WO2013118314A1 - 入力装置 - Google Patents
入力装置 Download PDFInfo
- Publication number
- WO2013118314A1 WO2013118314A1 PCT/JP2012/059963 JP2012059963W WO2013118314A1 WO 2013118314 A1 WO2013118314 A1 WO 2013118314A1 JP 2012059963 W JP2012059963 W JP 2012059963W WO 2013118314 A1 WO2013118314 A1 WO 2013118314A1
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- WIPO (PCT)
- Prior art keywords
- transparent
- layer
- input device
- ito
- bridge wiring
- Prior art date
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04111—Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
Definitions
- the present invention relates to an input device that can detect an operation position on an operation surface, and more particularly, to a configuration of a bridge wiring that connects between transparent electrodes formed on the surface of a transparent substrate.
- Patent Document 1 discloses an input device in which a bridge wiring that electrically connects a plurality of transparent electrodes (described in Patent Document 1 as an intersection portion and a relay electrode) is formed of ITO.
- Patent Document 2 discloses an input device in which a bridge wiring for electrically connecting a plurality of transparent electrodes is formed of Mo, Al, Au or the like.
- An insulating layer is interposed between the transparent base material forming the transparent electrode forming surface and the bridge wiring. That is, the bridge wiring is electrically connected between the transparent electrodes through the surface of the insulating layer.
- Patent Document 1 there is a problem that the bridge wiring is made of ITO and the wiring resistance of the bridge wiring is increased.
- the wiring resistance of the bridge wiring can be made lower than that formed with ITO, but good invisible characteristics, that is, the bridge wiring must not be visible. It was necessary to ensure good adhesion with the insulating layer constituting the bridge wiring formation surface. In addition, it was necessary to improve the environmental resistance (humidity resistance and heat resistance) of the bridge wiring.
- the present inventors selected Au as a low-resistance metal, for example.
- Au is used as a bridge wiring, particularly with good invisible characteristics.
- a structure for ensuring good adhesion with the insulating layer is not disclosed.
- the present invention is for solving the above-mentioned conventional problems, and in particular, it is possible to ensure good invisible characteristics and good adhesion to the transparent substrate side, and in addition, improve the environment resistance of the bridge wiring.
- An object of the present invention is to provide an input device that can be made to operate.
- the input device in the present invention is A transparent substrate, a plurality of transparent electrodes formed on the first surface of the transparent substrate, a bridge wiring electrically connecting the transparent electrodes, and formed between the transparent substrate and the bridge wiring. And an insulating layer,
- the bridge wiring includes an underlayer made of ITO in contact with the surface of the insulating layer and a metal layer formed on the surface of the underlayer.
- the underlayer made of ITO functions as a barrier layer against moisture caused by the water absorption of the insulating layer. Furthermore, the underlayer made of ITO can appropriately follow the shrinkage of the insulating layer due to environmental changes. Thus, good environmental resistance (moisture resistance, heat resistance) can be secured.
- the metal layer is preferably Au, Au alloy, CuNi, or Ni. Of these, the metal layer is more preferably formed of Au. As a result, good invisible characteristics can be secured and low resistance can be realized.
- a conductive oxide protective layer is formed on the surface of the metal layer.
- the metal layer is not exposed on the surface of the bridge wiring, and the surface of the metal layer is covered with the conductive oxide protective layer, so that the conductive oxide protective layer flows into the bridge wiring from the surface side. Therefore, the environment resistance of the bridge wiring can be improved more effectively. Moreover, invisible characteristics can be further improved.
- the conductive oxide protective layer is preferably made of ITO.
- the resistance of the bridge wiring can be lowered and the resistance to electrostatic breakdown can be improved.
- the transparent electrode includes a plurality of first transparent electrodes and a plurality of second transparent electrodes, and each first transparent electrode is connected in a first direction, and the first electrode A second direction in which each of the second transparent electrodes intersects with the first direction by the bridge wiring formed through the insulating surface of the insulating layer. It can be configured to be connected to.
- the present invention can be preferably applied to a configuration in which the insulating layer constituting the insulating surface is formed of a novolac resin.
- the present invention can be preferably applied to a configuration in which an optical transparent adhesive layer that is a bonding material between transparent substrates is in contact with the surface of the bridge wiring. Moreover, it can apply preferably to the structure which joins between the 1st surface side of a transparent base material, and the panel whose surface is an operation surface by the said optical transparent adhesion layer.
- the input device of the present invention good invisible characteristics can be secured, low resistance can be realized, and adhesion between the bridge wiring and the insulating layer can be improved.
- the underlayer made of ITO functions as a barrier layer against moisture caused by the water absorption of the insulating layer. Furthermore, the underlayer made of ITO can appropriately follow the shrinkage of the insulating layer due to environmental changes. Thus, good environmental resistance (moisture resistance, heat resistance) can be secured.
- FIG. 1 is a plan view showing each transparent electrode and wiring portion formed on the surface of a transparent substrate constituting the input device (touch panel) in the present embodiment.
- 2 (a) is an enlarged plan view of the input device shown in FIG. 1, and FIG. 2 (b) is a portion of the input device as seen from the direction of the arrow when FIG. 2 (a) is cut along AA.
- FIG. 2C is an enlarged longitudinal sectional view, and FIG. 2C is a partially enlarged longitudinal sectional view of an input device that is partially different from FIG.
- FIG. 3A is an enlarged longitudinal sectional view of the bridge wiring in the first embodiment, and
- FIG. 3B is an enlarged longitudinal sectional view of the bridge wiring in the second embodiment.
- FIG. 4 is a process diagram illustrating a method of manufacturing the input device according to the present embodiment, in which the right diagram in FIG. 4 is a partial longitudinal sectional view, and the left diagram in FIG.
- FIG. 1 is a plan view showing each transparent electrode and wiring portion formed on the surface of a transparent substrate constituting the input device (touch panel) in this embodiment
- FIG. 2 (a) is an input shown in FIG. 2B is an enlarged plan view of the input device
- FIG. 2B is a partially enlarged longitudinal sectional view of the input device as seen from the direction of the arrow cut along the line AA in FIG. 2A.
- transparent and “translucent” indicate a state where the visible light transmittance is 50% or more (preferably 80% or more). Further, it is preferable that the haze value is 6 or less.
- FIG. 1 shows the transparent electrodes 4 and 5 and the wiring portion 6 formed on the surface (first surface) 2a of the transparent base material 2 constituting the input device 1, but actually FIG. As shown in b), since the transparent panel 3 is provided on the surface side of the transparent base material 2 and there is a decorative layer at the position of the wiring part 6, the wiring part 6 is viewed from the surface side of the panel 3. I can't. Although the transparent electrode is transparent, it cannot be visually recognized, but FIG. 1 shows the outer shape of the transparent electrode.
- the transparent substrate 2 is formed of a film-like transparent substrate such as polyethylene terephthalate (PET) or a glass substrate.
- the transparent electrodes 4 and 5 are formed of a transparent conductive material such as ITO (Indium Tin Oxide) by sputtering or vapor deposition.
- a plurality of first transparent electrodes 4 and a plurality of second transparent electrodes are displayed in a display area 11 (a display screen that can be operated with an operating body such as a finger and facing the display).
- An electrode 5 is formed.
- the plurality of first transparent electrodes 4 are formed on the surface 2a of the transparent substrate 2, and each first transparent electrode 4 is connected to the Y1 via the elongated connecting portion 7. -It is connected in the Y2 direction (first direction).
- the first electrodes 8 composed of a plurality of first transparent electrodes 4 connected in the Y1-Y2 direction are arranged at intervals in the X1-X2 direction.
- the plurality of second transparent electrodes 5 are formed on the surface 2a of the transparent substrate 2. As described above, the second transparent electrode 5 is formed on the same surface as the first transparent electrode 4 (the surface 2a of the transparent substrate 2). As shown in FIGS. 1 and 2A, each second transparent electrode 5 is connected to the X1-X2 direction (second direction) via an elongated bridge wiring 10.
- the second electrodes 12 including a plurality of second transparent electrodes 5 connected in the X1-X2 direction are arranged at intervals in the Y1-Y2 direction.
- an insulating layer 20 is formed on the surface of the connecting portion 7 that connects the first transparent electrodes 4 together. As shown in FIG. 2B, the insulating layer 20 fills the space between the connecting portion 7 and the second transparent electrode 5, and is somewhat on the surface of the second transparent electrode 5.
- the bridge wiring 10 is formed from the surface 20a of the insulating layer 20 to the surface of each second transparent electrode 5 located on both sides of the insulating layer 20 in the X1-X2 direction. Has been.
- the bridge wiring 10 electrically connects the second transparent electrodes 5.
- an insulating layer 20 is provided on the surface of the connecting portion 7 that connects the first transparent electrodes 4, and each second transparent electrode is provided on the surface of the insulating layer 20.
- a bridge wiring 10 that connects the five is provided.
- the insulating layer 20 is interposed between the connecting portion 7 and the bridge wiring 10, and the first transparent electrode 4 and the second transparent electrode 5 are electrically insulated.
- the 1st transparent electrode 4 and the 2nd transparent electrode 5 can be formed in the same surface (surface 2a of the transparent base material 2), and thickness reduction of the input device 1 is realizable.
- the connecting portion 7, the insulating layer 20, and the bridge wiring 10 are all located in the display area 11 and are configured to be transparent and translucent like the transparent electrodes 4 and 5.
- the display area 11 is surrounded by a frame-shaped decoration area (non-display area) 25.
- the display area 11 is transparent and translucent, but the decorative area 25 is opaque and non-translucent. Therefore, the wiring part 6 and the external connection part 27 provided in the decoration area 25 cannot be seen from the surface of the input device 1 (the surface of the panel 3).
- Each wiring part 6 has a metal material such as Cu, Cu alloy, CuNi alloy, Ni, Ag, Au, and the like.
- each wiring part 6 constitutes an external connection part 27 that is electrically connected to a flexible printed circuit board (not shown).
- OCA optical Clear Adhesive
- the panel 3 is not particularly limited in material, but a glass substrate or a plastic substrate is preferably applied.
- the optical transparent adhesive layer (OCA) 30 is an acrylic adhesive or a double-sided adhesive tape.
- the contact position of the finger F can be calculated.
- the position of the finger F detects the X coordinate based on the capacitance change with the first electrode 8 and detects the Y coordinate based on the capacitance change with the second electrode 12 ( Self-capacitance detection type).
- a drive voltage is applied to one row of the first electrodes of the first electrode 8 and the second electrode 12, and a change in capacitance between the finger F is detected by the other second electrode.
- a mutual capacitance detection type in which the Y position is detected by the second electrode and the X position is detected by the first electrode may be used.
- the bridge wiring 10 includes a transparent underlayer 35 made of ITO formed from the surface 20a of the insulating layer 20 to the surface 5a of the second transparent electrode 5.
- a two-layer structure is formed with a transparent metal layer 36 formed on the surface of the base layer 35 and having a lower resistance than that of the base layer 35.
- the metal layer 36 is preferably formed of any one of Au, Au alloy, CuNi, and Ni. Among these, it is more preferable to select Au.
- the reason for selecting Au is that it is a material that does not oxidize even in heat resistance, moisture resistance, and environmental tests, has a small resistance change, and can maintain a low resistance.
- the underlayer 35 made of ITO also functions as a barrier layer against moisture caused by the water absorption of the insulating layer 20.
- the underlayer 35 made of ITO can increase the electrostatic breakdown voltage value (withstand voltage value) and can improve the electrostatic breakdown resistance.
- a novolac resin resist
- the gap between the second transparent electrode 5 and the connecting portion 7 can be appropriately filled. Further, the surface 20a of the insulating layer 20 can be formed smoothly, and the unevenness can be reduced.
- the underlayer 35 made of ITO in the present embodiment functions as a barrier layer against moisture caused by the water absorption of the novolak resin, and can appropriately follow the shrinkage of the insulating layer 20 due to environmental changes.
- favorable environmental resistance moisture resistance, heat resistance
- the electrostatic breakdown voltage value (withstand voltage value) can be increased by the laminated structure of the base layer 35 and the metal layer 36 made of ITO, and the electrostatic breakdown resistance can be improved.
- the maximum thickness of the insulating layer 20 is about 0.5 to 4 ⁇ m
- the thickness of the underlayer 35 is about 5 to 40 nm
- the thickness of the metal layer 36 is about 2 to 20 nm.
- the width dimension (length dimension in the Y1-Y2 direction) of the bridge wiring is about 5 to 50 ⁇ m
- the length dimension (length dimension in the X1-X2 direction) is about 150 to 500 ⁇ m.
- the bridge wiring 10 is compared with the case where the bridge wiring is formed with a single ITO film.
- the invisible characteristics can be improved by forming the metal layer 36 with a small thickness and a small width.
- ITO for the underlayer 35 made of ITO and the transparent electrodes 4 and 5, it is possible to ensure good electrical bonding as well as good adhesion.
- the bridge wiring 10 includes a transparent underlayer 35 made of ITO formed from the surface 20a of the insulating layer 20 to the surface 5a of the second transparent electrode 5. And a transparent metal layer 36 formed on the surface of the underlayer 35 and having a resistance lower than that of the underlayer 35 and a transparent protective layer 37 made of ITO formed on the surface of the metal layer 36.
- the thickness of the conductive oxide protective layer 37 made of ITO is about 5 to 40 nm.
- the surface of the metal layer 36 is covered with a conductive oxide protective layer 37 made of ITO, so that the conductive oxide protective layer 37 is replaced with the acrylic pressure-sensitive adhesive shown in FIG. It can be made to function as a barrier layer against moisture caused by the water absorption of the optically transparent adhesive layer (OCA) 30 formed by, for example.
- the conductive oxide protective layer 37 is most preferably made of highly transparent ITO. Thereby, the resistance of the bridge wiring can be lowered and the electrostatic breakdown resistance can be improved.
- ZnO or In 2 O 3 can be used as the conductive oxide protective layer.
- the reflectance of the bridge wiring 10 can be suppressed, and as a result, the transmittance / reflectance ratio can be increased, and the invisible characteristics can be further increased. It can be improved effectively.
- adhesion between the bridge wiring 10 and the insulating layer 20 is improved by laying the base layer 35 made of ITO under the metal layer 36. be able to. Further, the base layer 35 can also function as a barrier layer against moisture caused by the water absorption of the insulating layer 20. Therefore, as shown in FIG. 3B, by providing the base layer 35 made of ITO and the conductive oxide protective layer 37 on the front and back surfaces of the metal layer 36, the environmental resistance can be improved more effectively. Can do.
- the underlayer 35 made of ITO can increase the electrostatic breakdown voltage value (withstand voltage value) and improve the electrostatic breakdown resistance. Further, by using ITO for the underlayer 35 made of ITO and the transparent electrodes 4 and 5, it is possible to ensure good electrical bonding as well as good adhesion.
- the surface of the metal layer 36 is in contact with the optically transparent adhesive layer (OCA) 30, but the two-layer structure is shown in the experimental results described below.
- Environmental resistance that can be used as the input device 1 was obtained.
- the transparent electrodes 4 and 5, the insulating layer 20, and the bridge wiring 10 are provided on the surface 2 a facing the panel 3 of the transparent substrate 2.
- bridging wiring 10 can also be provided in the back surface 2b (1st surface) side of the transparent base material 2.
- OCA optical transparent adhesive layer
- the connecting portion 7 that connects the first transparent electrodes 4 can be formed of ITO. That is, each first transparent electrode 4 and the connecting portion can be integrally formed.
- amorphous ITO can be used as the ITO constituting the base layer 35 and the conductive oxide protective layer 37 of the bridge wiring 10.
- the base layer 35 and the conductive oxide protective layer 37 can also be formed of crystalline ITO.
- FIG. 4 is a process diagram showing a method for manufacturing the input device 1 in the present embodiment.
- the left figure of FIG. 4 is a partial longitudinal sectional view, and the right figure is a plan view. The left figure and the right figure have different dimensional ratios.
- the partial vertical sectional view shown in FIG. 4 is cut along the X1-X2 direction in the same manner as the partial vertical sectional view shown in FIG. In FIG. 4, the transparent electrodes 4 and 5 are shown.
- the transparent electrodes 4 and 5 made of ITO are formed on the surface 2a of the transparent substrate 2.
- the connecting portion 7 for connecting the first transparent electrodes 4 and 4 is formed integrally with the first transparent electrode 4 from ITO.
- an insulating layer made of a novolac resin or the like that covers the top of the connecting portion 7 and fills the space between the second transparent electrodes 5 located on both sides of the connecting portion 7 in the X1-X2 direction. 20 is formed. At this time, it is preferable to perform bleaching to make the insulating layer 20 transparent by overall exposure.
- each transparent electrode 4, 5, the surface of the insulating layer 20, and the surface of the transparent substrate 2 is a base layer 35 made of ITO / metal layer 36 made of Au alloy or the like.
- a bridge wiring 10 having a two-layer structure, or a three-layer structure of an underlayer 35 / Au made of ITO, a metal layer 36 made of Au alloy or the like, and a conductive oxide protective layer 37 made of ITO is formed.
- each layer of the base layer 35, the metal layer 36, and the conductive oxide protective layer 37 is formed by sputtering or vapor deposition.
- the bridge wiring 10 is elongated in the X1-X2 direction from the surface of the insulating layer 20 to the surface of the second transparent electrode 4 located on both sides of the insulating layer 20 by using a photolithography technique or the like. Leave in shape. At this time, it is preferable to perform selective etching so that the surfaces of the transparent electrodes 4 and 5 are not scraped. Thereby, the second transparent electrodes 5 and 5 can be electrically connected via the bridge wiring 10.
- the surface 2 a side of the transparent substrate 2 and the panel 3 whose surface is the operation surface 3 a are joined via the optical transparent adhesive layer 30.
- the input device in this embodiment is used for a mobile phone, a digital camera, a PDA, a game machine, a car navigation system, and the like.
- a transparent electrode (ITO) having a structure shown in FIG. 2, an insulating layer (novolak resin), and a bridge wiring were formed on a transparent substrate.
- the bridge wirings connecting the second transparent electrodes are amorphous ITO (underlayer) / Au (metal layer) / amorphous ITO (conductive oxide protective layer) of Examples 1 to 3 shown in Table 1 below.
- Table 1 shows the thickness of each layer, the width of the bridge wiring (the length in the Y1-Y2 direction shown in FIG. 2A), and the length of the bridge wiring (X1-X2 shown in FIG. 2A). Direction length).
- the transmittance and reflectance shown in Table 1 were measured in a state (solid film state) formed on the entire surface of the substrate before processing into the shape of the bridge wiring.
- the invisible rank shown in Table 1 is based on the ITO single layer film of Comparative Example 3.
- a bridge wiring made of ITO was seen.
- ⁇ indicates that the bridge wiring is not visible compared to Comparative Example 3, but the bridge wiring is visible when tilted, ⁇ indicates that 10% or less of the total number of bridge wiring is visible when tilted, and ⁇ indicates the bridge wiring when tilted Is invisible.
- the sheet resistance value Rs of the bridge wiring the case where it is larger than 60 ⁇ / ⁇ is rated as “X”, 40-60 ⁇ / ⁇ is evaluated as “ ⁇ ”, and the value less than 40 ⁇ / ⁇ is evaluated as “ ⁇ ”.
- the change rate is ⁇ 100% or more, or ⁇ when the wire is disconnected, and the change rate is ⁇ 30% or more ⁇
- the case where it was less than 100% was evaluated as ⁇ , and the case where the rate of change was within ⁇ 30% was evaluated as ⁇ .
- the adhesiveness in the environmental test in a dry atmosphere at 85 ° C. was evaluated as x when there was a disconnection and ⁇ when there was no disconnection.
- ESD Electro-Static Discharge
- Comparative Example 1 As shown in Table 1, in Comparative Example 1, the ESD characteristics (electrostatic breakdown voltage) were lowered, and it became unusable. In Comparative Example 2, disconnection occurred in the environmental resistance test. In Comparative Example 2, Ti as a base could not follow the shrinkage of the insulating layer (novolak resin), and peeled off and disconnected.
- the three-layered Examples 1 to 3 in which ITO is formed on the front and back surfaces of Au can suppress the reflectivity compared with Examples 4 to 6 in which the ITO / Au two-layered structure is used. As a result, the transmittance / reflectance ratio could be increased, and good invisible characteristics could be obtained.
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Abstract
Description
透明基材と、前記透明基材の第1の面に形成された複数の透明電極と、前記透明電極間を電気的に接続するブリッジ配線と、前記透明基材と前記ブリッジ配線間に形成された絶縁層と、を有し、
前記ブリッジ配線は、前記絶縁層の表面と接するITOからなる下地層と、前記下地層の表面に形成された金属層と、を有して構成されることを特徴とするものである。
2 透明基材
3 パネル
4 第1の透明電極
5 第2の透明電極
6 配線部
7 連結部
10 ブリッジ配線
11 表示領域
20 絶縁層
25 加飾領域
30 光学透明粘着層(OCA)
35 下地層
36 金属層
37 導電性酸化物保護層
Claims (9)
- 透明基材と、前記透明基材の第1の面に形成された複数の透明電極と、前記透明電極間を電気的に接続するブリッジ配線と、前記透明基材と前記ブリッジ配線間に形成された絶縁層と、を有し、
前記ブリッジ配線は、前記絶縁層の表面と接するITOからなる下地層と、前記下地層の表面に形成された金属層と、を有して構成されることを特徴とする入力装置。 - 前記金属層は、Au、Au合金、CuNi、あるいはNiである請求項1記載の入力装置。
- 前記金属層は、Auで形成される請求項2記載の入力装置。
- 前記金属層の表面に導電性酸化物保護層が形成される請求項1ないし3のいずれか1項に記載の入力装置。
- 前記導電性酸化物保護層は、ITOからなる請求項4記載の入力装置。
- 前記透明電極は、複数の第1の透明電極と、複数の第2の透明電極とを備え、各第1の透明電極が第1の方向に連結されており、前記第1の透明電極の連結位置に前記絶縁層が形成され、前記絶縁層の絶縁表面を通って形成された前記ブリッジ配線により各第2の透明電極が、前記第1の方向と交叉する第2の方向に連結されている請求項1ないし5のいずれか1項に記載の入力装置。
- 前記絶縁層は、ノボラック樹脂で形成される請求項1ないし6のいずれか1項に記載の入力装置。
- 前記ブリッジ配線の表面には、透明基材間の接合材である光学透明粘着層が接している請求項1ないし7のいずれか1項に記載の入力装置。
- 透明基材の第1の面側と、表面が操作面であるパネル間が前記光学透明粘着層により接合されている請求項8記載の入力装置。
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CN201290001166.XU CN204166512U (zh) | 2012-02-10 | 2012-04-12 | 输入装置 |
KR1020147022302A KR101562487B1 (ko) | 2012-02-10 | 2012-04-12 | 입력 장치 |
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JP2012026901A JP5075282B1 (ja) | 2012-02-10 | 2012-02-10 | 入力装置 |
JP2012-026901 | 2012-11-05 |
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KR (1) | KR101562487B1 (ja) |
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JP6002047B2 (ja) * | 2013-01-11 | 2016-10-05 | アルプス電気株式会社 | 入力装置 |
CN104699285B (zh) * | 2013-12-09 | 2017-11-21 | 宸鸿科技(厦门)有限公司 | 触控感测结构及其形成方法 |
JP5849110B2 (ja) * | 2014-01-09 | 2016-01-27 | アルプス電気株式会社 | 入力装置 |
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JP6444787B2 (ja) * | 2015-03-23 | 2018-12-26 | 太陽誘電株式会社 | 弾性波デバイスおよびその製造方法 |
JP2016224631A (ja) * | 2015-05-28 | 2016-12-28 | 大日本印刷株式会社 | タッチパネルセンサ、タッチパネルモジュール、及びタッチパネルセンサ付きカラーフィルタ |
CN109791458B (zh) * | 2016-10-06 | 2022-02-25 | 阿尔卑斯阿尔派株式会社 | 静电电容式传感器 |
CN110096169B (zh) * | 2018-01-30 | 2021-01-22 | 京东方科技集团股份有限公司 | 触控基板及其制造方法、电子装置 |
CN113433747B (zh) * | 2021-07-12 | 2023-06-27 | 武汉华星光电技术有限公司 | 阵列基板及制作方法、移动终端 |
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WO2010150668A1 (ja) * | 2009-06-23 | 2010-12-29 | ジオマテック株式会社 | 静電容量型入力装置及びその製造方法 |
JP2011128674A (ja) * | 2009-12-15 | 2011-06-30 | Sony Corp | 静電容量型入力装置およびその製造方法 |
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CN104777924A (zh) * | 2014-01-09 | 2015-07-15 | 宸鸿科技(厦门)有限公司 | 触控面板及其制作方法 |
CN104777924B (zh) * | 2014-01-09 | 2018-03-02 | 宸鸿科技(厦门)有限公司 | 触控面板及其制作方法 |
CN109032402A (zh) * | 2018-07-03 | 2018-12-18 | 京东方科技集团股份有限公司 | 一种柔性触控面板的制作方法、柔性触控面板和装置 |
US20200013831A1 (en) * | 2018-07-03 | 2020-01-09 | Hefei Xinsheng Optoelectronics Technology Co., Ltd. | Flexible touch panel, method for manufacturing the same and flexible touch device |
US10950671B2 (en) * | 2018-07-03 | 2021-03-16 | Hefei Xinsheng Optoelectronics Technology Co., Ltd. | Flexible touch panel, method for manufacturing the same and flexible touch device |
CN109032402B (zh) * | 2018-07-03 | 2021-09-03 | 京东方科技集团股份有限公司 | 一种柔性触控面板的制作方法、柔性触控面板和装置 |
Also Published As
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KR101562487B1 (ko) | 2015-10-21 |
TW201337680A (zh) | 2013-09-16 |
TWI489343B (zh) | 2015-06-21 |
JP5075282B1 (ja) | 2012-11-21 |
JP2013164698A (ja) | 2013-08-22 |
KR20140115345A (ko) | 2014-09-30 |
CN204166512U (zh) | 2015-02-18 |
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