WO2016088461A1 - 電子機器 - Google Patents
電子機器 Download PDFInfo
- Publication number
- WO2016088461A1 WO2016088461A1 PCT/JP2015/079579 JP2015079579W WO2016088461A1 WO 2016088461 A1 WO2016088461 A1 WO 2016088461A1 JP 2015079579 W JP2015079579 W JP 2015079579W WO 2016088461 A1 WO2016088461 A1 WO 2016088461A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- fpc
- oled panel
- electrode
- pattern
- wiring
- Prior art date
Links
- 238000002788 crimping Methods 0.000 claims description 12
- 230000007423 decrease Effects 0.000 abstract description 2
- 238000000605 extraction Methods 0.000 description 50
- 239000000758 substrate Substances 0.000 description 16
- 238000000034 method Methods 0.000 description 14
- 238000009826 distribution Methods 0.000 description 10
- IUYHQGMDSZOPDZ-UHFFFAOYSA-N 2,3,4-trichlorobiphenyl Chemical compound ClC1=C(Cl)C(Cl)=CC=C1C1=CC=CC=C1 IUYHQGMDSZOPDZ-UHFFFAOYSA-N 0.000 description 6
- 238000005304 joining Methods 0.000 description 5
- 239000006059 cover glass Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/23—Construction or mounting of dials or of equivalent devices; Means for facilitating the use thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/22—Illumination; Arrangements for improving the visibility of characters on dials
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M2201/00—Electronic components, circuits, software, systems or apparatus used in telephone systems
- H04M2201/38—Displays
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/041—Stacked PCBs, i.e. having neither an empty space nor mounted components in between
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10128—Display
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10128—Display
- H05K2201/10136—Liquid Crystal display [LCD]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
Definitions
- the present invention relates to an electronic device including an organic EL element panel connected to a flexible printed circuit (FPC) substrate.
- FPC flexible printed circuit
- the light guide plate LED has been used in various scenes and applications such as a backlight for LCD (liquid crystal display) as well as general illumination. Since around 2008, the production volume of smart devices (smartphones and tablets) has been increasing, and light guide plate LEDs have been used as key members.
- the light guide plate LED is mainly used as a backlight for the main display (LCD). However, as other uses, the light guide plate LED is often incorporated as a backlight for a common function key button at the bottom of the device. Yes.
- buttons As the common function key buttons, three types are mainly used: home (displayed by a mark such as a rectangle), back (displayed by an arrow mark, etc.), and search (displayed by a magnifying glass mark, etc.).
- a pattern of a mark to be displayed is printed on a cover glass, the light guide plate LED as described above is installed at the bottom of the cover glass, the LED emits light according to a required situation, and the light is guided to the light guide plate. The light is guided through the (film) and is extracted to the display side through a dot-shaped diffusion member printed on the pattern portion (see, for example, Patent Document 1).
- the organic light emitting layer is irradiated with a predetermined pattern of UV light, thereby destroying the organic light emitting layer of the irradiated portion and causing only the pattern of the non-irradiated portion to emit light.
- a method for forming a light emitting pattern has been proposed (see, for example, Patent Document 2). By applying this method, the light emission pattern itself can be formed as compared with the method in which the light guide plate and the LED are combined, so that a panel with low power consumption and high efficiency can be provided.
- the crimping pressure is concentrated on a part depending on the wiring layout of the FPC, and the mounting yield. Will fall.
- the present invention provides an electronic device capable of suppressing a reduction in mounting yield.
- the electronic device of the present invention is an electronic device in which an OLED (Organic Light Emitting Diode) panel and an FPC (Flexible printed Circuit) are connected by pressure bonding using an ACF (Anisotropic Conductive Film), and the FPC is equipped with an OLED panel.
- the pattern is symmetric with respect to a line in a direction orthogonal to a straight line connecting electrodes connected to the OLED panel.
- FIG. 2 is a cross-sectional view taken along line AA of the smart device shown in FIG. It is a plane arrangement view of the icon display part of the smart device. It is a figure which shows the layout of FPC of the part to which an OLED panel is connected. It is a figure which shows the joining method of an OLED panel and FPC. It is a figure which shows the joining method of an OLED panel and FPC. It is a plane arrangement view of the OLED panel and FPC in the icon display part of the electronic device of the first embodiment. It is a figure which shows the layout of FPC of the part to which the OLED panel of the electronic device of 1st Embodiment is connected.
- FIG. 8 is a diagram showing an FPC and an OLED panel in a crimped state in a cross section taken along line AA of the icon display unit shown in FIG. 7. It is a plane arrangement view of the OLED panel and the FPC in the icon display part of the electronic device of the second embodiment. It is a figure which shows the layout of FPC of the part to which the OLED panel of the electronic device of 2nd Embodiment is connected.
- FIG. 12 is a sectional view taken along line AA of the icon display unit shown in FIG. 11.
- FIG. 1 shows a plan view of a smart device as an example of a general electronic device.
- FIG. 2 is a cross-sectional view of the smart device shown in FIG.
- the smart device 10 illustrated in FIGS. 1 and 2 is, for example, a smartphone or a tablet computer.
- FIGS. 1 and 2 only the main components used in the description of the present embodiment are shown, and the description of other components such as the power supply unit is omitted.
- the smart device 10 is provided with a plurality of common function keys 13 in the icon display section 12 below the main display screen 11.
- the common function key 13 is displayed by icons 14, 15, and 16.
- a switch (not shown) is mounted below the common function key 13 displayed by these icons 14, 15, 16, and the lower switch is turned on by touching the icons 14, 15, 16 to switch the function of the smart device 10. It becomes possible.
- the smart device 10 includes a housing 18 that forms the bottom and side surfaces of the smart device 10, each element disposed inside the housing 18, and each element.
- the cover 18 covers the upper part inside the housing 18 and is provided on the entire surface of the smart device 10 on the surface side.
- a main display panel 19 composed of a liquid crystal panel or the like for configuring the main display screen 11, an OLED panel 20 for configuring the icon display unit 12, and various circuits of the smart device 10 are formed.
- the main display panel 19, the OLED panel 20 and the PCB 21, and the FPCs 22 and 23 are crimped and connected by an ACF (Anisotropic Conductive Film) or the like (not shown).
- the main display panel 19 and the OLED panel 20 are connected to the PCB 21 via the FPCs 22 and 23, and are connected to various control units and various circuits provided on the PCB 21.
- power is supplied from a power supply circuit provided in the PCB 21.
- FIG. 3 shows a plan layout of the icon display unit 12.
- the icon display unit 12 is provided with three common function keys, and three icons 14, 15, 16 are provided corresponding to the three common function keys.
- the icons 14, 15 and 16 are formed from individual OLED panels 20.
- the OLED panel 20 includes a cathode electrode (cathode) and an anode electrode (anode) on a substrate 24, and a light emitting layer sandwiched between these electrodes.
- the light emitting layer sandwiched between the cathode electrode and the anode electrode is formed in a predetermined pattern, so that icons 14, 15, and 16 can be displayed on the common function keys.
- a cathode extraction electrode 25 and an anode extraction electrode 26 are provided which are connected to the cathode electrode and the anode electrode and are connected to the outside from the OLED panel 20.
- the cathode extraction electrode 25 and the anode extraction electrode 26 are connected to the PCB 21 and the FPC 23 shown in FIG. 2 through an ACF (Anisotropic Conductive Film) not shown.
- FIG. 4 shows a layout of a portion connected to the OLED panel 20 which is a main part of the FPC 23.
- a wiring 28 is formed on a flexible substrate 27.
- the FPC 23 is provided with electrodes 31 and 32 at positions where the cathode extraction electrode 25 and the anode extraction electrode 26 of the OLED panel 20 are connected.
- the wiring 28 of the FPC 23 is designed so that each OLED panel 20 is connected in series. That is, the anode extraction electrode 26 of the OLED panel 20 is connected to the electrode 31 provided on the wiring 28 side serving as a delivery wiring from the power supply unit. Then, the cathode extraction electrode 25 of the OLED panel 20 is connected to the electrode 32 provided on the wiring 28 side serving as a return wiring to the power supply unit. Further, except for the cathode extraction electrode 25 of the OLED panel 20 arranged on the most return wiring side and the anode extraction electrode 26 of the OLED panel 20 arranged on the most delivery wiring side, the cathode extraction electrode 25 of each OLED panel 20 The anode extraction electrode 26 is connected to the wiring 28. Thereby, each OLED panel 20 is connected in series by the wiring 28.
- FIGS. 5 and 6 correspond to a cross section taken along line AA of the icon display section shown in FIG.
- the electrodes 31 and 32 provided on the wiring 28 are aligned with the cathode extraction electrode 25 and the anode extraction electrode 26 of the OLED panel 20.
- an ACF (not shown) is provided between the OLED panel 20 and the FPC 23.
- the FPC 23 and the OLED panel 20 are pressure-bonded by pressing the pressure-bonding bar 33 of the hot pressing tool from the FPC 23 side.
- the electrodes 31 and 32 of the FPC 23 and the cathode extraction electrode 25 and the anode extraction electrode 26 of the OLED panel 20 are electrically connected by the ACF.
- the pressure at the time of pressure bonding is non-uniform. It becomes. Then, as shown in FIG. 6, the OLED panel 20 and the FPC 23 are displaced. Specifically, if there is a deviation in the layout of the wiring 28 and the electrodes 31 and 32 on the straight line connecting the electrodes 31 and 32 connected to one OLED panel 20, the pressure is concentrated on a part of the FPC 23. The crimping pressure is shifted to one side. For example, as shown in FIG.
- the layout of the portion to which the OLED panel 20 is crimped is designed so that the pressure during crimping does not concentrate on a part. That is, the FPC 23 is laid out so that the FPC 23 has a pressure distribution that does not cause misalignment during pressure bonding.
- the FPC layout is designed so that the wiring and the electrode are symmetrical with respect to the line in the direction orthogonal to the straight line connecting the electrodes connected to the OLED panel.
- the FPC has a pattern that is symmetric with respect to a line in a direction orthogonal to a straight line connecting electrodes connected to the OLED panel.
- the pattern of the electrode and the wiring formed on the FPC is symmetric with respect to a line in a direction orthogonal to the straight line connecting the electrodes, thereby suppressing the biasing pressure to one side.
- FIGS. 1 and 2 are common configuration in the following embodiments. Therefore, in each embodiment, the FPC differs only in wiring and electrode layout, and the OLED panel differs only in electrode arrangement. Other configurations can be the same.
- FIG. 7 shows a planar arrangement of the OLED panel and the FPC in the icon display unit of the electronic device according to the first embodiment.
- the icon display unit 12 is provided with three icons 14, 15, and 16 corresponding to the common function keys.
- the icons 14, 15, and 16 are formed so that they can be displayed by forming the light emitting layer in a predetermined pattern in the individual OLED panel 40. These configurations are the same as the outline of the electronic device described above.
- the OLED panel 40 includes a cathode extraction electrode 41 and an anode extraction electrode 42 that are connected to the cathode electrode and the anode electrode and connected to the outside from the OLED panel 40 on the substrate 24.
- the cathode extraction electrode 41 and the anode extraction electrode 42 are connected to the electrodes 31 and 32 of the FPC 45 by an ACF (Anisotropic Conductive Film) (not shown) or the like.
- FIG. 8 shows a layout of the FPC 45 to which the OLED panel 40 is connected.
- the FPC 45 has a wiring 28 formed on a flexible substrate 46.
- the FPC 45 is provided with electrodes 31 and 32 at positions where the cathode extraction electrode 41 and the anode extraction electrode 42 of the OLED panel 40 are connected. Further, a dummy wiring 47 is provided in the FPC 45.
- FIG. 9 and 10 show a cross section of the icon display section. 9 and 10 correspond to a cross section taken along line AA of the icon display unit shown in FIG.
- FIG. 9 shows a state in which the FPC 45 and the OLED panel 40 before bonding are aligned.
- FIG. 10 shows a state in which the FPC 45 and the OLED panel 40 are pressed against each other by pressing the pressing bar 33 of the hot pressing tool from the FPC 45 side.
- the connection between the FPC 45 and the OLED panel 40 is made by electrodes 31 and 32 protruding from the flexible substrate 46, a cathode extraction electrode 41 and an anode extraction electrode 42 protruding from the substrate 24.
- Each is done. For this reason, when the crimping pressure is shifted in one direction in the direction in which the electrodes to be connected are arranged, as shown in FIG. For this reason, in order to prevent the position shift between the FPC 45 and the OLED panel 40, it is sufficient that the pressure distribution is such that no position shift occurs in the direction in which the electrodes to be connected are arranged.
- the OLED panel 40 is arranged in the direction in which the electrodes to be connected are arranged in order to distribute the crimping pressure so that positional displacement does not occur.
- the portion where the FPC 45 is disposed may be a layout with less pattern deviation.
- the FPC 45 may be arranged so that each pattern is symmetrical in the direction in which the pair of electrodes 31 and 32 connected to one OLED panel 40 are arranged. Since the range in which the symmetry of the pattern is required for the FPC 45 may be within the range where the pressure is applied, it may be within the range where the OLED panel 40 is disposed as described above.
- FIG. 8 shows a layout of the FPC 45 in which each pattern of the FPC 45 is symmetric in the direction in which the pair of electrodes 31 and 32 connected to the one OLED panel 40 is arranged.
- a line passing through the center of the electrode 31 and the center of the electrode 32 is a straight line 50.
- a symmetry axis 51 in which each pattern of the FPC 45 is symmetric is located in a direction orthogonal to the straight line 50. That is, each pattern of the FPC 45 is laid out so as to be symmetric with respect to the symmetry axis 51.
- the symmetry axis 51 is located between the electrode 31 and the electrode 32.
- the electrode 31 and the electrode 32 are arranged at symmetrical positions on the symmetry axis 51.
- a dummy wiring 47 is provided at a position that is symmetric with respect to the wiring 28 and the symmetry axis 51.
- the cathode extraction electrode 41 and the anode extraction electrode 42 of the OLED panel 40 are also provided at positions along the symmetry of the FPC 45. That is, the OLED panel 40 is disposed at a position where the cathode extraction electrode 41 and the anode extraction electrode 42 of the OLED panel 40 are symmetric with respect to the symmetry axis 51. Further, in the OLED panel 40, the cathode extraction electrode 41 and the anode extraction electrode 42 are provided at positions symmetrical with respect to the symmetry axis 51 at positions on the FPC 45 to which the OLED panel 40 is connected.
- Such a layout reduces the deviation of the pattern of the FPC 45 in the portion where the OLED panel 40 is arranged in the direction in which the electrodes to be connected are arranged. For this reason, as shown in FIG. 10, the pressure at the time of crimping is distributed evenly on both sides in the direction of the straight line 50 around the symmetry axis 51. Therefore.
- thermocompression bonding is performed using the pressure bonding bar 33 of the thermo-pressurization tool, it is possible to obtain a pressure distribution that does not cause misalignment between the OLED panel 40 and the FPC 45.
- the pattern of the FPC 45 is symmetrically arranged on the symmetry axis 51 as described above at the connection position of the OLED panel 40, it is possible to suppress the positional deviation due to the uneven pressure distribution. For this reason, in manufacture of an electronic device, the fall of the mounting yield in the mounting process of an OLED panel can be suppressed.
- the electrode 31 and the electrode 32 are formed in the same shape.
- the width of the wiring 28 on the straight line 50 and the length (width) of the dummy wiring 47 in the straight line 50 direction are preferably the same.
- the dummy wiring 47 is not connected to the wiring 28, and an independent island shape is shown for each portion where the OLED panel 40 is disposed, but other configurations may be used.
- it can be a dummy wiring pattern that is continuous under the plurality of OLED panels 40 to be arranged. Further, the length and size of the dummy wiring can be arbitrarily changed.
- connection between the FPC 45 and the OLED panel 40 is a connection between the protruding electrodes
- the shape of the pattern in the direction in which the protruding electrodes are arranged greatly affects the pressure distribution during the pressure bonding.
- the influence of the pattern on the pressure distribution is small.
- at least the length of the dummy wiring 47 in the direction of the symmetry axis 51 is preferably equal to or longer than the length of the electrodes 31 and 32 in the direction of the symmetry axis 51.
- the substrate 24, the cathode extraction electrode 41, and the anode extraction electrode 42 are formed symmetrically with respect to the symmetry axis 51. That is, it is preferable that the symmetry axis 51 is located at the center between the cathode extraction electrode 41 and the anode extraction electrode 42, and the center of the OLED panel 40 in the direction of the straight line 50 coincides with the symmetry axis 51.
- FIG. 11 shows a planar arrangement of the OLED panel and the FPC in the icon display section of the electronic device of the second embodiment.
- the icon display unit 12 is provided with three icons 14, 15, 16 corresponding to the common function keys.
- the icons 14, 15, and 16 are formed so that they can be displayed by forming the light emitting layer in a predetermined pattern in the individual OLED panel 60. These configurations are the same as the outline of the electronic device described above.
- the OLED panel 60 is connected to the cathode electrode and the anode electrode on the substrate 24, and is provided with a cathode extraction electrode 61 and an anode extraction electrode 62 for connecting to the outside from the OLED panel 60.
- the cathode extraction electrode 61 and the anode extraction electrode 62 are connected to the electrodes 72 and 73 of the FPC 70 by an ACF (Anisotropic Conductive Film) (not shown) or the like.
- the OLED panel 60 is provided with a dummy electrode 63.
- the dummy electrode 63 of the OLED panel 60 is connected to a dummy electrode 74 provided on the FPC 70 by an ACF (not shown).
- FIG. 12 shows a layout of the FPC 70 to which the OLED panel 60 is connected.
- the FPC 70 has a wiring 75 formed on a flexible substrate 71.
- the FPC 70 is provided with electrodes 72 and 73 at positions where the cathode extraction electrode 61 and the anode extraction electrode 62 of the OLED panel 60 are connected.
- a dummy electrode 74 is provided on the FPC 70.
- the dummy electrode 74 is provided at a position where the dummy electrode 74 is connected to the wiring 75 serving as the return wiring along the direction in which the pair of electrodes 72 and 73 connected to one OLED panel 60 are arranged.
- a dummy electrode 63 is provided on the OLED panel 60 in accordance with the position of the dummy electrode 74 of the FPC 70, and the dummy electrode 74 of the FPC 70 and the dummy electrode 63 of the OLED panel 60 are connected as shown in FIG.
- the electrodes 72 and 73 of the FPC 70 connected to one OLED panel 60 and the dummy electrodes 74 of the FPC 70 are arranged in a line. Further, in the OLED panel 60, the cathode extraction electrode 61, the anode extraction electrode 62, and the dummy electrode 63 are arranged in a line in accordance with the electrodes 72 and 73 and the dummy electrode 74 of the FPC 70.
- a line passing through the center of the pair of electrodes 72 connected to one OLED panel 40 and the center of the electrode 73 is a straight line 50.
- a symmetry axis 51 where the pattern is symmetric is located. That is, each pattern of the FPC 70 is laid out so as to be symmetric with respect to the symmetry axis 51.
- the symmetry axis 51 is located at the center of the electrode 73, and the electrode 73 is formed in a shape that is symmetric with respect to the symmetry axis 51. Further, a dummy electrode 74 is provided at a position symmetrical to the electrode 72 on the symmetry axis 51.
- the pattern of the FPC 70 within the range where the OLED panel 60 is arranged is symmetric with respect to the symmetry axis 51 in the direction in which the pair of electrodes 72 and 73 connected to one OLED panel 60 are arranged. Become.
- the cathode extraction electrode 61, the anode extraction electrode 62, and the dummy electrode 63 of the OLED panel 60 are also provided at positions along the symmetry of the FPC 70.
- the symmetry axis 51 is positioned at the center of the cathode extraction electrode 61, and the dummy electrode 63 is provided at a position symmetrical to the anode extraction electrode 62 on the symmetry axis 51.
- the dummy electrode 63 of the OLED panel 60 is formed as an independent pattern that is not connected to the configuration of the electrode of the organic EL element formed on the OLED panel 60.
- the dummy electrode 74 is formed on the wiring 75 serving as the return wiring, it is not necessary to newly provide a region for forming the dummy electrode 74 on the flexible substrate 71, and the FPC 70 can be downsized. Further, the FPC 70 is advantageous in miniaturization because it is not necessary to newly form an extra pattern such as a dummy wiring by effectively using the wiring 75 which is an essential configuration.
- the FPC 70 By arranging the FPC 70 to be symmetric with respect to the symmetry axis 51 as described above, as shown in FIG. 13, when the FPC 70 and the OLED panel 60 are joined, the pressure at the time of crimping is centered on the symmetry axis 51. It is evenly distributed on both sides of the straight line 50 direction. For this reason, if the pattern of the FPC 70 is arranged symmetrically at the connection position of the OLED panel 60, it is possible to suppress the positional deviation due to the uneven pressure distribution.
- each electrode formed in FPC and each electrode formed in an OLED panel can be made into arbitrary shapes.
- the electrodes provided at symmetrical positions have the same shape.
- the pressure distribution during the crimping does not deviate.
- the pattern which becomes symmetric about a symmetry axis should just be the arrangement
- the symmetrical pattern includes a pattern having such an arrangement.
- the pair of electrodes (dummy electrodes) that are symmetric with respect to the symmetry axis may be arranged so that at least a part thereof overlaps with the electrode (dummy electrode) that is symmetric when folded back with respect to the symmetry axis.
- the dummy wiring pattern it suffices if the dummy wiring is formed at a position where at least a part of the wiring at a position symmetrical with respect to the axis of symmetry overlaps.
- the FPC may be a wiring, an electrode, or another pattern as long as it is a layout that is symmetric with respect to the symmetry axis. What is necessary is just to lay out the turn of FPC so that these patterns may be combined and symmetrical about the axis of symmetry.
- the delivery wiring may be arranged instead of the dummy wiring, and the delivery wiring and the return wiring may be laid out so as to be symmetric with respect to the symmetry axis.
- other wiring patterns may be formed instead of dummy wirings as long as the symmetry is not impaired.
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Signal Processing (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Manufacturing & Machinery (AREA)
- Optics & Photonics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
- Combinations Of Printed Boards (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
2008年頃から、特にスマートデバイス(スマートフォン、タブレット)の生産量が伸び、導光板LEDがキー部材として使用されている。主にメインディスプレイ(LCD)のバックライト用途として導光板LEDが用いられるが、その他の使用用途として、デバイス下部にある共通機能キーボタンのバックライトとしても導光板LEDが組み込まれることが多くなっている。共通機能キーボタンとして、主にホーム(四角形などのマークで表示)、戻る(矢印マークなどで表示)、検索(虫眼鏡マークなどで表示)の3種類が使用されることが多い。一般的には、カバーガラスに表示したいマークのパターンを印刷しておき、カバーガラスの下部に上記のような導光板LEDを設置し、必要な場面に応じてLEDが発光し、光が導光板(フィルム)を通して導光され、パターン部分に印刷されたドット形状の拡散部材を通して表示側へ光を取り出す構成になっている(例えば、特許文献1参照)。
ここで、FPCとガラス基板パネルとの実装方法として、FPCとガラス基板パネルとの電気的コンタクト部分にACF(Anisotropic Conductive Film)を用いて圧着接続する方法がある(例えば、特許文献3参照)。また、パネルとFPCの線膨張係数の違いに起因するFPCの断線を防止するために、FPCにダミーパターンを配置する方法がある(例えば、特許文献4参照)。
なお、説明は以下の順序で行う。
1.電子機器の概要
2.電子機器の第1実施形態
3.電子機器の第2実施形態
電子機器の実施形態の説明に先立ち、電子機器の概要について説明する。
図1に、一般的な電子機器の一例として、スマートデバイスの平面図を示す。また、図1に示すスマートデバイスのA-A線断面図を図2に示す。図1及び図2に示すスマートデバイス10は、例えば、スマートフォンやタブレット型コンピュータ等である。なお、図1及び図2においては、本実施形態の説明に用いる主要な構成のみを示し、電源部等のその他の構成については記載を省略している。
メイン表示パネル19、OLEDパネル20及びPCB21と、FPC22,23とは、図示しないACF(Anisotropic Conductive Film)等により圧着接続されている。
まず、図5に示すように、配線28上に設けられた電極31,32と、OLEDパネル20のカソード取り出し電極25及びアノード取り出し電極26とを位置合わせをする。このとき、OLEDパネル20とFPC23との間に図示しないACFを設ける。
具体的には、1つのOLEDパネル20に接続される電極31,32を結ぶ直線上において、配線28及び電極31,32のレイアウトに偏りがあると、圧着圧力が一部に集中し、FPC23の圧着圧力が一方に片寄る。例えば、図6に示すように、配線28側に圧力が片寄ることにより、FPC23の位置が配線28側にずれる。この結果、FPC23の電極31,32と、OLEDパネル20のカソード取り出し電極25及びアノード取り出し電極26との接続信頼性が低下する。
従って、電子機器において、OLEDパネルの実装工程における実装歩留まりの低下という課題が発生する。
FPCに形成される電極と配線のパターンが、電極間を結ぶ直線と直行する方向の線に対して対称となることにより、圧着圧力の一方への偏りを抑制する。これにより、FPCにOLEDパネルを圧着する際に、FPCとOLEDパネルとが位置ずれを起こさない圧力分布とすることができる。
これにより、電子機器において、OLEDパネルの実装歩留まりの低下を抑制することいができる。
以下、電子機器の第1実施形態について説明する。第1実施形態の電子機器のアイコン表示部における、OLEDパネルとFPCとの平面配置を図7に示す。
このようなレイアウトとすることにより、1つのOLEDパネル40に接続される対となる電極31,32が並ぶ方向において、OLEDパネル40が配置される範囲内のFPC45のパターンが対称軸51で対称となる。
以下、電子機器の第2実施形態について説明する。第2実施形態の電子機器のアイコン表示部における、OLEDパネルとFPCとの平面配置を図11に示す。
また、FPC70の電極72,73と及びダミー電極74に合わせて、OLEDパネル60においても、カソード取り出し電極61、アノード取り出し電極62、及び、ダミー電極63が一列に並ぶように配置されている。
Claims (6)
- OLED(Organic Light Emitting Diode)パネルと、FPC(Flexible printed circuit)とが、ACF(Anisotropic Conductive Film)を用いて圧着接続された電子機器において、
前記FPCは、前記OLEDパネルが搭載される範囲内で、前記OLEDパネルと接続される電極間を結ぶ直線と直行する方向の線に対して、対称となるパターンを有する
電子機器。 - 前記OLEDパネルと接続される電極間を結ぶ直線の延長線上において、前記FPCが対称となるパターンを有する請求項1に記載の電子機器。
- 前記パターンが対称となる対称軸が、前記FPCの前記電極間に位置する請求項1に記載の電子機器。
- 前記OLEDパネルと接続される電極間を結ぶ直線の延長線上において、ダミー配線パターンを有する請求項1に記載の電子機器。
- 前記OLEDパネルと接続される電極間を結ぶ直線の延長線上において、ダミー電極を有する請求項1に記載の電子機器。
- 前記ダミー電極が戻り配線に接続されている請求項5に記載の電子機器。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/517,109 US20170295648A1 (en) | 2014-12-02 | 2015-10-20 | Electronic device |
JP2016562342A JPWO2016088461A1 (ja) | 2014-12-02 | 2015-10-20 | 電子機器 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014-243810 | 2014-12-02 | ||
JP2014243810 | 2014-12-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2016088461A1 true WO2016088461A1 (ja) | 2016-06-09 |
Family
ID=56091417
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2015/079579 WO2016088461A1 (ja) | 2014-12-02 | 2015-10-20 | 電子機器 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20170295648A1 (ja) |
JP (1) | JPWO2016088461A1 (ja) |
WO (1) | WO2016088461A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110831328A (zh) * | 2019-11-19 | 2020-02-21 | 京东方科技集团股份有限公司 | 电路板结构、显示面板 |
WO2021187377A1 (ja) * | 2020-03-16 | 2021-09-23 | ソニーグループ株式会社 | ディスプレイモジュール及び電子機器 |
US11500489B2 (en) | 2019-01-30 | 2022-11-15 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Flexible circuit board and manufacturing method, display device, circuit board structure and display panel thereof |
US11589461B2 (en) | 2019-01-30 | 2023-02-21 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Flexible printed circuit and manufacturing method thereof, electronic device module and electronic device |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11188222B2 (en) * | 2019-12-05 | 2021-11-30 | Cabin Management Solutions, Llc | Multi-arrayed display user interface panel |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001167881A (ja) * | 1999-12-08 | 2001-06-22 | Nippon Seiki Co Ltd | 表示装置及びその製造方法 |
JP2002215059A (ja) * | 2001-01-18 | 2002-07-31 | Seiko Epson Corp | 電気光学装置 |
WO2010016312A1 (ja) * | 2008-08-06 | 2010-02-11 | シャープ株式会社 | 液晶表示装置の試験方法および液晶表示装置 |
JP2012194291A (ja) * | 2011-03-15 | 2012-10-11 | Omron Corp | 面光源装置 |
JP2014203573A (ja) * | 2013-04-02 | 2014-10-27 | パイオニア株式会社 | 発光装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4337830B2 (ja) * | 2006-02-23 | 2009-09-30 | エプソンイメージングデバイス株式会社 | 電気光学装置及び電子機器 |
-
2015
- 2015-10-20 US US15/517,109 patent/US20170295648A1/en not_active Abandoned
- 2015-10-20 WO PCT/JP2015/079579 patent/WO2016088461A1/ja active Application Filing
- 2015-10-20 JP JP2016562342A patent/JPWO2016088461A1/ja active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001167881A (ja) * | 1999-12-08 | 2001-06-22 | Nippon Seiki Co Ltd | 表示装置及びその製造方法 |
JP2002215059A (ja) * | 2001-01-18 | 2002-07-31 | Seiko Epson Corp | 電気光学装置 |
WO2010016312A1 (ja) * | 2008-08-06 | 2010-02-11 | シャープ株式会社 | 液晶表示装置の試験方法および液晶表示装置 |
JP2012194291A (ja) * | 2011-03-15 | 2012-10-11 | Omron Corp | 面光源装置 |
JP2014203573A (ja) * | 2013-04-02 | 2014-10-27 | パイオニア株式会社 | 発光装置 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11500489B2 (en) | 2019-01-30 | 2022-11-15 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Flexible circuit board and manufacturing method, display device, circuit board structure and display panel thereof |
US11589461B2 (en) | 2019-01-30 | 2023-02-21 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Flexible printed circuit and manufacturing method thereof, electronic device module and electronic device |
US11765828B2 (en) | 2019-01-30 | 2023-09-19 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Flexible printed circuit and manufacturing method thereof, electronic device module and electronic device |
US11934606B2 (en) | 2019-01-30 | 2024-03-19 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Flexible circuit board and manufacturing method, display device, circuit board structure and display panel thereof |
CN110831328A (zh) * | 2019-11-19 | 2020-02-21 | 京东方科技集团股份有限公司 | 电路板结构、显示面板 |
WO2021187377A1 (ja) * | 2020-03-16 | 2021-09-23 | ソニーグループ株式会社 | ディスプレイモジュール及び電子機器 |
Also Published As
Publication number | Publication date |
---|---|
US20170295648A1 (en) | 2017-10-12 |
JPWO2016088461A1 (ja) | 2017-09-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN109426040B (zh) | 电子设备 | |
US10993330B2 (en) | Display panel, display device, and method for manufacturing display panel | |
WO2016088461A1 (ja) | 電子機器 | |
KR102595086B1 (ko) | 표시 장치 및 이의 제조 방법 | |
US8917227B2 (en) | Display | |
TWI538074B (zh) | 可撓性電路板及其製造方法,以及半導體封裝 | |
JP3630116B2 (ja) | 電気光学ユニットおよび電子機器 | |
US9715298B2 (en) | Flexible display device with sensor layer | |
JP2015232660A (ja) | 表示装置の製造方法及び表示装置 | |
KR20140059548A (ko) | 회로 기판의 접속 구조 | |
US9510473B2 (en) | Display device | |
JP2015075559A (ja) | 電子装置 | |
JP6762196B2 (ja) | 電気光学表示装置 | |
KR102396021B1 (ko) | 구동칩이 구비된 인쇄 회로부 및 이를 포함하는 표시 장치 | |
JP2006119321A (ja) | 電気回路間の導通接続構造 | |
CN103578370A (zh) | 具有分离光源的显示器 | |
JP2007108386A (ja) | 表示装置 | |
JP2002093851A (ja) | 基板の実装構造体、電気光学装置及び電子機器 | |
KR20120077440A (ko) | 연성인쇄회로기판 | |
CN111341744A (zh) | 一种阵列基板及其制作方法、显示装置 | |
TWI224709B (en) | Liquid crystal display and lamp bonding process thereof | |
JP2007322591A (ja) | 表示装置 | |
US11950467B2 (en) | Display device and method of providing the same | |
KR20140133292A (ko) | 연성 인쇄회로기판 및 표시소자 | |
JP5205780B2 (ja) | 表示モジュール |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 15864934 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 15517109 Country of ref document: US |
|
ENP | Entry into the national phase |
Ref document number: 2016562342 Country of ref document: JP Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 15864934 Country of ref document: EP Kind code of ref document: A1 |