WO2016008187A1 - 导电胶的制备方法及导电胶 - Google Patents

导电胶的制备方法及导电胶 Download PDF

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Publication number
WO2016008187A1
WO2016008187A1 PCT/CN2014/084337 CN2014084337W WO2016008187A1 WO 2016008187 A1 WO2016008187 A1 WO 2016008187A1 CN 2014084337 W CN2014084337 W CN 2014084337W WO 2016008187 A1 WO2016008187 A1 WO 2016008187A1
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Prior art keywords
conductive
epoxy resin
particles
functionalized graphene
mixture
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English (en)
French (fr)
Inventor
李泳锐
李吉
陈雅惠
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TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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Priority to US14/384,667 priority Critical patent/US20160240278A1/en
Publication of WO2016008187A1 publication Critical patent/WO2016008187A1/zh
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/24Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/04Non-macromolecular additives inorganic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/10Adhesives in the form of films or foils without carriers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02Electrically-conducting adhesives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/001Conductive additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/02Elements
    • C08K3/04Carbon
    • C08K3/042Graphene or derivatives, e.g. graphene oxides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00Use of pretreated ingredients
    • C08K9/04Ingredients treated with organic substances
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/30Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/40Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer

Definitions

  • the present invention relates to the field of liquid crystal display technologies, and in particular, to a method for preparing a conductive paste and a conductive adhesive. Background technique
  • the commonly used conductive adhesive is mainly composed of a polymer bonding matrix and a metal conductive filler, and the conductive particles are bonded together by the bonding of the matrix resin to form a conductive path to realize the conductive connection of the material to be bonded.
  • Conductive particles commonly used in conductive pastes are metal powders such as gold (Au), silver (Ag), aluminum (Al), copper (Cu), and nickel (Ni).
  • Au, Au, Al, and Ni are inexpensive and have good electrical conductivity.
  • they are easily oxidized in the air to deteriorate the conductivity, and the stability and reliability of use are limited.
  • Silver powder has excellent electrical conductivity and chemical stability, and it hardly oxidizes in the rubber layer, but its relative density is large, it is easy to precipitate, and there is electric migration in a humid environment.
  • the surface of the plastic particles coated with nickel metal is plated with a layer of gold to form a conductive gold ball for electrical connection.
  • conductive gold balls have these defects: (1) The interface between the plastic layer and the metal layer is poor, resulting in poor conductivity and mechanical properties after long-term use; (2) Electroplating process for environmental pollution during the production of gold balls Serious; (3) Gold is a precious rare metal.
  • Graphene is a new type of carbon nanomaterial with excellent electrical and thermal conductivity. Using it as a conductive filler in the conductive paste will provide excellent conductivity for the conductive paste. Moreover, since the graphene is a sheet-like structure, the surface contact formed by the graphene is more than that of the conductive particles formed by the point contact with the spherical conductive particles, and the probability of forming the conductive passage is higher. Graphene has good thermal conductivity, and the uniform dispersion of the graphene sheet in the conductive paste ensures the heat dissipation performance of the conductive paste. With this excellent thermal conductivity, it is beneficial to the current in the practical application of the conductive adhesive. The heat generated by the ohmic effect is dissipated, the temperature of the conductive paste is lowered, and the conductive adhesive is prevented from failing.
  • Graphene itself has excellent mechanical strength and ductility. Therefore, when the conductive paste is used for bonding an object, the sheet structure and ductility of the graphene ensure the stability of bonding and conductivity when the bond is subjected to a large external force. It also acts as a reinforcing agent in the bonded matrix to improve the bonding strength of the conductive paste.
  • An object of the present invention is to provide a method for producing a conductive paste which improves the dispersibility of functionalized graphene in a binder resin by introducing a functional group containing a polar group on the surface of the graphene.
  • Another object of the present invention is to provide a conductive adhesive, which uses functionalized graphene as a part or all of the conductive particles, and the conductive particles in the conductive paste are dispersed and hooked, and the conductive adhesive has excellent electrical conductivity, thermal conductivity and viscosity. Knot strength.
  • the present invention provides a method for preparing a conductive paste, comprising the following steps: Step 1. Preparing graphene oxide;
  • Step 2 providing a functionalizing reagent, and reacting with the graphene oxide to obtain a functionalized graphene;
  • Step 3 providing a curing agent and an organic solvent, mixing with a certain amount of conductive particles, and performing ultrasonic treatment to obtain a conductive particle dispersion;
  • the conductive particles are functionalized graphene or a mixture of functionalized graphene and other conductive particles ;
  • Step 4 providing a binder resin, and diluting the binder resin with the organic solvent described in step 3; Step 5, mixing the binder resin diluted in step 4 with the conductive particle dispersion to obtain a conductive paste
  • the mixture, the conductive rubber premix is repeatedly pulverized, and further dispersed by ultrasonic wave, the organic solvent is removed to obtain a conductive paste.
  • the method for preparing graphene oxide in the step 1 is the Hummers method; and the method for removing the organic solvent in the step 5 is a vacuum distillation method.
  • the functionalizing agent is Y-aminopropyltriethoxysilane, ⁇ -(2,3-epoxypropoxy)propyltrimethoxysilane, ⁇ -(methacryloyloxy)propyltrimethoxy a silane or ⁇ (0-arylethyl)-oxime-aminopropylmethyldimethoxysilane.
  • the other conductive particles are nano silver particles, micron silver powder, conductive polypyrrole particles or conductive gold balls.
  • the curing agent is methylhexahydrophthalic anhydride, phenyl-dimethylurea, triethylamine, 2-ethyl-4-methylimidazole, 1-cyanoethyl-2-ethyl-4- a mixture of one or more of methylimidazole, 3-aminopropylimidazole or methylimidazole;
  • the organic solvent is acetonitrile, acetone, tetrahydrofuran, N-methylpyrrolidone, water, acetone, ethanol, hydrazine, hydrazine a mixed solvent of one or more of dimethylformamide, dichloromethane, chloroform, propanol, isopropanol or ethylene glycol.
  • the binder resin is an epoxy resin
  • the epoxy resin is a glycidyl ether type bisphenol fluorene ring
  • the present invention also provides a conductive paste comprising conductive particles, a binder resin and a curing agent; wherein the conductive particles are functionalized graphene or a mixture of functionalized graphene and other conductive particles; the other conductive particles are nanometers Silver particles, micron silver powder, conductive polypyrrole particles or conductive gold balls.
  • the method for preparing the functionalized graphene is as follows: Step 1: preparing graphene oxide; step 2, providing a functionalizing reagent, and reacting with the graphene oxide to obtain functionalized graphene; the functionalizing reagent is Y -aminopropyltriethoxysilane, ⁇ -(2,3-epoxypropoxy)propyltrimethoxysilane, Y-(methacryloyloxy)propyltrimethoxysilane or ⁇ -( ⁇ -Aminoethyl)-Y-aminopropylmethyldimethoxysilane.
  • the binder resin is an epoxy resin
  • the epoxy resin is a glycidyl ether type bisphenol oxime type, a bisphenol F type epoxy resin, a glycidyl ester epoxy resin, an aliphatic epoxy resin or an alicyclic ring.
  • the curing agent is methylhexahydrophthalic anhydride, phenyl-dimethylurea, triethylamine, 2-ethyl-4-methylimidazole, 1 a mixture of one or more of cyanoethyl-2-ethyl-4-methylimidazole, 3-aminopropylimidazole or methylimidazole.
  • the epoxy resin is used in an amount of 20% by weight to 90% by weight of the conductive adhesive
  • the functionalized graphene is used in an amount of 1% by weight to 30% by weight of the conductive adhesive
  • the amount of the other conductive particles accounts for the conductive 0 ⁇ 30wt% of the glue
  • the curing agent is used in an amount of 0.1% by weight to 10% by weight of the conductive paste.
  • the method for preparing a conductive paste of the present invention and the conductive paste, the functionalized graphene obtained by surface functionalizing the graphene oxide can be uniformly dispersed in the binder resin, thereby achieving better Conductive bridging; using functionalized graphene or a mixture of functionalized graphene and other conductive particles as conductive particles, compared with the traditional conductive adhesive preparation method, the raw materials are more economical and easy to obtain, and environmentally friendly;
  • the use of ultrasonic treatment can improve the dispersibility and uniformity of the conductive particles, and is more advantageous for improving the conductivity.
  • the conductive paste of the present invention uses functionalized graphene as part or all of the conductive particles to obtain conductive particles in the conductive paste. The dispersion is uniform, so that the conductive paste has excellent electrical conductivity, thermal conductivity and bond strength.
  • FIG. 1 is a flow chart of a method for preparing a conductive paste of the present invention
  • 2 is a schematic view showing the reaction process of the second step of the method for preparing the conductive paste of the present invention
  • 3A is a photograph of a dispersion of graphene oxide and functionalized graphene
  • Figure 3B is an AFM photograph of functionalized graphene
  • Figure 3C is a SEM photograph of functionalized graphene
  • Figure 3D is a film height map of functionalized graphene measured by AFM
  • FIG. 4 is a schematic structural view of an embodiment of a conductive paste of the present invention.
  • FIG. 5 is a schematic structural view of another embodiment of the conductive paste of the present invention. detailed description
  • the present invention provides a method for preparing a conductive paste, which comprises the following steps: Step 1. Preparing graphene oxide;
  • the method for preparing graphene oxide in the step 1 is the Hummers method.
  • Step 2 providing a functionalizing reagent, and reacting with the graphene oxide to obtain a functionalized graphene;
  • the functionalizing reagent reacts with a functional group on the surface of the graphene oxide, introduces a functionalized molecule on the surface of the graphene oxide, and reduces other oxygen-containing functional groups on the surface of the graphene oxide.
  • the functionalized graphene is obtained by introducing a functionalized molecule containing a polar group on the surface of the functionalized graphene, thereby improving the dispersibility of the functionalized graphene in the binder resin.
  • the functionalizing agent is Y-aminopropyltriethoxysilane (KH-550);
  • the functionalizing agent is ⁇ -(2,3- Glycidoxy)propyltrimethoxysilane (KH-560);
  • the functionalizing agent is Y-(methacryloyloxy)propyltrimethoxysilane (KH-570);
  • the functionalizing agent is ⁇ -( ⁇ -aminoethyl)- ⁇ -aminopropylmethyldimethoxysilane ( ⁇ -602).
  • Step 3 providing a curing agent and an organic solvent, mixing with a certain amount of conductive particles, and performing ultrasonic treatment to obtain a conductive particle dispersion;
  • the conductive particles may be pure functionalized graphene or a mixture of functionalized graphene and other conductive particles;
  • the other conductive particles may be nano silver particles, micro silver powder, conductive polypyrrole particles or conductive gold balls;
  • the functionalized graphene When the functionalized graphene is used together with other conductive particles, not only the conductivity can be improved, the conduction efficiency is improved, and the amount of other conductive particles can be reduced.
  • the curing agent is methylhexahydrophthalic anhydride, phenyl-dimethylurea, triethylamine, 2-ethyl-4-methylimidazole, 1-cyanoethyl-2-ethyl-4- a mixture of one or more of methylimidazole, 3-aminopropylimidazole or methylimidazole.
  • the organic solvent is acetonitrile, acetone, tetrahydrofuran, hydrazine-methylpyrrolidone, water, acetone, ethanol, hydrazine, hydrazine-dimethylformamide, dichloromethane, chloroform, propanol, isopropanol or ethylene. a mixed solvent of one or more of the alcohols.
  • Ultrasonic treatment can improve the dispersion and uniformity of conductive particles.
  • the conductive particles are functionalized graphene obtained by treating with ⁇ -aminopropyltriethoxysilane ( ⁇ -550), it is dispersed in tetrahydrofuran to obtain a suspension of conductive particles;
  • the ⁇ -550 functionalized graphene has a sheet structure
  • the ⁇ -550 functionalized graphene has the same wrinkle morphology as graphene. From the SEM (scanning electron microscope), it can be seen that the functionalized graphene does not agglomerate. As shown in Fig. 3D, AFM (Atomic Force Microscopy) measured the thickness of ⁇ -550 functionalized graphene at 1.0 nm, which can be considered as a single layer dispersion;
  • the conductive particle suspension is uniformly stable, the functionalized graphene
  • the presence of a single layer and stable dispersion in tetrahydrofuran creates a good condition for the functionalized graphene to be dispersed in the binder resin.
  • Step 4 providing a binder resin, and diluting the binder resin with the organic solvent described in step 3;
  • the binder resin is an epoxy resin
  • the epoxy resin is a glycidyl ether bisphenol.
  • Step 5 mixing the binder resin diluted in step 4 with the conductive particle dispersion to prepare a conductive rubber premix, repeating the conductive rubber premix, and further removing the organic solvent by ultrasonic dispersion. , making conductive paste;
  • the method of removing the organic solvent is a vacuum distillation method.
  • the conductive paste pre-mixture is further dispersed by ultrasonic waves to ensure uniform dispersion of the conductive particles throughout the mixture.
  • the present invention also provides a conductive paste, comprising conductive particles, a binder resin, and a curing agent; wherein the conductive particles may be pure functionalized graphene or a mixture of functionalized graphene and other conductive particles;
  • the other conductive particles may be nano silver particles, micron silver powder, conductive polypyrrole particles or conductive gold spheres or the like.
  • the binder resin is an epoxy resin
  • the epoxy resin is a glycidyl ether type bisphenol A type, a bisphenol F type epoxy resin, a glycidyl ester epoxy resin, an aliphatic epoxy resin or an alicyclic ring. a mixture of one or more of the family of epoxy resins;
  • the curing agent is methylhexahydrophthalic anhydride, phenyl-dimethylurea, triethylamine, 2-ethyl-4-methylimidazole a mixture of one or more of 1-cyanoethyl-2-ethyl-4-methylimidazole, 3-aminopropylimidazole or methylimidazole.
  • the epoxy resin is used in an amount of 20% by weight to 90% by weight of the conductive adhesive
  • the functionalized graphene is used in an amount of 1% by weight to 30% by weight of the conductive adhesive
  • the amount of the other conductive particles accounts for the conductive 0 ⁇ 30wt% of the glue
  • the curing agent is used in an amount of 0.1% by weight to 10% by weight of the conductive paste.
  • the structure of the conductive paste of the present invention is as shown in FIG. 3; when the amount of the other conductive particles is greater than 0, That is, when the conductive particles are a mixture of functionalized graphene and other conductive particles, the structure of the conductive paste of the present invention is as shown in FIG.
  • the method for preparing the conductive paste of the present invention and the conductive paste the functionalized graphene obtained by surface functionalizing the graphene oxide can be uniformly dispersed in the binder resin to better conduct electricity. Bridging effect; using functionalized graphene or a mixture of functionalized graphene and other conductive particles as conductive particles, compared with the traditional conductive adhesive preparation method, the raw materials are more economical and easy to obtain, and environmentally friendly; Ultrasonic treatment can improve the dispersibility and uniformity of the conductive particles, and is more favorable for improving the conductivity; the conductive adhesive of the present invention adopts work
  • the graphene can be used as part or all of the conductive particles, and the conductive particles in the conductive paste are uniformly dispersed, so that the conductive paste has excellent electrical conductivity, thermal conductivity and bond strength.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Inorganic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
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Abstract

一种导电胶的制备方法及导电胶,所述制备方法包括以下步骤:步骤1、制备氧化石墨烯;步骤2、提供功能化试剂,并与所述氧化石墨烯反应,制得功能化石墨烯;步骤3、提供固化剂与有机溶剂,与一定量的导电粒子混合后,经过超声波处理,制得导电粒子分散液;所述导电粒子为功能化石墨烯或者功能化石墨烯与其它导电粒子的混合物;步骤4、提供粘结树脂,并采用步骤3所述的有机溶剂稀释该粘结树脂;步骤5、将经步骤4稀释过的粘结树脂与所述导电粒子分散液混合制得导电胶预混合物,将该导电胶预混合物重复搅拌均匀,并进一步采用超声波分散后,去除有机溶剂,制得导电胶。

Description

导电胶的制备方法及导电胶 技术领域
本发明涉及液晶显示器技术领域, 尤其涉及一种导电胶的制备方法及 导电胶。 背景技术
目前, 常用的导电胶主要由聚合物粘结基体和金属导电填料组成, 通 过基体树脂的粘接作用把导电粒子结合在一起, 形成导电通路, 实现被粘 材料的导电连接。 导电胶中常用的导电粒子有金 (Au),银(Ag)、 铝 (Al)、 铜 (Cu)、 镍 (Ni) 等金属粉末。 Cu、 Al、 Ni 价格便宜, 导电性好, 但是 温度升高时, 在空气中易氧化, 使导电性变坏, 使用的稳定性和可靠性受 到限制。 银粉具有优良的导电性和化学稳定性, 在胶层中几乎不氧化, 但 是其相对密度较大, 易沉淀, 潮湿环境下有电移迁出的现象。 为解决以上 问题, 将表面镀有镍金属的塑料粒子表面镀上一层金, 形成导电金球进行 导电连接。 然而, 导电金球存在这些缺陷: (1 ) 塑料层和金属层的界面作 用力较差, 导致长期使用后导电性和机械性能变差; (2) 金球的生产过程 中电镀工艺对环境污染严重; (3) 金是贵重稀有金属。
石墨烯是一种新型的碳纳米材料, 具有优异的导电、 导热性能。 将其 作为导电胶中的导电填料, 将为导电胶提供优异的导电性。 而且, 由于石 墨烯是片状结构, 与球状的导电粒子之间通过点接触形成导电通道相比, 石墨烯之间形成的面接触更多, 形成的导电通道的概率更高。 石墨烯具有 良好的导热性, 通过石墨烯片层在导电胶中的均匀分散, 保证了该导电胶 的散热性能, 利用这种优异的导热性, 有利于导电胶在实际应用中及时将 电流的欧姆效应产生的热量散去, 降低导电胶温度, 防止导电胶失效。
石墨烯本身具有优异的机械强度和延展性。 因此, 使用该导电胶用于 粘结物体时, 当粘结处收到较大外力破坏时, 石墨烯的片状结构和延展性 保证粘结和导电性的稳定。 在粘结基体中还能起到补强作用, 改善导电胶 的粘结强度。
目前, 将石墨烯作为导电填料用在导电胶和其它复合材料中的研究已 广泛报道, 然而发挥石墨烯的导电性最关键的因素是石墨烯在聚合物基体 中能否均勾分散。 导电胶中常用的聚合物粘结基体有环氧树脂、 聚丙烯酸 酯内树脂, 酚醛树脂, 聚氨酯数据, 有机硅树脂等。 这些树脂中都含有极 性基团, 而石墨烯表面没有任何官能团, 加上其超高的比表面积, 使石墨 烯无法在导电基体中分散开来。 发明内容
本发明的目的在于提供一种导电胶的制备方法, 通过在石墨烯表面引 入含有极性基团的功能化分子, 从而改善了功能化石墨烯在粘结树脂中的 分散性。
本发明的目的还在于提供一种导电胶, 采用功能化石墨烯作为导电粒 子的一部分或者全部, 制得的导电胶中导电粒子分散均勾, 且该导电胶具 有优异的导电、 导热性能和粘结强度。
为实现上述目的, 本发明提供一种导电胶的制备方法, 包括以下步骤: 步骤 1、 制备氧化石墨烯;
步骤 2、 提供功能化试剂, 并与所述氧化石墨烯反应, 制得功能化石墨 烯;
步骤 3、 提供固化剂与有机溶剂, 与一定量的导电粒子混合后, 经过超 声波处理, 制得导电粒子分散液; 所述导电粒子为功能化石墨烯或者功能 化石墨烯与其它导电粒子的混合物;
步骤 4、提供粘结树脂,并采用步骤 3所述的有机溶剂稀释该粘结树脂; 步骤 5、将经步骤 4稀释过的粘结树树脂与所述导电粒子分散液混合制 得导电胶预混合物, 将该导电胶预混合物重复搅袢均勾, 并进一步采用超 声波分散后, 去除有机溶剂, 制得导电胶。
所述步骤 1 中制备氧化石墨烯的方法为 Hummers法; 所述步骤 5中去 除有机溶剂的方法为减压蒸馏法。
所述功能化试剂为 Y -氨丙基三乙氧基硅烷、 γ -(2,3-环氧丙氧基)丙基 三甲氧基硅烷、 丫-(甲基丙烯酰氧)丙基三甲氧基硅烷或 ^( 0 -氛乙基)-丫- 氨丙基甲基二甲氧基硅烷。
所述其它导电粒子为纳米银颗粒、 微米银粉、 导电聚吡咯颗粒或导电 金球。
所述固化剂为甲基六氢邻苯二甲酸酐、 苯基-二甲脲, 三乙胺、 2-乙基 -4-甲基咪唑、 1-氰乙基 -2-乙基 -4-甲基咪唑、 3-氨丙基咪唑或甲基咪唑中的 一种或多种的混合物; 所述有机溶剂为乙腈、 丙酮、 四氢呋喃、 N-甲基吡 咯烷酮、 水、 丙酮、 乙醇、 Ν,Ν-二甲基甲酰胺、 二氯甲烷、 三氯甲烷、 丙 醇、 异丙醇或乙二醇中的一种或多种的混合溶剂。
所述粘结树脂为环氧树脂, 所述环氧树脂为縮水甘油醚类双酚 Α型环 氧树脂、 双酚 F 型环氧树脂、 縮水甘油酯环氧树脂、 脂肪族环氧树脂或脂 环族环氧树脂中的一种或多种的混合物。
本发明还提供一种导电胶, 包括导电粒子、 粘结树脂和固化剂; 其中, 所述导电粒子为功能化石墨烯或者功能化石墨烯与其它导电粒子的混合 物; 所述其他导电粒子为纳米银颗粒、 微米银粉、 导电聚吡咯颗粒或导电 金球。
所述功能化石墨烯的制备方法为: 步骤 1、 制备氧化石墨烯; 步骤 2、 提供功能化试剂, 并与所述氧化石墨烯反应, 制得功能化石墨烯; 所述功 能化试剂为 Y -氨丙基三乙氧基硅烷、 γ -(2,3-环氧丙氧基)丙基三甲氧基硅 烷、 Y - (甲基丙烯酰氧)丙基三甲氧基硅烷或 Ν-( β -氨乙基) - Y -氨丙基甲基 二甲氧基硅烷。
所述粘结树脂为环氧树脂, 所述环氧树脂为縮水甘油醚类双酚 Α型、 双酚 F 型环氧树脂、 縮水甘油酯环氧树脂、 脂肪族环氧树脂或脂环族环氧 树脂中的一种或多种的混合物; 所述固化剂为甲基六氢邻苯二甲酸酐、 苯 基-二甲脲, 三乙胺、 2-乙基 -4-甲基咪唑、 1-氰乙基 -2-乙基 -4-甲基咪唑、 3 -氨丙基咪唑或甲基咪唑中的一种或多种的混合物。
所述环氧树脂的用量占所述导电胶的 20wt%~90wt%, 所述功能化石墨 烯的用量占所述导电胶的 lwt%~30wt%, 所述其他导电粒子的用量占所述 导电胶的 0~30wt%, 所述固化剂的用量占所述导电胶的 0.1wt %〜10wt%。
本发明的有益效果: 本发明的导电胶的制备方法及导电胶, 通过对氧 化石墨烯进行表面功能化处理, 得到的功能化石墨烯能均勾分散在粘结树 脂中, 起到更好的导电架桥作用; 采用功能化石墨烯或者功能化石墨烯与 其它导电粒子的混合物作为导电粒子, 与传统导电胶的制备方法相比, 其 原料更经济易得, 而且环境友好; 同时在制备过程中使用超声波处理, 可 提高导电粒子的分散性及均匀性, 更有利于提高导电率; 本发明的导电胶, 采用功能化石墨烯作为导电粒子的部分或者全部, 制得的导电胶中导电粒 子分散均勾, 使得该导电胶具有优异的导电、 导热性能和粘结强度。 附图说明
下面结合附图, 通过对本发明的具体实施方式详细描述, 将使本发明 的技术方案及其它有益效果显而易见。
附图中,
图 1为本发明导电胶的制备方法的流程图;
图 2为本发明导电胶的制备方法步骤 2的反应过程示意图; 图 3A为氧化石墨烯和功能化石墨烯的分散液照片;
图 3B为功能化石墨烯的 AFM照片;
图 3C为功能化石墨烯的 SEM照片;
图 3D为 AFM量测功能化石墨烯的膜面高度图;
图 4为本发明导电胶一实施例的结构示意图;
图 5为本发明导电胶另一实施例的结构示意图。 具体实施方式
请参阅图 1, 本发明提供一种导电胶的制备方法, 包括以下步骤: 步骤 1、 制备氧化石墨烯;
所述步骤 1 中制备氧化石墨烯的方法为 Hummers法。
步骤 2、 提供功能化试剂, 并与所述氧化石墨烯反应, 制得功能化石墨 烯;
请参阅图 2, 所述步骤 2中, 所述功能化试剂与氧化石墨烯表面上的官 能团发生反应, 在氧化石墨烯表面引入功能化分子, 并将氧化石墨烯表面 上的其他含氧官能团还原掉, 得到功能化石墨烯; 通过在功能化石墨烯表 面引入含有极性基团的功能化分子, 从而改善了功能化石墨烯在粘结树脂 中的分散性。
所述功能化试剂的结构通式为:
Figure imgf000006_0001
; 其中 R基团的结构
式 为
Figure imgf000006_0002
NH、 NH;
NH,
当 R基团的结构式为- 时,所述功能化试剂为 Y -氨丙基三 乙氧基硅烷 (KH-550) ;
0 0
当 R基团的结构式为 时, 所述功能化试剂为 γ -(2,3- 环氧丙氧基)丙基三甲氧基硅烷 (KH-560) ;
当 R基团的结构式为
Figure imgf000007_0001
时,所述功能化试剂为 Y - (甲 基丙烯酰氧)丙基三甲氧基硅烷 (KH-570) ;
NH^NH2
当 R基团的结构式为 ^ 时,所述功能化试剂为 Ν-( β -氨乙基) - γ -氨丙基甲基二甲氧基硅烷 (ΚΗ-602)。
步骤 3、 提供固化剂与有机溶剂, 与一定量的导电粒子混合后, 经过超 声波处理, 制得导电粒子分散液;
其中, 所述导电粒子可以为单纯的功能化石墨烯, 也可以为功能化石 墨烯与其它导电粒子的混合物;
所述其它导电粒子可以为纳米银颗粒、 微米银粉、 导电聚吡咯颗粒或 导电金球;
当所述功能化石墨烯与其它导电粒子共同使用时, 不仅能改善导电性, 提高导通效率, 还能减少其它导电粒子的用量。
所述固化剂为甲基六氢邻苯二甲酸酐、 苯基- 二甲脲, 三乙胺、 2-乙 基 -4-甲基咪唑、 1-氰乙基 -2-乙基 -4-甲基咪唑、 3-氨丙基咪唑或甲基咪唑中 的一种或多种的混合物。
所述有机溶剂为乙腈、 丙酮、 四氢呋喃、 Ν-甲基吡咯烷酮、 水、 丙酮、 乙醇、 Ν,Ν-二甲基甲酰胺、 二氯甲烷、 三氯甲烷、 丙醇、 异丙醇或乙二醇 中的一种或多种的混合溶剂。
采用超声波处理可以提高导电粒子的分散性和均匀性。
当导电粒子为采用 Υ -氨丙基三乙氧基硅烷 (ΚΗ-550) 处理得到的功能 化石墨烯时, 将其分散在四氢呋喃中得到导电粒子悬浮液;
如图 3Α所示, 为氧化石墨烯 (左) 和 ΚΗ-550功能化石墨烯 (右) 的 分散液照片;
如图 3Β所示, ΚΗ-550功能化的石墨烯呈片层结构;
如图 3C所示, ΚΗ-550功能化石墨烯与石墨烯具有相同的褶皱形态, 从 SEM (扫描电子显微镜) 图可以看出, 功能化石墨烯并未出现团聚。; 如图 3D所示, AFM (原子力显微镜) 量测到 ΚΗ-550功能化石墨烯的 厚度在 1.0 nm, 可以认为是单层分散;
由图 3A-3D可见, 所述导电粒子悬浮液均匀稳定, 所述功能化石墨烯 在四氢呋喃中能单层并且稳定分散的存在, 这为功能化石墨烯在粘结树脂 中均勾分散创造了很好的条件。
步骤 4、提供粘结树脂,并采用步骤 3所述的有机溶剂稀释该粘结树脂; 本实施例中, 所述粘结树脂为环氧树脂, 所述环氧树脂为縮水甘油醚 类双酚 A型、 双酚 F型环氧树脂、 縮水甘油酯环氧树脂、 脂肪族环氧树脂 或脂环族环氧树脂中的一种或多种的混合物。
步骤 5、将经步骤 4稀释过的粘结树脂与所述导电粒子分散液混合制得 导电胶预混合物, 将该导电胶预混合物重复搅袢均勾, 并进一步采用超声 波分散后, 去除有机溶剂, 制得导电胶;
所述步骤 5中, 去除有机溶剂的方法为减压蒸馏法。
通过进一步采用超声波分散所述导电胶预混合物, 以保证所述导电粒 子在整个混合物中分散均匀。
本发明还提供一种导电胶, 包括导电粒子、 粘结树脂和固化剂; 其中, 所述导电粒子可以为单纯的功能化石墨烯, 也可以为功能化石墨烯与其他 导电粒子的混合物; 所述其它导电粒子可以是纳米银颗粒、 微米银粉、 导 电聚比咯颗粒或导电金球等。
其中,所述粘结树脂为环氧树脂,所述环氧树脂为縮水甘油醚类双酚 A 型、 双酚 F 型环氧树脂、 縮水甘油酯环氧树脂、 脂肪族环氧树脂或脂环族 环氧树脂中的一种或多种的混合物; 所述固化剂为甲基六氢邻苯二甲酸酐、 苯基-二甲脲, 三乙胺、 2-乙基 -4-甲基咪唑、 1-氰乙基 -2-乙基 -4-甲基咪唑、 3 -氨丙基咪唑或甲基咪唑中的一种或多种的混合物。
所述环氧树脂的用量占所述导电胶的 20wt%~90wt%, 所述功能化石墨 烯的用量占所述导电胶的 lwt%~30wt%, 所述其他导电粒子的用量占所述 导电胶的 0~30wt%, 所述固化剂的用量占所述导电胶的 0.1wt %〜10wt%。
当所述其他导电粒子的用量为 0 时, 即所述导电粒子为单纯的功能化 石墨烯时, 本发明导电胶的结构如图 3 所示; 当所述其他导电粒子的用量 大于 0 时, 即所述导电粒子为功能化石墨烯与其他导电粒子的混合物时, 本发明导电胶的结构如图 4所示。
综上所述, 本发明的导电胶的制备方法及导电胶, 通过对氧化石墨烯 进行表面功能化处理, 得到的功能化石墨烯能均勾分散在粘结树脂中, 起 到更好的导电架桥作用; 采用功能化石墨烯或者功能化石墨烯与其它导电 粒子的混合物作为导电粒子, 与传统导电胶的制备方法相比, 其原料更经 济易得, 而且环境友好; 同时在制备过程中使用超声波处理, 可提高导电 粒子的分散性及均匀性, 更有利于提高导电率; 本发明的导电胶, 采用功 能化石墨烯作为导电粒子的部分或者全部, 制得的导电胶中导电粒子分散 均匀, 使得该导电胶具有优异的导电、 导热性能和粘结强度。

Claims

权 利 要 求
1、 一种导电胶的制备方法, 包括以下步骤:
步骤 1、 制备氧化石墨烯;
步骤 2、 提供功能化试剂, 并与所述氧化石墨烯反应, 制得功能化石墨 烯;
步骤 3、 提供固化剂与有机溶剂, 与一定量的导电粒子混合后, 经过超 声波处理, 制得导电粒子分散液; 所述导电粒子为功能化石墨烯或者功能 化石墨烯与其它导电粒子的混合物;
步骤 4、提供粘结树脂,并采用步骤 3所述的有机溶剂稀释该粘结树脂; 步骤 5、将经步骤 4稀释过的粘结树脂与所述导电粒子分散液混合制得 导电胶预混合物, 将该导电胶预混合物重复搅袢均勾, 并进一步采用超声 波分散后, 去除有机溶剂, 制得导电胶。
2、 如权利要求 1所述的导电胶的制备方法, 其中, 所述步骤 1 中制备 氧化石墨烯的方法为 Hummers法; 所述步骤 5中去除有机溶剂的方法为减 压蒸馏法。
3、 如权利要求 1所述的导电胶的制备方法, 其中, 所述功能化试剂为 Y -氨丙基三乙氧基硅烷、 γ -(2,3-环氧丙氧基)丙基三甲氧基硅烷、 Y - (甲基 丙烯酰氧)丙基三甲氧基硅烷或 Ν-( β -氨乙基) - Y -氨丙基甲基二甲氧基硅 燒。
4、 如权利要求 1所述的导电胶的制备方法, 其中, 所述其它导电粒子 为纳米银颗粒、 微米银粉、 导电聚吡咯颗粒或导电金球。
5、 如权利要求 1所述的导电胶的制备方法, 其中, 所述固化剂为甲基 六氢邻苯二甲酸酐、 苯基-二甲脲, 三乙胺、 2-乙基 -4-甲基咪唑、 1-氰乙基 -2-乙基 -4-甲基咪唑、 3-氨丙基咪唑或甲基咪唑中的一种或多种的混合物; 所述有机溶剂为乙腈、 丙酮、 四氢呋喃、 Ν-甲基吡咯烷酮、 水、 丙酮、 乙 醇、 Ν,Ν-二甲基甲酰胺、 二氯甲烷、 三氯甲烷、 丙醇、 异丙醇或乙二醇中 的一种或多种的混合溶剂。
6、 如权利要求 1所述的导电胶的制备方法, 其中, 所述粘结树脂为环 氧树脂, 所述环氧树脂为縮水甘油醚类双酚 Α型环氧树脂、 双酚 F型环氧 树脂、 縮水甘油酯环氧树脂、 脂肪族环氧树脂或脂环族环氧树脂中的一种 或多种的混合物。
7、 一种导电胶, 包括导电粒子、 粘结树脂和固化剂; 其中, 所述导电 粒子为功能化石墨烯或者功能化石墨烯与其它导电粒子的混合物; 所述其 它导电粒子为纳米银颗粒、 微米银粉、 导电聚比咯颗粒或导电金球。
8、 如权利要求 7所述的导电胶, 其中, 所述功能化石墨烯的制备方法 为: 步骤 1、 制备氧化石墨烯; 步骤 2、 提供功能化试剂, 并与所述氧化石 墨烯反应, 制得功能化石墨烯; 所述功能化试剂为 Y -氨丙基三乙氧基硅烷、 γ -(2,3-环氧丙氧基)丙基三甲氧基硅烷、 Y - (甲基丙烯酰氧)丙基三甲氧基硅 烷或 Ν-( β -氨乙基) - Y -氨丙基甲基二甲氧基硅烷。
9、 如权利要求 7所述的导电胶, 其中, 所述粘结树脂为环氧树脂, 所 述环氧树脂为縮水甘油醚类双酚 Α型、 双酚 F型环氧树脂、 縮水甘油酯环 氧树脂、 脂肪族环氧树脂或脂环族环氧树脂中的一种或多种的混合物; 所 述固化剂为甲基六氢邻苯二甲酸酐、 苯基-二甲脲, 三乙胺、 2-乙基 -4-甲基 咪唑、 1-氰乙基 -2-乙基 -4-甲基咪唑、 3-氨丙基咪唑或甲基咪唑中的一种或 多种的混合物。
10、 如权利要求 7 所述的导电胶, 其中, 所述环氧树脂的用量占所述 导电胶的 20wt%~90wt%, 所述功能化石墨烯的用量占所述导电胶的 lwt%~30wt%, 所述其他导电粒子的用量占所述导电胶的 0~30wt%, 所述固 化剂的用量占所述导电胶的 0.1wt %〜10wt%。
11、 一种导电胶, 包括导电粒子、 粘结树脂和固化剂; 其中, 所述导 电粒子为功能化石墨烯或者功能化石墨烯与其它导电粒子的混合物; 所述 其它导电粒子为纳米银颗粒、 微米银粉、 导电聚比咯颗粒或导电金球; 其中, 所述功能化石墨烯的制备方法为: 步骤 1、 制备氧化石墨烯; 步 骤 2、 提供功能化试剂, 并与所述氧化石墨烯反应, 制得功能化石墨烯; 所 述功能化试剂为 Y -氨丙基三乙氧基硅烷、 γ -(2,3-环氧丙氧基)丙基三甲氧 基硅烷、 Y - (甲基丙烯酰氧)丙基三甲氧基硅烷或 N-( β -氨乙基)- γ -氨丙基 甲基二甲氧基硅烷;
其中,所述粘结树脂为环氧树脂,所述环氧树脂为縮水甘油醚类双酚 A 型、 双酚 F 型环氧树脂、 縮水甘油酯环氧树脂、 脂肪族环氧树脂或脂环族 环氧树脂中的一种或多种的混合物; 所述固化剂为甲基六氢邻苯二甲酸酐、 苯基-二甲脲, 三乙胺、 2-乙基 -4-甲基咪唑、 1-氰乙基 -2-乙基 -4-甲基咪唑、 3-氨丙基咪唑或甲基咪唑中的一种或多种的混合物;
其中, 所述环氧树脂的用量占所述导电胶的 20wt%~90wt%, 所述功能 化石墨烯的用量占所述导电胶的 lwt%~30wt%, 所述其他导电粒子的用量 占所述导电胶的 0~30wt%, 所述固化剂的用量占所述导电胶的 O.lwt %〜 10wt% o
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