WO2015165319A1 - 侧出声扬声器模组 - Google Patents

侧出声扬声器模组 Download PDF

Info

Publication number
WO2015165319A1
WO2015165319A1 PCT/CN2015/075664 CN2015075664W WO2015165319A1 WO 2015165319 A1 WO2015165319 A1 WO 2015165319A1 CN 2015075664 W CN2015075664 W CN 2015075664W WO 2015165319 A1 WO2015165319 A1 WO 2015165319A1
Authority
WO
WIPO (PCT)
Prior art keywords
module
cavity
speaker
shell
sound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2015/075664
Other languages
English (en)
French (fr)
Inventor
苗青
刘华伟
张怀省
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Goertek Inc
Original Assignee
Goertek Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Goertek Inc filed Critical Goertek Inc
Priority to US15/308,056 priority Critical patent/US10003870B2/en
Priority to KR1020167031038A priority patent/KR101853645B1/ko
Publication of WO2015165319A1 publication Critical patent/WO2015165319A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2807—Enclosures comprising vibrating or resonating arrangements
    • H04R1/2815—Enclosures comprising vibrating or resonating arrangements of the bass reflex type
    • H04R1/2823—Vents, i.e. ports, e.g. shape thereof or tuning thereof with damping material
    • H04R1/2826—Vents, i.e. ports, e.g. shape thereof or tuning thereof with damping material for loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/021—Casings; Cabinets ; Supports therefor; Mountings therein incorporating only one transducer
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/025—Arrangements for fixing loudspeaker transducers, e.g. in a box, furniture
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2807—Enclosures comprising vibrating or resonating arrangements
    • H04R1/2838—Enclosures comprising vibrating or resonating arrangements of the bandpass type
    • H04R1/2842—Enclosures comprising vibrating or resonating arrangements of the bandpass type for loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/32—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only
    • H04R1/323—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only for loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2869—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself
    • H04R1/2884—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself by means of the enclosure structure, i.e. strengthening or shape of the enclosure
    • H04R1/2888—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself by means of the enclosure structure, i.e. strengthening or shape of the enclosure for loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers

Definitions

  • the present invention relates to the field of speaker technology, and more particularly to a side-out sound speaker module.
  • Speaker modules which are important acoustic components in portable electronic products, have a wide range of demands. As the demand for portable electronic products has increased, the acoustic performance of speaker modules has received increasing attention.
  • FIG. 1 is a schematic structural view of a conventional side sound speaker module.
  • the existing side sound speaker module comprises a speaker unit 1 and a module housing for housing the fixed speaker unit.
  • the module housing comprises a module lower shell 2, a module middle shell 3 and a mold.
  • the space formed by the upper shell 4, the speaker unit 1, the module middle shell 3 and the module lower shell 2 is the rear sound chamber 7, and the speaker unit 1, the module middle shell 3 and the module upper shell 4 are formed.
  • the space is the front sound chamber 6, and a sound hole is opened at a position of the module 3 near the front sound chamber 6, and the front sound chamber 6 communicates with the sound hole. Since the position of the speaker unit 1 is limited by the position of the sound hole, a certain space is often left above the speaker unit.
  • the current common method is to avoid the necessary front cavity and to avoid The plastic casing shrinks, and the remaining space is often treated by local de-compacting, so that the remaining space cannot be utilized, which causes waste of the acoustic cavity space of the side-sounding speaker module and affects the acoustic performance of the side-sounding speaker module.
  • an object of the present invention is to provide a side-sounding speaker module to solve the problem that the side-sounding speaker module cannot utilize the excess space of the upper casing of the module.
  • the side sounding speaker module comprises a speaker unit and a module housing for accommodating the speaker unit;
  • the module housing comprises a module lower shell, a module middle shell and a module upper shell;
  • the speaker unit The space formed between the module middle case and the lower case of the module is a rear sound cavity, and a space formed between the speaker unit, the module middle case and the upper case of the module is a front sound cavity, wherein
  • the side sound speaker module further includes a cover plate that is fastened to the top of the upper shell of the module, and forms a cavity with the upper shell of the module, and is disposed at a position where the upper shell of the module forming the cavity is in contact with the rear sound chamber
  • the through hole is used for connecting the cavity and the rear acoustic cavity, and separating the front acoustic cavity and the rear acoustic cavity by sealing the through hole.
  • a cover plate is formed on the top of the upper shell of the module, so that the upper shell of the module forms a cavity, and then the cavity is opened with the rear sound cavity, thereby increasing the rear sound cavity.
  • the volume enhances the acoustic performance of the side-sounding speaker module, and avoids the effect of the partial-reduction mode on the appearance of the speaker module.
  • the sound emitted by the speaker module forms a filter that smoothes the sound quality curve. To make the sound more pleasant.
  • FIG. 1 is a schematic structural view of a conventional side sounding speaker module
  • FIG. 2 is a schematic structural view of a side sounding speaker module according to a first embodiment of the present invention
  • Figure 3 is a cross-sectional view taken along line A-A of Figure 2;
  • Figure 4 is a cross-sectional view taken along line B-B of Figure 2;
  • FIG. 5 is a schematic structural diagram of a side sounding speaker module according to a second embodiment of the present invention.
  • Figure 6 is a cross-sectional view taken along line A-A of Figure 5;
  • Figure 7 is a cross-sectional view taken along line B-B of Figure 5.
  • the reference numerals include: speaker unit 1, module lower case 2, module middle case 3, module upper case 4, sound hole 5, front sound chamber 6, rear sound chamber 7, cover plate 8, diaphragm 9
  • speaker unit 1 module lower case 2, module middle case 3, module upper case 4, sound hole 5, front sound chamber 6, rear sound chamber 7, cover plate 8, diaphragm 9
  • module lower case 2 module middle case 3
  • module upper case 4 sound hole 5
  • front sound chamber 6 rear sound chamber 7, cover plate 8
  • diaphragm 9 The via hole 10, the cavity 11, the card slots 12 to 14, and the fixing ribs 15.
  • the present invention increases the volume of the rear sound chamber by converting the excess space of the upper shell of the module into the rear sound cavity.
  • the specific embodiment details how to increase the volume of the rear acoustic cavity by using the excess space of the upper casing of the module.
  • FIGS. 2, 3 and 4 respectively show a structure of a side-out sound speaker module according to a first embodiment of the present invention, a cross-sectional view taken along line A-A of Fig. 2, and a cross-sectional view taken along line B-B of Fig. 2.
  • the side sound speaker module provided in the first embodiment of the present invention comprises a speaker unit 1 and a module housing for accommodating the speaker unit 1.
  • the speaker unit comprises a diaphragm 9
  • the module housing comprises a module lower shell 2, a module middle shell 3 and a module upper shell 4 which are sequentially combined.
  • a cover 8 is arranged on the top of the upper shell 4 of the module for fastening to the four sides of the upper shell 4 of the module.
  • a cavity 11 is formed with the module upper case 4.
  • the cover plate 8 may be a thin plate having a certain strength.
  • a metal piece or an alloy piece having a certain strength is used as the cover plate 8, such as a steel piece or an iron piece.
  • a copper sheet or the like can ensure the strength while reducing the thickness of the cover 8.
  • PET or other resin materials can be used.
  • the side wall of the case 3 in the module is provided with a recessed card slot 12, and the module lower case 2 is buckled at the bottom of the module middle case 3 through the card slot 12;
  • the material is formed into a concave card slot 13 , and the module upper case 4 is buckled at the top of the module middle case 3 through the card slot 13 .
  • a stepped fixing rib 15 protruding from the inner wall of the shell 3 of the module is disposed at a position in the middle of the shell 3 of the module, and the speaker unit 1 is fastened by the fixing rib 15 at a position in the middle of the shell 3 of the module;
  • the rib 15 is integrally formed with the module middle case 3.
  • the lower side of the diaphragm 9 is formed by the space surrounded by the speaker unit 1, the module lower shell 2, and the module middle shell 3, and the rear sound chamber 7 is formed; the upper side of the diaphragm 9 and the bottom of the module upper shell 4
  • a front acoustic cavity 6 is formed between the sides; the fixed rib 15 separates the front acoustic cavity from the rear acoustic cavity.
  • the cavity 11 and the rear acoustic cavity 7 are separated by the bottom wall of the module upper case 4.
  • the rear acoustic cavity 7 is connected to the cavity 11 on the bottom wall of the module upper case 4.
  • a through hole 10 is opened at the position, and the cavity 11 and the rear acoustic cavity 7 are electrically connected, and the cavity 11 is used as a rear acoustic cavity, thereby expanding the volume of the rear acoustic cavity.
  • the through hole 10 is not opened after the assembly of the module upper case 4 and the module middle case 3, but is pre-installed in the module middle case 3 and the module upper case 4 respectively.
  • the module middle case 3 and the opening of the module upper case 4 are correspondingly bonded and sealed to form the via hole 10.
  • the rear acoustic cavity of the speaker module needs to be sealed, it is necessary to completely seal the contact portion between the front acoustic cavity and the rear acoustic cavity of the speaker module, and the position of the module upper shell 4 and the module middle shell 3 is buckled, and the module middle shell 3
  • the position of the buckle of the lower shell of the module 2, the position of the latch of the speaker unit 1 and the middle shell of the module 3 can be sealed by ultrasonic welding or glue or crimping, and at the same time, the cover 8 and the upper shell of the module 4
  • the position of the fastening needs to be sealed, and the position where the cover 8 is engaged with the upper casing 4 of the module can also be sealed by ultrasonic welding or gluing or crimping.
  • the cavity 11 and the front acoustic cavity are also isolated structures.
  • a sound hole 5 is also opened in the middle of the module 3 near the front sound chamber 6.
  • the front sound chamber 6 communicates with the sound hole 5 for guiding the sound signal emitted by the speaker module.
  • the first embodiment of the present invention forms a cavity with the upper casing of the module by forming a cover plate above the upper casing of the module, and then The cavity and the rear sound cavity are opened, and the excess space of the upper shell of the module is converted into the rear sound cavity, so that the volume of the rear sound cavity is maximized, and the bass effect is better as the volume of the rear sound cavity is larger. Therefore, the embodiment of the present invention provides The side-sound speaker module achieves good acoustic performance.
  • FIG. 6, and FIG. 7 respectively show a structure of a side-out sound speaker module according to a second embodiment of the present invention, a cross-sectional view taken along line A-A of FIG. 5, and a cross-sectional view taken along line B-B of FIG. 5.
  • the side speaker module provided by the second embodiment of the present invention includes the speaker unit 1 and the module housing for accommodating the speaker unit;
  • the module housing comprises a module lower shell 2, a module middle shell 3 and a module upper shell 4.
  • the module upper case 4 is a top open cavity formed by four side walls and a bottom wall, and a card slot 14 is formed on the four side walls of the module upper case 4 to form a recessed recess.
  • the cover 8 is firmly fastened to the top end of the upper cover 4 of the module to form a cavity 11.
  • the cover 8 can be fastened to the top of the upper cover 4 of the module by ultrasonic welding or gluing or crimping. To complete the seal of the top of the cavity 11.
  • the cover plate 8 may be a thin plate having a certain strength, and a thin plate having a certain strength such as a metal piece or an alloy piece having a certain strength is used as the cover plate 8, such as steel sheet and iron. Sheets, copper sheets, etc., can ensure the strength while reducing the thickness of the cover 8.
  • the cover 8 can also be made of PET or other resin materials.
  • a card slot 12 is formed at the bottom of the side wall of the module 3 to form a recess, and the module lower case 2 is fastened by the card slot 12 at the bottom of the module middle shell 3; at the top of the side wall of the shell 3 of the module, a card slot 13 is formed, and the module upper shell 4 passes through the card slot 13
  • the buckle is at the position of the top of the casing 3 in the module.
  • the module upper shell 4 can be snapped on the top of the module middle shell 3 by ultrasonic welding or gluing or crimping, and the module lower shell 2 can also be sealed by ultrasonic welding or gluing or crimping. Buckle the bottom of the case 3 in the module.
  • a stepped fixing rib 15 protruding from the inner wall of the shell 3 of the module is disposed at a position in the middle of the middle portion of the module 3 for fixing the speaker unit 1 at a position in the middle of the shell 3 of the module, and the fixing rib 15 It is integrally formed with the module middle case 3.
  • the space between the speaker unit 1, the module lower case 2, the module middle case 3 and the fixing rib 15 forms a rear acoustic cavity 7, between the speaker unit 1, the fixed rib 15 and the bottom edge of the module upper case 4
  • Forming the front acoustic cavity 6, the fixed rib 15 separates the front acoustic cavity 6 and the rear acoustic cavity 7, and at the same time, the top end of the fixed rib is connected to the bottom edge of the upper casing 4 of the module, and the cavity 11 and the rear acoustic cavity 7 pass through the die.
  • a via hole 10 is opened at a position where the rear acoustic cavity 7 of the bottom edge of the module upper case 4 is in contact with the cavity 11, and the cavity 11 and the rear acoustic cavity 7 are opened. Conduction forms a large rear cavity.
  • the top end of the cavity 11 is also sealed, so that the cavity 11 and the rear sound cavity 7 are electrically connected to form a large rear sound cavity. It is sealed so that the sealed large rear sound chamber is separated from the front sound chamber 6.
  • a sound hole 5 is also opened in the middle of the module 3 near the front sound chamber 6.
  • the front sound chamber 6 communicates with the sound hole 5 for guiding the sound signal emitted by the speaker module.
  • the first embodiment and the second embodiment of the present invention describe the side-sounding speaker module provided by the present invention.
  • the upper casing of the module forms a cavity, and then the cavity is After the sound chamber is opened, the volume of the rear sound chamber is increased, the acoustic performance of the side sound speaker module is improved, and the influence of the partial rubber reduction mode on the appearance of the speaker module is avoided, and the sound generated by the speaker module is formed to some extent.
  • the function of the filter can smooth the sound quality curve and make the sound more pleasant.

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Health & Medical Sciences (AREA)
  • Otolaryngology (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)

Abstract

本发明提供的侧出声扬声器模组，包括扬声器单体和收容扬声器单体的模组壳体；模组壳体包括模组下壳、模组中壳和模组上壳；扬声器单体、模组中壳和模组下壳之间形成的空间为后声腔，扬声器单体、模组中壳和模组上壳之间形成的空间为前声腔；侧出声扬声器模组还包括盖板，盖板扣合在模组上壳的顶部，与模组上壳形成腔体，在模组上壳与后声腔相接的位置开设有导通孔，导通孔用于连通腔体与后声腔，通过密封导通孔分离前声腔和后声腔。利用上述根据本发明提供的侧出声扬声器模组，能够将模组上壳多余的空间转换成后声腔，从而增加后声腔的体积，提升扬声器模组的声学性能。

Description

侧出声扬声器模组 技术领域
本发明涉及扬声器技术领域，更为具体地，涉及一种侧出声扬声器模组。
背景技术
随着社会的进步和科学技术的快速发展，便携式电子产品逐渐兴起，以其携带方便、功能全面，能够满足人们上网、通信及娱乐等多方面的需求而倍受欢迎，如手机、ipad等。作为便携式电子产品中重要声学部件的扬声器模组具有广泛的需求，随着人们对便携式电子产品要求的提高，扬声器模组的声学性能也越来越受到人们的关注。
图1示出了现有的侧出声扬声器模组的结构示意图。如图1所示，现有的侧出声扬声器模组包括扬声器单体1和收容固定扬声器单体的模组壳体，模组壳体包括模组下壳2、模组中壳3和模组上壳4，扬声器单体1、模组中壳3和模组下壳2之间形成的空间为后声腔7，扬声器单体1、模组中壳3和模组上壳4之间形成的空间为前声腔6，在模组中壳3靠近前声腔6的位置开设有出声孔，前声腔6与出声孔连通。由于扬声器单体1的位置受到出声孔位置的限制，导致扬声器单体上方常常留有一定的空间，对于此空间的处理，目前常用的方式为，在留出必要的前声腔后，为了避免塑胶外壳缩水，往往采用局部减胶的方式处理剩余的空间，导致剩余的空间无法被利用，这样就造成侧出声扬声器模组的声腔空间的浪费，影响侧出声扬声器模组的声学性能。
因此，需要一种能够充分利用声腔空间的新的侧出声扬声器模组的技术方案。
发明内容
鉴于上述问题，本发明的目的是提供一种侧出声扬声器模组，以解决侧出声扬声器模组无法利用模组上壳多余空间的问题。
本发明提供的侧出声扬声器模组，包括扬声器单体和收容扬声器单体的模组壳体；模组壳体包括模组下壳、模组中壳和模组上壳；扬声器单体、模组中壳和模组下壳之间形成的空间为后声腔，扬声器单体、模组中壳和模组上壳之间形成的空间为前声腔，其中，
侧出声扬声器模组还包括盖板，盖板扣合在模组上壳的顶部，与模组上壳形成腔体，在形成腔体的模组上壳与后声腔相接的位置开设有导通孔，导通孔用于连通腔体与后声腔，通过密封导通孔分离前声腔和后声腔。
利用上述根据本发明提供的侧出声扬声器模组，通过在模组上壳的顶部增加盖板，使模组上壳形成腔体，再将该腔体与后声腔打通，从而增大后声腔的体积，提高侧出声扬声器模组的声学性能，而且避免局部减胶方式对扬声器模组外观产生的影响，在一定程度上对扬声器模组发出的声音形成滤波器的作用，可以平滑音质曲线，使声音更加悦耳。
为了实现上述以及相关目的，本发明的一个或多个方面包括后面将详细说明并在权利要求中特别指出的特征。下面的说明以及附图详细说明了本发明的某些示例性方面。然而，这些方面指示的仅仅是可使用本发明的原理的各种方式中的一些方式。此外，本发明旨在包括所有这些方面以及它们的等同物。
附图说明
通过参考以下结合附图的说明及权利要求书的内容，并且随着对本发明的更全面理解，本发明的其它目的及结果将更加明白及易于理解。在附图中：
图1为现有的侧出声扬声器模组的结构示意图；
图2为根据本发明实施例一的侧出声扬声器模组的结构示意图；
图3为沿图2中A-A线的剖视图；
图4为沿图2中B-B线的剖视图；
图5为根据本发明实施例二的侧出声扬声器模组的结构示意图；
图6为沿图5中A-A线的剖视图；
图7为沿图5中B-B线的剖视图。
在所有附图中相同的标号指示相似或相应的特征或功能。
其中的附图标记包括：扬声器单体1、模组下壳2、模组中壳3、模组上壳4、出声孔5、前声腔6、后声腔7、盖板8、振膜9、导通孔10、腔体11、卡槽12～14、固定筋15。
具体实施方式
在下面的描述中，出于说明的目的，为了提供对一个或多个实施例的全面理解，阐述了许多具体细节。然而，很明显，也可以在没有这些具体细节的情况下实现这些实施例。在其它例子中，为了便于描述一个或多个实施例，公知的结构和设备以方框图的形式示出。
以下将结合附图对本发明的具体实施例进行详细描述。
针对现有的侧出声扬声器模组不能利用模组上壳多余空间的问题，本发明通过将模组上壳多余的空间转换成后声腔，从而增大后声腔的体积，下面将以两个具体实施例对如何利用模组上壳多余的空间增大后声腔的体积进行详细地说明。
实施例一
图2、图3和图4分别示出了根据本发明实施例一的侧出声扬声器模组的结构、沿图2中A-A线的剖视图和沿图2中B-B线的剖视图。
如图2、图3和图4所示，本发明实施例一提供的侧出声扬声器模组，包括扬声器单体1和收容扬声器单体1的模组壳体，扬声器单体包括振膜9，模组壳体包括依次结合的模组下壳2、模组中壳3和模组上壳4。
在模组上壳4留出前声腔后，为了利用模组上壳4多余的空间，在模组上壳4的顶部设置一个盖板8，用于扣合在模组上壳4的四个侧壁的卡槽14上，与模组上壳4形成腔体11。
需要说明的是，盖板8可以为具有一定强度的薄板，作为本发明实施例一的一个具体实施方式，采用具有一定强度的金属片或合金片作为盖板8，例如钢片、铁片、铜片等，可以保证强度的同时减小盖板8的厚度。同样，也可以采用PET或其他树脂材料。
为了将模组下壳2牢固地卡扣在模组中壳3的底部，在模组中壳3侧壁 底部的位置设置有去料形成内凹的卡槽12，模组下壳2通过卡槽12卡扣在模组中壳3底部的位置上；在模组中壳3侧壁顶部的位置设置有去料形成内凹的卡槽13，模组上壳4通过卡槽13卡扣在模组中壳3顶部的位置上。
在模组中壳3中部的位置设置有突出于该模组中壳3内壁的阶梯型的固定筋15，扬声器单体1通过固定筋15卡扣在模组中壳3中部的位置上；固定筋15与模组中壳3一体形成。
其中，振膜9下侧由扬声器单体1、模组下壳2、模组中壳3围成的空间形成后声腔7；振膜9上侧扬声器单体1和模组上壳4的底边之间形成前声腔6；固定筋15将前声腔和后声腔分隔开。腔体11与后声腔7通过模组上壳4的底壁分离，为了将腔体11与后声腔7导通，在模组上壳4的底壁上后声腔7与腔体11相接的位置开设一个导通孔10，将腔体11与后声腔7导通，将腔体11作为后声腔使用，从而扩大了后声腔的体积。
需要说明的是，由于扬声器模组大部分部件由塑料材质制成，在模组壳体装配完成后很难进行二次加工，扬声器模组本身空间的限制也对模组壳体装配完成后的二次加工产生难度，因此，开设的导通孔10并不是在模组上壳4与模组中壳3装配完成后开设的，而是预先在模组中壳3与模组上壳4各自的预定位置上开孔，然后在模组中壳3与模组上壳4装配时，将模组中壳3与模组上壳4的开孔对应粘合密封形成导通孔10。
由于扬声器模组的后声腔需要密封，所以需要将扬声器模组的前声腔和后声腔接触的部分全部密封，上述模组上壳4与模组中壳3卡扣的位置、模组中壳3与模组下壳2卡扣的位置、扬声器单体1与模组中壳3卡扣的位置可以通过超声焊接或涂胶或压接等方式密封，同时，盖板8与模组上壳4扣合的位置也需要密封，盖板8与模组上壳4扣合的位置同样可以通过超声焊接或涂胶或压接等方式密封。同样，腔体11也前声腔也是相互隔离的结构。
在模组中壳3靠近前声腔6的位置还开设有出声孔5，前声腔6与出声孔5连通，用于将发扬声器模组发出的声信号的导出。
上述详细描述了本发明实施例一的侧出声扬声器模组的结构，可以看出，本发明实施例一通过在模组上壳上方设置盖板，与模组上壳形成腔体，再将腔体与后声腔打通，把模组上壳多余的空间转换为后声腔，使后声腔的体积最大化，由于后声腔的体积越大低音效果越好，因此，本发明实施例提供的 侧出声扬声器模组能够达到良好的声学性能。
实施例二
图5、图6和图7分别示出了根据本发明实施例二的侧出声扬声器模组的结构、沿图5中A-A线的剖视图和沿图5中B-B线的剖视图。
如图5、图6和图7所示，本发明实施例二提供的侧出声扬声器模组，同样地，包括扬声器单体1和收容扬声器单体的模组壳体；扬声器单体包括向上的振膜9；模组壳体包括模组下壳2、模组中壳3和模组上壳4。模组上壳4为四个侧壁和一个底壁构成的顶端开放式的腔体，并且，在模组上壳4的四个侧壁上设置有去料形成内凹的卡槽14，用于将盖板8牢固的扣合在模组上壳4的顶端，形成腔体11，盖板8可以通过超声焊接或涂胶或压接等密封方式扣合在模组上壳4的顶端，以完成腔体11顶部的密封。
在本发明实施例二的一个具体实施方式中，盖板8可以为具有一定强度的薄板，采用具有一定强度的金属片或合金片等具有一定强度的薄板作为盖板8，例如钢片、铁片、铜片等，可以保证强度的同时减小盖板8的厚度。除此之外，盖板8也可以采用PET或其他树脂材料。
同样地，为了将模组下壳2牢固地卡扣在模组中壳3的底部，在模组中壳3侧壁底部的位置设置有去料形成内凹的卡槽12，模组下壳2通过卡槽12卡扣在模组中壳3底部的位置上；在模组中壳3侧壁顶部的位置设置有去料形成内凹的卡槽13，模组上壳4通过卡槽13卡扣在模组中壳3顶部的位置上。上述模组上壳4可以通过超声焊接或涂胶或压接等密封方式卡扣在模组中壳3的顶部，模组下壳2也可以通过超声焊接或涂胶或压接等密封方式卡扣在模组中壳3的底部。
在模组中壳3中部的位置设置有突出于该模组中壳3内壁的阶梯型的固定筋15，用于将扬声器单体1固定在模组中壳3中部的位置上，固定筋15与模组中壳3一体成型。
其中，扬声器单体1、模组下壳2、模组中壳3和固定筋15之间的空间形成后声腔7，扬声器单体1、固定筋15和模组上壳4的底边之间形成前声腔6，固定筋15将前声腔6和后声腔7分隔开，同时，固定筋的竖直方向的顶端连接在模组上壳4的底边，腔体11与后声腔7通过模组上壳4的底边分 离，为了将腔体11与后声腔7导通，在模组上壳4的底边的后声腔7与腔体11相接的位置开设一个导通孔10，将腔体11与后声腔7导通形成大后声腔。
由于扬声器单体1和模组下壳2均采用密封的方式卡扣在模组中壳3上，腔体11的顶端也是密封的，所以腔体11与后声腔7导通形成的大后声腔为密封的，因此，密封的大后声腔与前声腔6是分离开的。
在模组中壳3靠近前声腔6的位置还开设有出声孔5，前声腔6与出声孔5连通，用于将扬声器模组发出的声信号的导出。
上述实施例一和实施例二详细地描述了本发明提供的侧出声扬声器模组，通过在模组上壳的顶部增加盖板，使模组上壳形成腔体，再将该腔体与后声腔打通，从而增大后声腔的体积，提高侧出声扬声器模组的声学性能，而且避免局部减胶方式对扬声器模组外观产生的影响，在一定程度上对扬声器模组发出的声音形成滤波器的作用，可以平滑音质曲线，使声音更加悦耳。
如上参照附图以示例的方式描述了根据本发明提出的侧出声扬声器模组。但是，本领域技术人员应当理解，对于上述本发明所提出的侧出声扬声器模组，还可以在不脱离本发明内容的基础上对其中的实现细节做出各种改进。因此，本发明的保护范围应当由所附的权利要求书的内容确定。

Claims (10)

  1. 一种侧出声扬声器模组，包括扬声器单体和收容固定所述扬声器单体的模组壳体；所述模组壳体包括模组下壳、模组中壳和模组上壳；所述扬声器单体、所述模组中壳和所述模组下壳之间形成的空间为后声腔，所述扬声器单体、所述模组中壳和所述模组上壳之间形成的空间为前声腔，其特征在于，
    所述侧出声扬声器模组还包括盖板，所述盖板扣合在所述模组上壳的顶部，与所述模组上壳形成独立的腔体，在形成所述腔体的模组上壳的底部与所述后声腔相接的位置开设有导通孔，所述导通孔用于连通所述腔体与所述后声腔。
  2. 如权利要求1所述的侧出声扬声器模组，其中，
    在所述模组中壳的底部和顶部位置分别设置有卡槽，所述模组下壳卡扣在所述模组中壳的底部的卡槽上，所述模组上壳卡扣在所述模组中壳的顶部的卡槽上。
  3. 如权利要求2所述的侧出声扬声器模组，其中，
    所述卡槽为通过去料形成的内凹型卡槽。
  4. 如权利要求2所述的侧出声扬声器模组，其中，在所述模组中壳的中部位置设置有固定筋，用于固定所述扬声器单体。
  5. 如权利要求4所述的侧出声扬声器模组，其中，
    所述扬声器单体包括向上设置的振膜，所述向上设置的振膜卡扣在所述固定筋上。
  6. 如权利要求4所述的侧出声扬声器模组，其中，
    所述扬声器单体包括向下设置的振膜，所述向下设置的振膜卡扣在所述固定筋上。
  7. 如权利要求4～6中任一项所述的侧出声扬声器模组，其中，
    所述固定筋为阶梯型的固定筋。
  8. 如权利要求6所述的侧出声扬声器模组，其中，
    所述模组上壳与模组中壳卡扣的位置、模组中壳与模组下壳卡扣的位置、扬声器单体与模组中壳卡扣的位置通过超声焊接或涂胶或压接的方式密封。
  9. 如权利要求1所述的侧出声扬声器模组，其中，
    所述盖板为钢片或PET。
  10. 如权利要求1所述的侧出声扬声器模组，其中，
    在所述模组中壳靠近所述前声腔的位置开设有出声孔，所述出声孔与所述前声腔连通。
PCT/CN2015/075664 2014-04-30 2015-04-01 侧出声扬声器模组 Ceased WO2015165319A1 (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US15/308,056 US10003870B2 (en) 2014-04-30 2015-04-01 Loudspeaker module emitting sound at lateral side
KR1020167031038A KR101853645B1 (ko) 2014-04-30 2015-04-01 측면 사운드 출력 타입 스피커 모듈

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201410182250.1A CN103957487B (zh) 2014-04-30 2014-04-30 侧出声扬声器模组
CN201410182250.1 2014-04-30

Publications (1)

Publication Number Publication Date
WO2015165319A1 true WO2015165319A1 (zh) 2015-11-05

Family

ID=51334693

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2015/075664 Ceased WO2015165319A1 (zh) 2014-04-30 2015-04-01 侧出声扬声器模组

Country Status (4)

Country Link
US (1) US10003870B2 (zh)
KR (1) KR101853645B1 (zh)
CN (1) CN103957487B (zh)
WO (1) WO2015165319A1 (zh)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5987820B2 (ja) * 2013-12-26 2016-09-07 オンキヨー株式会社 スピーカーシステムおよびこれを備える電子機器
CN103957487B (zh) * 2014-04-30 2018-07-27 歌尔股份有限公司 侧出声扬声器模组
CN104105038B (zh) * 2014-07-17 2017-09-22 歌尔股份有限公司 扬声器模组及该扬声器模组的组装方法
CN104185126B (zh) * 2014-09-01 2018-07-06 歌尔股份有限公司 扬声器模组及其组装方法
CN104768088A (zh) * 2015-03-18 2015-07-08 歌尔声学股份有限公司 一种扬声器模组和电子产品
CN109218928B (zh) * 2018-01-10 2024-01-30 歌尔股份有限公司 发声装置
CN108401047A (zh) * 2018-05-08 2018-08-14 西安易朴通讯技术有限公司 电子设备及其前壳装饰件、中框
CN108551635B (zh) 2018-05-28 2020-08-25 歌尔股份有限公司 微型扬声器模组
RU2763813C1 (ru) 2018-06-29 2022-01-11 Хуавэй Текнолоджиз Ко., Лтд. Громкоговоритель и мобильный терминал
CN108989944B (zh) * 2018-08-03 2021-02-19 瑞声光电科技(常州)有限公司 扬声器箱
CN209390328U (zh) * 2018-12-25 2019-09-13 瑞声科技(新加坡)有限公司 扬声器箱
CN110035359B (zh) * 2018-12-30 2021-01-15 瑞声科技(新加坡)有限公司 发声器件
KR20200119105A (ko) * 2019-04-09 2020-10-19 삼성전자주식회사 진동 가능한 시트를 구비한 음향관로를 포함하는 전자 장치
CN110536190A (zh) * 2019-08-30 2019-12-03 歌尔股份有限公司 一种发声装置以及电子产品
CN111131980B (zh) * 2019-12-30 2025-05-06 歌尔科技有限公司 扬声器模组和电子设备
US12149885B2 (en) 2022-09-28 2024-11-19 SimpliSafe, Inc. Speaker device
US12356139B2 (en) 2022-09-28 2025-07-08 SimpliSafe, Inc. Speaker device
US12563336B2 (en) 2022-11-17 2026-02-24 SimpliSafe, Inc. Resonator devices and assemblies thereof
USD1086015S1 (en) 2022-11-17 2025-07-29 SimpliSafe, Inc Resonator device
USD1086016S1 (en) 2022-11-17 2025-07-29 Simplisafe Inc. Resonator device
US12317018B2 (en) * 2023-02-23 2025-05-27 Aac Microtech (Changzhou) Co., Ltd. Cover plate and speaker module

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202773040U (zh) * 2012-09-10 2013-03-06 歌尔声学股份有限公司 扬声器模组
CN103118320A (zh) * 2013-01-18 2013-05-22 歌尔声学股份有限公司 一种超薄扬声器模组
CN203301738U (zh) * 2013-06-29 2013-11-20 歌尔声学股份有限公司 扬声器模组
CN103686550A (zh) * 2013-11-18 2014-03-26 歌尔声学股份有限公司 扬声器模组
CN103686551A (zh) * 2013-11-28 2014-03-26 歌尔声学股份有限公司 发声器件
CN103957487A (zh) * 2014-04-30 2014-07-30 歌尔声学股份有限公司 侧出声扬声器模组
CN203840491U (zh) * 2014-04-30 2014-09-17 歌尔声学股份有限公司 侧出声扬声器模组

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11232833A (ja) * 1998-02-10 1999-08-27 Fujitsu Ltd 記録ディスク装置およびそのカバーシール
KR100658003B1 (ko) * 2004-12-14 2006-12-15 삼성전자주식회사 휴대용 무선단말기의 스피커 모듈을 갖는 악세사리
JP2006191213A (ja) * 2004-12-28 2006-07-20 Citizen Electronics Co Ltd 電気音響変換器及び携帯端末装置
US20060273085A1 (en) * 2005-05-18 2006-12-07 Casto Daniel A Joint for connecting workpieces
KR100849310B1 (ko) * 2006-09-18 2008-07-29 삼성전자주식회사 휴대용 단말기의 스피커 장치
US9154869B2 (en) * 2012-01-04 2015-10-06 Apple Inc. Speaker with a large volume chamber and a smaller volume chamber
CN202818569U (zh) * 2012-09-12 2013-03-20 瑞声光电科技(常州)有限公司 低音箱
CN103618984B (zh) * 2013-12-09 2017-04-26 歌尔股份有限公司 一种扬声器模组及其制造方法
US11056918B2 (en) * 2015-12-11 2021-07-06 Chargedge, Inc. System for inductive wireless power transfer for portable devices

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202773040U (zh) * 2012-09-10 2013-03-06 歌尔声学股份有限公司 扬声器模组
CN103118320A (zh) * 2013-01-18 2013-05-22 歌尔声学股份有限公司 一种超薄扬声器模组
CN203301738U (zh) * 2013-06-29 2013-11-20 歌尔声学股份有限公司 扬声器模组
CN103686550A (zh) * 2013-11-18 2014-03-26 歌尔声学股份有限公司 扬声器模组
CN103686551A (zh) * 2013-11-28 2014-03-26 歌尔声学股份有限公司 发声器件
CN103957487A (zh) * 2014-04-30 2014-07-30 歌尔声学股份有限公司 侧出声扬声器模组
CN203840491U (zh) * 2014-04-30 2014-09-17 歌尔声学股份有限公司 侧出声扬声器模组

Also Published As

Publication number Publication date
US20170070796A1 (en) 2017-03-09
CN103957487B (zh) 2018-07-27
KR101853645B1 (ko) 2018-05-02
US10003870B2 (en) 2018-06-19
CN103957487A (zh) 2014-07-30
KR20160142385A (ko) 2016-12-12

Similar Documents

Publication Publication Date Title
WO2015165319A1 (zh) 侧出声扬声器模组
KR101827664B1 (ko) 단말기 내부 장착용 스피커 모듈
US10674250B2 (en) Speaker box
CN108632728B (zh) 发声器件及便携终端
KR101807276B1 (ko) 음향장치
KR20160134838A (ko) 스피커 모듈
WO2016124041A1 (zh) 扬声器模组
US9621981B2 (en) Speaker box
CN101983514A (zh) 传感信号输出装置
CN108430030B (zh) 扬声器箱及其装配方法
CN204180267U (zh) 扬声器模组
CN107820171B (zh) 扬声器模组
US8411881B2 (en) Electret capacitor microphone with one-piece vocal cavity component
CN205283804U (zh) 扬声器模组
CN208190912U (zh) 扬声器模组
WO2016179997A1 (zh) 扬声器模组
CN210093483U (zh) 扬声器箱
CN105657621B (zh) 一种扬声器组件及移动终端
US20200213696A1 (en) Speaker box
CN208638716U (zh) 扬声器箱
CN108055615B (zh) 扬声器箱
CN211531316U (zh) 扬声器箱
CN203840491U (zh) 侧出声扬声器模组
CN108366334B (zh) 扬声器箱及其制作方法
WO2020133177A1 (zh) 扬声器组件、便携式电子设备及扬声器组件的组装方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 15785688

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 15308056

Country of ref document: US

ENP Entry into the national phase

Ref document number: 20167031038

Country of ref document: KR

Kind code of ref document: A

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205N DATED 09/03/2017)

122 Ep: pct application non-entry in european phase

Ref document number: 15785688

Country of ref document: EP

Kind code of ref document: A1