WO2016027802A1 - 金属材、およびこの金属材を用いた通電部品 - Google Patents
金属材、およびこの金属材を用いた通電部品 Download PDFInfo
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- WO2016027802A1 WO2016027802A1 PCT/JP2015/073121 JP2015073121W WO2016027802A1 WO 2016027802 A1 WO2016027802 A1 WO 2016027802A1 JP 2015073121 W JP2015073121 W JP 2015073121W WO 2016027802 A1 WO2016027802 A1 WO 2016027802A1
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- metal
- platinum group
- compound layer
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- 239000007769 metal material Substances 0.000 title claims abstract description 52
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 123
- 229910052751 metal Inorganic materials 0.000 claims abstract description 95
- 239000002184 metal Substances 0.000 claims abstract description 95
- 150000002736 metal compounds Chemical class 0.000 claims abstract description 84
- -1 platinum group compound Chemical class 0.000 claims abstract description 41
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 27
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 26
- 239000001301 oxygen Substances 0.000 claims abstract description 26
- 229910052723 transition metal Inorganic materials 0.000 claims abstract description 26
- 150000003624 transition metals Chemical group 0.000 claims abstract description 26
- 150000001875 compounds Chemical class 0.000 claims abstract description 25
- 229910052741 iridium Inorganic materials 0.000 claims abstract description 4
- 229910052762 osmium Inorganic materials 0.000 claims abstract description 4
- 229910052703 rhodium Inorganic materials 0.000 claims abstract description 4
- 229910052707 ruthenium Inorganic materials 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 39
- 239000000446 fuel Substances 0.000 claims description 31
- 239000000758 substrate Substances 0.000 claims description 14
- 239000011248 coating agent Substances 0.000 abstract description 8
- 238000000576 coating method Methods 0.000 abstract description 8
- 239000010410 layer Substances 0.000 description 108
- 239000010408 film Substances 0.000 description 44
- 210000004027 cell Anatomy 0.000 description 40
- 238000005452 bending Methods 0.000 description 36
- 238000010438 heat treatment Methods 0.000 description 28
- 238000012360 testing method Methods 0.000 description 24
- 238000000034 method Methods 0.000 description 23
- 238000007747 plating Methods 0.000 description 17
- 230000007797 corrosion Effects 0.000 description 15
- 238000005260 corrosion Methods 0.000 description 15
- 230000008569 process Effects 0.000 description 13
- 239000005518 polymer electrolyte Substances 0.000 description 12
- 239000007789 gas Substances 0.000 description 11
- 239000000126 substance Substances 0.000 description 11
- 229910052719 titanium Inorganic materials 0.000 description 11
- 239000010936 titanium Substances 0.000 description 11
- 239000002344 surface layer Substances 0.000 description 10
- 229910045601 alloy Inorganic materials 0.000 description 9
- 239000000956 alloy Substances 0.000 description 9
- 229910000510 noble metal Inorganic materials 0.000 description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 7
- 229910052742 iron Inorganic materials 0.000 description 7
- 230000003647 oxidation Effects 0.000 description 7
- 238000007254 oxidation reaction Methods 0.000 description 7
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 6
- 238000010306 acid treatment Methods 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 6
- 229910052799 carbon Inorganic materials 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000012528 membrane Substances 0.000 description 6
- CLSUSRZJUQMOHH-UHFFFAOYSA-L platinum dichloride Chemical compound Cl[Pt]Cl CLSUSRZJUQMOHH-UHFFFAOYSA-L 0.000 description 6
- 239000002253 acid Substances 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- 230000001590 oxidative effect Effects 0.000 description 5
- 238000003466 welding Methods 0.000 description 5
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- 150000001768 cations Chemical class 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 4
- 229910052731 fluorine Inorganic materials 0.000 description 4
- 239000011737 fluorine Substances 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- QZPSXPBJTPJTSZ-UHFFFAOYSA-N aqua regia Chemical compound Cl.O[N+]([O-])=O QZPSXPBJTPJTSZ-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 239000002737 fuel gas Substances 0.000 description 3
- 229910052748 manganese Inorganic materials 0.000 description 3
- 229910044991 metal oxide Inorganic materials 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 238000005192 partition Methods 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 229910052720 vanadium Inorganic materials 0.000 description 3
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 229910001069 Ti alloy Inorganic materials 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 229910000963 austenitic stainless steel Inorganic materials 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- 239000003575 carbonaceous material Substances 0.000 description 2
- 238000009749 continuous casting Methods 0.000 description 2
- 239000000498 cooling water Substances 0.000 description 2
- 229910001039 duplex stainless steel Inorganic materials 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- GPRLSGONYQIRFK-UHFFFAOYSA-N hydron Chemical compound [H+] GPRLSGONYQIRFK-UHFFFAOYSA-N 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- MUMZUERVLWJKNR-UHFFFAOYSA-N oxoplatinum Chemical compound [Pt]=O MUMZUERVLWJKNR-UHFFFAOYSA-N 0.000 description 2
- 238000005554 pickling Methods 0.000 description 2
- 229910001924 platinum group oxide Inorganic materials 0.000 description 2
- 229910003446 platinum oxide Inorganic materials 0.000 description 2
- VWDWKYIASSYTQR-UHFFFAOYSA-N sodium nitrate Chemical compound [Na+].[O-][N+]([O-])=O VWDWKYIASSYTQR-UHFFFAOYSA-N 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 238000007751 thermal spraying Methods 0.000 description 2
- 229910000975 Carbon steel Inorganic materials 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- 208000005156 Dehydration Diseases 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000010962 carbon steel Substances 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005097 cold rolling Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- HPXRVTGHNJAIIH-UHFFFAOYSA-N cyclohexanol Chemical compound OC1CCCCC1 HPXRVTGHNJAIIH-UHFFFAOYSA-N 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000010494 dissociation reaction Methods 0.000 description 1
- 230000005593 dissociations Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003487 electrochemical reaction Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000005098 hot rolling Methods 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- LNJXVUXPFZKMNF-UHFFFAOYSA-K iridium(3+);trichloride;trihydrate Chemical compound O.O.O.Cl[Ir](Cl)Cl LNJXVUXPFZKMNF-UHFFFAOYSA-K 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- NFOHLBHARAZXFQ-UHFFFAOYSA-L platinum(2+);dihydroxide Chemical compound O[Pt]O NFOHLBHARAZXFQ-UHFFFAOYSA-L 0.000 description 1
- NWAHZABTSDUXMJ-UHFFFAOYSA-N platinum(2+);dinitrate Chemical compound [Pt+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O NWAHZABTSDUXMJ-UHFFFAOYSA-N 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 235000010344 sodium nitrate Nutrition 0.000 description 1
- 239000004317 sodium nitrate Substances 0.000 description 1
- 239000007784 solid electrolyte Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000005482 strain hardening Methods 0.000 description 1
- HSXKFDGTKKAEHL-UHFFFAOYSA-N tantalum(v) ethoxide Chemical compound [Ta+5].CC[O-].CC[O-].CC[O-].CC[O-].CC[O-] HSXKFDGTKKAEHL-UHFFFAOYSA-N 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M8/00—Fuel cells; Manufacture thereof
- H01M8/02—Details
- H01M8/0202—Collectors; Separators, e.g. bipolar separators; Interconnectors
- H01M8/0204—Non-porous and characterised by the material
- H01M8/0223—Composites
- H01M8/0228—Composites in the form of layered or coated products
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
- C23C28/322—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer only coatings of metal elements only
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
- C23C28/345—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
- C25B11/00—Electrodes; Manufacture thereof not otherwise provided for
- C25B11/04—Electrodes; Manufacture thereof not otherwise provided for characterised by the material
- C25B11/051—Electrodes formed of electrocatalysts on a substrate or carrier
- C25B11/073—Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material
- C25B11/091—Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material consisting of at least one catalytic element and at least one catalytic compound; consisting of two or more catalytic elements or catalytic compounds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/86—Inert electrodes with catalytic activity, e.g. for fuel cells
- H01M4/90—Selection of catalytic material
- H01M4/92—Metals of platinum group
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M8/00—Fuel cells; Manufacture thereof
- H01M8/02—Details
- H01M8/0202—Collectors; Separators, e.g. bipolar separators; Interconnectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M8/00—Fuel cells; Manufacture thereof
- H01M8/02—Details
- H01M8/0202—Collectors; Separators, e.g. bipolar separators; Interconnectors
- H01M8/0204—Non-porous and characterised by the material
- H01M8/0206—Metals or alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M8/00—Fuel cells; Manufacture thereof
- H01M8/02—Details
- H01M8/0202—Collectors; Separators, e.g. bipolar separators; Interconnectors
- H01M8/0204—Non-porous and characterised by the material
- H01M8/0215—Glass; Ceramic materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M8/00—Fuel cells; Manufacture thereof
- H01M8/10—Fuel cells with solid electrolytes
- H01M2008/1095—Fuel cells with polymeric electrolytes
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/30—Hydrogen technology
- Y02E60/50—Fuel cells
Definitions
- the present invention relates to a metal material and a current-carrying component (for example, a fuel cell separator, an electrode, etc.) using the metal material.
- a current-carrying component for example, a fuel cell separator, an electrode, etc.
- a fuel cell is a next-generation power generation system that is expected to be introduced and spread from both aspects of energy saving and environmental measures because it uses the energy generated in the combined reaction of hydrogen and oxygen.
- fuel cells such as solid electrolyte type, molten carbonate type, phosphoric acid type, and solid polymer type.
- the polymer electrolyte fuel cell has a high output density and can be miniaturized, operates at a lower temperature than other types of fuel cells, and is easy to start and stop. Because of these advantages, the polymer electrolyte fuel cell is expected to be used for small cogeneration for automobiles and households, and has attracted particular attention in recent years.
- FIG. 1 is a diagram showing the structure of a polymer electrolyte fuel cell (hereinafter also simply referred to as “fuel cell”).
- FIG. 1A is an exploded perspective view of a single cell constituting the fuel cell
- FIG. 1B is a perspective view of the entire fuel cell made by combining a plurality of single cells.
- the fuel cell 1 is an assembly (stack) of single cells.
- an anode-side gas diffusion electrode layer also referred to as “fuel electrode membrane”; hereinafter referred to as “anode”
- anode anode-side gas diffusion electrode layer
- Cathode-side gas diffusion electrode layers also referred to as “oxidant electrode films”; hereinafter referred to as “cathodes”
- separators (bipolar plates) 5a and 5b are laminated on both surfaces. It is piled up.
- Some fuel cells are provided with a separator having a cooling water flow path between two adjacent single cells or every several single cells.
- the present invention is also directed to such a water-cooled fuel cell separator.
- electrolyte membrane As the solid polymer electrolyte membrane (hereinafter simply referred to as “electrolyte membrane”) 2, a fluorine-based proton conductive membrane having a hydrogen ion (proton) exchange group is mainly used.
- Each of the anode 3 and the cathode 4 is mainly composed of a carbon sheet (or carbon paper thinner than the carbon sheet, or thinner carbon cloth) made of conductive carbon fibers in the form of a sheet.
- the anode 3 and the cathode 4 may be provided with a catalyst layer made of a particulate platinum catalyst, graphite powder, and, if necessary, a fluorine resin having a hydrogen ion (proton) exchange group.
- the fuel gas or oxidizing gas and the catalyst layer come into contact with each other to promote the reaction.
- a groove-like flow path 6a is formed on the surface on the anode 3 side.
- a fuel gas (hydrogen or hydrogen-containing gas) A flows through the flow path 6a, and hydrogen is supplied to the anode 3.
- the separator 5b has a groove-like channel 6b formed on the surface on the cathode 4 side.
- An oxidizing gas B such as air flows through the flow path 6 b and oxygen is supplied to the cathode 4. By supplying these gases, an electrochemical reaction occurs and DC power is generated.
- the main functions required for a separator of a polymer electrolyte fuel cell are as follows. (1) Function as a “flow path” for uniformly supplying fuel gas or oxidizing gas into the cell surface (2) Water generated on the cathode side, together with carrier gas such as air and oxygen after reaction, fuel Function as a “flow path” for efficiently discharging the battery out of the system (3) Contact with the electrode membrane (anode 3, cathode 4) to form an electrical path, and an electrical “connector” between two adjacent single cells (4) Function as a “partition” between the anode chamber of one cell and the cathode chamber of the adjacent cell between adjacent cells (5) In the water-cooled fuel cell, the cell adjacent to the cooling water flow path Function as a “partition wall”
- the base material of a separator (hereinafter simply referred to as “separator”) used in a polymer electrolyte fuel cell needs to be able to perform such a function.
- Substrate materials are roughly classified into metal materials and carbon materials.
- the use of a carbon-based material has an advantage that a lightweight separator can be obtained, but has a problem of gas permeability (poor function as a partition) and a problem of low mechanical strength.
- Titanium, stainless steel, carbon steel, etc. are used as metal materials. Separators made of these metal-based materials are manufactured by pressing or the like. Metallic materials have the advantages of excellent workability and reduced thickness of the separator as a unique property of the metal, and can reduce the weight of the separator, but the electrical conductivity may be reduced due to oxidation of the metal surface. There is. For this reason, there is a problem that the contact resistance between the separator made of a metal material and the gas diffusion layer can be increased. The following measures have been proposed for this problem.
- Patent Document 1 proposes a separator in which a metal member surface is plated with gold.
- Patent Document 2 proposes a separator in which a noble metal thin film layer is formed on the surface of a metal base material.
- Patent Document 3 discloses a metal separator having a surface having corrosion resistance and conductive inclusions exposed from the surface, and gold is coated on a region where the conductive inclusions are not exposed.
- Patent Document 4 discloses a structure (separator) having a gold-plated portion and a non-plated portion on the surface of a titanium base material.
- Patent Document 5 proposes a titanium alloy in which an increase in contact resistance is suppressed by pickling a titanium alloy containing one or more platinum group elements and concentrating the platinum group elements on the surface.
- Patent Document 6 a titanium separator is subjected to heat treatment in a low oxygen concentration atmosphere for the purpose of improving the adhesion between the platinum group element concentrated on the surface and the matrix after the surface enrichment of the platinum group element by pickling. Has been proposed.
- Patent Document 7 discloses a separator having a metal film containing conductive ceramics formed on its surface. The conductive ceramic is dispersed in the metal film.
- Patent Document 8 discloses an electrode for electrolysis having a surface layer made of a metal oxide film, the layer immediately below the surface layer containing a noble metal, and in the surface layer portion, the noble metal is precipitated and dispersed in the crystal grain boundary of the metal. ing.
- Patent Document 9 discloses a separator in which a concave channel is formed on a titanium substrate, a plating layer made of a noble metal such as Au and / or Pt is formed on the substrate, and a heat treatment at 300 to 800 ° C. is further performed.
- Patent Document 10 discloses a material in which a platinum group metal plating layer is formed on the surface layer of a metal substrate. Between the metal substrate and the plating layer, (A) layer: Group 4 and Group 5 metal from the metal substrate side. An oxide thin film, (B) layer: a corrosion-resistant conductive coating material in which two kinds of intermediate layers comprising a metal comprising a platinum group metal or a thin film comprising an oxide thereof is formed is disclosed.
- Japanese Unexamined Patent Publication No. 10-228914 Japanese Unexamined Patent Publication No. 2003-105523 Japanese Unexamined Patent Publication No. 2004-71321 Japanese Unexamined Patent Publication No. 2006-97088 Japanese Laid-Open Patent Publication No. 2006-190643 Japanese Unexamined Patent Publication No. 2007-59375 Japanese Patent Laid-Open No. 11-162479 International Publication No. 2012/036196 Japanese Unexamined Patent Publication No. 2008-108490 Japanese Unexamined Patent Publication No. 2009-102676
- Patent Documents 1 to 6 are subjected to an external pressure such as press molding at the time of production, the noble metal layer may be peeled off, and the corrosion resistance and conductivity may not be ensured.
- the separator of Patent Document 7 when press-molding from a plate material to a separator shape at the time of manufacture, the dispersed ceramics obstructed the molding, and cracks or through holes may occur in the plate material. Further, since ceramics wears the press die, there is a problem that the press die must be made of an expensive material such as carbide.
- the electrode of Patent Document 8 has poor conductivity because no noble metal exists on the surface.
- the adhesion between the plating layer and the substrate is not sufficient, and when a forming process such as a bending process is performed, the plating layer is peeled off and dropped, resulting in a decrease in conductivity.
- an oxide film containing crystalline titanium oxide is formed between the base material and the plating layer, but the adhesion between the oxide film and the plating layer is not sufficient, and when bending is performed, When the plating layer is peeled off and dropped, the conductivity is lowered.
- a mixed layer of a metal oxide layer and a platinum group or platinum group oxide layer is formed between the platinum group metal plating layer and the metal substrate.
- the adhesion between the platinum group metal plating layer is not sufficient. Further, since the metal oxide layer is formed to a thickness of 50 nm to 70 nm, it is difficult to ensure sufficient conductivity even if the platinum group or platinum group oxide layer is diffused and mixed.
- an object of the present invention is to provide a metal material excellent in corrosion resistance and conductivity, and a current-carrying component using such a metal material.
- the gist of the present invention is the metal material (A) below and the energized parts (B) below.
- the metal material according to the embodiment of the present invention is: A metal substrate; Laminated on the surface of the base material, a metal compound layer mainly composed of a compound of a transition metal and oxygen in the fourth period; A platinum group part mainly dispersed in a platinum group element dispersed on the surface of the metal compound layer; Covering the platinum group part, a platinum group compound film mainly composed of a compound of a platinum group element and oxygen; including.
- the current-carrying component according to the embodiment of the present invention uses the metal material (A).
- the current-carrying component is, for example, a fuel cell separator or an electrode.
- the platinum group part is dispersed on the surface of the metal material of the present invention, it is excellent in corrosion resistance and conductivity. Moreover, the adhesion between the metal compound layer and the platinum group part is improved by covering the platinum group part with the platinum group compound film. For this reason, even if it processes a metal material, a platinum group part does not drop or peel easily. Therefore, this metal material is excellent in corrosion resistance and conductivity even after being processed.
- the current-carrying parts of the present invention are excellent in corrosion resistance and conductivity even if processed.
- FIG. 1 is a diagram schematically showing the structure of a polymer electrolyte fuel cell.
- FIG. 2 is a diagram for explaining a method of measuring contact resistance.
- the “fourth period” means the fourth period in the periodic table of elements, and the transition metals in the fourth period are Ti, V, Cr, Mn, Fe, Co, Ni, and Cu.
- a metal compound layer “mainly composed of a compound of transition metal and oxygen in the fourth period” means that the ratio of the compound of transition metal and oxygen in the fourth period in the metal compound layer is greater than 50% by volume. It shall be said.
- platinum group part “mainly composed of a platinum group element” means that the proportion of the platinum group element in the platinum group part is larger than 50 mass%.
- mainly composed of a compound of platinum group element and oxygen means that the ratio of the compound of platinum group element and oxygen in the platinum group compound film is greater than 50% by volume. To do.
- A A metal plate in which a metal compound layer mainly composed of a metal compound of a transition metal and oxygen in the fourth period is laminated on the surface.
- B A metal plate including the metal plate A and having a platinum group portion mainly composed of a platinum group element dispersed on the surface of the metal compound layer of the metal plate A. All the metal plates were flat.
- each of the metal plates A and B was repeatedly subjected to bending and returning to a flat plate shape. Thereafter, small pieces were cut out from the repeatedly bent portions of the metal plates A and B, and the contact resistance of the small pieces was measured in the same manner as described above. As a result, the contact resistance of the small piece of the metal plate A did not change significantly before and after the bending process, whereas the contact resistance of the small piece of the metal plate B significantly increased by the bending process. Approached the contact resistance of a small piece of. Further, the contact resistance of the small pieces of the metal plate B increased as the number of bending processes increased.
- the present inventors examined the cause in detail, and as a result of bending the metal plate B, the platinum group portion on the metal compound layer decreases due to the dropping of the platinum group portion. I found out. This is because the adhesion between the metal compound layer and the platinum group part is not sufficient, and the platinum group part peels off from the metal compound layer when a large external force is applied to the metal plate as in the case of bending. It is thought that.
- the present inventors have found that the surface of the platinum group part is covered with a platinum group compound film mainly composed of a compound of a platinum group element and oxygen. It has been found that when the platinum group compound film has a contact portion with the metal compound layer, the adhesion between the metal compound layer and the platinum group portion is improved. The reason why the adhesion is improved is unclear, but the estimated mechanism is as follows.
- the transition metal and oxygen constituting the metal compound layer are ion-bonded, whereas the atoms of the platinum group element constituting the platinum group part are metal-bonded. Therefore, the bonding force at the contact interface between the metal compound layer and the platinum group part is not necessarily strong.
- the bonding mode between the platinum group compound film and the metal compound layer is an ionic bond. Thus, it is estimated that the bond is strengthened, that is, the adhesion between the metal compound layer and the platinum group portion is improved.
- the main cation of the metal compound layer and the main cation of the platinum group compound film are different from each other, but have the same bonding mode with oxygen (ionic bond), and one cation of the metal compound layer and the platinum group compound film Is diffused to the other, and a part of the other cation is substituted, so that the binding force is considered to be stronger.
- a metal material according to an embodiment of the present invention includes a metal base material, a metal compound layer that is laminated on the surface of the base material, and is mainly composed of a compound of a transition metal and oxygen in the fourth period, and the surface of the metal compound layer And a platinum group part mainly composed of a platinum group element and a platinum group compound film covering the platinum group part and mainly composed of a compound of the platinum group element and oxygen.
- the metal material of the base material is not particularly limited.
- ferritic stainless steel, austenitic stainless steel, duplex stainless steel, pure Ti, Ti base alloy, pure Fe, Fe base alloy, pure Co, Co base alloy, Pure Ni, Ni-based alloy, pure Cu, or Cu-based alloy can be used.
- pure Fe and Fe-based alloy are not preferable from the viewpoint of corrosion resistance
- pure Co, Co-based alloy, pure Cu, and Cu-based alloy are In addition to corrosion resistance, it is not preferable from the viewpoint of cost and availability.
- preferred metal materials for the substrate are ferritic stainless steel, austenitic stainless steel, duplex stainless steel, pure Ti, and Ti-based alloy.
- the metal compound layer can be configured using this transition metal.
- the transition metal constituting the metal compound layer is preferably contained in the substrate in an amount of 6% by mass or more.
- the metal compound layer includes one or more of the transition metals in the fourth period, that is, Ti, V, Cr, Mn, Fe, Co, Ni, and Cu.
- the corrosion resistance is resistance to a corrosive environment containing fluorine, for example. Since the separator in the polymer electrolyte fuel cell may be placed in a corrosive environment containing fluorine, if the metal material of this embodiment is applied to such a separator, the contact resistance of the separator is increased by the corrosion product. Can be suppressed.
- the transition metal in the fourth period contained in the metal compound layer is preferably one or more of Ti, V, Cr, Mn, Fe, Ni, and Cu. In this case, compared with the case where the metal contained in a metal compound layer is a thing other than the above, electroconductivity and corrosion resistance can be made higher.
- the compound contained in the metal compound layer may include a transition metal in the fourth period and an element other than oxygen.
- the metal compound layer may include a compound of oxygen and an element other than the transition metal in the fourth period.
- the thickness of the metal compound layer is not particularly limited. However, in order to obtain sufficiently high corrosion resistance, the thickness of the metal compound layer is preferably 2 nm or more, and more preferably 3 nm or more. On the other hand, when the thickness of the metal compound layer exceeds 30 nm, the conductivity is remarkably lowered. Therefore, when used as a separator for a fuel cell, it is necessary to limit the thickness to 30 nm or less. In order to further increase the conductivity, the thickness is preferably 20 nm or less. In observation (bright field image) by TEM (transmission electron microscope), the metal compound layer has a contrast different from that of the base material, the platinum group part, and the platinum group compound film. For this reason, the thickness of the metal compound layer can be measured by observation with a TEM.
- the platinum group elements are Ru, Rh, Pd, Os, Ir, and Pt.
- the platinum group part includes one or more of these elements.
- the contact resistance of this metal material becomes low.
- the metal material is a polymer electrolyte fuel cell separator
- the contact resistance of the metal material to the anode or cathode of the fuel cell is low, and high conductivity is maintained even if the fuel cell is operated for a long time. Can be maintained.
- the ratio of one or more of Ru, Rh, Os and Ir in the platinum group part is preferably larger than 50% by mass. In this case, compared to the case where the proportion of other platinum group elements is larger than 50% by mass, formation of a platinum group compound coating described later is facilitated, thereby increasing the adhesion of the platinum group part to the metal compound layer. be able to. In this case, it is possible to further suppress an increase in the contact resistance of the metal material after bending the metal material.
- the form of the platinum group part is not particularly limited, and may be, for example, a particulate form or a film form.
- the area ratio of the platinum group part dispersed on the surface of the metal compound layer (hereinafter referred to as “coverage”) is not particularly limited, but is preferably 0.2% or more, more preferably 1% or more. It is. With such a coverage, the contact resistance of the metal material can be sufficiently reduced. Further, the coverage is preferably 50% or less, and more preferably 40% or less. If the coverage exceeds such a value, cracking or peeling is likely to occur in the platinum group part during processing, and the contact resistance of the metal material increases.
- the coverage is determined by, for example, observing the surface of a metal material using an FE-SEM (field emission scanning electron microscope) and analyzing a photographed image, specifically, a region where a platinum group element exists at a certain concentration or more. And other regions can be identified and measured as the area ratio of a region existing at a certain concentration or higher.
- Platinum group compound film covers the platinum group part and forms a contact part with the metal compound layer. Thereby, it can suppress that a platinum group part peels off from a metal compound layer by process, and falls, and the low contact resistance of a metal material can be maintained.
- the thickness of a platinum group compound film is not specifically limited, Preferably, it is 0.3 nm or more, More preferably, it is 0.5 nm or more. With such a thickness, sufficient adhesion between the metal compound layer and the platinum group part can be obtained. Further, the thickness of the platinum group compound coating is preferably 15 nm or less, and more preferably 10 nm or less. With such a thickness, sufficiently high conductivity can be obtained.
- the thickness of the platinum group compound film is, for example, by using TEM to image the platinum group part and the part including the platinum group compound film in a bright field, and due to the difference in contrast between the platinum group part and the platinum group compound film, These can be identified and measured.
- the current-carrying component of the present embodiment uses the above metal material.
- the current-carrying parts are, for example, a separator for a fuel cell (for example, a polymer electrolyte fuel cell), an electrode (for example, an electrode for an electrolytic device), and the like. This current-carrying component is obtained by processing the above metal material, and is excellent in conductivity.
- This metal material is, for example, a preparation step of preparing a base material, a metal compound layer formation step of forming a metal compound layer on the surface of the base material, and a platinum group portion arrangement step of arranging a platinum group portion on the metal compound layer And a series of steps including a platinum group compound film forming step of forming a platinum group compound film on the surface of the platinum group part.
- a preparation step of preparing a base material a metal compound layer formation step of forming a metal compound layer on the surface of the base material
- a platinum group portion arrangement step of arranging a platinum group portion on the metal compound layer
- a series of steps including a platinum group compound film forming step of forming a platinum group compound film on the surface of the platinum group part.
- a metal substrate is prepared.
- a base material is obtained by processing the raw material used as the base material of a base material, for example.
- the material may be, for example, a slab manufactured by a continuous casting method (including a round continuous casting method), or a steel slab manufactured by hot working an ingot manufactured by an ingot-making method. It may be a steel piece manufactured from a slab.
- the raw material is charged in, for example, a heating furnace or a soaking furnace and heated, and then the heated raw material is hot-worked.
- the hot working can be, for example, hot rolling when producing a metal plate. After performing the softening heat treatment on the hot-worked material, in some cases, it is cold-worked.
- the cold working is, for example, cold rolling.
- it may be processed into a shape other than the metal plate, for example, a round bar shape, a square bar shape, a tubular shape, a linear shape, or the like.
- the surface may be processed into a shape other than flat, such as by providing irregularities on the surface of the material having each shape. In this case, the unevenness may be due to a plurality of minute protrusions (for example, having a height of 0.1 to 3 ⁇ m).
- a metal base material is manufactured by the above process.
- Metal compound layer forming step A metal compound layer is formed on the surface of the base material prepared in the preparation step.
- the metal compound layer can be formed chemically or mechanically.
- chemical formation include heat treatment (thermal oxidation of the surface layer portion of the substrate), acid treatment, and plating.
- mechanical formation include fusion welding, thermal spraying, brazing, and pressure welding. Of these methods, heat treatment and acid treatment are preferable because they are suitable for mass production.
- the metal compound layer contains the transition metal of the fourth period
- the base material needs to contain the transition metal of the fourth period.
- a metal compound layer is formed by a method that can add a transition metal of the fourth period to the surface of the base material, for example, plating, thermal spraying, etc.
- the base material contains the transition metal of the fourth period. It does not have to be.
- the platinum group part is dispersed on the surface of the metal compound layer.
- the platinum group part can be provided chemically or mechanically.
- An example of chemical provision is plating.
- mechanical provision include fusion welding, brazing, and pressure welding. Of these methods, plating is preferable because it is suitable for mass production.
- Platinum group compound film formation process For the metal material (base material, metal compound layer, and platinum group part) that has undergone the platinum group part arranging step, a platinum group compound film is formed on the surface of the platinum group part.
- the platinum group compound film is preferably formed chemically. Examples of chemical formation include heat treatment (thermal oxidation of the surface portion of the platinum group portion), acid treatment, and plating. Among these methods, heat treatment and acid treatment are preferable because they are suitable for mass production.
- the heat treatment conditions are preferably in a temperature range of 200 to 600 ° C. in an oxidizing atmosphere and a time range of 0.2 to 60 minutes. Thereby, the surface layer part of a platinum group part is oxidized, and a platinum group compound film is formed.
- the heat treatment temperature is too low, the oxidation of the surface part of the platinum group part does not proceed sufficiently and it is difficult to form a platinum group compound film. In this case, the adhesion between the metal compound layer and the platinum group part is not improved.
- the heat treatment temperature is too high, the oxidation of the surface layer portion of the platinum group portion proceeds excessively, and the contact resistance of the metal material decreases. Considering these, a more preferable heat treatment temperature range is 250 to 550 ° C.
- the heat treatment time is too short, the surface layer portion of the platinum group portion does not sufficiently oxidize and it is difficult to form a platinum group compound film. In this case, the adhesion between the metal compound layer and the platinum group part is not improved.
- the heat treatment time is too long, the oxidation of the surface layer portion of the platinum group portion proceeds excessively, and the contact resistance of the metal material decreases. Considering these, a more preferable heat treatment time range is 0.5 to 30 minutes. The appropriate heat treatment time depends on the heat treatment temperature.
- the gas atmosphere composition during the heat treatment is not particularly limited as long as the surface layer portion of the platinum group portion is oxidized, but it is preferable that the atmosphere has an oxygen partial pressure higher than the equilibrium dissociation pressure of the platinum group compound coating.
- platinum group elements Since the ease of oxidation of platinum group elements varies depending on the type of platinum group element, it is necessary to select appropriate heat treatment conditions according to the type of platinum group element contained in the platinum group part. In particular, among platinum group elements, Pt is an element that is difficult to oxidize. Therefore, it is preferable to combine acid treatment and heat treatment. For example, platinum chloride (IV) acid is generated on the Pt surface with aqua regia, and then platinum (II) chloride acid is generated by reduction treatment. This product is reacted with an aqueous solution such as potassium hydroxide to produce platinum hydroxide. Thereafter, a heat treatment is performed to perform a dehydration treatment to obtain platinum oxide. Moreover, platinum oxide can be obtained through a platinum nitrate complex by producing platinum chloride (IV) acid on the Pt surface with aqua regia and then reacting with sodium nitrate or the like.
- metal plate that was rolled to a thickness of 0.1 mm and then annealed was prepared, and this metal plate was used as a base material to form a metal compound layer on the surface of the metal plate.
- the metal compound layers were formed by heat treatment for the metal plates of test numbers 3, 5, 18 and 19, by low-speed spraying for the metal plate of test number 7, and by acid treatment for the metal plates of other test numbers. .
- compound layer (A) is such that the ratio of the compound of the element (metal) and oxygen in the metal compound layer is greater than 50% by volume.
- the metal compound layer defined in the present invention was not formed.
- a metal compound layer was formed on the surface, but this metal compound layer was substantially free of the fourth period transition metal.
- these base materials did not contain the transition metal of the 4th period substantially.
- metal compound layers of 100 nm and 42.5 nm were formed, respectively.
- the metal compound layer as thick as 225 nm was formed.
- a metal compound layer containing the transition metal was formed by a low speed spraying method (arc spraying method).
- the metal plates other than the test numbers 51 and 55 were subjected to the treatment of dispersing and arranging the platinum group part on the metal compound layer.
- the platinum group parts were dispersedly arranged by pressure welding for the metal plates of test numbers 8, 11 and 12 and by plating for the metal plates of other test numbers.
- no platinum group part was disposed on the metal compound layer.
- “substance (B)” is such that the proportion of the element in the platinum group part is greater than 50 mass%.
- a platinum group compound film (oxide film) was formed on the surface portion of the platinum group part by heat treatment on the metal plates other than the test numbers 52 and 56 to 59 among the metal plates in which the platinum group part was dispersedly arranged.
- the metal plates with test numbers 52 and 56 to 59 were not subjected to heat treatment, and no platinum group compound film was formed on the platinum group part.
- the metal plates with test numbers 60 and 61 formed the compound (C) before coating the substance (B). That is, a mixed solution of 2.47 g of iridium trichloride trihydrate, 1.22 g of tantalum (V) ethoxide, 98 ml of isopropanol, and 2 ml of cyclohexanol was prepared and applied to the upper surface of the compound layer (A). Thereafter, a metal compound (C) composed of Ir—O and Ta—O was formed by heat treatment, and Pt as the substance (B) was coated on the upper surface. Thus, compound (C) did not cover substance (B).
- the metal plate of test number 62 formed the compound (C) before coating the substance (B). That is, after chloroplatinic (IV) acid was produced on the Pt surface with aqua regia, it was reduced to chloroplatinic (II) acid. Subsequently, what was made to react with potassium hydroxide aqueous solution was apply
- the metal plates with test numbers 51 to 62 did not satisfy any of the requirements for the metal material of the present invention.
- the thickness of the metal compound layer was measured for each of the obtained metal plates. Specifically, using TEM, the magnification is 1,000,000, observation is performed in three fields of view, the thickness of the metal compound layer is measured at three positions for each field of view, and the average of the thicknesses at a total of nine positions is obtained. It was. Tables 1 and 2 show the thicknesses of the metal compound layers thus measured. In addition, when observing with this TEM, the platinum group compound film is also formed between the platinum group part and the metal compound layer, that is, the platinum group compound film has a contact part with the metal compound layer. confirmed.
- the thickness of the platinum group compound film was measured for each of the obtained metal plates. Specifically, using TEM, the magnification is set to 1,000,000, observation is performed in three fields of view, the thickness of the platinum group compound film is measured at three positions for each field of view, and the average of the thicknesses at a total of nine positions is calculated. Asked. Tables 3 and 4 show the thicknesses of the platinum group compound films thus measured.
- the contact resistance before and after bending was measured for each of the obtained metal plates.
- the metal plates of Test Nos. 51 and 55 were not formed with a platinum group portion and had high initial contact resistance. Therefore, contact resistance after bending was not measured for these metal plates. It was.
- the bending process was performed according to the method defined in JIS H3510, and the process of bending the metal plate by 90 ° using a die having a die R of 1 mm to return to a flat plate shape was repeated 10 times.
- a piece of metal plate with a thickness of 0.1 mm, a length of 10 mm, and a width of 10 mm is applied to each of a region subjected to bending and a region not subjected to bending. Cut out. A small piece cut out from the bent region corresponds to a metal plate after bending. A small piece cut out from a region where bending is not performed corresponds to a metal plate before bending.
- FIG. 2 is a diagram for explaining a method of measuring contact resistance.
- the contact resistance was measured using the apparatus schematically shown in FIG. Specifically, first, the metal plate 11 to be measured is a carbon paper (Toray Industries, Inc.) having an area of 1 cm 2 used for the gas diffusion layers (the anode 3 and the cathode 4 in FIG. 1) of the polymer electrolyte fuel cell. ) Made by TGP-H-90) 12 and sandwiched by gold-plated electrodes 13. Next, a process of applying a constant current to both ends of the gold-plated electrode 13 to pressurize for 10 seconds (10 kgf / cm 2 ) and then immediately unload it is repeated 20 cycles.
- the metal plate 11 to be measured is a carbon paper (Toray Industries, Inc.) having an area of 1 cm 2 used for the gas diffusion layers (the anode 3 and the cathode 4 in FIG. 1) of the polymer electrolyte fuel cell. ) Made by TGP-H-90) 12 and sandwiched by gold-plated electrode
- a voltage drop between the metal plate 11 and the metal plate 11 was measured, and a resistance value was obtained based on the result. Since the obtained resistance value is a sum of the contact resistances on both surfaces of the metal plate 11, it was divided by 2 to obtain a contact resistance value per one surface of the metal plate 11.
- a metal plate having a contact resistance value of 10 m ⁇ ⁇ cm 2 or less was determined to be acceptable, and the quality was determined.
- “low” means that the value of the contact resistance is 10 m ⁇ ⁇ cm 2 or less
- “high” means that the value of the contact resistance exceeds 10 m ⁇ ⁇ cm 2.
- Tables 3 and 4 show the contact resistance values of the metal plates before and after bending.
- test numbers 1 to 50 which are examples of the present invention, had low contact resistance before and after bending, and the difference in contact resistance before and after bending was small.
- the metal plates with test numbers 51 to 62 which are comparative examples, have high contact resistance before and after bending, or high contact resistance after bending. Did not meet.
- the contact resistance before bending was high. This is considered to be because the platinum group portion was not provided on the surface of the metal compound layer.
- the contact resistance before bending was low, but the contact resistance after bending was high. This is because the platinum group compound film was not formed on the surface of the platinum group part, so that sufficient adhesion between the platinum group part and the metal compound layer was not obtained. This is thought to be due to the dropout.
- the contact resistance was high both before and after bending. This is presumably because the metal compound layer itself was a compound of a metal other than the transition metal in the fourth period and oxygen, and the electrical resistance of the metal compound layer itself was high.
- the contact resistance before bending was low, but the contact resistance after bending was high. This is because the platinum group compound film was not formed on the surface of the platinum group part, so that sufficient adhesion between the platinum group part and the metal compound layer was not obtained. This is thought to be due to the dropout.
- the contact resistance before bending was high. Furthermore, the contact resistance after bending was very high. This is presumably because the metal compound layer was as thick as 40 nm or more, and in addition to the decrease in conductivity, the platinum group part dropped out during bending.
- the metal material of the present invention can be used for current-carrying parts that require excellent electrical conductivity, such as fuel cell separators and electrodes.
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Abstract
Description
(1)燃料ガス、または酸化性ガスを、電池面内に均一に供給する「流路」としての機能
(2)カソード側で生成した水を、反応後の空気、酸素といったキャリアガスとともに、燃料電池から効率的に系外に排出する「流路」としての機能
(3)電極膜(アノード3、カソード4)と接触して電気の通り道となり、隣接する2つの単セル間の電気的「コネクタ」となる機能
(4)隣り合うセル間で、一方のセルのアノード室と隣接するセルのカソード室との「隔壁」としての機能
(5)水冷型燃料電池では、冷却水流路と隣接するセルとの「隔壁」としての機能
(A)本発明の実施形態による金属材は、
金属の基材と、
前記基材の表面に積層され、第4周期の遷移金属と酸素との化合物を主体とする金属化合物層と、
前記金属化合物層の表面に分散し、白金族元素を主体とする白金族部と、
前記白金族部を覆い、白金族元素と酸素との化合物を主体とする白金族化合物被膜と、
を含む。
(B)本発明の実施形態による通電部品は、上記(A)の金属材を用いる。通電部品は、たとえば、燃料電池用セパレータ、または電極である。
A:第4周期の遷移金属と酸素との金属化合物を主体とする金属化合物層が、表面に積層された金属板。
B:上記金属板Aを含み、上記金属板Aの金属化合物層の表面に白金族元素を主体とする白金族部が分散された金属板。
いずれの金属板も、平板状であった。
本発明は、以上の知見に基づいて完成されたものである。本発明の一実施形態による金属材は、金属の基材と、基材の表面に積層され、第4周期の遷移金属と酸素との化合物を主体とする金属化合物層と、金属化合物層の表面に分散し、白金族元素を主体とする白金族部と、白金族部を覆い、白金族元素と酸素との化合物を主体とする白金族化合物被膜と、を含む。
基材の金属材料は、特に限定されないが、たとえば、フェライト系ステンレス鋼、オーステナイト系ステンレス鋼、2相ステンレス鋼、純Ti、Ti基合金、純Fe、Fe基合金、純Co、Co基合金、純Ni、Ni基合金、純Cu、またはCu基合金とすることができる。ただし、金属材が、電極、燃料電池用セパレータ等として用いられる場合は、純Fe、およびFe基合金は、耐食性の観点から好ましくなく、純Co、Co基合金、純Cu、およびCu基合金は、耐食性に加えてコストや入手性の点から好ましくない。この場合、基材として好ましい金属材料は、フェライト系ステンレス鋼、オーステナイト系ステンレス鋼、2相ステンレス鋼、純Ti、およびTi基合金である。
金属化合物層には、第4周期の遷移金属、すなわち、Ti、V、Cr、Mn、Fe、Co、Ni、およびCuのうち、1種または2種以上が含まれる。
白金族元素は、Ru、Rh、Pd、Os、Ir、およびPtである。白金族部には、これらの元素のうち、1種または2種以上が含まれる。
白金族化合物被膜は、白金族部を覆い、金属化合物層との間で、接触部を形成する。これにより、加工によって白金族部が金属化合物層から剥離して脱落することを抑制し、金属材の低い接触抵抗を維持することができる。白金族化合物被膜の厚さは、特に限定されないが、好ましくは、0.3nm以上であり、より好ましくは、0.5nm以上である。このような厚さであれば、金属化合物層と白金族部との密着力が十分に得られる。また、白金族化合物被膜の厚さは、好ましくは、15nm以下であり、より好ましくは、10nm以下である。このような厚さであれば、十分高い導電性が得られる。白金族化合物被膜の厚さは、たとえば、TEMを用いて、白金族部、および白金族化合物被膜を含む部分を明視野で撮像し、白金族部と白金族化合物被膜とのコントラストの違いにより、これらを識別して、計測することができる。
本実施形態の通電部品は、上記の金属材を用いたものである。通電部品は、たとえば、燃料電池(たとえば、固体高分子形燃料電池)用のセパレータ、電極(たとえば、電解装置用の電極)等である。この通電部品は、上記の金属材を加工したものであり、導電性に優れる。
本金属材は、たとえば、基材を準備する準備工程と、基材の表面に金属化合物層を形成する金属化合物層形成工程と、金属化合物層上に白金族部を配置する白金族部配置工程と、白金族部の表面に白金族化合物被膜を形成する白金族化合物被膜形成工程との一連の工程を経て製造できる。以下、各工程について説明する。
金属の基材を準備する。基材は、たとえば、基材の元となる素材を加工して得られる。素材は、たとえば、連続鋳造法(ラウンド連続鋳造法を含む。)により製造された鋳片であってもよく、造塊法により製造されたインゴットを熱間加工して製造された鋼片であってもよく、鋳片から製造された鋼片であってもよい。
前記準備工程で準備された基材の表面に、金属化合物層を形成する。金属化合物層は、化学的または機械的に形成することができる。化学的な形成の例として、熱処理(基材の表層部の熱酸化)、酸処理、およびめっきが挙げられる。機械的な形成の例として、融接、溶射、ろう接、および圧接が挙げられる。これらの方法のうち、熱処理および酸処理は、量産に適するので、好ましい。
金属化合物層形成工程を経た金属材(基材、および金属化合物層)について、金属化合物層の表面に白金族部を分散する。白金族部は、化学的または機械的に設けることができる。化学的に設ける例として、めっきが挙げられる。機械的に設ける例として、融接、ろう接、および圧接が挙げられる。これらの方法のうち、めっきは量産に適するので、好ましい。
白金族部配置工程を経た金属材(基材、金属化合物層、および白金族部)について、白金族部の表面に白金族化合物被膜を形成する。白金族化合物被膜は、化学的に形成することが好ましい。化学的な形成の例として、熱処理(白金族部の表層部の熱酸化)、酸処理、およびめっきが挙げられる。これらの方法のうち、熱処理、および酸処理は、量産に適するので、好ましい。
0.1mm厚に圧延し、その後焼鈍を施した金属板(箔)を準備し、この金属板を基材として、金属板の表面に金属化合物層を形成する処理をした。金属化合物層は、試験番号3、5、18および19の金属板については熱処理により、試験番号7の金属板については低速溶射により、これら以外の試験番号の金属板については酸処理により、形成した。表1および表2において、「化合物層(A)」は、金属化合物層中で、当該元素(金属)と酸素との化合物の割合が50体積%より大きいものである。
得られた金属板の各々について、金属化合物層の厚さを測定した。具体的には、TEMを用い、倍率を100万倍として、3視野で観察を行い、各視野につき3箇所で金属化合物層の厚さを計測し、合計9箇所での厚さの平均を求めた。表1および表2に、このようにして測定した金属化合物層の厚さを示す。また、このTEMによる観察の際、白金族化合物被膜が白金族部と金属化合物層との間においても形成されていること、すなわち、白金族化合物被膜が金属化合物層との接触部を有することを確認した。
Claims (5)
- 金属の基材と、
前記基材の表面に積層され、第4周期の遷移金属と酸素との化合物を主体とする金属化合物層と、
前記金属化合物層の表面に分散し、白金族元素を主体とする白金族部と、
前記白金族部を覆い、白金族元素と酸素との化合物を主体とする白金族化合物被膜と、
を含む、金属材。 - 請求項1に記載の金属材であって、
前記白金族部を構成する白金族元素が、Ru、Rh、OsおよびIrのうちの1種または2種以上である、金属材。 - 請求項1または2に記載の金属材を用いた、通電部品。
- 請求項1または2に記載の金属材を用いた、燃料電池用セパレータ。
- 請求項1または2に記載の金属材を用いた、電極。
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