WO2015147032A1 - 透光性導電フィルム - Google Patents
透光性導電フィルム Download PDFInfo
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- WO2015147032A1 WO2015147032A1 PCT/JP2015/059051 JP2015059051W WO2015147032A1 WO 2015147032 A1 WO2015147032 A1 WO 2015147032A1 JP 2015059051 W JP2015059051 W JP 2015059051W WO 2015147032 A1 WO2015147032 A1 WO 2015147032A1
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- Prior art keywords
- metal wiring
- wiring layer
- layer
- conductive film
- film
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04112—Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
Definitions
- the present invention relates to a translucent conductive film applied to an input display device or the like capable of inputting information by contact with a finger or a stylus pen.
- Patent Document 1 a translucent conductive film having a film substrate, a metal wiring layer patterned in a mesh pattern, and a colored layer (blackened layer) in this order is known (Patent Document 1).
- a light-transmitting conductive film is attracting attention as an electrode material for a touch sensor that replaces a light-transmitting conductive film using indium tin oxide (ITO) because of its excellent electrical conductivity and flexibility.
- ITO indium tin oxide
- An object of the present invention is to provide a translucent conductive film that is excellent in productivity, realizes high reliability without causing disconnection of metal wiring, and has a good usability because the metal wiring layer is hardly visible. is there.
- the present inventors focused on the surface shape of the film substrate, the dimensions of the metal wiring layer formed on the film substrate, and the arrangement of the colored layers.
- the translucent conductive film is excellent in productivity, realizes high reliability without causing disconnection of the metal wiring, and is difficult to visually recognize the mesh pattern of the metal wiring layer. Found that can provide.
- the gist of the present invention is as follows.
- a translucent conductive film having a film substrate, a patterned metal wiring layer, and a colored layer, wherein a plurality of the film substrates are provided on the surface on the side where the metal wiring layer is formed.
- the metal wiring layer has a line width of more than 5 ⁇ m and less than 8 ⁇ m, and the metal wiring layer has a thickness of 0.1 ⁇ m or more and less than 0.5 ⁇ m, and the colored layer includes the metal wiring layer
- a translucent conductive film characterized in that it is formed on the main surface on the visual recognition side of the metal wiring layer and not on the side surface of the metal wiring layer.
- a film substrate having a plurality of protrusions on both surfaces, A first metal wiring layer formed on one surface of the film substrate; A first colored layer formed on the first metal wiring layer; A second colored layer formed on the other surface of the film substrate; A second metal wiring layer formed on the second colored layer,
- the line width of the first and second metal wiring layers is more than 5 ⁇ m and less than 8 ⁇ m, and the thickness of the first and second metal wiring layers is 0.1 ⁇ m or more and less than 0.5 ⁇ m
- the first colored layer is laminated on the main surface of the first metal wiring layer opposite to the film base, and is not formed on the side surface of the first metal wiring layer.
- the translucent conductive film wherein the second colored layer is laminated on a main surface of the second metal wiring layer on the film base side and is not formed on a side surface of the second metal wiring layer.
- a plurality of protrusions are provided on the surface of the film substrate.
- the film base is provided with slipperiness and abrasion resistance, and when the metal wiring layer is continuously formed, the film formation rate is increased while the productivity is increased while maintaining high quality. Can be made.
- the metal wiring layer has a predetermined line width, and a colored layer that absorbs external light is provided on the surface of the metal wiring layer on the viewing side.
- the thickness of the metal wiring layer is thinner than the metal wiring layer in the prior art and is 0.1 ⁇ m or more and less than 0.5 ⁇ m.
- the metal wiring layers on both sides can be prevented from being visually recognized while the metal wiring layers on both sides are prevented from being disconnected. An effect can be obtained.
- FIG. 2 is a partially enlarged view of the translucent conductive film in FIG. 1, wherein (a) is a plan view and (b) is a cross-sectional view taken along line AA in (a). It is sectional drawing which shows the modification of the translucent conductive film of FIG. It is sectional drawing which shows the other modification of the translucent conductive film of FIG.
- FIG. 1 is a diagram schematically showing a configuration of a translucent conductive film according to the present embodiment.
- the length, width, or thickness of each component in FIG. 1 shows an example, and the length, width, or thickness of each component in the translucent conductive film of the present invention is limited to that in FIG. Shall not.
- the translucent conductive film of the present invention has a film substrate 11, a metal wiring layer 12 patterned in a mesh pattern, and a colored layer 13 in at least this order.
- the film base 11 has a plurality of protrusions 31 on the surface 11a on the side where the metal wiring layer 12 is formed. And each wiring which comprises the metal wiring layer 12 is continuously formed in both on the surface 11a of the film base material, and the surface 31a of the proceedings
- the line width of the metal wiring layer 12 is more than 5 ⁇ m and not more than 8 ⁇ m, and the thickness of the metal wiring layer is not less than 0.1 ⁇ m and less than 0.5 ⁇ m.
- the colored layer 13 is laminated on the main surface 12 a on the viewing side A of the metal wiring layer 12 and is not formed on the side surface 12 b of the metal wiring layer 12.
- the surface resistance value on the side having the metal wiring layer is preferably 0.1 ⁇ / ⁇ to 400 ⁇ / ⁇ , more preferably 0.1 ⁇ / ⁇ to 100 ⁇ / ⁇ , and particularly preferably. Is 1 ⁇ / ⁇ to 60 ⁇ / ⁇ .
- the transmissivity of the translucent conductive film 1 is preferably 80% or more, and more preferably 85% or more.
- the translucent conductive film of the present invention has a film substrate, a metal wiring layer, and a colored layer in this order
- the translucent conductive film may include other layers between the respective layers.
- an adhesive resin layer for enhancing adhesion may be disposed between the film substrate and the metal wiring layer, or the metal wiring layer or the colored layer may be a film substrate. It may be arranged on both sides.
- the film substrate used in the present invention supports the metal wiring layer.
- This film substrate may be a single layer or a multilayer.
- the thickness of the film substrate is preferably 20 ⁇ m to 200 ⁇ m from the viewpoint of transparency and handleability.
- the film substrate has a plurality of protrusions on the surface on which the metal wiring layer is formed.
- the film base material is provided with slipperiness and abrasion resistance, and when the metal wiring layer is continuously formed, the quality is kept high while maintaining the quality.
- Productivity can be improved by increasing the deposition rate.
- the protrusions have an outer diameter D exceeding 0 and not more than 5 ⁇ m, preferably 0.5 ⁇ m to 3 ⁇ m in a plan view of the surface of the film base on which the metal wiring layer is formed.
- the outer diameter of the protrusion can be measured, for example, by observing an image of the surface of the film base on which the metal wiring layer is formed at a predetermined magnification.
- the outer diameter D exceeds 5 ⁇ m, the metal wiring may be disconnected in the vicinity of the boundary between the surface of the film base and the surface of the protrusion.
- the height of the protrusion is preferably more than 0 and 3 ⁇ m or less, more preferably 0.1 ⁇ m to 2 ⁇ m, based on the flat surface of the film substrate.
- the shape of the protrusion is substantially dome-shaped in this embodiment, and the cross section in the surface direction of the film substrate is substantially circular, and the cross section in the thickness direction is substantially semicircular (FIG. 2).
- the protrusion in the present invention is not a dome shape as long as it imparts slipperiness and wear resistance to the film substrate and can form a high-quality metal wiring layer continuously and at a high speed. Other shapes may be used.
- Examples of means for providing protrusions on the film substrate include a method of dispersing a lubricant in the film substrate, and a method of applying a binder having a plurality of particles dispersed on the film surface.
- the film constituting the film substrate is preferably a polymer film having excellent transparency and heat resistance.
- the polymer film is, for example, a polyethylene terephthalate film, a polyethylene naphthalate film, a polycycloolefin film, a polycarbonate film, or a polysulfone film.
- Such a polymer film can be obtained from, for example, Mitsubishi Plastics, Teijin DuPont Films, Nippon Zeon, Teijin Chemicals, and the like.
- the metal wiring layer used in the present invention is, for example, a pattern formed in a mesh shape to impart translucency.
- the mesh pattern of the metal wiring layer is not particularly limited, and is, for example, a square lattice, a rhombus lattice, or a polygonal lattice.
- the material for forming the metal wiring layer is not limited as long as it has electrical conductivity, but is preferably silver, copper, or an alloy thereof, and more preferably copper.
- the line width of the metal wiring layer is more than 5 ⁇ m and less than 8 ⁇ m, preferably more than 5.5 ⁇ m and 7 ⁇ m or less. If it is the range of such a line
- the line width is 5 ⁇ m or less, the network pattern of the metal wiring layer becomes difficult to be visually recognized, but the frequency of the metal wiring breaks due to the protrusions of the film base, and the quality and reliability are high when mass-produced. Lower.
- the line width is 8 ⁇ m or more, the mesh pattern of the metal wiring layer is remarkably visually recognized.
- the thickness of the metal wiring layer is 0.1 ⁇ m or more and less than 0.5 ⁇ m, preferably more than 0.1 ⁇ m and 0.4 ⁇ m or less, and more preferably 0.15 ⁇ m to 0.35 ⁇ m.
- the metal wiring layer of the present invention is characterized in that it has a flat shape, and the ratio of the line width to the thickness (line width / thickness) is preferably 10 or more and less than 80, and more preferably 15-50. It is.
- the translucent conductive film satisfying such a relationship is excellent in productivity, does not cause disconnection of the metal wiring, and is difficult to visually recognize the network pattern of the metal wiring layer.
- Sectional area of the metal wiring layer in order to obtain the electrical conductivity required for a touch panel sensor, preferably 0.5 [mu] m 2 ⁇ 4 [mu] m 2, more preferably from 0.5 ⁇ m 2 ⁇ 3.2 ⁇ m 2, particularly preferably Is 0.5 ⁇ m 2 to 2.5 ⁇ m 2 .
- the pitch interval of the metal wiring layers is preferably 200 ⁇ m to 800 ⁇ m, and more preferably 350 ⁇ m to 650 ⁇ m, in order to obtain sufficient translucency.
- the aperture ratio of the metal wiring layer is preferably 95% to 99%, more preferably 96% to 99%.
- a predetermined resist pattern for example, after forming a metal layer on the entire surface of the film substrate, a predetermined resist pattern (resist pattern) is stacked on the metal layer, and etching is performed. A method of removing the resist after removing the metal layer in the unnecessary region is used so that a network-like metal wiring layer is formed.
- the method for forming the metal layer is, for example, a sputtering method, a plating method, or a combination thereof.
- the colored layer used in the present invention is laminated on the surface of the metal wiring layer on the viewing side, and external light is absorbed to prevent the mesh-like pattern from being brilliantly viewed.
- the translucent conductive film of the present invention since the thickness of the metal wiring layer is thin, it is not necessary to form a colored layer on the side surface of the metal wiring layer. Therefore, it is excellent in the productivity of a translucent conductive film.
- the colored layer may be a single layer or a multilayer.
- the total thickness of the colored layer is preferably 5 nm to 2 ⁇ m, more preferably 10 nm to 1 ⁇ m, and particularly preferably 10 nm to 60 nm.
- the line width of the colored layer is basically the same as that of the metal wiring layer, for example, more than 5 ⁇ m and less than 8 ⁇ m, preferably more than 5.5 ⁇ m and 7 ⁇ m or less.
- the color tone of the colored layer is preferably black or dark gray.
- the colored layer is sometimes referred to as a blackening layer, and the provision of the blackening layer is sometimes referred to as blackening treatment.
- the material for forming the colored layer is not particularly limited as long as it absorbs external light.
- a blackened layer black copper or black
- Nickel or a blackening layer (copper oxide, copper nitride, nickel nitride, or nickel oxide) formed by a sputtering method described in JP2013-129183A can be used.
- the colored layer forming method for forming the colored layer only on the surface on the visual recognition side of the metal wiring layer includes, for example, forming a metal layer by plating on the entire surface of the film substrate, and then blackening the surface of the metal layer by plating. Is formed, and then the metal layer and the colored layer are etched together (first manufacturing method).
- first manufacturing method since the blackening treatment can be continuously performed from the generation of the metal layer, the manufacturing time can be reduced, the cost can be reduced, and the environmental load can be reduced.
- the plurality of protrusions 31 are provided on the surface 11 a of the film base 11.
- the film base 11 is provided with slipperiness and wear resistance, and when the metal wiring layer 12 is continuously formed, the film formation speed is increased while maintaining the quality high, thereby increasing the productivity. Can be improved.
- the metal wiring layer 12 has a predetermined line width, and a colored layer 13 that absorbs external light is provided on the main surface 12 a on the viewing side A of the metal wiring layer 12.
- the thickness of the metal wiring layer 12 is less than 0.5 ⁇ m.
- the metal wiring layer is formed on the surface on the viewing side of the film base material, but instead, it may be formed on the surface on the display device side of the film base material.
- the translucent conductive film has a film substrate 11, a colored layer 23 patterned in a mesh pattern, and a metal wiring layer 22 in this order.
- the film base material 11 is the side on which the metal wiring layer 22 is formed, that is, the side B opposite to the viewing side A (when the translucent conductive film is used as a touch sensor in a stacked manner on the display device, A plurality of protrusions (not shown) on the surface 11b.
- the line width and thickness of the metal wiring layer 22 are the same as those of the metal wiring layer 12 of FIG.
- the colored layer 23 is laminated on the main surface 22a on the viewing side A of the metal wiring layer 22 and is characterized in that it is not formed on the side surface 22b of the metal wiring layer 22 as in the configuration of FIG.
- a sputtering method for example, after forming a colored layer on a film substrate before forming a metal layer by a sputtering method, a sputtering method is applied to the surface of the colored layer. And a method (second manufacturing method) in which a metal layer is formed and then the colored layer and the metal layer are etched together. Also in this manufacturing method, since the blackening treatment can be continuously performed from the generation of the metal layer, the manufacturing time can be reduced and the cost can be reduced, and the environmental load can also be reduced.
- the configuration shown in FIG. 3 can achieve the same effect as that of the embodiment shown in FIG. 3
- metal wiring layers may be formed on both sides of the film substrate.
- a colored layer is laminated on the surface on the viewing side of each metal wiring layer.
- the translucent conductive film includes a film substrate 11 having a plurality of protrusions (not shown) on both surfaces 11a and 11b, and one surface of the film substrate. Formed on the metal wiring layer 12 (first metal wiring layer) formed on 11a, the colored layer 13 (first colored layer) formed on the metal wiring layer 12, and the other surface 11b of the film substrate 11 The colored layer 23 (second colored layer) and the metal wiring layer 22 (second metal wiring layer) formed on the colored layer 23 are provided.
- the line widths of the metal wiring layers 12 and 22 are each greater than 5 ⁇ m and less than 8 ⁇ m, and the thicknesses of the metal wiring layers 12 and 22 are each 0.1 ⁇ m or more and less than 0.5 ⁇ m.
- the colored layer 13 is laminated on the main surface 12 a of the metal wiring layer 12 opposite to the film base 11, and is not formed on the side surface 12 b of the metal wiring layer 12. Further, the colored layer 23 is laminated on the main surface 22 a of the metal wiring layer 22 on the film base 11 side, and is not formed on the side surface 22 b of the metal wiring layer 22. According to the configuration shown in FIG. 4, the above effect can be obtained more remarkably.
- Example 10 On the surface of a polyethylene terephthalate film having a thickness of 50 ⁇ m, a binder (trade name “ELS888”, manufactured by DI Kenkyu Chemical Co., Ltd.) in which a plurality of particles (trade name “MX180-TA”) is dispersed is applied to the surface. A film substrate having a plurality of protrusions (height 1.2 ⁇ m with respect to the flat surface of the film substrate) was produced. Next, a copper layer having a thickness of 80 nm was formed on the surface of the film base coated with the binder by a DC sputtering method to form a laminate.
- a binder trade name “ELS888”, manufactured by DI Kenkyu Chemical Co., Ltd.
- MX180-TA a plurality of particles
- this laminate is immersed in an electrolytic copper plating bath, and the thickness of the copper layer is increased by an electrolytic plating method in which the current density is 20 A / dm 2 , so that the total thickness of the copper layer is 200 nm (0.2 ⁇ m). It was. The deposited metal at this stage was brown. Thereafter, the current density was changed to 50 A / dm 2 and plating was continued, and a colored layer made of black copper was laminated on the surface of the copper layer. The laminate having the film substrate, the copper layer, and the colored layer was taken out of the plating bath, washed with water and dried.
- a predetermined resist pattern is laminated on the surface of the blackened layer, and the copper layer and the colored layer in unnecessary areas are simultaneously removed by an etching method, and then the resist is peeled off to have a colored layer on the outermost surface.
- a square grid (network) metal wiring layer having a line width of 6 ⁇ m, a pitch interval of 450 nm, a thickness of 0.2 ⁇ m, and an aperture ratio of 97% was formed.
- the translucent conductive film thus obtained had a transmittance of 88% and a surface resistance value of 3 ⁇ / ⁇ .
- Example 1 A translucent conductive film was produced in the same manner as in Example except that the plating time was changed and the thickness of the metal wiring layer was set to 2 ⁇ m.
- Example 2 A translucent conductive film was produced in the same manner as in Example except that the plating time and the resist pattern were changed and the line width of the metal wiring layer was 10 ⁇ m and the thickness was 2 ⁇ m.
- the pitch interval in the metal wiring layer is the length from one center to the other center of two wirings arranged close to each other in the unit pattern, and the length of the mesh space is the line width of the wiring from the pitch interval.
- the produced translucent conductive film is visually observed under the light source of a three-wavelength light-emitting fluorescent lamp to confirm whether the mesh pattern is visible from both the front direction and the diagonal direction, and the mesh pattern is visually recognized. The case where it was not observed was judged good and the case where it was clearly visible was regarded as defective.
- the line width of the metal wiring layer is 6 ⁇ m and the thickness of the metal wiring layer is 0.2 ⁇ m, and the mesh pattern is not visually recognized from both the front direction and the diagonal direction. Also, no disconnection of metal wiring was confirmed.
- the metal wiring layer had a line width of 6 ⁇ m and a thickness of 2 ⁇ m, and although no disconnection of the metal wiring was confirmed, a mesh pattern was visually recognized when viewed from an oblique direction.
- the metal wiring layer had a line width of 10 ⁇ m and a thickness of 2 ⁇ m, and no disconnection of the metal wiring was confirmed. However, when viewed from both the front direction and the diagonal direction, the mesh pattern was visually recognized. It was done.
- the metal wiring layer had a line width of 8 ⁇ m and a thickness of 0.2 ⁇ m, and no disconnection of the metal wiring was confirmed, but a mesh pattern was visually recognized when viewed from the front direction.
- the metal wiring layer had a line width of 3 ⁇ m and a thickness of 0.2 ⁇ m, and although the mesh pattern was not visually recognized, disconnection of the metal wiring was confirmed.
- the translucent conductive film according to the present invention is suitable as an electrode material for a touch sensor.
- the touch sensor is preferably a capacitive touch sensor used for a mobile terminal such as a smartphone or a tablet terminal (Slate PC).
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Abstract
Description
(1)フィルム基材と、パターン形成された金属配線層と、着色層とを有する透光性導電フィルムであって、前記フィルム基材は、前記金属配線層が形成される側の表面に複数の突起を有し、前記金属配線層の線幅が5μmを超え8μ未満であり、且つ前記金属配線層の厚みが0.1μm以上0.5μm未満であり、前記着色層は、前記金属配線層の視認側の主面に形成され、且つ前記金属配線層の側面には形成されないことを特徴とする、透光性導電フィルム。
前記フィルム基材の一方の表面上に形成された第1金属配線層と、
前記第1金属配線層上に形成された第1着色層と、
前記フィルム基材の他方の表面に形成された第2着色層と、
前記第2着色層上に形成された第2金属配線層とを備え、
前記第1及び第2金属配線層の線幅が5μmを超え8μm未満であり、且つ前記第1及び第2金属配線層の厚みが0.1μm以上0.5μm未満であり、
前記第1着色層は、前記第1金属配線層の前記フィルム基材とは反対側の主面に積層され、且つ前記第1金属配線層の側面には形成されず、
前記第2着色層は、前記第2金属配線層の前記フィルム基材側の主面に積層され、且つ前記第2金属配線層の側面には形成されないことを特徴とする、透光性導電フィルム。
本発明に用いられるフィルム基材は、金属配線層を支持するものである。このフィルム基材は単層であってもよいし、複層であってもよい。フィルム基材の厚みは、透明性や取扱性の観点から、好ましくは20μm~200μmである。
本発明に用いられる金属配線層は、透光性を付与するために、例えば網目状にパターン形成されたものである。上記金属配線層の網目状パターンは、特に制限はなく、例えば、正方形格子、ひし形格子、又は多角形格子である。
本発明に用いられる着色層着色層は、金属配線層の視認側の表面に積層され、外光が吸収されることによって、網目状パターンが光輝して視認されることを防ぐ。本発明の透光性導電フィルムは、金属配線層の厚みが薄いために、金属配線層の側面に着色層を形成する必要がない。従って、透光性導電フィルムの生産性に優れる。
[実施例]
厚さ50μmのポリエチレンテレフタレートフィルムの表面に、複数の粒子(綜研化学社製、商品名「MX180-TA」)を分散させたバインダー(DI社製、商品名「ELS888」)を塗布し、表面に複数の突起(フィルム基材の平坦な面を基準として、高さ1.2μm)を有するフィルム基材を作製した。次に、フィルム基材のバインダーを塗布した表面に、DCスパッタリング法により、厚み80nmの銅層を成膜して積層体を形成した。
メッキ時間を変更して、金属配線層の厚みを2μmとしたこと以外は、実施例と同様の方法で透光性導電フィルムを作製した。
メッキ時間及びレジストパターンを変更して、金属配線層の線幅を10μm、厚みを2μmとしたこと以外は、実施例と同様の方法で透光性導電フィルムを作製した。
レジストパターンを変更して、金属配線層の線幅を8μmとしたこと以外は、実施例と同様の方法で透光性導電フィルムを作製した。
レジストパターンを変更して、金属配線層の線幅を3μmとしたこと以外は、実施例と同様の方法で透光性導電フィルムを作製した。
顕微鏡(オリンパス社製、装置名「MX61L」)を用いて顕微鏡写真を撮影し、撮影した写真に基づいて各値を実測した。
上記の方法で作製した透光性導電フィルムの一部を切り取って樹脂で注型し、顕微鏡(日立製作所社製、装置名「HF2000」を用いて断面を観察し、各値を実測した。
金属配線層におけるピッチ間隔を、単位パターンにおいて近接配置された2つの配線の一方の中心から他方の中心までの長さとし、また、メッシュ空間の長さを、上記ピッチ間隔から上記配線の線幅を減じた値とした場合に、「(開口率)={(メッシュ空間長さ/ピッチ間隔)2}×100」の式により求めた。
ダブルビーム分光光度計(日立製作所社製、装置名「U4100」)を用いて、400~700nmの透過率を測定し、その平均値を求めた。
作製した透光性導電フィルムの全面を、拡大鏡を用いて肉眼にて観察し、断線の有無を確認した。
作製した透光性導電フィルムを、三波長発光型蛍光灯の光源下で目視観察し、正面方向及び斜め方向の双方から網目状パターンが視認されるか否かを確認し、網目状パターンが視認されない場合を良好、明確に視認される場合を不良とした。
11a 表面
11b 表面
12 金属配線層
12a 主面
12b 側面
13 着色層
22 金属配線層
22a主面
22b 側面
23 着色層
31 突起
31a 表面
Claims (6)
- フィルム基材と、パターン形成された金属配線層と、着色層とを有する透光性導電フィルムであって、
前記フィルム基材は、前記金属配線層が形成される側の表面に複数の突起を有し、
前記金属配線層の線幅が5μmを超え8μm未満であり、且つ前記金属配線層の厚みが0.1μm以上0.5μm未満であり、
前記着色層は、前記金属配線層の視認側の主面に形成され、且つ前記金属配線層の側面には形成されないことを特徴とする、透光性導電フィルム。 - 前記突起は、前記フィルム基材の前記金属配線層が形成される側の表面の平面視において、その外径が0を超え5μm以下であることを特徴とする、請求項1記載の透光性導電フィルム。
- 前記突起の高さが0を超え3μm未満であることを特徴とする、請求項1記載の透光性導電フィルム。
- 前記金属配線層は、扁平形状を有し、厚みに対する線幅の比率が15~50であることを特徴とする、請求項1記載の透光性導電フィルム。
- 前記金属配線層が、網目状に形成されることを特徴とする、請求項1記載の透光性導電フィルム。
- 両側の表面にそれぞれ複数の突起を有するフィルム基材と、
前記フィルム基材の一方の表面上に形成された第1金属配線層と、
前記第1金属配線層上に形成された第1着色層と、
前記フィルム基材の他方の表面に形成された第2着色層と、
前記第2着色層上に形成された第2金属配線層とを備え、
前記第1及び第2金属配線層の線幅が5μmを超え8μ未満であり、且つ前記第1及び第2金属配線層の厚みが0.1μm以上0.5μm未満であり、
前記第1着色層は、前記第1金属配線層の前記フィルム基材とは反対側の主面に積層され、且つ前記第1金属配線層の側面には形成されず、
前記第2着色層は、前記第2金属配線層の前記フィルム基材側の主面に積層され、且つ前記第2金属配線層の側面には形成されないことを特徴とする、透光性導電フィルム。
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