WO2016026180A1 - 触摸屏的制造方法 - Google Patents

触摸屏的制造方法 Download PDF

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Publication number
WO2016026180A1
WO2016026180A1 PCT/CN2014/086261 CN2014086261W WO2016026180A1 WO 2016026180 A1 WO2016026180 A1 WO 2016026180A1 CN 2014086261 W CN2014086261 W CN 2014086261W WO 2016026180 A1 WO2016026180 A1 WO 2016026180A1
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Prior art keywords
black matrix
photoresist
manufacturing
film
conductive film
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PCT/CN2014/086261
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English (en)
French (fr)
Inventor
王俊
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深圳市华星光电技术有限公司
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Priority to US14/430,199 priority Critical patent/US9632636B2/en
Publication of WO2016026180A1 publication Critical patent/WO2016026180A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08—Oxides
    • C23C14/086—Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/13338—Input devices, e.g. touch panels
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a method of manufacturing a touch screen.
  • Touch Panel also known as touch screen and touch panel
  • touch screen and touch panel is widely used as an input device for human-computer interaction on various electronic products, such as mobile phones, PDAs, multimedia, public information inquiry systems, etc. .
  • the user can touch the screen by a finger or a special pen to generate a change of the electrical signal, and identify and select the characters, symbols, menus, and the like displayed in the display device behind the touch screen, thereby implementing an input operation on the device.
  • the widely used touch screen is a capacitive touch screen.
  • the working principle is that when the finger touches, the user and the surface of the touch screen form a coupling capacitor due to the electric field of the human body.
  • the capacitor is a direct conductor, so the finger contacts. The point sucks a small current and detects the small current change through the detection circuit to determine the position of the finger.
  • the prior art manufacturing capacitive touch screen is generally realized by forming a conductive film on the tempered glass, and then using a mask, commonly known as a photomask, to expose and etch the conductive film.
  • a mask commonly known as a photomask
  • the cost of using the mask is relatively high, and for the tempered glass, the small piece needs to be assembled in the carrier, and the mask is aligned with the carrier by focusing or grasping the alignment mark on the entire surface of the carrier, and performing exposure. Since the glass substrate is smaller in size than the carrier, the exposure error is large, which makes mass production more difficult.
  • the photoresist coating process requires photoresist coating, soft baking, hard baking, exposure, development, etching, and removal of photoresist, etc., which requires more process time, resulting in lower production efficiency and higher production cost. .
  • the touch system of the capacitive touch screen can be designed as an in-line structure, so that it can be integrated with the display panel, and can be certain To the extent that the thickness of the entire liquid crystal display is reduced and the production process is simplified.
  • the display panel generally includes a TFT array substrate, a color filter substrate (CF) bonded to the TFT array substrate, and a liquid crystal layer disposed therebetween. Since a large number of circuits are arranged on the TFT array substrate, the embedded capacitive touch panel is generally disposed on the color film substrate side.
  • the conventional black matrix 100 includes a plurality of horizontal rows 101 and columns 103 that are vertically connected to each other to form an integrated array structure. This conventional black matrix 100 only serves as a shading effect.
  • An object of the present invention is to provide a method for manufacturing a touch screen, which can simplify the process flow, reduce the number of masks, save process time, improve production efficiency, reduce production cost, improve alignment accuracy, and effectively avoid moiré problems.
  • the present invention provides a method of manufacturing a touch screen, comprising the following steps:
  • Step 1 Form a black matrix on one side of the color filter substrate
  • the black matrix is disposed corresponding to the sensor pattern to be disposed such that the black matrix forms a gap at a position corresponding to the sensor pattern to be set;
  • Step 2 depositing a conductive film on the other side of the color filter substrate
  • Step 3 coating a photoresist on the conductive film
  • Step 4 using the black matrix formed in step 1 as a photomask, exposing the photoresist formed in step 3 from the side of the color film substrate provided with a black matrix, and then performing development processing;
  • Step 5 etching the conductive film by using the photoresist remaining after the development in the above step 4 to obtain a sensor pattern to be set;
  • Step 6 Form a film on the color film substrate and the sensor pattern to form a protective layer, and complete the production of the touch screen sensor.
  • the black matrix includes a horizontal row and a column, and the horizontal rows and the columns are perpendicularly connected to each other.
  • the gap is disposed at a position where the horizontal row is connected to the column.
  • the conductive film in the step 2 is an indium tin oxide or a metal thin film.
  • the conductive film in the step 2 is formed by magnetron sputtering or chemical vapor deposition.
  • the photoresist is exposed to light using ultraviolet light having a wavelength of 200 nm to 450 nm.
  • the exposure in the step 4 lasts for 20 seconds to 180 seconds.
  • the protective layer in the step 6 is a silicon nitride or silicon dioxide film.
  • the present invention provides a method for manufacturing a touch panel, in which a black matrix corresponding to a sensor pattern is disposed on one side of a color filter substrate, and a photoresist is exposed by using a black matrix as a mask to etch a conductive film to form a sensor pattern.
  • the method can simplify the process flow, reduce the number of masks, save process time, improve production efficiency, reduce production cost, and realize self-alignment by using black matrix as a mask, thereby improving alignment accuracy and effectively avoiding moiré problems. .
  • 1 is a front view of a conventional black matrix
  • FIG. 2 is a flow chart of a method of manufacturing a touch screen of the present invention
  • FIG. 3 is a cross-sectional view showing the first step of the method for manufacturing the touch panel of the present invention
  • step 4 is a front elevational view showing a black matrix in step 1 of the method for manufacturing the touch screen of the present invention
  • FIG. 5 is a cross-sectional view showing the second step of the method for manufacturing the touch panel of the present invention.
  • FIG. 6 is a cross-sectional view showing the step 3 of the method for manufacturing the touch panel of the present invention.
  • FIG. 7 is a cross-sectional view showing the step 4 of the method for manufacturing the touch panel of the present invention.
  • FIG. 8 is a cross-sectional view showing the step 5 of the method for manufacturing the touch panel of the present invention.
  • FIG. 9 is a cross-sectional view showing the step 6 of the method of manufacturing the touch panel of the present invention.
  • the present invention provides a method for manufacturing a touch screen, the method comprising the following steps:
  • Step 1 Referring to FIG. 3 and FIG. 4, a black matrix 2 is formed on one side surface 11 of the color filter substrate 1.
  • the black matrix 2 includes a horizontal row 21 and a column 23, and the horizontal rows 21 and the columns 23 are perpendicularly connected to each other. It should be particularly noted that the black matrix 2 is disposed corresponding to the sensor pattern to be disposed: corresponding to the continuous portion of the sensor pattern to be disposed, the horizontal row 21 and the column 23 of the black matrix 2 also form a continuous relationship with each other. Connection; corresponding to the sensor pattern to be set In the disconnected position, a gap is provided at a position where the horizontal row 21 and the column 23 of the black matrix 2 are connected.
  • the black matrix 2 is formed by a photolithography process from a black resin polymer to which a photosensitive material is added to a shape corresponding to a sensor pattern to be disposed.
  • the black matrix 2 formed in this step 1 not only has a light-shielding effect, but also serves as a mask for exposing the photoresist in the subsequent step 4.
  • Step 2 Referring to FIG. 5, a conductive film 3 is deposited on the other side surface 13 of the color filter substrate 1.
  • the conductive film 3 is a substrate of a sensor pattern to be disposed, and the conductive film 3 is etched according to a predetermined pattern to obtain a sensor pattern to be disposed.
  • the conductive film 3 may be an indium tin oxide (ITO) film or a metal film, and may be formed by magnetron sputtering or chemical vapor deposition.
  • ITO indium tin oxide
  • Step 3 Referring to FIG. 6, a photoresist 4 is coated on the conductive film 3.
  • Step 4 referring to FIG. 7, using the black matrix 2 formed in step 1 as a photomask, and exposing the photoresist 4 formed in step 3 from the side surface 11 of the color matrix substrate 1 provided with the black matrix 2, and then Development processing is performed.
  • the step 4 is different from the conventionally produced photomask placed above the photoresist, and then the front side of the photoresist is exposed, but the black matrix 2 corresponding to the sensor pattern to be set is used as the photomask.
  • the side of the color film substrate 1 with the black matrix 2 is back-exposed to the photoresist 4, which eliminates the need to make a special mask, simplifies the process flow, saves process time, improves production efficiency, and reduces production costs.
  • the black matrix 2 can be used as a photomask to achieve self-alignment, improve alignment accuracy, and effectively avoid the occurrence of moiré problems.
  • the photoresist 4 is exposed to light using ultraviolet light having a wavelength of 200 nm to 450 nm.
  • the exposure time depends on the type and thickness of the photoresist 4, and the control ranges from 20 seconds to 180 seconds.
  • Step 5 referring to Fig. 8, the conductive film 3 is etched by the photoresist 4' remaining after development in the above step 4 to obtain the sensor pattern 3' to be provided.
  • the remaining photoresist 4' is removed by a lift-off process.
  • Step 6 referring to Fig. 9, a film is formed on the color filter substrate 1 and the sensor pattern 3' to form a protective layer 5, thereby completing the fabrication of the touch panel sensor.
  • the protective layer 5 may be a silicon nitride (Si 3 N 4 ) film or a silicon dioxide (SiO 2 ) film.
  • a black matrix corresponding to the sensor pattern is disposed on one side of the color filter substrate, and the photoresist is exposed by using the black matrix as a mask to etch the conductive film to form a sensor pattern.
  • the process of making a touch screen without using a special mask can simplify the process flow, reduce the number of masks, save process time, increase production efficiency, and reduce production cost.
  • the black matrix can be self-aligned as a mask, thereby improving alignment. Accuracy, effectively avoiding the occurrence of moiré problems.

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Abstract

一种触摸屏的制造方法，包括：步骤1、在彩膜基板（1）的一侧面（11）上形成黑色矩阵（2）；黑色矩阵（2）对应欲设置的传感器图案进行设置，使得该黑色矩阵（2）在对应欲设置的传感器图案的位置形成间隙；步骤2、在彩膜基板（1）的另一侧面（13）上沉积导电薄膜（3）；步骤3、在导电薄膜（3）上涂布光阻（4）；步骤4、利用黑色矩阵（2）作为光罩，从彩膜基板（1）设有黑色矩阵（2）的侧面（11）对光阻（4）进行曝光、显影；步骤5、利用显影后剩余的光阻（4'）对导电薄膜（3）进行蚀刻，得到欲设置的传感器图案（3'）；步骤6、在彩膜基板（1）与传感器图案（3'）上形成保护层（5）。该方法节省制程时间，成本低。

Description

触摸屏的制造方法 技术领域
本发明涉及显示技术领域，尤其涉及一种触摸屏的制造方法。
背景技术
触摸屏(Touch Panel，TP)又称为触控屏、触控面板，它作为一种人机交互的输入装置被广泛应用在各种电子产品上，比如手机、PDA、多媒体、公共信息查询系统等。用户可以通过手指或专用笔触摸屏幕而产生电信号的变化，对位于触摸屏后面显示器件中所显示的文字、符号、菜单等进行识别与选择操作，从而实现对设备的输入操作。
目前，使用较为广泛的触摸屏为电容式触摸屏，其工作原理是当手指触摸时，由于人体电场，用户和触摸屏表面形成一个耦合电容，对于高频电流来说，电容是直接导体，于是手指从接触点吸走一个很小的电流，通过检测电路来检测这个很小的电流变化来确定手指的位置。
现有技术制造电容式触摸屏一般是通过在强化玻璃上形成导电薄膜，再使用掩膜板(Mask)，即俗称的光罩，对导电薄膜进行曝光、刻蚀等工艺来实现。但是使用掩膜板的成本相对较高，且对于强化玻璃，需要把小片组装在载体中，通过聚焦或抓取载体整面上的对准标识等来使得掩膜板与载体对准，进行曝光，由于玻璃基板与载体相比尺寸较小，曝光误差较大，使得量产较为困难。而且，光罩制程中需进行光阻涂布、软烤、硬烤、曝光、显影、刻蚀及移除光阻等步骤，需花费较多制程时间，造成生产效率较低、生产成本较高。
在薄膜晶体管液晶显示器(Thin Film Transistor Liquid Crystal Dsiplay，TFT-LCD)等平板显示装置中，可将电容式触摸屏的触摸系统设计成内嵌式结构，从而能够与显示面板集成在一起，可以在一定程度上减少整个液晶显示器的厚度，并简化生产工艺。对于薄膜晶体管液晶显示器来说，其显示面板通常包括TFT阵列基板、与TFT阵列基板贴合的彩膜基板(Color Filter，CF)及配置于二者之间的液晶层。由于TFT阵列基板上布设有较多的电路，一般是将内嵌电容式触摸屏设置于彩膜基板侧。
在彩膜基板的制程过程中，通常需要制作黑色矩阵(Black Matrix，BM)， 防止红、绿、蓝三基色子像素之间的间隙漏光。请参阅图1，传统的黑色矩阵100包括数个相互垂直连接的横排101与纵列103，形成一体式阵列结构。该传统的黑色矩阵100仅起到遮光作用。
发明内容
本发明的目的在于提供一种触摸屏的制造方法，能够简化工艺流程，减少光罩数量，节省制程时间，提高生产效率，降低生产成本，同时提高对位精度，有效避免摩尔纹问题的发生。
为实现上述目的，本发明提供一种触摸屏的制造方法，包括如下步骤：
步骤1、在彩膜基板的一侧面上形成黑色矩阵；
所述黑色矩阵对应欲设置的传感器图案进行设置，使得该黑色矩阵在对应欲设置的传感器图案的位置形成间隙；
步骤2、在所述彩膜基板的另一侧面上沉积导电薄膜；
步骤3、在所述导电薄膜上涂布光阻；
步骤4、利用步骤1中形成的黑色矩阵作为光罩，从所述彩膜基板设有黑色矩阵的侧面对步骤3中形成的光阻进行曝光处理，而后进行显影处理；
步骤5、利用上述步骤4中显影后剩余的光阻对导电薄膜进行蚀刻，得到欲设置的传感器图案；
步骤6、在所述彩膜基板与传感器图案上成膜，形成保护层，完成触摸屏传感器的制作。
所述黑色矩阵包括横排及纵列，所述横排与纵列相互垂直连接。
所述间隙设置在横排与纵列连接的位置。
所述步骤2中的导电薄膜为氧化铟锡或金属薄膜。
所述步骤2中的导电薄膜采用磁控溅射法或化学气相沉积法形成。
所述步骤4中采用波长200nm～450nm的紫外光对光阻进行曝光处理。
所述步骤4中曝光持续20秒～180秒。
所述步骤6中的保护层为氮化硅或二氧化硅薄膜。
本发明的有益效果：本发明提供的触摸屏的制造方法，在彩膜基板一侧面设置对应于传感器图案的黑色矩阵，利用黑色矩阵作为光罩对光阻进行曝光，以蚀刻导电薄膜，形成传感器图案，是不使用专用光罩制作触摸屏的工艺方 法，能够简化工艺流程，减少光罩数量，节省制程时间，提高生产效率，降低生产成本，同时将黑色矩阵作为光罩能够实现自对位，从而提高对位精度，有效避免摩尔纹问题的发生。
为了能更进一步了解本发明的特征以及技术内容，请参阅以下有关本发明的详细说明与附图，然而附图仅提供参考与说明用，并非用来对本发明加以限制。
附图说明
下面结合附图，通过对本发明的具体实施方式详细描述，将使本发明的技术方案及其它有益效果显而易见。
附图中，
图1为传统黑色矩阵的主视示意图；
图2为本发明触摸屏的制造方法的流程图；
图3为本发明触摸屏的制造方法的步骤1的剖面示意图；
图4为本发明触摸屏的制造方法的步骤1中黑色矩阵的主视示意图；
图5为本发明触摸屏的制造方法的步骤2的剖面示意图；
图6为本发明触摸屏的制造方法的步骤3的剖面示意图；
图7为本发明触摸屏的制造方法的步骤4的剖面示意图；
图8为本发明触摸屏的制造方法的步骤5的剖面示意图；
图9为本发明触摸屏的制造方法的步骤6的剖面示意图。
具体实施方式
为更进一步阐述本发明所采取的技术手段及其效果，以下结合本发明的优选实施例及其附图进行详细描述。
请参阅图2，本发明提供一种触摸屏的制造方法，该方法包括如下步骤：
步骤1、请参阅图3、图4，在彩膜基板1的一侧面11上形成黑色矩阵2。
如图4所示，所述黑色矩阵2包括横排21及纵列23，所述横排21与纵列23相互垂直连接。特别需要说明的是，所述黑色矩阵2对应欲设置的传感器图案进行设置：对应于欲设置的传感器图案的连续部分，所述黑色矩阵2的横排21及纵列23相互之间亦形成连续的连接；对应于欲设置的传感器图案 的断开位置，在所述黑色矩阵2的横排21及纵列23连接的位置设置间隙。
具体的，所述黑色矩阵2由添加了光敏材料的黑色树脂聚合物经光刻工艺制作出对应于欲设置的传感器图案的形状。
该步骤1中形成的黑色矩阵2不仅具有遮光作用，还能作为后续步骤4中用于对光阻进行曝光的光罩。
步骤2、请参阅图5，在所述彩膜基板1的另一侧面13上沉积导电薄膜3。
所述导电薄膜3为欲设置的传感器图案的基体，按照预设图案对该导电薄膜3进行蚀刻，即得到欲设置的传感器图案。
具体的，所述导电薄膜3可为氧化铟锡(ITO)薄膜或金属薄膜，可采用磁控溅射法或化学气相沉积法形成。
步骤3、请参阅图6，在所述导电薄膜3上涂布光阻4。
步骤4、请参阅图7，利用步骤1中形成的黑色矩阵2作为光罩，从所述彩膜基板1设有黑色矩阵2的侧面11对步骤3中形成的光阻4进行曝光处理，而后进行显影处理。
该步骤4不同于现有技术中将专门制作的光罩置于光阻上方，再对光阻进行正面曝光，而是以对应于欲设置的传感器图案的黑色矩阵2作为光罩，由所述彩膜基板1设有黑色矩阵2的一侧对光阻4进行背面曝光，一方面省去了制作专用光罩，简化了工艺流程，节省了制程时间，提高了生产效率，降低了生产成本，一方面将所述黑色矩阵2作为光罩能够实现自对位，提高对位精度，有效避免摩尔纹问题的发生。
具体的，采用波长200nm～450nm的紫外光对所述光阻4进行曝光处理。曝光时间视光阻4的类型及厚度而定，控制在20秒～180秒不等。
完成该步骤4曝光、显影后，对应于欲设置的传感器图案的部分光阻4被保留下来，形成剩余的光阻4’。
步骤5、请参阅图8，利用上述步骤4中显影后剩余的光阻4’对导电薄膜3进行蚀刻，得到欲设置的传感器图案3’。
蚀刻完成后，需通过剥离工艺去除所述剩余的光阻4’。
步骤6、请参阅图9，在所述彩膜基板1与传感器图案3’上成膜，形成保护层5，完成触摸屏传感器的制作。
具体的，所述保护层5可为氮化硅(Si3N4)薄膜或二氧化硅(SiO2)薄膜。
综上所述，本发明的触摸屏的制造方法，在彩膜基板一侧面设置对应于传感器图案的黑色矩阵，利用黑色矩阵作为光罩对光阻进行曝光，以蚀刻导电薄膜，形成传感器图案，是不使用专用光罩制作触摸屏的工艺方法，能够简化工艺流程，减少光罩数量，节省制程时间，提高生产效率，降低生产成本，同时将黑色矩阵作为光罩能够实现自对位，从而提高对位精度，有效避免摩尔纹问题的发生。
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形都应属于本发明后附的权利要求的保护范围。

Claims (9)

  1. 一种触摸屏的制造方法，包括：
    步骤1、在彩膜基板的一侧面上形成黑色矩阵；
    所述黑色矩阵对应欲设置的传感器图案进行设置，使得该黑色矩阵在对应欲设置的传感器图案的位置形成间隙；
    步骤2、在所述彩膜基板的另一侧面上沉积导电薄膜；
    步骤3、在所述导电薄膜上涂布光阻；
    步骤4、利用步骤1中形成的黑色矩阵作为光罩，从所述彩膜基板设有黑色矩阵的侧面对步骤3中形成的光阻进行曝光处理，而后进行显影处理；
    步骤5、利用上述步骤4中显影后剩余的光阻对导电薄膜进行蚀刻，得到欲设置的传感器图案；
    步骤6、在所述彩膜基板与传感器图案上成膜，形成保护层，完成触摸屏传感器的制作。
  2. 如权利要求1所述的触摸屏的制造方法，其中，所述黑色矩阵包括横排及纵列，所述横排与纵列相互垂直连接。
  3. 如权利要求2所述的触摸屏的制造方法，其中，所述间隙设置在横排与纵列连接的位置。
  4. 如权利要求1所述的触摸屏的制造方法，其中，所述步骤2中的导电薄膜为氧化铟锡或金属薄膜。
  5. 如权利要求1所述的触摸屏的制造方法，其中，所述步骤2中的导电薄膜采用磁控溅射法或化学气相沉积法形成。
  6. 如权利要求1所述的触摸屏的制造方法，其中，所述步骤4中采用波长200nm～450nm的紫外光对光阻进行曝光处理。
  7. 如权利要求1所述的触摸屏的制造方法，其中，所述步骤4中曝光持续20秒～180秒。
  8. 如权利要求1所述的触摸屏的制造方法，其中，所述步骤6中的保护层为氮化硅或二氧化硅薄膜。
  9. 一种触摸屏的制造方法，包括：
    步骤1、在彩膜基板的一侧面上形成黑色矩阵；
    所述黑色矩阵对应欲设置的传感器图案进行设置，使得该黑色矩阵在对应欲设置的传感器图案的位置形成间隙；
    步骤2、在所述彩膜基板的另一侧面上沉积导电薄膜；
    步骤3、在所述导电薄膜上涂布光阻；
    步骤4、利用步骤1中形成的黑色矩阵作为光罩，从所述彩膜基板设有黑色矩阵的侧面对步骤3中形成的光阻进行曝光处理，而后进行显影处理；
    步骤5、利用上述步骤4中显影后剩余的光阻对导电薄膜进行蚀刻，得到欲设置的传感器图案；
    步骤6、在所述彩膜基板与传感器图案上成膜，形成保护层，完成触摸屏传感器的制作；
    其中，所述黑色矩阵包括横排及纵列，所述横排与纵列相互垂直连接；
    其中，所述间隙设置在横排与纵列连接的位置；
    其中，所述步骤2中的导电薄膜为氧化铟锡或金属薄膜；
    其中，所述步骤2中的导电薄膜采用磁控溅射法或化学气相沉积法形成；
    其中，所述步骤4中采用波长200nm～450nm的紫外光对光阻进行曝光处理；
    其中，所述步骤4中曝光持续20秒～180秒；
    其中，所述步骤6中的保护层为氮化硅或二氧化硅薄膜。
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Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104391349B (zh) * 2014-12-01 2017-04-19 深圳市华星光电技术有限公司 用于制作彩色滤光片的方法、彩色滤光片及液晶面板
CN105094433B (zh) * 2015-08-12 2018-09-04 京东方科技集团股份有限公司 显示基板和显示装置
CN105159514B (zh) * 2015-09-15 2019-03-15 深圳市华星光电技术有限公司 一种触控面板及其制备方法
CN107390926B (zh) * 2017-07-18 2020-07-24 京东方科技集团股份有限公司 一种显示基板及其制备方法、显示面板
CN108321088B (zh) * 2018-02-05 2020-06-16 京东方科技集团股份有限公司 触控基板的制造方法、触控基板及显示装置
FR3084207B1 (fr) * 2018-07-19 2021-02-19 Isorg Systeme optique et son procede de fabrication
CN110592559B (zh) * 2019-09-17 2021-08-27 淮北摩兰科技有限公司 一种显示屏线路保护装置及方法
CN111061084B (zh) * 2019-12-05 2020-12-04 Tcl华星光电技术有限公司 彩膜基板的制备方法及彩膜基板
CN115745415A (zh) * 2022-10-31 2023-03-07 信利光电股份有限公司 一种防眩光盖板的制作方法、防眩光盖板及显示模组

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009223266A (ja) * 2008-03-19 2009-10-01 Epson Imaging Devices Corp パターニング方法、マスクセット、電気光学装置、電気光学装置の製造方法及び電子機器
US20100291479A1 (en) * 2006-12-25 2010-11-18 Au Optronics Corporation Method for fabricating color filter layer
CN102436094A (zh) * 2011-12-19 2012-05-02 深圳市华星光电技术有限公司 液晶显示装置及其制作方法
CN102707484A (zh) * 2012-04-24 2012-10-03 京东方科技集团股份有限公司 半透射半反射彩膜基板及其制作方法，以及液晶显示装置
CN103969944A (zh) * 2014-05-21 2014-08-06 深圳市华星光电技术有限公司 紫外掩膜及其制作方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050049986A (ko) * 2003-11-24 2005-05-27 엘지.필립스 엘시디 주식회사 배면노광을 이용한 컬러필터 기판 및 그 제조방법
US7625780B2 (en) * 2005-03-15 2009-12-01 Regents Of The University Of Minnesota Fluidic heterogeneous microsystems assembly and packaging
US8623575B2 (en) * 2011-06-17 2014-01-07 Shenzhen China Star Optoelectronics Technology Co., Ltd. Liquid crystal display panel, color filter and manufacturing method thereof
US8873003B2 (en) * 2011-12-19 2014-10-28 Shenzhen China Star Optoelectronics Technology Co., Ltd. Liquid crystal display device and manufacture method thereof
JP2015043112A (ja) * 2011-12-21 2015-03-05 シャープ株式会社 タッチパネルおよびタッチパネル付き表示装置
CN103235454B (zh) * 2013-05-08 2015-12-23 深圳市华星光电技术有限公司 彩色滤光片基板及其氧化铟锡薄膜图案结构、制作方法、液晶显示器
CN103336620A (zh) * 2013-07-05 2013-10-02 南昌欧菲光显示技术有限公司 触摸显示屏及其滤光片组件以及该滤光片组件制备方法
CN103927045B (zh) * 2013-12-30 2017-04-05 上海天马微电子有限公司 一种触控基板的制备方法
CN103792711A (zh) * 2014-01-14 2014-05-14 京东方科技集团股份有限公司 一种触控显示面板及其制备方法
US9482905B2 (en) * 2014-06-18 2016-11-01 Apple Inc. Display with column spacer structures

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100291479A1 (en) * 2006-12-25 2010-11-18 Au Optronics Corporation Method for fabricating color filter layer
JP2009223266A (ja) * 2008-03-19 2009-10-01 Epson Imaging Devices Corp パターニング方法、マスクセット、電気光学装置、電気光学装置の製造方法及び電子機器
CN102436094A (zh) * 2011-12-19 2012-05-02 深圳市华星光电技术有限公司 液晶显示装置及其制作方法
CN102707484A (zh) * 2012-04-24 2012-10-03 京东方科技集团股份有限公司 半透射半反射彩膜基板及其制作方法，以及液晶显示装置
CN103969944A (zh) * 2014-05-21 2014-08-06 深圳市华星光电技术有限公司 紫外掩膜及其制作方法

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