WO2015167070A1 - Procédé de séparation verticale pour film de protection de substrat semi-conducteur et appareil de séparation verticale pour celui-ci - Google Patents

Procédé de séparation verticale pour film de protection de substrat semi-conducteur et appareil de séparation verticale pour celui-ci Download PDF

Info

Publication number
WO2015167070A1
WO2015167070A1 PCT/KR2014/005234 KR2014005234W WO2015167070A1 WO 2015167070 A1 WO2015167070 A1 WO 2015167070A1 KR 2014005234 W KR2014005234 W KR 2014005234W WO 2015167070 A1 WO2015167070 A1 WO 2015167070A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
film
unit
peeling
upright
Prior art date
Application number
PCT/KR2014/005234
Other languages
English (en)
Korean (ko)
Inventor
황선오
Original Assignee
주식회사 코엠에스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 코엠에스 filed Critical 주식회사 코엠에스
Publication of WO2015167070A1 publication Critical patent/WO2015167070A1/fr

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Definitions

  • the present invention relates to an upright peeling method and a peeling apparatus for a semiconductor substrate protective film.
  • PCBs printed circuit boards
  • PCBs are printed with copper foil for wiring of circuits required for thin plates made of epoxy or phenol resin, and are connected to each other. It refers to a substrate that can operate a circuit after applying power, and has a conductive function, an insulation function, and a support function. Therefore, the design of a printed circuit board (PCB) is very important in the manufacture of electronic-related products because it is directly related to the operation, performance, life and reliability of the product.
  • Printed circuit board (PCB) as described above is an electronic component that serves as a component for connecting semiconductors, capacitors, resistors, etc. It is used in all electronic devices, from computers to mobile phones to satellites.
  • PCBs include flexible printed circuit boards (FPCBs) and rigid printed circuit boards (RPCBs), such as printed circuit boards (PCBs).
  • FPCBs flexible printed circuit boards
  • RPCBs rigid printed circuit boards
  • PCBs printed circuit boards
  • FPCBs flexible printed circuit boards
  • PCBs are electronic components developed to cope with the trend of miniaturization and complexity of electronic products. They have good workability, excellent heat resistance, bending resistance, chemical resistance, and dimension change. It has the advantage of being less and heat-resistant, and it can reduce the working time during assembly work.
  • PCB Printed circuit board
  • semiconductor manufacturing board is protected by protecting the board surface by attaching a protective film to the upper and lower surfaces of the board for products that have been checked for abnormalities by removing contaminants that may be on the surface of the board during the manufacturing process. To lose. Therefore, in order to be able to insert various components such as semiconductors, capacitors and resistors on such substrates, the protective film attached to the substrate surface must be removed.
  • the present invention provides an upright peeling method and a peeling apparatus for a substrate protective film for a semiconductor, which can reduce the conveyance step of the substrate and the conveying amount of the peeling device, thereby miniaturizing and compacting the device, thereby providing excellent handling and enabling complete peeling. It is to.
  • the present invention can increase the work efficiency per hour while handling the substrate of 30 ⁇ 80cm size while accurately and completely peeling off the protective film of the substrate and provides an excellent peeling method and peeling device f of the substrate protective film for semiconductors excellent in durability It is to.
  • substrate protective film for semiconductors comprised including what consists of including.
  • a method for peeling and an upright peeling device for a substrate protective film for a semiconductor which can reduce the conveyance step of the substrate and the transporting amount of the peeling device, thereby making the device compact and compact, thereby enabling excellent peeling and complete peeling.
  • FIG. 1 is a whole perspective view of an upright peeling apparatus for a substrate protective film for a semiconductor according to an embodiment of the present invention.
  • Figure 2 is a perspective view of the whole upright peeling apparatus of the semiconductor substrate protective film according to an embodiment of the present invention.
  • Figure 3 (a, b) is a vacuum adsorption portion and the clapping portion of the upright peeling device of the semiconductor substrate protective film according to an embodiment of the present invention.
  • Figure 4 is a configuration of the scratch forming unit taping unit of the upright peeling apparatus of the substrate protective film for a semiconductor according to an embodiment of the present invention.
  • Figure 5 is a flow chart of the upright peeling method of the substrate protective film for a semiconductor according to an embodiment of the present invention.
  • Figure 6 is a substrate and film bonding of the peeling target of the present invention.
  • substrate protective film for semiconductors comprised including what consists of including.
  • FIG. 1 is an overall perspective view of an upright peeling apparatus for a semiconductor substrate protective film according to an embodiment of the present invention
  • Figure 2 is an overall perspective view of an upright peeling apparatus for a semiconductor substrate protective film according to an embodiment of the present invention
  • Figure 3 (a, b) is a schematic view of the vacuum adsorption unit and the clapping portion of the upright peeling apparatus of the semiconductor substrate protective film according to an embodiment of the present invention
  • Figure 4 is a semiconductor substrate protection according to an embodiment of the present invention A scratch forming unit taping unit configuration diagram among the upright peeling apparatuses of the film
  • FIG. 6 is a substrate and a film bonding of the peeling target of the present invention.
  • the upright peeling method of the substrate protective film for a semiconductor As shown in Figures 1 to 6, the upright peeling method of the substrate protective film for a semiconductor according to an embodiment of the present invention, the adsorption holding step (S10) and the net advance step (S20) and the scratch formation step (S30) ) And a film preliminary peeling step (S40), a film peeling step (S50) and a return step (S60).
  • the suction gripping step S10 when the substrate S on which the film is attached is loaded on the vacuum suction plate 10, the vacuum suction plate 11 sucks the substrate S and the clamper 21 the substrate S. Clamp the edge of.
  • the unit advance step S20 the unit transfer shuttle 30 on which the scratch forming unit 40 and the taping unit 50 are mounted is advanced.
  • the scratch forming step (S30) the scratch forming unit 40 forms a scratch portion to assist the film peeling on the side of the film (F) attached to the substrate (S).
  • the taping unit 50 taps the scratches on the substrate S and then is retracted to separate the side of the film F from the substrate.
  • the taping unit 50 peels off the film from the fixedly positioned substrate S while descending on the vertical frame 35 of the unit transfer shuttle 30.
  • the taping unit 50 is raised again and the unit transfer shuttle 40 is reversed to return to the initial position.
  • the vacuum suction plate 10 sucks and fixes the substrate S such that the right angled corner of the substrate S is located at the top.
  • the vacuum adsorption plate 11 is upright peeling
  • the unit transfer shuttle 30 is moved forward and backward in a horizontal direction parallel to the bottom of the structure and perpendicular to the vacuum suction plate 11 while maintaining the upright position from the bottom of the structure in which the apparatus is located.
  • the scratch forming unit 40 forms a scratch at a right angle corner of the substrate (S).
  • the vertical frame 35 of the unit transfer shuttle 30 is perpendicular to the advancing direction of the unit transfer shuttle 30 and remains upright from the bottom of the structure, and the taping unit 50 is Take the vertical frame 35 and descend in the vertical direction parallel to the vacuum suction plate (11).
  • the tape (T) is a film scratch portion of the substrate
  • the drive recovery roll 53 was repeatedly wound and unwound tape, and the pressure gripping roll 55 pressurized the feed roll 51 before the film peeling step S50 was carried out so that the film was no longer peeled off.
  • the tape T is fixed so as not to be released from the supply roll 51.
  • the upright peeling apparatus of the substrate protective film for semiconductors is an upright peeling apparatus of the body substrate protective film, on one side of the main frame (1)
  • the vacuum adsorption unit 10 for vacuum adsorption to the adsorption hole 13 provided in the vacuum adsorption plate 11 and the edge of the substrate adsorbed to the vacuum adsorption plate 11 are connected to the vacuum adsorption plate.
  • the taping unit 50 is mounted, and the unit transfer shuttle 30 is mounted on the horizontal rail 5 of the main frame 1 and moves forward and backward, and is installed on the vertical frame 35.
  • the flaw forming unit 40 for forming a flaw in the right angle corner of the substrate film while moving backward together Include.
  • the tape is mounted on the vertical frame 35, while moving backward with the unit transfer shuttle 30, by taping the scratches made by the scratch forming unit 40, and then backward, the film is lowered on the vertical frame 35. It further includes a taping unit 50 for peeling off from the substrate.
  • the vacuum suction plate 10 is located at the top right corner of the substrate (S).
  • the substrate S is sucked and fixed so that the unit transfer shuttle 30 moves forward and backward in a horizontal direction parallel to the bottom of the structure and perpendicular to the vacuum suction plate 11, and perpendicular to the unit transfer shuttle 30.
  • the frame 35 is perpendicular to the traveling direction of the unit transfer shuttle 30 and remains upright from the bottom of the structure, and the taping unit 50 rides on the vertical frame 35 and is parallel to the vacuum suction plate 11. And descending in one vertical direction.
  • the clamping portion 20 the back plate for supporting the vacuum suction plate 11 (
  • a horizontal cylinder 22 reciprocating in the outer radial direction and a horizontal piston forward and backward in the horizontal direction by the horizontal cylinder body 22 and parallel to the tip of the horizontal piston It comprises a clamper 21 for clamping while reversing the sides.
  • the horizontal cylinder body 22 passes through the horizontal piston to the clamper 21. Advance the front of the substrate.
  • the radial cylinder 25 again contracts the horizontal cylinder body 22 in the inner radial direction through the radial piston 26, the horizontal cylinder body 22 contracts the horizontal piston to form the clamper 21. The substrate is clamped by rewinding.
  • the forming unit 40 includes a knife for forming a scratch on the film while moving in a straight path, a rotor 41 for forming a scratch on the film while the knurled surface is rotated, or a non-contact forming a scratch on the film. It is preferable that it is one selected from a laser.
  • the rotor 41 having a knurled surface is rotatably fixed to the mounting block 43 fixed to the lifting plate 60.
  • the tape is mounted on the elevating plate 60 to be elevated along the vertical frame 35
  • the unit 50 includes a supply roll 51 on which the main body of the tape T is rotatably mounted, a tape support 52 for supporting the opposite side of the adhesive surface of the released tape T, and a supply roll 51.
  • the drive recovery roll 53 for pulling the tape T past the tape support 52, and the tape T released between the tape support 52, the supply roll 51 and the drive recovery roll 53. It includes a guide roll (R) to support and guide the opposite side of the adhesive surface.
  • the taping unit 50 also includes the feed roll before the lifting plate 60 is lowered to peel off the film after the tape T adheres to the film scratch portion of the substrate. And a pressure gripping roll 55 for pressurizing and fixing the feed roll 51 such that the tape T is no longer released from the feed roll 51 when the film 51 is pressed to release the film.
  • the drive recovery roll 53 rotates the drive motor 54 forward and reverse.
  • the pressing gripping roll 55 is mounted on the second auxiliary support (56)
  • the second auxiliary support 56 is lifted and lifted by a pneumatic cylinder, and the drive recovery roll 53 is a preliminary peeling to separate a square corner portion of the film from the substrate after the tape T adheres to the film scratch of the substrate. It is preferable to repeat the tape winding and unwinding.
  • a method for peeling and an upright peeling device for a substrate protective film for a semiconductor which can reduce the conveyance step of the substrate and the transporting amount of the peeling device, thereby making the device compact and compact, thereby enabling excellent peeling and complete peeling.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

Cette invention concerne un procédé de séparation verticale pour un film de protection de substrat semi-conducteur, comprenant : une étape d'aspiration et de maintien (S10) à laquelle, lorsqu'un substrat (S) auquel est fixé un film est chargé sur une plaque d'aspiration sous vide (10), la plaque d'aspiration sous vide (11) aspire le substrat (S) et dispositif de serrage (21) serre le bord du substrat (S) ; une étape d'avancement d'unité (S20) à laquelle une navette de transfert d'unité (30) sur laquelle sont montées une unité de formation de fente (40) et une unité de collage par bande adhésive (50) se déplace vers l'avant ; une étape de formation de fente (S30) à laquelle l'unité de formation de fente (40) forme une section de fente sur la périphérie du film (F) fixé au substrat (S), ladite section de fente aidant à la séparation du film ; une étape préliminaire de séparation de film (S40) à laquelle l'unité de collage par ruban adhésif (50) se déplace vers l'arrière après l'encollage de la section de fente sur le substrat (S) et sépare la périphérie du film (F) dudit substrat ; une étape de séparation de film (S50) à laquelle l'unité de collage par ruban adhésif (50) sépare le film du substrat fixe tout en se déplaçant vers le bas le long d'un cadre vertical (35) de la navette de transfert d'unité (30) ; et une étape de retour (S60) à laquelle l'unité de collage par ruban adhésif (50) se déplace à nouveau vers le haut et la navette de transfert d'unité (40) se déplace vers l'arrière et revient à la position initiale.
PCT/KR2014/005234 2014-04-29 2014-06-16 Procédé de séparation verticale pour film de protection de substrat semi-conducteur et appareil de séparation verticale pour celui-ci WO2015167070A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020140051182A KR101454172B1 (ko) 2014-04-29 2014-04-29 반도체용 기판 보호필름의 직립식 박리 방법 및 직립식 박리 장치
KR10-2014-0051182 2014-04-29

Publications (1)

Publication Number Publication Date
WO2015167070A1 true WO2015167070A1 (fr) 2015-11-05

Family

ID=51998609

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2014/005234 WO2015167070A1 (fr) 2014-04-29 2014-06-16 Procédé de séparation verticale pour film de protection de substrat semi-conducteur et appareil de séparation verticale pour celui-ci

Country Status (2)

Country Link
KR (1) KR101454172B1 (fr)
WO (1) WO2015167070A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101611172B1 (ko) 2015-03-20 2016-04-12 연세대학교 산학협력단 인쇄 회로 기판 보호 필름 제거 방법 및 장치
CN106129475B (zh) * 2016-06-29 2023-09-29 湖南携赢动力科技有限公司 一种用于锂电池的自动撕膜装置
KR102041553B1 (ko) * 2017-11-29 2019-11-06 코스텍시스템(주) 임시접합필름 박리장치 및 방법
KR102458941B1 (ko) * 2021-04-08 2022-10-25 (주)한빛테크놀로지 반도체 인쇄회로기판의 보호필름 자동박리기 및 자동박리방법

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101119571B1 (ko) * 2011-09-19 2012-03-06 주식회사 코엠에스 반도체 인쇄회로기판의 보호필름 자동박리기 및 필름 박리방법
KR20130041582A (ko) * 2011-10-17 2013-04-25 주식회사 에스에프에이 편광판 부착 장치
KR20130041583A (ko) * 2011-10-17 2013-04-25 주식회사 에스에프에이 편광판 부착 시스템
KR20140046825A (ko) * 2012-10-11 2014-04-21 주식회사 에스에프에이 기능성 필름 부착장치

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101119571B1 (ko) * 2011-09-19 2012-03-06 주식회사 코엠에스 반도체 인쇄회로기판의 보호필름 자동박리기 및 필름 박리방법
KR20130041582A (ko) * 2011-10-17 2013-04-25 주식회사 에스에프에이 편광판 부착 장치
KR20130041583A (ko) * 2011-10-17 2013-04-25 주식회사 에스에프에이 편광판 부착 시스템
KR20140046825A (ko) * 2012-10-11 2014-04-21 주식회사 에스에프에이 기능성 필름 부착장치

Also Published As

Publication number Publication date
KR101454172B1 (ko) 2014-10-30

Similar Documents

Publication Publication Date Title
KR101119571B1 (ko) 반도체 인쇄회로기판의 보호필름 자동박리기 및 필름 박리방법
WO2015167070A1 (fr) Procédé de séparation verticale pour film de protection de substrat semi-conducteur et appareil de séparation verticale pour celui-ci
TW200809996A (en) ACF attachment device and ACF attachment method
CN211128456U (zh) 一种fpc覆膜机
CN105620004A (zh) 贴合设备
TW201320852A (zh) 基板保護膜之剝離裝置和基板保護膜之剝離方法
CN103945649A (zh) 一种用于柔性电路板的胶片自动贴敷设备
KR20010112607A (ko) 전자 기기, 표시 패널의 조립 장치 및 조립 방법
CN108662975B (zh) 产品检测装置及产品检测系统
CN204046941U (zh) 一种用于柔性电路板的胶片自动贴敷设备
KR101320773B1 (ko) 디에프에스알용 필링시스템
KR20140111908A (ko) 캐리어 테이프의 자동 공급 장치
CN211070663U (zh) 一种用于控制板的点胶机
CN209757744U (zh) 一种lcm与屏幕的贴合装置
KR102458941B1 (ko) 반도체 인쇄회로기판의 보호필름 자동박리기 및 자동박리방법
KR20110029715A (ko) 커버 테이프 분리 유닛 및 이를 갖는 이송 테이프 연결 장치
CN115691339A (zh) 一种柔性屏的预弯曲设备
KR101885683B1 (ko) 인쇄회로기판 고정용 테이프 배출장치
KR101885676B1 (ko) 인쇄회로기판 고정용 테이프 자동 제거장치
KR101543786B1 (ko) 반도체용 기판 보호필름의 직립식 박리 방법 및 직립식 박리 장치
KR20030060471A (ko) 반도체 팩키지 제조용 테이프 커버 박리 장치 및, 테이프커버 박리 방법
CN209851770U (zh) 背光源预处理装置
CN110594255B (zh) 用于组装背光模组的治具和背光模组的组装方法
KR20110044845A (ko) 이송 테이프 연결 장치
KR100771338B1 (ko) 회로기판의 보호 시트 박리장치

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 14890866

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 10/02/2017)

122 Ep: pct application non-entry in european phase

Ref document number: 14890866

Country of ref document: EP

Kind code of ref document: A1