WO2015120754A1 - 具加热装置的模具 - Google Patents

具加热装置的模具 Download PDF

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Publication number
WO2015120754A1
WO2015120754A1 PCT/CN2015/070138 CN2015070138W WO2015120754A1 WO 2015120754 A1 WO2015120754 A1 WO 2015120754A1 CN 2015070138 W CN2015070138 W CN 2015070138W WO 2015120754 A1 WO2015120754 A1 WO 2015120754A1
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WO
WIPO (PCT)
Prior art keywords
conductive
mold
heating
layer
insulating
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Application number
PCT/CN2015/070138
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English (en)
French (fr)
Inventor
刘忠男
Original Assignee
刘忠男
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 刘忠男 filed Critical 刘忠男
Priority to JP2016550770A priority Critical patent/JP6230719B2/ja
Priority to US15/231,761 priority patent/US10093038B2/en
Priority to DE112015000748.2T priority patent/DE112015000748T5/de
Publication of WO2015120754A1 publication Critical patent/WO2015120754A1/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/02—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/52—Heating or cooling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/02—Details
    • H05B3/06—Heater elements structurally combined with coupling elements or holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/02—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means
    • B29C2033/023—Thermal insulation of moulds or mould parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0003—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
    • B29K2995/0005—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0003—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
    • B29K2995/0007—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0012—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular thermal properties
    • B29K2995/0013—Conductive

Definitions

  • the present invention relates to a mold for a thermoplastic or thermosetting process, and more particularly to a mold having a heating device.
  • a heat-conducting coil having a high-frequency induced induction magnetic wave is disposed inside the mold or on a parting surface of the mold, and the heat-conducting coil is connected with the high-frequency power supply system to load a high-frequency current on the heat-conductive coil.
  • the high-frequency furnace itself is an electric energy source. Although it has no safety concerns, the equipment cost is high, and the high frequency is only effective for the shallow depth and the flat mold cavity. It is difficult to apply to the complex shape of the mold surface, and both have The problem of uneven heating is that the temperature distribution on the surface of the mold is uneven, and there are problems such as unstable induction current, long heating time, and high power consumption.
  • a conductive layer, an insulating layer, and two electrodes and two conductive units are disposed in the upper mold or the lower mold, and the resistivity of the conductive unit is lower than the conductive
  • the resistivity of the layer is such that the surface temperature distribution of the upper or lower mold is uniform.
  • the two conductive units are respectively disposed on both sides of the conductive layer, and the two conductive units directly penetrate The external cavity does not correspond to the cavity. Therefore, in addition to causing inconvenience in power supply configuration, the current required for heating cannot be collected, and the heating effect of the cavity heating zone is not good.
  • the technical problem to be solved by the present invention is to provide a mold having a heating device which mainly enhances the heating effect of the heating zone of the mold.
  • the present invention provides a mold having a heating device, comprising: a conductive layer having a first conductive surface, a second conductive surface opposite to the first conductive surface, and a first conductive surface a heating portion of the conductive surface, and a first conductive side and a second conductive side connecting the first and second conductive surfaces; an insulating layer is insulatively bonded to the conductive layer and has a bonding to the second conductive surface a first insulating surface, a second insulating surface opposite to the first insulating surface, and first and second insulating sides connected to the first and second insulating surfaces and respectively on the same side of the first and second conductive sides a heating device, including At least one first conductive unit and at least one second conductive unit, wherein: the first conductive unit has a first electrode portion electrically connected to the first conductive side, and is electrically connected to the first electrode portion a first connecting portion insulated from the conductive layer, a first inner conductive portion electrically connected
  • the heating portion of the conductive layer is recessed in a groove shape from the first conductive surface toward the second conductive surface.
  • the upper mold further comprises a lower mold adjacent to or away from the upper mold, and the lower mold is composed of the conductive layer and the insulating layer.
  • the heating portion of the conductive layer is convexly convex from the first conductive surface in a direction opposite to the second conductive surface.
  • the upper mold further comprises a lower mold adjacent to or away from the upper mold, and the upper mold is composed of the conductive layer and the insulating layer.
  • the second conductive unit further has an adjustment section electrically connected to the second outer conductive section, and the adjustment section is located in the insulating layer and between the heating part and the first inner conductive section.
  • the adjustment section of the second conductive unit is provided with a through hole corresponding to the heating portion.
  • the second conductive unit further has a shielding segment electrically connected to the second outer conductive segment, the shielding segment being located in the insulating layer and located between the first inner conductive segment and the second insulating surface.
  • the first and second conductive units are in a plate shape.
  • the first electrode portion of the first conductive unit has a first through hole
  • the first connecting portion, the first inner conductive portion and the first outer conductive portion are tubular
  • the first connecting portion is inserted into the a first through hole
  • the second electrode portion of the second conductive unit has a second through hole
  • the second outer conductive portion is tubular and inserted into the second through hole and the insulating sleeve is disposed on the first outer conductive portion.
  • the two conductive units further have a tubular adjustment section electrically connected to the second outer conductive section, and the adjustment section is located in the insulating layer and is insulated from the first inner conductive section.
  • Figure 1 is a perspective view of a first embodiment of the present invention.
  • Figure 2 is a schematic cross-sectional view showing a first embodiment of the present invention.
  • FIG 3 is a perspective view showing a first embodiment of the present invention, showing a stereoscopic state of a first conductive unit and a second conductive unit.
  • Figure 4 is a cross-sectional view showing a second embodiment of the present invention.
  • Figure 5 is a perspective view of a second embodiment of the present invention showing the stereoscopic state of a first conductive unit and a second conductive unit.
  • Figure 6 is a schematic cross-sectional view showing a third embodiment of the present invention.
  • Figure 7 is a cross-sectional view showing a fourth embodiment of the present invention.
  • Figure 8 is a perspective view showing a third embodiment of the present invention, showing a stereoscopic state of a first conductive unit and a second conductive unit.
  • Figure 9 is a perspective view of a fifth embodiment of the present invention.
  • Fig. 10 is a perspective view showing a fifth embodiment of the present invention, showing a state in which the first and second conductive units are in a plate shape.
  • Figure 11 is a perspective view of a sixth embodiment of the present invention.
  • Fig. 12 is a perspective view showing a sixth embodiment of the present invention, showing a state in which the first and second conductive units are in a plate shape.
  • Figure 13 is a cross-sectional view showing a seventh embodiment of the present invention.
  • Figure 14 is a perspective view of a seventh embodiment of the present invention.
  • Figure 15 is a perspective view showing a seventh embodiment of the present invention, showing the three-dimensional state of the first conductive unit and the second conductive unit.
  • Figure 16 is a perspective view of an eighth embodiment of the present invention.
  • Figure 17 is a perspective view of a ninth embodiment of the present invention.
  • Insulation layer 20, 20A, 20B Insulation layer 20, 20A, 20B
  • a mold having a heating device according to a first embodiment of the present invention is mainly composed of a conductive layer 10, an insulating layer 20, and a heating device, wherein:
  • the conductive layer 10 is made of steel (or aluminum) and has a first conductive surface 11 , a second conductive surface 12 opposite to the first conductive surface 11 , and a first conductive surface disposed on the first conductive surface a heating portion 13 of the first conductive surface 13 and a first conductive side surface 14 and a second conductive side surface 15 connected to the first and second conductive surfaces 11 and 12; in the embodiment, the heating portion 13 is formed by the first conductive surface 11
  • the second conductive surface 12 side The concave portion is formed in a groove shape, and the first conductive side surface 14 and the second conductive side surface 15 are respectively located on the left and right sides of the second drawing surface.
  • the insulating layer 20 is insulatively bonded to the conductive layer 10 and has a first insulating surface 21 bonded to the second conductive surface 12, a second insulating surface 22 opposite to the first insulating surface 21, and a first and second insulating side surfaces 23, 24 connected to the first and second insulating surfaces 21, 22 and on the same side of the first and second conductive sides 14, 15 respectively; in the embodiment, the insulating layer 20 and the conductive layer
  • the layer 10 can be electrically insulated by electrical insulation treatment or anodization.
  • the insulation layer 20 can also be made of stone material or ceramic material, and can also be electrically insulated from the conductive layer 10.
  • the heating device comprises three first conductive units 30 and three second conductive units 40, wherein:
  • Each of the first conductive units 30 has a first electrode portion 31 electrically connected to the first conductive side surface 14 , a first connecting portion 32 electrically connected to the first electrode portion 31 and insulated from the conductive layer 10 , a first inner conductive portion 33 electrically connected to the first connecting portion 32 and located in the insulating layer 20 and corresponding to the heating portion 13, and an electrical connection between the first inner conductive portion 33 and the second insulating side
  • each of the first outer conductive segments 34 is connected to a power source 90 and has a plate shape, and each of the first conductive units 30 is made of copper or a surface of silver or gold.
  • Each of the second conductive units 40 has a second electrode portion 41 electrically connected to the second conductive side surface 15 and is electrically connected to the second electrode portion 41 and located outside the second insulating side surface 24 and
  • the second outer conductive segment 42 is insulated from the first outer conductive segment 34, and the second outer conductive segment 42 is located on the same side as the first outer conductive segment 34.
  • each of the second outer conductive segments 42 is connected.
  • a power source 90 is disposed and has a plate shape, and each of the second conductive units 40 is copper or the surface is coated with silver or gold.
  • the first conductive unit 30 has a pair of first inner conductive segments 33 that should be the heating portion 13 of the conductive layer 10. Therefore, by the configuration of the first and second conductive units 30, 40, the conductive layer 10 can be controlled to flow through.
  • the current path is such that the current can be collected on the first conductive surface 11 of the conductive layer 10, especially concentrated on the surface of the heating portion 13, so that it is preheated from the room temperature to reach the operating temperature, thereby improving the heating of the mold.
  • the purpose of the district heating effect is that the first outer conductive segments 34 of the first conductive unit 30 and the second outer conductive segments 42 of the second conductive units 40 are relatively simple when the power source 90 is connected.
  • a mold having a heating device according to a second embodiment of the present invention is the same It is composed of a conductive layer 10, an insulating layer 20, and a heating device. Since its configuration and function are the same as those in the first embodiment, it will not be described again.
  • the second embodiment differs in that:
  • Each of the second conductive units 40 further has an adjustment section 43 electrically connected to the second outer conductive section 42 .
  • the adjustment section 43 is located in the insulating layer 20 and located in the heating part 13 and the first inner conductive section 33 . According to this, the current flowing through the conductive layer 10 can be more controlled, so that the current can be more concentrated and collected on the surface of the heating portion 13 to be preheated by the room temperature to reach the working temperature, thereby improving the heating effect of the heating zone of the mold. the goal of.
  • a mold with a heating device according to a third embodiment of the present invention is also composed of a conductive layer 10, an insulating layer 20, and a heating device, because its configuration and efficacy are the same.
  • the second embodiment is not described again.
  • the third embodiment differs in that:
  • the adjusting portion 43 of the second conductive unit 40 is provided with a through hole 431 corresponding to the heating portion 13, and the optimal position of the through hole 431 is set according to the distance between the surface of the heating portion 13 and the adjusting portion 43, for example, Referring to FIG. 6, at the first position A of the heating portion 13, the distance L1 between the surface of the heating portion 13 and the adjustment portion 43 is greater than the second position B of the heating portion 13 to the adjustment portion 43.
  • the distance L2 is such that a perforation 431 can be provided in the adjustment section 43 relative to the first position A of the heating portion 13, so as to effectively control the path of the current circulation, thereby improving the heating effect of the heating zone of the mold.
  • a mold having a heating device according to a fourth embodiment of the present invention is also composed of a conductive layer 10, an insulating layer 20, and a heating device, due to its configuration and efficacy.
  • the fourth embodiment differs in that:
  • the second conductive unit 40 further has a shielding portion 44 electrically connected to the second outer conductive portion 42 .
  • the shielding portion 44 is located in the insulating layer 20 and located in the first inner conductive portion 33 and the second insulating surface 24 . Between, by effectively controlling the path of the current circulation, the purpose of improving the heating effect of the heating zone of the mold is achieved. It is worth mentioning that the shielding segment 44 and the first conductive unit 30 are still insulated.
  • a mold having a heating device according to a fifth embodiment of the present invention is also composed of a conductive layer 10A, an insulating layer 20A, and a heating device, due to its configuration and efficacy.
  • the fifth embodiment differs in that:
  • the number of the first and second conductive units 30A, 40A of the heating device is a plate shape, and the entire area of the first inner conductive portion 33A of the first conductive unit 30A is the heating corresponding to the conductive layer 10A.
  • the portion 13A is used for the purpose of improving the heating effect of the heating zone of the mold.
  • a mold having a heating device according to a sixth embodiment of the present invention is the same
  • the present invention is composed of a conductive layer 10A, an insulating layer 20A, and a heating device. Since its configuration and function are the same as those of the first embodiment, it will not be described again.
  • the sixth embodiment is different in that:
  • the number of the first and second conductive units 30A, 40A of the heating device is a plate shape, and the entire area of the first inner conductive portion 33A of the first conductive unit 30A is the heating portion corresponding to the conductive layer 10A.
  • the second conductive unit 40A further has an adjustment section 43A electrically connected to the second outer conductive section 42A.
  • the adjustment section 43A is located in the insulating layer 20A and is located in the heating part 13A and the first inner conductive section.
  • a mold having a heating device according to a seventh embodiment of the present invention is also composed of a conductive layer 10B, an insulating layer 20B, and a heating device, due to its configuration. And the effect is the same as the first embodiment, so it will not be described again.
  • the seventh embodiment is different in that:
  • the first electrode portion 31B of the first conductive unit 30B has a first through hole 311B.
  • the first connecting portion 32B, the first inner conductive portion 33B and the first outer conductive portion 34B are tubular, and the first connecting portion 32B is inserted.
  • the second electrode portion 41B of the second conductive unit 40B has a second through hole 411B.
  • the second outer conductive portion 42B is tubular and inserted into the second through hole 411B and the insulating sleeve.
  • the first outer conductive portion 34B, the second conductive unit 40B further has a tubular adjusting portion 43B electrically connected to the second outer conductive portion 42B.
  • the adjusting portion 43B is located in the insulating layer 20B and is insulated and sleeved.
  • the first inner conductive segment 33B is used for the purpose of improving the heating effect of the heating zone of the mold.
  • a mold with a heating device according to an eighth embodiment of the present invention is also composed of a conductive layer 10, an insulating layer 20, and a heating device, because its configuration and efficacy are the same.
  • the first embodiment is not described again.
  • the eighth embodiment differs in that:
  • the lower mold is composed of the conductive layer 10 and the insulating layer 20, and the first conductive unit 30 of the heating device and The second conductive unit 40 is provided in the lower mold 52.
  • a mold with a heating device according to a ninth embodiment of the present invention is also composed of a conductive layer 10, an insulating layer 20, and a heating device, because its configuration and efficacy are the same.
  • the first embodiment is not described again.
  • the difference in the ninth embodiment is that:
  • the conductive layer 10 and the insulating layer 20 are formed, and the first conductive unit 30 and the second conductive unit 40 of the heating device are disposed on the upper mold 51, and the heating portion 13 of the conductive layer 10 is
  • the first conductive surface 11 is convexly convex in a direction opposite to the second conductive surface 12 .

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Resistance Heating (AREA)
  • Central Heating Systems (AREA)

Abstract

本发明公开了一种具加热装置的模具，其主要是由一上模、一下模、一导电层、一绝缘层、至少一对电极，是能够导电地设于该导电层、至少一第一导电单元、及至少一第二导电单元，由于将各该第一导电单元的第一外导电段、以及各该第二导电单元的第二外导电段皆同由该导电层的导电侧面所穿出，而位在该导电层的同一侧面，且该第一导电单元具有一对应该下模模穴的第一内导电段、以及该第二导电单元较该第一导电单元靠近该导电层的绝缘表面，因此，藉由该第一、二导电单元的配置，能够控制流经该导电层的电流路径，使该电流较能集中汇集在该导电层表面，特别是集中汇集在模穴，使其由室温预热达工作温度，藉以达到提升该模具模穴加热区加热效果的目的。

Description

具加热装置的模具 技术领域
本发明涉及热塑性制程或热固性制程用的模具，特别是指一种具加热装置的模具。
背景技术
按常规模具的加热方法或装置，皆是于模具内部或者于模具的分模面设置具备高周波诱导感应磁波的导热线圈，并使导热线圈与高周波电源供应系统连接，以加载高周波电流于该导热线圈，藉以将模具由室温预热达工作温度，同时将加热限定在模具和材料之间的接触面上。
然而高周波炉本身为电力能源，虽较无安全性方面的虞虑，但设备成本高，而且高周波仅对深度浅与平板状模穴有效，对于形状复杂的模仁表面较难适用，且皆有加热不均匀的问题，亦即模具表面温度分布不均，且有感应电流不稳定、加热时间长、耗电量高等问题。
为此，WO 2010/104129 A1专利前案中，揭露在上模或下模中配置一导电层、一绝缘层、及搭配二电极与二导电单元，并使导电单元的电阻系数低于该导电层的电阻系数，藉以使该上模或下模的表面温度分布均匀，然而，该专利前案是将该二导电单元分别设于该导电层的两侧面，且该二导电单元直接穿出于外而无与该模穴相互对应，因此，除了造成电源配置不便之外，加热所需的电流无法汇集而造成模穴加热区的加热效果不彰。
发明内容
本发明所要解决的技术问题在于提供一种具加热装置的模具，其主要提升该模具加热区的加热效果。
为解决上述问题，本发明所提供一种具加热装置的模具，包含：一导电层，具有一第一导电表面、一反向于该第一导电表面的第二导电表面、一设于该第一导电表面的加热部、及一连接该第一、二导电表面的第一导电侧面及第二导电侧面；一绝缘层，绝缘地结合于该导电层，并具有一结合于该第二导电表面的第一绝缘表面、一反向于该第一绝缘表面的第二绝缘表面、及一连接该第一、二绝缘表面且分别与该第一、二导电侧面同侧的第一、二绝缘侧面；一加热装置，包含 至少一第一导电单元及至少一第二导电单元，其中：该第一导电单元，具有一电性连接该第一导电侧面的第一电极部、一电性连接该第一电极部且与该导电层绝缘的第一连接部、一电性连接该第一连接部且位于该绝缘层内并对应该加热部的第一内导电段、及一电性连接该第一内导电段且位于该第二绝缘侧面之外的第一外导电段；该第二导电单元，具有一电性连接该第二导电侧面的第二电极部、及一电性连接该第二电极部且位于该第二绝缘侧面之外并与该第一外导电段绝缘的第二外导电段。
较佳地，该导电层的加热部是由该第一导电表面朝该第二导电表面方向凹设呈槽状。
较佳地，更包含一上模、及一与该上模相互靠近或远离的下模，该下模是由该导电层与绝缘层所组成。
较佳地，该导电层的加热部是由该第一导电表面朝该第二导电表面反方向凸设呈凸状。
较佳地，更包含一上模、及一与该上模相互靠近或远离的下模，该上模是由该导电层与绝缘层所组成。
较佳地，该第二导电单元更具有一电性连接该第二外导电段的调整段，该调整段位于该绝缘层内且位于该加热部与该第一内导电段之间。
较佳地，该第二导电单元的调整段对应该加热部设有穿孔。
较佳地，该第二导电单元更具有一电性连接该第二外导电段的遮蔽段，该遮蔽段位于该绝缘层内且位于该第一内导电段与该第二绝缘表面之间。
较佳地，该第一、二导电单元皆呈板状。
较佳地，该第一导电单元的第一电极部具有一第一穿孔，该第一连接部、第一内导电段与第一外导电段为管状，且该第一连接部插置于该第一穿孔，该第二导电单元的第二电极部具有一第二穿孔，该第二外导电段为管状并插置于该第二穿孔及绝缘的套设该第一外导电段，该第二导电单元更具有一电性连接该第二外导电段且为管状的调整段，该调整段位于该绝缘层内且绝缘套设该第一内导电段。
附图说明
图1是本发明第一实施例的立体图。
图2是本发明第一实施例的剖面示意图。
图3是本发明第一实施例的立体图，显示一第一导电单元、及一第二导电单元的立体状态。
图4是本发明第二实施例的剖面示意图。
图5是本发明第二实施例的立体图，显示一第一导电单元、及一第二导电单元的立体状态。
图6是本发明第三实施例的剖面示意图。
图7是本发明第四实施例的剖面示意图。
图8是本发明第四实施例的立体图，显示一第一导电单元、及一第二导电单元的立体状态。
图9是本发明第五实施例的立体图。
图10是本发明第五实施例的立体图，显示第一、二导电单元呈板状的状态。
图11是本发明第六实施例的立体图。
图12是本发明第六实施例的立体图，显示第一、二导电单元呈板状的状态。
图13是本发明第七实施例的剖面示意图。
图14是本发明第七实施例的立体图。
图15是本发明第七实施例的立体图，显示第一导电单元、及第二导电单元的立体状态。
图16是本发明第八实施例的立体图。
图17是本发明第九实施例的立体图。
附图标记说明
导电层 10、10A、10B
第一导电表面 11
第二导电表面 12
加热部 13、13A
第一导电侧面 14
第二导电侧面 15
绝缘层 20、20A、20B
第一绝缘表面 21
第二绝缘表面 22
第一绝缘侧面 23
第二绝缘侧面 24
第一导电单元 30、30A、30B
第一电极部 31、31B
第一穿孔 311B
第一连接部 32、32B
第一内导电段 33、33A、33B
第一外导电段 34、34B
第二导电单元 40、40A、40B
第二电极部 41、41B
第二穿孔 411B
第二外导电段 42、42A、42B
调整段 43、43A、43B
穿孔 431
遮蔽部 44
上模 51
下模 52
电源 90
距离 L1、L2
第一位置 A
第二位置 B
具体实施方式
参阅图1、2、3所示，本发明第一实施例所提供的一种具加热装置的模具，主要是由一导电层10、一绝缘层20、以及一加热装置所组成，其中：
该导电层10，为钢材(或铝材)所制成，并具有一第一导电表面11、一反向于该第一导电表面11的第二导电表面12、一设于该第一导电表面11的加热部13、及一连接该第一、二导电表面11、12的第一导电侧面14及第二导电侧面15；本实施例中，该加热部13是由该第一导电表面11朝该第二导电表面12方 向凹设呈槽状，且该第一导电侧面14及第二导电侧面15分别位于第2图图面的左右两侧。
该绝缘层20，绝缘地结合于该导电层10，并具有一结合于该第二导电表面12的第一绝缘表面21、一反向于该第一绝缘表面21的第二绝缘表面22、及一连接该第一、二绝缘表面21、22且分别与该第一、二导电侧面14、15同侧的第一、二绝缘侧面23、24；本实施例中，该绝缘层20与该导电层10可透过电气绝缘处理或阳极处理来达到电性绝缘的状态，该绝缘层20亦可选自制石材或陶瓷材质所制成，同样可与该导电层10达到电性绝缘的状态。
该加热装置，包含三第一导电单元30及三第二导电单元40，其中：
各该第一导电单元30，具有一电性连接该第一导电侧面14的第一电极部31、一电性连接该第一电极部31且与该导电层10绝缘的第一连接部32、一电性连接该第一连接部32且位于该绝缘层20内并对应该加热部13的第一内导电段33、及一电性连接该第一内导电段33且位于该第二绝缘侧面24之外的第一外导电段34；本实施例中，各该第一外导电段34接设一电源90，并呈板状，且各该第一导电单元30为铜或表面批覆银或金。
各该第二导电单元40，具有一电性连接该第二导电侧面15的第二电极部41、及一电性连接该第二电极部41且位于该第二绝缘侧面24之外并与该第一外导电段34绝缘的第二外导电段42，使该第二外导电段42与该第一外导电段34位在同一侧，本实施例中，各该第二外导电段42接设一电源90，并呈板状，且各该第二导电单元40为铜或表面批覆银或金。
据此，由于各该第一导电单元30的第一外导电段34、以及各该第二导电单元40的第二外导电段42皆且位于该第二绝缘侧面24之外而呈同一侧，且该第一导电单元30具有一对应该导电层10加热部13的第一内导电段33，因此，藉由该第一、二导电单元30、40的配置，能够控制流经该导电层10的电流路径，使该电流较能汇集在该导电层10的第一导电表面11，特别是集中汇集在该加热部13的表面，使其由室温预热达工作温度，藉以达到提升该模具加热区加热效果的目的，同时，使得各该第一导电单元30的第一外导电段34、以及各该第二导电单元40的第二外导电段42在接设电源90时较为简易。
参阅图4、5，本发明第二实施例所提供的一种具加热装置的模具，其同样 是由一导电层10、一绝缘层20、以及一加热装置所组成，由于其组态及功效同于第一实施例，故不再赘述，至于第二实施例不同之处在于：
各该第二导电单元40更具有一电性连接该第二外导电段42的调整段43，该调整段43位于该绝缘层20内且位于该加热部13与该第一内导电段33之间，据此，更能控制流经该导电层10的电流，使该电流更能集中汇集在该加热部13表面，使其由室温预热达工作温度，藉以达到提升该模具加热区加热效果的目的。
参阅图6，本发明第三实施例所提供的一种具加热装置的模具，其同样是由一导电层10、一绝缘层20、以及一加热装置所组成，由于其组态及功效同于第二实施例，故不再赘述，至于第三实施例不同之处在于：
该第二导电单元40的调整段43对应该加热部13设有穿孔431，而该穿孔431的最佳设置位置是依照该加热部13表面与该调整段43之间的距离而设，例如，参阅第6图所示，在加热部13的第一位置A时，由于其加热部13表面至该调整段43之间的距离L1大于该加热部13的第二位置B至该调整段43之间的距离L2，因此，在相对于该加热部13第一位置A的调整段43上可设有穿孔431，藉以有效控制该电流流通的路径，达到提升该模具加热区加热效果的目的。
参阅图7、8，本发明第四实施例所提供的一种具加热装置的模具，其同样是由一导电层10、一绝缘层20、以及一加热装置所组成，由于其组态及功效同于第二实施例，故不再赘述，至于第四实施例不同之处在于：
该第二导电单元40更具有一电性连接该第二外导电段42的遮蔽段44，该遮蔽段44位于该绝缘层20内且位于该第一内导电段33与该第二绝缘表面24之间，藉以有效控制该电流流通的路径，达到提升该模具加热区加热效果的目的。值得一提的是，该遮蔽段44与该第一导电单元30仍为绝缘状态。
参阅图9、10，本发明第五实施例所提供的一种具加热装置的模具，其同样是由一导电层10A、一绝缘层20A、以及一加热装置所组成，由于其组态及功效同于第一实施例，故不再赘述，至于第五实施例不同之处在于：
该加热装置的第一、二导电单元30A、40A的数量各为一并皆呈板状，且该第一导电单元30A的第一内导电段33A的整片面积是对应该导电层10A的加热部13A，藉以达到提升该模具加热区加热效果的目的。
参阅图11、12，本发明第六实施例所提供的一种具加热装置的模具，其同 样是由一导电层10A、一绝缘层20A、以及一加热装置所组成，由于其组态及功效同于第一实施例，故不再赘述，至于第六实施例不同之处在于：
该加热装置的第一、二导电单元30A、40A的数量各为一并呈板状，且该第一导电单元30A的第一内导电段33A的整片面积是对应该导电层10A的加热部13A，又该第二导电单元40A更具有一电性连接该第二外导电段42A的调整段43A，该调整段43A位于该绝缘层20A内且位于该加热部13A与该第一内导电段33A之间，据此，更能控制流经该导电层10A的电流，使该电流更能集中汇集在该加热部13A表面，使其由室温预热达工作温度，藉以达到提升该模具加热区加热效果的目的。
参阅图13、14、15，本发明第七实施例所提供的一种具加热装置的模具，其同样是由一导电层10B、一绝缘层20B、以及一加热装置所组成，由于其组态及功效同于第一实施例，故不再赘述，至于第七实施例不同之处在于：
该第一导电单元30B的第一电极部31B具有一第一穿孔311B，该第一连接部32B、第一内导电段33B与第一外导电段34B为管状，且该第一连接部32B插置于该第一穿孔311B，该第二导电单元40B的第二电极部41B具有一第二穿孔411B，该第二外导电段42B为管状并插置于该第二穿孔411B及绝缘的套设该第一外导电段34B，该第二导电单元40B更具有一电性连接该第二外导电段42B且为管状的调整段43B，该调整段43B位于该绝缘层20B内且绝缘套设该第一内导电段33B，藉以达到提升该模具加热区加热效果的目的。
参阅图16，本发明第八实施例所提供的一种具加热装置的模具，其同样是由一导电层10、一绝缘层20、以及一加热装置所组成，由于其组态及功效同于第一实施例，故不再赘述，至于第八实施例不同之处在于：
更包含一上模51、及一与该上模51相互靠近或远离的下模52，该下模是由该导电层10与绝缘层20所组成，且该加热装置的第一导电单元30及第二导电单元40是设在该下模52。
参阅图17，本发明第九实施例所提供的一种具加热装置的模具，其同样是由一导电层10、一绝缘层20、以及一加热装置所组成，由于其组态及功效同于第一实施例，故不再赘述，至于第九实施例不同之处在于：
更包含一上模51、及一与该上模51相互靠近或远离的下模52，该上模51 是由该导电层10与绝缘层20所组成，且该加热装置的第一导电单元30及第二导电单元40是设在该上模51，另外，该导电层10的加热部13是由该第一导电表面11朝该第二导电表面12反方向凸设呈凸状。
综上所述，上述各实施例及图示仅为本发明的较佳实施例而已，当不能以之限定本发明实施之范围，即大凡依本发明申请专利范围所作的均等变化与修饰，皆应属本发明专利涵盖的范围内。

Claims (10)

  1. 一种具加热装置的模具，其特征在于：包含：
    一导电层，具有一第一导电表面、一反向于该第一导电表面的第二导电表面、一设于该第一导电表面的加热部、及一连接该第一、二导电表面的第一导电侧面及第二导电侧面；
    一绝缘层，绝缘地结合于该导电层，并具有一结合于该第二导电表面的第一绝缘表面、一反向于该第一绝缘表面的第二绝缘表面、及一连接该第一、二绝缘表面且分别与该第一、二导电侧面同侧的第一、二绝缘侧面；
    一加热装置，包含至少一第一导电单元及至少一第二导电单元，其中：
    该第一导电单元，具有一电性连接该第一导电侧面的第一电极部、一电性连接该第一电极部且与该导电层绝缘的第一连接部、一电性连接该第一连接部且位于该绝缘层内并对应该加热部的第一内导电段、及一电性连接该第一内导电段且位于该第二绝缘侧面之外的第一外导电段；
    该第二导电单元，具有一电性连接该第二导电侧面的第二电极部、及一电性连接该第二电极部且位于该第二绝缘侧面之外并与该第一外导电段绝缘的第二外导电段。
  2. 如权利要求1所述的具加热装置的模具，其特征在于：所述导电层的加热部是由该第一导电表面朝该第二导电表面方向凹设呈槽状。
  3. 如权利要求2所述的具加热装置的模具，其特征在于：更包含一上模、及一与该上模相互靠近或远离的下模，该下模是由该导电层与绝缘层所组成。
  4. 如权利要求1所述的具加热装置的模具，其特征在于：所述导电层的加热部是由该第一导电表面朝该第二导电表面反方向凸设呈凸状。
  5. 如权利要求4所述的具加热装置的模具，其特征在于：更包含一上模、及一与该上模相互靠近或远离的下模，该上模是由该导电层与绝缘层所组成。
  6. 如权利要求1所述的具加热装置的模具，其特征在于：所述第二导电单元更具有一电性连接该第二外导电段的调整段，该调整段位于该绝缘层内且位于该加热部与该第一内导电段之间。
  7. 如权利要求6所述的具加热装置的模具，其特征在于：所述第二导电单元的调整段对应该加热部设有穿孔。
  8. 如权利要求6所述的具加热装置的模具，其特征在于：所述第二导电单元 更具有一电性连接该第二外导电段的遮蔽段，该遮蔽段位于该绝缘层内且位于该第一内导电段与该第二绝缘表面之间。
  9. 如权利要求1所述的具加热装置的模具，其特征在于：所述第一、二导电单元皆呈板状。
  10. 如权利要求1所述的具加热装置的模具，其特征在于：所述第一导电单元的第一电极部具有一第一穿孔，该第一连接部、第一内导电段与第一外导电段为管状，且该第一连接部插置于该第一穿孔，该第二导电单元的第二电极部具有一第二穿孔，该第二外导电段为管状并插置于该第二穿孔及绝缘的套设该第一外导电段，该第二导电单元更具有一电性连接该第二外导电段且为管状的调整段，该调整段位于该绝缘层内且绝缘套设该第一内导电段。
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120168990A1 (en) * 2009-03-12 2012-07-05 The Doshisha Resin molding apparatus and resin molding method
CN103072222A (zh) * 2011-10-25 2013-05-01 昆山渝榕电子有限公司 具加热装置的模具
CN203057550U (zh) * 2012-10-17 2013-07-10 昆山渝榕电子有限公司 加热装置的导电结构
CN203876094U (zh) * 2014-02-11 2014-10-15 刘忠男 具加热装置的模具

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5593437A (en) * 1979-01-09 1980-07-15 Takashi Miura Injection molding process with thermo-linked reaction of rubber and synthetic resin
JPS60174624A (ja) * 1984-02-20 1985-09-07 Matsushita Electric Works Ltd 成形用金型
JPS6144616A (ja) * 1984-08-10 1986-03-04 Japan Steel Works Ltd:The 薄肉成形品の成形方法
JPH0464418A (ja) * 1990-07-03 1992-02-28 Kobe Steel Ltd 成形用金型
JP2618100B2 (ja) * 1991-02-20 1997-06-11 大宝工業 株式会社 表面加熱成形金型
JPH0596576A (ja) * 1991-10-04 1993-04-20 Olympus Optical Co Ltd 成形金型
JP3775376B2 (ja) * 1995-05-19 2006-05-17 株式会社デンソー インサート品成形方法およびインサート品成形装置
TWI513565B (zh) * 2011-10-19 2015-12-21 Kunshan yurong electronics co ltd 具加熱裝置的模具

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120168990A1 (en) * 2009-03-12 2012-07-05 The Doshisha Resin molding apparatus and resin molding method
CN103072222A (zh) * 2011-10-25 2013-05-01 昆山渝榕电子有限公司 具加热装置的模具
CN203057550U (zh) * 2012-10-17 2013-07-10 昆山渝榕电子有限公司 加热装置的导电结构
CN203876094U (zh) * 2014-02-11 2014-10-15 刘忠男 具加热装置的模具

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