WO2016070942A1 - Agencement de dépôt de matières et agencement de distribution de matières pour dépôt sous vide - Google Patents

Agencement de dépôt de matières et agencement de distribution de matières pour dépôt sous vide Download PDF

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Publication number
WO2016070942A1
WO2016070942A1 PCT/EP2014/074089 EP2014074089W WO2016070942A1 WO 2016070942 A1 WO2016070942 A1 WO 2016070942A1 EP 2014074089 W EP2014074089 W EP 2014074089W WO 2016070942 A1 WO2016070942 A1 WO 2016070942A1
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WO
WIPO (PCT)
Prior art keywords
distribution pipe
nozzles
distribution
nozzle
evaporated
Prior art date
Application number
PCT/EP2014/074089
Other languages
English (en)
Inventor
Stefan Bangert
Andreas Lopp
Thomas Gebele
Uwe Schüssler
Jose Manuel Dieguez-Campo
Original Assignee
Applied Materials, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials, Inc. filed Critical Applied Materials, Inc.
Priority to KR1020177015571A priority Critical patent/KR101990619B1/ko
Priority to CN201480083241.5A priority patent/CN107002221B/zh
Priority to CN201710574813.5A priority patent/CN107502858B/zh
Priority to PCT/EP2014/074089 priority patent/WO2016070942A1/fr
Priority to JP2017542272A priority patent/JP6656261B2/ja
Priority to KR1020177019747A priority patent/KR102082192B1/ko
Priority to TW108115443A priority patent/TW201945565A/zh
Priority to TW106123717A priority patent/TWI690611B/zh
Priority to TW104136582A priority patent/TWI641709B/zh
Publication of WO2016070942A1 publication Critical patent/WO2016070942A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45563—Gas nozzles
    • C23C16/45578—Elongated nozzles, tubes with holes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition

Definitions

  • Embodiments of the present invention relate to a material deposition arrangement, a distribution pipe for a material deposition arrangement, a deposition apparatus having a material deposition arrangement, and a method for depositing a material on a substrate.
  • Embodiments of the present invention particularly relate to a material deposition arrangement for a vacuum deposition chamber, a vacuum deposition apparatus having a material deposition arrangement, and a method for depositing a material on a substrate in a vacuum deposition chamber.
  • Organic evaporators are a tool for the production of organic light-emitting diodes (OLED).
  • OLEDs are a special type of light-emitting diodes in which the emissive layer comprises a thin-film of certain organic compounds.
  • Organic light emitting diodes (OLEDs) are used in the manufacture of television screens, computer monitors, mobile phones, other hand-held devices, etc., for displaying information.
  • OLEDs can also be used for general space illumination.
  • the range of colors, brightness, and viewing angle possible with OLED displays are greater than that of traditional LCD displays because OLED pixels directly emit light and do not use a back light. Therefore, the energy consumption of OLED displays is considerably less than that of traditional LCD displays.
  • a typical OLED display may include layers of organic material situated between two electrodes that are all deposited on a substrate in a manner to form a matrix display panel having individually energizable pixels.
  • the OLED is generally placed between two glass panels, and the edges of the glass panels are sealed to encapsulate the OLED therein.
  • OLED displays or OLED lighting applications include a stack of several organic materials, which are for example evaporated in vacuum. The organic materials are deposited in a subsequent manner through shadow masks.
  • the material is heated until the material evaporates.
  • the pipes guiding the material to the substrates may be heated, e.g. for keeping the evaporated material at a controlled temperature or to avoid condensation of the evaporated material in the pipes.
  • the material is guided to the substrate, e.g. by passing distribution pipes having outlets or nozzles for the evaporated material.
  • the precision of the deposition process has been increased, e.g. for being able to provide smaller and smaller pixel sizes.
  • shadowing effects of a mask, the spread of the evaporated material and the like make it difficult to further increase the precision and the predictability of the evaporation process.
  • a material deposition arrangement for depositing evaporated materials, in particular two or more evaporated materials, on a substrate in a vacuum chamber.
  • the material deposition arrangement includes a first material source including a first material evaporator configured for evaporating a first material, in particular a first material of the two or more materials, to be deposited on the substrate; a first distribution pipe including a first distribution pipe housing, wherein the first distribution pipe is in fluid communication with the first material evaporator; and a plurality of first nozzles in the first distribution pipe housing, wherein one or more nozzles of the plurality of first nozzles includes an opening length and an opening size, wherein the length to size ratio of the one or more nozzles of the plurality of first nozzles is equal to or larger than 2: 1.
  • the materiel deposition arrangement further includes a second material source including a second material evaporator configured for evaporating a second material, in particular a second material of the two or more materials, to be deposited on the substrate; a second distribution pipe comprising a second distribution pipe housing, wherein the second distribution pipe is in fluid communication with the second material evaporator; and a plurality of second nozzles in the second distribution pipe housing.
  • the distance between a first nozzle of the plurality of first nozzles and a second nozzle of the plurality of second nozzles is equal to or less than 30 mm.
  • a material deposition arrangement for depositing evaporated materials, in particular two or more evaporated materials on a substrate in a vacuum chamber.
  • the material deposition arrangement includes a first material source including a first material evaporator configured for evaporating a first material, in particular a first material of the two or more materials, to be deposited on the substrate; a first distribution pipe including a first distribution pipe housing, wherein the first distribution pipe is in fluid communication with the first material evaporator; and a plurality of first nozzles in the first distribution pipe housing, wherein one or more nozzles of the plurality of first nozzles includes an opening length and an opening size and is configured to provide a first distribution direction, wherein the length to size ratio of the one or more nozzles of the plurality of first nozzles is equal to or larger than 2: 1.
  • the material deposition arrangement further includes a second material source including a second material evaporator configured for evaporating a second material, in particular a second material of the two or more materials, to be deposited on the substrate; a second distribution pipe including a second distribution pipe housing, wherein the second distribution pipe is in fluid communication with the second material evaporator, and a plurality of second nozzles in the second distribution pipe housing, wherein one or more of the second nozzles is configured to provide a second distribution direction.
  • the first distribution direction of the one or more nozzles of the plurality of first nozzles and the second distribution direction of the one or more nozzles of the plurality of second nozzles are arranged parallel to each other or are arranged with a deviation of up to 5° from the parallel arrangement.
  • a distribution pipe for depositing evaporated material on a substrate in a vacuum chamber.
  • the distribution pipe includes a distribution pipe housing; and a nozzle in the distribution pipe housing, wherein the nozzle comprises an opening length and an opening size.
  • the length to size ratio of the nozzle is equal to or larger than 2: 1 and the nozzle comprises a material chemically inert to evaporated organic material.
  • a material deposition arrangement for depositing evaporated materials, in particular two or more evaporated materials on a substrate in a vacuum chamber.
  • the material deposition arrangement includes a first material source including a first material evaporator configured for evaporating a first material, in particular a first material of the two or more materials, to be deposited on the substrate; the distribution pipe according to embodiments described herein being a first distribution pipe of the material deposition arrangement, wherein the distribution pipe is in fluid communication with the first material evaporator.
  • the material deposition arrangement further includes a second material source including a second material evaporator configured for evaporating a second material, in particular a second material of the two or more materials, to be deposited on the substrate; a second distribution pipe including a distribution pipe housing, wherein the second distribution pipe is in fluid communication with the second material evaporator; and a plurality of second nozzles in the second distribution pipe housing.
  • the distance between the nozzle of the first distribution pipe and a second nozzle of the plurality of second nozzles of the second distribution pipe is equal to or less than 30 mm.
  • the nozzle of the first distribution pipe is configured to provide a first distribution direction and a second nozzle of the plurality of second nozzles of the second distribution pipe is configured to provide a second distribution direction, wherein the first distribution direction and the second distribution direction are arranged parallel to each other or are arranged with a deviation of up to 5° from the parallel arrangement.
  • a vacuum deposition chamber includes material deposition arrangement according to embodiments described herein.
  • the vacuum deposition chamber further includes a substrate support for supporting the substrate during deposition. The distance between at least one of the distribution pipes of the material deposition arrangement and the substrate support is less than 250mm.
  • a method for depositing an evaporated material on a substrate in a vacuum deposition chamber having a chamber volume includes evaporating a first material by a first material evaporator arranged within the chamber volume.
  • the method further includes providing the evaporated first material to a first distribution pipe including a first distribution pipe housing, wherein the first distribution pipe is in fluid communication with the first material evaporator.
  • Providing the evaporated first material to the first distribution pipe typically includes providing a pressure of about 10 - " 2 -10 " x mbar in the first distribution pipe.
  • the method further includes guiding the evaporated material through one or more of a plurality of first nozzles in the first distribution pipe housing.
  • the one or more nozzles of the plurality of first nozzles includes an opening length and an opening size, wherein guiding the evaporated material through the one or more nozzles comprises guiding the evaporated material through one or more nozzles having the length to size ratio equal to or larger than 2: 1.
  • the method further includes releasing the evaporated material to the chamber volume towards a substrate in the chamber volume, wherein the chamber volume provides a pressure of about 10 - " 5 to 10 - " 7 mbar.
  • Embodiments are also directed at apparatuses for carrying out the disclosed methods and include apparatus parts for performing each described method step.
  • the method steps may be performed by way of hardware components, a computer programmed by appropriate software, by any combination of the two or in any other manner.
  • embodiments according to the invention are also directed at methods for operating the described apparatus. It includes method steps for carrying out every function of the apparatus.
  • Figs. 2a to 2c show schematic views of distribution pipes of a material deposition arrangement according to embodiments described herein;
  • Fig. 3a shows a diagram of the material distribution of a distribution pipe and a nozzle according to embodiments described herein;
  • Fig. 3b shows a diagram of the material distribution of a distribution pipe of a known system
  • Fig. 3c shows a comparison diagram of the material distribution of a distribution pipe according to embodiments described herein and of a known system
  • Fig. 4a shows a material deposition arrangement according to embodiments described herein;
  • Fig. 4b shows a deposition system as known;
  • Fig. 5a and 5b show a schematic side and top view of a material deposition arrangement according to embodiments described herein;
  • Figs. 6a and 6b show a schematic side view of a material deposition arrangement according to embodiments described herein and a more detailed view of the distribution pipes and nozzles of the material deposition arrangement according to embodiments described herein;
  • Figs. 7a to 7d show schematic views of nozzles used in distribution pipes and material deposition arrangements according to embodiments described herein;
  • Figs. 8a to 8c show a material deposition arrangement and a distribution pipe according to embodiments described herein;
  • Figs. 9a and 9b show a distribution pipe according to embodiments described herein;
  • Fig. 10 shows a vacuum deposition chamber according to embodiments described herein.
  • Fig. 11 shows a flow chart of a method for depositing material on a substrate according to embodiments described herein.
  • fluid communication may be understood in that two elements being in fluid communication can exchange fluid via a connection allowing fluid to flow between the two elements.
  • the elements being in fluid communication may include a hollow structure, through which the fluid may flow.
  • at least one of the elements being in fluid communication may be a pipe-like element.
  • a material source may be understood as a source providing a material to be deposited on a substrate.
  • the material source may be configured for providing material to be deposited on a substrate in a vacuum chamber, such as a vacuum deposition chamber or apparatus.
  • the material source may provide the material to be deposited on the substrate by being configured to evaporate the material to be deposited.
  • the material source may include an evaporator or a crucible, which evaporates the material to be deposited on the substrate, and which, in particular, releases the evaporated material in a direction towards the substrate or into a distribution pipe of the material source.
  • the evaporator may stand in fluid communication with a distribution pipe, e.g. for distributing the evaporated material.
  • a distribution pipe may be understood as a pipe for guiding and distributing the evaporated material.
  • the distribution pipe may guide the evaporated material from the evaporator to the outlet or openings in the distribution pipe.
  • a linear distribution pipe may be understood as a pipe extending in a first, especially longitudinal, direction.
  • the linear distribution pipe includes a pipe having the shape of a cylinder, wherein the cylinder may have a circular bottom shape or any other suitable bottom shape.
  • a nozzle as referred to herein may be understood as a device for guiding a fluid, especially for controlling the direction or characteristics of a fluid (such as the rate of flow, speed, shape, and/or the pressure of the fluid that emerges from the nozzle).
  • a nozzle may be a device for guiding or directing a vapor, such as a vapor of an evaporated material to be deposited on a substrate.
  • the nozzle may have an inlet for receiving a fluid, an opening (e.g. a bore or passageway) for guiding the fluid through the nozzle, and an outlet for releasing the fluid.
  • the opening or passageway of the nozzle may include a defined geometry for achieving the desired direction or characteristic of the fluid flowing through the nozzle.
  • a nozzle may be part of a distribution pipe or may be connected to a distribution pipe providing evaporated material and may receive evaporated material from the distribution pipe.
  • a material deposition arrangement for depositing evaporated materials on a substrate in a vacuum chamber is provided.
  • the material deposition arrangement may be configured for depositing two or more evaporated materials on a substrate in a vacuum chamber.
  • the material deposition arrangement includes a first material source including a first material evaporator configured for evaporating a first material to be deposited on the substrate.
  • the first material may be a first material from the two or more materials to be deposited on the substrate.
  • the first material source further includes a first distribution pipe including a first distribution pipe housing, wherein the first distribution pipe is in fluid communication with the first material evaporator, wherein the material source further includes a plurality of first nozzles in the first distribution pipe housing.
  • one or more nozzles of the plurality of first nozzles includes an opening length and an opening size, wherein the length to size ratio of the one or more nozzles of the plurality of first nozzles is equal to or larger than 2: 1.
  • the material deposition apparatus includes a second material source including a second material evaporator configured for evaporating a second material to be deposited on the substrate.
  • the second material is a second material of the two or more materials to be deposited on the substrate.
  • the second material source further includes a second distribution pipe including a second distribution pipe housing, wherein the second distribution pipe is in fluid communication with the second material evaporator.
  • the second material source further includes a plurality of second nozzles in the second distribution pipe housing. According to embodiments described herein, a distance between a first nozzle of the plurality of first nozzles and a second nozzle of the plurality of second nozzles is equal to or less than 30 mm.
  • the first material and the second material may be the same material, or may, alternatively, be different materials.
  • Fig. la shows a side view of a material deposition arrangement 100 according to embodiments described herein.
  • the embodiment of a material deposition arrangement as shown in Fig. la may include a first material source with a first material evaporator 102a, a second material source with a second material evaporator 102b, and a third material source with a third material evaporator 102c.
  • each of the material evaporators 102a, 102b, and 102c may provide a different material.
  • each of the material evaporators may provide the same material, or a part of the material evaporators may provide the same material, whereas another part of the material evaporators provides a different material.
  • the material evaporators 102a, 102b and 102c may be crucibles, which are configured for evaporating material to be deposited on a substrate.
  • the material evaporators 102a, 102b, and 102c stand in fluid communication with distribution pipes 106a, 106b, and 106c, respectively.
  • the material evaporated by one of the material evaporators may be released from the material evaporator and flow into the respective distribution pipe.
  • each of the distribution pipes 106a, 106b, and 106c includes a distribution pipe housing including a plurality of nozzles 712. Through the plurality of nozzles, the evaporated material is released and guided to the substrate to be coated (not shown).
  • the nozzles 712 may be an integral part of the distribution pipes, such as an opening being formed in the distribution pipe housing, or may be provided by a nozzle, which is connected to the distribution pipe housing for fulfilling the defined processes, e.g. guiding the evaporated material towards the substrate to be coated.
  • the nozzles may be connected to the distribution pipe by screwing, plugging, or by a shrinking process.
  • the nozzles may be exchangeably connected to the distribution pipe of the material deposition arrangement.
  • Fig. lb shows an enlarged view of the section A of the third distribution pipe 106c shown in Fig. la.
  • the partial view shown in Fig. lb shows the distribution pipe 106c and one nozzle 712 of the plurality of nozzles of the distribution pipe 106c.
  • the nozzle 712 provides an opening 713, or passageway, through which the evaporated material can pass.
  • the opening 713 of the nozzle 712 provides an opening length 714, as shown in Fig. lb.
  • the opening length 714 may be measured along the longitudinal or length axis of the nozzle, in particular in a direction, which corresponds to the mean fluid direction exiting the nozzle.
  • the opening length 714 of the nozzle may be substantially perpendicular to the longitudinal (or linear) direction of the distribution pipe.
  • the term "substantially perpendicular” may be understood as including a deviation from the strict perpendicular arrangement by up to 15°. According to some embodiments, further terms being denoted with “substantially” in the following description may include a deviation of up to 15° from the indicated angular arrangement, or a deviation of about 15% of one dimension.
  • Fig. lc shows the material deposition arrangement 100 in a front view, which may correspond to the material deposition arrangement shown in Fig. la, but turned by about 90°.
  • the material evaporators 102a, 102b, and 102c stand in fluid communication with the distribution pipes 106a, 106b, and 106c, respectively.
  • the openings of the nozzles 712 can be seen in a front view.
  • the nozzles 712 of the different distribution pipes 106a, 106b, and 106c provide a distance 200 to each other. According to embodiments described herein, the distance between a first nozzle may typically be less than 50mm, more typically less than 30mm, and even more typically less than 25mm.
  • the distance between the nozzles 712 of the different distribution pipes 106a, 106b, and 106c is measured from the center point of the opening of the respective nozzle.
  • the center point of the opening of a nozzle may be defined as being the geometrical center point of the opening. In the case that the opening is a circle, the center point of the circle is the point equidistant from the points on the edge. If, for example, the opening of the nozzles has a symmetric shape, the center point of the opening may be described as the point left unchanged by a symmetric action.
  • the center point of a square, a rectangle, a rhombus, or a parallelogram is where the diagonals intersect, the center point being the fixed point of rotational symmetries.
  • the center of an ellipse is where the axes intersect.
  • the center point may be under stood as being the centroid of a shape.
  • the distance 200 between the nozzles of the distribution pipes may be a substantially horizontal distance.
  • the distribution pipes 106a, 106b, and 106c may extend in a substantially vertical direction.
  • the nozzles may have an evaporation direction, i.e. a direction in which the nozzles release the evaporated material, which is substantially horizontal.
  • the substantially horizontal distance between the nozzles of the different distribution pipes may be understood as including a deviation from the strict horizontal arrangement of about 15°.
  • the distance between the nozzles may be described as being the distance between the different distribution pipes to each other, e.g. measured from the longitudinal axis of the distribution pipes. In one embodiment, the distribution pipes have a distance 200 to each other.
  • Figs. Id to If show embodiments of the partial view B as indicated in the front view of Fig. lc. In Figs. Id to If, the opening size 716 of the nozzle 712 is indicated.
  • the opening size of the nozzle may depend on the shape of a nozzle. In one embodiment, the opening size may be understood as being one dimension of the opening, which is not the opening length. According to some embodiments, the opening size may be the minimum dimension of the cross-section of the opening, especially of the cross-section at the outlet of the nozzle (which is the position, where the evaporation material exits the nozzle).
  • Fig. Id shows an example of a nozzle opening and an opening size 716, wherein the opening size corresponds to a cross-section, particularly to an opening diameter.
  • Fig. le shows an example, wherein the nozzle opening has an elliptical like shape and the size of the opening is defined by the minimum dimension of the cross-section of the opening.
  • Fig. If shows an example, wherein the nozzle opening has a shape of an elongated circle, wherein the size of the opening is defined by the minimum dimension of the cross-section of the opening.
  • each nozzle of the first distribution pipe may have an opening length to size ratio of 2: 1 or larger, or only a part of the nozzles of the first distribution pipe may have the mentioned length to size ratio.
  • the second and/ or third distribution pipe of a material deposition arrangement as described herein may also include one or more nozzles having an opening length to size ratio of 2: 1 or larger.
  • the distribution pipe may have a substantially triangular cross-section.
  • Fig. 2a shows an example of a cross-section of a distribution pipe 106.
  • the distribution pipe 106 has walls 322, 326, and 324, which surround an inner hollow space 710.
  • the wall 322 is provided at an outlet side of the material source, at which the nozzles 712 are provided.
  • the cross-section of the distribution pipe can be described as being essentially triangular, that is the main section of the distribution pipe corresponds to a portion of a triangle and/or the cross-section of the distribution pipe can be triangular with rounded corners and/or cut-off corners. As shown in Fig. 2a, for example the corner of the triangle at the outlet side is cut off.
  • the width of the outlet side of the distribution pipe e.g. the dimension of the wall 322 in the cross-section shown in Fig. 2a, is indicated by arrow 352. Further, the other dimensions of the cross-section of the distribution pipe 106 are indicated by arrows 354 and 355. According to embodiments described herein, the width of the outlet side of the distribution pipe is 30% or less of the maximum dimension of the cross-section, e.g. 30% of the larger dimension of the dimensions indicated by arrows 354 and 355. In light of the dimensions and the shape of the distribution pipe, the nozzles 712 of neighboring distribution pipes 106 can be provided at a smaller distance. The smaller distance improves mixing of organic materials, which are evaporated next to each other.
  • Fig. 2b shows an embodiment where two distribution pipes are provided next to each other.
  • a material deposition arrangement having two distribution pipes as shown in Fig. 2b can evaporate two organic materials next to each other.
  • Such a material deposition arrangement can also be referred to as a material deposition array.
  • the shape of the cross-section of the distribution pipes 106 allows for placing nozzles of neighboring distribution pipes close to each other.
  • a first nozzle of the first distribution pipe and a second nozzle of the second distribution pipe can have a distance of 30 mm or below, such as from 5 mm to 25 mm. More specifically, the distance of the first outlet or nozzle to a second outlet or nozzle can be 10 mm or below.
  • the distance between a first nozzle of a first distribution pipe and a second nozzle of a second distribution pipe may be measured as the minimum distance between the longitudinal axes of the respective nozzles.
  • the minimum distance between the longitudinal axes of the respective nozzles is measures at the outlet of the nozzles (i.e. the position, where the evaporated material leaves the nozzle).
  • Fig. 2c shows a partial view C of the arrangement shown in Fig. 2b. The partial view C enlarged in Fig.
  • 2c shows an example of two nozzles 106a and 106b, wherein the distance 200 between the nozzles is measured between the longitudinal axis 201 of the first nozzle of the first distribution pipe 106a and the longitudinal axis 202 of the second nozzle of the first distribution pipe 106b at the outlet of the respective nozzles.
  • the longitudinal axis of a nozzle as referred to herein runs along the length direction of the nozzle.
  • the material deposition arrangement as described herein may be used in high precision processes such as an OLED production process.
  • Figs. 3a and 4a show the effects of a material deposition arrangement according to embodiments described herein.
  • Fig. 3b and 4b show the effects of a comparative example of a known material deposition arrangement.
  • test data of the distribution of evaporated material as released from a material deposition arrangement according to embodiments described herein is shown.
  • the curve 800 shows the experimental result of an evaporated material released from a nozzle having a length to size ration of 2: 1 or higher.
  • the example of Fig. 3a shows that the distribution of evaporated material follows approximately a cos 6 shape.
  • the comparison with a known material deposition arrangement as shown in Fig. 3b shows that the distribution of conventional material deposition arrangements corresponds to a cos 1 shape as shown by curve 801.
  • the difference between the curve 800 generated by a material deposition arrangement according to embodiments described herein and the curve 801 of known systems is substantially the width of the plume of evaporated material and the concentration distribution of the evaporated material in the plume.
  • the mask may be a pixel mask with pixel openings having the size of about 50 ⁇ x 50 ⁇ , or even below, such as a pixel opening with a dimension of the cross section (e.g.
  • the pixel mask may have a thickness of about 40 ⁇ . Considering the thickness of the mask and the size of the pixel openings, a shadowing effect may appear, where the walls of the pixel openings in the mask shadow the pixel opening.
  • the material deposition arrangement and/or the distribution pipes and/or the nozzles according to embodiments described herein may help in reducing the shadowing effect.
  • Fig. 3c shows the distribution of evaporated material in a pixel of a mask and shows three different lines. All three lines show the distribution of evaporated material in a defined distance between the nozzle and the substrate. In one example, the distance between the nozzle outlet (the position, where the evaporated material leaves the nozzle) and the substrate or a substrate support may be 250 mm or less, such as about 200 mm, or about 150 mm.
  • the first line 804 shows the distribution of evaporated material in a pixel opening of a mask as provided by known material deposition arrangements.
  • the distribution of the first line 804 corresponds to a cos 1 like distribution.
  • the distribution of the evaporated material may corresponds to a cos 6 like distribution as shown by the second line 805.
  • the slope of the second line 205 is steeper than the slope of the first line 804.
  • the skilled person can see from Fig. 3c that the edges of the pixel opening of the mask are better filled with the cos 6 distribution than with the cos 1 distribution.
  • the third line 806 shows the result of experimental tests with the material deposition arrangement or the distribution pipe according to embodiments described herein.
  • the third line 806 substantially follows the second line 805 with the cos 6 like distribution of evaporated material. The shadowing effect can be reduced when using the material deposition arrangement or the distribution pipe according to embodiments described herein.
  • Fig. 4a shows a material deposition arrangement according to embodiments described herein exemplarily including three material deposition arrangements 100a, 100b, and 100c.
  • the material deposition arrangement may be a material deposition arrangement as described in embodiments herein.
  • the deposition system of Fig. 4a further shows a substrate 121 to be coated with evaporated material and a mask 132 for masking the substrate 121.
  • Fig 4a shows schematically how the evaporated material 802 exits and leaves the material deposition arrangements 100a, 100b, and 100c, in particular the nozzles of the material deposition arrangements. According to embodiments described herein, the evaporated material 802 spreads when leaving the material deposition arrangement and entering the vacuum volume of a deposition chamber.
  • the nozzles having a length to size ratio of 2: 1 or larger allow for having a limited spread of evaporated material, e.g by encompassing an angle of about 30° or less.
  • a comparison with a deposition system as known shows in Fig. 4b that the evaporated material 803 encompasses an angle of about 60°.
  • the material deposition arrangement according to embodiments described herein may provide a smaller distribution spread of the evaporated material, and allows for guiding the evaporated material more precisely to the substrate, and in particular more precisely to the mask openings for coating the substrate with high precision.
  • Arranging the nozzles of the distribution pipes in a distance of less than 30 mm further provides options for mixing different materials of different material sources 100a, 100b, and 100c.
  • the decreased distance between the nozzles of the material deposition arrangements may further be improved by using a special shape for the distribution pipes, such as a triangular- like shape as exemplarily shown in Fig. 4a.
  • Having a cos 6 -like distribution of the evaporated material may allow for using smaller mask openings and improving the precision for smaller structures to be coated on the substrate, such as pixels for an OLED product.
  • a material deposition arrangement for depositing evaporated materials on a substrate in a vacuum chamber.
  • the material deposition arrangement may be configured for depositing two or more evaporated materials on a substrate in a vacuum chamber.
  • the material deposition arrangement includes a first material source including a first material evaporator configured for evaporating a first material to be deposited on the substrate.
  • the first material may be a first material of the two or more materials to be deposited on the substrate.
  • the first material source further includes a first distribution pipe including a first distribution pipe housing, wherein the first distribution pipe is in fluid communication with the first material evaporator; Further, the first material source includes a plurality of first nozzles in the first distribution pipe housing, wherein one or more nozzles of the plurality of first nozzles comprises an opening length and an opening size and is configured to provide a first distribution direction. The length to size ratio of the one or more nozzles of the plurality of first nozzles is equal to or larger than 2: 1.
  • the material deposition arrangement further includes a second material source including a second material evaporator configured for evaporating a second material to be deposited on the substrate.
  • the second material may be a second material of the two or more materials to be deposited on the substrate.
  • the second material source further includes a second distribution pipe: the second distribution pipe includes a second distribution pipe housing, wherein the second distribution pipe is in fluid communication with the second material evaporator.
  • the second material source further includes a plurality of second nozzles in the second distribution pipe housing, wherein one or more of the second nozzles is configured to provide a second distribution direction.
  • the first distribution direction of the one or more nozzles of the plurality of first nozzles and the second distribution direction of the one or more nozzles of the plurality of second nozzles are arranged parallel to each other or are arranged with a deviation of up to 5° from the parallel arrangement.
  • the first material and the second material may be the same material, or may, alternatively, be different materials.
  • Fig. 5a shows a material deposition arrangement with a substantially parallel arrangement of the first distribution direction of the nozzle in the first distribution pipe housing and the second distribution direction of the nozzle in the second distribution pipe housing.
  • the material deposition arrangement exemplarily shown in Fig. 5a shows a first material source 100a and a second material source 100b.
  • Each of the material sources 100a and 100b includes a material evaporator 102a and 102b, respectively.
  • each of the material evaporators may provide a different material.
  • each of the material evaporators may provide the same material, or a part of the material evaporators may provide the same material, whereas another part of the material evaporators provides a different material.
  • the first material source 100a includes a first distribution pipe 106a and the second material source 100b includes a second distribution pipe 102b.
  • the first and the second distribution pipe each have a distribution pipe housing, in which nozzles 712 are arranged.
  • the first distribution pipe includes a plurality of first nozzles and the second distribution pipe includes a plurality of second nozzles for releasing evaporated material from the respective distribution pipe housing towards the substrate to be coated.
  • one or more of the nozzles of the first distribution pipe and/or the second distribution pipe may have a length to size ratio of the nozzle opening being 2: 1 or larger, such as 2.5: 1, 3: 1, 5: 1 or even above 5: 1.
  • the size and the length of the nozzle opening may be understood as described in detail above with respect to Figs, la to If.
  • one or more nozzles of the first distribution pipe provide a first distribution direction and one or more nozzles of the second distribution pipe provide a second distribution direction.
  • a distribution direction of a nozzle may be understood as a mean distribution direction of the nozzle.
  • the mean distribution direction may substantially correspond to a line in the plume of evaporated material released from the nozzle towards a substrate to be coated, in particular a line along which the concentration of evaporated material reaches a maximum within the plume of evaporated material.
  • the mean distribution direction of a nozzle may be understood as corresponding to the geometrical center line of the plume of evaporated material released from a nozzle towards the substrate to be deposited.
  • the center line of a vapor plume may be described as corresponding to a line including the geometrical centroid of the plume of evaporated material and a point on the length axis or longitudinal axis of the nozzle, e.g. a point in the outlet of the nozzle.
  • the mean distribution direction of a nozzle may be described as running along the line with the minimum distance between the nozzle outlet and the substrate to be coated, in particular between a point of the nozzle outlet lying on the length axis or longitudinal axis of the nozzle and the substrate to be coated.
  • Fig. 5b shows a top view of the material arrangement including material sources 100a and 100b according to some embodiments.
  • the nozzles 712 of the first distribution pipe 106a provide a first distribution direction 210 and the nozzles 712 of the second distribution pipe 106b provide a second distribution direction 211.
  • the nozzles in the first distribution pipe and in the second distribution pipe are arranged so that the first distribution direction and the second distribution direction are parallel to each other.
  • the first distribution direction and the second distribution direction may have a deviation of up to 5° from the strict parallel arrangement, such as a deviation of about 3° or about 2° from the strict parallel arrangement.
  • the first distribution direction 210 and the second distribution direction 211 as indicated in Figs. 5a and 5b may have a distance between each other of about 30 mm or less.
  • the first distribution pipe and the second distribution pipe of the material deposition arrangement shown in Figs. 5a and 5b may have a triangular- like shape.
  • Figs. 6a and 6b show a substantially triangular shape of a material deposition arrangement, in which the distribution directions of the nozzles of the first distribution pipe and the second distribution pipe are substantially parallel to each other.
  • Fig. 6a shows a sectional view of an embodiment, in which a first material source having a first distribution pipe 106a, a second material source having a second distribution pipe 106b and a third material source having a third distribution pipe 106c is provided.
  • the distribution pipes may be equipped with heating elements 380 and a thermal insulator 879 for improving the heating efficiency and avoid a condensation of the evaporated material within the distribution pipes.
  • An evaporator control housing 702 is provided adjacent to the distribution pipes and connected thereto via the thermal insulator 879.
  • the arrows above the distribution pipes 106a, 106b, and 106c illustrate evaporated organic material exiting distribution pipes 106a, 106b, and 106c.
  • the mean distribution direction of the respective nozzles of the distribution pipes are denoted with the reference signs 210, 211, and 212. As can be seen in Fig. 6a, the distribution directions of the different distribution pipes are substantially parallel.
  • FIG. 6b A partial and simplified view of the nozzles 712 of the three distribution pipes 106a, 106b, and 106c is shown in Fig. 6b.
  • the three nozzles 712 exemplarily shown have length axes or longitudinal axes 201, 202, 203.
  • the nozzles 712 may guide the evaporated material from the distribution pipes 106a, 106b, and 106c towards the substrate to be coated (not shown) with a first distribution direction 210, a second distribution direction 211, and a third distribution direction 212.
  • the three distribution directions are parallel to each other, or may deviate from the strict parallel arrangement up to 5°.
  • the different distribution pipes such as the first, second and third distribution pipe as referred to herein may stand in fluid communication with different evaporators, e.g. three different evaporators in the case of three distribution pipes.
  • the different distribution pipes may stand in fluid communication with evaporators of the same type, but evaporating different materials.
  • three different components may be provided by the three distribution pipes standing in fluid communication with three evaporators.
  • the material deposition arrangement as described herein may be used for producing OLEDs.
  • the evaporated material may include three components used for producing OLEDs.
  • Using the parallel arrangement of the distribution directions of the different nozzles and using a nozzle having a length to size ratio of 2: 1 or larger according to embodiments described herein, may help to improve the uniformity and the predictability of the behavior of the evaporated material, when released from the nozzle.
  • the direction of the evaporated material being substantially parallel to the direction of another, or adjacent, evaporated material, may allow having a regular and uniform impact of the evaporated material on a mask and/or on a substrate.
  • the different components of the different distribution pipes may have substantially the same impact angle on the mask and/or the substrate, in particular a substantially perpendicular impact angle on the mask and/or the substrate.
  • the production of coating of one or more components may be performed in a more precise manner with the material deposition arrangement according to embodiments described herein.
  • the material sources having a parallel arrangement of the distribution directions may decrease the mounting and calculation effort, as e.g. done in known systems, when the different material sources have a defined angle between the distribution directions.
  • the material deposition arrangement including the above described parallel arrangement of distribution directions according to embodiments described herein can lead to a uniform mixture of the different components, if different components are used in the different material sources.
  • a distribution pipe for depositing evaporated material on a substrate in a vacuum chamber includes a distribution pipe housing and a nozzle in the distribution pipe housing.
  • the nozzle includes an opening length and an opening size, wherein the length to size ratio of the nozzle is equal to or larger than 2: 1.
  • the nozzle includes a material chemically inert to evaporated organic material.
  • evaporated organic material may have a temperature of typically about 150°C and about 650°C, more typically between about 100°C and 500°C.
  • Figs. 7a to 7d show examples of nozzles of a distribution pipe according to embodiments described herein.
  • the nozzles 200 shown in Figs. 7a to 7d include an opening 203 (or a passageway or a bore 203) for guiding the evaporated material through the nozzle.
  • the nozzles 200 have an opening length 714 and an opening size 716.
  • the length to size ratio of the nozzles in embodiments described herein may be 2: 1 or larger, as for instance described above.
  • the terms "opening length” and “openings size” may be understood as described above with respect to Figs, la to If. [0055] Fig.
  • the first nozzle material 206 may be a material having a thermal conductivity value greater than 21W/mK, e.g. copper.
  • the second nozzle material 208 may be provided at the inner side of the opening or passageway 203 and may be chemically inert to evaporated organic material in some embodiments.
  • the second nozzle material may be chosen from of Ta, Nb,Ti, DLC, stainless steel, quartz glass and graphite. As can be seen in the embodiments shown in Fig. 7a, the second nozzle material 208 may be provided as a thin coating at the inner side of the passageway 203.
  • Fig. 7b shows an embodiment of a nozzle having a first nozzle material 206 and a second nozzle material 208.
  • the example of a nozzle shown in Fig. 7b is composed of a first part being made from the first nozzle material 206 (which has for instance a thermal conductivity value of larger than 21 W/mK) and a second part being made from the second nozzle material 208, which may be inert to evaporated organic material.
  • the first and second nozzle material may be chosen as described with respect to Fig. 7a.
  • the second nozzle material 208 is a part of the nozzle, and especially not just a coating at the inner passageway side.
  • the thickness of the second nozzle material may typically be in a range of some nanometers to several micrometers. In one example, the thickness of the second nozzle material in the nozzle opening may typically be between about 10 nm to about 50 ⁇ , more typically between about 100 nm to about 50 ⁇ , and even more typically between about 500 nm to about 50 ⁇ . In one example, the thickness of the second nozzle material may be about 10 ⁇ .
  • Fig. 7c shows an embodiment of the nozzle 200, wherein the nozzle 200 is made of the first nozzle material having a thermal conductivity larger than the thermal conductivity of the distribution pipe, to which the nozzle may be connected, or a thermal conductivity higher than 21 W/mK.
  • the first nozzle material 206 is inert to evaporated organic materials.
  • the first nozzle material may be chosen from Ta, Nb, Ti, DLC or graphite.
  • Fig. 7d shows a perspective view of the nozzle shown in Fig. 7a according to embodiments described herein.
  • the second nozzle material 208 can be seen, while the outer side of the nozzle 200 shows the first nozzle material 206.
  • the opening or passageway of the nozzle through which the evaporated material flow during the evaporation process to reach the substrate to be coated, may have a size of typically about 1 mm to about 10 mm, more typically about 1 mm to about 6mm, and even more typically 2 mm to about 5 mm.
  • the dimension of the passageway or opening may refer to the minimum dimension of a cross-section, e.g. the diameter of the passageway or the opening.
  • the size of the opening or the passageway is measured at the outlet of the nozzle.
  • the opening or passageway may be produced in the tolerance zone H7, e.g. produced with a tolerance of about 10 ⁇ to about 18 ⁇ .
  • the nozzle for the material deposition arrangement for depositing a material on a substrate in a vacuum deposition chamber or for the distribution pipe may comprise a thread for repeatedly connecting and disconnecting the nozzle to the distribution pipe.
  • the nozzle having a thread for being connected to the distribution pipe may have an inner thread and/or an external thread for being able to repeatable connecting the nozzle to the distribution pipe, in particular without destroying the distribution pipe or the nozzle.
  • a first nozzle having defined characteristics may be connected to the distribution pipe for a first process. After the first process is finished, the first nozzle may be disconnected and a second nozzle may be connected to the distribution pipe for a second process.
  • the second nozzle may be disconnected from the distribution pipe and the first nozzle may again be connected to the distribution pipe fir performing the first process.
  • the distribution pipe may also comprise a thread for exchangeable connection of the nozzle to the distribution pipe, e.g. by fitting to the thread of the nozzle.
  • the material deposition arrangement as described in embodiments herein and a distribution pipe as described in embodiments described herein can be seen in Figs. 8a to 8c.
  • the distribution pipe 106 may stand in fluid communication with the crucible for distributing evaporated material provided by the crucible 104.
  • the distribution pipe can for example be an elongated cube with heating unit 715.
  • the evaporation crucible can be a reservoir for the organic material to be evaporated with a heating unit 725.
  • distribution pipe 106 provides a line source.
  • the material deposition arrangement 100 further includes a plurality of openings and/or outlets for releasing the evaporated material towards the substrate, such as nozzles being arranged along at least one line.
  • the nozzles of the distribution pipe may be adapted for releasing the evaporated material in a direction different from the length direction of the distribution pipe, such as a direction being substantially perpendicular to the length direction of the distribution pipe.
  • the outlets e.g. nozzles
  • the evaporation direction can be oriented slightly upward, e.g. to be in a range from horizontal to 15° upward, such as 3° to 7° upward.
  • the substrate can be slightly inclined to be substantially perpendicular to the evaporation direction.
  • the nozzle and the material deposition arrangement according to embodiments described herein may also be used in a deposition apparatus, which is configured for depositing material on a horizontally oriented substrate.
  • the length of the distribution pipe 106 corresponds at least to the height of the substrate to be deposited in the deposition apparatus. In many cases, the length of the distribution pipe 106 will be longer than the height of the substrate to be deposited, at least by 10% or even 20%. With a distribution pipe being longer than the height of the substrate, a uniform deposition at the upper end of the substrate and/or the lower end of the substrate can be provided.
  • the length of the distribution pipe can be 1.3 m or above, for example 2.5 m or above.
  • the evaporation crucible 104 is provided at the lower end of the distribution pipe 106.
  • the organic material is evaporated in the evaporation crucible 104.
  • the vapor of organic material enters the distribution pipe 106 at the bottom of the distribution pipe and is guided essentially sideways through the plurality of nozzles in the distribution pipe, e.g. towards an essentially vertical substrate.
  • Fig. 8b shows an enlarged schematic view of a portion of the material source, wherein the distribution pipe 106 is connected to the evaporation crucible 104.
  • a flange unit 703 is provided, which is configured to provide a connection between the evaporation crucible 104 and the distribution pipe 106.
  • the evaporation crucible and the distribution pipe are provided as separate units, which can be separated and connected or assembled at the flange unit, e.g. for operation of the material source.
  • the distribution pipe 106 has an inner hollow space 710.
  • a heating unit 715 may be provided to heat the distribution pipe. Accordingly, the distribution pipe 106 can be heated to a temperature such that the vapor of the organic material, which is provided by the evaporation crucible 104, does not condense at an inner portion of the wall of the distribution pipe 106.
  • the distribution pipe may be held at a temperature, which is typically about 1°C to about 20°C, more typically about 5°C to about 20°C, and even more typically about 10°C to about 15°C higher than the evaporation temperature of the material to be deposited on the substrate.
  • Two or more heat shields 717 are provided around the tube of the distribution pipe 106.
  • the distribution pipe 106 may be connected to the evaporation crucible 104 at the flange unit 703.
  • the evaporation crucible 104 is configured to receive the organic material to be evaporated and to evaporate the organic material.
  • the material to be evaporated may include at least one of ITO, NPD, Alq 3 , Quinacridone, Mg/AG, starburst materials, and the like.
  • Fig. 8b shows a cross-section through the housing of the evaporation crucible 104.
  • a refill opening is provided, for example, at an upper portion of the evaporation crucible, which can be closed using a plug 722, a lid, a cover or the like for closing the enclosure of evaporation crucible 104.
  • An outer heating unit 725 is provided within the enclosure of the evaporation crucible 104.
  • the outer heating element can extend at least along a portion of the wall of the evaporation crucible 104.
  • one or more central heating elements 726 can additionally or alternatively be provided.
  • Fig. 8b shows two central heating elements 726.
  • the evaporation crucible 104 can further include a shield 727.
  • the evaporation crucible 104 is provided at a lower side of the distribution pipe 106.
  • a vapor conduit 732 can be provided to the distribution pipe 106 at the central portion of the distribution pipe or at another position between the lower end of the distribution pipe and the upper end of the distribution pipe.
  • Fig. 8c illustrates an example of the material source having a distribution pipe 106 and a vapor conduit 732 provided at a central portion of the distribution pipe. Vapor of organic material is generated in the evaporation crucible 104 and is guided through the vapor conduit 732 to the central portion of the distribution pipes 106. The vapor exits the distribution pipe 106 through a plurality of nozzles 712, which may be nozzles as described with respect to Figs. 7a to 7d.
  • two or more vapor conduits 732 can be provided at different positions along the length of the distribution pipe 106.
  • the vapor conduits 732 can either be connected to one evaporation crucible 104 or to several evaporation crucibles 104.
  • each vapor conduit 732 can have a corresponding evaporation crucible 104.
  • the evaporation crucible 104 can be in fluid communication with two or more vapor conduits 732, which are connected to the distribution pipe 106.
  • the distribution pipe can be a hollow cylinder.
  • the term cylinder can be understood as commonly accepted as having a circular bottom shape and a circular upper shape and a curved surface area or shell connecting the upper circle and the little lower circle.
  • the term cylinder can further be understood in the mathematical sense as having an arbitrary bottom shape and an identical upper shape and a curved surface area or shell connecting the upper shape and the lower shape. Accordingly, the cylinder does not necessarily need to have a circular cross-section. Instead, the base surface and the upper surface can have a shape different from a circle.
  • Figs. 9a and 9b show sectional views of embodiments of a distribution pipe 106 for a material deposition arrangement according to embodiments described herein.
  • the distribution pipe 106 includes a distribution pipe housing 116, which includes, or is made from, a first housing material.
  • the distribution pipe is a linear distribution pipe extending along a first direction 136.
  • Fig. 9a shows a distribution pipe having a plurality of openings 107 being arranged along the first direction in the distribution pipe housing.
  • the walls 109 of the openings in the distribution pipe may be understood as being nozzles according to embodiments described herein.
  • the walls 109 of the openings 107 may include a first nozzle material (e.g. by being coated with a first nozzle material), wherein the thermal conductivity value of the first nozzle material may in some example be larger than the thermal conductivity of the first distribution pipe material or larger than 21W/mK.
  • the walls 109 of the openings 107 may be covered with copper.
  • the walls may be covered with copper and a second nozzle material, such as a material being chemically inert to evaporated organic material.
  • Fig. 9b shows an embodiment of a distribution pipe according to embodiments described herein.
  • the distribution pipe 106 shown in Fig. 9b includes openings 107 being provided with extending walls 108.
  • the extending walls 108 of the openings 107 extend in a direction substantially perpendicular to the first direction 136 of the distribution pipe housing 116.
  • the walls 108 of the openings 107 may extend in any suitable angle from the distribution pipe.
  • the walls 108 of the openings 107 of the distribution pipe housing 116 may provide the nozzle of the distribution pipe 106 according to embodiments described herein.
  • the walls 108 may include, or may be made from a first nozzle material.
  • the walls 108 may be coated at the inner side with a first and/or second nozzle material, such as a material being chemically inert to evaporated organic materials.
  • the walls 108 provide a mounting aid for mounting the nozzles, e.g. the nozzles as exemplarily shown in Figs. 8a to 8d, to the distribution pipe housing 116.
  • the walls 108 may provide a thread for screwing the nozzle to the distribution pipe housing 116.
  • the nozzles of the material deposition arrangement or the distribution pipes referred to herein may be designed to form a plume having a cos 11 like shaped profile, wherein n is in particular larger than 4.
  • the nozzle is designed to form a plume having a cos 6 like shaped profile.
  • the nozzle achieving a cos 11 formed plume of evaporated material may be useful if a narrow shape of the plume is desired.
  • the nozzle may be designed so that the relation of the length of the nozzle and the diameter of the passageway of the nozzle stand in a defined relation, such as 2: 1 or higher.
  • the passageway of the nozzle may include steps, inclinations, collimator structure(s) and/or pressure stages for achieving the desired plume shape.
  • a vacuum deposition chamber includes a material deposition arrangement according to any of the embodiments described above.
  • the vacuum deposition chamber further includes a substrate support for supporting the substrate during deposition.
  • the distance between at least one of distribution pipes of the material deposition arrangements and the substrate support is less than 250mm.
  • the distance between the distribution pipe and the substrate support may be measured from a nozzle outlet of the distribution pipe and a position of the substrate support lying in a plane with the substrate (e.g. a contact point, a clamp or the like).
  • the vacuum deposition chamber may include a material deposition arrangement having a nozzle with an opening size to opening length ratio of 2: 1 or greater.
  • the vacuum deposition chamber may include a material deposition arrangement with a first material source and a second material source, such as first and second material sources as described above (e.g. having a first distribution pipe with a plurality of first nozzles and a second distribution pipe with a plurality of second nozzles).
  • a distance between a first nozzle of the plurality of first nozzles and a second nozzle of the plurality of second nozzles is equal to or less than 30 mm.
  • the vacuum deposition chamber may include a material deposition arrangement having a nozzle with an opening size to opening length ratio of 2: 1 or greater.
  • the vacuum deposition chamber may include a material deposition arrangement with a first material source and a second material source, such as first and second material sources as described above (e.g. having a first distribution pipe with a plurality of first nozzles and a second distribution pipe with a plurality of second nozzles).
  • At least one of the pluralities of first nozzles of the first distribution pipe provides a first distribution direction and at least one of the pluralities of second nozzles provides a second distribution direction.
  • the first distribution direction of the one or more nozzles of the plurality of first nozzles and the second distribution direction of the one or more nozzles of the plurality of second nozzles are arranged parallel to each other or are arranged with a deviation of up to 5° from the parallel arrangement.
  • the vacuum deposition chamber may include a material deposition arrangement having a distribution pipe with a distribution pipe housing and a nozzle in the distribution pipe housing.
  • the length to size ratio of the nozzle opening is 2:1 or larger and the nozzle includes a material being chemically inert to evaporated organic material, such as organic materials referred to above.
  • Fig. 10 shows a deposition apparatus 300 in which a material deposition arrangement, a distribution pipe or a nozzle according to embodiments described herein may be used.
  • Elements referred to below, such as nozzles or distribution pipes, may be elements as described in detail above with respect to Figs. 1 to 9.
  • a distribution pipe as referred to in the following may be a distribution pipe as exemplarily described with respect to Figs. 1 to 9 as long as the embodiments combined do not contradict each other.
  • the deposition apparatus 300 of Fig. 10 includes a material source 100 in a position in a vacuum chamber 110.
  • the material source is configured for a translational movement and a rotation around an axis.
  • the material source 100 has one or more evaporation crucibles 104 and one or more distribution pipes 106. Two evaporation crucibles and two distribution pipes are shown in Fig. 10.
  • the distribution pipes 106 are supported by the support 102. Further, according to some embodiments, the evaporation crucibles 104 can also be supported by the support 102.
  • Two substrates 121 are provided in the vacuum chamber 110.
  • a mask 132 for masking of the layer deposition on the substrate can be provided between the substrate and the material source 100.
  • the mask may be a pixel mask, e.g. a pixel mask having openings with the size (e.g. the diameter or the minimum dimension of the cross section) between typically about 10 ⁇ and about 50 ⁇ , more typically between about 15 ⁇ and 40 ⁇ , and even more typically between about 15 ⁇ and about 30 ⁇ .
  • the size of the mask openings is about 20 ⁇ .
  • the mask openings have an extension of about 50 ⁇ x 50 ⁇ .
  • Organic material is evaporated from the distribution pipes 106.
  • the substrates are coated with organic material in an essentially vertical position.
  • the view shown in Fig. 10 is a top view of an apparatus including the material source 100.
  • the distribution pipe is a linear vapor distribution showerhead.
  • the distribution pipe provides a line source extending essentially vertically.
  • essentially vertically is understood particularly when referring to the substrate orientation, to allow for a deviation from the vertical direction of 20° or below, e.g. of 10° or below. The deviation can be provided for example because a substrate support with some deviation from the vertical orientation might result in a more stable substrate position.
  • the substrate orientation during deposition of the organic material is considered essentially vertical, which is considered different from the horizontal substrate orientation.
  • the surface of the substrates is coated by a line source extending in one direction corresponding to one substrate dimension and a translational movement along the other direction corresponding to the other substrate dimension.
  • the deposition apparatus may be a deposition apparatus for depositing material on an essentially horizontally oriented substrate. For instance, coating of a substrate in a deposition apparatus may be performed in an up or down direction.
  • Fig. 10 illustrates an embodiment of a deposition apparatus 300 for depositing organic material in a vacuum chamber 110.
  • the material source 100 is provided in the vacuum chamber 110 on a track, e.g. a looped track or linear guide 320.
  • the track or the linear guide 320 is configured for the translational movement of the material source 100.
  • a drive for the translational movement can be provided in the material source 100, at the track or linear guide 320, within the vacuum chamber 110 or a combination thereof.
  • Fig. 10 shows a valve 205, for example a gate valve.
  • the valve 205 allows for a vacuum seal to an adjacent vacuum chamber (not shown in Fig. 10).
  • the valve can be opened for transport of a substrate 121 or a mask 132 into the vacuum chamber 110 or out of the vacuum chamber 110.
  • a further vacuum chamber such as maintenance vacuum chamber 210 is provided adjacent to the vacuum chamber 110.
  • the vacuum chamber 110 and the maintenance vacuum chamber 210 are connected with a valve 207.
  • the valve 207 is configured for opening and closing a vacuum seal between the vacuum chamber 110 and the maintenance vacuum chamber 210.
  • the material source 100 can be transferred to the maintenance vacuum chamber 210 while the valve 207 is in an open state. Thereafter, the valve can be closed to provide a vacuum seal between the vacuum chamber 110 and the maintenance vacuum chamber 210. If the valve 207 is closed, the maintenance vacuum chamber 210 can be vented and opened for maintenance of the material source 100 without breaking the vacuum in the vacuum chamber 110.
  • Two substrates 121 are supported on respective transportation tracks within the vacuum chamber 110 in the embodiment shown in Fig. 10.
  • the distance between at least one of the distribution pipes and the substrate support is less than 250mm.
  • the distance is indicated by distance 101 between substrate support 126 and the outlet of a nozzle of a distribution pipe 106 of the material source 100.
  • two tracks for providing masks 132 thereon are provided. Coating of the substrates 121 can be masked by respective masks 132.
  • the masks 132 i.e. a first mask 132 corresponding to a first substrate 121 and a second mask 132 corresponding to a second substrate 121, are provided in a mask frame 131 to hold the mask 132 in a predetermined position.
  • a substrate 121 can be supported by a substrate support 126, which is connected to an alignment unit 112.
  • An alignment unit 112 can adjust the position of the substrate 121 with respect to the mask 132.
  • Fig. 10 illustrates an embodiment where the substrate support 126 is connected to an alignment unit 112. Accordingly, the substrate is moved relative to the mask 132 in order to provide for a proper alignment between the substrate and the mask during deposition of the organic material.
  • the mask 132 and/or the mask frame 131 holding the mask 132 can be connected to the alignment unit 112.
  • either the mask can be positioned relative to the substrate 121 or the mask 132 and the substrate 121 can both be positioned relative to each other.
  • the alignment units 112 which are configured for adjusting the position between a substrate 121 and a mask 132 relative to each other, allow for a proper alignment of the masking during the deposition process, which is beneficial for high quality, LED display manufacturing, or OLED display manufacturing.
  • the linear guide 320 provides a direction of the translational movement of the material source 100.
  • a mask 132 is provided on both sides of the material source 100 .
  • the masks 132 can extend essentially parallel to the direction of the translational movement.
  • the substrates 121 at the opposing sides of the material source 100 can also extend essentially parallel to the direction of the translational movement.
  • a substrate 121 can be moved into the vacuum chamber 110 and out of the vacuum chamber 110 through valve 205.
  • a deposition apparatus 300 can include a respective transportation track for transportation of each of the substrates 121.
  • the transportation track can extend parallel to the substrate position shown in Fig. 10 and into and out of the vacuum chamber 110.
  • further tracks are provided for supporting the mask frames 131 and the masks 132.
  • some embodiments which can be combined with other embodiments described herein, can include four tracks within the vacuum chamber 110.
  • the mask frame 131 and the mask can be moved onto the transportation track of the substrate 121.
  • the respective mask frame can then exit or enter the vacuum chamber 110 on the transportation track for the substrate.
  • the costs of ownership of a deposition apparatus 200 can be reduced if only two tracks, i.e. transportation tracks for a substrate, extend into and out of the vacuum chamber 110 and, in addition, the mask frames 131 can be moved onto a respective one of the transportation tracks for the substrate by an appropriate actuator or robot.
  • Fig. 10 illustrates an exemplary embodiment of the material source 100.
  • the material source 100 includes a support 102.
  • the support 102 is configured for the translational movement along the linear guide 320.
  • the support 102 supports two evaporation crucibles 104 and two distribution pipes 106 provided over the evaporation crucible 104.
  • the vapor generated in the evaporation crucible can move upwardly and out of the one or more nozzles or outlets of the distribution pipe.
  • a material source includes one or more evaporation crucibles and one or more distribution pipes, wherein a respective one of the one or more distribution pipes can be in fluid communication with the respective one of the one or more evaporation crucibles.
  • Various applications for OLED device manufacturing include processing steps, wherein one, two or more organic materials are evaporated simultaneously. Accordingly, as for example shown in Fig. 10, two distribution pipes and corresponding evaporation crucibles can be provided next to each other. Accordingly, the material source 100 may also be referred to as a material source array, e.g. wherein more than one kind of organic material is evaporated at the same time.
  • the material source array itself can be referred to as a material source for two or more organic materials, e.g. the material source array may be provided for evaporating and depositing three materials onto one substrate.
  • a material source array may be configured for providing the same material from different material sources simultaneously.
  • the one or more nozzle of the distribution pipe may include one or more nozzles, which can, e.g., be provided in a showerhead or another vapor distribution system.
  • the nozzles provided for the distribution pipe described herein may be nozzles as described in embodiments herein, such as nozzles described with respect to Figs. 8a to 8d.
  • a distribution pipe can be understood herein, to include an enclosure having openings such that the pressure in the distribution pipe is higher than that outside of the distribution pipe, for example by at least one order of magnitude.
  • the pressure in the distribution pipe may be between about 10- 2 to about 10- 3 mbar.
  • the rotation of the distribution pipe can be provided by a rotation of an evaporator control housing, on which at least the distribution pipe is mounted. Additionally or alternatively, the rotation of the distribution pipe can be provided by moving the material source along the curved portion off a looped track.
  • the evaporation crucible is mounted on the evaporator control housing.
  • the material sources include a distribution pipe and an evaporation crucible, which may both, be rotatably mounted, e.g. together.
  • the distribution pipe or evaporation tube can be designed in a triangular shape, so that it is possible to bring the openings or the nozzles of the distribution pipe as close as possible to each other. Bringing the openings or the nozzles of the distribution pipe as close as possible to each other allows for instance for achieving an improved mixture of the different organic materials, e.g. for the case of the co-evaporation of two, three or even more different organic materials.
  • the width of the outlet side of the distribution pipe (which is the side of the distribution pipe including the openings) is 30% or less of the maximum dimension of the cross-section.
  • the openings of the distribution pipes or the nozzles of neighboring distribution pipes can be provided at a smaller distance.
  • the smaller distance improves mixing of organic materials, which are evaporated next to each other.
  • the width of the wall facing the substrate in an essentially parallel manner can be reduced.
  • the surface area of a wall facing a substrate in an essentially parallel manner can be reduced. The arrangement reduces the heat load provided to a mask or substrate which is supported in the deposition area or slightly before the deposition area.
  • the area, which radiates towards the mask is reduced.
  • a stack of metal plates for example up to 10 metal plates, can be provided to reduce the heat transfer from the material source to the mask.
  • the heat shields or metal plates can be provided with orifices for the nozzles and may be attached to at least the front side of the source, i.e. the side facing the substrate.
  • Fig. 10 provides a deposition apparatus with a movable source
  • the skilled person may understand that the above described embodiments may also be applied in deposition apparatuses in which the substrate is moved during processing.
  • the substrates to be coated may be guided and driven along stationary material sources.
  • Embodiments described herein particularly relate to deposition of organic materials, e.g. for OLED display manufacturing on large area substrates.
  • large area substrates or carriers supporting one or more substrates i.e. large area carriers, may have a size of at least 0.174 m 2 .
  • the deposition apparatus may be adapted for processing large area substrates, such as substrates of GEN 5, which corresponds to about 1.4 m substrates (1.1 m x 1.3 m), GEN 7.5, which corresponds to about
  • the substrate thickness can be from 0.1 to 1.8 mm and the holding arrangement for the substrate, can be adapted for such substrate thicknesses.
  • the substrate thickness can be about 0.9 mm or below, such as 0.5 mm or 0.3 mm, and the holding arrangement are adapted for such substrate thicknesses.
  • the substrate may be made from any material suitable for material deposition.
  • the substrate may be made from a material selected from the group consisting of glass (for instance soda-lime glass, borosilicate glass etc.), metal, polymer, ceramic, compound materials, carbon fiber materials or any other material or combination of materials which can be coated by a deposition process.
  • glass for instance soda-lime glass, borosilicate glass etc.
  • metal for instance soda-lime glass, borosilicate glass etc.
  • polymer for instance polysilicate glass, metal, polymer, ceramic, compound materials, carbon fiber materials or any other material or combination of materials which can be coated by a deposition process.
  • a method for depositing an evaporated material on a substrate in a vacuum deposition chamber having a chamber volume is provided.
  • the chamber volume may be understood as the volume encompassed by the chamber walls, and especially as a volume providing the same pressure regime.
  • a flow chart 400 showing the method according to embodiments described herein is shown in Fig. 11.
  • the method includes in block 410 evaporating a first material by a first material evaporator arranged within the chamber volume.
  • the first material evaporator may be a source for evaporating organic materials.
  • the evaporator may be adapted for evaporating material having an evaporation temperature of about 150° to about 500°C.
  • the material source may be a crucible.
  • the method includes providing the evaporated first material to a first distribution pipe comprising a first distribution pipe housing.
  • the first distribution pipe is in fluid communication with the first material evaporator.
  • the distribution pipe may be a distribution pipe as described above, e.g. a linear distribution pipe, or a distribution pipe as shown and described with respect to Figs. 1 to 9.
  • Providing the evaporated first material to the first distribution pipe further includes providing a pressure of about 10 - " 2 -10 - " 1 mbar in the first distribution pipe.
  • the evaporated material is guided through one or more of a plurality of first nozzles in the first distribution pipe housing.
  • the one or more nozzles of the plurality of first nozzles have an opening length and an opening size, wherein guiding the evaporated material through the one or more nozzles further includes guiding the evaporated material through one or more nozzles having the length to size ratio equal to or larger than 2: 1.
  • the nozzles, through which the evaporated material is guided may be nozzles as described in embodiments above.
  • the nozzle may be screwable to the distribution pipe housing.
  • the nozzle may include a material being chemically inert to evaporated organic material, such as the nozzles being shown in Figs. 7a to 7d.
  • the nozzles may be part of the distribution pipe, as exemplarily shown and described with respect to Figs. 9a and 9b.
  • the evaporated material is released to the chamber volume towards a substrate in the chamber volume.
  • the chamber volume provides a pressure of about 10 "5 to 10 "7 mbar, more typically of about 10 "6 to about 10 "7 .
  • the vacuum chamber may include pumps, seals, and the like for being able to evacuate the chamber to the pressure of about 10 - " 5 to 10 - " 7 mbar and for maintaining the pressure in the vacuum chamber.
  • the vapor plume released from the nozzles may have a cos 6 like distribution.
  • the vapor plume with a cos 6 like distribution may provide a smaller shadowing effect than a vapor plume having e.g. a cos 1 like distribution.
  • the effect is for instance shown in Figs. 3a to 3c.
  • the method further includes evaporating a second material using a second material evaporator in the chamber volume, providing the evaporated second material to a second distribution pipe including a second distribution pipe housing.
  • the second material may be the same material as the first material. In other embodiments, the second material is different from the first material.
  • the second distribution pipe may be a distribution pipe as described above. Typically, the second distribution pipe is in fluid communication with the second material evaporator and providing the evaporated second material to the second distribution pipe includes providing a pressure of about 10 - " 2 -10 - " 1 mbar in the second distribution pipe.
  • the vacuum chamber and/or the material deposition arrangement may be provided with pumps, seals, sluices, and the like for providing and maintaining the pressure in the distribution pipe.
  • the method may further include guiding the evaporated material through one or more of a plurality of second nozzles in the second distribution pipe housing.
  • the first evaporated material and the second evaporated material are guided through the one or more first nozzles of the first distribution pipe and the one or more second nozzles of the second distribution pipe, respectively, in a distance of less than 30 mm.
  • a distance of less than 30 mm may allow a precise deposition of different evaporated materials on a substrate, e.g. for the production of an OLED display or the like.
  • the first evaporated material is released from the one or more first nozzles of the first distribution pipe in a first distribution being parallel to a second distribution direction of the one or more second nozzles of the second distribution pipe or with a deviation of up to 5° from the parallel arrangement.
  • the parallel arrangement of the distribution directions may allow for a defined deposition and mixing characteristic of the different evaporated materials coming from the different material sources.
  • the one or more nozzles of at least one of the first distribution pipe and the second distribution pipe includes a material being chemically inert to evaporated organic material.
  • the evaporated material passing the nozzle including an inert material is not affected by the nozzle material and remains in a desired state.
  • the composition of the evaporated material remains the same before and after the nozzle.
  • the direction, the flow velocity and the pressure may nevertheless be affected by the nozzle.
  • the method includes heating the distribution pipe to the evaporation temperature of the material to be deposited on the substrate or above.
  • the heating of the distribution pipe may be performed by heating devices.
  • the performance of the heating devices is supported by heat shields, as for instance described above with respect to Fig. 8a to 8c.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

La présente invention concerne un agencement de dépôt de matières (100) destiné à déposer des matériaux évaporés sur un substrat (121) dans une chambre à vide (110). L'agencement de dépôt de matières comprend deux sources de dépôt de matières (100a, 100b), chacune comportant un conduit de distribution (106a, 106b) et une ou plusieurs buses (712). L'invention concerne également une chambre de dépôt sous vide comprenant un agencement de dépôt de matériau et un procédé de dépôt d'un matières évaporé sur un substrat dans une chambre de dépôt sous vide.
PCT/EP2014/074089 2014-11-07 2014-11-07 Agencement de dépôt de matières et agencement de distribution de matières pour dépôt sous vide WO2016070942A1 (fr)

Priority Applications (9)

Application Number Priority Date Filing Date Title
KR1020177015571A KR101990619B1 (ko) 2014-11-07 2014-11-07 증발된 재료를 증착하기 위한 장치, 분배 파이프, 진공 증착 챔버, 및 증발된 재료를 증착하기 위한 방법
CN201480083241.5A CN107002221B (zh) 2014-11-07 2014-11-07 用于真空沉积的材料沉积布置和材料分配布置
CN201710574813.5A CN107502858B (zh) 2014-11-07 2014-11-07 真空沉积腔室
PCT/EP2014/074089 WO2016070942A1 (fr) 2014-11-07 2014-11-07 Agencement de dépôt de matières et agencement de distribution de matières pour dépôt sous vide
JP2017542272A JP6656261B2 (ja) 2014-11-07 2014-11-07 蒸発した材料を堆積させるための装置、分配管、真空堆積チャンバ、及び蒸発した材料を堆積させるための方法
KR1020177019747A KR102082192B1 (ko) 2014-11-07 2014-11-07 증발된 재료를 증착하기 위한 장치, 분배 파이프, 진공 증착 챔버, 및 증발된 재료를 증착하기 위한 방법
TW108115443A TW201945565A (zh) 2014-11-07 2015-11-06 用於真空沈積之材料沈積配置
TW106123717A TWI690611B (zh) 2014-11-07 2015-11-06 真空沉積腔室
TW104136582A TWI641709B (zh) 2014-11-07 2015-11-06 用於真空沈積之材料沈積配置、分佈管、真空沈積腔室及方法

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TWI755956B (zh) * 2020-12-03 2022-02-21 財團法人國家實驗研究院 氣體分配模組與真空鍍膜裝置

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CN106637091B (zh) * 2017-02-24 2019-08-30 旭科新能源股份有限公司 用于薄膜太阳能电池制造的高温蒸发炉
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TW201629248A (zh) 2016-08-16
TWI641709B (zh) 2018-11-21
TWI690611B (zh) 2020-04-11
CN107002221A (zh) 2017-08-01
KR101990619B1 (ko) 2019-06-18
KR102082192B1 (ko) 2020-02-27
CN107002221B (zh) 2020-03-03
CN107502858A (zh) 2017-12-22
JP6656261B2 (ja) 2020-03-04
TW201945565A (zh) 2019-12-01
KR20170083592A (ko) 2017-07-18
TW201805455A (zh) 2018-02-16
JP2017535677A (ja) 2017-11-30
CN107502858B (zh) 2020-06-19

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