WO2016179997A1 - 扬声器模组 - Google Patents

扬声器模组 Download PDF

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Publication number
WO2016179997A1
WO2016179997A1 PCT/CN2015/094899 CN2015094899W WO2016179997A1 WO 2016179997 A1 WO2016179997 A1 WO 2016179997A1 CN 2015094899 W CN2015094899 W CN 2015094899W WO 2016179997 A1 WO2016179997 A1 WO 2016179997A1
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WO
WIPO (PCT)
Prior art keywords
module
speaker
housing
metal piece
grounding end
Prior art date
Application number
PCT/CN2015/094899
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English (en)
French (fr)
Inventor
杨赟
韩丹
Original Assignee
歌尔声学股份有限公司
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Publication date
Application filed by 歌尔声学股份有限公司 filed Critical 歌尔声学股份有限公司
Priority to US15/572,142 priority Critical patent/US10582279B2/en
Publication of WO2016179997A1 publication Critical patent/WO2016179997A1/zh

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/06—Arranging circuit leads; Relieving strain on circuit leads
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R3/00—Circuits for transducers, loudspeakers or microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2807—Enclosures comprising vibrating or resonating arrangements
    • H04R1/2811—Enclosures comprising vibrating or resonating arrangements for loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/02—Details casings, cabinets or mounting therein for transducers covered by H04R1/02 but not provided for in any of its subgroups
    • H04R2201/029—Manufacturing aspects of enclosures transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2400/00—Loudspeakers
    • H04R2400/11—Aspects regarding the frame of loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/006—Interconnection of transducer parts
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers

Definitions

  • the present invention relates to the field of electroacoustic products, and in particular to a speaker module.
  • the speaker module is an important acoustic component of a portable electronic device for converting between an electrical signal and a sound signal, and is an energy conversion device.
  • the module housing of the speaker module generally comprises a module upper shell and a module lower shell, and the module upper shell and the module lower shell together enclose a module inner cavity in which the speaker unit is accommodated.
  • the existing speaker module generally includes a module housing and a speaker unit.
  • the module housing defines a module cavity for housing the speaker unit, and the speaker unit separates the module cavity into Front and rear sound chambers.
  • the module housing includes a module upper case and a module lower case, and the speaker unit is generally mounted near the upper case of the module.
  • the mainstream solution of the existing micro-speaker is to replace the plastic housing above the vibration area with the injection-molded steel sheet structure on the plastic housing, which makes the housing satisfy In the case of strength, the thickness of the outer casing can be reduced, and the volume of the inner cavity of the outer casing can be relatively increased, thereby effectively expanding the vibration space of the vibration system.
  • the metal structure of the steel sheet may cause certain interference to the application terminal of the speaker, so that the cooperation between the application terminal and the speaker of the speaker is disturbed and the stability is poor, and the stability of the application terminal of the speaker is lowered. , the quality of the application terminal that affects the speaker.
  • the technical problem to be solved by the present invention is to provide a speaker module that is advantageous for thinning and ensuring stability of the speaker and the application terminal.
  • the technical solution of the present invention is:
  • a speaker module includes a module housing and a speaker unit, wherein the module housing forms a module cavity for housing the speaker unit, and the module housing comprises a module upper shell and a module lower shell.
  • the upper casing of the module is disposed outside the front cover of the speaker unit, and the upper casing of the module is injection-molded with a metal piece, and the metal piece leads to a grounding end for ground connection with an application terminal of the speaker module.
  • the grounding end is fixedly exposed on the upper casing of the module.
  • the grounding end is electrically connected to the metal piece through an electrical connection.
  • the metal piece, the electrical connector and the grounding end are all injection molded on the upper casing of the module, and the grounding end is exposed.
  • the metal piece, the electrical connector and the ground end are of a unitary structure.
  • the metal sheet is a steel sheet.
  • the upper shell of the module is injection-molded with a metal piece, and the metal piece leads out a grounding end for ground connection with the application terminal of the speaker module.
  • the grounding end is disposed on the upper shell of the module, which is relatively firm, and is convenient for grounding connection between the grounding end of the metal piece and the application terminal of the speaker module.
  • FIG. 1 is a schematic top plan view of a speaker module of the present invention
  • Figure 2 is a cross-sectional structural view of Figure 1;
  • Figure 3 is a schematic exploded view of Figure 1;
  • a speaker module includes a module shell and a speaker unit 1 .
  • the module housing forms a module cavity for housing the speaker unit 1
  • the module shell includes a module upper shell 2 .
  • the module lower case 6, the module upper case 2 is disposed outside the front cover of the speaker unit 1, and the upper case 2 of the module is injection-molded with a metal piece.
  • the metal piece is the steel piece 3.
  • the steel sheet 3 leads to a ground terminal 4 for ground connection to the application terminal of the speaker module.
  • the grounding end of the steel sheet 3 is fixedly exposed on the upper casing 2 of the module, which is relatively firm, and the grounding end 4 of the steel sheet 3 is grounded to the application terminal of the speaker module.
  • the grounding end of the steel sheet 3 may adopt a spot weldable structure, a structure that can be fixed by screws, a rivetable structure, a structure that can be connected by a spring piece, a structure in which a shell is made of a conductive adhesive, and other structures that can be fixedly connected. The connection is made to the ground of the application terminal of the speaker module.
  • the grounding end 4 and the steel sheet 3 are electrically connected through the electrical connector 5; the steel sheet 3, the electrical connecting member 5 and the grounding end 4 are all injection molded on the module upper shell 2, and the grounding end 4 is exposed, which is convenient
  • the grounding end 4 of the steel sheet 3 is grounded to the application terminal; the steel sheet 3, the electrical connector 5 and the grounding end 4 are integrated, but are not limited to the integral structure.
  • the upper casing 2 of the module is injection-molded with a steel sheet 3, and the steel sheet 3 leads to a grounding end 4 for ground connection with an application terminal of the speaker module.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
  • Health & Medical Sciences (AREA)
  • Otolaryngology (AREA)
  • Manufacturing & Machinery (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)

Abstract

本发明公开了一种扬声器模组，包括模组外壳及扬声器单体，模组外壳内形成收容扬声器单体的模组内腔，模组外壳包括模组上壳和模组下壳，模组上壳设于扬声器单体的前盖外侧，模组上壳上注塑有金属片，金属片引出有用于与扬声器模组的应用终端接地连接的接地端。本发明的扬声器模组，既利于薄形化、又能保证扬声器与应用终端配合的稳定性。

Description

扬声器模组 技术领域
本发明涉及电声产品技术领域，具体地说，是涉及一种扬声器模组。
背景技术
扬声器模组是便携式电子设备的重要声学部件，用于完成电信号与声音信号之间的转换，是一种能量转换器件。扬声器模组的模组外壳一般包括模组上壳和模组下壳，模组上壳和模组下壳共同围成收容有扬声器单体的模组内腔。
现有的扬声器模组，一般包括模组外壳及扬声器单体，所述模组外壳内形成收容所述扬声器单体的模组内腔，所述扬声器单体将所述模组内腔分隔为前声腔和后声腔。模组外壳包括模组上壳和模组下壳，扬声器单体一般安装于靠近模组上壳的位置。为了增加扬声器单体的振动系统振动区域的空间，现有的微型扬声器的主流解决方法为将振动区域上方的塑料外壳改为在塑料外壳上注塑钢片结构代替，这种外壳结构使得外壳在满足强度的情况下，能够降低外壳的厚度，相对地增大了外壳内腔的体积，从而有效地扩大振动系统的振动空间。但是外壳上注塑设置钢片后，钢片的金属结构会对扬声器的应用终端造成一定的干扰，使得扬声器的应用终端与扬声器之间的配合受到干扰而稳定性差，降低扬声器的应用终端的稳定性，影响扬声器的应用终端的质量。
发明内容
本发明所要解决的技术问题是：提供一种既利于薄形化、又能保证扬声器与应用终端配合的稳定性的扬声器模组。
为解决上述技术问题，本发明的技术方案是：
一种扬声器模组，包括模组外壳及扬声器单体，所述模组外壳内形成收容所述扬声器单体的模组内腔，所述模组外壳包括模组上壳和模组下壳，所述模组上壳设于所述扬声器单体的前盖外侧，所述模组上壳上注塑有金属片，所述金属片引出有用于与扬声器模组的应用终端接地连接的接地端。
优选的，所述接地端固定外露设于所述模组上壳上。
优选的，所述接地端与所述金属片通过电连接件电连接。
优选的，所述金属片、所述电连接件以及所述接地端均注塑于所述模组上壳上，且所述接地端外露设置。
优选的，所述金属片、所述电连接件以及所述接地端为一体结构。
优选的，所述金属片为钢片。
采用了上述技术方案后，本发明的有益效果是：
本发明的扬声器模组，模组上壳上注塑有金属片，金属片引出有用于与扬声器模组的应用终端接地连接的接地端。将这种结构的扬声器模组安装到应用终端使用时，能够有效地抑制消除金属片的金属结构对应用终端的干扰，保证扬声器模组与应用终端之间配合的稳定性，保证扬声器模组的应用终端的质量。
本发明中，接地端设于所述模组上壳上，比较牢固，方便了金属片的接地端与扬声器模组的应用终端接地连接。
附图说明
图1是本发明的扬声器模组的俯视结构示意图；
图2是图1的剖视结构示意图；
图3是图1的分解结构示意图；
图中：1、扬声器单体；2、模组上壳；3、钢片；4、接地端；5、电连接件；6、模组下壳。
具体实施方式
为了使本发明的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本发明进行进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，且不用于限定本发明。
参照图1、图2以及3，一种扬声器模组，包括模组外壳及扬声器单体1，模组外壳内形成收容扬声器单体1的模组内腔，模组外壳包括模组上壳2和模组下壳6，模组上壳2设于扬声器单体1的前盖外侧，模组上壳2上注塑有金属片，本实施例中，金属片为钢片3。钢片3引出有用于与扬声器模组的应用终端接地连接的接地端4。
钢片3的接地端固定外露设于模组上壳2上，比较牢固，方便了钢片3的接地端4与扬声器模组的应用终端接地连接。钢片3的接地端可以采用可点焊结构、可以使用螺丝固定的结构、可铆接的结构、可以采用弹片接触连接的结构、壳采用导电胶配合的结构、以及其它的可固定连接的结构来与扬声器模组的应用终端的地实现连接。
本实施例中，接地端4与钢片3通过电连接件5电连接；钢片3、电连接件5以及接地端4均注塑于模组上壳2上，且接地端4外露设置，便于扬声器模组安装于应用终端时，钢片3的接地端4与应用终端接地连接；钢片3、电连接件5以及接地端4为一体结构，但不局限于一体结构。
本实施例的扬声器模组，模组上壳2上注塑有钢片3，钢片3引出有用于与扬声器模组的应用终端接地连接的接地端4。将这种结构的扬声器模组安装到应用终端使用时，能够有效地抑制消除钢片3的金属结构对应用终端的干扰，保证扬声器模组与应用终端之间配合的稳定性，保证扬声器模组的应用终端的质量。
以上所述为本发明最佳实施方式的举例，其中未详细述及的部分均为本领域普通技术人员的公知常识。本发明的保护范围以权利要求的内容为准，任何基于本发明的技术启示而进行的等效变换，也在本发明的保护范围之内。

Claims (6)

  1. 一种扬声器模组，包括模组外壳及扬声器单体，所述模组外壳内形成收容所述扬声器单体的模组内腔，所述模组外壳包括模组上壳和模组下壳，所述模组上壳设于所述扬声器单体的前盖外侧，所述模组上壳上注塑有金属片，其特征在于：所述金属片引出有用于与扬声器模组的应用终端接地连接的接地端。
  2. 根据权利要求1所述的扬声器模组，其特征在于：所述接地端固定外露设于所述模组上壳上。
  3. 根据权利要求2所述的扬声器模组，其特征在于：所述接地端与所述金属片通过电连接件电连接。
  4. 根据权利要求3所述的扬声器模组，其特征在于：所述金属片、所述电连接件以及所述接地端均注塑于所述模组上壳上，且所述接地端外露设置。
  5. 根据权利要求4所述的扬声器模组，其特征在于：所述金属片、所述电连接件以及所述接地端为一体结构。
  6. 根据权利要求1至5任一项所述的扬声器模组，其特征在于：所述金属片为钢片。
PCT/CN2015/094899 2015-05-12 2015-11-18 扬声器模组 WO2016179997A1 (zh)

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CN103531905A (zh) * 2012-07-06 2014-01-22 宏碁股份有限公司 电子装置
CN204046808U (zh) * 2014-08-29 2014-12-24 歌尔声学股份有限公司 扬声器模组
CN104540076A (zh) * 2014-11-20 2015-04-22 歌尔声学股份有限公司 扬声器模组
CN104811835A (zh) * 2015-05-12 2015-07-29 歌尔声学股份有限公司 扬声器模组
CN204681532U (zh) * 2015-05-12 2015-09-30 歌尔声学股份有限公司 扬声器模组

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