WO2016095076A1 - 线路板真空塞孔工艺 - Google Patents

线路板真空塞孔工艺 Download PDF

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Publication number
WO2016095076A1
WO2016095076A1 PCT/CN2014/093791 CN2014093791W WO2016095076A1 WO 2016095076 A1 WO2016095076 A1 WO 2016095076A1 CN 2014093791 W CN2014093791 W CN 2014093791W WO 2016095076 A1 WO2016095076 A1 WO 2016095076A1
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Prior art keywords
hole
circuit board
protective film
resin
blind
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PCT/CN2014/093791
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English (en)
French (fr)
Inventor
李林涛
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李林涛
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Priority to PCT/CN2014/093791 priority Critical patent/WO2016095076A1/zh
Publication of WO2016095076A1 publication Critical patent/WO2016095076A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits

Definitions

  • the invention belongs to the technical field of PCB manufacturing, and particularly relates to a vacuum plugging process for a circuit board.
  • the design of the hole in the plate is to design the welding plate on the metallized hole, so that the plate can be designed to be smaller and the density is higher.
  • the design of the hole in the disk requires the circuit board to fill the metallized hole with the resin plug hole during the manufacturing process, and then plate the resin on the metallized plug.
  • a layer of copper ensures that the area of the soldering pad is not reduced by the design of the metallized holes.
  • the biggest processing difficulty of this kind of plate design is how to fill the metallized hole, no bubbles, no voids, and does not affect the circuit board after the plug hole.
  • the resin plug hole of the circuit board in the industry mainly adopts the following two methods: 1.
  • the common screen printing machine screen printing resin ink plug hole, the plug hole method needs to make the screen plate and the back plate of the plug hole, and can only be used for the specified position.
  • the aperture is plugged, but there are quality problems such as air bubbles, voids, depressions, and insufficient plug holes during the plugging process, and the blind holes cannot be plugged.
  • the vacuum plug hole screen printing resin ink plug hole this way the plug hole is full, no bubbles, hollow, but for the plate surface uneven surface, after the vacuum plug hole machine is finished, the resin is easy to accumulate in the depression, follow-up
  • the shovel flat plate also cannot remove the resin at the recessed plate and requires manual manual treatment, which is very time consuming and easily causes the substrate to be worn out.
  • the present invention provides a vacuum plugging process for a circuit board, which can make a plate with uneven surface of the board surface adopt a vacuum plug hole method.
  • a vacuum plugging process for a circuit board including the steps of: plating a circuit board to achieve a predetermined thickness of a copper layer on a surface and a hole, and then laying on a circuit board requiring a plug hole A protective film is attached on both sides, and the through holes and the blind holes on the circuit board are covered, and the protective film is pressed to make it closely adhere to the circuit board, and no air bubbles are generated;
  • the protective film on the plug hole is required to be processed, the protective film covering the via hole and the blind hole is removed, the protective film at other positions is retained, and the exposure is cleaned by chemical syrup, ultrasonic wave or high pressure water washing.
  • the resin is not completely cured, the protective film is peeled off; after the baking is continued until the plug resin is completely cured, the protruding resin on the surface of the via hole and the blind hole is smoothed by a plate grinder.
  • the invention solves the problem that the plate surface after the lamination is uneven (such as a rigid-flex plate), but the problem of vacuum plug hole is required.
  • FIG. 1 is a flow chart of a vacuum plugging process for a circuit board provided by the present invention.
  • the invention provides a circuit board vacuum plug hole process, which is mainly used for solving the problem that the current plate surface unevenness plate adopts the screen printing resin plug hole to easily generate bubbles, voids, depressions, etc., and adopts vacuum resin. Plug hole, how to remove the resin problem accumulated in the recess.
  • Step S1 performing electroplating on the circuit board to make the thickness of the copper layer in the surface and the hole reach a predetermined requirement, and then bonding a protective film on the lower surface of the circuit board requiring the plug hole, and conducting the circuit board.
  • the holes and the blind holes cover the cover, and the protective film is pressed to be in close contact with the circuit board without generating bubbles.
  • the protective film must be able to withstand a high temperature of 200 degrees or less, and after passing through a high temperature, does not peel off the glue on the copper surface after being torn off.
  • Step S2 processing the protective film on the circuit board that needs to be plugged by CO2 or UV laser.
  • the present invention suggests that the CO2 laser drilling method is required to open the via hole and the blind hole.
  • the protective film covered on the hole is removed, the protective film at other positions is retained, and the exposed via holes and blind holes are cleaned by chemical syrup, ultrasonic wave or high pressure water washing.
  • Step S3 After the cleaning is completed, the circuit board is placed in a vacuum plugging machine, and the through holes and the blind holes are filled with the resin.
  • step S4 the circuit board is baked in a 120 degree oven for 1 hour, and the protective film is peeled off when the resin is not completely cured.
  • Step S5 after tearing off the protective film, the above circuit board is continuously placed in a 160 degree oven for 1 hour, and after the plug hole resin is completely cured, the above-mentioned through hole and blind hole surface are passed through a glass fiber cloth grinding machine. The raised resin is smoothed and the entire vacuum plug process is completed.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

一种线路板的真空塞孔工艺，包括步骤：对线路板进行电镀处理，使其表面和孔内的铜层厚度达到预定要求，然后在需要塞孔的线路板上下两面各贴合一层保护膜，将该线路板上的导通孔和盲孔遮挡覆盖，并对上述保护膜进行压合；对线路板上需要塞孔位置的保护膜进行处理，将需要塞孔的导通孔和盲孔上覆盖的保护膜去除，保留其它位置的保护膜，并通过化学药水、超声波或高压水洗方式清洗所述露出的导通孔和盲孔；将去除部分保护膜后的线路板放置于真空塞孔机中，将所述导通孔和盲孔填满树脂；将填满树脂后的线路板预烘一段时间，树脂在未完全固化时，撕下保护膜；继续烘板至塞孔树脂完全固化后，通过磨板机将导通孔和盲孔表面的凸起树脂磨平。

Description

线路板真空塞孔工艺 技术领域
本发明属于PCB制造技术领域，具体涉及的是一种线路板真空塞孔工艺。
背景技术
随着电子产品的普及和广泛应用，线路板的生产和制造技术也不断更新和发展，线路板正朝小型化，高密度化发展。因此盘中孔设计越来越普遍。盘中孔设计是在金属化孔上设计焊接盘，这样可以将板件设计得更小，密度更高。为了保证盘中孔既能实现电气连接，也能实现焊接的作用，盘中孔设计需要线路板在制造过程中将金属化孔使用树脂塞孔塞满，然后在金属化孔塞的树脂上电镀一层铜，保证焊接盘的面积不会因为金属化孔的设计而减少。这种板件设计最大的加工难度在于怎样才能将金属化孔塞满，无气泡，无空洞，且不影响塞孔后的线路板制作。
目前行业中线路板进行树脂塞孔主要采用以下两种方式：一、普通丝印机网印树脂油墨塞孔，这种塞孔方式需要制作塞孔的网版和垫板，可以只针对指定位置的孔径塞孔，但其塞孔过程中会产生气泡、空洞、凹陷，塞孔不够饱满等品质问题，而且不能塞盲孔。二、真空塞孔机丝印树脂油墨塞孔，这种方式塞孔饱满，没有气泡，空洞，但对于板面凹凸不平的板件，真空塞孔机塞完后，树脂容易堆积在凹陷处，后续铲平磨板同样无法去除掉凹陷板处的树脂，需人工手动处理，非常耗时，且容易造成打磨漏基材的情况。
对于板面凹凸不平的板件设计盘中孔，目前只能采用网印塞孔，因为采用真空塞孔的品质风险更高，手工操作无法管控，但网塞方式产生的气泡、空洞、凹陷却时有发生，品质不稳定，无法彻底解决。
发明内容
有鉴于此，本发明提供一种线路板真空塞孔工艺，能让板面凹凸不平的板件可以采用真空塞孔的方法。
在一实施例中，提供一种线路板的真空塞孔工艺，包括步骤：对线路板进行电镀处理，使其表面和孔内的铜层厚度达到预定要求，然后在需要塞孔的线路板上下两面各贴合一层保护膜，将该线路板上的导通孔和盲孔遮挡覆盖，并对上述保护膜进行压合，使其与线路板紧密贴合，且不产生气泡；对线路板上需要塞孔位置的保护膜进行处理，将需要塞孔的导通孔和盲孔上覆盖的保护膜去除，保留其它位置的保护膜，并通过化学药水、超声波或高压水洗方式清洗所述露出的导通孔和盲孔；将去除部分保护膜后的线路板放置于真空塞孔机中，将所述导通孔和盲孔填满树脂；将填满树脂后的线路板预烘一段时间，树脂在未完全固化时，撕下保护膜；继续烘板至塞孔树脂完全固化后，通过磨板机将上述导通孔和盲孔表面的凸起树脂磨平。
本发明解决了层压后板面凹凸不平的板件(如刚挠结合板)，但需要做真空塞孔的问题。
附图说明
图1是本发明提供的线路板真空塞孔工艺的流程图。
具体实施方式
下面结合附图和具体实施例对本发明的技术方案作进一步更详细的描述。显然，所描述的实施例仅仅是本发明的一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创造性劳动的前提下所获得的所有其他实施例，都应属于本发明保护的范围。
本发明提供的是一种线路板真空塞孔工艺，主要用于解决目前板面凹凸不平的板件采用网印树脂塞孔所存在的容易产生气泡、空洞、凹陷等品质问题，以及采用真空树脂塞孔，如何去除掉凹陷处堆积的树脂问题。
请参阅图1，本发明具体工艺如下：
步骤S1、对线路板进行电镀处理，使其表面和孔内的铜层厚度达到预定要求，然后在需要塞孔的线路板上下两面各贴合一层保护膜，将该线路板上的导通孔和盲孔遮挡覆盖，并对上述保护膜进行压合，使其与线路板紧密贴合，且不产生气泡。本实施例中，上述保护膜必须能耐200度以下的高温，且经过高温，撕下后不掉胶在铜面上。
步骤S2、通过CO2或UV镭射方式对线路板上需要塞孔位置的保护膜进行处理，为了加工效率，方便现场加工，本发明建议选择CO2镭射钻孔方式将需要塞孔的导通孔和盲孔上覆盖的保护膜去除，保留其它位置的保护膜，并通过化学药水、超声波或高压水洗方式清洗上述露出的导通孔和盲孔。
步骤S3、清洗完后，将上述线路板放置于真空塞孔机中，将所述导通孔和盲孔填满树脂。
步骤S4、将上述线路板在120度烘箱内烘1个小时，树脂在未完全固化时，撕下上述保护膜。
步骤S5、撕完保护膜后，将上述线路板继续放置在160度烘箱内烘1个小时，至塞孔树脂完全固化后，通过玻璃纤维布的磨板机将上述导通孔和盲孔表面的凸起树脂磨平，完成整个真空塞孔的过程。
以上所揭露的仅为本发明实施例中的较佳实施例而已，当然不能以此来限定本发明之权利范围，因此依本发明权利要求所作的等同变化，仍属本发明所涵盖的范围。

Claims (2)

  1. 一种线路板的真空塞孔工艺，其特征在于，包括步骤：
    对线路板进行电镀处理，使其表面和孔内的铜层厚度达到预定要求，然后在需要塞孔的线路板上下两面各贴合一层保护膜，将该线路板上的导通孔和盲孔遮挡覆盖，并对上述保护膜进行压合，使其与线路板紧密贴合，且不产生气泡；
    对线路板上需要塞孔位置的保护膜进行处理，将需要塞孔的导通孔和盲孔上覆盖的保护膜去除，保留其它位置的保护膜，并通过化学药水、超声波或高压水洗方式清洗所述露出的导通孔和盲孔；
    将去除部分保护膜后的线路板放置于真空塞孔机中，将所述导通孔和盲孔填满树脂；
    将填满树脂后的线路板预烘一段时间，树脂在未完全固化时，撕下保护膜；
    继续烘板至塞孔树脂完全固化后，通过磨板机将上述导通孔和盲孔表面的凸起树脂磨平。
  2. 如权利要求1所述的线路板的真空塞孔工艺，其特征在于，通过CO2或UV镭射方式对线路板上需要塞孔位置的保护膜进行处理。
PCT/CN2014/093791 2014-12-15 2014-12-15 线路板真空塞孔工艺 WO2016095076A1 (zh)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111343790A (zh) * 2020-03-09 2020-06-26 四川锐宏电子科技有限公司 一种pcb板软硬结合工艺
CN113727525A (zh) * 2021-08-11 2021-11-30 广德牧泰莱电路技术有限公司 树脂塞孔导气板及其制作方法
CN114071881A (zh) * 2021-11-04 2022-02-18 珠海杰赛科技有限公司 一种印刷电路板树脂塞孔爆孔修补方法

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US6889433B1 (en) * 1999-07-12 2005-05-10 Ibiden Co., Ltd. Method of manufacturing printed-circuit board
CN101662893A (zh) * 2009-09-04 2010-03-03 东莞美维电路有限公司 具高密集盘中孔的印制线路板的制作方法
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CN103929878A (zh) * 2014-04-09 2014-07-16 中国科学院微电子研究所 一种pcb基板塞孔制造方法及其结构
US20140246325A1 (en) * 2011-07-29 2014-09-04 Shinmaywa Industries, Ltd. Film-forming apparatus and film-forming method

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US6889433B1 (en) * 1999-07-12 2005-05-10 Ibiden Co., Ltd. Method of manufacturing printed-circuit board
CN101662893A (zh) * 2009-09-04 2010-03-03 东莞美维电路有限公司 具高密集盘中孔的印制线路板的制作方法
CN101692757A (zh) * 2009-09-07 2010-04-07 皆利士多层线路版(中山)有限公司 12oz厚铜多层线路板制造工艺
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Publication number Priority date Publication date Assignee Title
CN111343790A (zh) * 2020-03-09 2020-06-26 四川锐宏电子科技有限公司 一种pcb板软硬结合工艺
CN113727525A (zh) * 2021-08-11 2021-11-30 广德牧泰莱电路技术有限公司 树脂塞孔导气板及其制作方法
CN113727525B (zh) * 2021-08-11 2023-06-23 广德牧泰莱电路技术有限公司 树脂塞孔导气板及其制作方法
CN114071881A (zh) * 2021-11-04 2022-02-18 珠海杰赛科技有限公司 一种印刷电路板树脂塞孔爆孔修补方法
CN114071881B (zh) * 2021-11-04 2023-01-03 珠海杰赛科技有限公司 一种印刷电路板树脂塞孔爆孔修补方法

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