WO2016008178A1 - 显示面板及其制作方法 - Google Patents

显示面板及其制作方法 Download PDF

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Publication number
WO2016008178A1
WO2016008178A1 PCT/CN2014/083620 CN2014083620W WO2016008178A1 WO 2016008178 A1 WO2016008178 A1 WO 2016008178A1 CN 2014083620 W CN2014083620 W CN 2014083620W WO 2016008178 A1 WO2016008178 A1 WO 2016008178A1
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WO
WIPO (PCT)
Prior art keywords
cover plate
substrate
light shielding
display panel
shielding member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2014/083620
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English (en)
French (fr)
Inventor
余威
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TCL China Star Optoelectronics Technology Co Ltd
Original Assignee
Shenzhen China Star Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Shenzhen China Star Optoelectronics Technology Co Ltd filed Critical Shenzhen China Star Optoelectronics Technology Co Ltd
Priority to US14/406,580 priority Critical patent/US10833143B2/en
Publication of WO2016008178A1 publication Critical patent/WO2016008178A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/8791—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H10K59/8792—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. black layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a display panel and a method of fabricating the same.
  • OLED Organic Light Emitting Diode, organic light emitting diodes
  • the ultraviolet curable adhesive is applied to each periphery of the flat glass, and then bonded to the substrate, and the flat glass, the substrate and the ultraviolet curable adhesive form a sealed space in which the organic thin film is formed.
  • the ultraviolet curable adhesive is cured by irradiation with an ultraviolet lamp, and the ultraviolet ray may damage the organic thin film, so that the combination of the ultraviolet ray irradiating the flat glass, the organic thin film and the substrate requires an ultraviolet ray to cover the OLED light-emitting region ( The corresponding area of the organic film) only leaks the surrounding ultraviolet curing glue for ultraviolet irradiation.
  • the above traditional OLED display panel package needs to be in the nitrogen chamber (N2). In the Chamber, it takes more than 6 hours to open the cavity (open the nitrogen chamber) and replace the UV mask and then return to the nitrogen (N2) environment (in compliance with the production conditions), which is a waste of time.
  • a display panel includes: a substrate having a first surface; an organic light emitting diode display device, wherein the organic light emitting diode display device is disposed on the first surface of the substrate; a cover plate, the cover plate has a second surface, the substrate and the cover plate are superimposed and integrated, and the first surface of the substrate and the second surface of the cover plate are oppositely disposed; a member, the light shielding member is disposed on the second surface of the cover plate; and at least one sealant disposed between the substrate and the cover plate; the first portion of the substrate a surface is provided with a display area and at least two non-display areas, at least two of the non-display areas are located on at least two sides of the display area; the organic light emitting diode display device is disposed on the display area; On the second surface, the area corresponding to the display area; the sealant is disposed on the non-display area; the organic light emitting diode display device comprises a cathode layer, an organic material layer and
  • the sealant is formed by providing a colloid on the display area and then irradiating the colloid with a first light to cure the colloid.
  • the light shielding member is configured to block the first light that is irradiated onto the organic light emitting diode display device when the sealant is irradiated with the first light.
  • the organic light emitting diode display device has a first projection on the first surface
  • the light blocking member has a second projection on the first surface
  • the second projection covers the first A projection
  • the sealant has a third projection on the first surface, and an area of the overlapping portion of the second projection and the first projection is zero.
  • the light shielding member is formed by providing a light shielding material layer on the second surface of the cover plate and then patterning the light shielding material layer with a photomask.
  • the second surface of the cover plate is further provided with a marking portion for the cover plate and the substrate when the cover plate and the substrate are paired Perform the alignment.
  • the marking portion and the light shielding member are formed in the same mask process.
  • a display panel the display panel includes: a substrate having a first surface; an organic light emitting diode display device, wherein the organic light emitting diode display device is disposed on the first surface of the substrate; a cover plate, the cover plate has a second surface, the substrate and the cover plate are superimposed and integrated, and the first surface of the substrate and the second surface of the cover plate are oppositely disposed; a member, the light shielding member is disposed on the second surface of the cover plate; and at least one sealant disposed between the substrate and the cover plate.
  • the first surface of the substrate is provided with a display area and at least two non-display areas, at least two of the non-display areas are located on at least two sides of the display area; the organic light emitting diode display device And disposed on the display area; the light shielding member is disposed on a region of the second surface corresponding to the display area; and the sealant is disposed on the non-display area.
  • the sealant is formed by providing a colloid on the display area and then irradiating the colloid with a first light to cure the colloid.
  • the light shielding member is configured to block the first light that is irradiated onto the organic light emitting diode display device when the sealant is irradiated with the first light.
  • the organic light emitting diode display device has a first projection on the first surface
  • the light blocking member has a second projection on the first surface
  • the second projection covers the first A projection
  • the sealant has a third projection on the first surface, and an area of the overlapping portion of the second projection and the first projection is zero.
  • the light shielding member is formed by providing a light shielding material layer on the second surface of the cover plate and then patterning the light shielding material layer with a photomask.
  • the second surface of the cover plate is further provided with a marking portion for the cover plate and the substrate when the cover plate and the substrate are paired Perform the alignment.
  • the marking portion and the light shielding member are formed in the same mask process.
  • a method of fabricating the above display panel comprising the steps of: disposing the organic light emitting diode display device on the first surface of the substrate; and placing the second surface on the cover plate a light shielding member; a glue is disposed on the substrate or the cover; and the substrate provided with the organic light emitting diode display device and the cover plate provided with the light shielding member are superimposed and integrated, wherein Providing the light shielding member, the organic light emitting diode display device and a colloid between the cover plate and the substrate; and displaying a display area and a non-display of the cover plate with the substrate by using the first light The area corresponding to the zone is illuminated to cure the colloid.
  • the step of disposing the light shielding member on the second surface of the cover plate comprises: providing a light shielding material layer on the second surface of the cover plate; The light shielding material layer is patterned by a photomask to form the light shielding member.
  • the method further includes the following Step: blocking, by the light shielding member, the first light that is irradiated onto the display area to prevent the organic light emitting diode display device from being irradiated by the first light.
  • the invention can eliminate the ultraviolet ray mask and omit the process of replacing the ultraviolet ray mask, does not need to destroy the nitrogen environment, avoids the time required for restoring the nitrogen environment (it takes more than 6 hours), and also avoids The problem that the ultraviolet ray mask is abnormally aligned with the substrate or the cover plate.
  • FIG. 1 is a schematic view of a first embodiment of a display panel of the present invention
  • FIG. 2 is a schematic view of a cover plate not in front of a pair of substrates
  • FIG. 3 is a schematic view showing a layer of a light shielding material disposed on the cover plate of FIG. 2;
  • FIG. 4 is a schematic view showing a pattern of a light shielding material layer of the cover plate of FIG. 3;
  • FIG. 5 is a flow chart of a first embodiment of a method of fabricating a display panel of the present invention.
  • Figure 6 is a flow chart of the step of providing a light blocking member on the second surface of the cover of Figure 5.
  • FIG. 1 is a schematic view of a first embodiment of a display panel of the present invention.
  • the display panel of this embodiment includes a substrate 101, an organic light emitting diode display device 103, a cover 102, a light blocking member 104, and at least one sealant 105.
  • the substrate 101 has a first surface, and the organic light emitting diode display device 103 is disposed on the first surface of the substrate 101.
  • the organic light emitting diode display device 103 includes a cathode layer, an organic material layer and an anode. a layer, the organic material layer is disposed between the cathode layer and the anode layer, the organic light emitting diode display device 103 is configured to apply a voltage to the organic material layer in the cathode layer and the anode layer Generate an image.
  • the cover plate 102 has a second surface, and the substrate 101 and the cover plate 102 are superimposed and integrated, and the first surface of the substrate 101 and the second surface of the cover plate 102 are oppositely disposed. That is, the first surface and the second surface face each other, the light shielding member 104 is disposed on the second surface of the cover plate 102, and the sealant 105 is disposed on the substrate 101 and the cover Between the plates 102, the sealant 105 is used to seal the space formed by the substrate 101 and the cover plate 102. In particular, the sealant 105 is used to the cover plate 102 and the substrate.
  • the organic light emitting diode display device 103 between 101 performs sealing.
  • the first surface of the substrate 101 is provided with a display area 106 and at least two non-display areas 107, at least two of the non-display areas 107 are located on at least two sides of the display area 106,
  • the OLED display device 103 is disposed on the display area 106, the light shielding member 104 is disposed on the second surface corresponding to the display area 106, and the sealant 105 is disposed on the non-display Area 107.
  • the sealant 105 is formed by disposing a colloid on the display area 106 and then irradiating the colloid with a first light (for example, ultraviolet light) to cure the colloid. .
  • a first light for example, ultraviolet light
  • the light shielding member 104 is configured to block the first light that is irradiated onto the organic light emitting diode display device 103 when the sealant 105 is irradiated with the first light.
  • the organic light emitting diode display device 103 has a first projection on the first surface
  • the light blocking member 104 has a second projection on the first surface, the second projection covering
  • the first projection that is, the light blocking member 104 completely blocks the organic light emitting diode display device 103 in a direction perpendicular to the first surface.
  • the sealant 105 has a third projection on the first surface, the area of the overlapping portion of the second projection and the first projection is zero, that is, in a direction perpendicular to the first surface
  • the light shielding member 104 does not block the sealant 105 (the colloid).
  • FIG. 2 is a schematic view of the cover plate 102 before the group 101 is not aligned with the substrate 101
  • FIG. 3 is a schematic view showing the cover plate 102 of FIG. 2 with a light shielding material layer
  • FIG. 4 is a schematic view of FIG. Schematic diagram of the masking layer of the cover plate 102 after patterning.
  • the light shielding member 104 is provided by providing a light shielding material layer on the second surface of the cover plate 102 (for example, BM (Black Matrix (black matrix) layer) is then formed by patterning the light shielding material layer using a photomask.
  • a light shielding material layer on the second surface of the cover plate 102 for example, BM (Black Matrix (black matrix) layer
  • BM Black Matrix (black matrix) layer
  • the cover plate 102 as shown in FIG. 2 is prepared, and one or more forms of coating, deposition, sputtering, and the like are formed on the second surface of the cover plate 102.
  • the light shielding material layer is as shown in FIG.
  • the light shielding material layer is patterned by using a photomask (photomask), that is, the light shielding material layer is formed into at least one first predetermined pattern and at least one a second predetermined pattern, wherein the first predetermined pattern corresponds to a shape and an area of the light shielding member 104, and the second predetermined pattern corresponds to a shape and an area of a mark 401 of the cover plate 102, wherein
  • the marking portion 401 is configured to align the cover plate 102 and the substrate 101 when the cover plate 102 and the substrate 101 are paired (aligned), and finally, remove the light shielding material layer.
  • a portion other than the first predetermined pattern and the second predetermined pattern is formed to form the light blocking member 104.
  • the mark portion 401 and the light shielding member 104 for aligning the cover plate 102 and the substrate 101 are formed in the same photomask (photomask) process.
  • the substrate 101 provided with the organic light emitting diode display device 103 and the cover 102 provided with the light shielding member 104 are paired and the colloid is cured, the substrate 101 and the substrate are The cover plate 102 is cut to form a display panel as shown in FIG.
  • the above technical solution can prevent an additional mask process from being performed when the gel is cured, so there is no problem that the mask and the cover 102 are abnormally aligned, and there is no replacement due to the replacement of the mask.
  • the production environment of the display panel is restored to the problem of a nitrogen (N2) environment.
  • the cover plate 102 can be directly irradiated by using the first light, which saves the manufacturing process of the display panel, and does not need to restore the production environment of the display panel after replacing the reticle. Normal (nitrogen environment), saving the production time of the display panel (at least 6 hours).
  • FIG. 5 is a flowchart of a first embodiment of a method for fabricating a display panel of the present invention
  • FIG. 6 is a view of the second surface of the cover plate 102 of FIG.
  • Step 501 the organic light emitting diode display device 103 is disposed on the first surface of the substrate 101.
  • Step 502 disposing the light shielding member 104 on the second surface of the cover plate 102.
  • Step 503 a colloid is disposed on the substrate 101 or the cover plate 102.
  • Step 504 the substrate 101 provided with the organic light emitting diode display device 103 and the cover plate 102 provided with the light shielding member 104 are superimposed and integrated into one body, wherein the cover plate 102 and the substrate 101 are integrated.
  • the light shielding member 104, the organic light emitting diode display device 103, and a colloid are disposed therebetween.
  • Step 505 irradiating an area corresponding to the display area 106 and the non-display area 107 of the substrate 101 in the cover 102 with a first light to cure the colloid.
  • the step 501 and the step 502 are performed in sequence, that is, the step 501 and the step 502 may be performed simultaneously or sequentially.
  • the substrate 101 provided with the organic light emitting diode display device 103 and the cover 102 provided with the light shielding member 104 are paired (aligned in alignment) and the colloid is cured,
  • the substrate 101 and the cap plate 102 are cut to form a display panel as shown in FIG.
  • the step of disposing the light shielding member 104 on the second surface of the cover plate 102 includes:
  • Step 601 providing a light shielding material layer on the second surface of the cover plate 102.
  • Step 602 patterning the light shielding material layer with a photomask to form the light shielding member 104.
  • the cover plate 102 as shown in FIG. 2 is prepared, and one or more forms of coating, deposition, sputtering, and the like are formed on the second surface of the cover plate 102.
  • a light shielding material layer as shown in FIG.
  • the marking portion 401 is configured to align the cover plate 102 and the substrate 101 when the cover plate 102 and the substrate 101 are paired (aligned), and finally, remove the A portion of the light shielding material layer other than the first predetermined pattern and the second predetermined pattern to form the light shielding member 104.
  • the marking portion 401 and the light shielding member 104 are formed in the same photomask (photomask) process, wherein the marking portion 401 is used to align the cover plate 102 and the substrate 101.
  • the method further includes The following steps:
  • the first light illuminating the display area 106 is shielded (occluded) by the light shielding member 104 to prevent the organic light emitting diode display device 103 from being irradiated by the first light.
  • the above technical solution can prevent an additional mask process from being performed when the gel is cured, so there is no problem that the mask and the cover 102 are abnormally aligned, and there is no replacement due to the replacement of the mask.
  • the production environment of the display panel is restored to the problem of a nitrogen atmosphere.
  • the cover plate 102 can be directly irradiated by using the first light, which saves the manufacturing process of the display panel, and does not need to restore the production environment of the display panel after replacing the reticle. Normal (nitrogen environment), saving the production time of the display panel (at least 6 hours).
  • the marking portion 401 on the cover plate 102 for packaging and the light shielding member 104 are formed in the same process, and the light shielding member 104 replaces the function of the ultraviolet ray mask.
  • the cover plate 102 has a BM after being attached to the pair of the substrate 101 provided with the organic light emitting diode display device 103.
  • the pattern (the light-shielding member 104) can block the organic light-emitting diode display device 103 (organic material/organic film), and the surrounding colloid 105 is exposed to ultraviolet light.
  • BM of different sizes Pattern can be. This eliminates the need for an ultraviolet ray mask and omitting the replacement of the ultraviolet ray mask, without damaging the nitrogen environment, avoiding the time required to recover the nitrogen atmosphere (which takes more than 6 hours), and also avoids the ultraviolet ray mask and the glass (
  • the substrate 101 or the cover plate 104) has a problem of alignment abnormality.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

一种显示面板及其制作方法，显示面板包括基板（101）、有机发光二极管显示器件（103）、盖板（102）、遮光构件（104）、密封胶（105）；基板（101）具有第一表面；有机发光二极管显示器件（103）设置于该第一表面上；盖板（102）具有第二表面，基板（101）和盖板（102）叠加组合为一体，该第一表面和该第二表面相对设置；遮光构件（104）设置于该第二表面上；密封胶（105）设置于基板（101）和盖板（102）之间。

Description

显示面板及其制作方法 技术领域
本发明涉及显示技术领域，特别涉及一种显示面板及其制作方法。
 背景技术
传统的OLED（Organic Light Emitting Diode，有机发光二极管）显示面板的封装方式一般为：
在平板玻璃上的各周边涂布紫外线固化胶，然后与基板对组后贴合，上述平板玻璃、基板以及紫外线固化胶形成密闭空间，有机薄膜在其中。
紫外线固化胶使用紫外线灯照射固化，因紫外线会伤害所述有机薄膜，所以在所述紫外线照射所述平板玻璃、所述有机薄膜和所述基板的组合需要使用紫外线光罩遮住OLED发光区（所述有机薄膜对应的区域），只漏出四周的紫外线固化胶，以进行紫外线照射。
不同尺寸的显示面板就需要更换不同的紫外线光罩，上述传统的OLED显示面板的封装需要在氮气室（N2 Chamber）中进行，开腔（打开该氮气室）更换该紫外线光罩，然后恢复到氮气（N2）环境（符合可生产的状况）需耗时6小时以上，此过程非常浪费时间。
故，有必要提出一种新的技术方案，以解决上述技术问题。
 技术问题
本发明的目的在于提供一种显示面板及其制作方法，其能简化工序，节省生产时间。
 技术解决方案
一种显示面板，所述显示面板包括：一基板，所述基板具有第一表面；一有机发光二极管显示器件，所述有机发光二极管显示器件设置于所述基板的所述第一表面上；一盖板，所述盖板具有第二表面，所述基板和所述盖板叠加组合为一体，所述基板的所述第一表面和所述盖板的所述第二表面相对设置；一遮光构件，所述遮光构件设置于所述盖板的所述第二表面上；以及至少一密封胶，所述密封胶设置于所述基板和所述盖板之间；所述基板的所述第一表面设置有一显示区和至少两非显示区，至少两所述非显示区位于所述显示区的至少两侧；所述有机发光二极管显示器件设置于所述显示区上；所述遮光构件设置于所述第二表面上与所述显示区对应的区域上；所述密封胶设置于所述非显示区上；所述有机发光二极管显示器件包括阴极层、有机材料层和阳极层，所述有机材料层设置于所述阴极层和所述阳极层之间，所述有机发光二极管显示器件用于在所述阴极层和所述阳极层向所述有机材料层施加一电压时生成一图像。
在上述显示面板中，所述密封胶是通过在所述显示区上设置一胶体，然后利用第一光线对所述胶体进行照射，以使所述胶体固化来形成的。
在上述显示面板中，所述遮光构件用于在所述密封胶受到所述第一光线照射时，遮挡照射到所述有机发光二极管显示器件上的所述第一光线。
在上述显示面板中，所述有机发光二极管显示器件在所述第一表面上具有第一投影，所述遮光构件在所述第一表面上具有第二投影，所述第二投影覆盖所述第一投影。
在上述显示面板中，所述密封胶在所述第一表面上具有第三投影，所述第二投影与所述第一投影的重叠部分的面积为零。
在上述显示面板中，所述遮光构件是通过在所述盖板的所述第二表面上设置一遮光材料层，然后利用光掩模对所述遮光材料层进行图案化处理来形成的。
在上述显示面板中，所述盖板的所述第二表面上还设置有标记部，所述标记部用于在所述盖板和所述基板对组时为所述盖板和所述基板进行对位。
在上述显示面板中，所述标记部和所述遮光构件是在同一道光罩工序中形成的。
一种显示面板，所述显示面板包括：一基板，所述基板具有第一表面；一有机发光二极管显示器件，所述有机发光二极管显示器件设置于所述基板的所述第一表面上；一盖板，所述盖板具有第二表面，所述基板和所述盖板叠加组合为一体，所述基板的所述第一表面和所述盖板的所述第二表面相对设置；一遮光构件，所述遮光构件设置于所述盖板的所述第二表面上；以及至少一密封胶，所述密封胶设置于所述基板和所述盖板之间。
在上述显示面板中，所述基板的所述第一表面设置有一显示区和至少两非显示区，至少两所述非显示区位于所述显示区的至少两侧；所述有机发光二极管显示器件设置于所述显示区上；所述遮光构件设置于所述第二表面上与所述显示区对应的区域上；所述密封胶设置于所述非显示区上。
在上述显示面板中，所述密封胶是通过在所述显示区上设置一胶体，然后利用第一光线对所述胶体进行照射，以使所述胶体固化来形成的。
在上述显示面板中，所述遮光构件用于在所述密封胶受到所述第一光线照射时，遮挡照射到所述有机发光二极管显示器件上的所述第一光线。
在上述显示面板中，所述有机发光二极管显示器件在所述第一表面上具有第一投影，所述遮光构件在所述第一表面上具有第二投影，所述第二投影覆盖所述第一投影。
在上述显示面板中，所述密封胶在所述第一表面上具有第三投影，所述第二投影与所述第一投影的重叠部分的面积为零。
在上述显示面板中，所述遮光构件是通过在所述盖板的所述第二表面上设置一遮光材料层，然后利用光掩模对所述遮光材料层进行图案化处理来形成的。
在上述显示面板中，所述盖板的所述第二表面上还设置有标记部，所述标记部用于在所述盖板和所述基板对组时为所述盖板和所述基板进行对位。
在上述显示面板中，所述标记部和所述遮光构件是在同一道光罩工序中形成的。
一种上述显示面板的制作方法，所述方法包括以下步骤：在所述基板的所述第一表面上设置所述有机发光二极管显示器件；在所述盖板的所述第二表面上设置所述遮光构件；在所述基板或所述盖板上设置一胶体；将设置有所述有机发光二极管显示器件的所述基板和设置有所述遮光构件的所述盖板叠加组合为一体，其中，所述盖板和所述基板之间设置有所述遮光构件、所述有机发光二极管显示器件和一胶体；以及利用第一光线对所述盖板中与所述基板的显示区和非显示区对应的区域进行照射，以使所述胶体固化。
在上述显示面板的制作方法中，所述在所述盖板的所述第二表面上设置所述遮光构件的步骤包括：在所述盖板的所述第二表面上设置一遮光材料层；利用光掩模对所述遮光材料层进行图案化处理，以形成所述遮光构件。
在上述显示面板的制作方法中，在所述利用所述第一光线对所述盖板中与所述基板的显示区和非显示区对应的区域进行照射的过程中，所述方法还包括以下步骤：利用所述遮光构件遮挡照射到所述显示区上的所述第一光线，以避免所述有机发光二极管显示器件受到所述第一光线的照射。
 有益效果
相对现有技术，本发明可以省去紫外线光罩以及省略更换紫外线光罩的过程，不需破坏氮气环境，避免了恢复氮气环境所需的耗时（需耗时6h以上），此外也避免了紫外线光罩同所述基板或所述盖板对位异常的问题。
 附图说明
图1为本发明的显示面板的第一实施例的示意图；
图2为未与基板对组前的盖板的示意图；
图3为图2中的盖板上设置了遮光材料层的示意图；
图4为对图3中的盖板的遮光材料层进行图案化后的示意图；
图5为本发明的显示面板的制作方法的第一实施例的流程图；
图6为图5中的在盖板的第二表面上设置遮光构件的步骤的流程图。
 本发明的最佳实施方式
以下各实施例的说明是参考附加的图式，用以例示本发明可用以实施的特定实施例。
参考图1，图1为本发明的显示面板的第一实施例的示意图。
本实施例的显示面板包括一基板101、一有机发光二极管显示器件103、一盖板102、一遮光构件104和至少一密封胶105。
其中，所述基板101具有第一表面，所述有机发光二极管显示器件103设置于所述基板101的所述第一表面上，所述有机发光二极管显示器件103包括阴极层、有机材料层和阳极层，所述有机材料层设置于所述阴极层和所述阳极层之间，所述有机发光二极管显示器件103用于在所述阴极层和所述阳极层向所述有机材料层施加一电压时生成一图像。
所述盖板102具有第二表面，所述基板101和所述盖板102叠加组合为一体，所述基板101的所述第一表面和所述盖板102的所述第二表面相对设置，即，所述第一表面和所述第二表面相向，所述遮光构件104设置于所述盖板102的所述第二表面上，所述密封胶105设置于所述基板101和所述盖板102之间，所述密封胶105用于对所述基板101和所述盖板102所形成的空间进行密封，特别地，所述密封胶105用于对所述盖板102和所述基板101之间的所述有机发光二极管显示器件103进行密封。
在本实施例中，所述基板101的所述第一表面设置有一显示区106和至少两非显示区107，至少两所述非显示区107位于所述显示区106的至少两侧，所述有机发光二极管显示器件103设置于所述显示区106上，所述遮光构件104设置于所述第二表面上与所述显示区106对应的区域上，所述密封胶105设置于所述非显示区107上。
在本实施例中，所述密封胶105是通过在所述显示区106上设置一胶体，然后利用第一光线（例如，紫外线）对所述胶体进行照射，以使所述胶体固化来形成的。
在本实施例中，所述遮光构件104用于在所述密封胶105受到所述第一光线照射时，遮挡照射到所述有机发光二极管显示器件103上的所述第一光线。
在本实施例中，所述有机发光二极管显示器件103在所述第一表面上具有第一投影，所述遮光构件104在所述第一表面上具有第二投影，所述第二投影覆盖所述第一投影，也就是说，在垂直于所述第一表面的方向上，所述遮光构件104完全遮挡所述有机发光二极管显示器件103。所述密封胶105在所述第一表面上具有第三投影，所述第二投影与所述第一投影的重叠部分的面积为零，也就是说，在垂直于所述第一表面的方向上，所述遮光构件104不遮挡所述密封胶105（所述胶体）。
参考图2至图4，图2为未与基板101对组前的盖板102的示意图，图3为图2中的盖板102上设置了遮光材料层的示意图，图4为对图3中的盖板102的遮光材料层进行图案化后的示意图。
在本实施例中，所述遮光构件104是通过在所述盖板102的所述第二表面上设置一遮光材料层（例如，BM（Black Matrix，黑色矩阵）层），然后利用光掩模（Mask）对所述遮光材料层进行图案化处理来形成的。
具体地，首先准备如图2所示的所述盖板102，在所述盖板102的所述第二表面上通过涂布、沉积、溅射等方式中的一种或一种以上形成所述遮光材料层，如图3所示，然后利用光罩（光掩模）对所述遮光材料层进行图案化处理，即，使得所述遮光材料层形成至少一第一预定图案和至少一第二预定图案，其中，所述第一预定图案与所述遮光构件104的形状和面积对应，所述第二预定图案与所述盖板102的标记部（Mark）401的形状和面积对应，其中，所述标记部401用于在所述盖板102和所述基板101对组（对位组合）时为所述盖板102和所述基板101进行对位，最后，去除所述遮光材料层中除所述第一预定图案和所述第二预定图案以外的部分，以形成所述遮光构件104。
也就是说，所述用于为所述盖板102和所述基板101对位的所述标记部401和所述遮光构件104是在同一道光罩（光掩模）工序中形成的。
此外，在设置有所述有机发光二极管显示器件103的所述基板101与设置有所述遮光构件104的所述盖板102对组并对所述胶体进行固化后，对所述基板101和所述盖板102进行切割，从而形成如图1所示的显示面板。
上述技术方案可以使得在对所述胶体进行固化时，不需要额外的光罩工序，因此不存在光罩与所述盖板102对位异常的问题，同时也不存在由于更换光罩而将所述显示面板的生产环境恢复至氮气（N2）环境的问题。在上述技术方案中，直接使用所述第一光线对所述盖板102进行照射即可，节省了所述显示面板的制作工序，不需要在更换光罩后将所述显示面板的生产环境恢复正常（氮气环境），节省了所述显示面板的生产时间（至少6小时）。
参考图5和图6，图5为本发明的显示面板的制作方法的第一实施例的流程图，图6为图5中的在所述盖板102的所述第二表面上设置所述遮光构件104的步骤的流程图。
本实施例的显示面板的制作方法包括以下步骤：
步骤501，在所述基板101的所述第一表面上设置所述有机发光二极管显示器件103。
步骤502，在所述盖板102的所述第二表面上设置所述遮光构件104。
步骤503，在所述基板101或所述盖板102上设置一胶体。
步骤504，将设置有所述有机发光二极管显示器件103的所述基板101和设置有所述遮光构件104的所述盖板102叠加组合为一体，其中，所述盖板102和所述基板101之间设置有所述遮光构件104、所述有机发光二极管显示器件103和一胶体。
步骤505，利用第一光线对所述盖板102中与所述基板101的显示区106和非显示区107对应的区域进行照射，以使所述胶体固化。
其中，所述步骤501和所述步骤502不分先后次序，即，所述步骤501和所述步骤502可以同时执行，也可以相互先后执行。
此外，在设置有所述有机发光二极管显示器件103的所述基板101与设置有所述遮光构件104的所述盖板102对组（对位组合）并对所述胶体进行固化后，对所述基板101和所述盖板102进行切割，从而形成如图1所示的显示面板。
在本实施例中，所述在所述盖板102的所述第二表面上设置所述遮光构件104的步骤（即，所述步骤502）包括：
步骤601，在所述盖板102的所述第二表面上设置一遮光材料层。
步骤602，利用光掩模对所述遮光材料层进行图案化处理，以形成所述遮光构件104。
具体地，首先准备如图2所示的所述盖板102，在所述盖板102的所述第二表面上通过涂布、沉积、溅射等方式中的一种或一种以上形成所述遮光材料层，如图3所示，然后利用光罩（光掩模）对所述遮光材料层进行图案化处理，即，使得所述遮光材料层形成至少一所述第一预定图案和至少一所述第二预定图案，其中，所述第一预定图案与所述遮光构件104的形状和面积对应，所述第二预定图案与所述盖板102的所述标记部401的形状和面积对应，其中，所述标记部401用于在所述盖板102和所述基板101对组（对位组合）时为所述盖板102和所述基板101进行对位，最后，去除所述遮光材料层中除所述第一预定图案和所述第二预定图案以外的部分，以形成所述遮光构件104。
在同一道光罩（光掩模）工序中形成所述标记部401和所述遮光构件104，其中，所述标记部401用于为所述盖板102和所述基板101对位。
在本实施例中，在所述利用所述第一光线对所述盖板102中与所述基板101的显示区106和非显示区107对应的区域进行照射的过程中，所述方法还包括以下步骤：
利用所述遮光构件104遮蔽（遮挡）照射到所述显示区106上的所述第一光线，以避免所述有机发光二极管显示器件103受到所述第一光线的照射。
上述技术方案可以使得在对所述胶体进行固化时，不需要额外的光罩工序，因此不存在光罩与所述盖板102对位异常的问题，同时也不存在由于更换光罩而将所述显示面板的生产环境恢复至氮气环境的问题。在上述技术方案中，直接使用所述第一光线对所述盖板102进行照射即可，节省了所述显示面板的制作工序，不需要在更换光罩后将所述显示面板的生产环境恢复正常（氮气环境），节省了所述显示面板的生产时间（至少6小时）。
在本发明中，封装用的所述盖板102上的标记部401和所述遮光构件104是在同一道工序中制作的，所述遮光构件104代替了紫外线光罩的功能。
所述盖板102在与设置有所述有机发光二极管显示器件103的所述基板101对组贴合后，有BM Pattern（所述遮光构件104）的地方可遮挡所述有机发光二极管显示器件103（有机材料/有机薄膜），露出四周的胶体105进行紫外线照射。对于不同尺寸的显示面板，制作不同尺寸的BM Pattern即可。这样可以省去紫外线光罩以及省略更换紫外线光罩的过程，不需破坏氮气环境，避免了恢复氮气环境所需的耗时（需耗时6h以上），此外也避免了紫外线光罩同玻璃（所述基板101或所述盖板104）对位异常的问题。
综上所述，虽然本发明已以优选实施例揭露如上，但上述优选实施例并非用以限制本发明，本领域的普通技术人员，在不脱离本发明的精神和范围内，均可作各种更动与润饰，因此本发明的保护范围以权利要求界定的范围为准。

Claims (20)

  1. 一种显示面板，其中
    所述显示面板包括：
    一基板，所述基板具有第一表面；
    一有机发光二极管显示器件，所述有机发光二极管显示器件设置于所述基板的所述第一表面上；
    一盖板，所述盖板具有第二表面，所述基板和所述盖板叠加组合为一体，所述基板的所述第一表面和所述盖板的所述第二表面相对设置；
    一遮光构件，所述遮光构件设置于所述盖板的所述第二表面上；以及
    至少一密封胶，所述密封胶设置于所述基板和所述盖板之间；
    所述基板的所述第一表面设置有一显示区和至少两非显示区，至少两所述非显示区位于所述显示区的至少两侧；
    所述有机发光二极管显示器件设置于所述显示区上；
    所述遮光构件设置于所述第二表面上与所述显示区对应的区域上；
    所述密封胶设置于所述非显示区上；
    所述有机发光二极管显示器件包括阴极层、有机材料层和阳极层，所述有机材料层设置于所述阴极层和所述阳极层之间，所述有机发光二极管显示器件用于在所述阴极层和所述阳极层向所述有机材料层施加一电压时生成一图像。
  2. 根据权利要求1所述的显示面板，其中
    所述密封胶是通过在所述显示区上设置一胶体，然后利用第一光线对所述胶体进行照射，以使所述胶体固化来形成的。
  3. 根据权利要求2所述的显示面板，其中
    所述遮光构件用于在所述密封胶受到所述第一光线照射时，遮挡照射到所述有机发光二极管显示器件上的所述第一光线。
  4. 根据权利要求3所述的显示面板，其中
    所述有机发光二极管显示器件在所述第一表面上具有第一投影，所述遮光构件在所述第一表面上具有第二投影，所述第二投影覆盖所述第一投影。
  5. 根据权利要求4所述的显示面板，其中
    所述密封胶在所述第一表面上具有第三投影，所述第二投影与所述第一投影的重叠部分的面积为零。
  6. 根据权利要求1所述的显示面板，其中
    所述遮光构件是通过在所述盖板的所述第二表面上设置一遮光材料层，然后利用光掩模对所述遮光材料层进行图案化处理来形成的。
  7. 根据权利要求6所述的显示面板，其中
    所述盖板的所述第二表面上还设置有标记部，所述标记部用于在所述盖板和所述基板对组时为所述盖板和所述基板进行对位。
  8. 根据权利要求7所述的显示面板，其中
    所述标记部和所述遮光构件是在同一道光罩工序中形成的。
  9. 一种显示面板，其中
    所述显示面板包括：
    一基板，所述基板具有第一表面；
    一有机发光二极管显示器件，所述有机发光二极管显示器件设置于所述基板的所述第一表面上；
    一盖板，所述盖板具有第二表面，所述基板和所述盖板叠加组合为一体，所述基板的所述第一表面和所述盖板的所述第二表面相对设置；
    一遮光构件，所述遮光构件设置于所述盖板的所述第二表面上；以及
    至少一密封胶，所述密封胶设置于所述基板和所述盖板之间。
  10. 根据权利要求9所述的显示面板，其中
    所述基板的所述第一表面设置有一显示区和至少两非显示区，至少两所述非显示区位于所述显示区的至少两侧；
    所述有机发光二极管显示器件设置于所述显示区上；
    所述遮光构件设置于所述第二表面上与所述显示区对应的区域上；
    所述密封胶设置于所述非显示区上。
  11. 根据权利要求10所述的显示面板，其中
    所述密封胶是通过在所述显示区上设置一胶体，然后利用第一光线对所述胶体进行照射，以使所述胶体固化来形成的。
  12. 根据权利要求11所述的显示面板，其中
    所述遮光构件用于在所述密封胶受到所述第一光线照射时，遮挡照射到所述有机发光二极管显示器件上的所述第一光线。
  13. 根据权利要求12所述的显示面板，其中
    所述有机发光二极管显示器件在所述第一表面上具有第一投影，所述遮光构件在所述第一表面上具有第二投影，所述第二投影覆盖所述第一投影。
  14. 根据权利要求13所述的显示面板，其中
    所述密封胶在所述第一表面上具有第三投影，所述第二投影与所述第一投影的重叠部分的面积为零。
  15. 根据权利要求10所述的显示面板，其中
    所述遮光构件是通过在所述盖板的所述第二表面上设置一遮光材料层，然后利用光掩模对所述遮光材料层进行图案化处理来形成的。
  16. 根据权利要求15所述的显示面板，其中
    所述盖板的所述第二表面上还设置有标记部，所述标记部用于在所述盖板和所述基板对组时为所述盖板和所述基板进行对位。
  17. 根据权利要求16所述的显示面板，其中
    所述标记部和所述遮光构件是在同一道光罩工序中形成的。
  18. 一种如权利要求9所述的显示面板的制作方法，其中
    所述方法包括以下步骤：
    在所述基板的所述第一表面上设置所述有机发光二极管显示器件；
    在所述盖板的所述第二表面上设置所述遮光构件；
    在所述基板或所述盖板上设置一胶体；
    将设置有所述有机发光二极管显示器件的所述基板和设置有所述遮光构件的所述盖板叠加组合为一体，其中，所述盖板和所述基板之间设置有所述遮光构件、所述有机发光二极管显示器件和一胶体；以及
    利用第一光线对所述盖板中与所述基板的显示区和非显示区对应的区域进行照射，以使所述胶体固化。
  19. 根据权利要求18所述的显示面板的制作方法，其中
    所述在所述盖板的所述第二表面上设置所述遮光构件的步骤包括：
    在所述盖板的所述第二表面上设置一遮光材料层；
    利用光掩模对所述遮光材料层进行图案化处理，以形成所述遮光构件。
  20. 根据权利要求18所述的显示面板的制作方法，其中
    在所述利用所述第一光线对所述盖板中与所述基板的显示区和非显示区对应的区域进行照射的过程中，所述方法还包括以下步骤：
    利用所述遮光构件遮挡照射到所述显示区上的所述第一光线，以避免所述有机发光二极管显示器件受到所述第一光线的照射。
PCT/CN2014/083620 2014-07-17 2014-08-04 显示面板及其制作方法 Ceased WO2016008178A1 (zh)

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CN106848090B (zh) * 2016-12-26 2018-06-19 武汉华星光电技术有限公司 一种oled显示面板及oled显示面板的封装方法
CN109308435B (zh) * 2017-07-27 2023-12-22 固安翌光科技有限公司 用作指纹识别装置光源的oled屏体及光学指纹识别装置
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CN107863456A (zh) * 2017-10-11 2018-03-30 武汉华星光电半导体显示技术有限公司 Oled显示器及其制作方法
CN109808324A (zh) * 2019-03-05 2019-05-28 信利光电股份有限公司 一种圆形盖板丝印方法及圆形模组制作方法

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