WO2015119064A1 - Matériau composite thermoconducteur, et son procédé de fabrication - Google Patents

Matériau composite thermoconducteur, et son procédé de fabrication Download PDF

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Publication number
WO2015119064A1
WO2015119064A1 PCT/JP2015/052788 JP2015052788W WO2015119064A1 WO 2015119064 A1 WO2015119064 A1 WO 2015119064A1 JP 2015052788 W JP2015052788 W JP 2015052788W WO 2015119064 A1 WO2015119064 A1 WO 2015119064A1
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Prior art keywords
fiber
conductive composite
composite material
metal foil
reinforced resin
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PCT/JP2015/052788
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English (en)
Japanese (ja)
Inventor
優樹 延澤
倉田　功
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新日鉄住金マテリアルズ株式会社
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Priority to JP2015526082A priority Critical patent/JP6571000B2/ja
Publication of WO2015119064A1 publication Critical patent/WO2015119064A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/022—Mechanical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/027—Thermal properties
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/54—Yield strength; Tensile strength
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2439/00—Containers; Receptacles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention is used as a reinforcing plate for casings of information terminal devices such as smartphones, tablets, and portable personal computers, casing cases, mobile-type digital medical cassettes, and other electrical equipment casings that require heat countermeasures.
  • the present invention relates to a heat conductive composite material having high rigidity (high elasticity) and high heat dissipation characteristics, that is, heat conductivity, and a method for manufacturing the same.
  • a case in which a battery, a circuit board, etc. are mounted in an information terminal device such as a smartphone, a tablet, or a portable personal computer a case case, a case surface material that is integrally attached to the case, a ceiling Plates and the like are mainly produced by molding a plastic material for weight reduction.
  • a smartphone 100 having a schematic configuration shown in FIG. 1 generally includes a thin box-shaped housing (or housing case) 101 on which a battery, a circuit board, and the like are mounted, and a housing (or housing case).
  • a lid 102 provided with a display and a touch panel attached to 101.
  • Patent Document 1 proposes a hybrid heat dissipation plate using a carbon fiber composite material in order to cool a heating element such as a semiconductor used in an integrated circuit.
  • this heat radiating plate is formed by bonding a high thermal conductivity metal around the carbon fiber composite on which a heating element such as a semiconductor is mounted.
  • the carbon fiber of the composite is uniaxially oriented perpendicular to the surface on which the heating element is mounted.
  • Patent Document 2 discloses a thermal conductive material in which an aluminum flat plate is bonded to the bottom surface of a carbon fiber reinforced plastic molded product having a box-shaped long fiber pellet as a housing of a personal computer incorporating a high-performance CPU. Proposes composite molded products.
  • the carbon fiber reinforced composite material is a reinforcing fiber to be used, the carbon fiber conducts heat well in the fiber axis direction, but in the direction perpendicular to the fiber axis. Hardly conveys heat. Therefore, the carbon fiber on the surface close to the heat source of the carbon fiber reinforced composite material contributes to thermal diffusion to some extent, but the thermal conductivity is poor with respect to the thickness direction of the carbon fiber reinforced composite material, so Carbon fiber contributes little to heat diffusion.
  • pitch-based carbon fiber itself has a very high thermal conductivity of 100 to 600 W / mK, but can exhibit its ability only in the fiber axis direction and has anisotropy.
  • the hybrid heat sink using the carbon fiber composite material described in Patent Document 1 is, for example, a carbon fiber composite having a thickness of 2 mm fitted into a central portion of a 30 mm square copper piece having a thickness of 2 mm. A heating element is mounted on the composite.
  • the carbon fiber reinforced plastic molded product described in Patent Document 2 has, for example, a carbon fiber reinforced plastic molded product having a thickness of 1.4 mm, a long fiber pellet having a weight average fiber length of 0.38 mm, and an aluminum flat plate having a thickness of 1.4 mm. It is set to 0.6 mm.
  • the hybrid heat dissipation plate or carbon fiber reinforced plastic molded product described in Patent Literatures 1 and 2 cannot be used as a reinforcing plate used for reinforcing a housing cover or housing of a smartphone or the like. Therefore, the present inventors have conducted many research experiments in order to improve the above-described problems of hybrid heat sinks or carbon fiber reinforced plastic molded products using the above-mentioned conventional carbon fiber composite materials.
  • the surface to be in contact with the metal is made of metal and a fiber reinforced composite material such as a highly rigid carbon fiber reinforced composite material is arranged on the inside, or a metal is arranged on the inside and a carbon fiber reinforced composite material on both sides thereof.
  • a fiber reinforced composite material such as a highly rigid carbon fiber reinforced composite material
  • a metal is arranged on the inside and a carbon fiber reinforced composite material on both sides thereof.
  • thermoly conductive composite material containing continuous reinforcing fibers, and a metal foil layer integrally bonded to both surfaces of the fiber reinforced resin material are provided.
  • a thermally conductive composite material having a thickness of 0.07 to 1 mm,
  • the fiber reinforced resin material has a thickness of 0.05 mm or more and less than 1 mm,
  • the metal foil layer has a thickness of 0.009 to 0.1 mm,
  • the tensile modulus of the heat conductive composite is 80 GPa or more
  • a thermally conductive composite material is provided.
  • the present invention has a metal foil layer and a sheet-like fiber reinforced resin material containing continuous reinforcing fibers integrally bonded to both surfaces of the metal foil layer, and has a thickness.
  • a thermally conductive composite material of 0.12 to 1 mm
  • the fiber reinforced resin material has a thickness of 0.05 mm or more and less than 1 mm
  • the metal foil layer has a thickness of 0.009 to 0.1 mm
  • the tensile modulus of the heat conductive composite is 80 GPa or more
  • a thermally conductive composite material is provided.
  • the fiber reinforced resin material has a fiber volume content of pitch-based carbon fibers having a thermal conductivity of the reinforcing fibers of 100 W / mK or more and a tensile elastic modulus of 400 GPa or more. 20% or more.
  • the fiber reinforced resin material may be a pitch-based carbon fiber, a PAN-based carbon fiber, or a glass fiber, or a mixture of two or more of the fibers. It is.
  • the fiber reinforced resin material is formed by aligning the continuous reinforcing fibers in one direction and impregnating the resin, and / or The woven fabric woven in at least two axial directions is impregnated with resin.
  • the fiber reinforced resin material includes at least two sheets formed by aligning the continuous reinforcing fibers in one direction and impregnating the resin. It is produced by laminating in the axial direction.
  • the metal foil layer is made of a metal having a thermal conductivity of 50 W / mK or more.
  • the thermally conductive composite material has a thickness of 0.12 to 0.5 mm.
  • it has a sheet-like fiber reinforced resin material containing continuous reinforcing fibers, and a metal foil layer integrally bonded to both surfaces of the fiber reinforced resin material, and has a thickness.
  • the metal foil layer and the sheet-like fiber-reinforced resin material including continuous reinforcing fibers integrally bonded to both surfaces of the metal foil layer have a thickness.
  • a method for producing a thermally conductive composite material having a tensile modulus of 80 GPa or more and 0.12 to 1 mm (A) At least a continuous reinforcing fiber is arranged in at least one direction, and is impregnated with a resin and semi-cured to have a fiber basis weight of 25 to 600 g / m 2 and a fiber volume content of at least 20 to 70%. Preparing one prepreg sheet and a metal foil having a thickness of 0.009 to 0.1 mm, (B) The prepreg sheet is pressed on both sides of the metal foil and laminated together, (C) Thereafter, the prepreg sheet is cured to obtain a fiber reinforced resin material.
  • the manufacturing method of the heat conductive composite material with which the fiber reinforced resin material was united on both surfaces of the metal foil layer characterized by the above is provided.
  • the present invention has high rigidity and heat dissipation, and only by sticking to the reinforced body, it prevents deformation of the reinforced body due to external force, prevents the inside of the apparatus from being broken, and without creating a heat spot. Can be diffused.
  • FIG. 1 is a perspective view showing a schematic configuration of a smartphone, and shows a mode in which a case or case of a smartphone is reinforced with a thermally conductive composite material according to the present invention.
  • FIG. 2A is a schematic cross-sectional view of a smartphone casing or a casing case that is a reinforced body reinforced with the thermally conductive composite material according to the present invention
  • FIG. It is a schematic structure expanded sectional view of one example of the heat conductive composite concerning the present invention.
  • FIG.2 (c) is a schematic structure expanded sectional view of the other Example of the heat conductive composite material which concerns on this invention.
  • FIG. 1 is a perspective view showing a schematic configuration of a smartphone, and shows a mode in which a case or case of a smartphone is reinforced with a thermally conductive composite material according to the present invention.
  • FIG. 2A is a schematic cross-sectional view of a smartphone casing or a casing case that is a reinforced body reinforced with the thermally conductive composite
  • FIG. 3A is a perspective view showing an example of a prepreg sheet (fiber reinforced resin material) and a reinforced fiber sheet before the metal foil layer is joined
  • FIG. 3B is a lamination of prepreg sheets. It is a figure explaining an example of an aspect.
  • 4 (a) and 4 (b) are schematic configuration diagrams illustrating a method for manufacturing a heat conductive composite material according to the present invention.
  • FIG. 5A and FIG. 5B are a plan view and a cross-sectional view, respectively, for explaining the dimensional shape of the test sample of the thermally conductive composite material
  • FIG. 5C is the heat dissipation property of the test sample. It is a figure which shows the temperature measurement method for testing this.
  • thermally conductive composite material according to the present invention will be described in more detail with reference to the drawings.
  • FIG. 1 shows a schematic configuration of the smartphone 100 as described above, and a case or a housing case (that is, a cover) of the smartphone 100 by the reinforcing plate formed of the heat conductive composite material 1 according to the present invention.
  • (Reinforcing body) 101 shows a state in which the bottom plate portion 101a of the reinforcing body 101 is reinforced.
  • FIG. 2A is a cross-sectional view showing a schematic configuration of a smartphone case or a housing case 101 that is a reinforced body reinforced by the heat conductive composite material 1 according to the present invention.
  • b) is an enlarged schematic cross-sectional view of an embodiment of the thermally conductive composite material 1 according to the present invention.
  • FIG. 2A unlike FIG.
  • FIG. 2C is an enlarged schematic cross-sectional view of another embodiment of the heat conductive composite material 1 according to the present invention, which will be described later as a second embodiment.
  • the thermally conductive composite material 1 according to the present invention includes a sheet-like fiber reinforced resin material 2 including continuous reinforcing fibers, and the fiber reinforced resin material. 2 and the metal foil layer 3 (3a, 3b) integrally joined to both surfaces. According to the present invention, referring also to FIG.
  • the thermal diffusion by the thermally conductive composite material 1 is basically the fiber of the reinforcing fiber f of the fiber reinforced resin material 2 by the fiber reinforced resin material 2 and the metal foil layer 3.
  • Thermal diffusion in the axial direction (XX direction in FIG. 3) is attempted, and thermal diffusion in the direction (YY direction in FIG. 3) intersecting (orthogonal) the fiber axis direction of the reinforcing fiber f is the metal foil layer 3 To do.
  • the desired heat dissipation of the heat conductive composite material 1 is achieved by the thickness design of the heat conductive composite material 1 and the constituent members 2 and 3. That is, in the present invention, the heat conduction in the thickness direction of the thermally conductive composite material 1 (the ZZ direction in FIG.
  • the thickness (T1) of the heat conductive composite material 1 is 1 mm or less, usually 0.07 to 1 mm (0.07 mm ⁇ T1). ⁇ 1 mm).
  • the thermal conductive composite material 1 is used as a reinforcing plate for a case (or case case) 101 of a smartphone, which is a body to be reinforced, as in this embodiment.
  • the internal space of the to-be-reinforced body 101 occupies too much, and the housing of the smartphone, which is the to-be-reinforced body 101, is inevitably large in order to accommodate the main members of the smartphone. And weight reduction.
  • the thickness (T1) is less than 0.07 mm, it is difficult to achieve high rigidity as a reinforcing plate, which is an object of the present invention, and the fiber reinforced resin material 2 and the metal foil layer 3 are difficult to achieve. Becomes extremely thin and cannot be manufactured with existing raw materials, resulting in high costs.
  • the thickness (T1) of the heat conductive composite 1 is 0.12 to 0.5 mm.
  • the heat conductive composite material 1 has a tensile elastic modulus of at least an aluminum tensile modulus (a tensile elastic modulus (cross-sectional area)) in order to obtain a required tensile rigidity (tensile elastic modulus ⁇ cross-sectional area). It was found that it was necessary to be 80 GPa or more, which is greater than 70 GPa). If the tensile modulus is less than 80 GPa, sufficient rigidity for reinforcement cannot be obtained. Below, each structural member of the heat conductive composite material 1 which concerns on this invention is demonstrated in more detail.
  • the sheet-like fiber reinforced resin material 2 has a thickness (t2) of 0.05 mm or more and less than 1 mm (0.05 mm ⁇ t2 ⁇ 1 mm), and a heat dissipation property when the thickness (t2) is 1 mm or more.
  • the thickness (t2) is less than 0.05 mm, it is difficult to achieve high rigidity as a reinforcing plate, and the fiber reinforced resin material 2 becomes extremely thin, resulting in a problem of causing deterioration. There is a problem that raw materials cannot be manufactured and the cost is high.
  • the thickness (t2) of the fiber reinforced resin material 2 is 0.1 to 0.46 mm.
  • the fiber reinforced resin material 2 is a fiber reinforced composite material containing 20% or more of pitch-based carbon fibers having a thermal conductivity of 100 W / mK or more and a tensile modulus of 400 GPa or more in terms of fiber volume content (Vf). .
  • the fiber-reinforced resin material 2 can obtain the maximum thermal conductivity (heat dissipation) and rigidity when pitch-based carbon fibers are used as the reinforcing fibers.
  • the fiber reinforced resin material 2 having such a configuration, it is possible to obtain the thermally conductive composite material 1 having a tensile elastic modulus of 80 GPa or more according to the present invention.
  • the fiber reinforced resin material 2 is produced by impregnating a continuous reinforcing fiber f with a resin R, and as the reinforcing fiber f, carbon fiber can be most preferably used. Of these, carbon fibers are preferred.
  • the thermal conductive composite 1 PAN-based carbon fibers that are inferior in terms of tensile modulus and thermal conductivity to pitch-based carbon fibers can also be used.
  • the glass fiber which is inferior in terms of a tensile elasticity modulus and thermal conductivity further than a carbon fiber other than a carbon fiber can also be used.
  • these fibers can also be mixed and used.
  • the tensile elastic modulus and thermal conductivity of the reinforcing fibers that can be used in the present invention are as shown in Table 1. Further, as shown in FIG.
  • the fiber reinforced resin material 2 that can be used in the present invention is formed into a sheet by aligning the reinforcing fibers f as described above continuous in the fiber axis direction in one direction. It is produced using a prepreg sheet 10PG obtained by impregnating the resin R with the reinforcing fiber sheet 10S thus configured and semi-curing (B-stage).
  • the fiber basis weight of the prepreg sheet 10PG is preferably 25 to 600 g / m 2 , and the fiber volume content (Vf) of the carbon fiber is 20% or more as described above.
  • a plurality of prepreg sheets 10PG can be laminated and used as desired.
  • the prepreg sheet 10PG After curing, the prepreg sheet 10PG forms a fiber reinforced resin material having a thickness (t2) of 0.05 mm or more and less than 1 mm, preferably 0.1 to 0.46 mm, as described above.
  • a thickness (t2) of 0.05 mm or more and less than 1 mm, preferably 0.1 to 0.46 mm, as described above.
  • the description has been given on the assumption that the reinforced fiber f is formed in a UD shape that is aligned in one direction.
  • a plurality of prepreg sheets 10PG are laminated so that the reinforced fibers f intersect each other. You can also That is, the UD-shaped prepreg sheet 10PG produced by aligning the reinforcing fibers f in one direction is laminated so that the directions of the reinforcing fibers f are at least biaxial, and in some cases, triaxial and tetraaxial.
  • a prepreg sheet 10PG (0 °) in which the reinforcing fibers f are oriented in the 0 ° direction a prepreg sheet 10PG (90 °) in which the reinforcing fibers f are oriented in the 90 ° direction
  • a prepreg sheet 10PG (90 °) in which the reinforcing fibers f are oriented in the 90 ° direction can be produced by laminating three prepreg sheets 10PG (0 °) in which the reinforcing fibers f are oriented in the 0 ° direction.
  • the prepreg sheet 10PG (90 °) in which the reinforcing fibers f are oriented in the 90 ° direction
  • the prepreg sheet 10PG (+ 45 °) in which the reinforcing fibers f are oriented in the + 45 ° direction and the prepreg sheet 10PG ( ⁇ 45 °) in which the reinforcing fibers f are oriented in the ⁇ 45 ° direction were used.
  • a 4-axis configuration is also possible.
  • the reinforcing fiber sheet 10S may be formed by weaving one or more kinds of reinforcing fibers f as necessary, for example, a woven fabric (cross) such as a plain weave cloth, a twill cloth, a satin cloth, etc. it can.
  • a UD shape and a cloth in combination may be used.
  • any of epoxy resin, vinyl ester resin, MMA resin, unsaturated polyester resin, or phenol resin is preferably used.
  • Vf fiber volume content
  • the fiber volume content (Vf) of the reinforcing fiber f is less than 20%, there is a problem that the amount of fibers is small and the desired rigidity and heat dissipation cannot be obtained. There arises a problem that mechanical properties cannot be obtained.
  • the fiber volume content (Vf) is in the range of 40 to 65%.
  • the metal foil layer 3 (3a, 3b) is made of a metal having a thermal conductivity of 200 W / mK or higher, such as aluminum or copper. Depending on the required degree of heat dissipation, for example, iron, nickel, brass or the like having a thermal conductivity of 50 to 200 W / mK inferior to these metal materials may be used. Further, it may be made of an alloy of the above metals, such as an aluminum alloy, having a power of 50 to 200 W / mK.
  • the metal foil layers 3 a and 3 b may be the same metal or different metals depending on the shape of the heat conductive composite material 1.
  • the thickness (t3a, t3b) of the metal foil layer 3 (3a, 3b) is 0.009 to 0.1 mm (0.009 mm ⁇ t3a, t3b ⁇ 0.1 mm), respectively.
  • T3b) exceeds 0.1 mm, the thickness (t3a, t3b) of the metal foil layer 3 (3a, 3b) is too thick, and the tensile elastic modulus of the fiber reinforced resin material 2 cannot be utilized, which is disadvantageous in terms of rigidity.
  • the density of the metal foil layer 3 is generally higher than that of the fiber reinforced resin material 2, the weight of the heat conductive composite material 1 increases as the thickness (t3a, t3b) increases.
  • the thickness (t3a, t3b) of the metal foil layer 3 (3a, 3b) is 0.01 to 0.05 mm, respectively.
  • the thicknesses (t3a, t3b) of the metal foil layers 3a, 3b may be the same or different.
  • the metal foil layer 3 (3a, 3b) is a so-called prepreg sheet in which the reinforcing fiber sheet 10S is impregnated with the resin R and is not yet completely cured.
  • the two sides of 10PG are pressed and laminated together, and if necessary, heated to cure the resin R.
  • the post-bonding that is, the impregnation resin R of the prepreg sheet 10PG is completely cured, that is, the metal foil layer 3 (3a, 3b) is bonded to the fiber reinforced resin material 2 using an adhesive.
  • the adhesive layer may reduce heat dissipation and rigidity.
  • the heat conductive composite material 1 produced as described above is integrally joined to, for example, a smartphone housing or a housing case (reinforcement body) 101 (see FIG. 1).
  • a jig or the like is prepared in order to easily perform the work.
  • a jig or the like is integrally bonded to a pre-molded casing case or a top plate to be a top surface portion of the case with an adhesive, or in some cases, a double-sided tape.
  • the thickness and material of the adhesive are set appropriately so as not to cause a decrease in heat dissipation and rigidity.
  • it can also be integrally joined to the to-be-reinforced body 101 by installing in a shaping
  • the to-be-reinforced body 101 which is a fiber-reinforced plastic product thus obtained, has a high rigidity with a thickness (T1) of 0.07 to 1 mm and a tensile elastic modulus of 80 GPa or more.
  • Experimental examples 1 to 4 (Test sample) In Experimental Example 1, a thin plate-like aluminum (A5052) simple substance (metal simple substance) was used. In Experimental Example 2, a carbon fiber reinforced resin (CFRP cloth) obtained by impregnating a pitch carbon fiber cloth (woven fabric) with a resin was used. In Experimental Example 3, a glass fiber reinforced resin (GFRP cloth) in which a glass fiber cloth (woven fabric) is impregnated with a resin and a carbon fiber in which a resin is impregnated with a unidirectional carbon fiber sheet in which pitch-based carbon fibers are aligned in one direction. A glass-carbon fiber bonded composite (GFRP cross-CFRP unidirectional) laminated with a reinforced resin (CFRP unidirectional) was used.
  • GFRP cross-CFRP unidirectional glass-carbon fiber bonded composite
  • a copper foil was integrally formed on both sides of a carbon fiber reinforced resin (CFRP unidirectional) obtained by impregnating a unidirectional carbon fiber sheet in which pitch-based carbon fibers were aligned in one direction.
  • the fiber reinforced composite material metal foil surface layer—CFRP unidirectional core
  • the pitch-based carbon fibers used in Experimental Examples 2, 3, and 4 have a monofilament average diameter of 9 ⁇ m and a bundle of 3000, 6000, or 12000 fibers, that is, pitch-based carbon fiber strands (Nippon Graphite Fiber Co., Ltd.).
  • the glass fiber cloth prepreg used in Experimental Example 3 was manufactured by Mitsubishi Rayon Co., Ltd. (trade name: GHO250-381IM).
  • the fiber basis weight was as shown in Table 2.
  • a glass fiber cloth prepreg and a unidirectional carbon fiber sheet prepreg were laminated and integrated, and then heated to cure the resin to prepare a test sample.
  • the copper foil was pressed on both surfaces of the unidirectional carbon fiber sheet prepreg to be laminated integrally, and the resin was cured by heating to produce the thermally conductive composite material 1.
  • the mechanical properties and thermal conductivity of the used aluminum, copper, glass fiber, and pitch-based carbon fiber were as follows.
  • the test sample S used in Experimental Examples 1 to 4 has a length ⁇ width of 100 mm ⁇ 50 mm as shown in FIGS.
  • the foil layer thickness t3 and the fiber reinforced resin material thickness t2) are as shown in Table 2.
  • the heat dissipation of each test sample S was measured as follows. As shown in FIG.5 (c), a heater (H) is installed in the width direction center part of the longitudinal direction one end (left side end in FIG.5 (c)) of a test sample, ie, the test piece S, and at least a test piece is shown. The temperature measurement point was measured with the temperature sensor (TS) on the heater installation position and on the side opposite to the side where the heater (H) was installed (the right end in FIG. 5C).
  • the sample of the experimental example 2 is the third of the experimental examples 1 to 4 and is inferior to the sample of the experimental example 1 ( ⁇ ) although the heat spreads as a whole like the sample of the experimental example 1.
  • the temperature immediately below the heater is the highest among Experimental Examples 1 to 4, storing heat, and heat spreading only in one direction ( ⁇ : poor heat dissipation).
  • the temperature immediately below the heater is the second lowest in Experimental Examples 1 to 4, and the heat spreads out to the end of the test sample. ( ⁇ ⁇ ⁇ : good heat dissipation).
  • the tensile elastic modulus (E), tensile rigidity, and weight were obtained by calculation.
  • the results of tensile modulus, tensile stiffness and weight are as shown in Table 3. From Table 3, the test sample of Experimental Example 4 configured according to the present invention was excellent in heat dissipation and rigidity, and was lighter in weight than the aluminum simple substance of Experimental Example 1.
  • a carbon fiber reinforced resin obtained by laminating a prepreg impregnated with resin in a unidirectional carbon fiber sheet in which pitch-based carbon fibers are aligned in one direction in the X direction and the Y direction. / 90 ° plate).
  • a carbon fiber reinforced resin obtained by laminating a prepreg impregnated with a resin in a unidirectional carbon fiber sheet in which pitch-based carbon fibers are aligned in one direction in accordance with the configuration of the present invention, in the X direction and the Y direction.
  • a fiber reinforced composite material (metal foil surface layer-pitch-based CFRP unidirectional 0 ° / 90 ° plate) produced by integrally molding copper foil on both sides of the sheet was used.
  • a carbon fiber reinforced resin (PAN-based CFRP unidirectional) obtained by laminating a prepreg impregnated with a resin in a unidirectional carbon fiber sheet in which PAN-based carbon fibers are aligned in one direction, in the X direction and the Y direction. 0 ° / 90 ° plate) was used.
  • a fiber reinforced composite material metal foil surface layer—PAN-based CFRP unidirectional 0 ° / 90 ° plate
  • the pitch-based carbon fibers, aluminum, and copper used in Experimental Examples 5 to 9 have the same physical properties as in Experimental Examples 1 to 4.
  • Mitsubishi Rayon Co., Ltd. (TR380G125, etc.) was used.
  • the total fiber basis weight used was as shown in Table 4.
  • the test samples used in Experimental Examples 5 to 9 had a length ⁇ width of 100 mm ⁇ 50 mm as in Examples 1 to 4, and the thickness dimensions of each sample (total thickness T1, metal foil layer thickness t3, fiber reinforced resin)
  • the material thickness t2) is as shown in Table 4.
  • the heat dissipation of each test sample was measured by the same method as in Experimental Examples 1 to 4.
  • the results of measurement of heat dissipation are as shown in Table 5.
  • the temperature of the sample in Experimental Example 5 is 38.8 ° C., which is the lowest among the Experimental Examples 5 to 9, and the heat spreads over the whole. ( ⁇ : Very good heat dissipation).
  • the temperature immediately below the heater was 40 ° C., which was similar to that of Aluminum of Experimental Example 5, but the state of heat diffusion was inferior to that of Aluminum of Experimental Example 5 although it spread throughout. : Heat dissipation is slightly better.
  • the sample of Experimental Example 7 had a temperature immediately below the heater of 39.8 ° C., and due to the effect of the copper foil, the state of heat diffusion was similar to that of Aluminum of Experimental Example 5 (5: very good heat dissipation).
  • the temperature immediately below the heater is remarkably stored at 93.4 ° C., and the heat hardly spreads ( ⁇ : poor heat dissipation).
  • the sample of Experimental Example 9 showed heat storage at a temperature just below the heater of about 50 ° C., but compared to the sample of Experimental Example 9, the heat storage was suppressed by the effect of the copper foil, and the heat spread a little. ( ⁇ : heat dissipation is slightly inferior).
  • the tensile modulus (E), tensile rigidity and weight were obtained by calculation in the same manner as in Experimental Examples 1 to 4. The results of tensile modulus, tensile rigidity and weight are as shown in Table 5. From Table 5, the test sample of Experimental Example 7 constructed according to the present invention was excellent in heat dissipation and rigidity, and was lighter than the single aluminum of Experimental Example 5 having substantially the same thickness.
  • FIG. 2 (c) shows a second embodiment of the thermally conductive composite material 1 according to the present invention.
  • the thermally conductive composite material 1 includes the metal foil layer 3 and the sheet-like fiber reinforced resin material 2 (2a, 2b) integrally bonded to both surfaces of the metal foil layer 3.
  • the heat conductive composite material 1 of the present embodiment has a fiber reinforced resin material 2 (2a, 2b) having a high tensile elastic modulus on both surfaces of the metal foil layer 3.
  • the rigidity is more important than the heat dissipation.
  • the heat conductive composite material 1 of this example differs from the case of Example 1 in that the sheet-like fiber reinforced resin material 2 (2a, 2b) is integrally bonded to both surfaces of the metal foil layer 3,
  • the metal foil layer 3 and the sheet-like fiber reinforced resin material 2 (2a, 2b), which are constituent members, are made of the same material and configuration as in the first embodiment. Therefore, the description of the metal foil layer 3 and the sheet-like fiber reinforced resin material 2 (2a, 2b) uses the description of the first embodiment, and the detailed description is omitted.
  • the thickness (T2) of the heat conductive composite material 1 is set to 1 mm or less, as in the case of the above-described embodiment 1, and usually 0.12 to 1 mm (0.12 mm) in this embodiment.
  • the thickness (T2) of the heat conductive composite material is 0.12 to 0.5 mm.
  • the metal foil layer 3 needs to be integrally molded with the fiber reinforced resin material 2 (2a, 2b). That is, for example, as shown in FIG. 4B, the so-called prepreg state reinforcing fiber sheet (prepreg sheet) 10PG in which the reinforcing fiber sheets 10Sa and 10Sb are impregnated with the resin R and not yet completely cured. (10 PGa, 10 PGb) are pressed and laminated integrally on both surfaces of the metal foil layer 3, and if necessary, heated to cure the resin R.
  • the post-bonding that is, the impregnation resin of the prepreg sheet 10PG (10 PGa, 10 PGb) is completely cured on both sides of the metal foil layer 3, that is, fiber reinforced resin.
  • the material 2 (2a, 2b) is bonded and integrated, there is a concern that the heat dissipation and rigidity of the adhesive layer may be lowered depending on the thickness of the adhesive.
  • the heat conductive composite 1 produced as described above is integrally joined to the reinforced body 101 in the same manner as in the first embodiment.
  • the to-be-reinforced body 101 which is a fiber-reinforced plastic product thus obtained, has a high rigidity with a thickness (T2) of 0.12 to 1 mm and a tensile modulus of 80 GPa or more.
  • a reinforcing body having heat dissipation that is, the heat conductive composite material 1
  • Experimental Example 10 (Test sample) In Experimental Example 10, in accordance with the configuration of the present invention, prepregs impregnated with resin in a unidirectional carbon fiber sheet in which pitch-based carbon fibers are aligned in one direction are laminated on both sides of the copper foil 3 in the X direction and the Y direction, A fiber reinforced composite material (metal foil core-pitch-based CFRP unidirectional 0 ° / 90 ° plate) produced by integration was used.
  • the pitch-based carbon fibers and copper used in Experimental Example 10 were the same as those in Experimental Examples 1 to 9.
  • the total fiber basis weight used was as shown in Table 4.
  • the test sample used in Experimental Example 10 has a length ⁇ width of 100 mm ⁇ 50 mm as in Experimental Examples 1 to 9, and the thickness dimensions of each sample (total thickness T2, metal foil layer thickness t3, fiber reinforced resin material thickness) t2) is as shown in Table 4.
  • Total thickness T2, metal foil layer thickness t3, fiber reinforced resin material thickness t2 is as shown in Table 4.
  • the heat dissipation of the test sample was measured by the same method as in Experimental Examples 1-9. The results of measurement of heat dissipation are as shown in Table 5.
  • the temperature of the sample in Experimental Example 10 was 39.4 ° C. immediately below the heater, but the state of heat diffusion was similar to that of the sample in Experimental Example 7 above. Slightly inferior ( ⁇ to ⁇ : good heat dissipation).

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  • Cooling Or The Like Of Electrical Apparatus (AREA)
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Abstract

Le but de la présente invention est de fournir un matériau composite thermoconducteur qui est peu coûteux et qui présente des propriétés à la fois de dureté élevée et de dissipation de chaleur. Un matériau composite thermoconducteur (1) comprend un matériau de résine renforcé de fibres (2) qui est en forme de feuille et contient une fibre de renfort continue (f), et des couches de feuille métallique (3(3a, 3b)) qui sont solidairement reliées aux deux surfaces du matériau de résine renforcé de fibres (2), et l'épaisseur (T1) du matériau composite thermoconducteur est de 0,07 à 1mm. L'épaisseur (t2) du matériau de résine renforcé de fibres (2) est d'au moins 0,05 mm à moins de 1 mm, l'épaisseur (t3a, t3b) des couches de feuille métallique (3(3a, 3b)) est 0,009 à 0,1mm, et l'élasticité à la traction du matériau composite thermoconducteur (1) est d'au moins 80 GPa.
PCT/JP2015/052788 2014-02-10 2015-01-27 Matériau composite thermoconducteur, et son procédé de fabrication WO2015119064A1 (fr)

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IT201700011367A1 (it) * 2017-02-02 2018-08-02 Niteko S R L Dissipatore di calore planare in materiale composito ad alta conducibilità termica e ad alta resistenza meccanica
WO2019202975A1 (fr) 2018-04-18 2019-10-24 日本製鉄株式会社 Composite de métal et de matériau de résine renforcé par des fibres de carbone, et procédé de fabrication de composite de métal et de matériau de résine renforcé par des fibres de carbone
CN112684850A (zh) * 2020-12-16 2021-04-20 太仓鸿恩电子科技有限公司 一种快速散热超轻型笔记本碳纤板外壳的成型工艺
WO2021106561A1 (fr) * 2019-11-29 2021-06-03 東レ株式会社 Structure sandwich et son procédé de fabrication
WO2021106563A1 (fr) * 2019-11-29 2021-06-03 東レ株式会社 Structure en sandwich et son procédé de fabrication
KR20210079980A (ko) * 2019-12-20 2021-06-30 한국과학기술연구원 금속 코팅층을 포함하는 섬유강화 복합 구조체 및 이의 제조 방법
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JP2017106405A (ja) * 2015-12-11 2017-06-15 本田技研工業株式会社 移動体用構造部材
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WO2018142298A1 (fr) * 2017-02-02 2018-08-09 Niteko S.R.L. Dissipateur thermique plan en matériau composite à haute conductivité thermique et à haute résistance mécanique
WO2019202975A1 (fr) 2018-04-18 2019-10-24 日本製鉄株式会社 Composite de métal et de matériau de résine renforcé par des fibres de carbone, et procédé de fabrication de composite de métal et de matériau de résine renforcé par des fibres de carbone
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WO2021106561A1 (fr) * 2019-11-29 2021-06-03 東レ株式会社 Structure sandwich et son procédé de fabrication
WO2021106563A1 (fr) * 2019-11-29 2021-06-03 東レ株式会社 Structure en sandwich et son procédé de fabrication
CN114728495A (zh) * 2019-11-29 2022-07-08 东丽株式会社 夹层结构体及其制造方法
KR20210079980A (ko) * 2019-12-20 2021-06-30 한국과학기술연구원 금속 코팅층을 포함하는 섬유강화 복합 구조체 및 이의 제조 방법
KR102314378B1 (ko) * 2019-12-20 2021-10-20 한국과학기술연구원 금속 코팅층을 포함하는 섬유강화 복합 구조체 및 이의 제조 방법
CN112684850A (zh) * 2020-12-16 2021-04-20 太仓鸿恩电子科技有限公司 一种快速散热超轻型笔记本碳纤板外壳的成型工艺
WO2023206654A1 (fr) * 2022-04-25 2023-11-02 叶金蕊 Matériau composite isolant résistant aux ultra-hautes tensions thermoconducteur et son procédé de préparation

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