WO2016101458A1 - 真空对盒装置及对盒方法 - Google Patents

真空对盒装置及对盒方法 Download PDF

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Publication number
WO2016101458A1
WO2016101458A1 PCT/CN2015/077222 CN2015077222W WO2016101458A1 WO 2016101458 A1 WO2016101458 A1 WO 2016101458A1 CN 2015077222 W CN2015077222 W CN 2015077222W WO 2016101458 A1 WO2016101458 A1 WO 2016101458A1
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WO
WIPO (PCT)
Prior art keywords
pressure
vacuum
substrate
pressure cell
end surface
Prior art date
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PCT/CN2015/077222
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English (en)
French (fr)
Inventor
井杨坤
吴卫民
洪良
李桂
Original Assignee
京东方科技集团股份有限公司
合肥京东方光电科技有限公司
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Application filed by 京东方科技集团股份有限公司, 合肥京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US14/895,431 priority Critical patent/US9690124B2/en
Publication of WO2016101458A1 publication Critical patent/WO2016101458A1/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B1/00—Presses, using a press ram, characterised by the features of the drive therefor, pressure being transmitted directly, or through simple thrust or tension members only, to the press ram or platen
    • B30B1/32—Presses, using a press ram, characterised by the features of the drive therefor, pressure being transmitted directly, or through simple thrust or tension members only, to the press ram or platen by plungers under fluid pressure
    • B30B1/38—Presses, using a press ram, characterised by the features of the drive therefor, pressure being transmitted directly, or through simple thrust or tension members only, to the press ram or platen by plungers under fluid pressure wherein the plungers are operated by pressure of a gas, e.g. steam, air
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/06—Platens or press rams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/06—Platens or press rams
    • B30B15/065—Press rams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/06—Platens or press rams
    • B30B15/065—Press rams
    • B30B15/067—Press rams with means for equalizing the pressure exerted by a plurality of press rams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1825—Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
    • B32B38/1833—Positioning, e.g. registration or centering
    • B32B38/1841—Positioning, e.g. registration or centering during laying up
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1866—Handling of layers or the laminate conforming the layers or laminate to a convex or concave profile
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1858—Handling of layers or the laminate using vacuum
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133354—Arrangements for aligning or assembling substrates

Definitions

  • the present disclosure relates to the field of display manufacturing, and more particularly to a vacuum box apparatus and a box method.
  • the vacuum box is the core process of the cell process, so that the box is in a near vacuum environment.
  • the upper fixed plate and the lower fixed plate respectively absorb the TFT-LCD array (TFT) substrate and the color filter (CF) substrate, and the upper fixed plate and the lower fixed plate move toward each other, so that the array substrate and the color film substrate are pasted. put them together.
  • TFT TFT-LCD array
  • CF color filter
  • the upper and lower fixed disks are usually manufactured to have a fixed curved surface for adsorbing a curved substrate having a shape corresponding to the fixed curved surface, and the two parts are paired. Box together.
  • the vacuum box device of the structure the set of upper and lower fixing devices can only be used for the curved substrate of one shape of the box, and the upper and lower fixing devices need to be redesigned and manufactured for the curved substrates of different shapes. And after many times of debugging, it can be used, resulting in a lot of manpower, financial resources and time wasted.
  • the purpose of the technical solution of the present disclosure is to provide a vacuum-to-box device and a method for the same, which can display a plurality of curved display panels without replacing the upper and lower fixed plates.
  • the present disclosure provides a vacuum box apparatus for pairing an upper substrate and a lower substrate of a display panel, the vacuum pair box device including an upper machine and a lower machine, wherein the vacuum pair device further includes:
  • first pressure box units disposed on the upper machine and arranged in parallel, including a first end surface facing the lower machine, and each of the first pressure box units corresponding to a sub-area of the substrate to be mounted on the box ;
  • a plurality of second pressure cell units disposed on the lower machine and arranged in parallel, including a second end surface facing the upper machine, and each of the second pressure cell units corresponding to a sub-area of the lower substrate to be placed ;
  • an end surface of the support post on the first pressure cell unit is formed as the first end surface; an end surface of the support post on the second pressure cell unit is formed as a Said second end face;
  • a first transmission mechanism is connected between the support column and the support body
  • a second transmission mechanism is connected between the support column and the support body
  • the adjustment mechanism includes a first adjustment mechanism coupled to the first transmission mechanism for controlling the movement of the first transmission mechanism to translate the support column up and down relative to the support body; a second adjusting mechanism connected to the second transmission mechanism is configured to control the movement of the second transmission mechanism to rotate the support column relative to the support body.
  • the adjustment mechanism includes a first motor and a second motor, respectively, wherein the first motor is coupled to the first transmission mechanism, and the second motor is coupled to the first motor Two transmission mechanisms are connected.
  • the first transmission mechanism includes a mating screw and a thread pair, wherein the lead screw is connected to one of the support body and the support column, The thread pair is disposed on the support body and the other of the support columns connected to the lead screw; and the adjustment mechanism is coupled to the lead screw.
  • the second transmission mechanism comprises:
  • the first transmission shaft is rotatably connected to the support body, and one end of the first transmission shaft is fixedly disposed on the support column, and the other end is provided with a first bevel gear;
  • a second transmission shaft disposed perpendicular to the first transmission shaft, and one end of the second transmission shaft is provided with a second bevel gear meshing with the first bevel gear, and the other end is provided with a worm;
  • a worm wheel coupled to the worm, the worm wheel is coupled to the adjustment mechanism, the worm wheel is driven to rotate by the adjustment mechanism, and the second transmission shaft is rotated by the cooperation between the worm and the worm wheel And rotating, by the cooperation of the first bevel gear and the second bevel gear, to drive the first transmission shaft to rotate, thereby driving the support column to rotate around the support body.
  • the number of the second pressure box units is greater than the number of the first pressure box units.
  • the vacuum box device further comprises:
  • a driving mechanism for vertically moving the upper machine relative to the lower machine.
  • a vacuum line is disposed on the support column along the axial direction of the support column;
  • the vacuum box device further includes a vacuum suction mechanism connected to the vacuum line.
  • the vacuum-to-cassette device further includes a first pressure cartridge disc disposed on the first end surface of the first pressure cartridge unit, the first pressure cartridge tray and each a first end surface of the first pressure cell unit is absorbingly connected;
  • the vacuum box device further includes a second pressure plate tray disposed on the second end surface of the second pressure cell unit, the second pressure box The disk is affixed to the second end surface of each of the second pressure cell units.
  • the first pressure cell unit comprises a first pressure cartridge disk, and a surface of the first pressure cartridge disk opposite to the lower machine table is formed as the first end surface;
  • the second pressure cell unit includes a second pressure cartridge disk, and a surface of the second pressure cartridge disk opposite to the upper machine table is formed as the second end surface.
  • the first end surface is respectively provided with a dynamic sensing adjustment mechanism for when the upper substrate of the cartridge is to be adsorbed to the first end surface, according to the first end surface Corresponding pressure applied to the substrate sub-area of the cartridge to adjust deformation of the first end surface; and in the process of pairing the box, according to the vacuum corresponding to the first end surface of the substrate on the substrate Suck Force to adjust the deformation of the first end face.
  • the vacuum-to-box device described above further includes a control circuit, and the dynamic induction adjustment mechanism includes a flatness adjustment layer, a piezoelectric sensing layer and a surface adsorption layer in order from top to bottom;
  • the piezoelectric sensing layer is configured to generate a pressure induced current corresponding to the pressure according to a pressure applied by the upper substrate sub-region corresponding to the first end surface when the upper and lower substrates are opposed to the cartridge, and transmit the pressure to the a control circuit; the control circuit applies an electric field corresponding to the pressure induced current to the flatness adjustment layer such that the flatness adjustment layer generates a deformation that coincides with a corresponding upper substrate sub-region;
  • the piezoelectric sensing layer generates a suction induction current corresponding to the suction force according to a vacuum suction force received by the upper substrate sub-region corresponding to the first end surface, and transmits the current to the control circuit; the control circuit is configured according to The suction induced current controls a falling speed of the upper stage and a voltage applied to the surface adsorption layer such that the surface adsorption layer undergoes deformation corresponding to the magnitude of the voltage value.
  • the flatness adjustment layer is made of a piezoelectric ceramic material
  • the surface adsorption layer is made of a force-sensitive conductive rubber material, and the force-sensitive conductive rubber material is a flexible conductive composite material whose electrical resistivity decreases as the pressure is increased.
  • the surface adsorption layer is deformed under energization to form a plurality of suction cups for adsorbing the upper substrate.
  • a vacuum tube is disposed at a position corresponding to the suction cup in the surface adsorption layer for evacuating a sealed space composed of the suction cup and the upper substrate to increase a surface adsorption layer. Adsorption force with the upper substrate.
  • the piezoelectric sensing layer includes: a first substrate, a first sub-electrode disposed on the first substrate, disposed at the first sub-electrode An upper intermediate layer, a second sub-electrode disposed above the intermediate dielectric layer, and a second substrate disposed above the second sub-electrode;
  • the first sub-electrode and the second sub-electrode form a capacitance
  • the flatness adjustment layer is subjected to pressure to generate electric charge, so that the electric quantity of the capacitance changes, thereby generating a pressure-induced current corresponding to the pressure
  • the suction force on the upper substrate changes,
  • the pressure applied to the surface adsorption layer changes, and the resistivity of the surface adsorption layer changes, and a change in the resistivity causes a suction induction current corresponding to the suction force in the capacitance.
  • the first pressure cell unit is arranged in an array, and the first sub-electrodes of each of the first pressure cell units are distributed along the first direction, and the plurality of the first a sub-electrode forms a first electrode layer on the first substrate;
  • the second sub-electrodes of each of the first pressure cell units are distributed along a second direction, and the plurality of second sub-electrodes form a second electrode layer under the second sub-substrate.
  • the dynamic induction adjustment mechanism further includes a piezoelectric sensing layer disposed between the piezoelectric sensing layer and the surface adsorption layer for sensing the pressure Current and suction induced current are delivered to the control circuit.
  • the present disclosure also provides a method of aligning a cartridge using the vacuum-to-cassette device as described above, wherein the method of aligning the cartridge comprises:
  • the upper stage of the driving machine is moved downward to make the upper substrate and the lower substrate opposite to the box.
  • the step of adjusting the first pressure cell unit such that the combined faces of the respective first pressure cell units are combined with the shape of the upper substrate includes a step of translating the first pressure cell unit upward or downward and a step of rotating the first pressure cell unit; adjusting the second pressure cell unit to form a combination of each of the second pressure cell units
  • the step of the combined face corresponding to the shape of the lower substrate includes the step of translating the second pressure cell unit upward or downward and the step of rotating the second pressure cell unit.
  • the pressure applied by the upper substrate sub-region and the vacuum suction applied to the upper substrate sub-region corresponding to the first end surface adjust the deformation of the first end surface.
  • the curved surface formed by combining the lower end faces (ie, the first end faces) of the respective first pressure cell units can be matched with the substrate to be mounted on the cassette, and the second pressure box
  • the curved surface formed by the combination of the upper end surface (ie, the second end surface) of the unit is attached to the lower substrate of the box; thus, when the upper and lower substrates having different bending curvatures of the box are required, only the positions of the respective pressure box units need to be adjusted, and it is not necessary
  • the vacuum pair box device can be used for the substrate with a plurality of curvatures of the box, and because the shape of the end face of the pressure box unit matches the shape of the substrate to be pressed, it fits completely with the substrate to be pressed. , can guarantee the quality of the box and the accuracy of the box.
  • FIG. 1 is a schematic view showing the appearance of a vacuum box device according to a specific embodiment of the present disclosure
  • FIG. 2 is a cross-sectional structural view showing a vacuum box device according to an embodiment of the present disclosure
  • Figure 3 is a schematic view showing the structure of the upper machine at the first end face
  • FIG. 4 is a schematic structural view of a second transmission mechanism in the embodiment of the present disclosure.
  • Figure 5 is a schematic view showing the structure of the first pressure cartridge on the first end surface of the first pressure cell unit
  • Figure 6 is a schematic cross-sectional view showing the dynamic sensing adjustment structure
  • Figure 7 is a schematic view showing the planar structure of the piezoelectric sensing layer
  • Fig. 8 is a cross-sectional view showing the piezoelectric sensing layer taken along the line A-A1 in Fig. 7.
  • the vacuum box device of the embodiment of the present disclosure is configured to perform a pair of boxes on the upper substrate and the lower substrate of the display panel, wherein the vacuum pair box device includes an upper machine table and a lower machine table, wherein the vacuum pair box device further include:
  • first pressure box units disposed on the upper machine and arranged in parallel, including a first end surface facing the lower machine, and each of the first pressure box units corresponding to a sub-area of the substrate to be mounted on the box ;
  • a plurality of second pressure cell units disposed on the lower machine and arranged in parallel, including a second end surface facing the upper machine, and each of the second pressure cell units corresponding to a sub-area of the lower substrate to be placed ;
  • the upper machine has a plurality of independent first pressure box units
  • the lower machine has a plurality of independent second pressure box units, which can be adjusted by adjusting the height of each pressure box unit by an adjustment mechanism
  • the lower end faces (ie, the first end faces) of the respective first pressure cell units are combined to form a curved surface, which can be bonded to the upper substrate of the cartridge to be bonded, and the upper end surface (ie, the second end surface) of the second pressure cartridge unit is combined to form
  • the curved surface can be attached to the under-substrate substrate to be attached.
  • the vacuum pair box device can be used for the substrate with a plurality of curvatures of the box.
  • the shape of the end surface of the pressure box unit matches the shape of the substrate to be pressed, the box substrate can be completely fitted to ensure the quality of the box and the accuracy of the box.
  • FIG. 1 is a schematic diagram showing the appearance of a vacuum box device according to an embodiment of the present disclosure.
  • 2 is a schematic cross-sectional view of a vacuum box device according to an embodiment of the present disclosure.
  • the vacuum box device includes a base 10, a top plate 20, and four support columns 30 disposed between the base 10 and the top plate 20; in addition, a relative between the base 10 and the top plate 20 is disposed. And the upper machine 40 and the lower machine 50 are parallel.
  • the inside of the upper machine 40 is provided with a plurality of first pressure box units 41 arranged in parallel, and each of the first pressure box units 41 includes a first end surface 411 facing the lower machine 50, each first pressure The box unit 41 is disposed corresponding to a sub-area of the upper substrate of the cassette; the inside of the lower machine 50 is provided with a plurality of second pressure box units 51 arranged in parallel, and each of the second pressure box units 51 includes a first unit facing the upper unit 40.
  • the second end surface 511, each of the second pressure box units 51 is disposed corresponding to a sub-area of the lower substrate.
  • FIG. 3 is a schematic view showing the structure of the upper machine base 40 on the first end surface 411.
  • each of the first pressure box units 41 is arranged in an array, and the size and shape of each first end surface 411 are combined with the box to be aligned.
  • the size of the upper substrate corresponds to the shape; likewise, the shape of the lower machine base 50 in the second end surface 511 is the same as that shown in FIG. 3, and the second pressure box units 51 are arranged in an array, and the size and shape of each second end surface 511 are combined.
  • the respective first end faces 411 of the respective first pressure box units 41 are adjusted at different heights and/or different inclination angles with respect to the upper table 40, the respective first end faces 411 are formed into a joint A curved surface; also when the second end faces 511 of the respective second pressure box units 51 are at different heights and/or different inclination angles with respect to the lower table 50, the respective second end faces 511 are joined together to form a curved surface.
  • the height and/or the inclination angle of the first and second pressure cartridge units 41 and 51 can be adjusted before the cartridge, that is, can be used for
  • the curved surfaces of the upper and lower substrates are respectively corresponding to the curved surfaces of the upper and lower substrates to achieve precise fitting.
  • the number of the second pressure box units 51 is larger than the number of the first pressure box units 41 to accommodate a situation in which the bending curvature of the lower substrate to be inspected is generally larger than the bending curvature of the substrate to be mounted on the cassette, for example,
  • the number of the two pressure cartridge units 51 may be twice the number of the first pressure cartridge units 41.
  • each of the first pressure box unit 41 and the second pressure box unit 51 is internally provided with a vacuum line connecting the first end surface 411 and the second end surface 511, and the vacuum box device further includes Each of the first pressure box unit 41 and the vacuum line communicating with the vacuum line inside each of the second pressure box units 51 is configured to respectively press the first pressure box unit 41 and the second pressure box unit when adsorbing the upper and lower substrates respectively.
  • the vacuum line of 51 absorbs the vacuum so that the upper substrate is attracted to the first end surface 411, and the lower substrate is attracted to the second end surface 511.
  • the vacuum suction mechanism includes at least one vacuum pump 60, as shown in FIG. 1, disposed below the lower machine 50.
  • the vacuum box device further includes a driving mechanism for relatively speaking the upper machine and the lower machine.
  • the driving mechanism includes an upper cylinder 42 connected to the upper machine 40 and a lower cylinder 52 connected to the lower machine 50, and the upper cylinder 40 and the lower cylinder 52 can respectively control the upper machine 40 and
  • the lower table 50 moves up and down.
  • the upper cylinder 42 is pressurized to feed the upper table 40 toward the lower table 50, and/or the lower cylinder 52 is pressurized.
  • the lower table 50 is fed in a direction close to the upper table 40, and the pair of upper and lower substrates is realized.
  • the step of performing the pairing of the box includes:
  • the upper substrate and the lower substrate of the cartridge to be loaded are respectively loaded into the vacuum box device, and the vacuum suction mechanism is activated, so that the substrate on the upper surface of the cartridge is adsorbed to the first end surface of the first pressure cartridge unit 41, and the lower substrate is adsorbed to the lower substrate. a second end surface of the second pressure box unit 51;
  • the upper cylinder 42 and/or the lower cylinder 52 are activated, and the upper table 40 and the lower table 50 are opposed to each other so that the upper and lower substrates are opposed to the cartridge.
  • the following specifically includes:
  • the support body 1 is fixed to the upper machine table 40 or the lower machine table 50;
  • a supporting column 2 connected to the support body 1 , wherein an end surface of the support post 2 on the first pressure cell unit 41 is formed as the first end surface 411; the support on the second pressure box unit 51 The end surface of the column 2 is formed as the second end surface 511;
  • a first transmission mechanism is disposed between the support column 1 and the support body 2;
  • a second transmission mechanism is connected between the support column 1 and the support body 2;
  • the adjustment mechanism includes a first adjustment mechanism coupled to the first transmission mechanism for controlling the movement of the first transmission mechanism to vertically translate the support post 2 relative to the support body 1;
  • the second adjusting mechanism connected to the second transmission mechanism is configured to control the movement of the second transmission mechanism to rotate the support column 1 relative to the support body 2.
  • the up and down translation of the support column 2 can be controlled by the action of the first transmission mechanism on the first pressure box unit 41 and the second pressure box unit 51, so that the first end surface 411 is opposite to the upper machine 40.
  • the second end surface 511 moves up and down relative to the lower machine 50; the movement of the support column 2 can be controlled by the action of the second transmission mechanism on the first pressure box unit 41 and the second pressure box unit 51.
  • the first pressure cell unit 41 and the second pressure cell unit 51 are adjusted to accommodate the curved shape of the upper and lower substrates to be on the cassette.
  • the first transmission mechanism may be realized by a screw and a thread pair that are matched with each other, wherein the screw is connected to one of the support body and the support column, and the thread pair is disposed at the a support body and the other of the support columns connected to the lead screw; and the adjustment mechanism is coupled to the lead screw.
  • Support column and support by relative movement between the lead screw and the thread pair Relative movement.
  • Fig. 4 is a view showing the structure of a second transmission mechanism in the embodiment of the present disclosure.
  • the second transmission mechanism includes:
  • the first transmission shaft 3 is rotatably connected to the support body 1 (see FIG. 2), and one end of the first transmission shaft 3 is fixedly disposed on the support column 2 (see FIG. 2), and One end is provided with a first bevel gear 4;
  • a second transmission shaft 5 disposed perpendicular to the first transmission shaft 3, and one end of the second transmission shaft 5 is provided with a second bevel gear 6 meshing with the first bevel gear 4, and the other end is Set up with a worm (not shown);
  • a worm wheel 7 coupled to the worm is coupled to the adjustment mechanism, the worm wheel 7 is driven to rotate by the adjustment mechanism, and the second transmission shaft 5 is rotated by the cooperation between the worm and the worm wheel And the cooperation of the first bevel gear 4 and the second bevel gear 6 drives the first transmission shaft 3 to rotate, thereby driving the support column 2 to rotate around the support body 1.
  • the support column 2 is horizontal rather than vertical around the axis of rotation of the support 1, so that the rotation of the support column 2 is formed to rotate in the vertical plane.
  • a vacuum line is provided along the axial direction of each of the support columns 2, and is connected to the vacuum suction mechanism.
  • the adjustment mechanism for driving the first transmission mechanism and the second transmission mechanism of the above structure respectively includes a first motor and a second motor, wherein the first motor and the The first transmission mechanism is connected, and the second motor is connected to the second transmission mechanism, that is, the upper and lower translation and rotation of the support column 2 are controlled by a motor.
  • the vacuum box device further includes a first pressure cartridge tray 70 disposed on the first end surface 411 of the first pressure cartridge unit 41, the first pressure cartridge tray 70 and each The first end surface 411 of the first pressure box unit 41 is absorbingly connected; likewise, the vacuum box device further includes a second pressure box disk disposed on the second end surface 511 of the second pressure box unit 51 ( The same as the structure of the first pressure cartridge 70, the second pressure cartridge and the second end surface of each of the second pressure cartridge units Adsorption connection.
  • the first pressure cartridge tray 70 and the second pressure cartridge tray are respectively formed as a unitary structure on the first end surface 411 and the second end surface 511, and the first pressure cartridge tray 70 and the second pressure cartridge tray are made of a flexible material.
  • the vacuum lines of the first pressure cartridge 70 and the second pressure cartridge support column 2 are respectively connected to the first pressure cartridge tray 70 and the second pressure cartridge tray, and the first pressure cartridge unit 41 and the second pressure cartridge unit are utilized.
  • 51 respectively adsorbing the first pressure cartridge tray 70 and the second pressure cartridge tray, and deforming the first pressure cartridge tray 70 and the second pressure cartridge tray according to the position adjustment of the first pressure cartridge unit 41 and the second pressure cartridge unit 51, respectively.
  • the overall shape of the first pressure cartridge 70 corresponds to the curved shape of the substrate to be on the cartridge, the overall shape of the second compression cartridge and the curved shape of the lower substrate to be inspected, the first pressure cartridge 70 and the second pressure
  • the adsorption plane formed by the disc is flatter, and the upper and lower substrates are more accurately and accurately adsorbed on the first and second pressure cartridges 70, 70, respectively.
  • the first pressure cartridge unit 41 and the second pressure cartridge unit 51 may be separately formed into independent structures. That is, each of the first pressure cell unit 41 and each of the second pressure cell units 51 are respectively connected with a pressure cartridge disk, and each of the pressure cartridge disks is further combined into a specific structure for adsorbing the upper substrate and the lower substrate.
  • each of the first pressure cell units includes a first pressure plate, and a surface of each of the first pressure disk and the lower machine is formed as the first end surface;
  • each of the second pressure boxes The unit includes a second pressure cartridge, and a surface of the second pressure cartridge opposite to the upper machine is formed as the second end surface.
  • the first pressure cartridge tray 70 and the second pressure cartridge tray are made of a polyurethane material, and the material can reduce the indentation and mura generated by the upper and lower substrates of the curved shape during the vacuum-to-box process (the display brightness is not All).
  • the integral adsorption structure of the vacuum-to-box device of the prior art curved glass substrate is discrete into a plurality of adsorption structures, and the respective adsorption structures (the first pressure box unit and the second pressure) are
  • the upper and lower translation adjustments and the rotation angle adjustment of the box unit form a flexible adsorption surface adapted to the three-dimensional curved surface for the vacuum pair box of the three-dimensional curved glass substrate.
  • the structure can adapt to a plurality of different three-dimensional curved glass substrates, and does not need to replace the upper and lower fixed plates of a specific structure, thereby not only greatly reducing the manufacturing cost, but also improving the production efficiency and realizing the flexible vacuum box. .
  • the first end face of the first pressure cell unit 41 Each of the 411s is provided with a dynamic sensing adjustment mechanism for adjusting the first surface 411 to be applied to the first end surface 411 of the cartridge, according to the pressure applied to the substrate sub-region of the cartridge corresponding to the first end surface 411.
  • the deformation of the first end surface 411 is adjusted according to the vacuum suction applied to the sub-substrate region of the substrate corresponding to the first end surface 411.
  • the adsorption structure for adsorbing the upper substrate (that is, the first pressure box unit 41) is disposed in plurality, and each of the adsorption structures needs to have different positions corresponding to the shape of the substrate sub-region on the box to be matched.
  • the present invention adjusts the deformation of the first end surface 411 of the first pressure box unit 41 by the setting of the above dynamic sensing adjustment mechanism, so that the pressure applied to each area of the upper substrate is uniform, and the above situation is prevented.
  • FIG. 6 is a schematic diagram of the dynamic sensing adjustment mechanism 304 according to the embodiment of the present disclosure, which is disposed at the first end surface, and includes a flatness adjustment layer 3041 and a piezoelectric sensing layer 3042 from top to bottom. Piezoelectric sensing layer 3043 and surface adsorption layer 3044.
  • the vacuum box apparatus further includes a control circuit coupled to the dynamic sensing adjustment mechanism.
  • the piezoelectric sensing layer 3042 is configured to generate a pressure induced current corresponding to the pressure according to a pressure applied by the upper substrate sub-region corresponding to the first end surface 411 when the upper and lower substrates are opposed to the cartridge, and transmit the current to the pressure.
  • the control circuit applies an electric field corresponding to the pressure induced current to the flatness adjustment layer 3041, so that the flatness adjustment layer 3041 generates a deformation that coincides with a corresponding upper substrate sub-region;
  • the piezoelectric sensing layer 3042 generates a suction induced current corresponding to the suction force according to the suction force received by the upper substrate sub-region corresponding to the first end surface 411, and transmits the current to the control circuit;
  • the suction induced current controls the falling speed of the upper stage 40 and the voltage applied to the surface adsorption layer 3044, so that the surface adsorption layer 3044 undergoes deformation corresponding to the magnitude of the voltage value.
  • the flatness adjusting layer 3041 is made of a piezoelectric ceramic material; the piezoelectric ceramic material refers to a process of mixing with a raw material of a necessary component, and then passing through a process such as granulation, molding, high-temperature sintering, and the like.
  • a polycrystal obtained by randomly collecting fine crystal grains, such as a compound of barium titanate or lead zirconate titanate.
  • the piezoelectric ceramic material is deformed by an external force or an external electric field, and generates an opposite electrical charge on the opposite side surfaces of the deformation; therefore, when the upper and lower substrates are in the process of the cassette, when the upper substrate is adsorbed on After the dynamic sensing adjustment structure, the upper substrate applies pressure to the dynamic sensing adjustment structure, and the flatness adjustment layer 3041 formed of the piezoelectric ceramic material in each first end surface 411 is deformed under the pressure to make the upper substrate and the upper substrate
  • the degree of fit of the dynamic sensing adjustment structure is increased, and a positive charge and a negative charge are respectively generated on both sides of the position where the deformation occurs, the positive charge and the negative charge are equal in electric quantity, and the electric quantity corresponds to the degree of deformation; however,
  • the deformation generated by the pressure is unstable, so it is necessary to apply a certain electric field to the deformed partial flatness adjusting layer, so that the flatness adjusting layer 3041 in the structure can be maintained by the electric field. deformation;
  • the charge change on the surface of the flatness adjusting layer causes a change in the electric charge on the surface of the piezoelectric sensing layer 3042, so that a pressure induced current is generated in the piezoelectric sensing layer 3042, and
  • the piezoelectric sensing layer 3043 is transmitted to the control circuit; the control circuit applies an electric field corresponding to the pressure induced current to the flatness adjusting layer 3041 according to the received pressure induced current, so that the flatness adjusting layer 3041 is generated under the electric field.
  • the deformation conforms to the corresponding upper substrate sub-region, and can maintain the deformation, thereby increasing the degree of adhesion of the dynamic sensing adjustment structure and the upper substrate, eliminating pressure unevenness caused by the height difference of the substrate surface, and realizing
  • the flatness of the upper substrate is compensated; the flatness adjustment layer 3041 can be used for height adjustment within 50 micrometers ( ⁇ m).
  • the piezoelectric sensing layer 3042 is disposed under the flatness adjusting layer 3041.
  • FIG. 7 is a schematic plan view of the piezoelectric sensing layer 3042, and FIG. 8 is along the A-A1 direction of FIG.
  • the first sub-electrode 30423a and the second sub-electrode 30424a form a capacitance.
  • the flatness adjustment layer 3041 When the upper and lower substrates are paired with the cartridge, the flatness adjustment layer 3041 generates a charge after being subjected to pressure, so that the electric quantity of the capacitor changes. Generating a pressure induced current corresponding to the pressure; the upper substrate When the suction force is changed, the pressure applied to the surface adsorption layer 3044 changes, and at this time, the resistivity of the surface adsorption layer 3044 changes, and the change in the resistivity causes a suction induction current corresponding to the suction force in the capacitance. .
  • the first sub-electrode 30423a on each of the first end faces 411 is distributed along the first direction, and the plurality of first sub-electrodes 30423a form the first electrode layer 30423 on the first substrate 3042;
  • the second sub-electrodes 30424a on each of the first end faces 411 are distributed along the second direction, and the plurality of second sub-electrodes 30424a form a second electrode layer 30424 below the second substrate 30422;
  • the first sub-electrode 30423a and the second sub-electrode 30424a are made of a conductive metal material such as titanium or aluminum.
  • the intermediate dielectric layer 30425 includes a plurality of intermediate dielectric layer units 30425a having a quadrangular pyramid shape distributed in a matrix, and each intermediate dielectric layer unit 30425a is disposed between the first sub-electrode 30423a and the second sub-electrode 30424a, such that
  • the piezoelectric sensing layer 3042 has good static and dynamic performance, and the piezoelectric sensing layer 3042 can obtain tactile information well, whether for instantaneous touch or continuous extrusion.
  • the dynamic sensing adjustment structure when a pressure induced current or a suction induced current is generated in the dynamic sensing adjustment structure on one of the first end faces 411, the corresponding first sub-electrode 30423a and the second sub-electrode are detected.
  • the coordinates of the 30424a can determine the position of the first end surface 411, which is beneficial to improve the control precision of the control circuit, thereby improving the precision of the box.
  • the piezoelectric sensing layer 3043 is disposed under the piezoelectric sensing layer 3042 for transmitting the pressure induced current and the suction induced current to the control circuit; the piezoelectric sensing layer 3043 is also made of a piezoelectric ceramic material. Forming, the adjustment capability of the dynamic sensing adjustment structure 304 in the vertical direction can be further improved; in addition, the piezoelectric sensing layer 3043 can also be formed by using other conductive materials, or the piezoelectric sensing layer 3043 can also be formed. Replace with a conductive connecting wire.
  • the surface adsorption layer 3044 is disposed under the piezoelectric sensing layer 3043, and has a pressure induction current corresponding to a pressure applied to the dynamic sensing adjustment structure 304 by the upper substrate and a suction induction corresponding to the suction force received by the upper substrate. Current is transmitted to the control circuit;
  • the surface adsorption layer 3044 is made of a force-sensitive conductive rubber material; the force-sensitive conductive rubber material is filled with different carbon-based conductive materials (such as carbon black, graphite, carbon fiber, etc.) in a silicone rubber or other polymer matrix material. Forming.
  • carbon black-silicone rubber is used as the force sensitive conductive material.
  • the carbon black-silicone rubber is a silicone rubber filled with carbon black, wherein the carbon black has a mass fraction of 8%.
  • the force-sensitive conductive rubber material has scalability. As the pressure increases, the volume fraction of the rubber decreases, the volume fraction of the conductive particles increases, and the resistivity decreases as the pressure received increases.
  • the surface adsorption layer 3044 is deformed to form a plurality of suction cups for adsorbing the upper substrate; the surface adsorption layer 3044 is provided with a vacuum tube 3044a through which the sealing layer composed of the suction cup and the upper substrate is sealed.
  • the space is evacuated, so that the adsorption force between the suction cup and the upper substrate is further increased, and finally the upper substrate is completely adsorbed on the surface of the surface adsorption layer 3044 by the adsorption force.
  • the upper substrate is subjected to the suction of the surface adsorption layer 3044, and the surface adsorption layer 3044 is subjected to a pressure corresponding to the suction force, and each of the first end faces 411 is
  • the resistivity changes, so that the piezoelectric sensing layer 3042 generates a suction induced current corresponding to the suction force, and is transmitted to the control circuit through the piezoelectric sensing layer 3043, and the control circuit is based on
  • the suction induction current controls the falling speed of the upper stage 301 and the voltage applied to the surface adsorption layer 3044, so that the surface adsorption layer 3044 at each first end surface 411 undergoes deformation corresponding to the magnitude of the voltage value, thereby causing the upper substrate to be stressed. More uniform, improve the accuracy of the box and the quality of the
  • control circuit applies a reverse voltage to the surface adsorption layer 3044 at each first end surface 411, the suction pad on the surface adsorption layer 3044 disappears rapidly, the surface adsorption layer 3044 returns to the flat state, and the upper substrate is subjected to the upper substrate.
  • the suction force is reduced, and at the same time, an inert gas such as nitrogen gas, argon gas or the like is input through the vacuum tube 3044a provided in the suction cup, so that the upper substrate and the dynamic sensing adjustment structure 304 are completely peeled off; since the gas is uniformly pressed on the upper substrate when the gas is input
  • the surface thus makes the pressure box more compact, and the input gas is carried out after the pressure box, further ensuring that the inside of the display panel of the pressure box is in a vacuum state, effectively avoiding the generation of nitrogen bubbles and vacuum bubbles, and improving the efficiency.
  • the thickness uniformity of the box and the quality of the pressure box; at the same time, the upper substrate and the dynamic sensing adjustment structure 304 are peeled off by the method, thereby avoiding black spots or dark spots caused by using the thimble in the prior art, thereby further improving the quality of the display panel. .
  • connection structure is further disposed in the vacuum box device, and the connection structure is disposed between the upper machine 40 and the dynamic sensing adjustment structure 304 for fixing the dynamic sensing adjustment structure 304 to the upper machine.
  • the connecting structure is a fixed permanent magnet base or an electromagnet base
  • the dynamic sensing adjustment structure is fixed to the connecting structure by bonding, screwing or snapping, and then matching the electromagnet structure of the machine table
  • the dynamic sensing adjustment structure is fixed to the upper machine by the attraction between the magnets. When the dynamic sensing adjustment structure needs to be replaced, it is only necessary to apply a reverse voltage to the electromagnet structure of the upper machine to cause a repulsive force between the two magnets, and the dynamic sensing adjustment structure can be removed.
  • the control circuit connected to the dynamic induction adjustment mechanism may be disposed on the top plate 20 of the vacuum-to-box device as shown in FIG. 1 and connected to a drive mechanism that controls the movement of the upper machine 40, and the drive mechanism is obtained.
  • the sensing signal of the dynamic sensing adjustment mechanism controls the movement of the upper machine 40 in the process of the box according to the sensing signal.
  • the process of the substrate of the substrate is controlled by two parts, and a part of the process is controlled by a motor that controls the movement and rotation of the support column on the first pressure cell unit and the second pressure cell unit to make the first pressure
  • the first end surface 411 and the second end surface of the box unit respectively adapt to the curved shape of the upper substrate and the lower substrate of the box, and ensure that the adsorption end surface has high adaptability to the upper and lower substrates; and the other part is realized by the sensing of the dynamic sensing adjustment mechanism.
  • the deformation of the first end surface 411 ensures that the upper substrate is uniformly pressed to ensure the accuracy of the cartridge and the quality of the cartridge.
  • the displacement adjustment of the upper machine is further performed according to the pressure state data obtained by the dynamic sensing adjustment mechanism, so as to adjust the feed amount of the upper machine in the process of the cassette, and adjust the application of the upper machine. Give the pressure to the upper substrate.
  • Another embodiment of the present disclosure further provides a method of using the above-described vacuum box apparatus, the method of the box comprising:
  • the upper stage of the driving machine is moved downward to make the upper substrate and the lower substrate opposite to the box.
  • the step of adjusting the first pressure cell unit such that the combined faces of the first end faces are combined with the shape of the upper substrate comprises: moving the first pressure cell unit up or down a step of translating and a step of rotating the first pressure cell unit; adjusting the second pressure cell unit such that a combined surface of each of the second end faces is combined with a shape of the lower substrate, including a step of translating the second pressure cell unit upward or downward and a step of rotating the second pressure cell unit.
  • the upper substrate and the lower substrate are opposite to the box, and the dynamic sensing adjustment mechanism provided by the first end surface is pressed according to the pressure applied by the upper substrate sub-region corresponding to the first end surface.
  • the vacuum box device and the box method according to the specific embodiments of the present disclosure can ensure the high compatibility of the adsorption end face and the upper and lower substrates, and can also adjust the first according to the force of each area of the upper substrate in the process of the box.
  • the deformation of the end face ensures that the pressure of each area of the upper substrate is uniform to ensure the accuracy of the box and the quality of the box.

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Abstract

一种真空对盒装置及对盒方法。该真空对盒装置包括上机台（40）和下机台（50），还包括：设置于上机台（40）且平行排列的多个第一压盒单元（41），包括朝向下机台（50）的第一端面（411），且每一第一压盒单元（41）对应待对盒上基板的一个子区域设置；设置于下机台（50）且平行排列的多个第二压盒单元（51），包括朝向上机台的第二端面（511），且每一第二压盒单元（51）对应待对盒下基板的一个子区域设置；调节机构，用于调节第一压盒单元（41），使各个第一端面组合形成为与上基板相对应的形状；以及调节第二压盒单元（51），使各个第二端面（511）组合形成与下基板相对应的形状。该真空对盒装置能够对盒多种曲度的基板，且压盒单元的端面形状与待压盒基板的形状匹配，与待对盒基板贴合，能够保证对盒质量及对盒的精确度。

Description

真空对盒装置及对盒方法
相关申请的交叉引用
本申请主张在2014年12月22日在中国提交的中国专利申请号No.201410810290.6的优先权，其全部内容通过引用包含于此。
技术领域
本公开涉及显示器制造领域，尤其是指一种真空对盒装置及对盒方法。
背景技术
在薄膜场效应晶体管液晶显示器(Thin Film Transistor-Liquid Crystal Display，TFT-LCD)制造过程中，真空对盒是成盒(cell)工序的核心工艺，所谓成盒即是在近真空环境下，通过上定盘和下定盘分别吸附构成TFT-LCD的阵列(Thin Film Transistor，TFT)基板和彩膜(Color Filter，CF)基板，上定盘和下定盘相向移动，使阵列基板和彩膜基板贴合在一起。并且，其他的显示器制造过程，比如电子纸等的制造，也需要将上、下基板进行真空对盒。
随着显示技术的发展，出现了曲面形式的显示面板，如曲面电视、曲面手机等，该种曲面显示面板的制造过程中对真空对盒设备的要求就越来越高，既要保证曲面的曲度，又要很好的控制表面的吸附力。
现有技术用于曲面面板真空对盒的设备中，通常是将上定盘和下定盘制造为具有固定曲面度，以用于吸附与该固定曲面度相对应形状的曲面基板，将两部分对盒在一起。然而，该种结构的真空对盒设备，一套上定盘和下定盘装置只能够用于对盒一种形状的曲面基板，对于不同形状的曲面基板，需要重新设计并制造上、下定盘装置，并经过多次调试才能够使用，造成大量的人力、财力和时间的浪费。
发明内容
本公开技术方案的目的是提供一种真空对盒装置及对盒方法，能够无需更换上、下定盘，对盒多种曲度的显示面板。
本公开提供一种真空对盒装置，用于对显示面板的上基板和下基板进行对盒，所述真空对盒装置包括上机台和下机台，其中所述真空对盒装置还包括：
设置于上机台且平行排列的多个第一压盒单元，包括朝向所述下机台的第一端面，且每一所述第一压盒单元对应待对盒上基板的一个子区域设置；
设置于下机台且平行排列的多个第二压盒单元，包括朝向所述上机台的第二端面，且每一所述第二压盒单元对应待对盒下基板的一个子区域设置；
调节机构，用于调节所述第一压盒单元，使各个所述第一端面组合形成为与上基板相对应的形状；以及调节所述第二压盒单元，使各个所述第二端面组合形成与下基板相对应的形状。
优选地，上述所述的真空对盒装置，其中所述第一压盒单元和所述第二压盒单元分别包括：
支撑体，固定于所述上机台或所述下机台上；
支撑柱，与所述支撑体连接，其中所述第一压盒单元上所述支撑柱的端面形成为所述第一端面；所述第二压盒单元上所述支撑柱的端面形成为所述第二端面；
第一传动机构，连接设置于所述支撑柱与所述支撑体之间；
第二传动机构，连接设置于所述支撑柱与所述支撑体之间；
其中所述调节机构包括与所述第一传动机构连接的第一调节机构，用于控制所述第一传动机构动作，使所述支撑柱相对于所述支撑体上下平移；以及包括与所述第二传动机构连接的第二调节机构，用于控制所述第二传动机构动作，使所述支撑柱相对于所述支撑体转动。
优选地，上述所述的真空对盒装置，所述调节机构分别包括第一马达和第二马达，其中所述第一马达与所述第一传动机构连接，所述第二马达与所述第二传动机构连接。
优选地，上述所述的真空对盒装置，所述第一传动机构包括相互配合的丝杠和螺纹副，其中所述丝杠与所述支撑体和所述支撑柱的其中之一连接，所述螺纹副设置于所述支撑体和所述支撑柱中与所述丝杠连接的另一个上；且所述调节机构与所述丝杠连接。
优选地，上述所述的真空对盒装置，所述第二传动机构包括：
第一传动轴，与所述支撑体可转动连接，且所述第一传动轴一端固定设置于所述支撑柱上，另一端设置有第一锥齿轮；
第二传动轴，与所述第一传动轴相垂直设置，且所述第二传动轴的一端设置有与所述第一锥齿轮相啮合的第二锥齿轮，另一端上设置有蜗杆；
与所述蜗杆配合连接的蜗轮，所述蜗轮与所述调节机构连接，通过所述调节机构驱动所述蜗轮转动，并通过所述蜗杆与蜗轮之间的配合，带动所述第二传动轴转动，以及通过所述第一锥齿轮和所述第二锥齿轮的配合，带动所述第一传动轴转动，进而带动所述支撑柱绕所述支撑体转动。
优选地，上述所述的真空对盒装置，所述第二压盒单元的数量多于所述第一压盒单元的数量。
优选地，上述所述的真空对盒装置，所述真空对盒装置还包括：
驱动机构，用于使所述上机台相对于所述下机台上下平移。
优选地，上述所述的真空对盒装置，所述支撑柱上、沿所述支撑柱的轴线方向设置有真空管路；
且所述真空对盒装置还包括与所述真空管路连接的吸真空机构。
优选地，上述所述的真空对盒装置，所述真空对盒装置还包括设置于所述第一压盒单元的第一端面上的第一压盒盘，所述第一压盒盘与每一所述第一压盒单元的第一端面吸附连接；所述真空对盒装置还包括设置于所述第二压盒单元的第二端面上的第二压盒盘，所述第二压盒盘与每一所述第二压盒单元的第二端面吸附连接。
优选地，上述所述的真空对盒装置，所述第一压盒单元包括第一压盒盘，所述第一压盒盘与所述下机台相对的表面形成为所述第一端面；所述第二压盒单元包括第二压盒盘，所述第二压盒盘与所述上机台相对的表面形成为所述第二端面。
优选地，上述所述的真空对盒装置，所述第一端面上分别设置有动态感知调节机构，用于当待对盒上基板吸附于所述第一端面时，根据所述第一端面对应的待对盒上基板子区域施加的压力，调节所述第一端面的形变；以及在对盒过程中，根据所述第一端面对应的待对盒上基板子区域受到的真空吸 力，调节所述第一端面的形变。
优选地，上述所述的真空对盒装置，所述真空对盒装置还包括控制电路，所述动态感应调节机构从上至下依次包括平整度调节层、压电感应层和表面吸附层；
所述压电感应层用于在上下基板对盒时，根据所述第一端面对应的上基板子区域施加的压力，产生与所述压力大小相应的压力感应电流，并传送给所述控制电路；所述控制电路通过对所述平整度调节层施加与所述压力感应电流相应的电场，使得所述平整度调节层产生与对应的上基板子区域相吻合的形变；以及
所述压电感应层根据所述第一端面对应的上基板子区域所受到的真空吸力，产生与所述吸力相应的吸力感应电流，并传送给所述控制电路；所述控制电路根据所述吸力感应电流，控制上机台的下降速度和施加到所述表面吸附层的电压，使得所述表面吸附层发生与电压值大小相应的形变。
优选地，上述所述的真空对盒装置，所述平整度调节层采用压电陶瓷材料；
所述表面吸附层采用力敏导电橡胶材料，所述力敏导电橡胶材料为柔性导电复合材料，其电阻率随着受到的压力的增大而减小。
优选地，上述所述的真空对盒装置，所述表面吸附层在通电情况下产生形变，形成多个吸附上基板的吸盘。
优选地，上述所述的真空对盒装置，所述表面吸附层中与吸盘相对应的位置设置有真空管，用于对由所述吸盘与上基板组成的密闭空间抽真空，增大表面吸附层与上基板之间的吸附力。
优选地，上述所述的真空对盒装置，所述压电感应层包括：第一衬底基板，设置在所述第一衬底基板上的第一子电极，设置在所述第一子电极上方的中间介质层，设置在所述中间介质层上方的第二子电极，以及设置在所述第二子电极上方的第二衬底基板；
其中，所述第一子电极与所述第二子电极形成电容，在上下基板对盒时，所述平整度调节层受到压力后产生电荷，使得所述电容的电量发生变化，从而产生与所述压力相应的压力感应电流；所述上基板受到的吸力发生变化时， 表面吸附层受到的压力发生变化，此时表面吸附层的电阻率发生变化，电阻率的变化会使所述电容中产生与所述吸力相应的吸力感应电流。
优选地，上述所述的真空对盒装置，所述第一压盒单元呈阵列排布，每一所述第一压盒单元的第一子电极均沿第一方向分布，多个所述第一子电极在第一衬底基板上形成第一电极层；
每一所述第一压盒单元的第二子电极均沿第二方向分布，多个所述第二子电极在所述第二衬底基板下方形成第二电极层。
优选地，上述所述的真空对盒装置，所述动态感应调节机构还包括设置在所述压电感应层和所述表面吸附层之间的压电传感层，用于将所述压力感应电流和吸力感应电流传输给所述控制电路。
本公开还提供一种采用如上所述真空对盒装置的对盒方法，其中所述对盒方法包括：
调节所述第一压盒单元，使各个所述第一压盒单元的第一端面相组合构成的组合面与待对盒上基板的形状相对应；调节所述第二压盒单元，使各个所述第二压盒单元的第二端面相组合构成的组合面与待对盒下基板的形状相对应；
将待对盒的上基板和下基板分别载入真空对盒装置，并使上基板吸附于所述第一压盒单元的第一端面，下基板吸附于所述第二压盒单元的第二端面；
驱动上机台下移，使上基板与下基板相对盒。
优选地，上述所述的对盒方法，其中，调节所述第一压盒单元，使各个所述第一压盒单元的相组合构成的组合面与上基板的形状相对应的步骤中，包括使所述第一压盒单元向上或向下平移的步骤以及使所述第一压盒单元转动的步骤；调节所述第二压盒单元，使各个所述第二压盒单元的相组合构成的组合面与下基板的形状相对应的步骤中，包括使所述第二压盒单元向上或向下平移的步骤以及使所述第二压盒单元转动的步骤。
优选地，上述所述的对盒方法，驱动上机台下移，使上基板与下基板相对盒的步骤中，包括第一端面所设置的动态感知调节机构根据所述第一端面对应的上基板子区域施加的压力和所述第一端面对应的上基板子区域受到的真空吸力，调节所述第一端面的形变的步骤。
本公开具体实施例上述技术方案中的至少一个具有以下有益效果：
本公开通过调节机构调节各个压盒单元的高度时，可以使各个第一压盒单元的下端面(也即第一端面)组合形成的曲面与待对盒上基板相贴合，第二压盒单元的上端面(也即第二端面)组合形成的曲面与待对盒下基板相贴合；这样需要对盒不同弯曲曲率的上下基板时，只需要调节各个压盒单元的位置即可，无需更换整个上下定盘，简单方便，因此该真空对盒装置能够对盒多种曲度的基板，且由于压盒单元的端面形状与待压盒基板的形状匹配，与待对盒基板完全贴合，能够保证对盒质量及对盒的精确度。
附图说明
图1表示本公开具体实施例所述真空对盒装置的外观结构示意图；
图2表示本公开实施例所述真空对盒装置的剖面结构示意图；
图3表示上机台在第一端面的结构示意图；
图4表示本公开实施例中第二传动机构的结构示意图；
图5表示第一压盒单元的第一端面上设置第一压盒盘的结构示意图；
图6表示动态感知调节结构的剖面结构示意图；
图7表示压电感应层的平面结构示意图；
图8表示沿图7中A-A1方向压电感应层的剖面结构示意图。
具体实施方式
为使本公开的目的、技术方案和优点更加清楚，下面将结合附图及具体实施例对本公开进行详细描述。
本公开具体实施例所述真空对盒装置，用于对显示面板的上基板和下基板进行对盒，所述真空对盒装置包括上机台和下机台，其中所述真空对盒装置还包括：
设置于上机台且平行排列的多个第一压盒单元，包括朝向所述下机台的第一端面，且每一所述第一压盒单元对应待对盒上基板的一个子区域设置；
设置于下机台且平行排列的多个第二压盒单元，包括朝向所述上机台的第二端面，且每一所述第二压盒单元对应待对盒下基板的一个子区域设置；
调节机构，用于调节所述第一压盒单元，使各个所述第一端面组合形成为与上基板相对应的形状；以及调节所述第二压盒单元，使各个所述第二端面组合形成与下基板相对应的形状。
上述结构的真空对盒装置，上机台具有多个独立的第一压盒单元，下机台具有多个独立的第二压盒单元，通过调节机构调节各个压盒单元的高度时，可以使各个第一压盒单元的下端面(也即第一端面)组合形成为曲面，能够与待对盒上基板相贴合，第二压盒单元的上端面(也即第二端面)组合形成为曲面，能够与待对盒下基板相贴合。这样需要对盒不同弯曲曲率的上下基板时，只需要调节各个压盒单元的位置即可，无需更换整个上下定盘，简单方便，因此该真空对盒装置能够对盒多种曲度的基板，且由于压盒单元的端面形状与待压盒基板的形状匹配，能够与待对盒基板完全贴合，保证对盒质量及对盒的精确度。
如图1为本公开具体实施例所述真空对盒装置的外观结构示意图。图2为本公开实施例所述真空对盒装置的剖面结构示意图。参阅图1和图2，所述真空对盒装置包括底座10、顶板20以及设置于底座10与顶板20之间的四个支撑柱30；另外，在底座10与顶板20之间还设置有相对且平行的上机台40和下机台50。
本公开实施例中，上机台40的内部设置有多个平行排列的第一压盒单元41，各个第一压盒单元41包括朝向下机台50的第一端面411，每一第一压盒单元41对应待对盒上基板的一个子区域设置；下机台50的内部设置有多个平行排列的第二压盒单元51，各个第二压盒单元51包括朝向上机台40的第二端面511，每一第二压盒单元51对应待对盒下基板的一个子区域设置。如图3表示上机台40在第一端面411的结构示意图，从第一端面411上，各个第一压盒单元41呈阵列分布，各个第一端面411所组合的尺寸与形状与待对盒上基板的尺寸与形状对应；同样下机台50在第二端面511的形状与图3所示结构相同，各个第二压盒单元51呈阵列分布，各个第二端面511所组合的尺寸与形状与待对盒下基板的尺寸与形状相对应。
结合图2所示，当调节各个第一压盒单元41的第一端面411相对于上机台40位于不同高度和/或不同倾斜角度时，各个第一端面411相拼合形成为 一曲面；同样当调节各个第二压盒单元51的第二端面511相对于下机台50位于不同高度和/或不同倾斜角度时，各个第二端面511相拼合形成为一曲面。基于该一原理，在待对盒上、下基板的形状确定的情况下，在对盒前调节第一压盒单元41和第二压盒单元51的高度和/或倾斜角度，即能够使用于吸附上、下基板的曲面分别与上、下基板的曲面对应，以实现精准贴合。
另外，较佳地，第二压盒单元51的数量多于第一压盒单元41的数量，以适应待对盒下基板的弯曲曲率通常大于待对盒上基板的弯曲曲率的情形，例如第二压盒单元51的数量可以是第一压盒单元41的数量的两倍。
本公开实施例中，各个第一压盒单元41和第二压盒单元51内部分别设置有连通所述第一端面411和第二端面511的真空管路，且所述真空对盒装置还包括与各个第一压盒单元41和各个第二压盒单元51内部的真空管路连通的吸真空机构，用于在对上、下基板吸附时，分别对第一压盒单元41和第二压盒单元51的真空管路吸真空，以使上基板吸附在第一端面411处，下基板吸附在第二端面511处。本公开实施例中，所述吸真空机构包括至少一真空泵60，如图1所示，设置于下机台50的下方。
进一步地，本公开实施例中，所述真空对盒装置还包括用于使上机台、下机台相对平移的驱动机构。具体地，参阅图1，所述驱动机构包括与上机台40连接的上气缸42和与下机台50连接的下气缸52，通过上气缸42和下气缸52能够分别控制上机台40和下机台50的上、下移动。例如，当上机台40和下机台50分别吸附上基板和下基板时，上气缸42加压使上机台40向靠近下机台50的方向进给，和/或下气缸52加压使下机台50向靠近上机台40的方向进给，实现上、下基板的对盒。
基于本公开实施例上述结构的真空对盒装置，进行对盒的步骤包括：
根据待对盒上基板的形状，调节第一压盒单元41的高度和/或倾斜角度，使各个第一压盒单元41的第一端面411相组合的形状与待对盒上基板的形状对应；
根据待对盒下基板的形状，调节第二压盒单元51的高度和/或倾斜角度，使各个第二压盒单元51的第二端面511相组合的形状与待对盒下基板的形状对应；
将待对盒的上基板和下基板分别载入真空对盒装置，吸真空机构启动，使待对盒上基板吸附于第一压盒单元41的第一端面，待对盒下基板吸附于第二压盒单元51的第二端面；
上气缸42和/或下气缸52启动，上机台40与下机台50相向进给，使上、下基板相对盒。
本公开实施例中，用于实现第一压盒单元41和第二压盒单元51的具体结构可以参阅图2所示，分别具体包括：
支撑体1，固定于所述上机台40或所述下机台50上；
支撑柱2，与所述支撑体1连接，其中所述第一压盒单元41上所述支撑柱2的端面形成为所述第一端面411；所述第二压盒单元51上所述支撑柱2的端面形成为所述第二端面511；
第一传动机构，连接设置于所述支撑柱1与所述支撑体2之间；
第二传动机构，连接设置于所述支撑柱1与所述支撑体2之间；
其中所述调节机构包括与所述第一传动机构连接的第一调节机构，用于控制所述第一传动机构动作，使所述支撑柱2相对于所述支撑体1上下平移；以及包括与所述第二传动机构连接的第二调节机构，用于控制所述第二传动机构动作，使所述支撑柱1相对于所述支撑体2转动。
本公开实施例中，利用第一压盒单元41和第二压盒单元51上的第一传动机构的动作，能够控制支撑柱2的上下平移，使第一端面411相对于上机台40作上、下移动，第二端面511相对于下机台50作上、下移动；利用第一压盒单元41和第二压盒单元51上的第二传动机构的动作，能够控制支撑柱2的转动，使第一端面411相对于上机台40的倾斜角度变化，第二端面511相对于下机台50的倾斜角度变化；这样利用第一传动机构和第二传动机构的组合动作，对各个第一压盒单元41和第二压盒单元51进行调整，以适应待对盒上基板和下基板的曲面形状。
本公开实施例中，第一传动机构可以通过相互配合的丝杠和螺纹副实现，其中所述丝杠与所述支撑体和所述支撑柱的其中之一连接，所述螺纹副设置于所述支撑体和所述支撑柱中与所述丝杠连接的另一个上；且所述调节机构与所述丝杠连接。通过丝杠与螺纹副之间的相对移动，实现支撑柱与支撑体 的相对移动。本领域技术人员应该能够了解该种原理的第一传动机构分别与支撑柱和支撑体的连接方式，在此不详细描述。
图4表示本公开实施例中第二传动机构的结构示意图。参阅图4，并结合图2，第二传动机构包括：
第一传动轴3，与所述支撑体1(参阅图2所示)可转动连接，且所述第一传动轴3一端固定设置于所述支撑柱2(参阅图2所示)上，另一端设置有第一锥齿轮4；
第二传动轴5，与所述第一传动轴3相垂直设置，且所述第二传动轴5的一端设置有与所述第一锥齿轮4相啮合的第二锥齿轮6，另一端上设置有蜗杆(图中未显示)；
与所述蜗杆配合连接的蜗轮7，与所述调节机构连接，通过所述调节机构驱动所述蜗轮7转动，并通过所述蜗杆与蜗轮之间的配合，带动所述第二传动轴5转动，以及通过所述第一锥齿轮4和所述第二锥齿轮6的配合，带动所述第一传动轴3转动，进而带动所述支撑柱2绕所述支撑体1转动。
根据图2，本公开实施例中，支撑柱2绕支撑体1的转动的轴心方向为水平而非竖直，使支撑柱2的转动形成为在竖直面内的转动。
基于上述的第二传动机构，本领域技术人员应该了解支撑体1和支撑柱2分别与第二传动机构的连接方式，在此不详细描述。
另外，上述结构的第一压盒单元41和第二压盒单元51中，参阅图2，沿各个支撑柱2的轴线方向设置有真空管路，与吸真空机构连接。
本公开实施例所述真空对盒装置中，用于驱动上述结构的第一传动机构和第二传动机构的所述调节机构分别包括第一马达和第二马达，其中所述第一马达与所述第一传动机构连接，所述第二马达与所述第二传动机构连接，也即分别通过一个马达控制支撑柱2的上下平移和转动。
较佳地，参阅图5，所述真空对盒装置还包括设置于所述第一压盒单元41的第一端面411上的第一压盒盘70，所述第一压盒盘70与每一所述第一压盒单元41的第一端面411吸附连接；同样，所述真空对盒装置还包括设置于所述第二压盒单元51的第二端面511上的第二压盒盘(图未示，与第一压盒盘70的结构相同)，所述第二压盒盘与每一所述第二压盒单元的第二端面 吸附连接。
具体地，第一压盒盘70和第二压盒盘在第一端面411和第二端面511上分别形成为一个整体结构，且第一压盒盘70和第二压盒盘由柔性材料制成，第一压盒盘70和第二压盒盘上支撑柱2的真空管路分别连通至第一压盒盘70和第二压盒盘，利用第一压盒单元41和第二压盒单元51分别吸附第一压盒盘70和第二压盒盘，并使第一压盒盘70和第二压盒盘分别依据第一压盒单元41和第二压盒单元51的位置调节而变形，这样第一压盒盘70的整体形状与待对盒上基板的曲面形状对应，第二压盒盘的整体形状与待对盒下基板的曲面形状，第一压盒盘70和第二压盒盘所构成的吸附平面更加平整，确保上、下基板更能精准分别吸附于第一压盒盘70和第二压盒盘上。
除上述第一压盒盘70和第二压盒盘所形成的整体式的结构外，相较于第一压盒单元41和第二压盒单元51，也可以分别形成为独立的结构形式，也即每一第一压盒单元41和每一第二压盒单元51分别连接设置一压盒盘，各个压盒盘进一步拼合为用于吸附上基板和下基板的具体结构。具体地，各个所述第一压盒单元包括第一压盒盘，各个所述第一压盒盘与所述下机台相对的表面形成为所述第一端面；各个所述第二压盒单元包括第二压盒盘，所述第二压盒盘与所述上机台相对的表面形成为所述第二端面。通过该种设置方式，也可以组合形成为平整的吸附平面，用于吸附待对盒的上基板和下基板。
较佳地，第一压盒盘70和第二压盒盘由聚氨酯材料制成，通过该材料能够减少曲面形状的上、下基板在真空对盒过程中产生的压痕和mura(显示亮度不均)。
基于上述结构的真空对盒装置，将现有技术曲面玻璃基板的真空对盒装置中整体式的吸附结构，离散为多个吸附结构，通过对各个吸附结构(第一压盒单元和第二压盒单元)的上、下平移调节和转动角度调节，形成一种适应三维曲面的柔性吸附曲面，用于三维曲面玻璃基板的真空对盒。该种结构与现有技术的结构相比，能够适应多种不同的三维曲面玻璃基板，无需更换特定结构的上下定盘，不仅能够大大降低制造成本，还能够提高生产效率以及实现柔性真空对盒。
基于上述实施例的真空对盒装置，较佳地，第一压盒单元41的第一端面 411上分别设置有动态感知调节机构，用于当待对盒上基板吸附于所述第一端面411时，根据第一端面411对应的待对盒上基板子区域施加的压力，调节所述第一端面的形变；以及在对盒过程中，根据第一端面411对应的待对盒上基板子区域受到的真空吸力，调节所述第一端面411的形变。
由于本实施例将用于吸附上基板的吸附结构(也即第一压盒单元41)设置为多个，且每一吸附结构需要配合所对应待对盒上基板子区域的形状具有不同位置，因此当上基板吸附于第一端面以及在上、下基板的对盒过程中，每一吸附结构对上基板每一区域的吸附力可能不同，因此上基板各区域所受的压力不同，使得上基板各区域的受力不均匀，进而导致压盒过程中上基板受力不均而被压碎，或压盒后上基板与下基板的粘合状态较差，影响对盒的精确度和对盒质量的问题。因此本实用新型通过以上动态感知调节机构的设置，调节第一压盒单元41的第一端面411的形变，使上基板各区域所受压力均匀，防止上述情况发生。
图6为本公开实施例所述真空对盒装置中，所述动态感知调节机构304的示意图，设置于第一端面处，从上至下依次包括：平整度调节层3041、压电感应层3042、压电传感层3043和表面吸附层3044。
另外，所述真空对盒装置还包括与动态感知调节机构连接的控制电路。
结合图2，所述压电感应层3042用于在上下基板对盒时，根据第一端面411对应的上基板子区域施加的压力，产生与所述压力大小相应的压力感应电流，并传送给所述控制电路；所述控制电路通过对该平整度调节层3041施加与所述压力感应电流相应的电场，使得该平整度调节层3041产生与对应的上基板子区域相吻合的形变；
以及，所述压电感应层3042根据第一端面411对应的上基板子区域所受到的吸力，产生与所述吸力相应的吸力感应电流，并传送给所述控制电路；所述控制电路根据所述吸力感应电流，控制上机台40的下降速度和施加到表面吸附层3044的电压，使得表面吸附层3044发生与电压值大小相应的形变。
具体的：
所述平整度调节层3041采用压电陶瓷材料制作；所述压电陶瓷材料，是指用必要成份的原料进行混合后，然后通过造粒、成型、高温烧结等工艺而 获得的由微细晶粒无规则集合而成的多晶体，如钛酸钡系、锆钛酸铅二元系等化合物。所述压电陶瓷材料在外力或外电场作用下会发生形变，并在该形变相对应的两侧表面上产生电性相反的电荷；因此，在上下基板对盒过程中，当上基板吸附在动态感知调节结构上后，上基板对动态感知调节结构施加压力，每一第一端面411中由压电陶瓷材料形成的平整度调节层3041在该压力的作用下产生形变，以使得上基板与动态感知调节结构的贴合度增大，并在发生形变的位置的两侧分别产生正电荷和负电荷，所述正电荷与负电荷的电量相等，且电量大小与形变程度相对应；但是，在所述压力的作用下产生的形变是不稳定的，因此需要对该发生形变的部分平整度调节层施加一定的电场，使得本结构中的平整度调节层3041在该电场的作用下能够保持形变；
由于该平整度调节层3041与压电感应层直接接触，因此平整度调节层表面的电荷变化会引起压电感应层3042表面的电荷发生变化，使得压电感应层3042中产生压力感应电流，并通过压电传感层3043传送给控制电路；控制电路根据接收到的压力感应电流，对平整度调节层3041施加与所述压力感应电流相应的电场，使得平整度调节层3041在该电场下产生与对应的上基板子区域相吻合的形变，并能够保持该形变，进而使得动态感知调节结构与上基板的贴合程度增大，消除由基板表面的高度差所引起的压力不均，实现对上基板的平整度进行补偿；利用所述平整度调节层3041可进行50微米(μm)内的高度调整。
所述压电感应层3042设置在平整度调节层3041的下方，参见图7和图8，其中，图7为压电感应层3042的平面结构示意图，图8为沿图7中A-A1方向的压电感应层3042的剖面结构示意图；结合图7和图8可以看出，所述压电感应层3042包括：相对设置的第一衬底基板30421和第二衬底基板30422，设置在第一衬底基板30421上、面向第二衬底基板30422的第一子电极30423a，设置在第二衬底基板30422上、面向第一衬底基板30421的第二子电极30424a，以及设置在第一子电极30423a和第二子电极30424a之间的中间介质层30425；
其中，所述第一子电极30423a与所述第二子电极30424a形成电容，在上下基板对盒时，所述平整度调节层3041受到压力后产生电荷，使得所述电容的电量发生变化，从而产生与所述压力相应的压力感应电流；所述上基板 受到的吸力发生变化时，表面吸附层3044受到的压力发生变化，此时表面吸附层3044的电阻率发生变化，所述电阻率的变化使得所述电容中产生与所述吸力相应的吸力感应电流。
其中，每一第一端面411上的第一子电极30423a均沿第一方向分布，多个所述第一子电极30423a在第一衬底基板30421上形成第一电极层30423；
每一第一端面411上的第二子电极30424a均沿第二方向分布，多个所述第二子电极30424a在第二衬底基板30422的下方形成第二电极层30424；
所述第一子电极30423a和第二子电极30424a采用钛、铝等导电金属材料制作。
所述中间介质层30425包括多个有呈矩阵分布的四棱锥形状的中间介质层单元30425a组成，每一中间介质层单元30425a设置在第一子电极30423a和第二子电极30424a之间，使得所述压电感应层3042具有良好的静态和动态性能，无论是对于瞬间的触碰还是持续的受挤压，压电感应层3042均能良好的获取触觉信息。
所述动态感知调节结构中，当感知到其中一第一端面411上的所述动态感知调节结构中产生压力感应电流或吸力感应电流时，通过检测对应的第一子电极30423a和第二子电极30424a的坐标，即可确定第一端面411的位置，有利于提高所述控制电路的控制精度，进而提高对盒精度。
所述压电传感层3043，设置在压电感应层3042的下方，用于将所述压力感应电流和吸力感应电流传输给控制电路；所述压电传感层3043同样采用压电陶瓷材料形成，可进一步提高动态感知调节结构304在竖直方向上的调节能力；此外，所述压电传感层3043还可以采用其它的导电材料形成，或者，所述压电传感层3043还可以用导电的连接线来代替。
所述表面吸附层3044，设置在压电传感层3043的下方，将与上基板施加到动态感知调节结构304上的压力相应的压力感应电流以及与上基板所受到的吸力的相应的吸力感应电流传输给控制电路；
所述表面吸附层3044采用力敏导电橡胶材料制作；所述力敏导电橡胶材料是通过在硅橡胶或其他高分子基体材料中填充不同的碳系导电材料(如炭黑、石墨、碳纤维等)形成的。本实施例中采用炭黑-硅橡胶作为力敏导电材 料，所述炭黑-硅橡胶为填充有炭黑的硅橡胶，其中，炭黑的质量分数为8％。该力敏导电橡胶材料具有可伸缩性，随着压力增大，橡胶的体积分数减小，导电粒子的体积分数增大，其电阻率会随着所受到的压力的增大而减小。
在通电的情况下，表面吸附层3044产生形变，形成多个吸附上基板的吸盘；所述表面吸附层3044中设置有真空管3044a，通过所述真空管3044a对由所述吸盘和上基板组成的密闭空间进行抽真空，使得吸盘与上基板之间的吸附力进一步增大，最终使得上基板完全依靠吸附力吸附在表面吸附层3044的表面。
上基板完全依靠吸附力吸附在所述表面吸附层3044的表面后，上基板受到表面吸附层3044的吸力，并对表面吸附层3044产生与所述吸力相应的压力，每一第一端面411中表面吸附层3044受到压力后电阻率会发生变化，使得压电感应层3042产生与所述吸力相应的吸力感应电流，并通过压电传感层3043传送给控制电路，所述控制电路根据与所述吸力感应电流控制上机台301的下降速度和施加到表面吸附层3044的电压，使得每一第一端面411处的表面吸附层3044发生与电压值大小相应的形变，从而使得上基板受力更均匀，提高对盒的精确度和对盒质量，同时能够有效的避免上基板被压碎，进一步提高了生产的安全性。
在上下基板对盒完成后，控制电路对每一第一端面411处的表面吸附层3044施加反向电压，表面吸附层3044上的吸盘迅速消失，表面吸附层3044恢复到平整状态，上基板受到的吸力减小，同时，通过设置在吸盘中的真空管3044a输入惰性气体，如氮气、氩气等，使得上基板与动态感知调节结构304完全剥离；由于在输入气体时，气体均匀压在上基板表面，因此可使压盒更紧密，而且输入气体是在压盒后进行的，进一步保证了压盒后的显示面板的盒内为真空状态，有效避免了氮气气泡与真空气泡的产生，提高了盒厚均一性和压盒的质量；同时，通过该方法将上基板与动态感知调节结构304剥离，避免了现有技术中使用顶针而造成的黑斑或暗斑，进一步提高了显示面板的质量。
此外，也可以不对动态感知调节结构304施加反向电压，而只对动态感知调节结构304进行断电，使得吸盘自行消失，但是吸盘自行消失的速度不 及施加反向电压后的消失的速度快。
进一步的，所述真空对盒装置中还设置有连接结构，所述连接结构设置在上机台40与动态感知调节结构304之间，用于将所述动态感知调节结构304固定到上机台40表面；所述连接结构为定型永磁铁底座或电磁铁底座，将所述动态感知调节结构通过粘接、螺接或卡接的方式固定到连接结构上，然后配合上机台的电磁铁结构，利用磁铁之间的吸引力，将动态感知调节结构固定到上机台上。当需要更换动态感知调节结构时，只需要对上机台的电磁铁结构施加反向电压，使两磁铁之间产生排斥力，便可将动态感知调节结构取下。
本公开具体实施例上述与动态感应调节机构连接的控制电路可以设置于如图1所示真空对盒装置的顶板20上，同时与控制上机台40移动的驱动机构连接，所述驱动机构获得动态感应调节机构的感应信号，根据感应信号控制上机台40在对盒过程中的移动。
本公开所述的真空对盒装置，基板的对盒过程由两部分控制，一部分由控制第一压盒单元和第二压盒单元上的支撑柱移动和转动的马达控制实现，使第一压盒单元的第一端面411和第二端面分别适应待对盒上基板、下基板的曲面形状，保证吸附端面与上、下基板具有高适应度；另一部分由动态感知调节机构的感应实现，调节第一端面411的形变，保证上基板各区域受压均匀，以确保对盒的精确度和对盒质量。
另外，上述的真空对盒装置中，还进一步根据动态感知调节机构获得的压力状态数据，进行上机台的位移调整，以调整对盒过程中上机台的进给量，调整上机台施加给上基板的压力。
本公开具体实施例另一方面还提供一种采用上述真空对盒装置的对盒方法，所述对盒方法包括：
调节所述第一压盒单元，使各个所述第一压盒单元的第一端面相组合构成的组合面与待对盒上基板的形状相对应；调节所述第二压盒单元，使各个所述第二压盒单元的第二端面相组合构成的组合面与待对盒下基板的形状相对应；
将待对盒的上基板和下基板分别载入真空对盒装置，并使上基板吸附于 所述第一压合单元的第一端面，下基板吸附于所述第二压盒单元的第二端面；
驱动上机台下移，使上基板与下基板相对盒。
具体地，上述调节所述第一压盒单元，使各个所述第一端面相组合构成的组合面与上基板的形状相对应的步骤中，包括使所述第一压盒单元向上或向下平移的步骤以及使所述第一压盒单元转动的步骤；调节所述第二压盒单元，使各个所述第二端面相组合构成的组合面与下基板的形状相对应的步骤中，包括使所述第二压盒单元向上或向下平移的步骤以及使所述第二压盒单元转动的步骤。
另外，驱动上机台下移，使上基板与下基板相对盒的步骤中，包括第一端面所设置的动态感知调节机构根据所述第一端面对应的上基板子区域施加的压力和所述第一端面对应的上基板子区域受到的真空吸力，调节所述第一端面的形变的步骤。
本公开具体实施例所述真空对盒装置和对盒方法，既能够保证吸附端面与上、下基板具有高适应度，还能够根据对盒过程中上基板各区域的受力情况，调节第一端面的形变，保证上基板各区域受压均匀，以确保对盒的精确度和对盒质量。
以上所述的是本公开的优选实施方式，应当指出对于本技术领域的普通人员来说，在不脱离本公开所述的原理前提下还可以作出若干改进和润饰，这些改进和润饰也在本公开的保护范围内。

Claims (21)

  1. 一种真空对盒装置，用于对显示面板的上基板和下基板进行对盒，所述真空对盒装置包括上机台和下机台，其中，所述真空对盒装置还包括：
    设置于所述上机台且平行排列的多个第一压盒单元，包括朝向所述下机台的第一端面，且每一所述第一压盒单元对应待对盒上基板的一个子区域设置；
    设置于所述下机台且平行排列的多个第二压盒单元，包括朝向所述上机台的第二端面，且每一所述第二压盒单元对应待对盒下基板的一个子区域设置；
    调节机构，用于调节所述第一压盒单元，使各个所述第一端面组合形成为与上基板相对应的形状；以及调节所述第二压盒单元，使各个所述第二端面组合形成与下基板相对应的形状。
  2. 如权利要求1所述的真空对盒装置，其中，所述第一压盒单元和所述第二压盒单元分别包括：
    支撑体，固定于所述上机台或所述下机台上；
    支撑柱，与所述支撑体连接，其中所述第一压盒单元上所述支撑柱的端面形成为所述第一端面；所述第二压盒单元上所述支撑柱的端面形成为所述第二端面；
    第一传动机构，连接设置于所述支撑柱与所述支撑体之间；
    第二传动机构，连接设置于所述支撑柱与所述支撑体之间；
    其中所述调节机构包括与所述第一传动机构连接的第一调节机构，用于控制所述第一传动机构动作，使所述支撑柱相对于所述支撑体上下平移；以及包括与所述第二传动机构连接的第二调节机构，用于控制所述第二传动机构动作，使所述支撑柱相对于所述支撑体转动。
  3. 如权利要求2所述的真空对盒装置，其中，所述调节机构分别包括第一马达和第二马达，其中所述第一马达与所述第一传动机构连接，所述第二马达与所述第二传动机构连接。
  4. 如权利要求2或3所述的真空对盒装置，其中，所述第一传动机构包 括相互配合的丝杠和螺纹副，其中所述丝杠与所述支撑体和所述支撑柱的其中之一连接，所述螺纹副设置于所述支撑体和所述支撑柱中与所述丝杠连接的另一个上；且所述调节机构与所述丝杠连接。
  5. 如权利要求2或3所述的真空对盒装置，其中，所述第二传动机构包括：
    第一传动轴，与所述支撑体可转动连接，且所述第一传动轴一端固定设置于所述支撑柱上，另一端设置有第一锥齿轮；
    第二传动轴，与所述第一传动轴相垂直设置，且所述第二传动轴的一端设置有与所述第一锥齿轮相啮合的第二锥齿轮，另一端上设置有蜗杆；
    与所述蜗杆配合连接的蜗轮，所述蜗轮与所述调节机构连接，通过所述调节机构驱动所述蜗轮转动，并通过所述蜗杆与所述蜗轮之间的配合，带动所述第二传动轴转动，以及通过所述第一锥齿轮和所述第二锥齿轮的配合，带动所述第一传动轴转动，进而带动所述支撑柱绕所述支撑体转动。
  6. 如权利要求1所述的真空对盒装置，其中，所述第二压盒单元的数量多于所述第一压盒单元的数量。
  7. 如权利要求1所述的真空对盒装置，其中，所述真空对盒装置还包括：
    驱动机构，用于使所述上机台相对于所述下机台上下平移。
  8. 如权利要求2所述的真空对盒装置，其中，所述支撑柱上、沿所述支撑柱的轴线方向设置有真空管路；
    且所述真空对盒装置还包括与所述真空管路连接的吸真空机构。
  9. 如权利要求1所述的真空对盒装置，其中，所述真空对盒装置还包括设置于所述第一压盒单元的第一端面上的第一压盒盘，所述第一压盒盘与每一所述第一压盒单元的第一端面吸附连接；所述真空对盒装置还包括设置于所述第二压盒单元的第二端面上的第二压盒盘，所述第二压盒盘与每一所述第二压盒单元的第二端面吸附连接。
  10. 如权利要求1所述的真空对盒装置，其中，所述第一压盒单元包括第一压盒盘，所述第一压盒盘与所述下机台相对的表面形成为所述第一端面；所述第二压盒单元包括第二压盒盘，所述第二压盒盘与所述上机台相对的表面形成为所述第二端面。
  11. 如权利要求1所述的真空对盒装置，其中，所述第一端面上分别设置有动态感知调节机构，用于当待对盒上基板吸附于所述第一端面时，根据所述第一端面对应的待对盒上基板子区域施加的压力，调节所述第一端面的形变；以及在对盒过程中，根据所述第一端面对应的待对盒上基板子区域受到的真空吸力，调节所述第一端面的形变。
  12. 如权利要求11所述的真空对盒装置，其中，所述真空对盒装置还包括控制电路，所述动态感应调节机构从上至下依次包括平整度调节层、压电感应层和表面吸附层；
    所述压电感应层用于在上下基板对盒时，根据所述第一端面对应的上基板子区域施加的压力，产生与所述压力大小相应的压力感应电流，并传送给所述控制电路；所述控制电路通过对所述平整度调节层施加与所述压力感应电流相应的电场，使得所述平整度调节层产生与对应的上基板子区域相吻合的形变；以及
    所述压电感应层根据所述第一端面对应的上基板子区域所受到的真空吸力，产生与所述吸力相应的吸力感应电流，并传送给所述控制电路；所述控制电路根据所述吸力感应电流，控制上机台的下降速度和施加到所述表面吸附层的电压，使得所述表面吸附层发生与电压值大小相应的形变。
  13. 如权利要求12所述的真空对盒装置，其中，所述平整度调节层采用压电陶瓷材料；
    所述表面吸附层采用力敏导电橡胶材料，所述力敏导电橡胶材料为柔性导电复合材料，其电阻率随着受到的压力的增大而减小。
  14. 如权利要求12所述的真空对盒装置，其中，所述表面吸附层在通电情况下产生形变，形成多个吸附上基板的吸盘。
  15. 如权利要求14所述的真空对盒装置，其中，所述表面吸附层中与吸盘相对应的位置设置有真空管，用于对由所述吸盘与上基板组成的密闭空间抽真空，增大表面吸附层与上基板之间的吸附力。
  16. 如权利要求15所述的真空对盒装置，其中，所述压电感应层包括：第一衬底基板，设置在所述第一衬底基板上的第一子电极，设置在所述第一子电极上方的中间介质层，设置在所述中间介质层上方的第二子电极，以及 设置在所述第二子电极上方的第二衬底基板；
    其中，所述第一子电极与所述第二子电极形成电容，在上下基板对盒时，所述平整度调节层受到压力后产生电荷，使得所述电容的电量发生变化，从而产生与所述压力相应的压力感应电流；所述上基板受到的吸力发生变化时，表面吸附层受到的压力发生变化，此时表面吸附层的电阻率发生变化，电阻率的变化会使所述电容中产生与所述吸力相应的吸力感应电流。
  17. 如权利要求16所述的真空对盒装置，其中，所述第一压盒单元呈阵列排布，每一所述第一压盒单元的第一子电极均沿第一方向分布，多个所述第一子电极在第一衬底基板上形成第一电极层；
    每一所述第一压盒单元的第二子电极均沿第二方向分布，多个所述第二子电极在所述第二衬底基板下方形成第二电极层。
  18. 如权利要求12所述的真空对盒装置，其中，所述动态感应调节机构还包括设置在所述压电感应层和所述表面吸附层之间的压电传感层，用于将所述压力感应电流和吸力感应电流传输给所述控制电路。
  19. 一种采用权利要求1所述真空对盒装置的对盒方法，其中，所述对盒方法包括：
    调节所述第一压盒单元，使各个所述第一压盒单元的第一端面相组合构成的组合面与待对盒上基板的形状相对应；调节所述第二压盒单元，使各个所述第二压盒单元的第二端面相组合构成的组合面与待对盒下基板的形状相对应；
    将待对盒的上基板和下基板分别载入真空对盒装置，并使上基板吸附于所述第一压盒单元的第一端面，下基板吸附于所述第二压盒单元的第二端面；
    驱动上机台下移，使上基板与下基板相对盒。
  20. 如权利要求19所述的对盒方法，其中，调节所述第一压盒单元，使各个所述第一压盒单元的相组合构成的组合面与上基板的形状相对应的步骤中，包括使所述第一压盒单元向上或向下平移的步骤以及使所述第一压盒单元转动的步骤；调节所述第二压盒单元，使各个所述第二压盒单元的相组合构成的组合面与下基板的形状相对应的步骤中，包括使所述第二压盒单元向上或向下平移的步骤以及使所述第二压盒单元转动的步骤。
  21. 如权利要求19所述的对盒方法，其中，驱动上机台下移，使上基板与下基板相对盒的步骤中，包括第一端面所设置的动态感知调节机构根据所述第一端面对应的上基板子区域施加的压力和所述第一端面对应的上基板子区域受到的真空吸力，调节所述第一端面的形变的步骤。
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