WO2016080238A1 - 積層体、一体化成形品、それの製造方法 - Google Patents
積層体、一体化成形品、それの製造方法 Download PDFInfo
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- WO2016080238A1 WO2016080238A1 PCT/JP2015/081560 JP2015081560W WO2016080238A1 WO 2016080238 A1 WO2016080238 A1 WO 2016080238A1 JP 2015081560 W JP2015081560 W JP 2015081560W WO 2016080238 A1 WO2016080238 A1 WO 2016080238A1
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Definitions
- the present invention is excellent in adhesiveness between a thermosetting resin or a fiber reinforced resin using a thermoplastic resin as a matrix resin (sometimes abbreviated as FRP) and another member, particularly a thermoplastic resin, and excellent in a high temperature atmosphere.
- the present invention relates to a laminate exhibiting adhesiveness, an integrally molded article, and a method for producing the same, specifically, a reinforcing fiber, a matrix resin made of a thermosetting resin or a thermoplastic resin, and a porous substrate made of a thermoplastic resin.
- the present invention relates to a laminated body and an integrally molded product, and a method for producing the same.
- a mechanical joining method such as a bolt, a rivet or a screw, or a joining method using an adhesive is used.
- the mechanical joining method requires a processing step for pre-working the joint portion, so there is a problem that it is difficult to reduce the production cost, and in a high temperature atmosphere, loosening occurs due to thermal expansion, and from its appearance, There was a problem that application application was limited.
- the bonding method using an adhesive requires a bonding process including the preparation of the adhesive and the application work of the adhesive, and thus there is a problem that it is difficult to reduce the production cost, and the reliability of the bonding strength is sufficient. There was a problem that was not satisfactory.
- thermoplastic resins a thermoplastic resin with extremely high heat resistance called super engineering plastic has been used as an alternative material for metals in the automotive field for the purpose of reducing the weight of the vehicle body. From the viewpoint of safety, durability by repeated rapid temperature changes is required, and improvement in continuous usable temperature as well as heat resistance is required.
- Patent Document 1 discloses a laminate having a matrix resin composed of a continuous reinforcing fiber group, a thermosetting resin, and a thermoplastic resin, and a method for producing the same.
- This laminate has a thermoplastic resin adhesive layer formed on the surface of a fiber-reinforced thermosetting resin by melting or softening a thermoplastic resin that provides an adhesive effect with other members at the heating temperature of the thermosetting resin. It is. Also, a thermoplastic resin that provides an adhesive effect with other members is melted or softened during the curing reaction of the thermosetting resin, and a thermoplastic resin adhesive layer is formed on the surface of the fiber reinforced thermosetting resin to obtain a laminate. It is.
- Patent Document 2 discloses a thermoplastic resin composite in which a high-heat-resistant thermoplastic resin in the form of a single fiber assembly excellent in flame retardancy is embedded in a thermoplastic resin layer.
- a composite structure using this thermoplastic resin composite is obtained by melting or softening a thermoplastic resin having an adhesive effect with other members at the heating temperature of the composite structure in the same manner as in Patent Document 1.
- An embedded thermoplastic resin adhesive layer is formed.
- the thermoplastic resins that provide the adhesive effect described in these documents need to be melted or softened at the heating temperature, so that the adhesive property at room temperature is excellent, but for adaptation as a member used in a high temperature atmosphere There was a big limitation.
- Patent Document 3 discloses a fiber reinforced resin racket frame made of a fiber reinforced thermosetting resin and a fiber reinforced thermoplastic resin.
- This racket frame has a mixture of thermosetting resin and thermoplastic resin at the boundary between fiber reinforced thermosetting resin and fiber reinforced thermoplastic resin, and it has a melting point or softening point from the heating temperature when curing the thermosetting resin.
- a high thermoplastic resin is used, it takes a long time for molding because the temperature is further increased after the thermosetting resin is cured to melt or soften the thermoplastic resin to obtain a racket frame.
- the mixed layer of thermosetting resin and thermoplastic resin that can be an adhesive layer is formed inside the racket frame, there is a great limitation on the adhesion to other members and the adaptation as a member used in a high temperature atmosphere. .
- Patent Document 4 discloses a prepreg composed of reinforcing fibers, a matrix resin, and a thermoplastic resin, in which a knitted fabric made of thermoplastic resin fibers is distributed in the vicinity of the surface layer, and a method for manufacturing the same.
- the knitted fabric made of thermoplastic resin fibers described in this document is used for the purpose of increasing the interlayer toughness, and in the molded product made of these prepregs, it is necessary to be present between the layers. When joining, it was necessary to use a general integration method.
- the present invention attempts to improve the problems of the prior art, and an object of the present invention is to provide a laminate and an integrally molded product having excellent adhesion, and a method for producing the same, even in a high temperature atmosphere.
- Porous base material (C) made of thermoplastic resin (c) and reinforcing fiber (A) and thermosetting resin (B), or A laminate comprising a porous substrate (C) made of a thermoplastic resin (c), a reinforcing fiber (A), and a thermoplastic resin (D),
- the porous substrate (C) has a continuous void in the thickness direction of the laminate, and the melting point or softening point is higher than 180 ° C.
- a laminate in which the porous substrate (C) is exposed on one surface of the laminate by 10% or more with respect to the one surface.
- the laminate is composed of a porous substrate (C) made of a thermoplastic resin (c), a reinforcing fiber (A) and a thermosetting resin (B), or a porous substrate made of a thermoplastic resin (c) ( C), reinforcing fiber (A) and thermoplastic resin (D),
- a porous substrate made of a thermoplastic resin (c) ( C), reinforcing fiber (A) and thermoplastic resin (D)
- the porous substrate (C) and the thermosetting resin (B) or the thermoplastic resin (D) form a co-continuous structure
- the porous substrate (C) is exposed to 10% or more with respect to the surface on the side integrated with the other members of the laminate, and satisfies any relationship of the following formula: Integrated molded product.
- the laminate of the present invention is excellent in adhesiveness with other members. Furthermore, the integrated molded product of the present invention in which the laminate of the present invention and other members are joined (integrated) has a wide range of application to members and products that are used not only at room temperature but also in a high temperature atmosphere. Moreover, the manufacturing method of those laminated bodies and integrated molded products is a manufacturing method which can obtain easily the laminated body which is excellent in adhesiveness with other members, and the integrated molded products with a wide application range as mentioned above. It is. Furthermore, the laminate and the integrally molded product obtained by the manufacturing method disclosed in the present invention have a wide range of application to members and products used in a high temperature atmosphere as well as a normal temperature.
- FIG. 4 is a schematic diagram showing a star shape, (g) eyebrows shape, and (h) Y shape.
- FIG. 1 It is a schematic diagram which shows an example of the preform in this invention, (a) The porous base material (C) was laminated
- FIG. 1 It is a schematic diagram which shows the surface of the laminated body of this invention, (a) The schematic cross section of a laminated body, (b) The schematic diagram which observed the surface 13 from the arrow direction. It is a schematic diagram which shows an example of a thermosetting resin (B) and a porous base material (C) structure in this invention, (a) A schematic perspective view which shows a co-continuous structure, (b) A cross section of a schematic perspective view. It is the schematic cross section observed from the arrow direction.
- B thermosetting resin
- C porous base material
- FIG. 2 is a schematic view showing a state in which a mold is opened and an integrally molded product (20) is taken out.
- Example 8-2 It is a schematic diagram showing press molding of Example 8-2 of the present invention, (a) a schematic diagram showing a state in which the laminate (3) and other members are arranged in a mold, and (b) heating. It is a schematic diagram which shows the state which is cooling in the pressurized state after pressurization, (c) It is a schematic diagram which shows the state which opens a metal mold
- the laminate of the present invention has, as its constituent elements, a porous base material (C) composed of a thermoplastic resin (c), a reinforcing fiber (A), a thermosetting resin (B), or a thermoplastic resin (c). It is the laminated body which has the porous base material (C) which consists of, a reinforced fiber (A), and a thermoplastic resin (D). First, each element will be described.
- the reinforcing fiber (A) in the present invention is, for example, a glass fiber made of E glass, C glass, S glass, D glass, or polyacrylonitrile for the purpose of expressing mechanical properties such as strength and elastic modulus of the laminate.
- a ceramic fiber is preferably exemplified. You may use these individually or in combination of 2 or more types. These reinforcing fibers may be subjected to surface treatment.
- Preferred examples of the surface treatment include a metal deposition treatment, a treatment with a coupling agent, a treatment with a sizing agent, and an additive adhesion treatment.
- a sizing agent The compound which has 3 or more of at least 1 sort (s) of functional groups selected from the group which consists of a carboxyl group, an amino group, a hydroxyl group, and an epoxy group is preferable. Two or more kinds of functional groups may be mixed in one molecule, or two or more compounds having three or more kinds of one kind of functional group in one molecule may be used in combination.
- the reinforcing fibers (A) are preferably metal fibers, glass fibers, and carbon fibers from the viewpoint of high strength and high elastic modulus. Among them, carbon is low in specific gravity and excellent in specific strength and specific rigidity from the viewpoint of light weight. Fiber is preferably used. In particular, polyacrylonitrile-based carbon fibers are preferably used because they can realize inexpensive production costs.
- a strand composed of a large number of filaments a cross such as a plain weave, satin weave, or a twill weave composed of this strand, a strand in which a large number of filaments are arranged in one direction
- a continuous fiber substrate such as a unidirectional strand
- a unidirectional cloth composed of the unidirectional strand
- continuous fiber refers to a fiber having a length of 10 mm or more in at least one direction, and is a fiber having a length from one end to the opposite end in the laminate. Is preferred. From the viewpoint of expressing high mechanical properties, a continuous fiber substrate is preferably used.
- fiber dispersed base materials such as reinforced fiber strands and / or monofilaments dispersed in a plane, for example, chopped strand mat, paper mat, carding mat, air laid mat, etc.
- the monofilament usually does not have regularity in the dispersed state, and therefore a papermaking mat is preferably used, and a fiber-dispersed base material is preferably used from the viewpoint of shape shaping of the laminate.
- thermosetting resin (B) in the present invention is preferably a resin excellent in mechanical properties such as the strength of the laminate and heat resistance.
- a resin excellent in mechanical properties such as the strength of the laminate and heat resistance.
- unsaturated polyester, vinyl ester, epoxy, phenol (resole type), urea melamine , Polyimide, copolymers thereof, modified products, and resins obtained by blending at least two of these are preferred.
- an elastomer or a rubber component may be added to the thermosetting resin (B).
- thermosetting resin (B) suitable for the present invention there is an epoxy resin in particular, and it is generally used in combination with a curing agent or a curing catalyst.
- an epoxy resin having an amine, a phenol, or a compound having a carbon-carbon double bond as a precursor is preferable.
- epoxy resins having amines as precursors various isomers of tetraglycidyldiaminodiphenylmethane, triglycidyl-p-aminophenol, triglycidyl-m-aminophenol, triglycidylaminocresol, and phenols are used as precursors.
- epoxy resin bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, compound having carbon-carbon double bond and precursor
- the epoxy resin to be used include, but are not limited to, alicyclic epoxy resins.
- brominated epoxy resins obtained by brominating these epoxy resins are also used.
- An epoxy resin having an aromatic amine as a precursor represented by tetraglycidyldiaminodiphenylmethane is most suitable for the present invention because it has good heat resistance and good adhesion to the reinforcing fiber (A).
- An epoxy resin is preferably used in combination with an epoxy curing agent.
- an epoxy curing agent any compound having an active group capable of reacting with an epoxy group can be used.
- a compound having an amino group, an acid anhydride group, or an azide group is suitable.
- dicyandiamide, various isomers of diaminodiphenylsulfone, and aminobenzoic acid esters are suitable.
- dicyandiamide is preferably used because it has excellent prepreg storage stability.
- Various isomers of diaminodiphenylsulfone are most suitable for the present invention because they give a cured product having good heat resistance.
- thermoplastic resin (c) a polyester resin such as polyethylene terephthalate (PET) resin, polybutylene terephthalate (PBT) resin, polytrimethylene terephthalate (PTT) resin, polyethylene naphthalate (PENp) resin, liquid crystal polyester, Polyolefin resin such as polyethylene (PE) resin, polypropylene (PP) resin, polybutylene resin, styrene resin, urethane resin, polyoxymethylene (POM) resin, polyamide (PA) resin, polycarbonate (PC) resin, Polyarylene sulfide (PAS) resin such as polymethyl methacrylate (PMMA) resin, polyvinyl chloride (PVC) resin, polyphenylene sulfide (PPS) resin, polyethersulf
- PMMA polymethyl methacrylate
- PVC polyvinyl chloride
- PPS polyphenylene sulfide
- thermoplastic resins may be a copolymer or modified body of the above-mentioned thermoplastic resin, and / or a resin blended with two or more types, and further, the purpose of the present invention is impaired depending on the application.
- Other fillers and additives may be appropriately contained within the range.
- a flame retardant can be added to increase the flame retardancy of the thermoplastic resin (c), or a plasticizer can be added to facilitate the production of a fiber substrate.
- the porous substrate (C) preferably has a melting point or a softening point higher than 180 ° C. From the viewpoint of heat resistance, it is more preferably 200 ° C. or higher, and further preferably 250 ° C. or higher.
- the upper limit of the melting point or softening point is not particularly limited, but is preferably 400 ° C. or lower, and preferably 300 ° C. or lower from the viewpoint of production of the porous substrate (C) and adhesion to other members. Further preferred.
- Such a porous substrate (C) can be easily obtained by using a thermoplastic resin (c) having a melting point or softening point higher than 180 ° C.
- it may contain at least one resin selected from the group consisting of a polyarylene sulfide resin, a polyether ether ketone resin, a polyether sulfone resin, and a polyamide resin. preferable.
- the PAS resin is mainly composed of — (Ar—S) — (wherein Ar represents an arylene group) as a repeating unit.
- Ar represents an arylene group
- the arylene group include a p-phenylene group, m-phenylene group, o-phenylene group, substituted phenylene group, p, p'-diphenylene sulfone group, p, p'-biphenylene group, p, p'-diphenylene ether group, p, p'-diphenylenecarbonyl Group, naphthalene group and the like can be used.
- PPS resins that are widely used industrially are preferably used.
- the porous substrate (C) is impregnated with the thermosetting resin (B) and cured under a temperature condition not higher than the melting point and softening point of the porous substrate (C). Therefore, it is necessary to select from the above group according to the heating temperature at the time of curing. This is because when the viscosity of the thermosetting resin (B) is reduced by heating, the continuous voids of the porous substrate (C) are impregnated with the thermosetting resin (B), and the thermostructural resin ( B) and the porous substrate (C) are preferable from the viewpoint of being able to form a co-continuous structure.
- the thermosetting resin (B) is in a state where the porous base material (C) is melted or softened. ) Is cured, the volume of the porous base material (C) shrinks after molding, that is, after the laminated body is cooled, which may cause warpage of the laminated body and sink on the surface of the laminated body.
- the melting point is a value measured by DSC at a heating rate of 10 ° C./min in accordance with JIS-K7121 (2012).
- the softening point is a value obtained by measuring the Vicat softening temperature in accordance with JIS-K7206 (1999).
- the melting point Tm (° C.) and the heating temperature Tp (° C.) when the thermosetting resin (B) is cured are Tm> Tp, Or when melting
- the melting point or softening point of the base material (C) is preferably 10 ° C or higher, more preferably 30 ° C or higher, and further preferably 50 ° C or higher.
- the porous substrate (C) is used from the viewpoint of enhancing the adhesion with the thermosetting resin (B) or the thermoplastic resin (D).
- An adhesive component may be applied to the surface. From the viewpoint of improving adhesion, the adhesive component is preferably attached to 70% or more of the surface of the porous substrate (C), more preferably 90% or more, and uniformly attached to the entire surface. More preferably.
- attachment component From the point which improves adhesion
- Examples of functional groups include carboxyl groups, glycidyl groups, amino groups, isocyanate groups, acid anhydride groups, hydroxyl groups, amide groups, ester groups, among others, carboxyl groups, glycidyl groups, amino groups, isocyanate groups, acids.
- An anhydride group is a highly reactive functional group and is preferred.
- a compound having two or more of the functional groups is preferable.
- the compound is preferably an organic compound, a polymer compound or an organosilicon compound from the viewpoint of affinity for the porous substrate (C), and in the case of an inorganic compound, the affinity may be inferior.
- Preferred examples of the organic compound include trimellitimide compounds such as N, N′-ethylene bistrimellitic imide and N, N′-hexamethylene bistrimellitic imide, and polyfunctional aromatic epoxies such as bisphenol A, There are bisphenol-glycidyl ether type epoxy compounds such as resorcinol, hydroquinone, bisphenol S, and 4,4′-dihydroxybiphenyl.
- Preferred examples of the polymer compound include ethylene-ethyl acrylate copolymer and maleic anhydride-modified polypropylene as examples of acid-modified polyolefin, and ethylene-glycidyl methacrylate copolymer as an example of epoxy-modified polyolefin. There is.
- organosilicon compound examples include ⁇ -glycidoxypropyltrimethoxysilane as an example of a glycidyl-modified organosilane compound, and 3-isocyanatopropyltriethoxysilane as an example of an isocyanate-modified organosilane compound.
- modified organosilane compound examples include 3-aminopropyltrimethoxysilane and N-2- (aminoethyl) -3-aminopropyltrimethoxysilane.
- the method for applying the organic compound, polymer compound or organosilicon compound to the surface of the porous substrate (C) is not particularly limited, but if it is a solid, the pulverized powder is attached to the porous substrate (C).
- a method and a method in which a compound is melted and applied but a uniform and simple application method is to prepare a porous substrate (C) in a liquid having a predetermined concentration in which a compound is dissolved or dispersed in an organic solvent or water.
- a method of drying after soaking, a method of drying after spraying, etc. are preferable.
- the absolute value of the difference in solubility parameter (SP value) between the porous base material (C) and the thermosetting resin (B) or the thermoplastic resin (D) used is preferably 1 or less. By using a combination of such resins, it is possible to form an adhesive layer firmly due to the compatibility between the porous substrate (C) and the thermosetting resin (B) or the thermoplastic resin (D).
- a detailed description of the solubility parameter is given in “Polymer Blend” (CMC), written by Saburo Akiyama, Takashi Inoue, and Toshio Nishi.
- CMC Polymer Blend
- Several methods for determining the solubility parameter of a polymer are known, but the same determination method may be used for comparison. Specifically, it is desirable to use the Hoy's method that is easy to calculate (see above). The closer the solubility parameter values of the two materials are, the more preferable the combination.
- void space continuous in the thickness direction refers to a gap through which a gas such as air or a liquid such as water can pass from one surface of the porous substrate (C) to the other surface in the thickness direction. That is.
- the porous substrate (C) When it is larger than 500 cm 3 / cm 2 ⁇ s, the porous substrate (C) can be easily impregnated with the thermosetting resin (B) or the thermoplastic resin (D). There is little entanglement between the plastic resin (D) and the porous substrate (C), and it may be difficult to form a strong adhesive layer. Moreover, when it is less than 3 cm 3 / cm 2 ⁇ s, it may be difficult to completely impregnate the porous base material (C) with the thermosetting resin (B) or the thermoplastic resin (D). Manufacturing conditions are limited, for example, it is necessary to increase the pressure to promote the pressure. Due to the presence of such an unimpregnated porous base material, a partially fragile adhesive layer is formed, which becomes a breaking point when integrated with other members, and expresses adhesive strength. It can be difficult.
- the method for obtaining the porous substrate (C) is not particularly limited, but a fiber woven fabric such as plain weave or twill weave is used in which the thermoplastic resin (c) is a bundle of 1,000 to 1 million single fibers. , One to 1,000-million single fibers bundled into a single fiber entangled form in which single fibers are randomly entangled by air or water flow, etc., and melt blow method, spun bond method, etc.
- a nonwoven fabric in which fibers are randomly bonded to each other, but from the viewpoint of forming a strong adhesive layer on the surface of the laminate, each single fiber is melt-bonded at the point of contact between the single fibers.
- it is preferably in the form of a nonwoven fabric.
- the melt viscosity of the thermoplastic resin (c) at the heating temperature for curing the thermosetting resin (B) or the heating temperature for melting or softening the thermoplastic resin (D) is 1 ⁇ 10 5 Pa ⁇ s or less. Preferably, it is 1 ⁇ 10 3 Pa ⁇ s or less.
- a thermoplastic resin (c) By using such a thermoplastic resin (c), it is possible to easily obtain a porous substrate (C) in the form of a nonwoven fabric. Is possible. If the melt viscosity is higher than this, it will be difficult to produce fibers made of the thermoplastic resin (c), and in particular, it will be difficult to discharge the resin by the melt blow method, and a porous substrate (C) in the form of a nonwoven fabric is obtained. It becomes difficult.
- the basis weight of the porous substrate (C) is not particularly limited from the viewpoint of impregnation of the thermosetting resin (B) or the thermoplastic resin (D) into the porous substrate (C), but is 300 g / m. preferably 2 or less, more preferably 200 g / m 2 or less, and more preferably 100 g / m 2 or less. Moreover, it is preferable that it is 3 g / m ⁇ 2 > or more from a viewpoint which exposes the porous base material (C) on the surface of a laminated body, and expresses adhesiveness, and it is more preferable that it is 5 g / m ⁇ 2 > or more.
- the porous base material (C) exposed on the surface of the laminate is small as shown in FIG. 1B, and adhesion with other members becomes difficult.
- a thermosetting resin (B) or a thermoplastic resin (D) may not fully impregnate a porous base material (C).
- the non-impregnated part of the thermosetting resin (B) or the thermoplastic resin (D) of the porous substrate (C) may become a fragile part.
- the state shown in FIG. 1A is more preferable.
- the tensile strength is preferably 50 MPa or more, more preferably 80 MPa or more.
- an adhesive layer having high strength can be formed and high adhesiveness can be expressed.
- a lower range of the thermoplastic resin (c) when an external force is applied to the integrally molded product, the thermoplastic resin (c) breaks down and exhibits high adhesiveness. Is difficult.
- the fiber diameter of the porous base material (C) in the present invention is not particularly limited, but is preferably in the range of 0.1 to 100 ⁇ m, and if the fiber diameter is large, the fiber per diameter when exposed on the surface of the laminate is preferred. From the viewpoint of effectively exhibiting adhesiveness with other members, and when the fiber diameter is small, the thermosetting resin (B) or the thermoplastic resin (D) and the porous substrate ( The confounding with C) is complicated, which is preferable from the viewpoint of forming a strong adhesive layer.
- the entanglement is complicated, but it becomes difficult to impregnate the thermosetting resin (B) or the thermoplastic resin (D), and conversely, when the fiber diameter is larger than 100 ⁇ m, the thermosetting is performed.
- the entanglement with the conductive resin (B) or the thermoplastic resin (D) is reduced, and a strong adhesive layer may not be formed.
- the cross-sectional shape of the fiber there are no particular restrictions on the cross-sectional shape of the fiber, but there are many such as (a) a circle such as a perfect circle and (b) an ellipse, (c) a triangle, (d) a rectangle, and (e) a pentagon as shown in FIG.
- Examples of the shape include a square shape, (f) star shape, (g) eyebrow shape, and (h) Y shape. These are used alone or in combination of two or more.
- a circular cross section is preferable, and the adhesion area with the thermosetting resin (B) or the thermoplastic resin (D) is widened, and the entanglement is complicated.
- a polygonal shape or a modified cross section is preferable.
- the ratio of the density ⁇ of the thermoplastic resin (c) and the bulk density ⁇ m of the porous substrate (C) in the present invention is preferably 0.8 or less, and this ratio is the ratio of the porous substrate (C). It is an index of the degree of void in the thickness direction and is calculated by the following formula.
- the density ratio is not particularly limited. If the density ratio is 0.01 or more, the exposure for expressing the impregnation property of the thermosetting resin for forming a strong adhesive layer and the adhesion property with other members is provided. It is possible to achieve both.
- the porous substrate (C) in the present invention may be one in which the void portion of the porous substrate (C) is impregnated with the thermosetting resin (B) or the thermoplastic resin (D) in advance.
- a porous substrate (C) is preferable in terms of improving the handleability of the porous substrate (C) during preform production.
- the thermosetting resin (B) or the thermoplastic resin (D) is a thermosetting resin (B)
- the porous base material (C) is impregnated with the thermosetting resin (B) in an uncured state.
- the thermoplastic resin (D) in the present invention is preferably a thermoplastic resin having a melting point or a softening point lower than that of the porous substrate (C) to be used, and is described in the section of the thermoplastic resin (c) described above.
- the resin can be used depending on the purpose.
- the melting point or softening point of the thermoplastic resin (D) is preferably 10 ° C. or more lower than the melting point or softening point of the porous substrate (C) from the viewpoint of impregnation into the porous substrate (C). 30 ° C. or higher is more preferable.
- thermoplastic resin (D) there is no particular upper limit for the difference in melting point or softening point, but if the melting point or softening point of the thermoplastic resin (D) is too low, the heat resistance of the laminate is inferior, so that the heat resistance of the laminate can be maintained. Since it disappears, it is not preferable.
- the preform in the present invention is a porous substrate made of a thermoplastic resin (c) on a substrate (p) made of a reinforcing fiber (A) and a thermosetting resin (B).
- a preform in which (C) is laminated on the surface layer is preferable.
- thermosetting resin (B) A preform in which a porous substrate (C) is laminated on a surface layer of a prepreg obtained by impregnating a reinforcing fiber (A) with a thermosetting resin (B) in advance may be used.
- the method for impregnating the reinforcing fiber (A) with the thermosetting resin (B) is not particularly limited.
- the thermosetting resin (B) is dissolved in an organic solvent such as methyl ethyl ketone or methanol to lower the viscosity, After impregnating while reinforcing fiber (A) is immersed, wet method to evaporate organic solvent using oven etc.
- thermosetting resin (B) is reduced in viscosity by heating, on roll or release paper
- a hot melt method in which a film is prepared, and then the film is superimposed from both sides or one side of the reinforcing fiber (A) and impregnated by heating and pressurization is exemplified.
- a preform in which a plurality of base materials (p) are laminated as shown in FIG. Also good.
- the strength in a specific direction of the laminate and the integrally molded product It is also possible to have a distribution.
- the porous substrate (C) is preferably exposed to 10% or more with respect to the one surface of the laminate, and is exposed to 30% or more from the viewpoint of adhesiveness. It is more preferable that the exposure is 50% or more. It is preferable that the exposure of the thermoplastic resin (c) is increased because the area ratio of the thermoplastic resin (c) and the other member in contact with each other on the adhesive surface with the other member is increased. There is no upper limit for the exposure ratio of the porous substrate (C), but a strong adhesive layer is formed by entanglement of the thermosetting resin (B) or thermoplastic resin (D) and the porous substrate (C). From the viewpoint, it is preferably 90% or less.
- the term “exposed” as used herein refers to a porous substrate as shown in FIG. 4B when one surface of the laminate is observed from the direction of the arrow as shown in FIG. It is a state where the material (C) appears on the surface, and can be visually recognized by surface observation.
- the state shown in FIG. 1C can also be said that the porous substrate (C) is exposed, but the porous substrate (C) is fixed to the thermosetting resin (B) or the thermoplastic resin (D).
- the porous substrate (C) as shown in FIG. 1A is fixed to the thermosetting resin (B) or the thermoplastic resin (D).
- Form is preferred.
- thermosetting resin (B) or the thermoplastic resin (D) and the porous substrate (C) form a co-continuous structure.
- co-continuous structure refers to 2 of thermosetting resin (B) or thermoplastic resin (D) and porous substrate (C) forming a phase separation structure as shown in FIG.
- both phases form a continuous phase.
- TEM transmission electron microscope
- the porous substrate when the porous substrate is impregnated with the thermosetting resin (B) or the thermoplastic resin (D), the porous substrate is not melted. For this reason, the porous substrate having a network structure with voids becomes a source of forming a co-continuous structure, and the voids of the porous substrate are impregnated with the thermosetting resin (B) or the thermoplastic resin (D). As a result, it is possible to easily form a co-continuous structure.
- the laminate of the present invention can be made into an integrally molded product by integrating other members.
- the means for integrating the other members is not particularly limited.
- a method of previously forming the laminate and the other members separately and integrating them that is, a step of obtaining the laminate
- there are a method of integrating the laminate and other members and (ii) a method of previously forming the laminate and forming the other members and simultaneously integrating the two members.
- the laminate of the present invention and other members are preferably integrated by thermal welding.
- the laminate is press-molded, and the other members are pressed or injection molded. Make it.
- the laminate is press-molded, then placed in the press-molding die, and the material for forming other members is charged into the press-molding die, and the press molding is performed.
- the method (ii) is preferred, and insert injection molding and outsert injection molding are preferably used as injection molding, and stamping molding and heat and cool molding are preferably used as press molding. Is done.
- thermoplastic resin is present on at least a part of the adhesion surface of another member.
- the area ratio of the thermoplastic resin present on the adhesive surface is not particularly limited, but is preferably 10% or more, more preferably 30% or more, and further preferably 50% or more.
- the range of the bonding surface of the other member is not limited, which is preferable in that the degree of freedom in design is increased.
- thermoplastic resin present on at least a part of the adhesion surface of another member is substantially the same type of thermoplastic resin as the thermoplastic resin (c) used for the porous substrate (C) constituting the laminate. It is preferable that Here, “substantially the same” means that a component occupying 50% by mass or more of the components constituting the resin is included in common, and a component occupying 70% by mass or more is common. More preferably, the thermoplastic resin (c) used to produce the porous substrate (C) is used as a matrix resin to produce another member.
- the integrated molded product of the present invention is formed by integrating the laminate and other members, and the surface layer on the side integrated with the other members of the laminate comprises a porous substrate (C) and a thermosetting resin (B ) Or the thermoplastic resin (D) needs to form a co-continuous structure.
- the thermosetting resin (B) or the thermoplastic resin (D) exists uniformly on the surface layer due to the formation of the co-continuous structure, stable adhesive strength with other members is expressed.
- the integrally molded product of the present invention has a thermal expansion coefficient Eb of the thermosetting resin (B) ⁇ a thermal expansion coefficient Ec of the porous substrate (C) or a thermal expansion coefficient Ed of the thermoplastic resin (D) ⁇ porous. It is necessary to satisfy the relationship of the thermal expansion coefficient Ec of the substrate (C). By satisfying such a relationship, the part where the porous base material (C) serving as an adhesive component is exposed on the surface of the laminate is raised in the method of manufacturing an integrally molded product to be described later, and can be easily combined with other members. In addition, it becomes an integrally molded product that is firmly integrated.
- the thermal expansion coefficient Eb of the thermosetting resin (B) or the thermal expansion coefficient Ed of the thermoplastic resin (D) is 5 ⁇ 10 ⁇ 6 / ° C. or more than the thermal expansion coefficient Ec of the porous substrate (C). It is preferably small and more preferably 10 ⁇ 10 ⁇ 6 / ° C. or smaller. In the context of thermal expansion coefficient, the upper limit is not, because that could lead to large deformation is integrated molded dimensional accuracy and bonding strength reduction of the resulting to occur at a slight change in temperature, and 500 ⁇ 10 -6 / °C or less It is preferable to become.
- a porous substrate (C) made of a thermoplastic resin (c) is laminated on a surface layer of a substrate (p) made of a reinforcing fiber (A) and a thermosetting resin (B). It is preferable that the preform is molded by heating and pressing.
- the thermosetting resin (B), whose viscosity has been reduced by heating, is molded by using a preform in which the porous substrate (C) is laminated on such a surface layer. It is possible to easily manufacture a laminate in which a strong adhesive layer is formed on the surface of the laminate.
- the method for forming the preform by heating and pressing is not particularly limited, and is a hand lay-up molding method, a spray-up molding method, a vacuum back molding method, a pressure molding method, an autoclave molding method, a press molding.
- a known molding method using a thermosetting resin such as a method, a transfer molding method or a stamping molding method is used.
- vacuum back molding, autoclave molding, press molding which are continuously molded by heating and pressurization, are preferable.
- the press molding method is more preferably used.
- a porous substrate (C) is impregnated with a thermosetting resin (B) and cured under a temperature condition below the melting point and softening point of the porous substrate (C). It is preferable to mold the preform. By molding the preform under such temperature conditions, the porous form of the porous substrate (C) is maintained, so that the thermosetting resin (B) with reduced viscosity can be easily impregnated. it can. Thereby, the strong continuous structure which consists of a porous base material (C) and a thermosetting resin (B) is easily formed in the surface layer of a laminated body, and it is possible to form a firm adhesive layer easily.
- thermosetting resin (B) is not melted or softened slowly.
- volume shrinkage of the porous base material (C) is suppressed after molding, that is, after the laminate is cooled, thereby preventing warpage of the laminate and sink marks generated on the surface of the laminate. A few laminated bodies can be obtained.
- the porous substrate (C) is porous with respect to the heating temperature at which the thermosetting resin (B) is cured.
- the melting point or softening point of the base material (C) is preferably 10 ° C or higher, more preferably 30 ° C or higher, and further preferably 50 ° C or higher.
- the method for producing an integrally molded article of the present invention is a method for integrating the laminate obtained as described above and other members, and the method for integrating the laminate and other members is not particularly limited. However, for example, (i) a method in which the laminate and other members are separately molded in advance and integrated with each other, that is, in a step different from the step of obtaining the laminate, the laminate and other members And (ii) a method in which a laminate is formed in advance and the other members are formed, and at the same time, the two are integrated.
- the laminate obtained by the production method of the present invention and other members are preferably integrated by heat welding.
- the laminate is press-molded and the other members are press-molded. Or made by injection molding.
- welding means such as hot plate welding, vibration welding, ultrasonic welding, laser welding, resistance welding, induction heating welding and the like. From the viewpoint of process simplicity, hot plate welding and ultrasonic welding are preferably used.
- a laminate is press-molded, then inserted into an injection mold, and a material for forming another member is injection-molded into the mold to be in a molten or softened state.
- the porous base material (C) exposed on the surface of the laminate is melted or softened and bonded by the amount of heat.
- the laminate is press-molded, then placed in the press-molding die, and the material for forming other members is charged into the press-molding die, and the press molding is performed.
- the method (ii) is preferred, and insert injection molding and outsert injection molding are preferably used as injection molding, and stamping molding and heat and cool molding are preferably used as press molding. Is done.
- the laminate is preheated and the porous base material (C) is melted or softened and then integrated with another member by pressurization.
- the laminate shown in FIG. 6 (a) is preheated, and the porous substrate (C) is melted or softened under non-pressurized conditions, so that a thermoplastic resin (c) is obtained as shown in FIG. 6 (b). ) Expands, and the portion exposed on the surface of the laminate rises. After making such a state, by pressing with other members, the expanded thermoplastic resin (c) spreads on the surfaces of the laminate and other members (FIG. 6 (c)), and the bonding area is increased. It is preferable because it exhibits high adhesive strength by spreading.
- the area of the porous substrate (C) exposed on the surface of the laminate after preheating and pressurizing the laminate is preferably at least twice the exposed area before preheating and pressurization. 3 times or more is more preferable.
- Applicable products for laminates and integrally molded products include products in fields where high adhesiveness and shape maintenance are required even in a high temperature atmosphere.
- it is suitable as a housing for electric / electronic devices, and is suitably used for computers, televisions, cameras, audio players and the like.
- electrical and electronic component applications such as connectors, LED lamps, sockets, optical pickups, terminal boards, printed boards, speakers, small motors, magnetic heads, power modules, generators, motors, transformers, current transformers, It is suitably used for voltage regulators, rectifiers, inverters, etc.
- automotive parts and vehicle-related parts such as instrument panels, console boxes, pillars, roof rails, fenders, bumpers, door panels, roof panels, hood panels, trunk lids, door mirror stays, spoilers, hood louvers.
- it is also useful in various fields such as aerospace and civil engineering.
- thermoplastic resin (c) when an amorphous resin is used out of the thermoplastic resin (c), it conforms to the A50 method of “Plastic-thermoplastic-Vicat softening temperature (VST) test” defined in JIS-K7206 (1999). Then, the softening point was measured.
- VST Plastic-thermoplastic-Vicat softening temperature
- the thermoplastic resin (c) or the porous substrate (C) used for the production of the porous substrate (C) is dried in a vacuum dryer controlled at a furnace temperature of 50 ° C. for 24 hours or more, Molded with an injection molding machine (JSW J150EII-P). A square plate having a thickness of 3.2 mm and a length and width of 12.5 mm was cut out from the obtained molded piece, and this was used as a sample. The sample was subjected to a heat distortion temperature measuring instrument (S3-FH, manufactured by Toyo Seiki Seisakusho Co., Ltd.) to obtain a softening
- the above operation was repeated three times, and the average value of the obtained temperatures was calculated as the melting point or softening point of the porous substrate (C).
- the temperature obtained as the melting point was treated as Tm (° C.)
- the softening point was treated as Tn (° C.).
- Exposure rate E of porous substrate (C) At an arbitrary position on one surface of the obtained laminate, an enlargement magnification of 200 using an ultra deep color 3D shape measurement microscope VK-9500 (controller part) / VK-9510 (measuring part) (manufactured by Keyence Corporation) Taken at double. At this time, when the fiber diameter of the porous base material (C) to be observed is thin and it is difficult to observe, it is possible to enlarge the observation magnification and similarly take an image of the surface of the laminate.
- the mass Mc of the porous substrate (C) was measured in accordance with “General nonwoven fabric test method—mass per unit area”, and the area of the porous substrate (C) used at this time was determined as the porous substrate.
- the area Sc in (C) was used.
- the bulk density ⁇ c of the porous substrate (C) was calculated from the following formula.
- ⁇ c Mc / (Tc ⁇ Sc)
- thermoplastic resin (c) Tensile strength ⁇ tp of thermoplastic resin (c)
- the resin pellet of the thermoplastic resin (c) used for the porous substrate (C) is dried for 24 hours or more in a vacuum dryer controlled at a furnace temperature of 50 ° C., and then an injection molding machine (JSW J150EII-P) Was used to mold Type-I dumbbell specimens according to ASTM D638.
- the obtained Type-I dumbbell specimen was used, and an “Instron” (registered trademark) universal testing machine (manufactured by Instron) was used as a testing machine.
- the tensile strength refers to a value obtained by dividing the load at the breaking point by the cross-sectional area. The value at this time was taken as the tensile strength ⁇ tp of the thermoplastic resin (c).
- Adhesive strength ⁇ rt, ⁇ ht of an integrally molded product Using an integrally molded product composed of a laminate and other members, 23 ° C. in accordance with “Test method for tensile shear bond strength of adhesive / rigid substrate” defined in JIS-K6850 (1999)
- the adhesive strength ⁇ rt at room temperature and the adhesive strength ⁇ ht in a high temperature atmosphere at 120 ° C. were measured.
- the method of integrating the laminate and other members differs depending on the embodiment, but after bonding so that the length of the bonded portion is 12.5 ⁇ 0.25 mm, the width is 25.0 ⁇ 0.25 mm. Cut out as follows.
- test piece was fixed with chucks attached to the top and bottom of a tensile test apparatus “Instron” (registered trademark) 5565 type universal material testing machine (manufactured by Instron Japan Co., Ltd.). After leaving for 10 minutes in a chamber set to °C or 120 °C, the number of test pieces n was set to 5 at a tensile speed of 1.6 mm / min.
- the adhesive strength of the integrally molded product was calculated from the following equation from the maximum breaking load P, the width B of the test piece, and the length L of the bonded portion.
- Thermosetting resin 2 (B-2) 100 parts by mass of ELM434 (tetraglycidyldiaminodiphenylmethane, manufactured by Sumitomo Chemical Co., Ltd.) as an epoxy resin, and Nonflex H (N, N′-diphenyl-p-phenylenediamine, Seiko Chemical Co., Ltd.) as an amine compound
- Thermosetting Resin 2 (B-) was prepared by blending 15 parts by weight of “Seika Cure” S (4,4′-diaminodiphenyl sulfone, manufactured by Wakayama Seika Co., Ltd.) as a curing agent. Obtained as 2).
- thermoplastic resin 1 (D-1) A pellet of PP resin (“Prime Polypro” J226E manufactured by Prime Polymer Co., Ltd.) was hot-pressed to produce a film-like substrate having a thickness of 100 ⁇ m to obtain thermoplastic resin 1 (D-1).
- thermoplastic resin 2 (D-2) A pellet of Ny6 resin (Toray Co., Ltd. “Amilan” CM1017) was hot-pressed to produce a film-like substrate having a thickness of 100 ⁇ m, and a thermoplastic resin 2 (D-2) was obtained.
- thermosetting resin (B) is applied to the reinforcing fiber (A) in the same manner as the prepreg 1 (P-1) except that the thermosetting resin 2 (B-2) is used as the thermosetting resin (B). Was impregnated to obtain prepreg 2 (P-2).
- thermoplastic resin 1 (D-1) is used as the thermoplastic resin (D), and the reinforcing fibers 1 (A-1) are arranged in one direction to form a plurality of reinforcing fiber groups.
- the reinforcing fiber (A) and the thermoplastic resin (D) are arranged so that the mass ratio (Wf) is 67%, and the thermoplastic resin (D) is arranged and pressed in a press machine having a hot platen temperature of 170 ° C. Was impregnated. After heating, the platen was cooled in a pressurized state until the hot platen temperature reached 100 ° C. to obtain prepreg 3 (P-3).
- thermoplastic resin 2 (D-2) is used as the thermoplastic resin (D), and the reinforcing fibers 1 (A-1) are arranged in one direction to form a plurality of reinforcing fiber groups.
- the reinforcing fiber (A) and the thermoplastic resin (D) are arranged so that the mass ratio (Wf) is 67%, and the thermoplastic resin (D) is arranged and pressed in a press machine with a hot platen temperature of 250 ° C. Was impregnated. After heating, the platen was cooled in a pressurized state until the hot platen temperature reached 140 ° C. to obtain prepreg 4 (P-4).
- Porous substrate 1 (C-1) A non-woven substrate was produced by a melt blow method using pellets of PPS resin (“Torelina” M2888 manufactured by Toray Industries, Inc.) to obtain porous substrate 1 (C-1). The characteristics of this porous substrate 1 (C-1) were as follows.
- the direction of the long side of the sheet cut into a rectangle is 0 °, and the fiber direction and material are [(C-1) / (P-1) 90 ° / (P-1) 0 ° / (P-1 ) 90 ° / (P-1) 0 ° / (P-1) 90 ° / (P-1) 0 ° / (P-1) 90 ° / (P-1) 0 ° / (P-1) 90 ° / (P-1) 0 ° / (P-1) 90 ° / (P-1) 0 ° / (P-1) 90 °] (C-1) were sequentially laminated from the bottom (indicated by arrow A) to obtain a preform 1.
- the preform 1 was heated at 160 ° C. for 30 minutes in a press molding machine while applying a surface pressure of 0.6 MPa to cure the thermosetting resin. After completion of curing, the laminate 1 was cooled at room temperature to obtain a laminate 1 having an average thickness of 1.6 mm.
- the properties of the obtained laminate 1 are summarized in Table 1.
- Example 1-2 Integrated molded product 1
- the laminated body 1 trimmed to an insertable shape was placed in an injection mold for manufacturing an integrally molded product 1 shown in FIG.
- a fiber reinforced pellet (“Torelina” A504X90 manufactured by Toray Industries, Inc.) having a matrix resin made of PPS resin and a glass fiber content of 40% by mass (Wf) was prepared.
- Wf 40% by mass
- an injection molded material having a shape as shown in FIG. 8 was formed by injection molding to produce an integrally molded product 1.
- the injection molding was performed using a J150EII-P injection molding machine manufactured by JSW, and the cylinder temperature was 320 ° C. and the mold temperature was 130 ° C.
- the characteristics of the obtained integrally molded product 1 are summarized in Table 1.
- Example 2-1 Laminate 2 In the same manner as in Example 1-1, except that the porous substrate 2 (C-2) using PEEK resin as the thermoplastic resin (c) was used as the porous substrate, an average thickness of 1. A 6 mm laminate 2 was obtained. The properties of the obtained laminate 2 are summarized in Table 1.
- Example 2-2 Integrated molded product 2
- fiber reinforced pellets (“VICTREX” PEEK 90GL30 manufactured by Victrex) with a matrix resin made of PEEK resin and a glass fiber content of 30% by mass (Wf) were prepared.
- the integrally molded product 2 was obtained in the same manner as in Example 1-2 except that the obtained laminate 2 was used as the laminate, the cylinder temperature was 370 ° C., and the mold temperature was 160 ° C. Obtained.
- Example 3-1 Laminate 3
- the porous substrate 3 (C-3) using PES resin as the thermoplastic resin (c) was used as the porous substrate, an average thickness of 1.
- a 6 mm laminated body 3 was obtained.
- the properties of the obtained laminate 3 are summarized in Table 1.
- Example 3-2 Integrated molded product 3
- a fiber reinforced pellet (Sumitomo Chemical Co., Ltd. “Sumika Excel” 3601GL30) having a matrix resin of PES resin and a glass fiber content (Wf) of 30% was prepared.
- the integrally molded product 3 was prepared in the same manner as in Example 1-2 except that the obtained laminate 3 was used as the laminate, the cylinder temperature was 360 ° C., and the mold temperature was 140 ° C. Obtained.
- Example 4-1 Laminate 4 In the same manner as in Example 1-1, except that the porous substrate 4 (C-4) using Ny6 resin as the thermoplastic resin (c) was used as the porous substrate, an average thickness of 1. A 6 mm laminate 4 was obtained. The properties of the obtained laminate 4 are summarized in Table 1.
- Example 4-2 Integrated molded product 4
- a fiber reinforced pellet Toray Industries, Inc. “Torayca” pellet TLP1060 having a matrix resin made of Ny6 resin and a carbon fiber content (Wf) of 30% was prepared.
- the integrally molded product 4 was obtained in the same manner as in Example 1-2 except that the obtained laminate 4 was used as the laminate, the cylinder temperature was 260 ° C., and the mold temperature was 80 ° C. Obtained.
- Example 5-1 Laminate 5
- a laminate 5 having an average thickness of 1.6 mm was obtained in the same manner as in Example 1-1 except that the porous substrate 5 (C-5) made of a carding mat was used as the porous substrate. It was.
- the properties of the obtained laminate 5 are summarized in Table 1.
- Example 5-2 Integrated molded product 5
- An integrally molded product 5 was obtained in the same manner as in Example 1-2, except that the obtained laminate 5 was used as the laminate.
- Example 6-1 Laminate 6 A laminate 6 having an average thickness of 1.6 mm was obtained in the same manner as in Example 1-1 except that the porous substrate 6 (C-6) made of PPS fibers was used as the porous substrate. .
- the properties of the obtained laminate 6 are summarized in Table 1.
- Example 6-2 Integrated molded product 6
- An integrally molded product 6 was obtained in the same manner as in Example 1-2, except that the obtained laminate 6 was used as the laminate.
- Example 7-1 Laminate 7 A laminate 7 having an average thickness of 1.6 mm was obtained in the same manner as in Example 1-1, except that the porous substrate 7 (C-7) made of PPS resin was used as the porous substrate. .
- the properties of the obtained laminate 7 are summarized in Table 1.
- Example 7-2 Integrated molded product 7
- An integrally molded product 7 was obtained in the same manner as in Example 1-2, except that the obtained laminate 7 was used as the laminate.
- Example 8-1 Laminate 8
- Example 8-1 Laminate 8
- Table 2 The properties of the obtained laminate 8 are summarized in Table 2.
- Example 8-2 Integrated molded product 8
- a plate having the same shape as the laminate 8 was obtained by injection molding. These are overlaid as shown in FIG. 9 (a), and after pressurizing for 5 minutes by applying a surface pressure of 1.0 MPa with a press molding machine having a mold temperature of 320 ° C., heating is stopped and cooling water is poured into the mold. It was cooled in a pressurized state until the mold temperature reached 100 ° C. (FIG. 9B). After cooling, the mold was opened and the molded product was taken out (FIG. 9C) to obtain an integrated molded product 8.
- Example 9-1 Laminate 9 A laminate having an average thickness of 1.6 mm, as in Example 1-1, except that the porous substrate 8 (C-8) of a porous film made of PPS resin was used as the porous substrate. 9 was obtained. The properties of the obtained laminate 9 are summarized in Table 2.
- Example 9-2 Integrated molded product 9
- An integrally molded product 9 was obtained in the same manner as in Example 1-2, except that the obtained laminate 9 was used as the laminate.
- Example 10-1 Laminate 10
- P-2 prepreg 2
- B-2 thermosetting resin 2
- B thermosetting resin
- Example 10-2 Integrated molded product 10
- An integrally molded product 10 was obtained in the same manner as in Example 1-2, except that the obtained laminate 10 was used as the laminate.
- Example 11-1 Laminate 11
- Example 1-1 except that the porous substrate 9 (C-9) made of PP resin was used as the porous substrate, and the thermosetting resin was cured by heating at 130 ° C. for 2 hours. Thus, a laminate 11 having an average thickness of 1.6 mm was obtained.
- the properties of the obtained laminate 11 are summarized in Table 2.
- Example 11-2 Integrated molded product 11
- the matrix resin is made of PP resin, and the glass fiber content is 20% by mass ratio (Wf).
- Fiber-reinforced pellets (Prime Polymer Co., Ltd.) “Prime Polypro” V7000) was prepared. Using this pellet, an integrally molded product 11 was obtained in the same manner as in Example 1-2 except that the cylinder temperature was 230 ° C. and the mold temperature was 60 ° C.
- Example 12-1 Laminate 12
- the prepreg 3 (P-3) using the thermoplastic resin 1 (D-1) was used as the thermoplastic resin (D), the heating temperature was pressurized at 170 ° C. for 10 minutes, and the thermoplastic resin was melted. Thereafter, a laminate 12 having an average thickness of 1.6 mm was obtained in the same manner as in Example 1-1 except that the hot plate temperature was cooled to 100 ° C. in a pressurized state.
- the properties of the obtained laminate 12 are summarized in Table 2.
- Example 12-2 Integrated molded product 12
- An integrally molded product 12 was obtained in the same manner as in Example 1-2, except that the obtained laminate 12 was used as the laminate.
- Example 13-1 Laminate 13
- the prepreg 4 (P-4) using the thermoplastic resin 1 (D-2) was used as the thermoplastic resin (D), the heating temperature was pressurized at 250 ° C. for 10 minutes, and the thermoplastic resin was melted. Thereafter, a laminate 13 having an average thickness of 1.6 mm was obtained in the same manner as in Example 1-1 except that the hot plate was cooled in a pressurized state until reaching 140 ° C.
- the properties of the obtained laminate 13 are summarized in Table 2.
- Example 13-2 Integrated molded product 13
- An integrally molded product 13 was obtained in the same manner as in Example 1-2, except that the obtained laminate 13 was used as the laminate.
- Example 1-2 Integrated molded product 15
- a fiber reinforced pellet (“Prime Polypro” E7000 manufactured by Prime Polymer Co., Ltd.) having a matrix resin made of PP resin and a glass fiber content of 30% by mass (Wf) was prepared.
- the integrally molded product 15 was obtained in the same manner as in Example 1-2, except that the obtained laminate 15 was used as the laminate, the cylinder temperature was 230 ° C., and the mold temperature was 60 ° C. Obtained.
- the laminated body of the present invention is superior in heat resistant adhesiveness because an adhesive resin layer having high heat resistance is easily and firmly formed on the surface of the laminated body as compared with the conventional laminated body. Furthermore, the laminate of the present invention is an integrated molded product that easily exhibits high heat-resistant adhesiveness by thermal welding via a thermoplastic resin present on the surface. Moreover, the manufacturing method of the laminated body of this invention is a point which can form the adhesive resin layer with high heat resistance firmly and easily on the surface of a laminated body compared with the manufacturing method of the conventional laminated body. Excellent.
- the laminate and the integrally molded product of the present invention are suitably used for a wide range of applications such as electrical and electronic equipment casings and parts, automotive parts, vehicle-related parts, aerospace-related parts, civil engineering and building-related parts. be able to.
- Porous substrate (C) made of thermoplastic resin (c) 2 Thermosetting resin (B) 3 Laminated Body 4 Fiber Reinforced Resin 5 Consisting of Reinforcing Fiber (A) and Thermosetting Resin (B) 5 Co-continuous Structure Layer 6 Consisting of Porous Base Material (C) and Thermosetting Resin (B) 6 Thermosetting Resin ( B) Unimpregnated layer 7 of porous substrate (C) not impregnated 7 Preform 8 Reinforcing fiber (A) 9 Substrate (p) 10 Thermosetting resin (B) 11 Prepreg 12 Base material (P) 13 Surface 14 of Laminated Body Molten or softened and expanded porous substrate (C) 15 Other members 16 Mold (movable side) 17 Mold (fixed side) 18 Injection molding machine 19 Injection molding material (other parts) 20 Integrated molded products
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Abstract
Description
(1)熱可塑性樹脂(c)からなる多孔質基材(C)と強化繊維(A)と熱硬化性樹脂(B)、または、
熱可塑性樹脂(c)からなる多孔質基材(C)と強化繊維(A)と熱可塑性樹脂(D)、を有してなる積層体であって、
多孔質基材(C)が、該積層体の厚み方向に連続した空隙部を有し、かつ、融点または軟化点が180℃より高く、
多孔質基材(C)が、該積層体の一方の表面において、その一方の表面に対して10%以上露出していることを特徴とする積層体。
(2)多孔質基材(C)が連続体である(1)に記載の積層体。
(3)熱硬化性樹脂(B)と多孔質基材(C)、または、
熱可塑性樹脂(D)と多孔質基材(C)が、共連続構造を形成してなる(1)または(2)に記載の積層体。
(4)(1)~(3)のいずれかに記載の積層体と他の部材が一体化されてなる一体化成形品。
(5)(4)に記載の一体化成形品の製造方法であって、積層体を得る工程と別の工程で他の部材と一体化されてなる一体化成形品の製造方法。
(6)強化繊維(A)と熱硬化性樹脂(B)とからなる基材(p)に、熱可塑性樹脂(c)からなる多孔質基材(C)を表層に積層したプリフォームを、加熱ならびに加圧により成形する積層体の製造方法であって、
該多孔質基材(C)の融点および軟化点以下の温度条件下において、該多孔質基材(C)に熱硬化性樹脂(B)を含浸させるとともに硬化させて該プリフォームを成形することを特徴とする積層体の製造方法。
(7)多孔質基材(C)の融点または軟化点が180℃よりも高い(6)に記載の積層体の製造方法。
(8)多孔質基材(C)が厚み方向に連続した空隙部を有する(6)または(7)に記載の積層体の製造方法。
(9)多孔質基材(C)が、積層体の少なくとも一方の表面において、その表面に対して10%以上露出している(6)~(8)のいずれかに記載の積層体の製造方法。
(10)多孔質基材(C)が連続体である(6)~(9)のいずれかに記載の積層体の製造方法。
(11)(6)~(10)のいずれかに記載の積層体の製造方法で得られる積層体と他の部材を一体化する一体化成形品の製造方法。
(12)積層体と他の部材を一体化してなる一体化成形品であって、
該積層体は、熱可塑性樹脂(c)からなる多孔質基材(C)と強化繊維(A)と熱硬化性樹脂(B)、または、熱可塑性樹脂(c)からなる多孔質基材(C)と強化繊維(A)と熱可塑性樹脂(D)、を有し、
該積層体の他の部材と一体化する側の表層は、多孔質基材(C)と、熱硬化性樹脂(B)または熱可塑性樹脂(D)が共連続構造を形成し、
多孔質基材(C)が、該積層体の他の部材と一体化する側の表面において、その表面に対して10%以上露出し、次式のいずれかの関係を満たすことを特徴とする一体化成形品。
熱硬化性樹脂(B)の熱膨張係数Eb<多孔質基材(C)の熱膨張係数Ec
熱可塑性樹脂(D)の熱膨張係数Ed<多孔質基材(C)の熱膨張係数Ec
(13)多孔質基材(C)が、該積層体の厚み方向に連続した空隙部を有する(12)に記載の一体化成形品。
(14)多孔質基材(C)が連続体である(12)または(13)に記載の一体化成形品。
(15)熱溶着によって一体化する(12)~(14)のいずれかに記載の一体化成形品の製造方法。
(16)積層体を予熱し、多孔質基材(C)を溶融または軟化状態にした後、他の部材と加圧することにより一体化する(15)に記載の一体化成形品の製造方法。
(17)積層体を予熱および加圧した後の、積層体の表面に露出している多孔質基材(C)の面積が、予熱および加圧前の露出面積の2倍以上である(15)または(16)に記載の一体化成形品の製造方法。
本発明における強化繊維(A)は、積層体の強度や弾性率などの力学特性を発現させることを目的として、例えば、Eガラス、Cガラス、Sガラス、Dガラスなどからなるガラス繊維、ポリアクリロニトリル系、レーヨン系、リグニン系、ピッチ系の炭素繊維、ステンレス、鉄、金、銀、アルミニウム、それらの合金などからなる金属繊維、芳香族ポリアミド繊維、ポリアラミド繊維、アルミナ繊維、炭素珪素繊維、ボロン繊維、セラミック繊維が好ましく例示される。これらは、単独または2種以上を併用して用いてもよい。これらの強化繊維は、表面処理が施されているものであっても良い。表面処理としては、金属の被着処理、カップリング剤による処理、サイジング剤による処理、添加剤の付着処理などが好ましく例示される。サイジング剤としては、特に限定されないが、カルボキシル基、アミノ基、水酸基およびエポキシ基からなる群より選択される少なくとも1種の官能基を1分子中に3個以上有する化合物が好ましい。官能基は1分子中に2種類以上が混在しても良く、1種類の官能基を1分子中に3個以上有する化合物を2種類以上併用しても良い。強化繊維(A)としては、高強度、高弾性率の観点からは、金属繊維、ガラス繊維、および炭素繊維が好ましく、中でも軽量性の観点からは比重が小さく、比強度、比剛性に優れる炭素繊維が好ましく使用される。とりわけ、安価な生産コストを実現できる点で、ポリアクリロニトリル系炭素繊維が、好ましく用いられる。
本発明における熱硬化性樹脂(B)は、積層体の強度などの力学特性、耐熱性に優れた樹脂が好ましく、例えば、不飽和ポリエステル、ビニルエステル、エポキシ、フェノール(レゾール型)、ユリア・メラミン、ポリイミド、これらの共重合体、変性体、および、これらの少なくとも2種類をブレンドした樹脂が好ましく例示される。他の特性を付与するために、例えば、耐衝撃性向上の観点から、熱硬化性樹脂(B)には、エラストマーもしくはゴム成分が添加されていても良い。
本発明における熱可塑性樹脂(c)からなる多孔質基材(C)は、積層体に他の部材との接着機能を付与することを目的としている。熱可塑性樹脂(c)としては、ポリエチレンテレフタレート(PET)樹脂、ポリブチレンテレフタレート(PBT)樹脂、ポリトリメチレンテレフタレート(PTT)樹脂、ポリエチレンナフタレート(PENp)樹脂、液晶ポリエステル等のポリエステル系樹脂や、ポリエチレン(PE)樹脂、ポリプロピレン(PP)樹脂、ポリブチレン樹脂等のポリオレフィン樹脂や、スチレン系樹脂、ウレタン樹脂の他や、ポリオキシメチレン(POM)樹脂、ポリアミド(PA)樹脂、ポリカーボネート(PC)樹脂、ポリメチルメタクリレート(PMMA)樹脂、ポリ塩化ビニル(PVC)樹脂、ポリフェニレンサルファイド(PPS)樹脂などのポリアリーレンスルフィド(PAS)樹脂、ポリエーテルスルホン(PES)樹脂、ポリアミドイミド(PAI)樹脂、ポリエーテルイミド(PEI)樹脂、ポリスルホン(PSU)樹脂、変性PSU樹脂、ポリケトン(PK)樹脂、ポリエーテルケトン(PEK)樹脂、ポリエーテルエーテルケトン(PEEK)樹脂、ポリエーテルケトンケトン(PEKK)樹脂、ポリアリレート(PAR)樹脂、ポリエーテルニトリル(PEN)樹脂、熱可塑性ポリイミド(PI)樹脂、ポリフェニレンエーテル(PPE)樹脂、変性PPE樹脂、およびポリアミド(PA)樹脂が例示される。また、これらの熱可塑性樹脂は、上述の熱可塑性樹脂の共重合体や変性体、および/または2種類以上ブレンドした樹脂などであっても良く、さらに用途等に応じ、本発明の目的を損なわない範囲で適宜、他の充填材や添加剤を含有しても良い。例えば、熱可塑性樹脂(c)の難燃性を高めるために難燃剤を添加する、あるいは繊維基材を作製しやすくするために可塑剤を添加することなどができる。
・密度の比=ρm/ρ
このとき密度の比が0.8よりも高い場合、多孔質基材(C)への熱硬化性樹脂(B)または熱可塑性樹脂(D)の含浸が困難となることがあり、他の部材と一体化は可能であるが、多孔質基材(C)の熱硬化性樹脂(B)または熱可塑性樹脂(D)未含浸部が脆弱部となり、十分な接着強度を発現することが不可能であることがある。密度の比において、特に限定はされないが、0.01以上であれば、強固な接着層を形成するための熱硬化性樹脂の含浸性と他の部材との接着性を発現するための露出を両立することが可能となる。
本発明における熱可塑性樹脂(D)は、用いる多孔質基材(C)よりも融点または軟化点が低い熱可塑性樹脂であることが好ましく用いられ、前述した熱可塑性樹脂(c)の項に記した樹脂を目的に応じて用いることができる。このとき、熱可塑性樹脂(D)の融点または軟化点は、多孔質基材(C)への含浸の観点から、多孔質基材(C)の融点または軟化点より10℃以上低いことが好ましく、30℃以上がより好ましい。融点または軟化点の差の上限は特にないが、熱可塑性樹脂(D)の融点または軟化点が低すぎると、積層体の耐熱性が劣るため、積層体としての耐熱性を維持することが出来なくなるため好ましくない。
本発明におけるプリフォームは、図3(a)に示すように強化繊維(A)、熱硬化性樹脂(B)からなる基材(p)に、熱可塑性樹脂(c)からなる多孔質基材(C)を表層に積層したプリフォームであることが好ましい。このとき、強化繊維(A)および熱硬化性樹脂(B)で構成される材料を積層した基材(p)の表層に多孔質基材(C)を積層したプリフォームや、図3(b)に示すようにあらかじめ強化繊維(A)に熱硬化性樹脂(B)を含浸させて得られるプリプレグの表層に多孔質基材(C)を積層したプリフォームを用いても良い。強化繊維(A)に熱硬化性樹脂(B)を含浸させる方法としては、特に限定されないが、例えば、熱硬化性樹脂(B)をメチルエチルケトンやメタノールなどの有機溶媒に溶解させて低粘度化し、強化繊維(A)を浸漬させながら含浸させた後、オーブンなどを用いて有機溶媒を蒸発させてプリプレグとするウェット法、熱硬化性樹脂(B)を加熱により低粘度化し、ロールや離型紙上にフィルムを作製し、ついで強化繊維(A)の両側あるいは片側からそのフィルムを重ね、加熱および加圧することにより含浸させるホットメルト法などが挙げられる。また本発明の製造方法で得られる積層体の力学特性や軽量性、賦型性などを考慮して、図3(c)に示すように基材(p)を複数積層したプリフォームを用いても良い。例えば、基材(p)を複数枚積層することにより、強化繊維(A)として一方向性ストランドからなる基材(p)を用いた場合、積層体および一体化成形品の特定の方向に強度分布を持たせることも可能である。
本発明の積層体の一方の表面において、多孔質基材(C)が積層体のその一方の表面に対して10%以上露出していることが好ましく、接着性の観点から30%以上の露出であることがより好ましく、さらに50%以上の露出であることが好ましい。熱可塑性樹脂(c)の露出が大きくなることで、他の部材との接着面において熱可塑性樹脂(c)と他の部材が接触する面積割合が大きくなるため好ましい。多孔質基材(C)の露出の割合について、上限はないが、熱硬化性樹脂(B)または熱可塑性樹脂(D)と多孔質基材(C)の交絡による強固な接着層を形成させる観点から、90%以下であることが好ましい。ここで言う「露出している」とは、図4(a)に示したように積層体の一方の表面を矢印方向から観察した際に、図4(b)に示したように多孔質基材(C)が表面に現れている状態のことであり、表面観察によって視認できる。図1(c)に示す状態も多孔質基材(C)が露出していると言えるが、多孔質基材(C)が熱硬化性樹脂(B)または熱可塑性樹脂(D)に固定されておらず、同じ露出の割合であった場合、図1(a)に示したような多孔質基材(C)が熱硬化性樹脂(B)または熱可塑性樹脂(D)に固定されている形態が好ましい。
本発明の積層体は、他の部材が一体化することにより一体化成形品とすることができる。他の部材を一体化させる手段としては、特に限定されないが、例えば、(i)積層体と他の部材を別々に予め成形しておき、両者を一体化する方法、つまり、積層体を得る工程とは別の工程において、積層体と他の部材とを一体化する方法、(ii)積層体を予め成形しておき、他の部材を成形すると同時に両者を一体化する方法、がある。本発明の積層体と他の部材は、熱溶着によって一体化されることが好ましく、前記(i)の具体例としては、積層体をプレス成形し、他の部材をプレス成形ないし射出成形にて作製する。作製したそれぞれの部材を、熱板溶着、振動溶着、超音波溶着、レーザー溶着、抵抗溶着、誘導加熱溶着、などの公知の溶着手段により接合する方法がある。一方、前記(ii)の具体例としては、積層体をプレス成形し、次いで射出成形金型にインサートし、他の部材を形成する材料を金型に射出成形し、溶融ないし軟化状態にある材料の熱量で積層体の表面に露出している多孔質基材(C)を溶融ないし軟化させて接合する方法がある。また、前記(ii)の別の具体例としては、積層体をプレス成形し、次いでプレス成形金型内に配置し、他の部材を形成する材料をプレス成形金型内にチャージし、プレス成形することで、前記と同様の原理で接合する方法がある。一体化成形品の量産性の観点からは、好ましくは(ii)の方法であって、射出成形としてインサート射出成形やアウトサート射出成形、および、プレス成形としてスタンピング成形やヒートアンドクール成形が好ましく使用される。
本発明の一体化成形品は、 積層体と他の部材を一体化してなり、積層体の他の部材と一体化する側の表層は、多孔質基材(C)と熱硬化性樹脂(B)または熱可塑性樹脂(D)が共連続構造を形成していることが必要である。このような構造を表層に形成することにより、他の部材との接着層として強固に一体化され、接着層における層間剥離などが生じにくくなる。また共連続構造の形成により、表層に満遍なく熱硬化性樹脂(B)または熱可塑性樹脂(D)が存在するため、他の部材との安定した接着強度が発現される。
本発明の積層体の製造方法は、強化繊維(A)と熱硬化性樹脂(B)からなる基材(p)に熱可塑性樹脂(c)からなる多孔質基材(C)を表層に積層したプリフォームを、加熱ならびに加圧により成形することが好ましい。このような表層に多孔質基材(C)を積層したプリフォームを用いて成形することにより、加熱によって粘度が低下した熱硬化性樹脂(B)が、加圧により多孔質基材(C)に含浸し、積層体表面に強固な接着層を形成した積層体を容易に製造することができる。プリフォームを、加熱ならびに加圧により成形する手法としては、特に限定されるものではなく、ハンドレイアップ成形法、スプレーアップ成形法、真空バック成形法、加圧成形法、オートクレーブ成形法、プレス成形法、トランスファー成形法、スタンピング成形法などの熱硬化樹脂を使用した公知の成形方法が用いられる。多孔質基材(C)への熱硬化性樹脂(B)の含浸性の観点からは、連続的に加熱ならびに加圧により成形される真空バック成形法、オートクレーブ成形法、プレス成形法が好ましく、プロセスの簡易性の観点から、プレス成形法がより好ましく用いられる。
本発明の一体化成形品の製造方法は、上記のようにして得られる積層体と他の部材を一体化する方法であり、積層体と他の部材を一体化させる方法としては、特に限定はされないが、例えば、(i)積層体と他の部材を別々に予め成形しておき、両者を一体化する方法、つまり、積層体を得る工程とは別の工程において、積層体と他の部材とを一体化する方法、(ii)積層体を予め成形しておき、他の部材を成形すると同時に両者を一体化する方法、がある。本発明の製造方法で得られる積層体と他の部材は、熱溶着によって一体化されることが好ましく、前記(i)の具体例としては、積層体をプレス成形し、他の部材をプレス成形ないし射出成形にて作製する。作製したそれぞれの部材を、熱板溶着、振動溶着、超音波溶着、レーザー溶着、抵抗溶着、誘導加熱溶着、などの公知の溶着手段により接合する方法がある。プロセスの簡易性の観点から、熱板溶着、超音波溶着が好ましく用いられる。一方、前記(ii)の具体例としては、積層体をプレス成形し、次いで射出成形金型にインサートし、他の部材を形成する材料を金型に射出成形し、溶融ないし軟化状態にある材料の熱量で積層体の表面に露出している多孔質基材(C)を溶融ないし軟化させて接合する方法がある。また、前記(ii)の別の具体例としては、積層体をプレス成形し、次いでプレス成形金型内に配置し、他の部材を形成する材料をプレス成形金型内にチャージし、プレス成形することで、前記と同様の原理で接合する方法がある。一体化成形品の量産性の観点からは、好ましくは(ii)の方法であって、射出成形としてインサート射出成形やアウトサート射出成形、および、プレス成形としてスタンピング成形やヒートアンドクール成形が好ましく使用される。このとき、積層体を予熱し、多孔質基材(C)を溶融または軟化状態にした後、他の部材と加圧することにより一体化することが好ましい。図6(a)に示す積層体を予熱し、無加圧の条件下において、多孔質基材(C)を溶融または軟化させることで、図6(b)に示すように熱可塑性樹脂(c)が膨張して積層体の表面に露出している部分が盛りあがる。このような状態とした後、他の部材と加圧することにより、膨張して盛りあがった熱可塑性樹脂(c)が積層体および他の部材の表面に広がり(図6(c))、接着面積が広がることで高い接着強度を発現することから好ましい。このとき、積層体を予熱及び加圧した後の積層体の表面に露出している多孔質基材(C)の面積が、予熱および加圧前の露出面積の2倍以上であることが好ましく、3倍以上がより好ましい。予熱および加圧前後の露出面積の比について、上限はないが、高すぎると多孔質基材が多く流出することとなり、ヒケを引き起こす可能性があるため、10倍以下であることが好ましく、8倍以下がより好ましい。
本発明の積層体および一体化成形品、本発明の製造方法で得られる積層体および一体化成形品の用途としては、高温雰囲気においても高い接着性、形状維持が要求される分野における製品がある。例えば、電気・電子機器筐体として好適であり、コンピューター、テレビ、カメラ、オーディオプレイヤー等に好適に使用される。また電気・電子部品用途に好適であり、コネクター、LEDランプ、ソケット、光ピックアップ、端子板、プリント基板、スピーカー、小型モーター、磁気ヘッド、パワーモジュール、発電機、電動機、変圧器、変流器、電圧調整器、整流器、インバーター等に好適に使用される。その他にも、自動車用部品や車両関連部品等に好適であり、インストルメントパネル、コンソールボックス、ピラー、ルーフレール、フェンダー、バンパー、ドアパネル、ルーフパネル、フードパネル、トランクリッド、ドアミラーステー、スポイラー、フードルーバー、ホイールカバー、ホイールキャップ、ガーニッシュ、インテークマニホールド、燃料ポンプ、エンジン冷却水ジョイント、ワイパー、エンジン周辺部品、ランプハウジング、ランプリフレクター、ランプソケット等に好適に使用される。さらに、航空・宇宙分野や土木建築分野などの各種分野にも有用である。
熱可塑性樹脂(c)からなる多孔質基材(C)の融点および軟化点を次のようにして評価した。まず、熱可塑性樹脂(c)のうち結晶性樹脂を用いた場合は、JIS-K7121(2012)に規定される「プラスチックの転移温度測定方法」に準拠して融点を測定した。多孔質基材(C)の作製に用いた熱可塑性樹脂(c)ないし多孔質基材(C)を、炉内温度50℃で制御された真空乾燥機中で24時間以上乾燥させた後、細かく裁断して試料を準備した。試料を、示差走査熱量測定装置(TA Instruments社製、DSC Q2000)にかけ、昇温速度10℃/分で規格による融点を得た。
得られた積層体の一方の表面の任意の位置において、超深度カラー3D形状測定顕微鏡VK-9500(コントローラー部)/VK-9510(測定部)(株式会社キーエンス製)を使用して拡大倍率200倍で撮影した。このとき、観察対象である多孔質基材(C)の繊維径が細く観察が困難な場合、観察する倍率を拡大して同様に積層体表面の画像を撮影することができる。撮影した画像より解析アプリケーションVK-H1A9を使用して、多孔質基材(C)の面積Acn(n=1)を測定し、このときの測定範囲を全体面積An(n=1)とした。得られたAcn、Anから次式より、多孔質基材(C)の露出率En(n=1)として算出した。
・En=(Acn/An)×100[%]
上記操作を10回繰り返し、得られた露出率En(n=1~10)の平均値を算出して、多孔質基材(C)の露出率Eとした。
キャピログラフ1D型(東洋精機製作所株式会社製)を使用して、多孔質基材(C)を作製するときの温度におけるせん断速度1000sec-1において熱可塑性樹脂(c)の溶融粘度を測定した。このとき、孔径1mmφ、L/D=10のダイスを用いた。
多孔質基材(C)に用いる熱可塑性樹脂(c)の樹脂ペレットまたは成形品を用いて、JIS-Z8807(2012)に規定される「固体の密度及び比重の測定方法」の液中ひょう量法に準拠して熱可塑性樹脂(c)の密度ρtpを測定した。ついで、多孔質基材(C)について、JIS-L1913(2010)に規定される「一般不織布試験方法-厚さ」のA~C法に準拠し、多孔質基材(C)の厚みTcを測定した。ついで、「一般不織布試験方法-単位面積当たりの質量」に準拠し、多孔質基材(C)の質量Mcを測定し、このとき用いた多孔質基材(C)の面積を多孔質基材(C)の面積Scとした。得られたTc、Mc、Scから次式より、多孔質基材(C)の嵩密度ρcを算出した。
・ρc=Mc/(Tc×Sc)
得られた熱可塑性樹脂(c)の密度ρtp、多孔質基材(C)の嵩密度ρcから次式より、多孔質基材(C)の密度の比を算出した。
・密度の比=ρc/ρtp。
上記評価方法4で得られたMc、Scから次式より、多孔質基材(C)の目付けWcを算出した。
・Wc=Mc/Sc。
多孔質基材(C)に用いる熱可塑性樹脂(c)の樹脂ペレットを炉内温度50℃で制御された真空乾燥機において24時間以上乾燥させた後、射出成形機(JSW社J150EII-P)を用いて、ASTM D638に準拠したType-Iのダンベル試験片を成形した。得られたType-Iのダンベル試験片を用い、試験機として、"インストロン"(登録商標)万能試験機(インストロン社製)を用いた。本発明において、引張強度とは、破断点の荷重を断面積で除したものを指す。このときの値を熱可塑性樹脂(c)の引張強度σtpとした。
積層体において多孔質基材(C)の厚さ方向と直角方向の任意の50箇所が観察できるようにエポキシ樹脂で包埋し、エポキシ樹脂の硬化後、観察面の研磨を行い、断面観察用サンプルを作製した。積層体の断面全体を超深度カラー3D形状測定顕微鏡VK-9500(コントローラー部)/VK-9510(測定部)(株式会社キーエンス製)を使用して拡大倍率200倍で撮影した。断面全体を撮影した画像より解析アプリケーションVK-H1A9を使用して、多孔質基材(C)の外接円の直径を測定した。その後、それらの平均値を算出し、多孔質基材(C)の繊維径φcとした。
積層体と他の部材からなる一体化成形品を用いて、JIS-K6850(1999)に規定される「接着剤-剛性被着材の引張せん断接着強さ試験方法」に準拠して、23℃の室温における接着強度σrtおよび120℃の高温雰囲気下における接着強度σhtを測定した。積層体と他の部材の一体化方法は実施例によって異なるが、接着部分の長さが12.5±0.25mmとなるように接着させた後、幅が25.0±0.25mmとなるように切り出した。得られた試験片を引張試験装置"インストロン"(登録商標)5565型万能材料試験機(インストロン・ジャパン(株)製)の上下に取り付けたチャックで固定し、庫内の雰囲気温度を23℃または120℃とした庫内で10分間放置した後、引張速度1.6mm/分で試験片数nを5として評価を行った。この時の最大破断荷重P、試験片の幅Bと接着部分の長さLから次式より一体化成形品の接着強度を算出した。
・σrt、σht=P/(B×L)
評価は、20MPa以上の場合を◎、10MPa以上20MPa未満を○、5MPa以上10MPa未満を△、5MPa未満を×とした。
多孔質基材(C)を用いて、JIS-L1913(2010)に規定される「一般不織布試験方法-通気性」のフラジール形法に準拠して、多孔質基材(C)の連続した空隙部の状態(通気度)を測定した。
JIS K7197(1991)に規定される「プラスチックの熱機械分析による線膨張率試験方法」を参考にして、各材料の熱膨張係数を評価した。本評価における試験片は、実施例または比較例の各材料を用いた。この時、一辺の長さが5mmとなるように試験片を作製した。測定数はn=5とし、平均値を各材料の熱膨張係数とした。
[強化繊維1(A-1)]
ポリアクリロニトリルを主成分とする重合体から紡糸、焼成処理を行い、総フィラメント数12000本の連続炭素繊維を得た。さらに該連続炭素繊維を電解表面処理し、120℃の加熱空気中で乾燥して炭素繊維1(A-1)を得た。この炭素繊維1(A-1)の特性は次に示す通りであった。
単繊維径:7μm
引張強度:4.9GPa
引張弾性率:230GPa
[熱硬化性樹脂1(B-1)]
エポキシ樹脂として、エポトートYD128(東都化成(株)社製)を40質量部、エポトートYD128G(東都化成(株)社製)を20質量部、エピコート1001(ジャパンエポキシレジン(株)社製)を20質量部、エピコート1009(ジャパンエポキシレジン(株)社製)を20質量部、硬化剤としてDICY7(ジャパンエポキシレジン(株)社製、ジシアンジアミド)を4質量部、DCMU99(保土ヶ谷化学(株)社製、3-(3,4-ジクロロフェニル)-1,1-ジメチルウレア)を3質量部、その他添加剤としてビニレックK(チッソ(株)社製、ポリビニルホルマール)5質量部を配合したものを熱硬化性樹脂1(B-1)として得た。
[熱硬化性樹脂2(B-2)]
エポキシ樹脂として、ELM434(テトラグリシジルジアミノジフェニルメタン、住友化学(株)社製)を 100質量部、アミン化合物として、ノンフレックスH(N,N’-ジフェニル-p-フェニレンジアミン、精工化学(株)社製)を15質量部、硬化剤として、“セイカキュア”S(4,4’-ジアミノジフェニルスルホン、和歌山精化(株)社製)を30質量部配合したものを熱硬化性樹脂2(B-2)として得た。
[熱可塑性樹脂1(D-1)]
PP樹脂(プライムポリマー(株)社製“プライムポリプロ”J226E)のペレットを熱プレスし、厚み100μmのフィルム状の基材を作製し、熱可塑性樹脂1(D-1)を得た。
[熱可塑性樹脂2(D-2)]
Ny6樹脂(東レ(株)“アミラン”CM1017)のペレットを熱プレスし、厚み100μmのフィルム状の基材を作製し、熱可塑性樹脂2(D-2)を得た。
[プリプレグ1(P-1)]
強化繊維(A)として強化繊維1(A-1)を、熱硬化性樹脂(B)として熱硬化性樹脂1(B-1)を用い、強化繊維1(A-1)を一方向に配列して多数本の強化繊維群を形成し、強化繊維の含有量が質量割合(Wf)で67%となるように、強化繊維(A)に熱硬化性樹脂(B)を含浸させプリプレグ1(P-1)を得た。
熱硬化性樹脂(B)として熱硬化性樹脂2(B-2)を用いたこと以外は、プリプレグ1(P-1)と同様にして、強化繊維(A)に熱硬化性樹脂(B)を含浸させプリプレグ2(P-2)を得た。
熱可塑性樹脂(D)として熱可塑性樹脂1(D-1)を用い、強化繊維1(A-1)を一方向に配列して多本数の強化繊維群を形成し、強化繊維の含有量が質量割合(Wf)で67%となるように強化繊維(A)と熱可塑性樹脂(D)を配置し、熱盤温度を170℃としたプレス機内に配置・加圧して熱可塑性樹脂(D)を含浸させた。加熱後、加圧状態のまま熱盤温度が100℃となるまで冷却を行い、プリプレグ3(P-3)を得た。
熱可塑性樹脂(D)として熱可塑性樹脂2(D-2)を用い、強化繊維1(A-1)を一方向に配列して多本数の強化繊維群を形成し、強化繊維の含有量が質量割合(Wf)で67%となるように強化繊維(A)と熱可塑性樹脂(D)を配置し、熱盤温度を250℃としたプレス機内に配置・加圧して熱可塑性樹脂(D)を含浸させた。加熱後、加圧状態のまま熱盤温度が140℃となるまで冷却を行い、プリプレグ4(P-4)を得た。
PPS樹脂(東レ(株)社製“トレリナ”M2888)のペレットを用い、メルトブロー法にて、不織布状の基材を製造し、多孔質基材1(C-1)とした。この多孔質基材1(C-1)の特性は次に示す通りであった。
単繊維径:7.8μm
融点:278℃
目付け:40g/m2
引張強度:50MPa
熱膨張係数:75×10-6/℃
厚み:0.2mm
通気度:100cm3/cm2・s
[多孔質基材2(C-2)]
PEEK樹脂(ビクトレックス社製“VICTREX”PEEK 90P)のペレットを用い、メルトブロー法にて、不織布状の基材を製造し、多孔質基材2(C-2)とした。この多孔質基材2(C-2)の特性は次に示す通りであった。
単繊維径:7.5μm
融点:343℃
目付け:40g/m2
引張強度:100MPa
熱膨張係数:70×10-6/℃
厚み:0.2mm
通気度:90cm3/cm2・s
[多孔質基材3(C-3)]
PES樹脂(住友化学(株)社製“スミカエクセル”4100G)のペレットを用い、メルトブロー法にて、不織布状の基材を製造し、多孔質基材3(C-3)とした。この多孔質基材3(C-3)の特性は次に示す通りであった。
単繊維径:7.5μm
軟化点:226℃
目付け:40g/m2
引張強度:84MPa
熱膨張係数:60×10-6/℃
厚み:0.2mm
通気度:120cm3/cm2・s
[多孔質基材4(C-4)]
Ny6樹脂(東レ(株)“アミラン”CM1017)のペレットを用い、メルトブロー法にて、不織布状の基材を製造し、多孔質基材4(C-4)とした。この多孔質基材4(C-4)の特性は次に示す通りであった。
単繊維径:7.0μm
融点:225℃
目付け:40g/m2
引張強度:85MPa
熱膨張係数:80×10-6/℃
厚み:0.2mm
通気度:80cm3/cm2・s
[多孔質基材5(C-5)]
PPS樹脂からなるマルチフィラメントを長さ25mmにカットし、チョップドファイバーを得た。チョップドファイバーを開綿機に投入して当初の太さのPPS繊維束がほとんど存在しない、綿上のPPS繊維集合体を得た。このPPS繊維集合体を直径600mmのシリンダーロールを有するカーディング装置により、カーディングマットからなる多孔質基材5を得た。
単繊維径:10μm
融点:278℃
目付け:40g/m2
引張強度:81MPa
熱膨張係数:75×10-6/℃
厚み:0.3mm
通気度:100cm3/cm2・s
[多孔質基材6(C-6)]
繊維径150μmのPPS繊維からなるメッシュを多孔質基材6(C-6)として得た。特性は次に示す通り。
融点:278℃
メッシュ:60本/inch(縦・横ともに)
目開き率:38%
目付け:75g/m2
引張強度:80MPa
熱膨張係数:75×10-6/℃
厚み:0.3mm
通気度:50cm3/cm2・s
[多孔質基材7(C-7)]
PPS樹脂(東レ(株)社製“トレリナ”M2888)のペレットを用い、メルトブロー法にて、不織布状の基材を製造し、多孔質基材7(C-7)とした。この多孔質基材7(C-7)の特性は次に示す通りであった。
単繊維径:7.8μm
融点:278℃
目付け:80g/m2
引張強度:50MPa
熱膨張係数:75×10-6/℃
厚み:0.4mm
通気度:70cm3/cm2・s
[多孔質基材8(C-8)]
PPS樹脂(東レ(株)社製“トレリナ”M2888)のペレットを熱プレスし、厚み100μmのフィルム状の基材を作製した。得られたフィルムにφ10mm、ピッチ14mmで加工を行い、開孔率46%とした有孔フィルムの多孔質基材8(C-8)を得た。
融点:278℃
開孔率:46%
目付け:72g/m2
引張強度:50MPa
熱膨張係数:75×10-6/℃
厚み:0.1mm
通気度:80cm3/cm2・s
[多孔質基材9(C-9)]
PP樹脂(プライムポリマー(株)社製“プライムポリプロ”J226E)のペレットを用い、メルトブロー法にて、不織布状の基材を製造し、多孔質基材9(C-9)とした。この多孔質基材9(C-9)の特性は次に示す通りであった。
単繊維径:6.0μm
融点:150℃
目付け:40g/m2
引張強度:29MPa
熱膨張係数:110×10-6/℃
厚み:0.2mm
通気度:60cm3/cm2・s
[樹脂フィルム1(F-1)]
PPS樹脂(東レ(株)社製“トレリナ”M2888)のペレットを熱プレスし、厚み100μmのフィルム状の基材を作製し、樹脂フィルム1(F-1)を得た。
融点:278℃
目付け:134g/m2
引張強度50MPa
熱膨張係数:75×10-6/℃
厚み:0.1mm
通気度:0cm3/cm2・s
(実施例1-1:積層体1)
強化繊維(A)として強化繊維1(A-1)を、熱硬化性樹脂(B)として熱硬化性樹脂1(B-1)を用いてなるプリプレグ1(P-1)を用いた。多孔質基材(C)として、多孔質基材1(C-1)を用いた。このプリプレグ1(P-1)および多孔質基材1(C-1)より、所定の大きさを有する長方形のプリプレグシートを13枚、多孔質基材1(C-1)を1枚切り出した。図7において、これら13枚のプリプレグシートと1枚の多孔質基材を、模式図をもって示す。
図8に示される、一体化成形品1を製造するための射出成形用金型に、インサート可能な形状にトリミングした積層体1を金型に配置した。他の部材として、マトリックス樹脂がPPS樹脂からなり、ガラス繊維含有率が質量割合(Wf)で40%の繊維強化ペレット(東レ(株)社製“トレリナ”A504X90)を用意した。このペレットを用いて、図8のような形状を有する射出成形材を射出成形にて形成させ、一体化成形品1を製造した。射出成形は、JSW社製J150EII-P射出成形機を用いて行い、シリンダ温度は320℃、金型温度を130℃とした。得られた一体化成形品1の特性をまとめて表1に示す。
多孔質基材として、熱可塑性樹脂(c)にPEEK樹脂を用いた多孔質基材2(C-2)を用いたこと以外は、実施例1-1と同様にして、平均の厚み1.6mmの積層体2を得た。得られた積層体2の特性をまとめて表1に示す。
他の部材として、マトリックス樹脂がPEEK樹脂からなり、ガラス繊維含有率が質量割合(Wf)で30%の繊維強化ペレット(ビクトレックス社製“VICTREX”PEEK 90GL30)を用意した。積層体として、得られた積層体2を用いたこと、シリンダ温度を370℃とし、金型温度を160℃としたこと以外は、実施例1-2と同様にして、一体化成形品2を得た。
多孔質基材として、熱可塑性樹脂(c)にPES樹脂を用いた多孔質基材3(C-3)を用いたこと以外は、実施例1-1と同様にして、平均の厚み1.6mmの積層体3を得た。得られた積層体3の特性をまとめて表1に示す。
他の部材として、マトリックス樹脂がPES樹脂からなり、ガラス繊維含有率(Wf)で30%の繊維強化ペレット(住友化学(株)社製“スミカエクセル”3601GL30)を用意した。積層体として、得られた積層体3を用いたこと、シリンダ温度を360℃とし、金型温度を140℃としたこと以外は、実施例1-2と同様にして、一体化成形品3を得た。
多孔質基材として、熱可塑性樹脂(c)にNy6樹脂を用いた多孔質基材4(C-4)を用いたこと以外は、実施例1-1と同様にして、平均の厚み1.6mmの積層体4を得た。得られた積層体4の特性をまとめて表1に示す。
他の部材として、マトリックス樹脂がNy6樹脂からなり、炭素繊維含有率(Wf)で30%の繊維強化ペレット(東レ(株)社製“トレカ”ペレットTLP1060)を用意した。積層体として、得られた積層体4を用いたこと、シリンダ温度を260℃とし、金型温度を80℃としたこと以外は、実施例1-2と同様にして、一体化成形品4を得た。
多孔質基材として、カーディングマットからなる多孔質基材5(C-5)を用いたこと以外は、実施例1-1と同様にして、平均の厚み1.6mmの積層体5を得た。得られた積層体5の特性をまとめて表1に示す。
積層体として、得られた積層体5を用いたこと以外は、実施例1-2と同様にして、一体化成形品5を得た。
多孔質基材として、PPS繊維からなる多孔質基材6(C-6)を用いたこと以外は、実施例1-1と同様にして、平均の厚み1.6mmの積層体6を得た。得られた積層体6の特性をまとめて表1に示す。
積層体として、得られた積層体6を用いたこと以外は、実施例1-2と同様にして、一体化成形品6を得た。
多孔質基材として、PPS樹脂からなる多孔質基材7(C-7)を用いたこと以外は、実施例1-1と同様にして、平均の厚み1.6mmの積層体7を得た。得られた積層体7の特性をまとめて表1に示す。
積層体として、得られた積層体7を用いたこと以外は、実施例1-2と同様にして、一体化成形品7を得た。
積層体として、実施例1-1と同様にして、積層体8を得た。得られた積層体8の特性をまとめて表2に示す。
積層体として、得られた積層体8と、他の部材として、実施例1-2で用いたPPS樹脂ペレットを用い、積層体8と同じ形状の板を射出成形により得た。これらを図9(a)に示すように重ね合わせ、金型温度を320℃としたプレス成形機で面圧1.0MPaをかけ5分間加圧した後、加熱を停止し、冷却水を金型内に供給し、金型温度が100℃となるまで加圧状態のまま冷却させた(図9(b))。冷却後、金型を開き成形品を取り出し(図9(c))、一体化成形品8を得た。
多孔質基材として、PPS樹脂からなる多孔質フィルムの多孔質基材8(C-8)を用いたこと以外は、実施例1-1と同様にして、平均の厚み1.6mmの積層体9を得た。得られた積層体9の特性をまとめて表2に示す。
積層体として、得られた積層体9を用いたこと以外は、実施例1-2と同様にして、一体化成形品9を得た。
熱硬化性樹脂(B)として、熱硬化性樹脂2(B-2)を用いてなるプリプレグ2(P-2)を用いたこと、加熱温度180℃で2時間加圧し、熱硬化性樹脂を硬化させたこと以外は、実施例1-1と同様にして、平均の厚み1.6mmの積層体10を得た。得られた積層体10の特性をまとめて表2に示す。
積層体として、得られた積層体10を用いたこと以外は、実施例1-2と同様にして、一体化成形品10を得た。
多孔質基材として、PP樹脂からなる多孔質基材9(C-9)を用い、130℃で2時間加熱して熱硬化性樹脂を硬化させたこと以外は、実施例1-1と同様にして、平均厚み1.6mmの積層体11を得た。得られた積層体11の特性をまとめて表2に示す。
積層体として、得られた積層体11を用い、他の部材として、マトリックス樹脂がPP樹脂からなり、ガラス繊維含有率が質量割合(Wf)で20%の繊維強化ペレット(プライムポリマー(株)社製“プライムポリプロ”V7000)を用意した。このペレットを用いて、シリンダ温度を230℃、金型温度を60℃としたこと以外は、実施例1-2と同様にして、一体化成形品11を得た。
熱可塑性樹脂(D)として、熱可塑性樹脂1(D-1)を用いてなるプリプレグ3(P-3)を用いたこと、加熱温度を170℃で10分加圧し、熱可塑性樹脂を溶融させた後、熱盤温度が100℃となるまで加圧状態で冷却したこと以外は、実施例1-1と同様にして、平均厚み1.6mmの積層体12を得た。得られた積層体12の特性をまとめて表2に示す。
積層体として、得られた積層体12を用いたこと以外は、実施例1-2と同様にして、一体化成形品12を得た。
熱可塑性樹脂(D)として、熱可塑性樹脂1(D-2)を用いてなるプリプレグ4(P-4)を用いたこと、加熱温度を250℃で10分加圧し、熱可塑性樹脂を溶融させた後、熱盤温度が140℃となるまで加圧状態で冷却したこと以外は、実施例1-1と同様にして、平均厚み1.6mmの積層体13を得た。得られた積層体13の特性をまとめて表2に示す。
積層体として、得られた積層体13を用いたこと以外は、実施例1-2と同様にして、一体化成形品13を得た。
多孔質基材として、PP樹脂からなる多孔質基材9(C-9)を用いたこと以外は、実施例1-1と同様にして、平均の厚み1.6mmの積層体10を得た。得られた積層体14の特性をまとめて表3に示す。
他の部材として、マトリックス樹脂がPP樹脂からなり、ガラス繊維含有率が質量割合(Wf)で30%の繊維強化ペレット((株)プライムポリマー社製“プライムポリプロ”E7000)を用意した。積層体として、得られた積層体15を用いたこと、シリンダ温度を230℃とし、金型温度を60℃としたこと以外は、実施例1-2と同様にして、一体化成形品15を得た。
多孔質基材として、多孔質基材1(C-1)と多孔質基材9(C-9)を用い、積層構成を上から[(C-1)/(C-9)/(P-1)90°/(P-1)0°/(P-1)90°/(P-1)0°/(P-1)90°/(P-1)0°/(P-1)90°/(P-1)0°/(P-1)90°/(P-1)0°/(P-1)90°/(P-1)0°/(P-1)90°]としたこと以外は、実施例1-1と同様にして、平均の厚み1.6mmの積層体16を得た。得られた積層体16の特性をまとめて表3に示す。
積層体として、得られた積層体16を用いたこと以外は、実施例1-2と同様にして、一体化成形品16を得た。
多孔質基材を用いないこと以外は、実施例1-1と同様にして、平均の厚み1.6mmの積層体17を得た。得られた積層体17の特性をまとめて表3に示す。
積層体として、得られた積層体17を用いたこと以外は、実施例1-2と同様にして、一体化成形品17を得た。
多孔質基材の代わりに樹脂フィルム1(F-1)を用いること以外は実施例1-1と同様にして、平均の厚み1.6mmの積層体18を得た。得られた積層体18の特性をまとめて表3に示す。
積層体として、得られた積層体18を用いたこと以外は、実施例1-2と同様にして、一体化成形品18を得た。
2 熱硬化性樹脂(B)
3 積層体
4 強化繊維(A)および熱硬化性樹脂(B)からなる繊維強化樹脂
5 多孔質基材(C)と熱硬化性樹脂(B)からなる共連続構造層
6 熱硬化性樹脂(B)が含浸されていない多孔質基材(C)の未含浸層
7 プリフォーム
8 強化繊維(A)
9 基材(p)
10 熱硬化性樹脂(B)
11 プリプレグ
12 基材(P)
13 積層体の表面
14 溶融または軟化して膨張した多孔質基材(C)
15 他の部材
16 金型(可動側)
17 金型(固定側)
18 射出成形機
19 射出成形材料(他の部材)
20 一体化成形品
Claims (17)
- 熱可塑性樹脂(c)からなる多孔質基材(C)と強化繊維(A)と熱硬化性樹脂(B)、または、
熱可塑性樹脂(c)からなる多孔質基材(C)と強化繊維(A)と熱可塑性樹脂(D)、を有してなる積層体であって、
多孔質基材(C)が、該積層体の厚み方向に連続した空隙部を有し、かつ、融点または軟化点が180℃より高く、
多孔質基材(C)が、該積層体の一方の表面において、その一方の表面に対して10%以上露出していることを特徴とする積層体。 - 多孔質基材(C)が連続体である請求項1に記載の積層体。
- 熱硬化性樹脂(B)と多孔質基材(C)、または、
熱可塑性樹脂(D)と多孔質基材(C)が、共連続構造を形成してなる請求項1または2に記載の積層体。 - 請求項1~3のいずれかに記載の積層体と他の部材が一体化されてなる一体化成形品。
- 請求項4に記載の一体化成形品の製造方法であって、積層体を得る工程と別の工程で他の部材と一体化されてなる一体化成形品の製造方法。
- 強化繊維(A)と熱硬化性樹脂(B)とからなる基材(p)に、熱可塑性樹脂(c)からなる多孔質基材(C)を表層に積層したプリフォームを、加熱ならびに加圧により成形する積層体の製造方法であって、
該多孔質基材(C)の融点および軟化点以下の温度条件下において、該多孔質基材(C)に熱硬化性樹脂(B)を含浸させるとともに硬化させて該プリフォームを成形することを特徴とする積層体の製造方法。 - 多孔質基材(C)の融点または軟化点が180℃よりも高い請求項6に記載の積層体の製造方法。
- 多孔質基材(C)が厚み方向に連続した空隙部を有する請求項6または7に記載の積層体の製造方法。
- 多孔質基材(C)が、積層体の少なくとも一方の表面において、その表面に対して10%以上露出している請求項6~8のいずれかに記載の積層体の製造方法。
- 多孔質基材(C)が連続体である請求項6~9のいずれかに記載の積層体の製造方法。
- 請求項6~10のいずれかに記載の積層体の製造方法で得られる積層体と他の部材を一体化する一体化成形品の製造方法。
- 積層体と他の部材を一体化してなる一体化成形品であって、
該積層体は、熱可塑性樹脂(c)からなる多孔質基材(C)と強化繊維(A)と熱硬化性樹脂(B)、または、熱可塑性樹脂(c)からなる多孔質基材(C)と強化繊維(A)と熱可塑性樹脂(D)、を有し、
該積層体の他の部材と一体化する側の表層は、多孔質基材(C)と、熱硬化性樹脂(B)または熱可塑性樹脂(D)が共連続構造を形成し、
多孔質基材(C)が、該積層体の他の部材と一体化する側の表面において、その表面に対して10%以上露出し、次式のいずれかの関係を満たすことを特徴とする一体化成形品。
熱硬化性樹脂(B)の熱膨張係数Eb<多孔質基材(C)の熱膨張係数Ec
熱可塑性樹脂(D)の熱膨張係数Ed<多孔質基材(C)の熱膨張係数Ec - 多孔質基材(C)が、該積層体の厚み方向に連続した空隙部を有する請求項12に記載の一体化成形品。
- 多孔質基材(C)が連続体である請求項12または13に記載の一体化成形品。
- 熱溶着によって一体化する請求項12~14のいずれかに記載の一体化成形品の製造方法。
- 積層体を予熱し、多孔質基材(C)を溶融または軟化状態にした後、他の部材と加圧することにより一体化する請求項15に記載の一体化成形品の製造方法。
- 積層体を予熱および加圧した後の、積層体の表面に露出している多孔質基材(C)の面積が、予熱および加圧前の露出面積の2倍以上である請求項15または16に記載の一体化成形品の製造方法。
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US20170326820A1 (en) | 2017-11-16 |
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CN107107535A (zh) | 2017-08-29 |
TW201622976A (zh) | 2016-07-01 |
ES2908839T3 (es) | 2022-05-04 |
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