WO2016092694A1 - Module de circuit moulé et son procédé de production - Google Patents

Module de circuit moulé et son procédé de production Download PDF

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Publication number
WO2016092694A1
WO2016092694A1 PCT/JP2014/082957 JP2014082957W WO2016092694A1 WO 2016092694 A1 WO2016092694 A1 WO 2016092694A1 JP 2014082957 W JP2014082957 W JP 2014082957W WO 2016092694 A1 WO2016092694 A1 WO 2016092694A1
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WO
WIPO (PCT)
Prior art keywords
resin
substrate
circuit module
shield layer
molded circuit
Prior art date
Application number
PCT/JP2014/082957
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English (en)
Japanese (ja)
Inventor
悟 三輪
Original Assignee
株式会社メイコー
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Filing date
Publication date
Application filed by 株式会社メイコー filed Critical 株式会社メイコー
Priority to PCT/JP2014/082957 priority Critical patent/WO2016092694A1/fr
Priority to JP2015539896A priority patent/JPWO2016092694A1/ja
Publication of WO2016092694A1 publication Critical patent/WO2016092694A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Definitions

  • the present invention relates to a molded circuit module.
  • the mold circuit module includes a substrate having wiring (for example, a printed circuit board), an electronic component mounted so as to be electrically connected to the wiring of the substrate, and a resin that covers the substrate together with the electronic component.
  • the molded circuit module can protect the electronic component by covering the electronic component with resin, and can protect a portion where the electronic component and the wiring on the substrate are electrically connected.
  • the size of the molded circuit module is a very important factor in the molded circuit module. As long as the performance is the same, the smaller the molded circuit module, the better, and the thinner the molded circuit module, the better.
  • the thickness of the molded circuit module is determined by the thickness of the resin covering the substrate.
  • the resin applied to the substrate should be as thin as possible from the top of the tallest electronic component (the part farthest from the substrate) to the surface of the resin.
  • the thickness of the completed molded circuit module is reduced.
  • the thickness of the resin before curing is difficult because it deals with a semi-solid, and it is difficult to increase its accuracy.
  • the thickness of the first resin existing on the tallest electronic component in the finished molded circuit module cannot be made thinner than about 500 ⁇ m.
  • This invention makes it the subject to provide the technique which makes the thickness of a mold circuit module smaller.
  • the present invention has a plurality of virtual sections adjacent to each other on one surface, and at least one electronic component is mounted on each of the sections on the one surface, and has a grounding electrode.
  • a first coating process in which the entire surface of the one is covered with the first resin, which is a resin, together with the electronic component, and a surface (upper surface) of the cured first resin, the surface of which is the one of the substrates
  • a plurality of molded circuit modules based on each of the sections are obtained by cutting the substrate at a boundary between the first resin molding step and cutting the substrate so as to be parallel to the surface of the section.
  • the first resin in the present invention corresponds to the resin contained in the molded circuit module described in the prior art.
  • the surface of the cured first resin is performed in a first resin molding process in which the surface is cut so that the surface is parallel to the one surface of the substrate. Since the first resin molding process is a treatment for the resin after being cured, the accuracy can generally be set to about ⁇ 35 ⁇ m. Therefore, according to the present invention, considering manufacturing errors, it is relatively easy to make the thickness of the first resin present on the tallest electronic component in the molded circuit module 100 ⁇ m or less, In some cases, it may be about 80 ⁇ m.
  • the first coating process when the one whole surface of the substrate is coated with the first resin together with the electronic components, it may be executed by any method.
  • a vacuum printing method can be used. If the vacuum printing method is used, it is possible to prevent the formation of minute bubbles in the cured first resin, and it becomes possible to cover electronic parts having various shapes with the first resin without any gaps.
  • the thickness of the resin layer present on the component attached to the substrate is thin, the unevenness caused by the difference in height of the electronic component, It always appears on the surface of the first resin.
  • the first resin has a filling property for entering between electronic components (this is a property before curing), adhesion to the electronic component or substrate, and a property that does not cause warping (these are properties after curing). 3) is required.
  • a filling property for entering between electronic components this is a property before curing
  • adhesion to the electronic component or substrate adhesion to the electronic component or substrate
  • a property that does not cause warping (these are properties after curing). 3) is required.
  • the characteristics to be satisfied by the first resin are the ratio of the filler with respect to the total amount of the first resin including the filler in a weight ratio of 80% or more as the characteristics before curing, and the linear expansion coefficient ( ⁇ 1) is 11 ppm / TMA or less, linear expansion coefficient ( ⁇ 2) is 25 ppm / TMA or less, and 25 ° C. elastic modulus is 15 GPa / DMA or more.
  • the high filling property contributes to reducing the thickness of the completed molded circuit module. There is usually a gap between the underside of the electronic component and the substrate. Such a gap must be designed to be large enough to fill the gap with the first resin.
  • the gap between the lower side of the electronic component and the substrate can be reduced.
  • the thickness of the molded circuit module can be reduced.
  • the gap between the lower side of the electronic component and the substrate can be reduced to 30 ⁇ m (generally 150 to 200 ⁇ m).
  • the present invention after the first resin molding process, a half-cut process of removing the first resin and the substrate having a predetermined width including a number of boundary lines of the sections to a predetermined thickness of the substrate is performed. It may be a thing.
  • the present invention provides the surface of the first resin, the side surface of the first resin exposed by the half-cut process, and the side surface of the substrate by applying a paste containing metal powder or plating.
  • a shield layer forming process for forming a shield layer that is a metal layer electrically connected to the grounding electrode, and the full cut process is performed after the shield layer forming process.
  • the molded circuit module includes electronic components. Some electronic components are vulnerable to electromagnetic waves. Some electronic components emit electromagnetic waves.
  • the molded circuit module is combined with other electronic components.
  • Other electronic components may or may not be included in other molded circuit modules.
  • other electronic components may be vulnerable to electromagnetic waves, and others may emit electromagnetic waves.
  • the metal shield is a box that is open on one side made of a thin metal plate.
  • the metal shield is a box that is open on one side made of a thin metal plate.
  • the box is normal not to mold with resin, but it was positioned inside the box by attaching the box to the substrate with the edge surrounding the box opening in contact with the substrate. Shield the electronic components with a box.
  • the height from the substrate to the top surface of the box tends to increase, and the thickness of the circuit module tends to increase.
  • the labor and cost of making the box increase, and more than one type of box is prepared according to the height of the electronic component. It can happen that it becomes useless compared to the height of the component from the substrate.
  • the shield layer since the surface and side surfaces of the first resin of the completed molded circuit module can be covered with the shield layer, other electronic components outside the mold circuit module are released by the shield layer. Reducing the effect of electronic components contained in the molded circuit module from electromagnetic waves also reducing the effect of other electronic components outside the molded circuit module from electromagnetic waves emitted by the electronic components contained in the molded circuit module It is also possible to do.
  • the application of the paste containing the metal powder or the plating shield layer can be adhered to the first resin, unlike the case of using a box, and the thickness thereof is also higher than that of the case of using a box. Therefore, it is possible to prevent the completed molded circuit module from being thick and large.
  • the shield layer (or a first metal coating layer and a second metal coating layer described later included therein) is formed by applying a paste containing metal powder or plating.
  • the plating is not limited to a wet dry type.
  • wet plating include electrolytic plating and electroless plating.
  • dry plating include physical vapor deposition (PVD) and chemical vapor deposition (CVD).
  • PVD physical vapor deposition
  • CVD chemical vapor deposition
  • Examples of the former include sputtering and vacuum deposition. Examples of the latter include heat. Examples include CVD and photo-CVD.
  • wet plating is the most cost-effective, and the residual stress in the metal coating layer formed by wet plating is smaller than the residual stress in the metal coating layer formed by other methods. In this respect, wet plating is suitable for application to the present invention.
  • the thickness of the metal film layer obtained by PVD and CVD which are thin film formation techniques, is from the order of nm to several ⁇ m, whereas according to wet plating, it is thicker from several ⁇ m to several tens ⁇ m. Film formation is possible.
  • the shielding layer has a thickness of at least several ⁇ m. Therefore, wet plating is also compatible with the present invention.
  • Wet plating includes electroless plating and electrolytic plating. Considering the possibility of damage to electronic components included in the molded circuit module, it is necessary to apply a current to the surface of the molded circuit module to be processed. Electroless plating that does not require a current to flow is preferable to electrolytic plating.
  • the shield layer in the present invention is electrically connected to the grounding electrode of the substrate.
  • the shield layer may be in direct contact with the grounding electrode or indirectly in contact with the grounding electrode via another conductive metal.
  • the grounding electrode may be present in layers in a predetermined portion in the thickness direction of the substrate. In that case, in the half-cut process, if the first resin and the substrate having a predetermined width including the boundary lines of many partitions are removed up to the grounding electrode inside the substrate, the periphery of each partition Thus, the end face of the ground electrode is exposed.
  • the shield layer is in direct contact with the exposed end face of the ground electrode.
  • the shield layer can be electrically connected to the ground electrode by using an appropriate metal member such as a partition member.
  • the shield layer in the present application has a function of reducing the influence of electromagnetic waves generated by electronic components outside the molded circuit module on the electronic components in the molded circuit module, or the electronic components included in the molded circuit module are molded circuit modules. It has a function of reducing the influence on other external electronic components. And if it has such a function, it may be comprised with what kind of metal.
  • the shield layer may be a single layer or a multilayer. The metal constituting each of the multiple shield layers may be the same, but may be different.
  • the shield layer includes a first metal coating layer made of a first metal which is a metal having excellent characteristics for electric field shielding, and a second metal coating made of a second metal which is a metal having excellent characteristics for shielding a magnetic field.
  • the shield layer can also be formed as including two layers. If the shield layer includes such two layers, the electronic component can be more efficiently protected from electromagnetic waves.
  • the first metal for example, copper or iron can be used.
  • nickel can be used as the second metal. Either the first metal coating layer or the second metal coating layer may be exposed to the outside. In any case, there is no particular effect on the above-described functions. However, when copper is used as the first metal, copper may be oxidized and discolored to black. Therefore, if the appearance is taken into consideration, the first metal coating layer composed of copper should not be exposed to the outside. good.
  • a resin containing a filler can also be used.
  • the surface of the first resin after the first resin molding process covering the substrate is performed is coated with a second resin that is a resin not containing a filler.
  • a metal powder is formed on the surface of the second resin, the side surface of the first resin exposed by the half-cutting process, and the side surface of the substrate.
  • a shield layer which is a metal layer that is electrically connected to the grounding electrode, may be formed by applying a paste containing or by plating.
  • a filler may be mixed in the first resin in the present invention.
  • the filler is granular. Further, since the filler is composed of a material having a linear expansion coefficient different from that of the resin constituting the first resin, it suppresses the degree of thermal expansion and contraction of the molded circuit module. Often used in modules.
  • the shield layer is formed by applying a paste containing metal powder to the surface of the first resin mixed with the filler or by performing plating, the shield layer may fall off.
  • the filler that is present on the surface of the first resin and is exposed from the first resin may be easily removed from the first resin. When a situation in which the filler is detached from the first resin occurs, Part of the shield layer falls off. It is the second resin that prevents the shield layer from falling off.
  • the second resin covers the surface of the first resin.
  • the shield layer is formed on the surface of the second resin, the side surface of the first resin exposed by the half-cut process performed prior to the full cut for later dicing, and the side surface of the substrate.
  • the second resin does not contain a filler. Therefore, the shield layer formed in this way has no connection with the dropout due to the dropout of the filler. Even in this case, the portion of the shield layer that covers the side surface of the first resin covers the first resin without using the second resin.
  • half-cutting is performed by a normal method, the side surface of the first resin is moderately roughened. Therefore, the inventor has confirmed that the shield layer is in close contact with the first resin and the shield layer does not easily fall off. Has been.
  • wet plating when wet plating is used for the formation of the shield layer, if the layer made of the second resin does not exist, the shield layer is likely to fall off due to the filler falling off.
  • the present invention is also meaningful in that wet plating can be selected in the process of forming a shield layer when manufacturing a molded circuit module.
  • the present invention by covering at least a portion of the upper surface of the first resin covered with the shield layer with the second resin, it is possible to prevent the shield layer from falling off due to the filler falling off.
  • the shield layer since the shield layer is formed on the first resin via the second resin, if the second resin falls off from the first resin, the shield layer will eventually fall off.
  • the high adhesion of the second resin to the first resin is important. This adhesion is realized by an anchor effect between the first resin and the second resin, an intermolecular force, and a slight covalent bond.
  • main resin means the resin if the resin contained in the first resin is one kind, and if the first resin contains a plurality of kinds of resins, the most weight among them. It means something that is more in ratio.
  • the second resin can be an epoxy resin.
  • covers the part coat
  • the thickness of the second resin is reduced within a range in which the filler exposed from the first resin can be prevented from falling off the first resin and the strength of the second resin can be maintained. Is good. Thinning the second resin layer is advantageous when the shield layer is formed by plating because it is easy to roughen in the next step.
  • the layer made of the second resin is preferably thin enough not to fill the uneven shape on the surface of the first resin.
  • FIG. 2 is a side sectional view showing a state in which electronic components are mounted on the substrate shown in FIG.
  • the sectional side view which shows the state which attached the partition member to the board
  • the side sectional view showing the state where the substrate shown in Drawing 1 (c) was covered with the 1st resin together with the part, and the 1st resin was hardened.
  • the sectional side view for showing the range removed among the 1st resin shown in Drawing 1 (d).
  • the sectional side view which shows the state which coat
  • the sectional side view which shows the state which performed the process of the half cut with respect to the board
  • the sectional side view which shows the state which provided the shield layer with respect to the board
  • the perspective view which shows the structure of the partition member used with the manufacturing method of the mold circuit module of embodiment.
  • the top view which shows the structure of the other partition member used with the manufacturing method of the mold circuit module of embodiment, a left view, and a front view.
  • the top view which shows the structure of the other partition member used with the manufacturing method of the mold circuit module of embodiment, a left view, and a front view.
  • the top view which shows the structure of the other partition member used with the manufacturing method of the mold circuit module of embodiment, a left view, and a front view.
  • the side view which shows the principle of the vacuum printing method used with the manufacturing method of the mold circuit module of embodiment.
  • the sectional side view which shows an example of a structure of the shield layer obtained by the manufacturing method of the mold circuit module of embodiment.
  • the sectional side view of the mold circuit module obtained by the manufacturing method of the mold circuit module by embodiment.
  • FIG. 8 is a side sectional view showing a state where the mask shown in FIG. 7B is removed.
  • FIG. 8 is a side cross-sectional view showing a state after a half cut process is performed on the substrate shown in FIG.
  • FIG. 8 is a side sectional view showing a state in which a shield layer is provided on the substrate shown in FIG.
  • FIG. 8 is a side cross-sectional view showing a state in which a full cut process and plating resist removal are performed on the substrate shown in FIG.
  • a molded circuit module is manufactured using the substrate 100 shown in FIG.
  • the substrate 100 may be extremely general, and the substrate 100 of this embodiment is also extremely general.
  • the substrate 100 includes wiring not shown.
  • the wiring is electrically connected to an electronic component, which will be described later, and supplies power to the electronic component, and is known or known.
  • the wiring is designed so that it is possible.
  • the wiring may be provided on the substrate 100 by any method, and may be provided anywhere on the substrate 100.
  • the wiring may be provided on the surface of the substrate 100 by printing.
  • the substrate 100 is generally called a printed wiring board.
  • the wiring may also exist inside the substrate 100.
  • the shape of the substrate 100 in plan view is, for example, a rectangle.
  • a ground electrode 110 is provided at an appropriate position on the substrate 100.
  • the grounding electrode 110 may be all or part of the ground electrode 110 inside the substrate 100, or may be all or part of the ground electrode 110 on any surface of the substrate 100. .
  • the ground electrode 110 is used for grounding a shield layer, which will be described later, via the ground electrode 110 when the completed molded circuit module is used.
  • the grounding electrode 110 is designed so that it is possible.
  • a large number of molded circuit modules are manufactured from one substrate 100. That is, in this embodiment, so-called many molded circuit modules are taken from one substrate 100.
  • the substrate 100 is divided into a large number of virtual adjacent sections 120, and one molded circuit module is manufactured from each section 120.
  • the molded circuit modules produced from each compartment 120 are not necessarily the same, but are usually the same.
  • each section 120 has the same size, and each section 120 is provided with wiring and a ground electrode 110 in the same pattern.
  • the mold circuit module manufactured from each division 120 shall be the same.
  • the electronic component 200 is attached. All of the electronic components 200 may be existing ones, for example, active elements such as IC (integrated circuit) amplifiers, oscillators, detectors, and transceivers or passive elements such as resistors, capacitors, and coils. Selected.
  • the electronic component 200 is attached to each compartment 120 such that terminals (not shown) of the electronic component 200 are electrically connected to the wiring of each compartment 120. In this embodiment, since the same molded circuit module is obtained from each section 120, the electronic components 200 mounted on each section 120 are the same.
  • a gap between the lower side of the electronic component 200 and the substrate 100 is smaller than usual, and may be, for example, about 30 ⁇ m.
  • the partition member 300 is attached to the substrate 100 (FIG. 1C).
  • the partition member 300 is a member for creating a partition in the molded circuit module.
  • the purpose of partitioning is to reduce the influence of electromagnetic waves generated by the electronic component 200 in the molded circuit module on other electronic components 200 in the molded circuit module.
  • the partition member 300 may be used as necessary when the following circumstances exist, and is not essential.
  • the electronic component 200A shown in FIG. 1C is a high-frequency oscillator, a strong electromagnetic wave is emitted from the electronic component 200A.
  • the other electronic component 200 is replaced with an electronic component.
  • the electronic component 200A is particularly susceptible to electromagnetic waves produced by other electronic components 200. In such a case, the electronic component 200A is protected from electromagnetic waves produced by the other electronic components 200. There is a need. In any case, it is preferable to shield electromagnetic waves between the electronic component 200 ⁇ / b> A and the other electronic component 200. This is made possible by the partition made by the partition member 300.
  • the partition member 300 is made of a metal having conductivity so as to shield electromagnetic waves. In the manufactured molded circuit module, the partition member 300 is electrically connected to the ground electrode 110 directly or via a shield layer described later. It has become.
  • the partition member 300 is an electronic component 200 (not necessarily only one) when the substrate 100 is viewed in plan by a partition made by the partition member 300 alone or by a partition made by the partition member 300 and a shield layer described later. It is designed as a shape that can be enclosed. Although not limited to this, the partition member 300 in this embodiment has a shape as shown in FIG.
  • the partition member 300 is connected to a ceiling 310 that is a triangle when viewed in plan, more specifically a right triangle, and two sides other than the oblique sides of the ceiling 310, and adjacent ones thereof are connected to each other.
  • the rectangular side wall portion 320 is formed.
  • the partition made by the partition member 300 in this embodiment is electrically connected to the shield layer when the molded circuit module is completed.
  • the partition member 300 may be attached to the substrate 100 in any manner.
  • the partition member 300 can be attached to the substrate 100 by bonding.
  • the grounding electrode 110 and the partitioning member 300 are designed as such, and the grounding electrode 110 and the grounding electrode 110 can be connected with a known conductive adhesive or the like. What is necessary is just to adhere
  • the lower end of the side wall portion 320 of the partition member 300 is brought into contact with the grounding electrode 110 that has been exposed from the beginning of the substrate 100 or exposed from the substrate 100 by scraping the surface of the substrate 100. Can be made.
  • the partition member 300 only needs to be electrically connected to the ground electrode 110 as a result.
  • the partition member 300 may be in direct contact with the grounding electrode 110 or indirectly in contact with the grounding electrode 110 via another conductive metal (for example, a shield layer). Also good. And of course, if one of these is achieved, the other need not be achieved.
  • Other examples of the partition member 300 are shown in FIGS. 2B, 2C, and 2D.
  • Each partition member 300 shown in each figure includes a ceiling portion 310 and a side wall portion 320.
  • a plurality of ceiling holes 311 which are openings are formed in the ceiling portion 310 of the partition member 300 shown in FIGS. 2B, 2C, and 2D.
  • the ceiling hole 311 is a hole for allowing the first resin 400 to flow into the partition member 300 when the first resin 400 is filled, and prevents the partition member 300 and the first resin 400 from being separated after curing. It plays a role.
  • a plurality of side wall holes 321 that are openings are formed in the side wall portion 320 of the partition member 300 shown in FIG.
  • the side wall holes 321 serve to prevent the partition member 300 and the first resin 400 from being separated after the first resin 400 is cured.
  • a resin sealing method such as molding or potting can be used.
  • a vacuum printing method is used. According to the vacuum printing method, it is possible to prevent fine bubbles from being mixed into the molded first resin 400, and it is possible to omit the defoaming process for removing the fine bubbles.
  • the vacuum printing method can be performed using a known vacuum printing machine.
  • VE500 (trademark) which is a vacuum printing sealing device manufactured and sold by Toray Engineering Co., Ltd.
  • the principle of the vacuum printing method will be briefly described with reference to FIG.
  • the substrate 100 is placed between, for example, a metal mask 450 which is a metal mask.
  • a squeegee 460 that is rod-shaped while supplying the first resin 400 in an uncured state and whose length direction is perpendicular to the paper surface in FIG. 3 is shown on the one side shown in FIG. It moves from the position located on the metal mask 450 toward the metal mask 450 on the other side as viewed in FIG.
  • the upper surface of the first resin 400 is leveled by the lower surface of the squeegee 460 and covers the surface of the substrate 100 without any gap while entering between the electronic components 200.
  • the vacuum printing method is performed in a state where the substrate 100, the metal mask 450, and the squeegee 460 are all placed in a vacuum chamber (not shown) in which a vacuum is drawn. Therefore, there is no room for bubbles to enter the first resin 400.
  • the squeegee 460 is moved as shown in FIG. 3, the distance or height of the squeegee 460 from the substrate 100 is usually constant.
  • the first resin 400 covering the substrate 100 is cured by setting an appropriate time.
  • a ceiling hole 311 is provided in the ceiling part 310 of the partition member 300, and a side wall hole 321 is provided in the side wall part 320 of the partition member 300.
  • the first resin 400 before curing enters the partition member 300 from them.
  • the side wall hole 321 provided in the side wall part 320 of the partition member 300 shown in FIG. 2D is hardened in a state where the first resin 400 wraps around the side wall hole 321, so that the partition member 300 The function of fixing the first resin 400 better is exhibited. Even when the below-described process of scraping the upper portion of the first resin 400 is performed, when the ceiling portion 310 of the partition member 300 remains in the first resin 400, the ceiling hole 311 of the ceiling portion 310 also has the same function. Will have.
  • the first resin 400 has a filling property for entering between the electronic components 200 (this is a property before curing), adhesion with the electronic component 200 or the substrate 100, and a property that does not cause warping (these Is a property after curing.
  • the first resin 400 may have the following characteristics. If it is the 1st resin 400 which has the following characteristic, the 1st resin before hardening and after hardening will satisfy the above-mentioned characteristic.
  • the characteristics of the first resin 400 that is preferably satisfied are, as far as the characteristics before curing, the ratio of the filler to the total amount of the first resin including the filler is 80% by weight or more, and the characteristics after curing are linear.
  • the expansion coefficient ( ⁇ 1) is 11 ppm / TMA or less
  • the linear expansion coefficient ( ⁇ 2) is 25 ppm / TMA or less
  • the 25 ° C. elastic modulus is 15 GPa / DMA or more.
  • the resin composition product number: CV5385 (trademark) which Panasonic Corporation manufactures and sells can be mentioned.
  • These resin compositions contain silica (as filler), epoxy resin, curing agent, modifier and the like.
  • the resin composition contains only one type of resin. Therefore, the main resin in the present application of the first resin 400 is an epoxy resin.
  • the first resin 400 includes a filler, but the above-described resin composition (product number: CV5385) includes a filler.
  • the amount of filler contained in these resin compositions is 83%, which is 80% or more by weight with respect to the entire first resin 400.
  • the filler is made of a material having a small linear expansion coefficient, and is usually made of silica. Further, in order to satisfy the filling property of the first resin 400, the filler preferably has a particle size of 30 ⁇ m or less. Both of the fillers contained in the above-described two resin compositions described above satisfy these conditions.
  • the linear expansion coefficient ( ⁇ 1) after curing of the above-described resin composition illustrated is 11 ppm / TMA
  • the linear expansion coefficient ( ⁇ 2) after curing is 25 ppm / TMA
  • the 25 ° C. elastic modulus after curing is 15 GPa / DMA. Yes, satisfying the above-mentioned preferable conditions.
  • the upper part of the first resin 400 is removed.
  • the main purpose of this is to reduce the thickness of the finally obtained molded circuit module by reducing the thickness of the first resin 400 on the substrate 100.
  • the 1st resin 400 located above the position shown with the broken line L of FIG.1 (e) among the 1st resin 400 is removed.
  • the state which removed the 1st resin 400 located above the position shown with the broken line L is shown by FIG.1 (f).
  • the upper surface of the first resin 400 after removing the first resin 400 positioned above the broken line L is parallel to one surface of the substrate 100.
  • the first resin 400 after the first resin 400 positioned above the broken line L is removed from the uppermost portion when the tallest electronic component 200 is the electronic component 200B.
  • the distance to the upper surface is between 30 ⁇ m and 80 ⁇ m.
  • the partition member 300 when removing the portion of the first resin 400 located above the broken line L, together with the first resin 400, the upper side of the ceiling portion 310 and the side wall portion 320 of the partition member 300. A certain range of is also removed.
  • the partition member 300 is in a state in which only the side wall portion 320 remains in the first resin 400.
  • the side wall portion 320 of the partition member 300 remaining in the first resin 400 serves as a partition that partitions the first resin 400.
  • the upper portion of the partition member 300 is not necessarily removed together with the first resin 400 when the portion of the first resin 400 positioned above the broken line L is removed.
  • the height of the partition member 300 is designed such that the ceiling portion 310 is lower than the broken line L.
  • a suitable known technique can be used for the method of removing the portion of the first resin 400 located above the broken line L.
  • the first resin 400 can be removed by a cutting device such as a milling machine or a polishing cutting device such as a dicer.
  • the upper surface of the first resin 400 (the surface facing the substrate 100) that is parallel to the substrate 100 is covered with the second resin 500, and the second resin 500 is cured.
  • the reason why the upper surface of the first resin 400 is covered with the second resin 500 is to prevent the filler contained in the first resin 400 from dropping off from the first resin 400.
  • At least a portion of the upper surface of the first resin 400 that is covered with a shield layer described later is covered with the second resin 500.
  • the second resin 500 contains no filler.
  • the material of the second resin 500 is selected from those having high adhesion to the first resin 400 of the second resin 500 after being cured.
  • an epoxy resin or an acrylic resin can be used as the material of the second resin 500.
  • the main resin of the first resin 400 is an epoxy resin as described above, the epoxy resin can be used as the material of the second resin 500 in this embodiment.
  • the second resin 500 is an epoxy resin, although not limited to this.
  • the thickness of the second resin 500 is preferably as thin as possible within a range where the following two conditions are satisfied. First, since the 2nd resin 500 plays the role which hold
  • the second resin 500 covers the entire upper surface of the first resin 400.
  • a known technique can be used as the technique used to coat the upper surface of the first resin 400 with the second resin 500.
  • the upper surface of the first resin 400 can be covered with the second resin 500 by spray application using a spray device.
  • the second resin 500 coated with the first resin 400 is cured by putting an appropriate time.
  • the surface of the second resin 500 is roughened.
  • the surface of the second resin 500 is roughened so that a shield layer, which will be described later, is better adhered to the surface of the second resin 500, and the purpose is achieved. Since the technique for roughening the surface of the resin is known or well known, such as etching using a strong acid or strong alkali, the technique may be used for roughening the surface of the second resin 500.
  • Half-cut is a process of making a groove-like cut 100X in the second resin 500, the first resin 400, and the substrate 100.
  • the range into which the incision 100X is made is a range having a predetermined width across the boundary line between adjacent sections 120.
  • the depth of the cut 100X is not limited to this, but in this embodiment, the depth reaches the grounding electrode 110 in the substrate 100. As a result, the end face of the ground electrode 110 is exposed at the periphery of each section 120 after the half-cut process.
  • the width of the cut 100X is not limited to this, but is, for example, 200 ⁇ m to 400 ⁇ m.
  • the width of the cut 100X is determined by the characteristics of the first resin 400, the blade width of a dicer used for half-cutting, and the like.
  • a known technique can be used for the half-cut process.
  • half cut processing can be performed using a DFD641 (trademark), which is a full-auto dicing saw manufactured and sold by Disco Corporation, with a blade having an appropriate width.
  • the shield layer 600 protects the electronic component 200 included in the molded circuit module from electromagnetic waves caused by the electronic components outside the molded circuit module. Alternatively, the electronic component outside the molded circuit module is protected from electromagnetic waves caused by the electronic component 200 in the molded circuit module.
  • the shield layer 600 is formed of a conductive metal suitable for shielding electromagnetic waves.
  • the shield layer 600 may be a single layer or a multilayer. When the shield layer 600 is a multilayer, the metal constituting each layer can be different.
  • the shield layer 600 of this embodiment is, but not limited to, two layers, a first metal coating layer 610 made of a first metal, which is a metal having excellent characteristics for electric field shielding, and characteristics excellent for magnetic field shielding. It is formed so as to include two layers of a second metal covering layer 620 made of a second metal that is a metal having a (FIG. 4).
  • a first metal coating layer 610 made of a first metal
  • a second metal covering layer 620 made of a second metal that is a metal having a (FIG. 4).
  • copper or iron can be used as the first metal.
  • nickel can be used as the second metal.
  • copper is used as the first metal and nickel is used as the second metal.
  • Either the first metal coating layer 610 or the second metal coating layer 620 may be exposed to the outside.
  • the second metal coating layer 620 is exposed to the outside.
  • the shield layer 600 is provided on the surface of the second resin 500 and the side surface of the first resin 400 and the side surface of the substrate 100 that are to be exposed to the outside by performing half-cutting.
  • the shield layer 600 is electrically connected to the grounding electrode 110 included in the substrate 100 on the side surface of the substrate 100.
  • the shield layer 600 includes two sides facing the sides connecting the side wall portions 320 among the side wall portions 320 of the partition member 300 constituting the partition (these are due to the half-cut process being performed.
  • the first resin 400 is exposed from the side surface of the first resin 400, and the first resin 400 is electrically connected to the side surface.
  • the partition member 300 is electrically connected to the ground electrode 110 through the shield layer 600.
  • the partition member 300 may already be electrically connected to the grounding electrode 110 at the lower end without the shield layer 600 being interposed.
  • the shield layer 600 can be electrically connected to the grounding electrode 110 via the partition member 300 without being directly connected to the end face of the grounding electrode 110 at the lower end thereof.
  • the shield layer 600 can be formed by applying a paste containing metal powder or by plating.
  • the formation method of each layer may or may not be the same.
  • the first metal coating layer 610 and the second metal coating layer 620 are formed by the same method.
  • the plating is not limited to a wet dry type.
  • wet plating is electroless plating.
  • dry plating include physical vapor deposition (PVD) and chemical vapor deposition (CVD).
  • PVD physical vapor deposition
  • CVD chemical vapor deposition
  • wet plating should be selected in terms of cost and the aspect of reducing the residual stress in the shield layer 600.
  • the thickness of the shield layer 600 can be increased, more specifically, several ⁇ m to several tens ⁇ m, and a sufficient thickness can be easily obtained to shield electromagnetic waves.
  • wet plating includes electroless plating and electrolytic plating.
  • both the first metal coating layer 610 and the second metal coating layer 620 are formed by electroless plating.
  • a full cut process is performed to divide the substrate 100 into the respective sections 120 along the cuts 100X made by performing the half cut (FIG. 1 (j)).
  • a known technique can be used for the full cut processing.
  • full cutting can be performed by mounting and using a blade having an appropriate width on the above-described full-auto dicing saw DFD641 (trademark). Thereby, a mold circuit module is obtained one by one from each section of the substrate 100.
  • FIG. 5 is a sectional view of the molded circuit module M obtained by the above method
  • FIG. 6 is a perspective plan view of the molded circuit module M.
  • the substrate 100 included in the molded circuit module M is covered with the first resin 400 together with the electronic component 200.
  • the upper surface of the first resin 400 is covered with the second resin 500.
  • the upper surface of the second resin 500, the side surfaces of the first resin 400 and the second resin 500, and the side surface of the substrate 100 exposed by the half cut are covered with a shield layer 600.
  • the shield layer 600 includes the first metal coating layer 610 and the second metal coating layer 620, which are electrically connected to the side surface of the grounding electrode 110 inside the substrate 100 as shown in FIG. is doing.
  • the second resin 500 exists in the portion of the shield layer 600 that covers the first resin 400 via the second resin 500, the dropout caused by the filler dropping off from the first resin 400 is It is unrelated.
  • the portion of the shield layer 600 that covers the side surface of the first resin 400 covers the first resin 400 without the second resin 500 interposed therebetween.
  • the side surface of the first resin 400 is covered by the half-cut process. Since it is in a somewhat rough state, the adhesion of the shield layer 600 to the first resin 400 is high, and it is difficult for the first resin 400 to fall off from the side surface.
  • the shield layer 600 includes two sides of the side wall portion 320 of the partition member 300 that constitute the partition, the sides facing the side connecting the side wall portions 320, and the first resin 400. Conducted on the side.
  • the electronic component 200 ⁇ / b> A is surrounded by two side surfaces by the side wall portion 320, two side surfaces by the shield layer 600, and the upper surface by the shield layer 600.
  • the method for manufacturing the molded circuit module of Modification 1 is generally the same as that described in the above embodiment. More specifically, the process described in FIG. 1G is exactly the same as that in the above-described embodiment until the upper surface of the first resin 400 is covered with the second resin 500 and the second resin 500 is cured. .
  • the method for manufacturing a molded circuit module according to Modification 1 is different from the above-described embodiment in that a part of the shield layer 600 on the upper surface of the manufactured molded circuit module does not exist and is open. It is necessary to provide an opening in a part of the shield layer 600 in the following cases, for example.
  • the electronic component 200 when the electronic component 200 is a transceiver, the electronic component 200 must communicate with an external electronic component, for example, by radio waves.
  • the shield layer 600 that shields electromagnetic waves hinders communication by radio waves. Therefore, by providing a range necessary for such communication, for example, a range where the shield layer 600 does not exist immediately above the electronic component 200 that performs communication, and setting the range as an opening of the shield layer 600, the electronic components included in the molded circuit module Of the components 200, those that perform communication can be communicated, and at the same time, the other electronic components 200 can be surrounded by the shield layer 600.
  • making the opening in the shield layer 600 according to the circumstances is the main point of the method for manufacturing the molded circuit module of the first modification.
  • a mask 700 is overlaid on the surface of the second resin 500 (FIG. 7A).
  • the mask 700 is a mold for forming a layer made of a plating resist described later.
  • the mask 700 may be a known one, the mask 700 has a sheet shape, and a mask opening 710 is provided at a position where a layer of plating resist is to be formed.
  • one mask opening 710 is provided for each section 120 and at a common position in the section 120.
  • a plating resist 800 is applied from above the mask 700 (FIG. 7B).
  • the plating resist 800 is made of a material such that the shield layer 600 is not formed on the surface thereof.
  • the plating resist 800 in this embodiment is made of a material that does not adhere to the surface when plating, more specifically, electroless plating is performed. Since the plating resist is well known, its description is omitted.
  • the plating resist 800 adheres to the surface of the second resin 500 at a portion corresponding to the mask opening 710 of the mask 700 and does not adhere to the surface of the second resin 500 at a portion covered with the mask 700.
  • the mask 700 is removed (FIG. 7C).
  • the layer made of the plating resist 800 remains on an appropriate portion of the surface of the second resin 500.
  • the electronic component 200 ⁇ / b> C immediately below the portion where the plating resist 800 is present can be an electronic component 200 that is more advantageous when the shield layer 600 is not present, such as the above-described transceiver.
  • a shield layer 600 having the same two-layer structure as that described in the above embodiment is formed by the same method as that described in the above embodiment (FIG. 7E).
  • the shield layer 600 is formed in a portion where the layer made of the plating resist 800 does not exist, but is not formed in a portion where the layer made of the plating resist 800 exists.
  • the plating resist 800 is removed, and a full-cut process similar to that in the above-described embodiment is performed, whereby a molded circuit module having an opening 630 at a desired position of the shield layer 600 is completed (FIG. 7 ( f)).

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

L'objectif de la présente invention est de réduire l'épaisseur d'un module de circuit moulé. Un procédé de production d'un module de circuit moulé comprend : une première étape de revêtement dans laquelle la totalité d'une surface d'un substrat, qui présente, à la surface, une pluralité de compartiments virtuels disposés les uns à côté des autres, au moins un composant électronique monté sur chacun des compartiments de la première surface, et qui est pourvu d'électrodes de mise à la terre, est revêtu d'une première résine comprenant une charge, de telle sorte que tous les composants électroniques sont revêtus de celle-ci, et la première résine est durcie; une première étape de moulage de résine dans laquelle la surface de la première résine durcie est ébarbée de sorte que la surface devienne parallèle à la surface du substrat; et une étape de découpage complet dans laquelle une pluralité de modules de circuit moulés sur la base de chacun des compartiments sont obtenus par découpage du substrat au niveau des limites des compartiments, et par séparation de chacun des compartiments.
PCT/JP2014/082957 2014-12-12 2014-12-12 Module de circuit moulé et son procédé de production WO2016092694A1 (fr)

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JP2015539896A JPWO2016092694A1 (ja) 2014-12-12 2014-12-12 モールド回路モジュール及びその製造方法

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Cited By (3)

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Publication number Priority date Publication date Assignee Title
JP2018093014A (ja) * 2016-12-01 2018-06-14 太陽誘電株式会社 無線モジュール、およびその製造方法
WO2018159290A1 (fr) * 2017-02-28 2018-09-07 株式会社村田製作所 Composant électronique doté d'une couche de blindage à film mince
US10714822B2 (en) 2016-12-01 2020-07-14 Taiyo Yuden Co., Ltd. Wireless module and method for manufacturing wireless module

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WO2007083352A1 (fr) * 2006-01-17 2007-07-26 Spansion Llc Dispositif semi-conducteur et son procédé de fabrication
JP2010219210A (ja) * 2009-03-16 2010-09-30 Renesas Electronics Corp 半導体装置およびその製造方法
JP2010278421A (ja) * 2009-04-27 2010-12-09 Murata Mfg Co Ltd 電子部品の製造方法
JP2014107372A (ja) * 2012-11-27 2014-06-09 Taiyo Yuden Co Ltd 回路モジュール及びその製造方法
JP2014146624A (ja) * 2013-01-25 2014-08-14 Murata Mfg Co Ltd モジュールおよびその製造方法

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Publication number Priority date Publication date Assignee Title
WO2007083352A1 (fr) * 2006-01-17 2007-07-26 Spansion Llc Dispositif semi-conducteur et son procédé de fabrication
JP2010219210A (ja) * 2009-03-16 2010-09-30 Renesas Electronics Corp 半導体装置およびその製造方法
JP2010278421A (ja) * 2009-04-27 2010-12-09 Murata Mfg Co Ltd 電子部品の製造方法
JP2014107372A (ja) * 2012-11-27 2014-06-09 Taiyo Yuden Co Ltd 回路モジュール及びその製造方法
JP2014146624A (ja) * 2013-01-25 2014-08-14 Murata Mfg Co Ltd モジュールおよびその製造方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018093014A (ja) * 2016-12-01 2018-06-14 太陽誘電株式会社 無線モジュール、およびその製造方法
US10714822B2 (en) 2016-12-01 2020-07-14 Taiyo Yuden Co., Ltd. Wireless module and method for manufacturing wireless module
US10868364B2 (en) 2016-12-01 2020-12-15 Taiyo Yuden Co., Ltd. Wireless module and method for manufacturing the same
WO2018159290A1 (fr) * 2017-02-28 2018-09-07 株式会社村田製作所 Composant électronique doté d'une couche de blindage à film mince
JPWO2018159290A1 (ja) * 2017-02-28 2019-12-12 株式会社村田製作所 薄膜シールド層付き電子部品
US10964645B2 (en) 2017-02-28 2021-03-30 Murata Manufacturing Co., Ltd. Electronic component with thin-film shield layer

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