WO2016021025A1 - Procédé de montage sur substrat de composants étiquetés - Google Patents

Procédé de montage sur substrat de composants étiquetés Download PDF

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Publication number
WO2016021025A1
WO2016021025A1 PCT/JP2014/070904 JP2014070904W WO2016021025A1 WO 2016021025 A1 WO2016021025 A1 WO 2016021025A1 JP 2014070904 W JP2014070904 W JP 2014070904W WO 2016021025 A1 WO2016021025 A1 WO 2016021025A1
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WO
WIPO (PCT)
Prior art keywords
label
mounting
component
electronic component
nozzle
Prior art date
Application number
PCT/JP2014/070904
Other languages
English (en)
Japanese (ja)
Inventor
大輔 山中
英矢 黒田
伸明 蓑島
和人 洞口
Original Assignee
富士機械製造株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士機械製造株式会社 filed Critical 富士機械製造株式会社
Priority to PCT/JP2014/070904 priority Critical patent/WO2016021025A1/fr
Priority to JP2016539757A priority patent/JP6479015B2/ja
Publication of WO2016021025A1 publication Critical patent/WO2016021025A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components

Definitions

  • the present invention relates to a substrate mounting method for components with labels, and is intended to reduce cycle time by efficiently removing labels and components from a component supply device and mounting them on a substrate.
  • a label that records a product code, a production lot, and the like as management information related to a mounting object may be attached to the component or the substrate.
  • a label holding tape in which a label coated with an adhesive on the back surface is affixed to the surface of the tape is generally used, and a label affixing method using a label feeder or a component mounting machine for that purpose is used.
  • the problem to be solved by the present invention relates to a method of mounting a component on a substrate with a label attached to the upper surface of the electronic component, and efficiently using the label and the electronic component supplied from the component supply device on the substrate. By mounting, the cycle time of component mounting is reduced.
  • the mounting nozzle adsorbs the label having the adhesive layer formed on the back surface, the adhering the adsorbed label to the upper surface of the electronic component in the component supply device, and the bonding integrated by the pressure bonding.
  • a method for mounting a labeled component on a board comprising: adsorbing a label and the electronic component; and moving the label and the electronic component onto a circuit board to mount the label and the electronic component on the substrate.
  • the label and the electronic component can be supplied from the feeder and efficiently mounted on the substrate without requiring manual labor and without supplying the electronic component in a tray.
  • the electronic component since it is not necessary to separately mount the electronic component and the label on the solder applied to the substrate, there is no possibility that the electronic component is displaced during mounting.
  • the time required for the mounting and remounting of electronic components from the back and forth to the substrate can be saved, there is little time loss, so in the substrate mounting process that includes electronic components with labels, the cycle time of component mounting is shortened by repeating this operation. can do.
  • the pressure bonding may be performed by pressurizing the mounting nozzle in multiple times to the same location on the upper surface of the label (Claim 2). By pressing the upper surface of the label a plurality of times with the tip of the suction nozzle, the adhesion of the label to the electronic component can be enhanced.
  • the mounting nozzle may be temporarily lifted from the mounting component and may be adsorbed again after pressurizing a plurality of different locations on the top surface of the mounting component (Claim 3).
  • the suction surface of the mounting nozzle is smaller than the surface of the label, the adhesion of the label to the electronic component can be enhanced by moving the mounting nozzle in the plane direction and applying pressure over the entire surface of the label as much as possible.
  • the pressure bonding may include an operation of moving the mounting nozzle in a plane direction while lightly pressing the mounting nozzle against the upper surface of the component (Claim 4). By adhering the adhesive between the label and the electronic component, mutual adhesion can be enhanced.
  • FIG. 1 It is a block diagram which shows the control system of this invention. It is a top view which shows the label holding tape supplied with a label feeder. It is a top view which peels and shows the component holding tape supplied with a component feeder. It is a flowchart which shows the main operation
  • (A) to (F) are explanatory diagrams showing, in a time series, processes from attaching a label to a component and mounting it on a substrate.
  • FIG. 1 is a block diagram showing main components of a component mounter for carrying out the present invention.
  • the component mounting machine includes a control device 10, a mounting head 12 that holds the mounting nozzle, a head drive unit 11 that drives the mounting head 12, an IPS camera 13 and a part camera 14 that image components picked up by the mounting nozzle, and a reference position of the board
  • a mark camera 15 for imaging a mark, a label feeder 16 for supplying a label, and a component feeder 17 for supplying a component to which the label is attached are provided.
  • a storage device 18 for storing production programs, image processing data, and the like, a display device 19 such as a liquid crystal display, an input device 20 such as a keyboard and a mouse, and the like are provided.
  • FIG. 2 shows a form of the label holding tape 21 supplied by the label feeder 16.
  • labels 23 having an adhesive applied on the back surface are affixed at equal intervals.
  • Feed holes 24 penetrating the label holding tape 21 are formed in one row in the longitudinal direction at an equal pitch on one of both side portions parallel to the longitudinal direction of the label holding tape 21.
  • the label holding tape 21 is accommodated in the label feeder 16 in a state where it can be pulled out, and its leading end is fed to a label suction position by a tape feeding device (not shown).
  • FIG. 3 shows the form of the component holding tape 31 supplied by the component feeder 17.
  • one electronic component 32 is accommodated in each of the accommodating recesses 33 formed at equal intervals, and is covered with a cover film (not shown).
  • feed holes 34 penetrating the component holding tape 31 are formed in a row at an equal pitch.
  • the component holding tape 31 is accommodated in the component feeder 17 in a state where it can be pulled out, and its leading end is fed to a component suction position by a tape feeder (not shown).
  • the control device 10 causes the head drive unit 11 to move the mounting head 12 above the label suction unit 64 of the label feeder 16 (S401). Then, the tip of the mounting nozzle 51 held by the mounting head 12 is lowered until it contacts the peel target label.
  • the label feeder 16 has a structure in which the label holding tape 21 is bent downward at the suction portion, so that a gap is formed between the label 52 to be peeled off and the tape mount 54 so that the label can be easily peeled off.
  • the control device 10 starts suction to the mounting nozzle 51 that has contacted the label 52 (S402), and sucks and raises the label 52 (FIG. 5A).
  • Xa indicates the feeding direction of the label holding tape 21, and the tape mount 54 that has finished label adsorption is fed to the lower part of the label feeder 16 through the tape collection hole 53.
  • the control device 10 moves the mounting head 12 to above the component suction portion of the component feeder 17 (S403). Then, the label 52 adsorbed by the mounting nozzle 51 is lowered until it comes into contact with the electronic component 57 (FIG. 5B), and the label 52 at the tip of the mounting nozzle 51 is pressed against the upper surface of the electronic component 57 (S404). (FIG. 5 (C)).
  • 5B and 5C are front views (cross-sections) showing a state in which the mounting nozzle 51 holding the label 52 is pressure-bonded to the upper surface of the electronic component 57 in the component suction portion 61.
  • Xb indicates the feeding direction of the component holding tape 31.
  • the crimping operation may be performed by pressurizing the mounting nozzle 51 in a plurality of times at the same location on the upper surface of the label 52. That is, by repeating pressurization, decompression, and pressurization on the upper surface of the label at the tip of the mounting nozzle 51, the adhesion of the label to the electronic component can be enhanced.
  • pressure reduction may be merely a momentary weakening of the applied pressure of the mounting nozzle 51, or the suction of the label 52 is temporarily stopped to separate the tip of the mounting nozzle 51 from the upper surface of the label. Also good.
  • the pressure bonding operation includes at least one operation of once stopping suction of the label 52 by the mounting nozzle 51, moving the mounting nozzle 51 slightly away from the label 52, moving in the plane direction, and pressurizing the upper surface of the label 52 again.
  • This is also an effective means.
  • the suction surface of the mounting nozzle 51 is smaller than the upper surface of the label 52, so that the adhesive force between the label 52 and the electronic component 57 is increased by increasing the adhesion area by pressing a plurality of different locations on the label upper surface. Thereby, the label 52 and the electronic component 57 can be integrated and sucked.
  • the pressure bonding may include an operation of moving the mounting nozzle 51 in the plane direction while lightly pressing the mounting nozzle 51 against the upper surface of the label 52.
  • the adhesive between the label and the electronic component can be blended to improve the mutual adhesion. It is desirable to experimentally determine various conditions such as the pressing force of the mounting nozzle 51 at this time, the moving distance in the plane direction, and the speed.
  • the pressurizing operations in a plurality of times, the adhesion between the label 52 and the electronic component 57 can be further increased over the entire surface of the label 52.
  • the control device 10 resumes sucking and sucks the label 52 and the electronic component 57 simultaneously. That is, since the label 52 and the electronic component 57 are integrated by the effect of the adhesive, the label 52 and the electronic component 57 are attracted by the mounting nozzle 51 and the mounting nozzle 51 is raised after the crimping operation is completed ( S405) (FIG. 5D).
  • control device 10 images the suction state of the label 52 and the electronic component 57 from the side surface direction with the IPS camera 13 (S406), and determines whether or not the suction state is normal (S407). If the crimping operation is not successful, the label 52 and the electronic component 57 are not sufficiently integrated, causing adsorption, or only the label 52 can be adsorbed, or nothing is adsorbed. This is also possible.
  • the control device 10 moves the mounting head 12 to the mounting position of the substrate (S408), lowers the mounting nozzle 51, contacts the electronic component 57 with the mounting substrate 59, and puts it on the mounting substrate 59.
  • the label 52 and the electronic component 57 are mounted (S409) (FIG. 5E).
  • the suction is stopped and the mounting nozzle 51 rises (FIG. 5 (F)).
  • Y indicates the direction in which the circuit board is conveyed by the board conveying conveyor 60.
  • an abnormality is detected by imaging from the side, the operator is notified of this and urged to respond (S410). Specifically, an alarm sound is generated to display an abnormal state on the display device 19 or display a notification on the mobile device. After confirming the actual product, the operator determines whether to re-mount or discard the component depending on the defective state and takes measures (S411).
  • the label and the electronic component can be supplied from the feeder and can be efficiently mounted on the substrate without requiring a manual operation and without supplying the electronic component in a tray.
  • the electronic component and the label since it is not necessary to separately mount the electronic component and the label on the solder applied to the substrate, there is no possibility that the electronic component is displaced during mounting.
  • the time required for the mounting and remounting of electronic components from the back and forth to the substrate can be saved, there is little time loss, so in the substrate mounting process that includes electronic components with labels, the cycle time of component mounting is shortened by repeating this operation. can do.
  • step S402 the control device 10 adsorbs the label 52 as a regular one, but proceeds after confirming from the information displayed on the label 52 in advance whether it is a regular label that matches the production plan. It is also possible. That is, since the management information necessary for production is printed on the surface of the label 52, the ID code printed on the label 52 in advance is read by the mark camera 15, and the information system connected online with the component mounting machine is in accordance with the production plan. It is also possible to proceed to the adsorption of the label after confirming that there is no difference in the label 52. If the label differs from the production plan for some reason, it is possible to avoid erroneously attaching the label to the electronic component. In particular, in the case of electronic parts with limited quantities, it is safe to perform such a prior check because no single piece can be wasted.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Labeling Devices (AREA)

Abstract

Dans un procédé de montage sur substrat de composants étiquetés, il serait nécessaire de dupliquer l'effort d'adsorption et de mise en place si l'on montait un composant électronique à l'aide d'une buse de mise en place et si l'on adsorbait et mettait en place ensuite une étiquette sur une surface supérieure du composant électronique. Après que l'étiquette a été adsorbée par la buse de mise en place, l'étiquette est montée par pression sur la surface supérieure du composant électronique, et le composant électronique est également adsorbé intégralement tel que et déplacé vers le substrat de circuit pour le montage. De cette manière, le composant électrique tout comme l'étiquette peuvent être montés intégralement sur le substrat de circuit en une seule fois, sans nécessiter la duplication de l'effort de montage du composant et de fixation de l'étiquette sur sa surface supérieure, ce qui permet de réduire le nombre d'étapes de montage.
PCT/JP2014/070904 2014-08-07 2014-08-07 Procédé de montage sur substrat de composants étiquetés WO2016021025A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/JP2014/070904 WO2016021025A1 (fr) 2014-08-07 2014-08-07 Procédé de montage sur substrat de composants étiquetés
JP2016539757A JP6479015B2 (ja) 2014-08-07 2014-08-07 ラベル付き部品の基板実装方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2014/070904 WO2016021025A1 (fr) 2014-08-07 2014-08-07 Procédé de montage sur substrat de composants étiquetés

Publications (1)

Publication Number Publication Date
WO2016021025A1 true WO2016021025A1 (fr) 2016-02-11

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JP (1) JP6479015B2 (fr)
WO (1) WO2016021025A1 (fr)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05221439A (ja) * 1992-02-12 1993-08-31 Toshiba Corp 電子部品のラベル貼付装置
JPH11273816A (ja) * 1998-03-20 1999-10-08 Fujitsu Ltd 半導体部品および半導体実装装置
JP2003078298A (ja) * 2001-07-30 2003-03-14 Hewlett Packard Co <Hp> ボルスタープレート、集積回路チップの取付方法およびコンピュータ読み取り可能なフォーム
JP2010027661A (ja) * 2008-07-15 2010-02-04 Fuji Mach Mfg Co Ltd 電子部品装着機の電子部品装着方法及び電子部品装着機
JP2011258875A (ja) * 2010-06-11 2011-12-22 Hitachi High-Tech Instruments Co Ltd 部品装着装置の部品実装方法および部品装着装置
JP2012222035A (ja) * 2011-04-05 2012-11-12 Fuji Mach Mfg Co Ltd 電子部品装着方法及び装着装置
JP2013115229A (ja) * 2011-11-29 2013-06-10 Panasonic Corp 部品実装方法及び部品実装システム

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0864993A (ja) * 1994-08-24 1996-03-08 Matsushita Electric Ind Co Ltd 電子部品実装方法
JP3976372B2 (ja) * 1997-06-18 2007-09-19 富士機械製造株式会社 バーコードラベルフィーダおよびそれを備えた装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05221439A (ja) * 1992-02-12 1993-08-31 Toshiba Corp 電子部品のラベル貼付装置
JPH11273816A (ja) * 1998-03-20 1999-10-08 Fujitsu Ltd 半導体部品および半導体実装装置
JP2003078298A (ja) * 2001-07-30 2003-03-14 Hewlett Packard Co <Hp> ボルスタープレート、集積回路チップの取付方法およびコンピュータ読み取り可能なフォーム
JP2010027661A (ja) * 2008-07-15 2010-02-04 Fuji Mach Mfg Co Ltd 電子部品装着機の電子部品装着方法及び電子部品装着機
JP2011258875A (ja) * 2010-06-11 2011-12-22 Hitachi High-Tech Instruments Co Ltd 部品装着装置の部品実装方法および部品装着装置
JP2012222035A (ja) * 2011-04-05 2012-11-12 Fuji Mach Mfg Co Ltd 電子部品装着方法及び装着装置
JP2013115229A (ja) * 2011-11-29 2013-06-10 Panasonic Corp 部品実装方法及び部品実装システム

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JP6479015B2 (ja) 2019-03-06

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