WO2015196518A1 - 基板的封装方法及封装结构 - Google Patents

基板的封装方法及封装结构 Download PDF

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Publication number
WO2015196518A1
WO2015196518A1 PCT/CN2014/082129 CN2014082129W WO2015196518A1 WO 2015196518 A1 WO2015196518 A1 WO 2015196518A1 CN 2014082129 W CN2014082129 W CN 2014082129W WO 2015196518 A1 WO2015196518 A1 WO 2015196518A1
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WO
WIPO (PCT)
Prior art keywords
plastic frame
substrate
groove
package board
packaging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2014/082129
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English (en)
French (fr)
Inventor
陈林豆
史凯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TCL China Star Optoelectronics Technology Co Ltd
Original Assignee
Shenzhen China Star Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen China Star Optoelectronics Technology Co Ltd filed Critical Shenzhen China Star Optoelectronics Technology Co Ltd
Priority to US14/381,986 priority Critical patent/US9472603B2/en
Publication of WO2015196518A1 publication Critical patent/WO2015196518A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/86—Series electrical configurations of multiple OLEDs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/65—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials
    • H10P14/6516—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials
    • H10P14/6536—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials by exposure to radiation, e.g. visible light
    • H10P14/6538—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials by exposure to radiation, e.g. visible light by exposure to UV light
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/874—Passivation; Containers; Encapsulations including getter material or desiccant

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a method and a package structure for a substrate. Background technique
  • LCD liquid crystal display
  • OLED Organic Light Emitting Diode
  • LCD liquid crystal display
  • OLED Organic Light Emitting Diode
  • OLED has self-illumination, low driving voltage, high luminous efficiency, short response time, high definition and contrast ratio, near 180° viewing angle, wide temperature range, flexible display and large-area full-color display.
  • the industry is recognized as the most promising display device.
  • the biggest problem that restricts the development of the OLED industry and the biggest drawback of OLEDs is that the lifetime of OLEDs is short, and the reason why the lifetime of OLEDs is short is that the electrodes and organic materials constituting the OLED devices are very sensitive to water vapor and oxygen. Therefore, effective packaging of OLEDs to prevent water vapor and oxygen from entering the interior of the OLED is particularly important to extend the lifetime of the OLED and ensure the performance of the OLED device.
  • OLED package is the key to the effectiveness of OLEDs, in the OLED factory test production, through Manage package quality to ensure the effectiveness of OLED devices.
  • OLED package mainly includes the following methods: desiccant package, UV glue package (also known as Dam only package UV glue and filler package (also known as Dam & Fill package glass glue package (also known as Frit package).
  • Dam & Fill The package has more and more applications in the OLED industry due to its simple process, high size packaging, high flexibility, stability and reliability, and can effectively reduce production costs.
  • the conventional method for packaging a TFT substrate having an OLED device is as follows: applying a sealant on the package board 100 by coating, that is, without intermittently, forming an inner plastic frame 2 00 and the outer plastic frame 300; and then applying the filling adhesive 400 by a drop, intermittently; the package board 100 and the TFT substrate with the OLED device are pressed in the VAS machine, due to the filling glue
  • the viscosity of 400 is relatively low.
  • ⁇ true adhesive 400 is distributed under the pressure to fill the area surrounded by the inner plastic frame 200; finally, the sealing glue and the filling glue are irradiated by the UV light source. It is cured to realize encapsulation of the package board 100 to the TFT substrate having the OLED device.
  • Another object of the present invention is to provide a package structure of a substrate, which can prevent bubbles from filling the rubber particles and fill the plastic frame, thereby ensuring good packaging effect, thereby improving the performance of the OLED device and prolonging the life of the OLED device. .
  • the present invention first provides a method for packaging a substrate, comprising the following steps:
  • Step 1 Providing a substrate and a package board, the package board having a rubberized surface
  • Step 2 the package board is provided with at least one groove on the coating path of the glue surface to form the plastic frame;
  • Step 3 Apply a sealant on the rubberized surface of the package board to form a continuous plastic frame, and the plastic frame forms a recess corresponding to at least one groove;
  • Step 4 providing a filling glue on the rubber coating surface of the packaging board in the area surrounding the plastic frame; Step 5, the substrate and the packaging board are relatively bonded, and the recessed position between the substrate and the packaging board in the plastic frame Forming a gas passage;
  • Step 6 extracting air between the substrate and the package board via the gas passage
  • Step 7 Pressing the substrate and the package board
  • Step 8 Using a UV light source to illuminate the sealant and the filling glue to cure the package, thereby encapsulating the package board to the substrate.
  • the substrate is a TFT substrate having an OLED device.
  • the plastic frame to be formed in the step 2 includes an inner plastic frame and an outer plastic frame, and the packaging plate is respectively provided with at least one groove on the coating path of the inner and outer plastic frames on the rubber coating surface.
  • the groove on the coating path of the inner frame to be formed is aligned with the groove on the coating path on which the outer frame is to be formed.
  • the grooves on the coating path for forming the inner frame and the grooves on the coating path for forming the outer frame are respectively four.
  • the thickness of the frame at the groove of the package board is the same as the thickness of the frame at the non-groove.
  • the vertical distance d of the apex of the frame located at the most position of the groove to the glue surface of the package board is greater than the thickness of the frame after the step 7 is pressed.
  • the filling glue is set by means of dripping, and the filling glue maintains a safe distance from the inner edge of the plastic frame located in the groove so that the filling glue does not overflow from the groove during the pressing process of step 7. Out.
  • the sealant is a UV glue
  • the filler is a liquid transparent desiccant.
  • the width of the frame in the groove after the step 7 is pressed is greater than 2 mm.
  • the present invention further provides a package structure, comprising: a substrate, a package board, and a plastic frame and a filler formed by the sealant disposed between the substrate and the package board, wherein the filler is located inside the plastic frame, and the package board has A rubberized surface, the packaging board is provided with at least one groove on the coating surface of the glue-coated surface corresponding to the plastic frame.
  • the substrate is a TFT substrate having an OLED device;
  • the plastic frame includes an inner plastic frame and an outer plastic frame, and the packaging plate is respectively provided with at least one groove on a coating path corresponding to the inner and outer plastic frames.
  • the [H] groove on the coating path of the inner plastic frame is aligned with the groove on the coating path of the outer plastic frame.
  • the sealant is a UV glue
  • the filler is a liquid transparent desiccant
  • the width of the plastic frame located in the groove is greater than 2 mm.
  • the present invention further provides a package structure, comprising: a substrate, a package board, and a plastic frame and a filler formed by the sealant disposed between the substrate and the package board, wherein the filler is located inside the plastic frame, and the package board has a rubberized surface, the packaging board is provided with at least one groove on the coating path of the corresponding plastic frame on the rubber coating surface-
  • the substrate is a TFT substrate having an OLED device;
  • the plastic frame includes an inner plastic frame and an outer plastic frame, and the packaging plate is respectively provided with at least one groove on a coating path corresponding to the inner and outer plastic frames.
  • the [H] groove on the coating path of the inner plastic frame is aligned with the groove on the coating path of the outer plastic frame;
  • the sealant is a UV glue
  • the filler is a liquid transparent desiccant
  • the width of the plastic frame located in the groove is greater than 2 mm.
  • the beneficial effects of the present invention are as follows: a method for packaging a substrate of the present invention, by providing a groove on a rubberized surface of a package board, forming a recess in the corresponding frame when the plastic frame is formed, and after the package board and the substrate are relatively attached, the two A gas passage is formed between the [H] trapping position, so that the air between the substrate and the package board can be extracted, which solves the problem that the filling of the filling filler is not filled with bubbles in the Dam & Fill package, thereby improving the packaging effect and improving the OLED.
  • the performance of the device extends the lifetime of the OLED device, and the method is simple and operability.
  • the package structure of the present invention by setting the [H] groove on the coating surface of the package board corresponding to the coating path of the plastic frame, bubbles can be formed between the rubber particles of the filling glue and the plastic frame can be filled to ensure a good packaging effect. , thereby improving the performance of OLED devices and extending the lifetime of OLED devices.
  • FIG. 1 is a schematic view of a package board before a package board is pressed against a substrate in a packaging method of a conventional substrate;
  • FIG. 2 is a schematic view of a package board after a package board is pressed against a substrate in a packaging method of a conventional substrate;
  • FIG. 3 is a flow chart of a method of packaging a substrate of the present invention.
  • FIG. 4 is a front cross-sectional view showing a step 3 of a method for packaging a substrate of the present invention
  • FIG. 5 is a schematic plan view showing a step 4 of a method for packaging a substrate of the present invention; and a package board before the package board of the package structure of the present invention is pressed against the substrate.
  • FIG. 6 is a front cross-sectional view showing a step 5 of a method for packaging a substrate according to the present invention
  • FIG. 7 is a front cross-sectional view showing a step 8 of a method for packaging a substrate according to the present invention and a front cross-sectional view of the package structure of the present invention.
  • the present invention provides a method for packaging a substrate, comprising the following steps: Step 1. Providing a substrate 1 and a package board 3, the package board 3 having a glue surface 31; The package board 3 is provided with at least one groove 311 on the coating path of the glue surface 31 to form the plastic frame 5;
  • Step 3 applying a sealant 50 on the glue surface 31 of the package board 3 to form a continuous plastic frame 5, the plastic frame 5 corresponding to at least one groove 311 forming a recess 51;
  • Step 4 On the rubberized surface 31 of the package board 3, a filling glue 70 is disposed in a region surrounded by the plastic frame 5; Step 5, the substrate 1 and the package board 3 are relatively adhered, and the substrate 1 and the package board 3 are glued together. frame
  • the depression 51 position of 5 forms a gas passage 20;
  • Step 6 The air between the substrate 1 and the package board 3 is extracted through the gas passage 20; Step 7. Pressing the substrate 1 and the package board 3;
  • Step 8 The sealant 50 and the filler 70 are irradiated and cured by using a UV light source, thereby encapsulating the package board 1 on the substrate 3.
  • the substrate 1 provided in the step 1 is a TFT substrate having an OLED device.
  • the plastic frame 5 to be formed in the step 2 includes an inner plastic frame 53 and an outer plastic frame 55.
  • the packaging plate 3 is respectively disposed on the coating path of the inner and outer plastic frames 53 and 55 on the rubberized surface 31.
  • the groove 311 located on the coating path of the inner plastic frame 53 is aligned with the groove 311 on the coating path where the outer frame 55 is to be formed.
  • the inner and outer plastic frames 53, 55 are formed in a rectangular shape, and the groove 311 on the coating path of the inner plastic frame 53 is formed on the coating path on which the outer plastic frame 55 is to be formed.
  • the grooves 311 are respectively four and are distributed at the center of the four sides of the rectangle.
  • the filling glue 70 overflows the plastic frame 5 through the groove 311 under the action of a large air pressure, and ensures the plastic frame located at the groove 311 after pressing.
  • the width of 5 is greater than 2 mm, and the curvature of the groove 311 is not too large.
  • Step 3 The adhesive is coated on the surface of the sealing plate 31 of sealant 50 to form a continuous plastic frame 5, the plastic frame must be at least five pairs of grooves 311 formed in a recess 510 of the sealant 50 is a UV adhesive. Since the distance between the nozzle of the sealant 50 and the rubberized surface 31 of the package board 3 is a fixed value, a plastic frame having the same shape as the coating path can be formed, so the thickness of the plastic frame 5 at the groove 311 of the package board 3 is obtained. It is the same thickness as the frame 5 at the non-groove.
  • the substrate 1 and the package board 3 are completely sealed, and the apex of the plastic frame 5 located at the lowest position of the recess 311 is achieved.
  • the vertical distance d to the glue surface 31 of the package board 3 It is larger than the thickness of the plastic frame 5 after the step 7 is pressed.
  • the filling glue 70 is provided by means of dripping, and the filling glue 70 maintains a safe distance from the inner edge of the plastic frame 5 located in the groove 311, so that the filling glue 70 is not in the pressing process of the subsequent step 7. It will overflow from the groove 311, and the filling glue 70 can be prevented from overflowing by adjusting the proper glue pressure.
  • the filler 70 is a liquid transparent desiccant.
  • the substrate 1 and the package board 3 are pasted together, and only the substrate 1 is attached to the plastic frame 5, and no pressing force is applied, so that the substrate 1 and the package board 3 are disposed at the recess 51 of the plastic frame 5.
  • a gas passage 20 is formed.
  • the step 6 is to extract the air between the substrate 1 and the package board 3 via the gas passage 20, and the air bubbles at the gap between the rubber particles of the filler 70 are discharged.
  • the step 7 is to press the substrate 1 and the package board 3.
  • the width of the frame 5 located in the groove 311 after pressing is greater than 2 mm. Since the air bubbles in the gap between the rubber particles 70 in the step ⁇ are discharged, after the substrate 1 and the package board 3 are pressed, the true filler 70 can fill the area surrounded by the plastic frame 5, thereby improving the package. The effect is to improve the performance of OLED devices and extend the lifetime of OLED devices.
  • step 8 the operation of step 8 is performed, and the sealant 50 and the filler 70 are irradiated with a UV light source to be cured, thereby encapsulating the package board 1 on the substrate 3.
  • a package structure comprising: a substrate 1 , a package board 3 , and a plastic frame 5 and a filling glue 70 formed by the sealant 50 disposed between the substrate 1 and the package board 3 , wherein the filling glue 70 is located in the plastic frame 5 .
  • the encapsulating plate 3 On the inner side, the encapsulating plate 3 has a rubber coating surface 31.
  • the packaging plate 3 is provided with at least one groove 311 on the coating path of the plastic frame 5 corresponding to the plastic frame 5.
  • the groove 311 can provide a passage for the gas to be discharged, so that there is no air bubble between the rubber particles of the glue filling and filling the plastic frame, thereby ensuring a good packaging effect, thereby improving the performance of the OLED device and prolonging the life of the OLED device.
  • the substrate 1 is a TFT substrate having an OLED device.
  • the plastic frame 5 includes an inner plastic frame 53 and an outer plastic frame 55.
  • the package plate 3 is coated on the rubberized surface 31 corresponding to the inner and outer plastic frames 53 and 55.
  • At least one groove 311 is respectively disposed on the cloth path, and the groove 311 on the coating path of the inner plastic frame 53 is aligned with the groove 311 on the coating path of the outer plastic frame 55.
  • the plastic frame 5 forms a recess 51 corresponding to the groove 311, but after the package board 3 is pressed against the substrate 1, the recess 51 disappears.
  • the inner and outer plastic frames 53, 55 are rectangular, and the groove 311 on the coating path of the inner plastic frame 53 and the groove 311 on the coating path of the outer plastic frame 55 are respectively four. , distributed at the center of the four sides of the rectangle.
  • the sealant 50 is a UV glue
  • the filler 70 is a liquid transparent desiccant.
  • the width of the plastic frame 5 located in the groove 311 is greater than 2 mm.
  • the method for packaging a substrate provided by the present invention is such that a recess is formed on a rubberized surface of a package board, and a recess is formed corresponding to the groove when the plastic frame is formed, and the package board and the substrate are relatively bonded together, A gas passage is formed between the recessed position, so that the air between the substrate and the package board can be extracted, which solves the problem that the filling of the filling filler is not filled with bubbles in the Dam & Fill package, thereby improving the packaging effect and improving the performance of the OLED device.
  • the method is simple and operability.
  • the package structure of the present invention by setting the [H] groove on the coating surface of the package board corresponding to the coating path of the plastic frame, bubbles can be formed between the rubber particles of the filling glue and the plastic frame can be filled to ensure a good packaging effect. , thereby improving the performance of the OLED device and extending the life of the OLED device.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

一种基板的封装方法及封装结构，该方法包括：步骤1、提供基板（1）及封装板（3），封装板（3）具有一涂胶面（31）；步骤2、于涂胶面（31）上设置至少一个凹槽（311）；步骤3、涂布密封胶（50）形成连续胶框（5），该胶框（5）对应凹槽（311）形成凹陷（51）；步骤4、于胶框（5）所围区域内设置填充胶；步骤5、将基板（1）与封装板（3）相对贴合，基板（1）与封装板（3）之间于胶框（5）的凹陷（51）位置形成气体通道（20）；步骤6、经由气体通道（20）抽出基板（1）与封装板（3）之间的空气；步骤7、压合基板（1）与封装板（3）；步骤8、使用UV光源对密封胶（50）及填充胶进行照射使其固化。

Description

基板的封装方法及封装结构 技术领域
本发明涉及显示技术领域，尤其涉及一种基板的封装方法及封装结构。 背景技术
在显示技术领域，液晶显示器 ( Liquid Crystal Display , LCD )与有机 发光二极管显示器（ Organic Light Emitting Diode , OLED )等平板显示技术 已经逐步取代 CRT显示器。 其中， OLED具有自发光、 驱动电压低、 发光 效率高、 响应时间短、 清晰度与对比度高、 近 180°视角、 使用温度范围宽， 可实现柔性显示与大面积全色显示等诸多优点，被业界公认为是最有发展 潜力的显示装置。
目前，制约 OLED产业发展的最大问题与 OLED的最大缺陷是 OLED 的寿命较短，造成 OLED寿命较短的原因主要是构成 OLED器件的电极和 有机材料对水汽、 氧气非常敏感。 因此，对 OLED进行有效封装，阻止水 汽、 氧气进入 OLED内部对延长 OLED的寿命及保证 OLED 器件的性能 尤为重要。
封装是 OLED有效与否的关键所在，在 OLED工厂试验生产中，通过 管控封装质量来保证 OLED器件的有效性。 OLED封装主要包括以下几种 方式：干燥剂封装、 UV胶封装 (又称 Dam only封装 UV胶和填充胶封 装（又称 Dam & Fill封装 玻璃胶封装（又称 Frit封装 )等。 其中 Dam & Fill封装，以其工艺简单、 适用于大尺寸封装、 封装灵活度高、 稳定性与可 靠性佳等优点，在 OLED行业中得到越来越多的应用，且可有效降低生产 成本。
如图 1、 图 2所示，现有的对具有 OLED器件的 TFT基板的封装方法 为：在封装板 100上通过涂覆（ coat )即没有间断的方式涂布密封胶，形成 内胶框 200与外胶框 300；再通过滴注 ( dispense )即一滴一滴、 有间断的 方式涂布填充胶 400；然后将封装板 100与具有 OLED器件的 TFT基板在 VAS机台中压合，由于填充胶 400的黏度比较低，在该压合过程中， ±真充 胶 400在压力的作用下，分布开来填满由内胶框 200包围的区域；最后使 用 UV光源对密封胶及填充胶进行照射使其固化，从而实现封装板 100对 具有 OLED器件的 TFT基板的封装。
然而，在实际生产中，将封装板 100与具有 OLED器件的 TFT基板压 合后， ±真充胶 400胶滴之间的空隙会形成气泡，但由于受内、 外胶框 200、 300的密封限制难以排出，常常出现填充胶 400 ±真充不满由内胶框 200包围 的区域而留有气泡的情形，影响到 OLED器件的性能及寿命。 发明内容
本发明的目的在于提供一种基板的封装方法，能够解决 Dam & Fill封 装时填充胶填充不满存有气泡的问题，从而改善封装效果，提高 OLED器 件的性能、 延长 OLED器件的寿命。
本发明的另一目的在于提供一种基板的封装结构，能够使得填充胶的 胶粒之间不存在气泡并填满胶框，保证封装效果良好，从而提高 OLED器 件的性能、 延长 OLED器件的寿命。
为实现上述目的，本发明首先提供一种基板的封装方法，包括如下步 骤：
步骤 1、 提供基板及封装板，所述封装板具有一涂胶面；
步骤 2、所述封装板于涂胶面上欲形成胶框的涂布路径上设置至少一个 凹槽；
步骤 3、在封装板的涂胶面上涂布密封胶形成连续胶框，该胶框对应该 至少一个凹槽形成凹陷；
步骤 4、 在封装板的涂胶面上于胶框所围区域内设置填充胶； 步骤 5、将基板与封装板相对贴合，基板与封装板之间于胶框的凹陷位 置形成气体通道；
步骤 6、 经由气体通道抽出基板与封装板之间的空气；
步骤 7、 压合基板和封装板；
步骤 8、使用 UV光源对密封胶及填充胶进行照射使其固化，从而实现 封装板对基板的封装。
所述基板为具有 OLED器件的 TFT基板。
所述步骤 2中欲形成的胶框包括内胶框与外胶框，所述封装板于涂胶 面上欲形成内与外胶框的涂布路径上分别设置至少一个凹槽。
所述位于欲形成内胶框的涂布路径上的凹槽与位于欲形成外胶框的涂 布路径上的凹槽对齐。
所述位于欲形成内胶框的涂布路径上的凹槽与位于欲形成外胶框的涂 布路径上的凹槽分别为四个。
所述步骤 3中封装板的凹槽处的胶框厚度与非凹槽处的胶框厚度相同。 所述步骤 3 中位于凹槽最 ί氏位置处的胶框的顶点到封装板涂胶面的垂 直距离 d大于步骤 7压合后胶框的厚度。
所述步骤 4设置填充胶采用滴注的方式，该填充胶与位于凹槽的胶框 的内边缘保持一安全距离使得在步骤 7的压合过程中填充胶不会从凹槽溢 出。
所述密封胶为 UV胶，所述填充胶为液态透明干燥剂，所述步骤 7压 合后位于凹槽内的胶框的宽度大于 2mm。
本发明还提供一种封装结构，包括：基板、 封装板及设于基板与封装 板之间的由密封胶形成的胶框及填充胶，所述填充胶位于胶框内侧，所述 封装板具有一涂胶面，所述封装板于涂胶面上对应胶框的涂布路径上设置 至少一个凹槽。
所述基板为具有 OLED器件的 TFT基板；所述胶框包括内胶框与外胶 框，所述封装板于涂胶面上对应内与外胶框的涂布路径上分别设置至少一 个凹槽，且所述位于内胶框的涂布路径上的 [H]槽与位于所述外胶框的涂布 路径上的凹槽对齐。
所述密封胶为 UV胶，所述填充胶为液态透明干燥剂，位于凹槽内的 胶框的宽度大于 2mm。
本发明还提供一种封装结构，包括：基板、 封装板及设于基板与封装 板之间的由密封胶形成的胶框及填充胶，所述填充胶位于胶框内侧，所述 封装板具有一涂胶面，所述封装板于涂胶面上对应胶框的涂布路径上设置 至少—个凹槽 - 所述基板为具有 OLED器件的 TFT基板；所述胶框包括内胶框与外胶 框，所述封装板于涂胶面上对应内与外胶框的涂布路径上分别设置至少一 个凹槽，且所述位于内胶框的涂布路径上的 [H]槽与位于所述外胶框的涂布 路径上的凹槽对齐；
所述密封胶为 UV胶，所述填充胶为液态透明干燥剂，位于凹槽内的 胶框的宽度大于 2mm。
本发明的有益效果：本发明的基板的封装方法，通过在封装板的涂胶 面上设置凹槽，形成胶框时对应该凹槽形成凹陷，将封装板与基板相对贴 合后，二者之间于该 [H]陷位置形成气体通道，使得基板与封装板之间的空 气可以被抽出，解决了 Dam & Fill封装时填充胶填充不满存有气泡的问题， 从而改善封装效果，提高 OLED器件的性能，延长 OLED器件的寿命，且 该方法较简便，可操作性强。 本发明的封装结构，通过在封装板的涂胶面 上对应胶框的涂布路径设置 [H]槽，能够使得填充胶的胶粒之间不存在气泡 并填满胶框，保证封装效果良好，从而提高 OLED器件的性能、延长 OLED 器件的寿命。
为了能更进一步了解本发明的特征以及技术内容，请参阅以下有关本 发明的详细说明与附图，然而附图仅提供参考与说明用，并非用来对本发 明加以限制。 附图说明
下面结合附图，通过对本发明的具体实施方式详细描述，将使本发明 的技术方案及其它有益效果显而易见。
附图中，
图 1 为现有基板的封装方法中封装板与基板压合之前的封装板的示意 图；
图 2为现有基板的封装方法中封装板与基板压合之后的封装板的示意 图；
图 3为本发明基板的封装方法的流程图；
图 4为本发明基板的封装方法的步骤 3的主视剖面示意图； 图 5为本发明基板的封装方法的步骤 4的俯视示意图暨本发明封装结 构的封装板与基板压合之前的封装板的俯视示意图；
图 6为本发明基板的封装方法的步骤 5的主视剖面示意图； 图 7为本发明基板的封装方法的步骤 8的主视剖面示意图暨本发明封 装结构的主视剖面示意图。 具体实施方式
为更进一步阐述本发明所采取的技术手段及其效果，以下结合本发明 的优选实施例及其附图进行详细描述。
请参阅图 3至图 7 ,本发明提供一种基板的封装方法，包括以下步骤： 步骤 1、 提供基板 1及封装板 3 ,所述封装板 3具有一涂胶面 31； 步骤 2、 所述封装板 3于涂胶面 31上欲形成胶框 5的涂布路径上设置 至少一个凹槽 311；
步骤 3、 在封装板 3的涂胶面 31上涂布密封胶 50形成连续胶框 5 ,该 胶框 5对应该至少一个凹槽 311形成凹陷 51；
步骤 4、在封装板 3的涂胶面 31上于胶框 5所围区域内设置填充胶 70； 步骤 5、将基板 1与封装板 3相对贴合，基板 1与封装板 3之间于胶框
5的凹陷 51位置形成气体通道 20；
步骤 6、 经由气体通道 20抽出基板 1与封装板 3之间的空气； 步骤 7、 压合基板 1和封装板 3；
步骤 8、使用 UV光源对密封胶 50及填充胶 70进行照射使其固化，从 而实现封装板 1对基板 3的封装。
具体的，所述步骤 1中提供的基板 1为具有 OLED器件的 TFT基板。 所述步骤 2中欲形成的胶框 5包括内胶框 53与外胶框 55 ,所述封装板 3于涂胶面 31上欲形成内与外胶框 53、 55的涂布路径上分别设置至少一个 凹槽 311。 所述位于欲形成内胶框 53的涂布路径上的凹槽 311与位于欲形 成外胶框 55的涂布路径上的凹槽 311对齐。 优选的，所述欲形成内与外胶 框 53、 55呈矩形，所述位于欲形成内胶框 53的涂布路径上的凹槽 311与 位于欲形成外胶框 55的涂布路径上的凹槽 311分别为四个，分布于所述矩 形的四条边的中心位置。 为避免后续步骤 7压合基板 1与封装板 3的过程 中填充胶 70在较大气压的作用下通过所述凹槽 311溢出胶框 5及保证压合 后位于所述凹槽 311处的胶框 5的宽度大于 2mm ,所述凹槽 311的弧度不 易太大。
所述步骤 3为在封装板 3的涂胶面 31上涂布密封胶 50形成连续胶框 5 , 该胶框 5对应该至少一个凹槽 311形成凹陷 510 所述密封胶 50为 UV胶。 由于涂布密封胶 50的针嘴与封装板 3的涂胶面 31的距离为固定值，可形 成与涂布路径形状相同的胶框，所以封装板 3的凹槽 311处的胶框 5厚度 与非凹槽处的胶框 5厚度相同。 为保证后续步骤 7压合基板 1与封装板 3 后，所述胶框 5的凹陷 51消失，实现完全密封基板 1与封装板 3 ,所述位 于凹槽 311最低位置处的胶框 5的顶点到封装板 3涂胶面 31的垂直距离 d 大于步骤 7压合后胶框 5的厚度。
所述步骤 4中设置填充胶 70采用滴注的方式，该填充胶 70与位于凹 槽 311的胶框 5的内边缘保持一安全距离，使得在后续步骤 7的压合过程 中填充胶 70不会从凹槽 311溢出，也可通过调试合适的涂胶气压避免填充 胶 70溢出。 所述填充胶 70为液态透明干燥剂。
所述步骤 5将基板 1与封装板 3相对贴合，仅仅使所述基板 1贴合胶 框 5 ,并不施加压合力，使得基板 1与封装板 3之间于胶框 5的凹陷 51位 置形成气体通道 20。
所述步骤 6为经由所述气体通道 20抽出基板 1与封装板 3之间的空气 , 所述填充胶 70胶粒之间空隙处的气泡得以排出。
所述步骤 7为压合基板 1与封装板 3。 压合后位于凹槽 311内的胶框 5 的宽度大于 2mm。由于步骤 ό中所述填充胶 70胶粒之间空隙处的气泡已排 出，压合基板 1与封装板 3后， ±真充胶 70能够填满所述胶框 5所围区域， 从而改善封装效果，提高 OLED器件的性能、 延长 OLED器件的寿命。
最后进行步骤 8的操作，使用 UV光源对密封胶 50及填充胶 70进行 照射使其固化，从而实现封装板 1对基板 3的封装。
请参阅图 5、 图 7 ,在本发明提供的基板的封装方法的基础上，本发明 还提供一种封装结构，包括：基板 1、 封装板 3及设于基板 1与封装板 3之 间的由密封胶 50形成的胶框 5及填充胶 70 ,所述填充胶 70位于胶框 5内 侧，所述封装板 3具有一涂胶面 31 ,所述封装板 3于涂胶面 31上对应胶框 5的涂布路径上设置至少一个凹槽 311。 所述凹槽 311能够提供气体排出的 通道，使得填充胶的胶粒之间不存在气泡并填满胶框，保证封装效果良好， 从而提高 OLED器件的性能、 延长 OLED器件的寿命。
所述基板 1为具有 OLED器件的 TFT基板；所述胶框 5包括内胶框 53 与外胶框 55 ,所述封装板 3于涂胶面 31上对应内与外胶框 53、 55的涂布 路径上分别设置至少一个凹槽 311 ,且所述位于内胶框 53的涂布路径上的 凹槽 311与位于所述外胶框 55的涂布路径上的凹槽 311对齐。如图 5所示， 所述封装板 3与基板 1压合之前，所述胶框 5对应该凹槽 311形成凹陷 51 , 但封装板 3与基板 1压合之后，所述凹陷 51消失。
优选的，所述内与外胶框 53、 55呈矩形，所述位于内胶框 53的涂布 路径上的凹槽 311与位于外胶框 55的涂布路径上的凹槽 311分别为四个， 分布于所述矩形的四条边的中心位置。
所述密封胶 50为 UV胶，所述填充胶 70为液态透明干燥剂，位于凹 槽 311内的胶框 5的宽度大于 2mm。 综上所述，本发明提供的基板的封装方法，通过在封装板的涂胶面上 设置凹槽，形成胶框时对应该凹槽形成凹陷，将封装板与基板相对贴合后， 二者之间于该凹陷位置形成气体通道，使得基板与封装板之间的空气可以 被抽出，解决了 Dam & Fill封装时填充胶填充不满存有气泡的问题，从而 改善封装效果，提高 OLED器件的性能，延长 OLED器件的寿命，且该方 法较简便，可操作性强。 本发明的封装结构，通过在封装板的涂胶面上对 应胶框的涂布路径设置 [H]槽，能够使得填充胶的胶粒之间不存在气泡并填 满胶框，保证封装效果良好，从而提高 OLED器件的性能、 延长 OLED器 件的寿命。
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术 方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形 都应属于本发明权利要求的保护范围。

Claims

杈 利 要 求
1、 一种基板的封装方法，包括如下步骤：
步骤 1、 提供基板及封装板，所述封装板具有一涂胶面；
步骤 2、所述封装板于涂胶面上欲形成胶框的涂布路径上设置至少一个 凹槽；
步骤 3、在封装板的涂胶面上涂布密封胶形成连续胶框，该胶框对应该 至少一个凹槽形成凹陷；
步骤 4、 在封装板的涂胶面上于胶框所围区域内设置填充胶； 步骤 5、将基板与封装板相对贴合，基板与封装板之间于胶框的凹陷位 置形成气体通道；
步骤 6、 经由气体通道抽出基板与封装板之间的空气；
步骤 7、 压合基板和封装板；
步骤 8、使用 UV光源对密封胶及填充胶进行照射使其固化，从而实现 封装板对基板的封装。
2、如权利要求 1所述的基板的封装方法，其中，所述基板为具有 OLED 器件的 TFT基板。
3、 如权利要求 1所述的基板的封装方法，其中，所述步骤 2中欲形成 的胶框包括内胶框与外胶框，所述封装板于涂胶面上欲形成内与外胶框的 涂布路径上分别设置至少一个凹槽。
4、 如权利要求 3所述的基板的封装方法，其中，所述位于欲形成内胶 框的涂布路径上的凹槽与位于欲形成外胶框的涂布路径上的凹槽对齐。
5、 如权利要求 4所述的基板的封装方法，其中，所述位于欲形成内胶 框的涂布路径上的凹槽与位于欲形成外胶框的涂布路径上的凹槽分别为四 个
6、 如权利要求 1所述的基板的封装方法，其中，所述步骤 3中封装板 的凹槽处的胶框厚度与非凹槽处的胶框厚度相同。
7、如权利要求 1所述的基板的封装方法，其中，所述步骤 3中位于凹 槽最低位置处的胶框的顶点到封装板涂胶面的垂直距离 d大于步骤 7压合 后胶框的厚度。
8、如权利要求 1所述的基板的封装方法，其中，所述步骤 4设置填充 胶采用滴注的方式，该填充胶与位于凹槽的胶框的内边缘保持一安全距离 使得在步骤 7的压合过程中填充胶不会从凹槽溢出。
9、如权利要求 1所述的基板的封装方法，其中，所述密封胶为 UV胶， 所述填充胶为液态透明干燥剂，所述步骤 7压合后位于凹槽内的胶框的宽 度大于 2mm。
10、 一种封装结构，包括：基板、 封装板及设于基板与封装板之间的 由密封胶形成的胶框及填充胶，所述填充胶位于胶框内侧，所述封装板具 有一涂胶面，所述封装板于涂胶面上对应胶框的涂布路径上设置至少一个 凹槽。
11、如权利要求 10所述的封装结构，其中，所述基板为具有 OLED器 件的 TFT基板；所述胶框包括内胶框与外胶框，所述封装板于涂胶面上对 应内与外胶框的涂布路径上分别设置至少一个 [Η]槽，且所述位于内胶框的 涂布路径上的凹槽与位于所述外胶框的涂布路径上的凹槽对齐。
12、 如权利要求 10所述的封装结构，其中，所述密封胶为 UV胶，所 述填充胶为液态透明干燥剂，位于凹槽内的胶框的宽度大于 2mm。
13、 一种封装结构，包括：基板、 封装板及设于基板与封装板之间的 由密封胶形成的胶框及填充胶，所述填充胶位于胶框内侧，所述封装板具 有一涂胶面，所述封装板于涂胶面上对应胶框的涂布路径上设置至少一个 凹槽；
其中，所述基板为具有 OLED器件的 TFT基板；所述胶框包括内胶框 与外胶框，所述封装板于涂胶面上对应内与外胶框的涂布路径上分别设置 至少一个 槽，且所述位于内胶框的涂布路径上的 [Η]槽与位于所述外胶框 的涂布路径上的凹槽对齐；
其中，所述密封胶为 υν胶，所述填充胶为液态透明干燥剂，位于凹 槽内的胶框的宽度大于 2mm。
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CN106531903B (zh) * 2016-11-10 2019-04-02 昆山国显光电有限公司 Oled封装方法及封装结构
CN107331787B (zh) * 2017-06-26 2019-06-21 京东方科技集团股份有限公司 封装盖板、有机发光显示器及其制备方法
CN110957412A (zh) * 2019-12-11 2020-04-03 河南鸿昌电子有限公司 一种致冷件的封胶方法和致冷件
CN111128019B (zh) * 2019-12-18 2021-06-15 Oppo广东移动通信有限公司 电子设备的装配方法及电子设备
CN111613529B (zh) * 2020-05-27 2023-05-23 华天慧创科技（西安）有限公司 一种晶圆的封装工艺
CN112133619B (zh) * 2020-09-22 2023-06-23 重庆臻宝科技股份有限公司 下部电极塑封夹具及塑封工艺

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1200464C (zh) * 2001-08-20 2005-05-04 翰立光电股份有限公司 电致发光元件的封装方法
US20090121303A1 (en) * 2007-11-08 2009-05-14 Visera Technologies Company Limited Semiconductor package
CN202111067U (zh) * 2011-04-20 2012-01-11 海太半导体（无锡）有限公司 半导体封装模具的改进

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3059560B2 (ja) * 1991-12-25 2000-07-04 株式会社日立製作所 半導体装置の製造方法およびそれに使用される成形材料
US6329224B1 (en) * 1998-04-28 2001-12-11 Tessera, Inc. Encapsulation of microelectronic assemblies
US6641933B1 (en) * 1999-09-24 2003-11-04 Semiconductor Energy Laboratory Co., Ltd. Light-emitting EL display device
US6384473B1 (en) * 2000-05-16 2002-05-07 Sandia Corporation Microelectronic device package with an integral window
CN1650672A (zh) * 2002-04-25 2005-08-03 哈利盛东芝照明株式会社 有机电致发光装置
TW578280B (en) * 2002-11-21 2004-03-01 United Epitaxy Co Ltd Light emitting diode and package scheme and method thereof
CN102290409B (zh) * 2003-04-01 2014-01-15 夏普株式会社 发光装置
JP4827593B2 (ja) * 2005-07-19 2011-11-30 パナソニック株式会社 半導体装置およびその製造方法
CN101268120B (zh) * 2005-09-22 2011-09-14 三菱化学株式会社 半导体发光器件用部件及其制造方法、以及使用该部件的半导体发光器件
DE102009046755A1 (de) * 2009-11-17 2011-05-26 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Organisches photoelektrisches Bauelement
CN102870230B (zh) * 2010-04-27 2016-04-20 费罗公司 用于气密密封导电馈通的方法
US20130050228A1 (en) * 2011-08-30 2013-02-28 Qualcomm Mems Technologies, Inc. Glass as a substrate material and a final package for mems and ic devices
US9093621B2 (en) * 2011-12-28 2015-07-28 Nichia Corporation Molded package for light emitting device
JP6282419B2 (ja) * 2012-07-27 2018-02-21 エルジー イノテック カンパニー リミテッド 照明装置
CN102956675A (zh) * 2012-10-18 2013-03-06 京东方科技集团股份有限公司 干燥剂层制备方法、有机发光二极管显示屏及其封装方法
US20150008819A1 (en) * 2013-07-05 2015-01-08 Shenzhen China Star Optoelectronics Technology Co., Ltd. OLED Panel and Package Method Thereof
CN103383992B (zh) * 2013-08-13 2015-12-02 深圳市华星光电技术有限公司 Oled器件的封装方法及用该方法封装的oled器件

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1200464C (zh) * 2001-08-20 2005-05-04 翰立光电股份有限公司 电致发光元件的封装方法
US20090121303A1 (en) * 2007-11-08 2009-05-14 Visera Technologies Company Limited Semiconductor package
CN202111067U (zh) * 2011-04-20 2012-01-11 海太半导体（无锡）有限公司 半导体封装模具的改进

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