WO2016019653A1 - 柔性显示面板 - Google Patents

柔性显示面板 Download PDF

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Publication number
WO2016019653A1
WO2016019653A1 PCT/CN2014/091887 CN2014091887W WO2016019653A1 WO 2016019653 A1 WO2016019653 A1 WO 2016019653A1 CN 2014091887 W CN2014091887 W CN 2014091887W WO 2016019653 A1 WO2016019653 A1 WO 2016019653A1
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fan
area
display panel
flexible display
zigzag
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PCT/CN2014/091887
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English (en)
French (fr)
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宋松
永山和由
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京东方科技集团股份有限公司
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Application filed by 京东方科技集团股份有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US14/769,171 priority Critical patent/US9666535B2/en
Publication of WO2016019653A1 publication Critical patent/WO2016019653A1/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5386—Geometry or layout of the interconnection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5387—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
    • H01L27/1244—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits for preventing breakage, peeling or short circuiting
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133305—Flexible substrates, e.g. plastics, organic film
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2380/00—Specific applications
    • G09G2380/02—Flexible displays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/17—Passive-matrix OLED displays
    • H10K59/179—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates

Definitions

  • the present invention provides a flexible display panel including at least a display area, a fan-out area, and a driving circuit area, and the fan-out area is located in the display area and the driving circuit area. Connecting the display area and the driving circuit area, wherein the fan-out area includes at least one zigzag fan-out line, and each z-shaped fan-out line includes a plurality of fan-out line segments separated by a bending point. .
  • the fan-out segments located in different layers are respectively mutually Cross, each fan-out segment located in the same layer is parallel to each other.
  • FIG. 6 is a schematic view showing a driving IC disposed in a four-corner direction of a display area according to an embodiment of the present invention
  • FIG. 7 is a view showing a GOA circuit disposed in a four-corner direction of a display area according to an embodiment of the present invention.
  • the middle portion is a display area (AA), and a portion filled with a diagonal line around the display area is a fanout area, and a fan-out area is a zigzag type wiring as shown in, for example, Fig. 2-5.
  • the rectangular frame outside the fan-out area of the line filling is an area for setting the driving IC, and the driving IC can be disposed in any rectangular frame, so that the driving IC is disposed at the center of the edge of the flexible display panel, so that the flexible display panel can be freely Bend. If the driver IC is disposed at a center position of the edge of the flexible display panel, the flexible display panel may not be freely bent at the side.

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  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Geometry (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)

Abstract

一种柔性显示面板，该柔性显示面板至少包括显示区、扇出区和驱动电路区，且扇出区位于显示区与驱动电路区之间以连接显示区与驱动电路区，其中，扇出区包括至少一条Ｚ字型扇出线，每条Ｚ字型扇出线包括由弯折点分开的多个扇出线分段。柔性显示面板使用Ｚ字型布线使弯折时对金属线的损害减小，增加了扇出区的抗弯折性，避免或降低了柔性显示面板在弯折时对屏幕的损害。

Description

柔性显示面板 技术领域
本发明的实施例涉及显示面板技术领域，尤其是一种柔性显示面板及包括该显示面板的显示设备。
背景技术
柔性显示面板是采用柔性材料制成的可弯折可变形的显示面板或显示屏，具有低功耗、体积小、轻便、安装简便、运输方便、显示方式多样和显示画质卓越等优点，主要应用于便携式电子设备和触摸式输入设备等，具有广阔的发展前景。
柔性显示面板在弯折时对屏幕易造成损害，该损害除了存在于柔性显示面板的显示区(Active Area)外，还存在于显示区与驱动电路区之间的扇出(Fanout)区。
如图1所示，图1是现有的柔性显示面板中驱动电路区1、扇出区2与显示区3三者之间的位置关系示意图。驱动电路区1可以包括驱动IC和/或阵列基板栅极驱动(Gate Driver on Array，GOA)电路，而驱动IC包括行方向上的Gate IC和列方向上的Source IC，GOA电路则是直接将栅极驱动电路制作在基板上，来代替由外接硅片制作的驱动晶片的一种电路。图1中，扇出区2采用直线布线的方式，驱动电路区1的引脚与显示区3之间采用直导线连接。该布线方式由于在柔性显示面板弯折时弯折力完全作用于扇出区2的直导线上，使扇出区2在弯折时容易断裂和破损。
另外，现有技术中驱动IC一般都是设置在扇出区上方的中间部分，如图1所示，这样的设置方式易于布线，但整个柔性显示面板无法沿图1中的虚线a进行左右弯折；并且，现有技术中GOA电路一般是沿显示区3的边框设置(图1中未示)，沿显示区3的边框设置的GOA电路虽然可以弯折，但是在弯折中易损坏且特性可能发生改变。
发明内容
有鉴于此，本发明的主要目的在于提供一种柔性显示面板，以避免或降低柔性显示面板在弯折时对屏幕的损害，实现柔性显示面板全方位无损弯折。
为达到上述目的，本发明提供了一种柔性显示面板，该柔性显示面板至少包括显示区、扇出区和驱动电路区，且所述扇出区位于所述显示区与所述驱动电路区之间以连接所述显示区与所述驱动电路区，其中，所述扇出区包括至少一条Z字型扇出线，每条Z字型扇出线包括由弯折点分开的多个扇出线分段。
根据一个实施例，所述驱动电路区设置于所述显示区的四角方向。
根据一个实施例，所述驱动电路区包括驱动IC和/或阵列基板栅极驱动电路。
根据一个实施例，所述扇出区采用一条Z字型扇出线连接所述驱动IC的一个引脚与所述显示区，或者是所述扇出区采用一条Z字型扇出线连接所述阵列基板行驱动电路的一个引脚与所述显示区。
根据一个实施例，位于弯折点两侧的扇出线分段，是由一种金属材料或两种金属材料制成。
根据一个实施例，位于弯折点两侧的扇出线分段，是位于同一层或位于不同层。
根据一个实施例，当一条Z字型扇出线中的各个弯折点两侧的扇出线分段位于不同层时，在所述各个弯折点处采用过孔连接，使整条Z字型扇出线形成导通。
根据一个实施例，同一条Z字型扇出线的各扇出线分段交替地位于两层中。
根据一个实施例，属于不同的Z字型扇出线的扇出线分段可位于同一层中。
根据一个实施例，所述驱动IC或所述阵列基板栅极驱动电路设置于所述显示区四角外侧且靠近所述显示区四角的任意位置。
根据一个实施例，在扇出区中，位于不同层中的各扇出分段分别相互 交叉，位于同一层中的各扇出分段相互平行。
本发明的另一方面提供了一种显示设备，包括上述任意实施例的显示面板。
本发明的各个实施例具有以下有益效果：
1、本发明实施例提供的柔性显示面板，通过在驱动IC与显示区之间或GOA电路与显示区之间的扇出区采用Z字型布线，使弯折时对扇出线例如金属导线的损害减小，增加了扇出区的抗弯折性，避免或降低了柔性显示面板在弯折时对屏幕的损害。
2、本发明实施例提供的柔性显示面板，在驱动IC与显示区之间或GOA电路与显示区之间的扇出区采用Z字型布线，有效地减小了扇出区的长度和宽度，为实现柔性显示面板的多方向弯折提供了有利条件。
3、本发明实施例提供的柔性显示面板，通过将驱动IC或GOA电路设置于显示区的四角方向，柔性显示面板在弯折时不会损害到驱动IC或GOA电路，实现了柔性显示面板全方位无损弯折。
附图说明
图1是现有的柔性显示面板中驱动电路区、扇出区与显示区三者之间的位置关系示意图。
图2是依照本发明的一个实施例的在扇出区采用Z字型布线时一条Z字型扇出线的示意图。
图3是依照本发明的一个实施例的在扇出区采用Z字型布线时两条Z字型扇出线的示意图。
图4是依照本发明的一个实施例的在扇出区采用Z字型布线时六条Z字型扇出线的示意图。
图5是依照本发明的一个实施例的在驱动IC与显示区之间的扇出区采用Z字型布线的示意图。
图6是依照本发明的一个实施例的将驱动IC设置于显示区的四角方向的示意图。
图7是依照本发明的一个实施例的将GOA电路设置于显示区的四角方向的示意图。
具体实施方式
为使本发明的目的、技术方案和优点更加清楚明白，以下结合具体实施例，并参照附图，对本发明进一步详细说明。
本发明提供的柔性显示面板的基本构思是：通过在显示区(AA)与驱动电路区之间的扇出区采用Z字型布线，使弯折时对金属线的损害减小，增加了扇出区的抗弯折性，避免或降低了柔性显示面板在弯折时对屏幕的损害，实现了柔性显示面板无损弯折。
根据本发明的一个实施例，柔性显示面板，至少包括显示区、扇出区和驱动电路区，且所述扇出区位于所述显示区与所述驱动电路区之间以连接所述显示区与所述驱动电路区，其中，所述扇出区包括至少一条Z字型扇出线，每条Z字型扇出线包括由弯折点分开的多个扇出线分段。
在本发明中，在显示区与驱动电路区之间的扇出区采用Z字型布线，能够使弯折时对扇出线的损害减小。所述扇出线例如由金属导线构成。
具体地，驱动电路区可以包括驱动IC和/或阵列基板行驱动电路，因此，该扇出区采用Z字型布线，是扇出区采用一条Z字型扇出线连接驱动IC的一个引脚与显示区，或者是扇出区采用一条Z字型扇出线连接GOA电路的一个引脚与显示区。通过在显示区与驱动电路区之间的扇出区采用Z字型布线，增加了扇出区的抗弯折性，避免或降低了柔性显示面板在弯折时对屏幕的损害；进一步地，在显示区与驱动电路区之间的扇出区采用Z字型布线，有效地减小了扇出区的长度和宽度，为实现柔性显示面板的多方向弯折提供了有利条件。
所述Z字型扇出线中的由弯折点分开的多个扇出线分段可以设置在同一层或不同层中。由一个弯折点分的位于不同层的两个扇出线分段可以在其弯折点处采用过孔连接。同一条Z字型扇出线的位于不同层的各扇出线分段可以在各个弯折处采用过孔连接，以使整条Z字型扇出线形成导通。采用过孔连接的两段Z字型扇出线分段，可以采用一种金属材料制备，也可以采用两种金属材料制备。
根据一个实施例，所述驱动电路区设置于所述显示区的四角方向。
具体地，，驱动电路区设置于显示区的四角方向，是将驱动IC或GOA 电路设置于显示区四角外侧且靠近显示区四角的任意位置。通过将驱动IC或GOA电路设置于显示区四角外侧且靠近显示区四角的任意位置，柔性显示面板在弯折时不会损害到驱动IC或GOA电路，实现了柔性显示面板全方位无损弯折。
图2至图4分别示出了依照本发明的实施例的在扇出区采用Z字型布线时一条Z字型扇出线、两条Z字型扇出线或六条Z字型扇出线的示意图。
图2中示出的一条Z字型扇出线，在其弯折处是采用过孔O连接的，以使整条Z字型扇出线形成导通。
图3中示出的两条Z字型扇出线，金属导线l2和金属导线l3属于同一条Z字型扇出线，但是金属导线l2和金属导线l3不属于同一层，二者通过过孔连接。同样，金属导线l1和金属导线l4属于同一条Z字型扇出线，金属导线l1和金属导线l4不属于同一层，二者也通过过孔连接。金属导线l2和金属导线l4可位于同层，金属导线l1和金属导线l3可位于同层，也可四个金属导线均不位于同层。金属导线l1、l2、l3和l4为扇出线分段的例子。
图3中所示的属于同一条Z字型扇出线的各扇出线分段可交替地位于两层中。并且，属于不同的Z字型扇出线的扇出线分段可位于同一层中。从而，两条Z字型扇出线共用两层，这样便于减少扇出区的布线层数。
另外，在图3中，位于扇出区中的两条Z字形扇出线交叉布置，以节省扇出区的空间。具体地，一条Z字形扇出线的金属导线l1和另一条Z字形扇出线的金属导线l2可以在扇出区的不同层中交叉布置。类似地，一条Z字形扇出线的金属导线l4和另一条Z字形扇出线的金属导线l3可以在扇出区的不同层中交叉布置。
并且，如图3所示，在扇出区中，位于同一层中的各金属导线可以分别相互平行，而不论是否属于同一条Z字型扇出线。例如，金属导线l1和金属导线l3位于同一层且相互平行。金属导线l2和金属导线l4位于同一层且相互平行。并且，如图3所示，在扇出区中，位于不同层中的各金属导线分别相互交叉。例如，金属导线l1和金属导线l2位于不同层且相互交叉，金属导线l3和金属导线l4位于不同层且相互交叉，以此类推。以这种布置，有利于节省空间和避免同一层的金属导线相互干扰。
图4中示出的六条Z字型扇出线，其中构成每条Z字型扇出线的各金 属导线之间的连接同图2和图3所示的例子，这里就不再赘述。另外，在图4中，6条扇出线分成两组，其中，三条扇出线平行布置，另外三条扇出线平行布置，并且，所述三条扇出线与另外三条扇出线交叉布置。同样，位于不同层中的各金属导线分别相互交叉，位于同一层中的各金属导线相互平行。
图5示出了依照本发明的一个实施例的在驱动IC与显示区AA之间的扇出区采用Z字型布线的示意图，其中，在驱动IC与显示区之间的扇出区采用了多条Z字型扇出线。
本发明实施例的在显示区与驱动电路区之间的扇出区采用Z字型布线，使弯折时对金属导线的损害减小；并且，在保护金属导线不被弯折损坏的情况下，这一Z字型布线方法还可以节约空间，使扇出区的长度和宽度减小，进而能够满足各种可能的配线分布需求。
图6示出了依照本发明的一个实施例的将驱动IC设置于显示区的四角方向的示意图，图7示出了依照本发明的一个实施例的将GOA电路设置于显示区的四角方向的示意图。
图6中，中间部分是显示区(AA)，显示区四周以斜线填充的部分是扇出(Fanout)区，扇出区是采用例如图2-5所示的Z字型布线，以斜线填充的扇出区外侧的长方形框是用以设置驱动IC的区域，驱动IC可以设置于任意一个长方形框中，这样避免驱动IC设置于柔性显示面板边缘的正中位置，使柔性显示面板可以自由弯折。如果驱动IC设置在柔性显示面板边缘的正中位置，则柔性显示面板在该边不可以自由弯折。
图7中，中间部分是显示区(AA)，显示区四周以斜线填充的部分是扇出(Fanout)区，扇出区是采用Z字型布线，以斜线填充的扇出区外侧的直角形框是用以设置GOA电路的区域，GOA电路可以设置于任意一个直角形框中，这样避免GOA电路被设置于柔性显示面板的整个边缘，使柔性显示面板可以自由弯折。如果GOA电路设置在柔性显示面板的整个边缘，虽然柔性显示面板在设置GOA电路的这一边可以自由弯折，但是对GOA电路损坏比较大，会损坏GOA电路。
在图6和图7所示的实施例中，驱动IC设置于显示区的四角方向的长方形框中，GOA电路设置于显示区的四角方向的直角形框中，在实际 应用中，驱动IC也可以设置于显示区的四角方向的直角形框中，GOA电路也可以设置于显示区的四角方向的长方形框中，这样的实施例也能够达到避免或降低柔性显示面板在弯折时对屏幕的损害，实现柔性显示面板全方位无损弯折的效果。
本发明提供的柔性显示面板可以是能够实现全方位无损弯折的柔性显示屏。该柔性显示屏可以用于各种显示设备，例如移动电话、个人数字助理、笔记本电脑、导航仪等便携式电子设备和触摸式输入设备等。
以上所述的具体实施例，对本发明的目的、技术方案和有益效果进行了进一步详细说明，所应理解的是，以上所述仅为本发明的具体实施例而已，并不用于限制本发明，凡在本发明的精神和原则之内，所做的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。

Claims (12)

  1. 一种柔性显示面板，该柔性显示面板至少包括显示区、扇出区和驱动电路区，且所述扇出区位于所述显示区与所述驱动电路区之间以连接所述显示区与所述驱动电路区，
    其特征在于：所述扇出区包括至少一条Z字型扇出线，每条Z字型扇出线包括由弯折点分开的多个扇出线分段。
  2. 根据权利要求1所述的柔性显示面板，其特征在于，所述驱动电路区设置于所述显示区的四角方向。
  3. 根据权利要求2所述的柔性显示面板，其特征在于，所述驱动电路区包括驱动IC和/或阵列基板栅极驱动电路。
  4. 根据权利要求3所述的柔性显示面板，其特征在于，所述扇出区采用一条Z字型扇出线连接所述驱动IC的一个引脚与所述显示区，或者是所述扇出区采用一条Z字型扇出线连接所述阵列基板行驱动电路的一个引脚与所述显示区。
  5. 根据权利要求1所述的柔性显示面板，其特征在于，位于弯折点两侧的扇出线分段，是由一种金属材料或两种金属材料制成。
  6. 根据权利要求1所述的柔性显示面板，其特征在于，位于弯折点两侧的扇出线分段，是位于同一层或位于不同层。
  7. 根据权利要求6所述的柔性显示面板，其特征在于，当一条Z字型扇出线中的各个弯折点两侧的扇出线分段位于不同层时，在所述各个弯折点处采用过孔连接，使整条Z字型扇出线形成导通。
  8. 根据权利要求6所述的柔性显示面板，其特征在于，同一条Z字型扇出线的各扇出线分段交替地位于两层中。
  9. 根据权利要求6所述的柔性显示面板，其特征在于，属于不同的Z字型扇出线的扇出线分段可位于同一层中。
  10. 根据权利要求3所述的柔性显示面板，其特征在于，所述驱动IC或所述阵列基板栅极驱动电路设置于所述显示区四角外侧且靠近所述显示区四角的任意位置。
  11. 根据权利要求1所述的柔性显示面板，其特征在于，在扇出区中， 位于不同层中的各扇出分段分别相互交叉，位于同一层中的各扇出分段相互平行。
  12. 一种显示设备，包括如权利要求1-11任一项所述的显示面板。
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