WO2016041275A1 - 有机电致发光器件及显示装置 - Google Patents

有机电致发光器件及显示装置 Download PDF

Info

Publication number
WO2016041275A1
WO2016041275A1 PCT/CN2014/093766 CN2014093766W WO2016041275A1 WO 2016041275 A1 WO2016041275 A1 WO 2016041275A1 CN 2014093766 W CN2014093766 W CN 2014093766W WO 2016041275 A1 WO2016041275 A1 WO 2016041275A1
Authority
WO
WIPO (PCT)
Prior art keywords
organic electroluminescent
electroluminescent device
transparent material
package substrate
layer
Prior art date
Application number
PCT/CN2014/093766
Other languages
English (en)
French (fr)
Inventor
许晓伟
龙春平
石磊
徐文清
Original Assignee
京东方科技集团股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US14/770,365 priority Critical patent/US10193103B2/en
Publication of WO2016041275A1 publication Critical patent/WO2016041275A1/zh

Links

Images

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/875Arrangements for extracting light from the devices
    • H10K59/879Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/844Encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/85Arrangements for extracting light from the devices
    • H10K50/858Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/122Pixel-defining structures or layers, e.g. banks
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/873Encapsulations

Definitions

  • At least one embodiment of the present invention is directed to an organic electroluminescent device and a display device.
  • OLEDs Organic electroluminescent devices
  • LCDs liquid crystal displays
  • plasma display panels A new generation of flat panel display products after PDP.
  • At least one embodiment of the present invention provides an organic electroluminescent device and a display device to improve output light efficiency of an OLED light emitting device.
  • At least one embodiment of the present invention provides an organic electroluminescent device including an array substrate and a package substrate, the package substrate being provided with a protrusion formed of a first transparent material on a side of the array substrate, The raised surface is also covered with a transparent layer formed of a second transparent material having a refractive index greater than a refractive index of the first transparent material.
  • At least one embodiment of the present invention also provides a display device comprising the above organic electroluminescent device.
  • Figure 1 is a schematic view of an organic electroluminescent device
  • FIG. 2 is a schematic view of an organic electroluminescent device according to an embodiment of the present invention.
  • FIG. 3 is a schematic view of another organic electroluminescent device according to an embodiment of the present invention.
  • FIG. 4 is a schematic view of still another organic electroluminescent device according to an embodiment of the present invention.
  • FIG. 5-7 are schematic diagrams showing the formation of a bump and a transparent layer on a package substrate according to an embodiment of the present invention.
  • FIG. 8 is a schematic diagram showing a distribution of a groove and a pixel defining layer on a package substrate in an organic electroluminescent device according to an embodiment of the present invention.
  • FIG. 1 is a schematic structural view of an OLED light emitting device including an array substrate and a package substrate 2'.
  • the array substrate includes a substrate substrate 1', an anode layer 4', a pixel defining layer (PDL) 3', and a cathode layer. 6' and the organic light-emitting layer 5' between the anode layer 4' and the cathode layer 6'. The light emitted from the organic light-emitting layer 5' is emitted through the package substrate 2'.
  • the refractive index of the package substrate 2' is larger than the refractive index of the outside air, a part of the light incident on the interface cannot be emitted through the package substrate 2' due to total reflection. Thereby reducing the output light efficiency of the OLED light emitting device.
  • FIG. 2 is a schematic diagram of an organic electroluminescent device according to an embodiment of the present invention, which is organic
  • the electroluminescent device comprises an array substrate comprising a base substrate 1, an anode layer 4, a pixel defining layer (PDL) 3, a cathode layer 6, and an organic light-emitting layer 5 between the anode layer 4 and the cathode layer 6.
  • a protrusion 7 formed of a first transparent material is disposed on a side of the package substrate facing the array substrate, and a surface of the protrusion 7 is further covered with a transparent layer 8 formed of a second transparent material, and The refractive index of the two transparent materials is greater than the refractive index of the first transparent material.
  • An organic electroluminescent device by providing a protrusion on a side of the package substrate facing the array substrate, and forming a transparent layer larger than the convex refractive index on the surface of the protrusion, when the light emitted by the organic light-emitting layer
  • a protrusion on a side of the package substrate facing the array substrate
  • a transparent layer larger than the convex refractive index on the surface of the protrusion
  • part of the light irradiated to the surface of the protrusion is totally reflected to change the optical path to reduce total reflection at the interface between the package substrate and the outside air.
  • the incident light, and the light after changing the optical path is more easily emitted through the package substrate, thereby improving the output light efficiency of the OLED light emitting device.
  • the bumps on the package substrate can be obtained by various methods.
  • the glass substrate may be etched to form a plurality of raised structures thereon while the package substrate is obtained.
  • a protrusion may be formed on the glass substrate by using a transparent organic material.
  • the protrusion may be formed by using a negative photoresist, that is, the first transparent material may include a negative photoresist, for example, a polyimide may be used. Amine, acrylic, phenolic resin, etc., for example, Anzhi CTP-100 negative photoresist can be used.
  • the cross-sectional shape of the protrusion in the direction of the vertical package substrate in at least one embodiment of the present invention may be not only the trapezoid shown in FIG. 2, the rectangle shown in FIG. 3, and other polygonal shapes such as a triangle, but also a figure.
  • the shape of the "bowl" shown in FIG. 4 is approximately a polygonal shape to pass through the transparent layer of the convex surface, so that part of the light irradiated to the convex surface can be totally reflected to change the optical path, and the interface between the package substrate and the outside air is reduced. The total reflected incident light, and the light after changing the optical path is more easily emitted through the package substrate, thereby improving the output light efficiency of the OLED light emitting device.
  • the cross section of the protrusion in the direction of the vertical package substrate may be trapezoidal and trapezoidal.
  • the upper bottom side 71 faces the package substrate, and the lower bottom side 72 of the trapezoid faces the array substrate to form a forward trapezoidal shape (ie, the length of the upper bottom side 71 is smaller than the length of the lower bottom side 72).
  • the protrusion of the trapezoid shape may be formed by a negative photoresist.
  • a negative photoresist 10 is first formed on the package substrate 2, and then exposed and developed, see FIG.
  • the protrusions 7 are formed in the exposed regions, the grooves 9 are formed in the unexposed areas, and then formed on the surface of the protrusions 7 by the first
  • the transparent layer 8 formed of two transparent materials is obtained as shown in FIG.
  • the protrusion 7 may have an isosceles trapezoidal shape, as shown in FIG. 7.
  • the base angle ⁇ of the trapezoid may be 35 degrees to 75 degrees, for example, 55 degrees, 70 degrees, or the like.
  • the protrusions of the forward trapezoid shape can be formed by exposure and development of the negative photoresist, no other fabrication process is required, and the fabrication process is simple and the fabrication cost is small.
  • the transparent layer can be formed on the surface of the bump by sputtering.
  • the transparent layer may have a thickness of 50 nm to 1000 nm, for example, may be 100 nm, 300 nm, 500 nm, 800 nm, or the like.
  • the second transparent material forming the transparent layer may also have electrical conductivity such that the transparent layer has electrical conductivity, and the transparent layer is further in contact with the cathode layer on the array substrate such that the transparent layer and the cathode layer are formed.
  • the parallel structure reduces the resistance of the cathode layer and reduces the power consumption of the OLED light-emitting device.
  • the second transparent material may include any one of ITO (indium tin oxide), AZO (aluminum-doped zinc oxide), and FTO (fluorine-doped tin oxide).
  • the anode layer 4 on the array substrate can be formed into a desired shape by a photolithography and etching process.
  • the pixel defining layer 3 partially covers the anode layer 4 and exposes a light-emitting region on the anode layer 4.
  • the material of the pixel defining layer may include materials such as polyimide, acryl, phenolic resin; for example, the thickness may be 1-3 ⁇ m; the pixel defining layer may be formed into a desired shape by a photolithography process, and may also pass through 150 ⁇ 700mj of UV light improves its slope angle.
  • the material of the cathode layer 6 may be a metal and an alloy of two or more metals.
  • the formed protrusions 7 may be disposed opposite to the pixel defining layer 3 such that the relative positions of the grooves 9 on the package substrate and the pixel defining layer 3 are as shown in FIG.
  • the light is irradiated to the side of the groove 9 (i.e., the side waist surface of the protrusion 7), and since the side surface is covered with the transparent layer 8 having a refractive index greater than the refractive index of the protrusion 7, the partial light irradiated to the side surface is totally reflected.
  • Changing the optical path not only reduces the incident light that is totally reflected at the interface between the package substrate and the outside air, but also makes it easier for the light after changing the optical path to exit through the package substrate, and also reduces the influence on the overall transmittance of the package substrate;
  • the protrusion is disposed opposite to the pixel defining layer, and the effective display area (AA) of the organic electroluminescent device can also be raised to avoid the influence of the height of the package area and the effective display area (AA) during packaging. Packaging effect.
  • At least one embodiment of the present invention also provides a display device comprising the above-described organic electroluminescent device.
  • the display device provided by the embodiment of the present invention may be an OLED panel, Any product or component with display function such as electronic paper, laptop display, LCD monitor, LCD TV, digital photo frame, mobile phone, tablet, etc.

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种有机电致发光器件及显示装置,该有机电致发光器件包括阵列基板和封装基板(2),该封装基板(2)朝向该阵列基板的一侧上设置有由第一透明材料形成的凸起(7),凸起(7)的表面还覆盖有由第二透明材料形成的透明层(8),第二透明材料的折射率大于第一透明材料的折射率。该有机电致发光器件使有机发光层(5)发出的照射至凸起(7)表面的部分光发生全反射而改变光路,以减少在封装基板(2)与外界空气界面发生全反射的入射光,并使得改变光路后的光线更易通过封装基板(2)出射,从而提高输出光效率。

Description

有机电致发光器件及显示装置 技术领域
本发明的至少一个实施例涉及一种有机电致发光器件及显示装置。
背景技术
有机电致发光器件(OLED)因其具有自发光、全固态、宽视角、响应快等诸多优点而被认为在平板显示中有着巨大的应用前景,是继液晶显示器(LCD)、等离子显示板(PDP)之后的新一代平板显示产品。
发明内容
本发明的至少一个实施例提供一种有机电致发光器件及显示装置,以提高OLED发光器件的输出光效率。
本发明的至少一个实施例提供了一种有机电致发光器件,其包括阵列基板和封装基板,所述封装基板朝向所述阵列基板的一侧上设置有由第一透明材料形成的凸起,所述凸起的表面还覆盖有由第二透明材料形成的透明层,所述第二透明材料的折射率大于所述第一透明材料的折射率。
本发明的至少一个实施例还提供了一种显示装置,其包括上述有机电致发光器件。
附图说明
为了更清楚地说明本发明实施例的技术方案,下面将对实施例的附图作简单地介绍,显而易见地,下面描述中的附图仅仅涉及本发明的一些实施例,而非对本发明的限制。
图1是一种的有机电致发光器件的示意图;
图2是本发明实施方式提供的一种有机电致发光器件的示意图;
图3是本发明实施方式提供的另一种有机电致发光器件的示意图;
图4是本发明实施方式提供的又一种有机电致发光器件的示意图;
图5-7是本发明实施方式提供的在封装基板上形成凸起和透明层的示意 图;
图8是本发明实施方式提供的有机电致发光器件中封装基板上的凹槽与像素定义层分布的示意图。
具体实施方式
为使本发明实施例的目的、技术方案和优点更加清楚,下面将结合本发明实施例的附图,对本发明实施例的技术方案进行清楚、完整地描述。显然,所描述的实施例是本发明的一部分实施例,而不是全部的实施例。基于所描述的本发明的实施例,本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例,都属于本发明保护的范围。
除非另外定义,本公开使用的技术术语或者科学术语应当为本发明所属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性,而只是用来区分不同的组成部分。同样,“一个”、“一”或者“该”等类似词语也不表示数量限制,而是表示存在至少一个。“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同,而不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接,而是可以包括电性的连接,不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系,当被描述对象的绝对位置改变后,则该相对位置关系也可能相应地改变。
在研究中,本申请的发明人注意到,在OLED发光器件中,不同结构由于材料不同存在折射率差异,使得大部分光线在不同结构间的界面发生全反射而不能导出。图1为一种OLED发光器件的结构示意图,该OLED发光器件包括阵列基板和封装基板2’,阵列基板包括衬底基板1’、阳极层4’、像素定义层(PDL)3’、阴极层6’以及阳极层4’与阴极层6’之间的有机发光层5’。有机发光层5’发出的光通过封装基板2’射出,然而,由于封装基板2’的折射率大于外界空气的折射率,使得入射至该界面的一部分光由于全反射不能通过封装基板2’出射,从而降低了OLED发光器件的输出光效率。
图2是本发明实施方式提供的一种有机电致发光器件的示意图,该有机 电致发光器件包括阵列基板和封装基板2,阵列基板包括衬底基板1、阳极层4、像素定义层(PDL)3、阴极层6以及阳极层4与阴极层6之间的有机发光层5,所述封装基板朝向所述阵列基板的一侧上设置有由第一透明材料形成的凸起7,所述凸起7的表面还覆盖有由第二透明材料形成的透明层8,且第二透明材料的折射率大于所述第一透明材料的折射率。
本发明实施方式提供的有机电致发光器件,通过在封装基板朝向阵列基板的一侧上设置凸起,并在凸起的表面形成大于凸起折射率的透明层,当有机发光层发出的光照射至该凸起的表面时,由于凸起的折射率小于透明层的折射率,照射至该凸起表面的部分光发生全反射而改变光路,以减少在封装基板与外界空气界面发生全反射的入射光,并使得改变光路后的光线更易通过封装基板出射,从而提高OLED发光器件的输出光效率。
本发明实施方式提供的有机电致发光器件中,封装基板上的凸起可通过多种方法得到。例如可对玻璃基板进行刻蚀,从而在得到封装基板的同时在其上形成多个凸起结构。此外,还可在玻璃基板上采用透明有机材料制作凸起,例如,可采用负性光刻胶制作上述凸起,即上述第一透明材料可以包括负性光刻胶,例如可采用聚酰亚胺,亚克力,酚醛树脂等,例如,可采用安智CTP-100负性光刻胶。
对于本发明至少一个实施例中的凸起在垂直封装基板方向上的截面形状,其不但可以为图2所示的梯形、图3所示的矩形、以及三角形等其他多边形形状,还可以为图4所示的“碗”形状等近似多边形的形状,以通过凸起表面的透明层,使得照射至该凸起表面的部分光能够发生全反射而改变光路,减少在封装基板与外界空气界面发生全反射的入射光,并使得改变光路后的光线更易通过封装基板出射,从而提高OLED发光器件的输出光效率。
在至少一个实施例中,为了降低制作成本并使改变光路后的光线更易通过封装基板出射,如图2所示,可以将凸起在垂直封装基板方向上的截面设为梯形,且使梯形的上底边71朝向封装基板,梯形的下底边72朝向阵列基板,形成正梯形状(即上底边71的长度小于下底边72的长度)。例如,该正梯形状的凸起可通过负性光刻胶形成,例如,参见图5,首先在封装基板2上形成一层负性光刻胶10,而后对其曝光显影,参见图6,从而在曝光的区域形成凸起7,在未曝光的区域形成凹槽9,而后再在凸起7的表面形成由第 二透明材料形成的透明层8,得到如图7所示的结构。在至少一个实施例中,上述凸起7的截面可以为等腰梯形,如图7所示,例如,梯形的底角α可以为35度~75度,例如可以为55度、70度等。相较于其他截面形状的凸起,由于正梯形状的凸起通过负性光刻胶曝光显影即可形成,而不再需其他制作工艺,其制作工艺较为简单,制作成本较少。
在至少一个实施例中,上述透明层可通过溅射的方式形成在凸起的表面。在至少一个实施例中,透明层的厚度可以为50nm-1000nm,例如,可以为100nm、300nm、500nm、800nm等。例如,形成该透明层的第二透明材料还可以具有导电性,从而使该透明层具有导电性,并使该透明层还与阵列基板上的阴极层相接触,使得该透明层与阴极层形成并联结构,从而减小阴极层的电阻,降低OLED发光器件的功耗。例如,该第二透明材料可以包括ITO(氧化铟锡)、AZO(铝掺杂氧化锌)和FTO(掺杂氟的氧化锡)中的任意一种。
本发明实施方式提供的有机电致发光器件中,阵列基板上的阳极层4可通过光刻和刻蚀工艺形成所需形状。像素定义层3部分覆盖在阳极层4上,并在阳极层4上露出发光区域。该像素定义层可选择的材料包括聚酰亚胺,亚克力,酚醛树脂等材料;例如,其厚度可以为1~3μm;像素定义层可通过光刻工艺形成所需的形状,还可以通过150~700mj的UV光照改善其坡度角。阴极层6的材料可以为金属以及两种或两种以上金属的合金。在至少一个实施例中,可使形成的凸起7与像素定义层3正对设置,使封装基板上的凹槽9与像素定义层3的相对位置如图8所示,当有机发光层发出的光照射至凹槽9的侧面(即凸起7的侧腰面),由于该侧面覆盖有折射率大于凸起7折射率的透明层8,使得照射至该侧面的部分光发生全反射而改变光路,这不但能够减少在封装基板与外界空气界面发生全反射的入射光,并使得改变光路后的光线更易通过封装基板出射,还能降低对封装基板整体透射率造成的影响;此外,通过将该凸起与像素定义层正对设置,还可将有机电致发光器件的有效显示区(AA)垫高,避免在封装时,由于封装区与有效显示区(AA)的高度不同而影响封装效果。
此外,本发明的至少一个实施方式还提供了一种显示装置,其包括上述的有机电致发光器件。本发明实施方式提供的显示装置可以是OLED面板、 电子纸、笔记本电脑显示屏、液晶显示器、液晶电视、数码相框、手机、平板电脑等任何具有显示功能的产品或部件。
以上所述仅是本发明的示范性实施方式,而非用于限制本发明的保护范围,本发明的保护范围由所附的权利要求确定。
本申请要求于2014年9月15日递交的中国专利申请第201410469964.0号的优先权,在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。

Claims (12)

  1. 一种有机电致发光器件,包括阵列基板和封装基板,其中,所述封装基板朝向所述阵列基板的一侧上设置有由第一透明材料形成的凸起,所述凸起的表面还覆盖有由第二透明材料形成的透明层,所述第二透明材料的折射率大于所述第一透明材料的折射率。
  2. 根据权利要求1所述的有机电致发光器件,其中,所述凸起在垂直所述封装基板方向上的截面形状为多边形或“碗”形。
  3. 根据权利要求1或2所述的有机电致发光器件,其中,所述凸起在垂直所述封装基板方向上的截面为矩形或三角形。
  4. 根据权利要求1或2所述的有机电致发光器件,其中,所述凸起在垂直所述封装基板方向上的截面为梯形,且所述梯形的上底边朝向所述封装基板,所述梯形的下底边朝向所述阵列基板。
  5. 根据权利要求4所述的有机电致发光器件,其中,所述梯形为等腰梯形。
  6. 根据权利要求5所述的有机电致发光器件,其中,所述梯形的底角为35度~75度。
  7. 根据权利要求1-6任一所述的有机电致发光器件,其中,所述阵列基板上形成有像素定义层,所述凸起与所述像素定义层正对设置。
  8. 根据权利要求1-7任一所述的有机电致发光器件,其中,所述第二透明材料具有导电性,所述透明层还与所述阵列基板上的阴极层相接触。
  9. 根据权利要求1-8任一所述的有机电致发光器件,其中,所述透明层的厚度为50nm-1000nm。
  10. 根据权利要求1-9任一所述的有机电致发光器件,其中,所述第一透明材料包括负性光刻胶。
  11. 根据权利要求1-10任一所述的有机电致发光器件,其中,所述第二透明材料包括氧化铟锡、铝掺杂氧化锌、掺杂氟的氧化锡中的任意一种。
  12. 一种显示装置,包括如权利要求1-11任一所述的有机电致发光器件。
PCT/CN2014/093766 2014-09-15 2014-12-13 有机电致发光器件及显示装置 WO2016041275A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US14/770,365 US10193103B2 (en) 2014-09-15 2014-12-13 Organic light emitting device having protrusion formed of transparent material and display apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201410469964.0A CN104241541B (zh) 2014-09-15 2014-09-15 有机电致发光器件及显示装置
CN201410469964.0 2014-09-15

Publications (1)

Publication Number Publication Date
WO2016041275A1 true WO2016041275A1 (zh) 2016-03-24

Family

ID=52229249

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2014/093766 WO2016041275A1 (zh) 2014-09-15 2014-12-13 有机电致发光器件及显示装置

Country Status (3)

Country Link
US (1) US10193103B2 (zh)
CN (1) CN104241541B (zh)
WO (1) WO2016041275A1 (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105957875A (zh) * 2016-05-31 2016-09-21 上海天马有机发光显示技术有限公司 一种oled显示面板及显示装置
CN107170904B (zh) * 2017-06-30 2019-10-15 京东方科技集团股份有限公司 Oled显示基板及其制作方法、显示装置
CN108267926A (zh) * 2018-01-31 2018-07-10 京东方科技集团股份有限公司 一种掩膜版、显示基板及其制作方法和显示装置
US11063245B2 (en) * 2018-12-14 2021-07-13 Lg Display Co., Ltd. Display apparatus
CN109888127B (zh) * 2019-03-19 2021-12-21 京东方科技集团股份有限公司 一种显示面板、其制作方法及显示装置
CN111710798A (zh) * 2020-06-23 2020-09-25 京东方科技集团股份有限公司 有机发光二极管器件、其制备方法及阵列基板
CN113421987B (zh) * 2021-06-03 2023-04-07 武汉华星光电技术有限公司 一种盖板及显示装置
TWI784731B (zh) * 2021-09-28 2022-11-21 友達光電股份有限公司 顯示裝置及其製造方法
KR20230054534A (ko) * 2021-10-15 2023-04-25 삼성디스플레이 주식회사 표시 장치 및 그 제조 방법

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1561149A (zh) * 2002-10-24 2005-01-05 ���ṫ˾ 显示单元及其制造方法
JP2008210728A (ja) * 2007-02-28 2008-09-11 Hitachi Displays Ltd 有機el表示装置
JP2012124103A (ja) * 2010-12-10 2012-06-28 Dainippon Printing Co Ltd 有機エレクトロルミネッセンス表示装置用対向基板および有機エレクトロルミネッセンス表示装置
CN102742352A (zh) * 2010-04-22 2012-10-17 出光兴产株式会社 有机电致发光元件及照明装置
CN104037357A (zh) * 2014-06-05 2014-09-10 京东方科技集团股份有限公司 一种有机发光显示装置及其制造方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07283185A (ja) 1994-04-08 1995-10-27 Casio Comput Co Ltd 基板洗浄装置
US5836809A (en) 1996-10-07 1998-11-17 Eco-Snow Systems, Inc. Apparatus and method for cleaning large glass plates using linear arrays of carbon dioxide (CO2) jet spray nozzles
JP3865978B2 (ja) 1999-09-28 2007-01-10 大日本スクリーン製造株式会社 基板処理装置
JP2004056005A (ja) 2002-07-23 2004-02-19 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP4669760B2 (ja) 2004-09-14 2011-04-13 芝浦メカトロニクス株式会社 基板の処理装置及び処理方法
TWI362296B (en) 2009-01-17 2012-04-21 Au Optronics Corp Wet clean apparatus
CN101884983A (zh) 2010-07-16 2010-11-17 上海集成电路研发中心有限公司 半导体清洗装置和清洗半导体器件的方法
JP2012138226A (ja) * 2010-12-27 2012-07-19 Hitachi Ltd 有機発光装置
CN202076333U (zh) 2011-04-02 2011-12-14 东莞宏威数码机械有限公司 Oled玻璃基片清洗系统
CN102489470A (zh) 2011-12-07 2012-06-13 深圳市华星光电技术有限公司 玻璃基板的清洗装置及清洗方法
JP2013191314A (ja) 2012-03-12 2013-09-26 Idemitsu Kosan Co Ltd 有機エレクトロルミネッセンス素子
KR101973165B1 (ko) 2012-06-20 2019-08-27 삼성디스플레이 주식회사 디스플레이 장치 및 디스플레이 장치의 제조방법
CN202977537U (zh) * 2012-12-07 2013-06-05 昆山工研院新型平板显示技术中心有限公司 顶发光有机电致发光器件的封装盖板
CN103212549B (zh) 2013-04-28 2016-04-06 瑞鼎机电科技(昆山)有限公司 全自动盲孔清理机
CN103815853A (zh) 2014-02-27 2014-05-28 傅宇宙 用于洗碗机的移动冲洗系统
CN104494922A (zh) 2014-11-13 2015-04-08 苏州经贸职业技术学院 一种对称式可调夹持装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1561149A (zh) * 2002-10-24 2005-01-05 ���ṫ˾ 显示单元及其制造方法
JP2008210728A (ja) * 2007-02-28 2008-09-11 Hitachi Displays Ltd 有機el表示装置
CN102742352A (zh) * 2010-04-22 2012-10-17 出光兴产株式会社 有机电致发光元件及照明装置
JP2012124103A (ja) * 2010-12-10 2012-06-28 Dainippon Printing Co Ltd 有機エレクトロルミネッセンス表示装置用対向基板および有機エレクトロルミネッセンス表示装置
CN104037357A (zh) * 2014-06-05 2014-09-10 京东方科技集团股份有限公司 一种有机发光显示装置及其制造方法

Also Published As

Publication number Publication date
US20160372702A1 (en) 2016-12-22
CN104241541B (zh) 2016-12-14
CN104241541A (zh) 2014-12-24
US10193103B2 (en) 2019-01-29

Similar Documents

Publication Publication Date Title
WO2016041275A1 (zh) 有机电致发光器件及显示装置
TWI809661B (zh) 顯示裝置
US11005068B1 (en) Organic light-emitting diode touch display and manufacturing method thereof
WO2020186932A1 (zh) 发光器件及其制造方法、显示装置
TWI610434B (zh) 顯示裝置
US11329258B2 (en) Display panel and manufacture method thereof, display device
KR101797293B1 (ko) 유기 발광 다이오드 어레이 기판 및 그 제조 방법과 디스플레이 디바이스
US9685489B2 (en) OLED pixel structure and OLED display device
WO2016082341A1 (zh) 有机电致发光器件、其制备方法以及显示装置
US20210223604A1 (en) Optical film and fabrication method thereof and display apparatus
TW201624080A (zh) 光學薄膜及顯示器裝置
WO2020133720A1 (zh) Oled显示面板及oled显示装置
WO2015188595A1 (zh) 显示面板及其制作方法、显示装置
WO2019096097A1 (zh) 显示面板及其驱动方法、显示装置
US20170038874A1 (en) Display panel, method for fabricating the same, and display apparatus
WO2018171268A1 (zh) 基板及其制备方法、显示面板和显示装置
TW201331036A (zh) 積層體、及積層體之製造方法
WO2021016859A1 (zh) 显示面板、显示装置及显示面板的制作方法
WO2018119784A1 (zh) 底发光型oled显示单元及其制作方法
KR102033162B1 (ko) Oled 발광 소자 및 표시 장치
TWI545480B (zh) 觸控顯示裝置
WO2021036007A1 (zh) 显示面板、显示装置及显示面板的制作方法
JP5846345B1 (ja) 面状発光ユニット
WO2020093454A1 (zh) 一种显示面板和显示装置
CN112236883A (zh) 光提取设备和柔性oled显示器

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 14770365

Country of ref document: US

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 14902275

Country of ref document: EP

Kind code of ref document: A1

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 05/09/2017)

122 Ep: pct application non-entry in european phase

Ref document number: 14902275

Country of ref document: EP

Kind code of ref document: A1