されるように、部品パレットを交換する電子部品装着機及び部品パレットに搭載する電子部品の種類を決定する請求項1又は2に記載の電子部品供給システム。
- 部品パレットを交換するときに、複数の電子部品装着機の各々に取り付けられている部品パレットに搭載されている電子部品と、部品パレット交換後に実行するジョブで使用する電子部品と、に基づいて、部品パレットの交換後により多くのジョブが実施されるように、部品パレットを交換する電子部品装着機を決定する請求項1から3のいずれか一項に記載の電子部品供給システム。
- 部品パレットは、電子部品を収容する複数のスロットを備えており、
ジョブが切り替わるときに、次のジョブで用いる電子部品がいずれの部品パレットに収容されておらず、いずれかの部品パレットが電子部品を収容していないスロットを備えている場合、部品パレットを交換することなく、前記電子部品を収容していないスロットに次のジョブで用いる電子部品を収容する請求項1から4のいずれか一項に記載の電子部品供給システム。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2014/084583 WO2016103472A1 (ja) | 2014-12-26 | 2014-12-26 | 電子部品供給システム |
EP14909076.3A EP3240389B1 (en) | 2014-12-26 | 2014-12-26 | Electronic component supply system |
US15/539,374 US10568243B2 (en) | 2014-12-26 | 2014-12-26 | Electronic component supply system |
JP2016565816A JP6473762B2 (ja) | 2014-12-26 | 2014-12-26 | 電子部品供給システム |
CN201480084242.1A CN107114007B (zh) | 2014-12-26 | 2014-12-26 | 电子元件供给系统 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2014/084583 WO2016103472A1 (ja) | 2014-12-26 | 2014-12-26 | 電子部品供給システム |
Publications (1)
Publication Number | Publication Date |
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WO2016103472A1 true WO2016103472A1 (ja) | 2016-06-30 |
Family
ID=56149557
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/JP2014/084583 WO2016103472A1 (ja) | 2014-12-26 | 2014-12-26 | 電子部品供給システム |
Country Status (5)
Country | Link |
---|---|
US (1) | US10568243B2 (ja) |
EP (1) | EP3240389B1 (ja) |
JP (1) | JP6473762B2 (ja) |
CN (1) | CN107114007B (ja) |
WO (1) | WO2016103472A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019035196A1 (ja) * | 2017-08-17 | 2019-02-21 | ヤマハ発動機株式会社 | 段取り支援装置、段取り支援方法、段取り支援プログラム、記録媒体 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003092492A (ja) * | 2001-09-18 | 2003-03-28 | Fuji Mach Mfg Co Ltd | 部品供給装置および部品供給方法 |
JP2011138834A (ja) * | 2009-12-26 | 2011-07-14 | Fuji Mach Mfg Co Ltd | 電子回路部品供給装置 |
JP2012134565A (ja) * | 2012-04-09 | 2012-07-12 | Hitachi High-Tech Instruments Co Ltd | 部品装着設定装置、部品装着装置、プログラム及び部品供給ユニット配置方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
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US5371940A (en) * | 1991-05-24 | 1994-12-13 | Fujitsu Limited | Pallet arranging system |
JP2642800B2 (ja) | 1991-05-24 | 1997-08-20 | 富士通株式会社 | パレット編成システム |
JP2005347317A (ja) * | 2004-05-31 | 2005-12-15 | Yamaha Motor Co Ltd | 部品供給装置およびそれを備えた実装機 |
DE102012221259A1 (de) | 2012-11-21 | 2014-05-22 | Siemens Aktiengesellschaft | Optimieren von Rüstfamilien |
-
2014
- 2014-12-26 JP JP2016565816A patent/JP6473762B2/ja active Active
- 2014-12-26 EP EP14909076.3A patent/EP3240389B1/en active Active
- 2014-12-26 CN CN201480084242.1A patent/CN107114007B/zh active Active
- 2014-12-26 US US15/539,374 patent/US10568243B2/en active Active
- 2014-12-26 WO PCT/JP2014/084583 patent/WO2016103472A1/ja active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003092492A (ja) * | 2001-09-18 | 2003-03-28 | Fuji Mach Mfg Co Ltd | 部品供給装置および部品供給方法 |
JP2011138834A (ja) * | 2009-12-26 | 2011-07-14 | Fuji Mach Mfg Co Ltd | 電子回路部品供給装置 |
JP2012134565A (ja) * | 2012-04-09 | 2012-07-12 | Hitachi High-Tech Instruments Co Ltd | 部品装着設定装置、部品装着装置、プログラム及び部品供給ユニット配置方法 |
Non-Patent Citations (1)
Title |
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See also references of EP3240389A4 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019035196A1 (ja) * | 2017-08-17 | 2019-02-21 | ヤマハ発動機株式会社 | 段取り支援装置、段取り支援方法、段取り支援プログラム、記録媒体 |
JPWO2019035196A1 (ja) * | 2017-08-17 | 2020-02-27 | ヤマハ発動機株式会社 | 段取り支援装置、段取り支援方法、段取り支援プログラム、記録媒体 |
Also Published As
Publication number | Publication date |
---|---|
JP6473762B2 (ja) | 2019-02-20 |
JPWO2016103472A1 (ja) | 2017-10-05 |
EP3240389A1 (en) | 2017-11-01 |
US10568243B2 (en) | 2020-02-18 |
EP3240389A4 (en) | 2017-12-27 |
US20170354069A1 (en) | 2017-12-07 |
EP3240389B1 (en) | 2020-12-09 |
CN107114007B (zh) | 2019-12-17 |
CN107114007A (zh) | 2017-08-29 |
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