WO2016037574A1 - 芯片封装方法和封装结构 - Google Patents
芯片封装方法和封装结构 Download PDFInfo
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- WO2016037574A1 WO2016037574A1 PCT/CN2015/089304 CN2015089304W WO2016037574A1 WO 2016037574 A1 WO2016037574 A1 WO 2016037574A1 CN 2015089304 W CN2015089304 W CN 2015089304W WO 2016037574 A1 WO2016037574 A1 WO 2016037574A1
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Definitions
- the present disclosure relates to the field of semiconductor manufacturing technologies, and in particular, to a chip packaging method and a package structure.
- fingerprint identification technology has the characteristics of good security, high reliability and simple and convenient use, which makes fingerprint recognition technology widely used in various fields to protect personal information security.
- information security of various electronic products has always been one of the key points of technology development.
- mobile terminals such as mobile phones, notebook computers, tablet computers, digital cameras, etc.
- the demand for information security is more prominent.
- the sensing method of the fingerprint identification device includes a capacitive (electric field type) and an inductive type, and the fingerprint identification device obtains the fingerprint information of the user by extracting the user fingerprint and converting the user fingerprint into an electrical signal output.
- FIG. 1 is a cross-sectional structural diagram of a fingerprint identification device, including: a substrate 100; a fingerprint identification chip 101 coupled to the surface of the substrate 100; and a glass substrate covering the surface of the fingerprint identification chip 101. 102.
- the fingerprint identification chip 101 has one or more capacitor plates therein. Since the skin or the subcutaneous layer of the user's finger has convex ridges and valleys of depressions, when the user's finger 103 contacts the surface of the glass substrate 102, the distance between the ridge and the valley to the fingerprint recognition chip 101 is different, and therefore, the user's finger 103 The capacitance between the ridge or valley and the capacitor plate is different, and the fingerprint identification core
- the slice 101 is capable of acquiring the different capacitance values and converting them into corresponding electrical signal outputs, and after the fingerprint identification device summarizes the received electrical signals, the fingerprint information of the user can be acquired.
- the sensitivity of the fingerprint recognition chip is high, and the manufacture and application of the fingerprint recognition device are limited.
- the problem solved by the embodiment of the present invention is to simplify the packaging method of the fingerprint identification chip, simplify the packaging structure of the formed fingerprint identification chip, and reduce the sensitivity of the sensing chip, so that the packaging method and the package structure are widely used. .
- an embodiment of the present invention provides a fingerprint identification chip packaging method, including: providing a substrate; coupling the sensing chip to the substrate, the sensing chip including a first surface, and a second surface opposite to the first surface a surface, the sensing chip further includes a sensing area on the first surface, a second surface of the sensing chip faces the substrate; forming a plastic sealing layer on the substrate, a surface of the plastic sealing layer and the sensing chip The first surface is flush; a cover layer is formed on the first surface of the plastic seal layer and the sensing chip.
- the cover layer has a thickness of less than or equal to 100 micrometers.
- the cover layer has a thickness of 20 micrometers to 100 micrometers; the cover layer has a Mohs hardness of greater than or equal to 8H; and the cover layer has a dielectric constant greater than or equal to 7.
- the material of the cover layer comprises at least one of an inorganic nano material or a polymer material.
- the forming process of the cover layer is a screen printing process, a spin coating process or a spraying process.
- the polymer material comprises an epoxy resin, a polyimide resin, a benzocyclobutene resin, a polybenzoxazole resin, a polybutylene terephthalate, a polycarbonate, a polyparaphenylene At least one of ethylene glycol dicarboxylate, polyethylene, polypropylene, polyolefin, polyurethane, polyolefin, polyethersulfone, polyamide, polyurethane, ethylene-vinyl acetate copolymer or polyvinyl alcohol.
- the inorganic nano material is aluminum oxide and/or cobalt oxide.
- the forming process of the cover layer is a chemical vapor deposition process, a physical vapor deposition process, an atomic layer deposition process, a screen printing process, a spin coating process, or a spray process.
- the color of the cover layer includes black and/or white.
- the material of the plastic sealing layer is a polymer material.
- the forming process of the plastic sealing layer is a transfer process, a screen printing process, a spin coating process or a spraying process.
- the sensing chip further includes a peripheral area located on the first surface and surrounding the sensing area.
- the method further includes: forming an edge groove in a peripheral region of the sensing chip before forming the plastic sealing layer, the side surface of the sensing chip exposing the edge groove; at a periphery of the sensing chip The surface of the region, as well as the sidewalls and bottom surface of the edge recess, form a chip circuit.
- the edge groove is a continuous groove surrounding the sensing area, or the edge groove is a plurality of discrete grooves surrounding the sensing area.
- the plastic sealing layer is further formed in the edge groove, and the plastic sealing layer is flush with the sensing area of the sensing chip.
- the method further includes forming a first pad at the bottom of the edge groove, and the chip circuit is connected to the first pad.
- the substrate has a first side
- the sensing chip is coupled to a first side of the substrate
- the first side of the substrate has a second pad
- the method further includes: forming a conductive line before forming the plastic sealing layer, wherein the two ends of the conductive line are respectively connected to the first pad and the second pad.
- a point at which the conductive line has the largest distance from the first side of the substrate is an apex, and the apex is lower than the surface of the plastic sealing layer.
- the method further includes: forming a conductive layer on the sidewall surface of the sensing chip, the first side of the substrate, and the edge groove, and the two ends of the conductive layer are respectively connected to the first pad and the second pad.
- the method further includes: forming a first bonding layer on the first side of the substrate or the second surface of the sensing chip before coupling the sensing chip to the substrate;
- the sensing chip is fixed to the first side of the substrate.
- the method further includes: forming a second bonding layer on the first surface of the molding layer and the sensing chip; forming a covering layer on the surface of the second bonding layer.
- the cover layer is a glass substrate, the glass substrate has a dielectric constant of 6-10, and the thickness is 100 micrometers to 300 micrometers; or the cover layer is a ceramic substrate, and the dielectric of the ceramic substrate The constant is 20 to 100 and the thickness is 100 to 200 micrometers.
- the color of the second bonding layer comprises black and/or white.
- a color layer is formed on the surface of the second bonding layer, the cover layer is formed on the surface of the color layer, and the color of the color layer comprises black and/or white.
- the method further includes: forming a protection ring on the substrate, the protection ring surrounding the sensing chip, the plastic sealing layer and the cover layer, exposing a partial cover layer on the sensing area.
- the method further includes: forming an outer casing surrounding the plastic sealing layer, the sensing chip, the covering layer and the protection ring, the outer casing exposing a partial covering layer on the sensing area.
- the method further includes: forming an outer casing surrounding the plastic sealing layer, the sensing chip and the covering layer, the outer casing exposing a partial covering layer on the sensing area.
- a connecting portion is formed at one end of the substrate, and the connecting portion is used for electrically connecting the sensing chip to an external circuit.
- the embodiment of the present invention further provides a fingerprint identification chip package structure, including: a substrate; a sensing chip coupled to the substrate, the sensing chip includes a first surface, and a second surface opposite to the first surface, the sensing chip further Included in the sensing region on the first surface, the second surface of the sensing chip faces the substrate; a plastic sealing layer on the substrate, the surface of the plastic sealing layer is flush with the first surface of the sensing chip; The plastic layer and the cover layer of the first surface of the sensing chip.
- the sensing chip further includes a peripheral area located on the first surface and surrounding the sensing area.
- the sensing chip further includes an edge groove in the peripheral region, a side surface of the sensing chip exposes the edge groove; a surface of the peripheral region of the sensing chip, and a sidewall of the edge groove And the chip circuit on the bottom surface.
- the edge groove is a continuous groove surrounding the sensing area; or the edge groove is a plurality of discrete grooves surrounding the sensing area.
- the plastic sealing layer is further located in the edge groove, and the plastic sealing layer is flush with the sensing area of the sensing chip.
- the method further includes: a first pad located at a bottom of the edge groove, and the chip circuit is connected to the first pad.
- the substrate has a first side
- the sensing chip is coupled to a first side of the substrate
- the first side of the substrate has a second pad
- the method further includes: a conductive line, wherein the two ends of the conductive line are respectively connected to the first pad and the second pad.
- a point at which the conductive line has the largest distance from the first side of the substrate is an apex, and the apex is lower than the surface of the plastic sealing layer.
- the method further includes: a conductive layer on the sidewall of the sensing chip, the first side of the substrate, and the edge groove, the two ends of the conductive layer being respectively connected to the first pad and the second pad.
- the method further includes: a first bonding layer between the sensing chip and the substrate.
- the cover layer has a thickness of 20 micrometers to 100 micrometers; the cover layer has a Mohs hardness of greater than or equal to 8H; the cover layer has a dielectric constant greater than or equal to 7; and the cover layer material comprises Inorganic nanomaterials and/or polymeric materials; the polymeric materials include epoxy resins, polyimide resins, benzocyclobutene resins, polybenzoxazole resins, polybutylene terephthalate, poly Carbonate, polyethylene terephthalate, polyethylene, polypropylene, polyolefin, polyurethane, polyolefin, polyethersulfone, polyamide, polyurethane, ethylene-vinyl acetate copolymer or polyvinyl alcohol At least one of; the inorganic nanomaterials include aluminum oxide and/or cobalt oxide; the color of the cover layer includes black and/or white.
- the polymeric materials include epoxy resins, polyimide resins, benzocyclobutene resins, polybenzo
- a second bonding layer between the cover layer and the first surface of the molding layer and the sensing chip.
- the cover layer is a glass substrate, the glass substrate has a dielectric constant of 6-10, and the thickness is 100 micrometers to 300 micrometers; or the cover layer is a ceramic substrate, and the dielectric of the ceramic substrate The constant is 20 to 100 and the thickness is 100 to 200 micrometers.
- the color of the second bonding layer comprises black and/or white.
- a color layer is located on the surface of the second bonding layer, the cover layer is located on the surface of the color layer, and the color of the color layer comprises black and/or white.
- the method further includes: a protection ring on the substrate, the protection ring surrounding the sensing chip, the plastic sealing layer and the cover layer, exposing a partial cover layer on the sensing area.
- the method further includes: an outer casing surrounding the plastic sealing layer, the sensing chip, the covering layer and the protection ring, the outer casing exposing a partial covering layer on the sensing area.
- the method further includes: an outer casing surrounding the plastic sealing layer, the sensing chip and the covering layer, the outer casing exposing a partial covering layer on the sensing area.
- one end of the substrate has a connecting portion for electrically connecting the sensing chip to an external circuit.
- FIG. 1 is a schematic cross-sectional structural view of a fingerprint recognition device
- FIG. 2 to FIG. 6 are schematic cross-sectional structural views showing a process of forming a fingerprint identification chip package structure according to an embodiment of the present invention
- FIG. 7 to 11 are schematic cross-sectional views showing a fingerprint identification chip package structure according to another embodiment of the present invention.
- the sensitivity of the fingerprint recognition chip is relatively high, so that the manufacture and application of the fingerprint recognition device are limited.
- the inventor of the present invention has found through research that, referring to FIG. 1 , the surface of the fingerprint identification chip 101 is covered with a glass substrate 102 for protecting the fingerprint identification chip 101 , and the user's finger 103 directly faces the glass substrate 102 .
- the thickness of the glass substrate 102 is relatively thick.
- the fingerprint recognition chip 101 is required to have high sensitivity to ensure accurate extraction of the user's fingerprint.
- the high-sensitivity fingerprint identification chip is difficult to manufacture and the manufacturing cost is high, which in turn causes the application and promotion of the fingerprint identification chip to be limited.
- a capacitance can be formed between the user's finger 103 and the capacitive plate in the fingerprint identification chip 101; wherein the user The finger 103 and the capacitor plate are the two poles of the capacitor, and the glass substrate 102 is a dielectric between the two poles of the capacitor.
- the capacitance value between the user's finger 103 and the capacitor substrate is large, and the difference in height between the ridge and the valley of the user's finger 103 is small, and therefore, the ridge is The difference between the capacitance value between the capacitor plates and the capacitance value between the valley and the capacitor plate is extremely small, and the fingerprint identification chip 101 is required in order to accurately detect the difference in the capacitance value. Has a higher sensitivity.
- the present invention provides a fingerprint identification chip packaging method and package structure.
- the surface of the plastic sealing layer formed on the substrate is flush with the first surface of the sensing chip (for example, a fingerprint identification chip), the plastic sealing layer is used to protect the sensing chip, and the The sensing chip is electrically isolated from the external environment.
- the surface of the plastic sealing layer is flush with the first surface of the sensing chip, a coating layer can be directly formed on the first surface of the plastic sealing layer and the sensing chip, without additionally performing a patterning process on the covering layer, not only
- the process of forming the cover layer is simplified, and unnecessary damage to the sensing area of the sensing chip during the process of forming the cover layer can be avoided, and the fingerprint data obtained by the sensing area is ensured to be accurate.
- the cover layer replaces the conventional glass substrate and can be directly in contact with the user's finger for protecting the sensor chip.
- the cover layer can be thinner, and the cover layer can reduce the distance from the first surface of the sensor chip to the surface of the cover layer, so that the sensor chip can easily detect the user fingerprint, correspondingly
- the package structure reduces the sensitivity of the sensing chip, and the packaging structure of the fingerprint identification chip is more widely used.
- FIG. 2 to FIG. 6 are schematic cross-sectional structural views showing a process of forming a fingerprint identification chip package structure according to an embodiment of the present invention.
- a substrate 200 is provided.
- the substrate 200 is a rigid substrate or a flexible substrate, and the device or the terminal of the sensing chip 201 can be adjusted as needed.
- the substrate 200 is a rigid substrate, and the rigid substrate is a PCB substrate.
- the substrate 200 has a first side 230, and the first side 230 of the substrate 200 is used to couple the sensing chip.
- the first side 230 of the substrate 200 has a wiring layer (not shown) and a second pad 206, the wiring layer is connected to the second pad 206, and the second pad 206 is used for sensing Chip circuit connection on the surface of the chip.
- a connecting portion 240 is formed at one end of the substrate 200, and the connecting portion 240 is for electrically connecting the sensing chip to an external circuit.
- the material of the connecting portion 240 includes a conductive material, and the connecting portion 240 is electrically connected to the wiring layer, so that the chip circuit on the sensing chip can pass through the wiring layer and the connecting portion 240 of the first side surface 230 of the substrate 200, and An external circuit or device makes an electrical connection to deliver an electrical signal.
- a sensing chip 201 is fixed on the substrate 200.
- the sensing chip 201 has a first surface 210 and a second surface 220 opposite to the first surface 210.
- the sensing chip 201 includes a first surface.
- the sensing area 211 of the 210, the second surface 220 of the sensing chip 201 faces the substrate 200.
- the first adhesive layer 208 is adhered to the second surface 220 of the sensing chip 201, and the first adhesive layer 208 is pasted to the first side 230 of the substrate 200, thereby The sensing chip 201 is fixed to the first side 230 of the substrate 200. Subsequently, the sensing chip 201 can be coupled to the substrate 200 by a wire bonding process, even if electrical connection is made between the sensing chip 201 and the wiring layer on the substrate 200.
- the first adhesive layer 208 can be formed at a corresponding position of the first side 230 of the substrate 200 to fix the sensing chip 201, and the sensing chip 201 is pasted on the surface of the first adhesive layer 208.
- the sensor chip 201 is fixed to the substrate 200.
- a capacitance structure or an inductive structure for acquiring user fingerprint information is formed in the sensing area 211, so that the sensing area 211 can detect and receive fingerprint information of the user.
- the sensing chip 201 further includes a peripheral region 212 on the first surface 210 and surrounding the sensing region 211, and a chip circuit 215 is formed in the peripheral region 212 of the first surface 210 of the sensing chip 201.
- the chip circuit 215 is electrically connected to the capacitor structure or the inductor structure in the sensing region 211 for processing the electrical signal output by the capacitor structure or the inductor structure.
- At least one capacitor plate is formed in the sensing region 211.
- the capacitor plate, the cover layer and the user's finger form a capacitor structure.
- the sensing area 211 can acquire the difference in capacitance value between the surface ridges and valleys of the user's finger and the capacitor plate, and output the capacitance value difference through the chip circuit 215 to output the user fingerprint data.
- the sensing chip 201 further includes: an edge groove 204 located in the peripheral region 212, the sidewall of the sensing chip 201 exposing the edge groove 204, the edge groove 204 A first pad 205 is formed on the bottom.
- the edge groove 204 is used to form an output end of the chip circuit 215, that is, the first pad 205, and subsequently through the wire bonding process, the first pad 205 can be electrically connected to the wiring layer on the substrate 200.
- the chip circuit 215 located in the peripheral region 212 of the sensing chip 201 covers the sidewall and the bottom surface of the edge groove 204, and the chip circuit 215 at the bottom of the edge groove 204 is connected to the first solder.
- the pads 205 are connected.
- the edge groove 204 is a continuous groove surrounding the sensing region 211, and the bottom surface of the continuous edge groove 204 has one or several first pads 205.
- the edge groove 204 is a plurality of discrete grooves surrounding the sensing region 211, and each edge groove 204 has one or several first pads 205 therein. The number and distribution state of the first pads 205 are designed according to the specific circuit wiring requirements of the chip circuit 215.
- the sidewall of the edge groove 204 is inclined with respect to the surface of the sensing chip 201, and the angle between the sidewall of the edge groove 204 and the bottom is an obtuse angle.
- the sidewalls of the inclined edge recess 204 facilitate the formation process of the chip circuit 215, and the deposition or etching process for forming the chip circuit 215 is easily performed on the sidewall surface of the edge recess 204.
- the sensing chip 201 is coupled to the substrate 200.
- Coupling the sensing chip 201 with the substrate 200 enables the sensing chip 201 and the substrate 200 to be electrically interconnected.
- the conductive line 207 is formed by a wire bonding process, and the two ends of the conductive line 207 are respectively connected to the first pad 205 and the second pad 206, so that the sensing chip 201 and the substrate 200 are electrically connected to each other. Even.
- the conductive line 207 can electrically connect the chip circuit 215 to the wiring layer on the substrate 200, and the wiring layer is electrically connected to the connection portion 240, so that the chip circuit 215 and the sensing region 211 on the surface of the sensing chip 201 can be connected to the external circuit. Or the device transmits electrical signals.
- the material of the conductive wire 207 is a metal, and the metal is copper, tungsten, aluminum, gold or silver. The process of electrically connecting the sensing chip 201 and the substrate 200 by the wire bonding process is simple, and the process cost is low.
- the wire bonding process includes: providing a conductive wire 207; and connecting the two ends of the conductive wire 207 to the first pad 205 and the second pad 206 by a soldering process.
- the material of the conductive wire 207 is a metal, and the metal is copper, tungsten, aluminum, gold or silver.
- the conductive line 207 is wrapped by the plastic sealing layer, so that the conductive line 207 and the sensing chip 201, and the conductive line 207 are electrically isolated from the external environment. Since the conductive line 207 is connected between the first pad 205 and the second pad 206, the conductive line 207 is curved, and the point on the conductive line 207 that is the largest distance from the first side 230 of the substrate 200 is an apex.
- the apex is also higher than the bottom surface of the edge groove 204, and the apex is lower than the first surface 210 of the sensing chip 201, due to the surface of the subsequently formed plastic sealing layer and the first of the sensing chip 201
- the surface 210 is flush, so that the apex can be lower than the surface of the subsequently formed plastic sealing layer, so that the subsequently formed plastic sealing layer can completely wrap the conductive wire 207, so that the conductive wire 207 can be electrically isolated from the sensing chip 201, and The conductive line 207 is prevented from being exposed.
- a conductive layer 211 (shown in FIG. 8) is formed on the sidewall surface of the sensing chip 201, the first side 230 of the substrate 200, and the edge recess 204, and the two ends of the conductive layer 211 are respectively It is connected to the first pad 205 and the second pad 206.
- the forming process of the conductive layer 211 includes: forming a conductive film by a deposition process, an electroplating process, or an electroless plating process; etching a portion of the conductive film to form the conductive layer 211.
- the material of the conductive layer 211 is a metal, and the metal is one or more of copper, tungsten, aluminum, silver, gold, titanium, tantalum, nickel, titanium nitride, and tantalum nitride.
- a molding layer 202 is formed on the substrate 200 .
- the molding layer 202 surrounds the sensing chip 201 , and the surface of the molding layer 202 is flush with the first surface 210 of the sensing chip 201 .
- the plastic sealing layer 202 is used for fixing and protecting the sensing chip 201 and the conductive line 207, and between the conductive line 207 and the sensing chip 201, between the conductive line 207 and the external environment, and the sensing chip. Electrically isolated from the external environment.
- the apex of the conductive line 207 is lower than the first surface 210 of the sensing chip 201, and the surface of the plastic sealing layer 202 is flush with the first surface 210 of the sensing chip 201, so The plastic encapsulation layer 202 can completely surround the conductive line 207.
- the material of the plastic sealing layer 202 is a polymer material having good flexibility, ductility and covering ability, and the polymer material is epoxy resin, polyethylene, polypropylene, polyolefin, polyamide. Polyurethane, the plastic sealing layer 202 can also adopt other suitable molding materials.
- the molding layer 202 can be formed by an injection molding process, a transfer molding process, or a screen printing process. Since the injection molding process, the transfection process, or the screen printing process can form the molding layer 202 having a predetermined shape, the surface of the formed molding layer 202 can be flush with the first surface 210 of the sensing chip 201 without The plastic encapsulation layer 202 performs an additional etching or polishing process, so that the damage to the first surface 210 of the sensing chip 201 is less, and the fingerprint information acquired by the sensing region 211 can be made more accurate.
- the subsequently formed covering layer can be closely attached to the first of the plastic sealing layer 202 and the sensing chip 201.
- the surface 210 does not need to perform an additional etching process on the cover layer. Therefore, the first surface 210 of the sensing chip 201 is not damaged, so that the detection result obtained by the sensing area 211 of the sensing chip 201 is more accurate.
- the material of the plastic sealing layer 202 can be selected from a material having adhesiveness, and the subsequently formed covering layer portion is located on the surface of the plastic sealing layer 202, so that the covering layer can be fixed by the plastic sealing layer 202, so that the package is formed.
- the structure of the process is simpler and helps to reduce the size of the package structure formed.
- the plastic sealing layer 202 is also located in the edge groove 204, and the plastic sealing layer 202 and the sensing chip 201 are The surface of the sensing area 211 is flush.
- a cover layer 203 is formed on the first surface 210 of the molding layer 202 and the sensing chip 201.
- the cover layer 203 is used to protect the sensing area 211.
- the sensing area 211 can acquire fingerprint information of the user.
- the cover layer 203 has a Mohs hardness of greater than or equal to 8H.
- the hardness of the cover layer 203 is high. Therefore, even if the thickness of the cover layer 203 is thin, the cover layer 203 is sufficient to protect the sensing area 211 of the sensing chip 201 when the user's finger moves on the surface of the cover layer 203. When the surface of the sensor chip 201 is not damaged.
- the hardness of the cover layer 203 is high, the cover layer 203 is difficult to be deformed, and even if the user's finger presses against the surface of the cover layer 203, the thickness of the cover layer 203 is hard to change, thereby ensuring The detection result of the sensing area 211 is accurate.
- the cover layer 203 has a dielectric constant greater than or equal to 7. Since the dielectric constant of the cover layer 203 is large, the electrical isolation capability of the cover layer 203 is strong, and the cover layer 203 has a strong protection capability for the sensing area 211.
- the cover layer 203 has a thickness of 20 micrometers to 100 micrometers.
- the thickness of the cover layer 203 is relatively thin, and when the user's finger is placed on the surface of the cover layer 203, the distance from the finger to the sensing area 211 is reduced. Therefore, the sensing area 211 more easily detects the fingerprint of the user's finger, thereby reducing the requirement for high sensitivity of the sensing chip 201.
- the capacitance between the user's finger and the capacitor plate is inversely proportional to the thickness of the cover layer 203, and is proportional to the dielectric constant of the cover layer 203. Therefore, when the thickness of the cover layer 203 is higher than that of the cover layer 203, When the dielectric constant is large, the capacitance between the finger and the capacitor plate can be detected within the range that the sensing region 211 can detect, and the detection of the sensing region 211 is prevented from being too large or too small. .
- the thickness of the cover layer 203 is in the range of 20 ⁇ m to 100 ⁇ m and the dielectric constant is in the range of greater than or equal to 7, the thickness of the cover layer 203 is increased, and the cover layer 203 is The dielectric constant is also increased correspondingly, and the capacitance value between the user's finger and the capacitor plate can be made larger, and the capacitance value is more easily detected by the sensing area 211.
- the material of the cover layer 203 is a polymer material, an inorganic nano material or a ceramic material.
- the material of the cover layer 203 is an inorganic nano material
- the inorganic nano material includes aluminum oxide or cobalt oxide
- the forming process includes: a chemical vapor deposition process, a physical vapor deposition process, an atomic layer deposition process, Formed by a screen printing process, a spray process or a spin coating process.
- the material of the cover layer 203 is an inorganic nano material, and the inorganic nano material can be formed by a spray coating process or a spin coating process, and the cover layer 203 can be formed by using the inorganic nano material to make the thickness of the cover layer 203.
- the thinner one can enhance the sensing capability of the sensing chip 201 on the fingerprint of the user's finger, and correspondingly reduce the sensitivity of the sensing chip 201.
- the material of the cover layer 203 is a polymer material, which is an epoxy resin, a polyimide resin, a benzocyclobutene resin, a polybenzoxazole resin, and a poly Butylene terephthalate, polycarbonate, polyethylene terephthalate, polyethylene, polypropylene, polyolefin, polyurethane, polyolefin, polyethersulfone, polyamide, polyurethane, ethylene - Vinyl acetate copolymer, polyvinyl alcohol or other suitable polymeric material.
- the cover layer 203 can be formed by a printing process, a spraying process, or a spin coating process.
- the cap layer 203 is formed by a chemical vapor deposition process, a physical vapor deposition process, an atomic layer deposition process, a screen printing process, a spray process, or a spin coating process
- the cover layer 203 is etched to remove a portion of the cover layer 203 on the substrate 200 such that the cover layer is only on the surface of the mold layer 202 and the sensing chip 201.
- the color of the cover layer 203 can be consistent with the color of the protective ring or the casing that is subsequently disposed, so that the formed package structure has a beautiful appearance and uniform color.
- the color of the cover layer 203 includes black or white; in other embodiments, the cover layer 203 can also be other colors.
- the process of etching the cover layer on the substrate 200 can be omitted, so that the formed cover layer is further located on the first side surface 230 of the substrate 200 and the sidewall surface of the plastic seal layer 202, so as to form a cover.
- the layer process is more simplified.
- a second bonding layer 209 (shown in FIG. 7) is formed on the first surface of the molding layer 202 and the sensing chip 201; and a capping layer 203 is formed on the surface of the second bonding layer 209.
- the second bonding layer 209 is used to fix the cover layer 203 to the first surface 210 of the molding layer 202 and the sensing chip 201.
- the cover layer 203 is a material having poor ductility and flexibility, such as a ceramic substrate or a glass substrate, and the surface of the second adhesive layer 209 has a viscosity on the surface of the cover layer 203.
- the cover layer 203 can be adhered to the surface of the plastic seal layer 202 and the sensing chip 201 by adhering the second adhesive layer 209.
- the glass substrate has a dielectric constant of 6 to 10; when the cover layer 203 is a ceramic substrate, the ceramic substrate has a dielectric constant of 20 to 100 and a thickness of 100 ⁇ . 200 microns.
- the color of the second bonding layer 209 includes black or white.
- a color layer can also be formed on the surface of the second bonding layer, the cover layer is formed on the surface of the color layer, and the color of the color layer includes black or white; other embodiments
- the color layer can also be other colors.
- the method further includes forming a guard ring 212 on the substrate 200 , the guard ring 212 surrounding the sensing chip 201 , the molding layer 202 , and the cover layer 203 .
- the material of the guard ring 212 is metal, and the guard ring 212 is grounded through the substrate 200 , and the guard ring 212 is fixed to the first side 230 of the substrate 200 .
- the guard ring 212 is located around the sensing chip 201, the cover layer 203, and the plastic seal layer 202, and a portion of the guard ring 212 extends over the cover layer 203 and is exposed on the sensing area 211. The portion of the cover layer 203 surface.
- the guard ring is only located around the sensing chip 201 and the encapsulation layer 202 and completely exposes the surface of the cover layer 203.
- the material of the guard ring 212 is metal, and the metal is copper, tungsten, aluminum, silver or gold.
- the protection ring 212 is used for electrostatic protection of the sensing chip 201. Since the protection ring 212 is metal, the protection ring 212 can conduct electricity. When a user's finger generates static electricity when contacting the cover layer 203, the electrostatic charge will be Firstly, the protection ring 212 is transmitted from the protection ring 212 to the substrate 200, so as to prevent the overburden layer 203 from being broken by an excessive electrostatic voltage, thereby protecting the sensing chip 201, improving the accuracy of fingerprint detection, eliminating signal noise generated by the sensing chip, and making the sensing The signal output from the chip is more accurate.
- the method further includes: forming a casing 213 surrounding the plastic sealing layer 202, the sensing chip 201, the covering layer 203, and the guard ring 212, the casing 213 exposing the surface of the sensing area 201 Layer 203.
- the housing 213 can be a housing of a device or terminal that requires a fingerprint identification chip, and can also be a housing of the package structure of the fingerprint identification chip.
- the method further includes forming a casing 213 surrounding the plastic encapsulation layer 202, the sensing chip 201 and the cover layer 203, and the casing 213 exposes the cover layer 203 of the surface of the sensing region 211.
- the surface of the plastic sealing layer formed on the substrate is flush with the first surface of the sensing chip, and the plastic sealing layer is used to protect the sensing chip, and the sensing chip is The external environment is electrically isolated. Since the surface of the plastic sealing layer is flush with the first surface of the sensing chip, a coating layer can be directly formed on the first surface of the plastic sealing layer and the sensing chip, without additionally performing a patterning process on the covering layer, not only The process of forming the cover layer is simplified, and unnecessary damage to the sensing area of the sensing chip during the process of forming the cover layer can be avoided, and the fingerprint data obtained by the sensing area is ensured to be accurate.
- the cover layer replaces the conventional glass substrate and can be directly in contact with the user's finger for protecting the sensor chip.
- the cover layer can be selected from a thinner material, and the cover layer can reduce the distance from the first surface of the sensor chip to the surface of the cover layer, so that the sensor chip can easily detect the user. Fingerprint, corresponding
- the package structure reduces the sensitivity of the sensing chip, and the packaging structure of the fingerprint identification chip is more widely used.
- the embodiment of the present invention further provides a package structure formed by the above method.
- a substrate 200 a sensing chip 201 coupled to the substrate 200, the sensing chip 201 having a first surface 210 And the second surface 220 opposite to the first surface 210, the sensing chip 201 includes a sensing area 211 on the first surface 210, the second surface 220 of the sensing chip 201 faces the substrate 200, and a plastic package on the substrate 200
- the layer 202 is surrounded by the sensing chip 201, and the surface of the molding layer 202 is flush with the first surface 210 of the sensing chip 201; the first surface of the molding layer 202 and the sensing chip 201 is located.
- the cover layer 203 of 210 has a thickness of less than 100 microns.
- the sensing area 211 of the first surface 210 of the sensing chip 201 is used for detecting and receiving fingerprint information of the user.
- the sensing area 211 has a capacitor structure or an inductive structure for acquiring user fingerprint information.
- the sensing chip 201 further includes a peripheral area 212 on the first surface 210 and surrounding the sensing area 211.
- the peripheral area 212 of the sensing chip 201 has a chip circuit 215, and the chip circuit 215 and the sensing
- the capacitive structure or the inductive structure in the region 211 is electrically connected for processing the electrical signal output from the capacitive structure or the inductive structure.
- the sensing area 211 has at least one capacitor plate.
- the capacitor plate, the cover layer 203 and the user's finger constitute a capacitor structure, and the sensing The area 211 is capable of acquiring a difference in capacitance value between the surface ridges of the user's finger and the valley and the capacitor plate, and outputting the difference in capacitance value through the chip circuit 215 for output, thereby acquiring user fingerprint data.
- the sensing chip 201 further includes: an edge groove 204 located in the peripheral region 212, a sidewall of the sensing chip 201 exposing the edge groove 204; and a bottom portion of the edge groove 204 has a first solder Pad 205.
- the edge groove 204 is used to form an output end of the chip circuit 215, that is, the first pad 205. By electrically connecting the first pad 205 and the substrate 200, the sensing chip 201 can be realized. Coupling with the substrate 200.
- the chip circuit 215 located in the peripheral region 212 of the sensing chip 201 covers the sidewall and the bottom surface of the edge groove 204, and the chip circuit 215 at the bottom of the edge groove 204 is connected to the first solder.
- the pads 205 are connected.
- the edge groove 204 is a continuous groove surrounding the sensing region 211, and the bottom surface of the continuous edge groove 204 has one or several first pads 205.
- the edge groove 204 is a plurality of discrete grooves surrounding the sensing region 211, and each edge groove 204 has one or several first pads 205 therein. The number and distribution state of the first pads 205 are designed according to the specific circuit wiring requirements of the chip circuit 215.
- the sidewall of the edge groove 204 is inclined with respect to the surface of the sensing chip 201, and the angle between the sidewall of the edge groove 204 and the bottom is an obtuse angle.
- the sidewall surface of the slanted edge recess 204 facilitates the formation of the chip circuit 215, making the deposition and etch process for forming the chip circuit 215 easy.
- the substrate 200 is used to fix the sensing chip 201 and electrically connect the sensing chip 201 with other devices or circuits.
- the fingerprint identification chip package structure further includes a first bonding layer 208 between the sensing chip 201 and the substrate 200, and the sensing chip 201 is fixed to the Substrate 200.
- the substrate 200 is a rigid substrate or a flexible substrate, and the substrate 200 can be adjusted to be a rigid substrate or a flexible substrate according to the requirements of a device or a terminal provided with the sensing chip 201.
- the substrate 200 is a rigid substrate, and the rigid substrate is a PCB substrate, a glass substrate, a metal substrate, a semiconductor substrate, or a polymer substrate.
- the substrate 200 has a first side 230 and the sensing chip 201 is coupled to the first side 230 of the substrate 200.
- the first surface 230 of the substrate 200 has a wiring layer (not shown) and a second pad 206, the wiring layer is connected to the second pad 206, and the second pad 206 is used for sensing
- the chip circuit 215 of the first surface 210 of the chip 201 is connected.
- one end of the substrate 200 has a connecting portion 240, and the material of the connecting portion 240
- the material includes a conductive material, and the connecting portion 240 is electrically connected to the wiring layer, so that the chip circuit 215 on the sensing chip 201 can be electrically connected to the external circuit or device through the wiring layer and the connecting portion 240 of the first side 230 of the substrate 200.
- the connecting portion 240 is electrically connected to the wiring layer, so that the chip circuit 215 on the sensing chip 201 can be electrically connected to the external circuit or device through the wiring layer and the connecting portion 240 of the first side 230 of the substrate 200.
- the fingerprint identification chip package structure further includes a conductive line 207, and the conductive line 207 ends are respectively connected to the first pad 205 and the second pad 206 to make the chip circuit 215 and the wiring layer on the substrate 200.
- the wiring layer is electrically connected to the connecting portion 240, so that the chip circuit and the sensing region 211 on the surface of the sensing chip 201 can transmit electrical signals with an external circuit or device.
- the material of the conductive wire 207 is a metal, and the metal is copper, tungsten, aluminum, gold or silver.
- the conductive line 207 is wrapped by the plastic sealing layer, so that the conductive line 207 and the sensing chip 201, and the conductive line 207 are electrically isolated from the external environment. Since the conductive line 207 is connected between the first pad 205 and the second pad 206, the conductive line 207 is curved, and the point on the conductive line 207 that is the largest distance from the first side 230 of the substrate 200 is an apex.
- the apex is also higher than the bottom surface of the edge groove 204, and the apex is lower than the first surface 210 of the sensing chip 201, due to the surface of the plastic sealing layer 202 and the first of the sensing chip 201
- the surface 210 is flush, so that the plastic encapsulation layer 202 can completely surround the conductive line 207, preventing the conductive line 207 from being exposed.
- the plastic encapsulation layer 202 is located on the substrate 200 and surrounds the sensing chip 201 and the conductive line 207.
- the plastic encapsulation layer 202 is used to fix the sensing chip 201 to the first side 230 of the substrate 200, and can also be used to make the
- the conductive line 207 is electrically isolated from the sensing chip 201, the conductive line 207 and the external environment.
- the material of the plastic sealing layer 202 is a polymer material having good flexibility, ductility and covering ability, and the polymer material is epoxy resin, polyethylene, polypropylene, polyolefin, polyamide. Polyurethane, the plastic sealing layer 202 can also adopt other suitable molding materials.
- the molding layer 202 can be formed by an injection molding process, a transfer molding process, or a screen printing process.
- the surface of the plastic sealing layer 202 is flush with the first surface 210 of the sensing chip 201, so that the covering layer 203 can directly cover the first sealing surface 202 and the first surface 210 of the sensing chip 201.
- the formed fingerprint identification chip is simple in structure and easy to assemble.
- the plastic seal layer 202 can be used to fix the cover layer 203, so that the cover layer 203 can be closely attached to the first surface of the sensor chip 201. 210, and the first surface 210 of the sensing chip 201 is not damaged, so that the detection result obtained by the sensing area 211 of the sensing chip 201 is more accurate.
- the plastic sealing layer 202 is also located in the edge groove 204, and the plastic sealing layer 202 and the sensing chip 201 are The surface of the sensing area 211 is flush.
- the material of the cover layer 203 is a polymer material, an inorganic nano material or a ceramic material.
- the material of the cover layer 203 is an inorganic nano material, and the inorganic nano material includes aluminum oxide or cobalt oxide; the cover layer 203 can be formed by a printing process, a spraying process or a spin coating process.
- the material of the cover layer 203 is a polymer material, which is an epoxy resin, a polyimide resin, a benzocyclobutene resin, a polybenzoxazole resin, and a poly Butylene terephthalate, polycarbonate, polyethylene terephthalate, polyethylene, polypropylene, polyolefin, polyurethane, polyolefin, polyethersulfone, polyamide, polyurethane, ethylene - Vinyl acetate copolymer, polyvinyl alcohol or other suitable polymeric material; the cover layer 203 can be formed by a printing process, a spray coating process or a spin coating process.
- the cover layer 203 has a Mohs hardness of greater than or equal to 8H.
- the hardness of the cover layer 203 is high. Therefore, even if the thickness of the cover layer 203 is thin, the cover layer 203 is sufficient to protect the sensing area 211 of the sensing chip 201 when the user's finger moves on the surface of the cover layer 203. When the surface of the sensor chip 201 is not damaged.
- the hardness of the cover layer 203 is high, the cover layer 203 is difficult to be deformed, and even if the user's finger presses against the surface of the cover layer 203, the thickness of the cover layer 203 is hard to change, thereby ensuring The detection result of the sensing area 211 is accurate.
- the cover layer 203 has a dielectric constant greater than or equal to 7. Since the dielectric constant of the cover layer 203 is large, the electrical isolation capability of the cover layer 203 is strong, and the cover layer 203 has a strong protection capability for the sensing area 211.
- the cover layer 203 has a thickness of 20 micrometers to 100 micrometers.
- the thickness of the cover layer 203 is relatively thin.
- the sensing area 211 is more likely to detect the fingerprint of the user's finger. Thereby, the requirement for high sensitivity of the sensing chip 201 is lowered.
- the capacitance between the user's finger and the capacitor plate is inversely proportional to the thickness of the cover layer 203, and is proportional to the dielectric constant of the cover layer 203. Therefore, when the thickness of the cover layer 203 is higher than that of the cover layer 203, When the dielectric constant is large, the capacitance between the user's finger and the capacitor plate can be detected within the range that the sensing region 211 can detect, and the detection of the sensing region 211 is prevented from being invalid if the capacitance value is too large or too small.
- the thickness of the cover layer 203 is in the range of 20 ⁇ m to 100 ⁇ m and the dielectric constant is in the range of greater than or equal to 7, the thickness of the cover layer 203 is increased, and the cover layer 203 is The dielectric constant is also increased correspondingly, and the capacitance value between the user's finger and the capacitor plate can be made larger, and the capacitance value is more easily detected by the sensing area 211.
- the color of the cover layer 203 can be consistent with the color of the protective ring or the casing that is subsequently disposed, so that the formed package structure has a beautiful appearance and uniform color.
- the color of the cover layer 203 includes black or white; in other embodiments, the cover layer 203 can also be other colors.
- the fingerprint identification chip package structure further includes: a second adhesive layer between the cover layer 203 and the molding layer 202 and the first surface 210 of the sensing chip 201. 209.
- the cover layer 203 is a material having poor ductility and flexibility, such as a ceramic substrate or a glass substrate, and the second adhesive layer 209 is used to fix the cover layer 203 to the The molding layer 202 and the first surface 210 of the sensing chip 201.
- the glass substrate has a dielectric constant of 6-10 and a thickness of 100 micrometers to 300 micrometers; when the cover layer 203 is a ceramic substrate, the dielectric constant of the ceramic substrate is 20 to 100, the thickness is from 100 micrometers to 200 micrometers.
- the color of the second bonding layer 209 includes black or white.
- a color layer can also be formed on the surface of the second bonding layer, the cover layer being formed on the color map
- the layer surface, the color of the color layer includes black or white; in other embodiments, the color layer can also be other colors.
- the package structure of the fingerprint identification chip further includes: a conductive layer 211 located on the sidewall surface of the sensing chip 201, the first side 230 of the substrate 200, and the edge groove 204, the conductive layer The two ends of the layer 211 are respectively connected to the first pad 205 and the second pad 206 to realize electrical connection between the sensing region 211 and the chip circuit 215 and the wiring layer on the substrate 200.
- the package structure of the fingerprint identification chip further includes: a protection ring 212 on the substrate 200 , the protection ring 212 surrounding the induction chip 201 , the molding layer 202 and the cover layer 203 .
- the material of the guard ring 212 is metal, and the guard ring 212 is grounded through the substrate 200 , and the guard ring 212 is fixed to the first side 230 of the substrate 200 .
- the guard ring 212 is located around the sensing chip 201, the cover layer 203, and the plastic seal layer 202, and a portion of the guard ring 212 extends over the cover layer 203 and is exposed on the sensing area 211. The portion of the cover layer 203 surface.
- the guard ring is only located around the sensing chip 201 and the encapsulation layer 202 and completely exposes the surface of the cover layer 203.
- the material of the guard ring 212 is metal, and the metal is copper, tungsten, aluminum, silver or gold.
- the protection ring 212 is used for electrostatic protection of the sensing chip 201. Since the protection ring 212 is metal, the protection ring 212 can conduct electricity. When a user's finger generates static electricity when contacting the cover layer 203, the electrostatic charge will be Firstly, the protection ring 212 is transmitted from the protection ring 212 to the substrate 200, so as to prevent the overburden layer 203 from being broken by an excessive electrostatic voltage, thereby protecting the sensing chip 201, improving the accuracy of fingerprint detection, eliminating signal noise generated by the sensing chip, and making the sensing The signal output from the chip is more accurate.
- the package structure of the fingerprint identification chip further includes: a housing 213 surrounding the plastic sealing layer 202, the sensing chip 201, the cover layer 203, and the guard ring 212, the housing 213 exposing the sensing A cover layer 203 on the surface of the region 211.
- the housing 213 can be a housing of a device or terminal provided with the fingerprint identification chip, and can also be an outer casing of the package structure of the fingerprint identification chip.
- the package structure of the fingerprint identification chip further includes: a housing 213 surrounding the molding layer 202 , the sensing chip 201 and the cover layer 203 , the housing 213 exposing the surface of the sensing area 211 Cover layer 203.
- the surface of the plastic sealing layer formed on the substrate is flush with the first surface of the sensing chip, and the plastic sealing layer is used to protect the sensing chip and electrically isolate the sensing chip from the external environment. Since the surface of the plastic sealing layer is flush with the first surface of the sensing chip, a coating layer can be directly formed on the first surface of the plastic sealing layer and the sensing chip, without additionally performing a patterning process on the covering layer, not only The process of forming the cover layer is simplified, and unnecessary damage to the sensing area of the sensing chip during the process of forming the cover layer can be avoided, and the fingerprint data obtained by the sensing area is ensured to be accurate.
- the cover layer replaces the conventional glass substrate and can be directly in contact with the user's finger for protecting the sensor chip.
- the cover layer can be selected from a thinner material, and the cover layer can reduce the distance from the first surface of the sensor chip to the surface of the cover layer, so that the sensor chip can easily detect the user.
- the fingerprint correspondingly, the package structure reduces the sensitivity of the sensing chip, so that the packaging structure of the fingerprint identification chip is more widely used.
- the cover layer has a thickness of from 20 micrometers to 100 micrometers.
- the thickness of the cover layer is thin, so that the sensing area of the sensing chip can more easily detect the user fingerprint placed on the surface of the cover layer, which reduces the sensitivity of the sensing chip; when the material hardness of the cover layer is large, Even if the cover layer is thin, it has a first surface sufficient to protect the sensing chip.
- the Mohs hardness of the cover layer is greater than or equal to 8H, and the hardness of the cover layer is high. Even if the cover layer on the surface of the sensing area is thin, the cover layer still has sufficient strength to protect the induction. When the user's finger is placed on the surface of the cover layer on the sensing area, the cover layer is less likely to be deformed or worn, so that the extraction result of the user's fingerprint is more accurate.
- the cover layer has a dielectric constant of 7 to 9.
- the cover layer has a large dielectric constant, so that the electrical isolation property of the cover layer is better, and the cover layer has better protection ability to the sensing area, even if the cover layer on the surface of the sensing area is thinner. Capable of making electricity between the user's finger and the sensing area The isolation capability is strong, and the capacitance formed between the user's finger and the sensing area is large, and is within a range that can be detected.
- a protective ring is disposed on the substrate, and the guard ring surrounds the sensing chip and the cover layer.
- the protection ring is used for electrostatic protection of the sensing chip to prevent the accuracy of the user fingerprint data detected by the sensing area from decreasing; the protection ring can also eliminate the signal noise outputted by the sensing chip, and the data detected by the sensing chip, And the output signal is more accurate.
- the surface of the substrate surrounds the plastic sealing layer of the sensing chip, and the first surface of the plastic sealing layer and the sensing chip has a covering layer.
- the plastic sealing layer is used for fixing the covering layer, so that the covering layer can directly be attached to the first surface of the sensing chip, and the covering layer replaces the traditional glass substrate and can directly contact the user's finger.
- the cover layer has a thinner thickness and a higher hardness than a conventional glass substrate; the cover layer has a high hardness, so that the cover layer can be made thinner in the case of a thinner cover layer.
- the cover layer has a sufficient hardness to protect the first surface of the sensing chip; and the covering layer can reduce the distance from the first surface of the sensing chip to the surface of the cover layer, so that the sensing chip can easily detect the fingerprint of the user, and accordingly
- the package structure reduces the sensitivity of the sensing chip, so that the fingerprint identification chip package structure is more widely used, and the structure is simple, the assembly is easier, and the production cost can be reduced.
- the surface of the substrate surrounds the plastic sealing layer of the sensing chip, and the first surface of the plastic sealing layer and the sensing chip has a covering layer.
- the plastic sealing layer is used for fixing the covering layer, so that the covering layer can directly be attached to the first surface of the sensing chip, and the covering layer replaces the traditional glass substrate and can directly contact the user's finger.
- the cover layer has a thinner thickness and a higher hardness than a conventional glass substrate; the cover layer has a high hardness, so that the cover layer can be made thinner in the case of a thinner cover layer.
- the cover layer has a sufficient hardness to protect the first surface of the sensing chip; and the covering layer can reduce the distance from the first surface of the sensing chip to the surface of the cover layer, so that the sensing chip can easily detect the fingerprint of the user, and accordingly
- the package structure reduces the sensitivity of the sensing chip, so that the fingerprint identification chip package structure is more widely used, and the structure is simple, the assembly is easier, and the production cost can be reduced.
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Abstract
Description
Claims (33)
- 一种芯片封装结构,包括:基板;与基板耦合的感应芯片,所述感应芯片包括第一表面、以及与第一表面相对的第二表面,所述感应芯片还包括位于所述第一表面的感应区,所述感应芯片的第二表面面向基板;位于基板上的塑封层,所述塑封层包围所述感应芯片,所述塑封层的表面与所述感应芯片的第一表面齐平;位于所述塑封层和感应芯片第一表面上的覆盖层。
- 如权利要求1所述的芯片封装结构,其中,所述感应芯片还包括:位于所述第一表面且包围所述感应区的外围区;位于所述外围区的边缘凹槽,所述感应芯片的侧面暴露出所述边缘凹槽;位于感应芯片的外围区表面、以及边缘凹槽的侧壁和底部表面的芯片电路。
- 如权利要求2所述的芯片封装结构,其中,所述塑封层还位于所述边缘凹槽内,且所述塑封层与感应芯片的感应区表面齐平。
- 如权利要求2所述的芯片封装结构,其中,还包括:位于所述边缘凹槽底部的第一焊垫,所述芯片电路与所述第一焊垫电连接。
- 如权利要求4所述的芯片封装结构,其中,所述基板具有第一侧面,所述基板的第一侧面具有第二焊垫,所述感应芯片与所述第二焊垫耦合。
- 如权利要求1所述的芯片封装结构,其中,所述基板具有连接部,所述连接部用于使感应芯片与外部电路电连接。
- 如权利要求5所述的芯片封装结构,还包括:导电线,所述导电线两端分别与第一焊垫与第二焊垫连接,其中,所述导电线上到基板第一侧面距离 最大的点为顶点,所述顶点低于所述塑封层表面。
- 如权利要求5所述的芯片封装结构,还包括:位于感应芯片侧壁表面上、基板第一侧面上、以及边缘凹槽内的导电层,所述导电层两端分别与第一焊垫和第二焊垫电连接。
- 如权利要求1所述的芯片封装结构,其中,所述覆盖层的厚度为20微米~100微米;所述覆盖层的莫氏硬度大于或等于8H;所述覆盖层的介电常数大于或等于7。
- 如权利要求1所述的芯片封装结构,其中,所述覆盖层的材料包括无机纳米材料和聚合物材料中的至少一种。
- 如权利要求10所述的芯片封装结构,其中,所述聚合物材料包括环氧树脂、聚酰亚胺树脂、苯并环丁烯树脂、聚苯并恶唑树脂、聚对苯二甲酸丁二酯、聚碳酸酯、聚对苯二甲酸乙二醇酯、聚乙烯、聚丙烯、聚烯烃、聚氨酯、聚烯烃、聚醚砜、聚酰胺、聚亚氨酯、乙烯-醋酸乙烯共聚物和聚乙烯醇中的至少一种。
- 如权利要求10所述的芯片封装结构,其中,所述无机纳米材料包括氧化铝和氧化钴中的至少一种。
- 如权利要求1所述的芯片封装结构,其中,所述覆盖层包括玻璃基板,所述玻璃基板的介电常数为6~10,厚度为100微米~300微米;或者,所述覆盖层包括陶瓷基板,所述陶瓷基板的介电常数为20~100,厚度为100微米~200微米。
- 如权利要求1所述的芯片封装结构,其中,所述塑封层的材料包括聚合物材料。
- 如权利要求14所述的芯片封装结构,其中,所述聚合物材料包括环氧树脂、聚乙烯、聚丙烯、聚烯烃、聚酰胺和聚亚氨酯中的至少一种。
- 如权利要求1所述的芯片封装结构,还包括位于所述基板上的保护环,所述保护环包围所述感应芯片、塑封层和覆盖层,暴露出感应区上的部分覆 盖层。
- 如权利要求16所述的芯片封装结构,还包括包围所述塑封层、感应芯片、覆盖层和保护环的外壳,所述外壳暴露出感应区上的部分覆盖层。
- 一种芯片封装方法,包括:提供基板;将感应芯片与所述基板耦合,所述感应芯片包括第一表面、以及与第一表面相对的第二表面,所述感应芯片还包括位于所述第一表面的感应区,所述感应芯片的第二表面面向基板;在所述基板上形成塑封层,所述塑封层的表面与所述感应芯片的第一表面齐平;在所述塑封层和感应芯片的第一表面上形成覆盖层。
- 如权利要求18所述的芯片封装方法,其中,所述覆盖层的厚度为20微米~100微米;所述覆盖层的莫氏硬度大于或等于8H;所述覆盖层的介电常数大于或等于7。
- 如权利要求18所述的芯片封装方法,其中,所述塑封层包括聚合物材料。
- 如权利要求20所述的芯片封装方法,其中,所述塑封层通过转注工艺、丝网印刷工艺、旋涂工艺或喷涂工艺形成。
- 如权利要求18所述的芯片封装方法,其中,所述覆盖层的材料包括无机纳米材料和聚合物材料中的至少一种。
- 如权利要求22所述的芯片封装方法,其中,所述聚合物材料包括环氧树脂、聚酰亚胺树脂、苯并环丁烯树脂、聚苯并恶唑树脂、聚对苯二甲酸丁二酯、聚碳酸酯、聚对苯二甲酸乙二醇酯、聚乙烯、聚丙烯、聚烯烃、聚氨酯、聚烯烃、聚醚砜、聚酰胺、聚亚氨酯、乙烯-醋酸乙烯共聚物和聚乙烯醇中的至少一种。
- 如权利要求23所述的芯片封装方法,其中,所述覆盖层通过丝网印刷工艺、 旋涂工艺或喷涂工艺形成。
- 如权利要求22所述的芯片封装结构,其中,所述无机纳米材料包括氧化铝和氧化钴中的至少一种。
- 如权利要求25所述的芯片封装结构,其中,所述覆盖层通过化学气相沉积工艺、物理气相沉积工艺、原子层沉积工艺、丝网印刷工艺、旋涂工艺或喷涂工艺形成。
- 如权利要求18所述的芯片封装方法,在将感应芯片与所述基板耦合之前,还包括:在所述基板的第一侧面或感应芯片的第二表面上形成第一粘结层;通过所述第一粘结层使所述感应芯片固定于所述基板的第一侧面。
- 如权利要求18所述的芯片封装方法,还包括:在所述塑封层和感应芯片第一表面上形成第二粘结层;在所述第二粘结层上形成覆盖层。
- 如权利要求18所述的芯片封装方法,其中,所述感应芯片还包括位于所述第一表面且包围所述感应区的外围区,其中,所述方法还包括:在形成所述塑封层之前,在所述感应芯片的外围区形成边缘凹槽,所述感应芯片的侧面暴露出所述边缘凹槽;以及在所述感应芯片的外围区表面、以及边缘凹槽的侧壁和底部表面形成芯片电路。
- 如权利要求29所述的芯片封装方法,其中,所述塑封层还形成于所述边缘凹槽内,且所述塑封层与感应芯片的感应区表面齐平。
- 如权利要求29所述的芯片封装方法,还包括:在所述边缘凹槽底部形成第一焊垫,所述芯片电路与所述第一焊垫电连接。
- 如权利要求31所述的芯片封装方法,其中,所述基板具有第一侧面,所述基板的第一侧面具有第二焊垫,所述方法还包括:在形成所述塑封层之前,形成导电线,所述导电线两端分别与第一焊垫与第二焊垫连接,其中所述导电线上到基板第一侧面距离最大的点为顶点,所述顶点低于所述塑封层 表面。
- 如权利要求31所述的芯片封装方法,其中,所述基板具有第一侧面,所述基板的第一侧面具有第二焊垫,所述方法还包括:在所述感应芯片侧壁上、基板第一侧面上、以及边缘凹槽内形成导电层,所述导电层两端分别与第一焊垫和第二焊垫电连接。
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CN104201116A (zh) | 2014-12-10 |
US20170287797A1 (en) | 2017-10-05 |
TWI672749B (zh) | 2019-09-21 |
US10090217B2 (en) | 2018-10-02 |
CN104201116B (zh) | 2018-04-20 |
TW201611137A (zh) | 2016-03-16 |
KR20170051515A (ko) | 2017-05-11 |
KR101974011B1 (ko) | 2019-04-30 |
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