WO2015118798A1 - Élément à électroluminescence organique et dispositif d'éclairage - Google Patents

Élément à électroluminescence organique et dispositif d'éclairage Download PDF

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Publication number
WO2015118798A1
WO2015118798A1 PCT/JP2015/000065 JP2015000065W WO2015118798A1 WO 2015118798 A1 WO2015118798 A1 WO 2015118798A1 JP 2015000065 W JP2015000065 W JP 2015000065W WO 2015118798 A1 WO2015118798 A1 WO 2015118798A1
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Prior art keywords
thermal conductivity
electrode
high thermal
organic
organic light
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PCT/JP2015/000065
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English (en)
Japanese (ja)
Inventor
將有 鎌倉
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パナソニックＩｐマネジメント株式会社
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Publication of WO2015118798A1 publication Critical patent/WO2015118798A1/fr

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8428—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/361—Temperature

Definitions

  • An organic electroluminescent device and a lighting device using the same are disclosed.
  • An organic light emitting layer comprising a plurality of functional layers including a light transmitting electrode (anode) and a light emitting layer on the surface of a light transmitting substrate as an organic electroluminescent device (hereinafter also referred to as “organic EL device”) And what laminated
  • organic EL element light emitted from the light emitting layer by applying a voltage between the anode and the cathode is extracted to the outside through the light transmitting electrode and the substrate.
  • the light emitting layer is sealed by a sealing material to protect from the outside.
  • the light transmitting electrode is formed of a light transmitting and conductive material (such as ITO), but generally, the material of the light transmitting electrode has a high specific resistance and is electrically conductive. Is not very good.
  • the electrode layer is thinned to improve the luminous efficiency, or when the luminous area of the device is enlarged, the sheet resistance is increased.
  • heat may be generated due to Joule heat along with the flow of the current in a portion where the light transmissive electrode is a single body. Heat generation may cause deterioration of the organic layer.
  • an electrode is drawn from the sealing region to the outside in order to connect to an external power source, and current is concentrated at the part from which the electrode is drawn to easily generate heat locally.
  • heat is generated locally, temperature unevenness may occur in the element, and deterioration of the organic layer may locally proceed.
  • the temperature of the element is increased, current flows easily through that portion, the luminance may become uneven within the light emitting surface, and the problem of uneven luminance may occur.
  • an auxiliary wiring is formed on the surface of the light transmitting electrode with a material having higher conductivity than the light transmitting electrode, and the electrical conductivity of the light transmitting electrode is determined by this auxiliary wiring. It can be considered that the conductivity of the electrode is enhanced. However, if a portion where the auxiliary wiring is not formed is provided due to the sealing structure, the resistance at that portion becomes high, current flows and heat is generated, and local heat generation becomes a problem.
  • Japanese Patent Laid-Open Publication No. 2012-212555 discloses the structure of a light emitting device in which a sheet member functioning as a heat equalizing plate is provided on the outer surface of a sealing member.
  • a heat spreader When a heat spreader is used, the generated heat can be made as uniform as possible by the heat spreader, but heat generation is continuously generated along with the flow of current, and a structure that further suppresses heat generation is required. .
  • Japanese Patent Laid-Open Publication No. 2003-100447 discloses that, in an organic EL element, a resin layer having high thermal conductivity is provided in a portion from which an electrode is drawn.
  • the high thermal conductivity resin layer is formed on the outer peripheral portion of the sealing structure, which can suppress heat generation at the outer peripheral portion of the sealing structure, but the inside of the sealing region It is difficult to reduce temperature non-uniformity and brightness non-uniformity because the heat generation is not suppressed.
  • An object of the present disclosure is to provide a highly reliable organic electroluminescent device and a lighting device in which heat generation of the device is suppressed and temperature unevenness and brightness unevenness are reduced.
  • An organic electroluminescent device includes a substrate having light transmittance, an organic light-emitting body supported by the substrate, a sealing plate disposed to face the substrate, the substrate, and the sealing plate And a filler disposed between.
  • the organic light-emitting body includes a light-transmitting first electrode, a second electrode paired with the first electrode, and an organic light-emitting layer disposed between the first electrode and the second electrode.
  • the sealing plate covers and seals the organic light emitter.
  • the filler has a high thermal conductivity region at a position of the edge of the organic light emitting layer, the thermal conductivity being higher than the thermal conductivity of the substrate.
  • a lighting device includes the above-described organic electroluminescent device.
  • the organic electroluminescent element of the present disclosure can suppress heat generation by efficiently releasing heat from the high thermal conductivity region to the outside, reduces temperature unevenness and brightness unevenness, and has high reliability.
  • FIG. 1 is composed of FIG. 1A, FIG. 1B and FIG. 1C.
  • FIG. 1 shows an example of the organic electroluminescent device.
  • FIG. 1A is a partially exploded plan view.
  • FIG. 1B is a cross-sectional view.
  • FIG. 1C is a partial cross-sectional view.
  • FIG. 2 is composed of FIG. 2A, FIG. 2B and FIG. 2C.
  • FIG. 2 shows an example of the organic electroluminescent device.
  • FIG. 2A is a partially exploded plan view.
  • FIG. 2B is a cross-sectional view.
  • FIG. 2C is a partial cross-sectional view.
  • FIG. 3 is composed of FIGS. 3A to 3D.
  • FIG. 3 is composed of FIGS. 3A to 3D.
  • FIG. 3A is a cross-sectional view of a part of an example of the organic electroluminescent device.
  • FIG. 3B is a cross-sectional view of a part of an example of the organic electroluminescent device.
  • FIG. 3C is a cross-sectional view of a part of an example of the organic electroluminescent device.
  • FIG. 3D is a cross-sectional view of a part of an example of the organic electroluminescent device.
  • FIG. 4 is composed of FIG. 4A, FIG. 4B and FIG. 4C.
  • FIG. 4A is a plan view of a part of an example of the partially disassembled organic electroluminescent device.
  • FIG. 4A is a plan view of a part of an example of the partially disassembled organic electroluminescent device.
  • FIG. 4B is a plan view of a part of an example of the organic electroluminescent device with a part thereof disassembled.
  • FIG. 4C is a plan view of a part of an example of the partially disassembled organic electroluminescent device. It is the top view which showed an example of the organic electroluminescent element, and decomposed
  • the organic electroluminescent device (organic EL device) according to the present disclosure includes a substrate 1 having light transmittance, an organic light-emitting body 10 supported by the substrate 1, and a sealing plate 5 disposed to face the substrate 1. And a filler 6 disposed between the substrate 1 and the sealing plate 5.
  • the organic light emitting body 10 is an organic light emitting layer disposed between the first electrode 2 having light transmittance, the second electrode 4 paired with the first electrode 2, and the first electrode 2 and the second electrode 4.
  • the sealing plate 5 covers and seals the organic light emitting body 10.
  • the filler 6 has a high thermal conductivity area 6 A at a position of the edge 3 e of the organic light emitting layer 3, the thermal conductivity of which is higher than the thermal conductivity of the substrate 1.
  • the high thermal conductivity region 6A is disposed at the position of the edge 3e of the organic light emitting layer 3 where heat is easily generated, the heat generated at the edge 3e of the organic light emitting layer 3 is efficiently absorbed It is possible to dissipate heat and suppress the heat generation of the organic light emitting layer 3. Excessive light emission in a part of the organic light emitting layer 3 is suppressed by heat transfer using the high thermal conductivity region 6A, and luminance unevenness such as uneven light emission in the plane can be reduced. In addition, it is possible to reduce temperature unevenness such that the temperature is partially high, and to suppress local increase in luminance and nonuniform deterioration of the organic light emitting body 10 in the plane. That is, heat generation can be suppressed, temperature unevenness and brightness unevenness can be reduced, and an organic EL element with good light emission and high reliability can be obtained.
  • the organic EL element of the present disclosure is not limited to the embodiment.
  • FIG. 1 shows an example (first embodiment) of the organic EL element.
  • FIG. 1 is composed of FIGS. 1A to 1C.
  • FIG. 2 shows another example (second embodiment) of the organic EL element.
  • FIG. 2 is composed of FIGS. 2A to 2C.
  • the organic EL element includes a substrate 1 having light transmittance, an organic light-emitting body 10 supported by the substrate 1, and a sealing plate 5 disposed to face the substrate 1. Equipped with The organic light emitting body 10 is an organic light emitting layer disposed between the first electrode 2 having light transmittance, the second electrode 4 paired with the first electrode 2, and the first electrode 2 and the second electrode 4. And three. The organic light emitting body 10 is covered and sealed by the sealing plate 5.
  • FIGS. 1A and 2A show the organic EL element in a plan view (when viewed from a direction perpendicular to the surface of the substrate 1).
  • 1A and 2A are plan views seen from the side of the sealing plate 5, that is, the surface opposite to the light emitting surface.
  • the sealing plate 5 and the filling material 6 are removed and illustrated so that the internal configuration of the element can be easily understood, and the sealing side wall 8 disposed at the outer peripheral portion of the sealing plate 5 is hatched. It shows by.
  • the hidden portion of the auxiliary wiring 7 is indicated by a broken line.
  • the high thermal conductivity area 6A is indicated by an alternate long and short dash line.
  • FIG. 1B and 1C are lateral cross-sectional views of FIG. 1A.
  • 2B and 2C are transverse cross-sectional views of FIG. 2A.
  • FIG. 1B and FIG. 2B sectional drawing in the part in which the 1st electrode lead-out part 11a was formed is shown.
  • the portion filled with the filler 6 is indicated by dots, and the high thermal conductivity area 6A is a dark dot, and the filling area 6B is a thin dot.
  • FIG. 1C and FIG. 2C sectional drawing in the part in which the 2nd electrode lead-out part 11b was formed is shown.
  • FIG. 1 The structure of FIG. 1 is different from the structure of FIG. 2 in the lead-out structure of the electrode and the structure of the auxiliary wiring 7.
  • the auxiliary wiring 7 is an annular frame continuously integrated.
  • the auxiliary wiring 7 is divided in accordance with the lead-out pattern of the electrode.
  • the substrate 1 a plate-like body having light transparency can be used.
  • the substrate 1 may be any as long as it transmits light, and may be transparent or semitransparent. More preferably, the substrate 1 is transparent.
  • the substrate 1 can be configured of a glass substrate, a resin substrate, or the like. When the substrate 1 is made of glass, since the glass has low moisture permeability, the penetration of moisture from the substrate 1 side can be suppressed. Also, the substrate 1 may be made of a composite material of glass and another material. For example, in the case of using the substrate 1 in which the light extracting resin layer is provided on the glass surface, the light extracting property can be effectively enhanced. This resin layer can be provided on the surface of the substrate 1 on the side of the first electrode 2.
  • the resin layer may be provided by pasting a plastic material. PET, PEN, etc. can be used as a plastic material.
  • the resin layer may be provided by applying a material such as an acrylic resin system or an epoxy resin system.
  • the resin layer may have a multilayer structure of a high refractive index layer and a low refractive index layer, or a layer in which a fine uneven structure is provided at the interface of the multilayer structure.
  • a light diffusion layer may be disposed on the surface of the substrate 1 opposite to the first electrode 2. Thereby, light can be diffused and more light can be extracted. In addition, the viewing angle dependency can be reduced.
  • the light diffusion layer may be formed of an optical film, a resin layer, or the like.
  • An organic light emitting body 10 is configured by a laminate of the first electrode 2, the organic light emitting layer 3, and the second electrode 4.
  • the organic light emitting body 10 can be defined as a structure in which the first electrode 2, the organic light emitting layer 3 and the second electrode 4 are stacked in the thickness direction.
  • the area where the organic light emitting body 10 is provided is an area of the central portion of the light transmitting substrate 1 in a plan view (when viewed from the direction perpendicular to the substrate surface).
  • the organic light emitting body 10 is covered and sealed by a sealing plate 5 which is larger than the organic light emitting body 10 in plan view, and the organic light emitting body 10 is disposed inside the sealing region.
  • the first electrode 2, the organic light emitting layer 3 and the second electrode 4 are disposed in this order from the substrate 1 side.
  • the first electrode 2 is an electrode having light transparency.
  • the second electrode 4 is an electrode that forms a pair with the first electrode 2.
  • the first electrode 2 constitutes an anode
  • the second electrode 4 constitutes a cathode, but may be reversed. Since the first electrode 2 has light transparency, it can constitute an electrode on the light extraction side.
  • the second electrode 4 may have light reflectivity. In that case, light from the light emitting layer emitted toward the second electrode 4 side can be reflected by the second electrode 4 and extracted from the substrate 1 side.
  • the second electrode 4 may be a light transmitting electrode. In the case where the second electrode 4 is light transmissive, it is possible to have a structure in which light is extracted from the surface (rear surface) on the sealing plate 5 side.
  • the second electrode 4 is light transmissive
  • a light reflective layer is provided on the back surface (the surface opposite to the organic light emitting layer 3) of the second electrode 4 to move in the direction of the second electrode 4 It is possible to reflect the emitted light and extract the light from the substrate 1 side.
  • the light reflective layer may be diffuse reflective or specular reflective.
  • the first electrode 2 can be configured using a transparent electrode material.
  • a conductive metal oxide can be preferably used.
  • ITO, IZO, AZO etc. are illustrated.
  • the material of the first electrode 2 is preferably ITO.
  • the first electrode 2 can be formed by a sputtering method, a vapor deposition method, a coating method, or the like.
  • the thickness of the first electrode 2 is not particularly limited, but can be, for example, in the range of 10 nm to 1000 nm.
  • the second electrode 4 can be configured using an appropriate electrode material.
  • the second electrode 4 can be formed of Al, Ag or the like.
  • the second electrode 4 can be formed by vapor deposition, sputtering or the like.
  • the thickness of the second electrode 4 is not particularly limited, but can be, for example, in the range of 10 nm to 1000 nm.
  • the organic light emitting layer 3 is a layer having a function of causing light emission, and usually, from a hole injection layer, a hole transport layer, a light emitting layer (a layer containing a light emitting dopant), an electron transport layer, an electron injection layer, an intermediate layer, etc. It is composed of a plurality of layers to be selected.
  • the organic light emitting layer 3 may have a multilayer structure. Each layer in the organic light emitting layer 3 is defined as a functional layer.
  • the thickness of the organic light emitting layer 3 is not particularly limited, but can be, for example, about 60 to 300 nm.
  • the organic light emitting layer 3 has a hole injection layer, a hole transport layer, a light emitting layer, an electron transport in this order from the first electrode 2 side.
  • the layer can be an electron injection layer.
  • the laminated structure is not limited to this, and for example, a single layer of the light emitting layer, a laminated structure of the hole transporting layer, the light emitting layer, and the electron transporting layer, or the hole transporting layer and the light emitting layer A stacked structure can be used, or a stacked structure of a light emitting layer and an electron transporting layer can be used.
  • the light emitting layer may have a single layer structure or a multilayer structure.
  • the light emitting layer may be stacked.
  • the light emitting units have a light transmitting property and conductivity. It may be a multi-unit structure stacked via layers.
  • the multi-unit structure is a structure provided with a plurality of light emitting units overlapping in the thickness direction between paired electrodes (anode and cathode).
  • the electrode lead-out portion 11 is formed by drawing the conductive layer constituting the first electrode 2 to the end of the substrate 1. Then, on the surface of the electrode lead-out portion 11, an electrode pad 9 constituting an electrode terminal is disposed.
  • the electrode terminal is a terminal for electrically connecting to an external power supply.
  • the electrode lead portion 11 is disposed on the end surface of the substrate 1.
  • the electrode lead-out portion 11 is divided into a first electrode lead-out portion 11 a electrically connected to the first electrode 2 and a second electrode lead-out portion 11 b electrically connected to the second electrode 4.
  • the first electrode lead-out portion 11 a can be defined as a portion where the first electrode 2 extends and protrudes from the organic light emitting layer 3 in plan view.
  • the second electrode lead-out portion 11 b can be defined as a portion where the conductive layer constituting the first electrode 2 at the end portion of the substrate 1 is divided by patterning.
  • the second electrode lead-out portion 11 b may be formed by drawing the material of the second electrode 4, and in this case, the second electrode lead-out portion 11 b is a portion of the second electrode 4 protruding from the organic light emitting layer 3. It can be defined.
  • the electrode lead-out portion 11 is formed by the conductive layer constituting the first electrode 2 being drawn to the end portion side of the substrate 1 and extending outside the region where the sealing plate 5 is provided. That is, as shown in FIG. 1B and FIG. 2B, at the end where the first electrode lead-out portion 11a is provided, the conductive layer constituting the first electrode 2 extends out from the sealing region by stretching and is applied to the surface of the substrate 1 It is formed.
  • the first electrode lead-out portion 11 a is configured by an extended portion of the first electrode 2.
  • the conductive layer constituting the first electrode 2 is divided and the conductive layer divided is extended by stretching.
  • the second electrode lead-out portion 11 b is configured by an extended portion of the conductive layer separated from the first electrode 2.
  • the second electrode lead-out portion 11b is in contact with the stacked second electrode 4 inside the sealing region, whereby the second electrode lead-out portion 11b and the second electrode 4 are electrically connected. .
  • the structure of the electrode lead-out portion 11 (structure for drawing the electrode to the outside of the sealing region) is not limited to the structure shown in FIGS. 1 and 2, and, for example, the first electrode lead-out portion 11a and the second One or both of the electrode lead portions 11 b may be formed using a conductive layer different from the conductive layer constituting the first electrode 2.
  • An electrode pad 9 is disposed on the surface of the electrode lead-out portion 11 exposed to the outside. Since the electrode pad 9 is formed in the non-light emitting region, it may not have light transparency. By providing the electrode pad 9, connection with an external power supply can be made by the electrode pad 9, and electrical connectivity can be improved. Further, by providing the electrode pad 9, the conductivity of the conductive layer constituting the first electrode 2 and the electrode lead-out portion 11 can be enhanced.
  • the electrode pad 9 is formed such that one electrically connected to the first electrode 2 and one electrically connected to the second electrode 4 are electrically insulated.
  • the auxiliary wiring 7 is disposed on the surface inside the sealing region of the electrode lead-out portion 11. Since the auxiliary wiring 7 is formed in the non-light emitting region, it may not have light transparency. Further, by providing the auxiliary wiring 7, the conductivity of the conductive layer constituting the first electrode 2 and the electrode lead-out portion 11 can be enhanced.
  • the auxiliary wiring 7 is formed so as to be electrically connected to the first electrode 2 and electrically insulated from the second electrode 4.
  • the auxiliary wiring 7 is formed on the extension of the first electrode 2.
  • the auxiliary wiring 7 is provided on the electrode lead portion 11. In FIG. 1 and FIG. 2, the auxiliary wiring 7 is disposed on the first electrode lead-out portion 11 a.
  • the auxiliary wiring 7 is preferably disposed at the end of the organic EL element at which the electrode lead-out portion 11 is formed. As a result, the conduction assisting effect can be further enhanced. It is more preferable that the auxiliary wiring 7 be disposed at the end where the first electrode lead-out portion 11 a is formed. Thereby, the conductivity of the first electrode lead-out portion 11a can be enhanced.
  • the auxiliary wiring 7 is preferably provided in a frame shape as a whole so as to surround the organic light emitting layer 3. Thereby, the current density in the plane can be made more uniform to obtain more uniform light emission in the plane.
  • the auxiliary wiring 7 may be in the form of a frame as a whole, and may be formed in a continuous pattern as shown in FIG. 1, or the first electrode 2 and the second electrode 4 may be formed as shown in FIG. It may be formed in a divided pattern so as not to short.
  • the example which has the auxiliary wiring 7 is shown in FIG.1 and FIG.2, in the organic EL element, it is not necessary to have the auxiliary wiring 7. FIG. Also in that case, the heat generation at the edge 3 e of the organic light emitting layer 3 can be suppressed.
  • the auxiliary wiring 7 can be formed of, for example, a metal layer.
  • the auxiliary wiring 7 is an embodiment preferably formed of a laminated structure of metal layers.
  • a laminated structure of Mo / Al / Mo can be used.
  • the auxiliary wiring 7 may be formed of a layer containing Ag.
  • the electrode pad 9 may be made of the same material as the auxiliary wiring 7. Thereby, the highly conductive electrode pad 9 can be easily formed.
  • a mesh-like auxiliary electrode may be formed in contact with the first electrode 2.
  • An auxiliary electrode can be provided in the area
  • the auxiliary electrode has a grid-like pattern. A square grid, a hexagonal grid, etc. are illustrated as a grid-like pattern.
  • the auxiliary electrode can be formed of the same material as the auxiliary wiring 7.
  • the auxiliary electrode may be provided on the surface of the first electrode 2 on the organic light emitting layer 3 side, or may be provided on the surface of the first electrode 2 on the substrate 1 side. By providing the auxiliary electrode, the conductivity of the first electrode 2 can be enhanced.
  • the lead-out structure of the electrode and the shape of the auxiliary wiring 7 are different.
  • the organic EL element is provided with the insulating layer 12.
  • the insulating layer 12 is formed as a covering layer covering the auxiliary wiring 7.
  • the insulating layer 12 is formed of an insulating material, and is made of, for example, a resin.
  • the insulating layer 12 is formed at a position on the element inner side of the first electrode lead-out portion 11 b of the auxiliary wiring 7.
  • the insulating layer 12 may be provided corresponding to the first electrode lead portion 11 b.
  • the insulating layer 12 may be in contact with the organic light emitting layer 3.
  • a part of the second electrode 4 is extended so as not to contact the auxiliary wiring 7.
  • the extended portion of the second electrode 4 is in contact with the second electrode lead-out portion 11 b.
  • the auxiliary wiring 7 can be provided annularly so as to surround the organic light emitting body 10. That is, the auxiliary wiring 7 can be provided over the entire outer periphery of the first electrode 2. This is because the extended portion of the first electrode 2 and the extended portion of the second electrode 4 are insulated by the insulating layer 12. In this case, the auxiliary wiring 7 is not divided but is continuous and can be integrated. Therefore, the conductivity of the first electrode 2 can be enhanced, and light emission with high brightness can be obtained more uniformly in the plane.
  • the insulating layer 12 may cover the auxiliary wiring 7 all around the auxiliary wiring 7. In that case, the insulating layer 12 may be formed in a continuous frame shape.
  • the insulating layer 12 may be annularly formed.
  • the insulating layer 12 may have any appropriate pattern as long as it can ensure the insulation between the first electrode 2 and the second electrode 4.
  • the auxiliary wiring 7 is divided at the position of the second electrode lead-out portion 11 b.
  • the second electrode lead-out portion 11 b intrudes into the inside of the frame formed by the auxiliary wiring 7.
  • the organic EL element does not have the insulating layer 12.
  • FIG. 2C at the position where the organic light emitting layer 3 covers the first electrode 2, the second electrode 4 is extended, and this extended portion is connected to the second electrode lead-out portion 11b. Thereby, electrical connection is possible. Since the form of FIG. 2 does not need to provide the insulating layer 12, manufacture may become easy.
  • the sealing plate 5 can be formed using a substrate material with low moisture permeability.
  • a glass substrate can be used. Specifically, soda lime glass, alkali-free glass and the like can be mentioned. Since these are relatively inexpensive glass materials, it is possible to reduce the manufacturing cost of the device.
  • the sealing plate 5 can use a plate material having a flat surface.
  • the sealing plate 5 may be made of resin or metal.
  • a sealing sidewall 8 be provided on the outer periphery of the organic light emitting body 10 between the substrate 1 and the sealing plate 5.
  • the sealing side wall 8 is disposed on the outer periphery of the organic light emitting body 10 so as to surround the organic light emitting body 10.
  • the sealing side wall 8 may be frame-shaped.
  • the sealing side wall 8 has a function as a spacer material for housing the organic light emitting body 10.
  • the sealing side wall 8 preferably has a function of bonding the substrate 1 and the sealing plate 5.
  • the sealing side wall 8 preferably has a function of blocking and filling the filling material 6.
  • the structure in which the region surrounded by the sealing material is filled with the filling material is called a filled sealing structure.
  • the material of the sealing side wall 8 may be made of an appropriate material which has sealing properties and functions as an adhesive.
  • a resin material can be used as a material of the sealing side wall 8.
  • the resin material preferably has moisture resistance.
  • the resin material may be mainly composed of a thermosetting resin or an ultraviolet curable resin.
  • the cured side wall 8 is formed by curing the resin.
  • a spacer component is included as the material of the sealing side wall 8.
  • the spacer component is a material to be mixed to secure a space for the thickness of the organic light emitting body 10. Examples of the spacer component include particles. By using particles of an appropriate size, the thickness of the gap between the substrate 1 and the sealing plate 5 is adjusted, and a space for housing the organic light emitting body 10 is formed.
  • the material of the sealing side wall 8 preferably has a viscosity that allows filling and blocking of the filler 6 in the state before curing. Thereby, the function as a dam material can be exhibited, and the filler 6 can be filled in the region surrounded by the sealing side wall 8.
  • the sealing plate 5 is bonded to the substrate 1 by an adhesive material.
  • the adhesive material is constituted by at least the sealing side wall 8.
  • a filler 6 is disposed in the gap between the substrate 1 and the sealing plate 5.
  • the filler 6 is disposed so as to be surrounded by the sealing side wall 8.
  • the filler 6 may have adhesiveness or may not have adhesiveness, but having adhesiveness can increase the adhesive strength between the substrate 1 and the sealing plate 5. Because it is preferable.
  • the filled and sealed structure is a structure having higher thermal conductivity.
  • a sealing structure of the organic EL element there is also a hollow sealing structure in which the gap in which the organic light emitting body 10 is accommodated is hollow.
  • heat is transferred to the outside through air (a gas such as nitrogen) present in the hollow portion.
  • the heat conductivity of air is at a level smaller than 0.03 [W / (m ⁇ K)], and since air can also exhibit a heat insulating function, heat is less likely to escape in the hollow sealing structure.
  • the thermal conductivity of the resin is higher than the thermal conductivity of air, and the thermal conductivity of the resin can also be improved by selecting the material, In the case of the filling and sealing structure, the heat is easily transmitted and the heat is easily released.
  • the filler 6 of the organic EL element of the present disclosure has the high thermal conductivity region 6A at the position of the edge 3e of the organic light emitting layer 3.
  • the thermal conductivity of the high thermal conductivity region 6A is higher than the thermal conductivity of the substrate 1.
  • the thermal conductivity of the high thermal conductivity region 6A is higher than the thermal conductivity of the substrate 1, the heat generated at the edge 3e of the organic light emitting layer 3 is sealed at a faster speed than the heat spreads along the substrate 1 It can be transmitted to the plate 5 side and heat can be dissipated from the sealing plate 5 to the outside.
  • the heat tends to be applied to the organic light emitting body 10.
  • the heat load can be suppressed from being applied to the organic light emitting body 10. Therefore, degradation of the organic light-emitting body 10 can be suppressed.
  • the outer edge of the high thermal conductivity area 6A is indicated by a dashed dotted line.
  • the edge 3 e of the organic light emitting layer 3 is shown at the position of the end of the organic light emitting layer 3.
  • the portion of the filler 6 other than the high thermal conductivity region 6A is defined as a filler region 6B.
  • the filling material 6 is composed of the high thermal conductivity area 6A and the filling area 6B.
  • the filling region 6B may be a region having a lower thermal conductivity than the high thermal conductivity region 6A. In that case, the filling area 6B can be called a low thermal conductivity area. However, the low thermal conductivity in the low thermal conductivity region is relative to that in the filler 6.
  • the high thermal conductivity area 6A can be a heat path and heat can be dissipated to the outside.
  • the thermal conductivity of the high thermal conductivity area 6A be higher than the thermal conductivity of the sealing plate 5. Thereby, heat can be dissipated to the outside more efficiently.
  • the plan view shape of the organic EL element is preferably a polygon.
  • the plan view shape of the organic EL element is preferably a rectangular shape.
  • the rectangular shape includes a rectangle and a square.
  • the substrate 1 is a rectangular shape.
  • the sealing plate 5 has a rectangular shape.
  • the electrode lead portions 11 may be provided on two opposing sides of a square.
  • high thermal conductivity area 6A is provided in the side in which electrode lead-out part 11 was provided.
  • the high thermal conductivity area 6A can be disposed at a portion where heat is more likely to be generated.
  • the high thermal conductivity area 6A be disposed including at least four corners of the square of the sealing plate 5. In this case, heat is easily generated at the corner portions, so that the heat can be efficiently transmitted.
  • the current density is the lowest in the central region of the organic light emitting body 10 and the highest in the outer peripheral portion due to the voltage drop. Further, between the organic light emitting body 10 to be a light emitting region and the electrode pad 9 to be an electrode terminal, a portion consisting only of the first electrode 2 with high resistance formed of ITO film or the like is provided. It becomes a factor which heat is easy to generate locally.
  • the auxiliary wiring 7 is not formed in the second electrode lead-out portion 11 b so as not to short-circuit but is formed in the first electrode lead-out portion 11 a from which the first electrode 2 is drawn. More current flows. This is because a current flows through the auxiliary wiring 7 and the current flows into the first electrode 2 (under the organic light emitting layer 3). Therefore, generation of Joule heat relatively increases in the substrate outer peripheral portion in the vicinity of the auxiliary wiring 7. When the temperature rises locally, the current easily flows to emit excessive light and the brightness locally increases, which may cause unevenness in the surface. Furthermore, when the temperature becomes high, the current easily flows to increase the current density, which may cause a vicious cycle in which Joule heat is further generated. Therefore, in the organic EL element shown in FIG.
  • the high thermal conductivity region 6A is provided at the position of the edge 3e of the organic light emitting layer 3. Then, since heat can be absorbed at the portion where heat is likely to be generated locally and the heat can be dissipated to the outside, heat generation can be efficiently suppressed. Also, by preferentially absorbing the heat of the portion where heat generation is likely to occur by the high thermal conductivity region 6A, the uneven distribution of the local temperature distribution is suppressed, the temperature is made more uniform in the plane, and the temperature unevenness and the brightness unevenness are It can be suppressed. Moreover, since the temperature rise of whole is suppressed, deterioration of the organic light emitting layer 3 by high temperature is suppressed, and since the continuity of electricity supply improves, reliability can be improved.
  • the high thermal conductivity region 6A is in contact with the sealing plate 5.
  • heat can be efficiently absorbed and dissipated to the outside.
  • the heat generated at the edge 3e of the organic light emitting layer 3 which is the end of the sealing region can be transmitted to the sealing plate 5 through the high thermal conductivity region 6A, and the heat can be dissipated from the sealing plate 5 to the outside.
  • a structure in which a heat equalizing plate is provided on the outer surface of the sealing plate 5 is known as a structure for suppressing local heat generation, but the heat equalizing plate has a function to make heat uniform by heat conduction. Yes, there is little heat absorption.
  • the heat spreader is provided outside and heat is transmitted through the sealing plate 5, heat generation can not be suppressed directly.
  • the high thermal conductivity region 6A is disposed at the edge 3e of the organic light emitting layer 3 where heat is easily generated inside the sealing region, it efficiently absorbs heat and suppresses local heat generation. At the same time, it is possible to suppress the high temperature of the entire device. Therefore, temperature unevenness and brightness unevenness can be suppressed, and the reliability can be enhanced.
  • a heat spreader plate may be further provided on the surface of the sealing plate 5 on the element external side (the surface on the opposite side to the substrate 1). Thereby, the nonuniformity of the temperature distribution can be further reduced.
  • the heat spreader can be made of Cu or the like.
  • the high thermal conductivity region 6A overlaps the edge 3e of the organic light emitting layer 3 in plan view.
  • the organic light emitting layer 3 may protrude from the second electrode 4 or may be covered with the second electrode 4 depending on the pattern shape of each layer of the organic light emitting body 10, but the high thermal conductivity region 6A emits organic light when viewed in plan It may be disposed at the position of the edge 3 e of the layer 3. It is more preferable that the high thermal conductivity area 6A be disposed across the edge 3e of the organic light emitting layer 3. Thereby, the heat in the vicinity of the edge 3 e of the organic light emitting layer 3 can be efficiently dissipated.
  • the high thermal conductivity region 6A may be in contact with the organic light emitter 10. When the high thermal conductivity region 6A is in contact with the organic light emitting body 10, the heat generation of the organic light emitting body 10 can be efficiently absorbed.
  • the high thermal conductivity region 6A may be in contact with the second electrode 4.
  • the high thermal conductivity region 6A may be in contact with the organic light emitting layer 3. In the case where the organic light emitting body 10 is covered with a covering agent in the sealing region, the high thermal conductivity area 6A may not be in direct contact with the organic light emitting body 10. In this case, the high thermal conductivity area 6A may overlap the edge 3e of the organic light emitting layer 3 in plan view. In short, the high thermal conductivity area 6A may be arranged so as to absorb the heat generated near the edge 3e of the organic light emitting layer 3.
  • the organic EL element has the auxiliary wiring 7 on the outer periphery of the organic light emitting body 10 inside the sealing.
  • the high thermal conductivity area 6A is preferably disposed at the position of the auxiliary wiring 7.
  • the position of the auxiliary wiring 7 is a portion where the current easily flows locally, so it is a portion where heat generation is likely to occur, but the heat at that portion can be absorbed and transmitted. It is preferable that the high thermal conductivity area 6A be disposed so as to overlap the auxiliary wiring 7 in a plan view.
  • the auxiliary wiring 7 is a layer formed on the surface of the extended portion of the first electrode 2 in order to enhance the electrical conductivity, and the electrode lead-out portion 11 in the vicinity of the auxiliary wiring 7 is a portion where heat is easily generated. Therefore, heat generation can be suppressed more efficiently.
  • the organic EL element has a first electrode lead-out portion 11 a as an electrode lead-out portion 11 drawn from the first electrode 2.
  • the high thermal conductivity area 6A be disposed at the position of the first electrode lead-out portion 11a.
  • the electrode lead-out portion 11 has a high resistance and is a portion where heat generation is likely to occur due to the flow of electricity.
  • the first electrode lead-out portion 11 a is an extended portion of the first electrode 2 and is a portion where heat is easily generated. Therefore, heat can be absorbed and transmitted at the lead-out portion of the electrode, so that heat generation can be efficiently suppressed.
  • the high thermal conductivity area 6A may be provided at the position of the second electrode lead-out portion 11b.
  • the second electrode lead-out portion 11 b is also disposed at the end portion, and heat is easily generated also in this portion. Therefore, when the high thermal conductivity area 6A is provided at the position of the second electrode lead-out portion 11b, heat can be dissipated efficiently.
  • the high thermal conductivity area 6A be disposed so as to overlap the electrode lead portion 11 in a plan view. Furthermore, in plan view, it is preferable that the high thermal conductivity area 6A be disposed overlapping the first electrode lead-out portion 11a.
  • the first electrode lead-out portion 11a is a portion where heat is easily generated, and heat generation can be suppressed more efficiently when the first electrode lead-out portion 11a and the high thermal conductivity area 6A overlap in a plan view.
  • the high thermal conductivity area 6A is preferably in contact with the first electrode lead portion 11a. More preferably, the high thermal conductivity region 6A is in contact with the second electrode lead-out portion 11b.
  • the organic EL element is surrounded by the sealing side wall 8 in which the filler 6 is provided on the outer periphery of the organic light emitting body 10.
  • the high thermal conductivity region 6A be in contact with the sealing side wall 8.
  • heat can be efficiently absorbed and released to the outside.
  • the heat absorbed by the high thermal conductivity area 6A is transmitted not only to the sealing plate 5 but also to the sealing sidewall 8 to release the heat from the sealing sidewall 8 to the outside. It is because
  • FIG. 3 is composed of FIGS. 3A to 3D.
  • the high thermal conductivity region 6A is disposed at the position of the edge 3e of the organic light emitting layer 3.
  • directions of heat transfer are indicated by arrows.
  • the high thermal conductivity area 6A is spaced apart from the sealing sidewall 8.
  • the filling area 6B is disposed between the high thermal conductivity area 6A and the sealing side wall 8.
  • the high thermal conductivity region 6A is disposed in contact with the sealing sidewall 8.
  • the high thermal conductivity area 6A is formed at the position of the first electrode lead-out portion 11a.
  • the first electrode lead-out portion 11 a is a portion where the first electrode 2 extends and protrudes from the organic light emitting layer 3.
  • the high thermal conductivity area 6A and the first electrode lead-out portion 11a overlap in a plan view.
  • the high thermal conductivity region 6A overlaps the first electrode lead-out portion 11a between the auxiliary wiring 7 and the organic light emitting layer 3 in plan view, and is in contact with this portion. Therefore, it is possible to efficiently absorb and transmit the heat generated in the first electrode lead-out portion 11 a which is likely to generate heat.
  • the high thermal conductivity area 6A is not provided at the position of the auxiliary wiring 7.
  • the high thermal conductivity area 6A is disposed at the position of the auxiliary wiring 7.
  • the high thermal conductivity region 6A and the auxiliary wiring 7 overlap in plan view.
  • the high thermal conductivity area 6A is formed at the position of the first electrode lead-out portion 11a.
  • the high thermal conductivity area 6A and the first electrode lead-out portion 11a overlap in a plan view.
  • the heat generated in the auxiliary wiring 7 where the current tends to be concentrated and the vicinity thereof can be efficiently absorbed and transmitted, the heat can be absorbed more efficiently than the heat in FIG. 3A.
  • the high thermal conductivity region 6A is disposed so as to cover the auxiliary wiring 7.
  • the high thermal conductivity region 6A is formed across the auxiliary wiring 7.
  • the auxiliary wiring 7 is surrounded by the high thermal conductivity area 6A. It may be said that the outer edge of the high thermal conductivity area 6A is disposed outside the outer edge of the auxiliary wiring 7.
  • the high thermal conductivity region 6A overlaps the first electrode lead-out portion 11a between the auxiliary wiring 7 and the organic light emitting layer 3 in plan view, and is in contact with this portion.
  • the high thermal conductivity region 6A overlaps the first electrode lead-out portion 11a between the sealing sidewall 8 and the auxiliary wiring 7 in plan view and is in contact with this portion.
  • heat can be absorbed and dissipated more efficiently than in FIGS. 3A and 3B because the heat generated in the auxiliary wiring 7 where the current tends to be concentrated and the vicinity thereof can be absorbed and transmitted more efficiently. be able to.
  • the high thermal conductivity area 6A is provided at the position of the auxiliary wiring 7 and the position of the first electrode lead-out portion 11a, and is in contact with the sealing sidewall 8.
  • the absorbed heat can be released from both the sealing plate 5 and the sealing side wall 8.
  • heat is transferred to the sealing plate 5
  • heat can be transferred to the sealing side wall 8 in addition to the sealing plate 5. Yes (black arrow).
  • the sealing side wall 8 is often formed in a portion where the auxiliary wiring 7 of the electrode lead-out portion 11 is not provided.
  • the sealing side wall 8 is required to have high adhesion, but if the sealing side wall 8 is formed in contact with the auxiliary wiring 7, the adhesion may be reduced. At this time, the sealing side wall 8 and the electrode lead-out portion 11 are in contact with each other. Then, if the auxiliary wiring 7 is not formed at the position of the sealing side wall 8, the single layer of the first electrode lead-out portion 11 a crosses the sealing side wall 8. The current passes through the relatively high first electrode lead-out portion 11a. Therefore, the current is concentrated in the vicinity of the sealing side wall 8 to easily generate heat. Therefore, in FIG. 3D, the high thermal conductivity region 6A is provided in contact with the sealing sidewall 8. Then, since the high thermal conductivity region 6A contacts the sealing sidewall 8, the heat generated near the sealing sidewall 8 can be efficiently absorbed and released. Therefore, FIG. 3D can more efficiently absorb heat and dissipate heat than FIGS. 3A to 3C.
  • the high thermal conductivity region 6A is preferably provided on the side of the organic EL element on which the electrode pad 9 is formed.
  • the current passes through the electrode pad 9 and enters the element, so the temperature in the vicinity of the electrode pad 9 tends to rise. Therefore, by providing the high thermal conductivity area 6A on the side where the electrode pad 9 is formed, heat can be efficiently absorbed and heat generation can be suppressed.
  • the filler 6 is made of an appropriate material.
  • the filler 6 is preferably formed of a resin composition. It is preferable that the filler 6 is a resin composition hardened and hardened.
  • the filling material 6 may be formed by using the material of the high thermal conductivity area 6A and the material of the filling area 6B.
  • the resin composition that constitutes the high thermal conductivity area 6A may be different from the resin composition that constitutes the filling area 6B. Thereby, high thermal conductivity high thermal conductivity area 6A can be formed easily. It is preferable that the high thermal conductivity region 6A be a resin for forming the filling region 6B to which a high thermal conductivity material be added. Thus, the same kind of resin can be used as the filler 6, and the integrity of the filler 6 as a whole can be enhanced, and the thermal conductivity in the high thermal conductivity area 6A can be efficiently enhanced.
  • Examples of the material of the filler 6 include ultraviolet curable resins and thermosetting resins.
  • an epoxy resin, an acrylic resin, etc. are preferably used.
  • an ultraviolet curable resin is preferable.
  • An ultraviolet curable resin can be cured by ultraviolet irradiation, and thus can be cured at a temperature lower than that of a thermosetting resin.
  • the resin depends on the type of resin, the heat conductivity is usually lower than 1, and for example, it is about 0.5 for an epoxy resin.
  • the unit of thermal conductivity is W / (m ⁇ K).
  • the thermal conductivity of the glass that can be used as the substrate 1 and the sealing plate 5 is about 1. That is, since the resin generally tends to have a lower thermal conductivity than glass, in order to form the high thermal conductivity region 6A, it is required to increase the thermal conductivity of the filler 6. Therefore, it is preferable that the component that enhances the thermal conductivity be contained in the high thermal conductivity region 6A.
  • particles having thermal conductivity are preferable. Examples of the particles having thermal conductivity include metal particles.
  • the thermal conductivity of the high thermal conductivity area 6A can be easily made higher than that of the substrate 1 by the addition of the particles having thermal conductivity.
  • a material having insulating properties or a material to which an insulating treatment has been applied may be used as the particles having thermal conductivity.
  • the high thermal conductivity area 6A preferably has a thermal conductivity greater than one. As a result, heat can be efficiently transmitted and released to the outside.
  • the thermal conductivity of the high thermal conductivity region 6A can be, for example, in the range of 1 to 3, but is not limited thereto.
  • the thermal conductivity of the substrate 1 may be less than one.
  • the thermal conductivity of the sealing plate 5 may be smaller than one.
  • the difference in thermal conductivity between the substrate 1 and the sealing plate 5 may be 0.1 or less.
  • the thermal conductivity of the filling region 6B may be smaller than one.
  • the unit of thermal conductivity is W / (m ⁇ K).
  • the thermal conductivity of the filling region 6B may be lower or higher than the thermal conductivity of the substrate 1. In any case, if the high thermal conductivity area 6A is provided, heat can be efficiently transmitted.
  • the thermal conductivity of the filling region 6B is preferably one higher than the thermal conductivity of the substrate 1. In this case, heat can be transmitted through the filling region 6B, and heat generation can be further suppressed.
  • the thermal conductivity of the filling region 6B is smaller than the thermal conductivity of the substrate 1, the thermal conductivity is, in order from the smaller one, the filling region 6B, the substrate 1, and the high thermal conductivity region 6A.
  • the thermal conductivity of the filling region 6B is higher than the thermal conductivity of the substrate 1, the thermal conductivity is, in ascending order, the substrate 1, the filling region 6B, and the high thermal conductivity region 6A.
  • the thermal conductivity of the substrate 1 and the sealing plate 5 may be the same, and the order of the thermal conductivity may replace the substrate 1 and the sealing plate 5.
  • the thermal conductivity of the filling region 6B is higher than the thermal conductivity of the substrate 1, it can be considered that the whole of the filler 6 becomes the high thermal conductivity region 6A as in the form described later.
  • the filling material 6 is provided with the filling area 6B and the high thermal conductivity area 6A having a higher thermal conductivity than the filling area 6B.
  • the configuration is advantageous. By providing the filler 6 with the high thermal conductivity area 6A having a relatively high thermal conductivity, heat can be efficiently dissipated from the high thermal conductivity area 6A. Therefore, it is advantageous to form the region separately.
  • the thermal conductivity of the sealing sidewall 8 may be higher than the filling area 6B. Thereby, the thermal conductivity can be enhanced to facilitate the release of heat.
  • the thermal conductivity of the sealing sidewall 8 is preferably higher than that of the substrate 1. Thereby, the heat in the vicinity of the sealing side wall 8 where the heat is easily generated can be efficiently absorbed and transmitted, and the heat can be dissipated to the outside.
  • the sealing sidewall 8 preferably has a high thermal conductivity portion 8A having a thermal conductivity higher than that of the high thermal conductivity region 6A in a portion in contact with the high thermal conductivity region 6A. Since the sealing sidewall 8 has high thermal conductivity, heat can be efficiently conducted to release the heat to the outside.
  • the high thermal conductivity portion 8A is a portion having a thermal conductivity higher than that of the substrate 1.
  • FIG. 4 is an explanatory view of the high heat conducting portion 8A provided on the sealing side wall 8.
  • FIG. 4 is composed of FIGS. 4A to 4C.
  • FIG. 4 shows a plan view of the vicinity of the sealing side wall 8 in the organic EL element excluding the sealing plate 5.
  • the high thermal conductivity portion 8A may be provided on at least a part of a portion of the sealing sidewall 8 in contact with the high thermal conductivity region 6A.
  • FIGS. 4A to 4C is applicable to the above-mentioned organic EL element.
  • the high thermal conductivity portion 8A is partially provided on the sealing sidewall 8 and in contact with a part of the high thermal conductivity region 6A in contact with the sealing sidewall 8.
  • the high thermal conductivity portion 8A is partially provided on the sealing side wall 8 and arranged to cover the side of the high thermal conductivity region 6A.
  • the contact area is increased, and heat can be more easily dissipated to the outside than in FIG. 4A.
  • a portion of the sealing sidewall 8 other than the high thermal conductivity portion 8A is defined as a low thermal conductivity portion 8B.
  • the low thermal conductivity in the low thermal conductivity portion 8B indicates the relative thermal conductivity in the sealing sidewall 8. It is preferable that the low thermal conductivity portion 8B has a thermal conductivity higher than that of the filling region 6B. It is preferable that the low thermal conductivity portion 8B has a thermal conductivity higher than that of the substrate 1. It is preferable that the low thermal conductivity portion 8B has a thermal conductivity higher than that of the sealing plate 5.
  • the whole of the sealing side wall 8 is configured by the high thermal conductivity portion 8A. That is, the thermal conductivity of the sealing side wall 8 is higher than that of the high thermal conductivity area 6A.
  • the whole of the sealing side wall 8 since the whole of the sealing side wall 8 has high thermal conductivity, heat can be easily transferred to the outside, and heat generation can be efficiently suppressed. Further, since the sealing side wall 8 can be formed of the same material, the sealing side wall 8 can be easily formed.
  • the description of the reference numerals of the high thermal conductivity portion 8A and the low thermal conductivity portion 8B is omitted, but in each figure, it may be considered that the sealing side wall 8 is formed of the same material. Also in these, the sealing side wall 8 may have the high thermal conductivity portion 8A.
  • the sealing side wall 8 may be entirely formed of a high thermal conductivity portion 8A preferably having a thermal conductivity higher than that of the high thermal conductivity region 6A.
  • the sealing side wall 8 is made of an appropriate material.
  • the sealing sidewall 8 is preferably formed of a resin composition. It is preferable that the sealing side wall 8 is a hardened and hardened resin composition.
  • the resin composition constituting the high thermal conductivity portion 8A and the resin composition constituting the low thermal conductivity portion 8B may be different. Thereby, the high thermal conductivity portion 8A having high thermal conductivity can be easily formed. It is preferable that the high thermal conductivity portion 8A be a resin for forming the low thermal conductivity portion 8B to which a high thermal conductivity material be added.
  • the same kind of resin can be used as the sealing side wall 8 and the integrity can be enhanced, and the thermal conductivity in the high thermal conductivity portion 8A can be efficiently enhanced.
  • the sealing side wall 8 it is more preferable that the whole is comprised by 8 A of high heat conduction parts.
  • the sealing side wall 8 can be integrally formed of a high thermal conductivity resin composition. Thereby, the sealing sidewall 8 having high thermal conductivity can be easily formed.
  • an ultraviolet curable resin As a material of the sealing side wall 8, an ultraviolet curable resin, a thermosetting resin, etc. are mentioned.
  • an epoxy resin, an acrylic resin, etc. are preferably used.
  • an ultraviolet curable resin As a material of the sealing side wall 8, an ultraviolet curable resin is preferable.
  • An ultraviolet curable resin can be cured by ultraviolet irradiation, and thus can be cured at a temperature lower than that of a thermosetting resin.
  • the resin depends on the type of resin, the heat conductivity is usually lower than 1, and for example, it is about 0.5 for an epoxy resin.
  • the unit of thermal conductivity is W / (m ⁇ K). Therefore, in order to provide the sealing sidewall 8 with high thermal conductivity, it is preferable that the sealing sidewall 8 contain a component that enhances the thermal conductivity.
  • a component which improves thermal conductivity particles having thermal conductivity are preferable.
  • the particles having thermal conductivity include metal particles.
  • aluminum oxide and aluminum nitride are exemplified.
  • the thermal conductivity of the sealing sidewall 8 can be easily increased by the addition of the particles having the thermal conductivity.
  • a material having insulating properties or a material to which an insulating treatment has been applied may be used as the particles having thermal conductivity.
  • the sealing sidewall 8 preferably has a thermal conductivity greater than one. As a result, heat can be efficiently transmitted and released to the outside.
  • the thermal conductivity of the sealing sidewall 8 can be, for example, in the range of 1 to 3, but is not limited thereto.
  • the thermal conductivity of the low thermal conductivity portion 8B is in the range of 1 to 2 and the thermal conductivity of the high thermal conductivity portion 8A is 2 to 3 It may be a range.
  • the unit of thermal conductivity is W / (m ⁇ K).
  • the auxiliary wiring 7 is formed in a ring shape. That is, the auxiliary wiring 7 is formed as a continuous frame so as to surround the outer periphery of the organic light emitting body 10. The auxiliary wiring 7 is integrated. Thereby, the conductivity of the first electrode 2 can be highly assisted.
  • the auxiliary wiring 7 is preferably provided in a polygonal frame shape continuous to the entire outer periphery of the organic light emitting body 10.
  • the polygon may be a polygon having a shape corresponding to the polygon of the organic EL element.
  • the high thermal conductivity area 6A be disposed at least over the entire length of one side of the polygon.
  • the end that is the side of the polygon is a portion where current is likely to be concentrated and heat is likely to be generated. Therefore, heat can be efficiently absorbed and released by forming the high thermal conductivity region 6A in this portion.
  • the number of high thermal conductivity regions 6A disposed along the entire length of the side is preferably at least one, and more preferably two or more.
  • the high thermal conductivity regions 6A are linearly arranged along the sides of the square of the organic EL element.
  • the shape of the high thermal conductivity region 6A may be rectangular.
  • the electrode lead-out portions 11 are formed at both ends of the substrate 1, and the high heat conduction area 6A is formed at both of the both ends.
  • the high thermal conductivity regions 6A are disposed on two opposing sides of the square of the organic EL element in which the electrode lead-out portion 11 is formed.
  • the high thermal conductivity region 6A extends over the entire length of the end portion of the sealing plate 5.
  • the high heat conduction area 6A is long.
  • the high thermal conductivity region 6A may be in contact with the insulating layer 12.
  • the high thermal conductivity region 6A may cover the insulating layer 12. Since the insulating layer 12 is provided at the position of the auxiliary wiring 7 and is located at a position where heat generation is easy, heat can be efficiently dissipated.
  • the auxiliary wiring 7 is formed by being divided at the outer periphery of the organic light emitting body 10.
  • the auxiliary wiring 7 is divided.
  • the conductivity of the first electrode lead-out portion 11a can be efficiently improved.
  • the high thermal conductivity region 6A be disposed in accordance with the divided shape of the auxiliary wiring 7.
  • the high thermal conductivity region 6A is disposed corresponding to the auxiliary wiring 7.
  • the auxiliary wiring 7 is disposed in the first electrode lead portion 11 a.
  • the high thermal conductivity area 6A is disposed corresponding to the portion from which the first electrode lead-out portion 11a is drawn.
  • the auxiliary wiring 7 is divided at the portion where the second electrode lead-out portion 11 b is provided.
  • the high thermal conductivity area 6A is divided at the portion where the second electrode lead-out portion 11b is provided.
  • the high thermal conductivity area 6A is divided into plural pieces (six pieces).
  • the high thermal conductivity regions 6A are disposed at the four corners of the square in the planar shape of the organic EL element.
  • the four corners are portions where the first electrode lead-out portion 11 a extends, and heat is easily generated. Therefore, heat generation can be efficiently suppressed by the high thermal conductivity areas 6A disposed at the four corners.
  • the high thermal conductivity area 6A is disposed at the center of the side of the square in the planar shape of the organic EL element.
  • the first electrode lead-out portion 11a is provided between the second electrode lead-out portions 11b, and the high thermal conductivity region 6A is provided corresponding to the central first electrode lead-out portion 11a. Is formed. Therefore, heat generation that may occur at the center of the side can be efficiently suppressed.
  • FIG. 5 is a modification of the organic EL element.
  • FIG. 5 shows a modification based on the auxiliary wiring 7 formed in a continuous annular shape as shown in FIG. 1, the high heat conduction region 6A of FIG. 5 is applied to any of the embodiments of FIG. 1 and FIG. It is possible.
  • FIG. 5 shows the organic EL element disassembled and viewed in plan. The symbols shown in FIG. 5 are the same as those described above.
  • the high thermal conductivity region 6A is formed in a continuous annular shape inside the sealing sidewall 8.
  • the high thermal conductivity area 6A is preferably disposed in the entire area of the edge 3e of the organic light emitting layer 3.
  • the high thermal conductivity area 6A may be said to be a continuous frame. In the current density distribution and temperature distribution in the plane of the organic EL element, the distribution is the highest in the vicinity where the electrode lead-out portion 11 is provided, but the distribution is relatively high also in the outer peripheral portion.
  • the auxiliary wiring 7 when the auxiliary wiring 7 is provided so as to surround the organic light emitting body 10, and the auxiliary wiring 7 is disposed at an end other than the portion from which the electrode is drawn out, the auxiliary wiring 7 Heat is likely to be generated in the entire area where the 7 is provided. Therefore, by providing the high thermal conductivity region 6A along the outer periphery of the organic light emitting body 10 so as to overlap the entire area of the edge 3e of the organic light emitting layer 3, heat generation can be suppressed high and temperature unevenness is reduced. can do. Further, by making the in-plane temperature distribution more uniform, it is possible to further uniform the luminance and to further reduce the luminance unevenness.
  • the high thermal conductivity area 6A may be provided along the outer periphery of the sealing plate 5.
  • FIG. 6 shows a modification of the organic EL element.
  • the example of FIG. 6 is applicable to any of the forms of FIGS. 1 and 2.
  • sectional drawing in the part in which the 1st electrode lead-out part 11a in the organic EL element was provided is shown.
  • the plan view of the embodiment of FIG. 6 may be considered the same as FIG. 1A or FIG. 2A.
  • the outer edge of the high thermal conductivity area 6A is modified from FIGS. 1A and 2A.
  • the whole of the filler 6 is configured by the high thermal conductivity area 6A.
  • the filler 6 does not have the filling area 6B. That is, the whole of the filler 6 has a thermoelectric conductivity higher than that of the substrate 1.
  • the entire portion surrounded by the sealing side wall 8 between the substrate 1 and the sealing plate 5 is the high thermal conductivity area 6 ⁇ / b> A.
  • the thermal conductivity of the filler 6 may be higher than the thermal conductivity of the substrate 1. Therefore, the heat generated in the organic light emitting body 10 can be easily transmitted to the sealing plate 5 and the sealing side wall 8 to dissipate the heat to the outside.
  • the types of fillers 6 can be reduced, there is an advantage that the manufacturing becomes easy.
  • the filler 6 is configured by the high thermal conductivity area 6A and the filling area 6B, and the heat of the outer peripheral portion is dissipated preferentially. Is preferred. Also, in order to enhance the uniformity of the entire temperature, as in the above embodiment, the filler 6 is constituted by the high thermal conductivity area 6A and the filling area 6B, and the heat of the outer peripheral portion is dissipated preferentially. Is preferred.
  • the manufacturing method of an organic EL element is demonstrated.
  • the organic light emitting body 10 is formed on the substrate 1.
  • the formation of the organic light emitting body 10 can be performed by sequentially laminating the layers constituting the organic light emitting body 10.
  • the first electrode 2 is stacked on the surface of the substrate 1, then the organic light emitting layer 3 is stacked, and then the second electrode 4 is stacked.
  • the lamination can be performed by selecting an appropriate method of sputtering, vapor deposition, and application for each layer.
  • the organic light emitting layer 3 has a multilayer structure, the layers of the organic light emitting layer 3 can be sequentially stacked.
  • the first electrode 2, the organic light emitting layer 3 and the second electrode 4 may be formed by patterning so that the organic EL element can be driven.
  • the conductive layer constituting the first electrode 2 is extended to form the first electrode lead-out portion 11a, and the conductive layer constituting the first electrode 2 is patterned by patterning. It is made to divide and form the 2nd electrode lead-out part 11b.
  • the auxiliary wiring 7 can be formed after the first electrode 2 and before laminating the organic light emitting layer 3. At the same time as the auxiliary wiring 7, one or both of the electrode pad 9 and the auxiliary electrode may be formed.
  • the organic light emitting body 10 is formed by laminating the first electrode 2, the organic light emitting layer 3 and the second electrode 4.
  • the material of the sealing side wall 8 is formed in a frame shape on the substrate 1 so as to surround the outer periphery of the organic light emitting body 10 and surrounded by the material of the sealing side wall 8
  • the part is filled with the material of the filler 6.
  • the material of the sealing side wall 8 is preferably one having form retention while having a certain degree of fluidity. In that case, it becomes possible to function as a dam for blocking the material of the filler 6.
  • the material of the filler 6 may be fluid. For example, an uncured resin can be mentioned.
  • the material for forming the high thermal conductivity area 6A is disposed at the location of the high thermal conductivity area 6A, and the material for forming the filler area 6B at the location of the loading area 6B. can do.
  • the material of the high thermal conductivity area 6A can be arranged linearly or partially (dividingly) arranged on two opposing sides of a square forming the shape of the organic EL element.
  • the material of the high thermal conductivity region 6A can be disposed in the entire place where the filler 6 is to be filled.
  • the filler 6 is preferably configured to have fluidity and shape retention that slightly extend from the applied position when applied in a dot-like manner. Then, mixing of the material of the high thermal conductivity area 6A and the material of the filling area 6B is suppressed. Thereby, the materials of the filling material 6 can be arranged while maintaining the mutual area. Control of the flowability and the shape retention is possible by the viscosity of the material of the filler 6 or the like.
  • the materials of the organic light emitting body 10 and the filling material 6 are interposed between the substrate 1 and the sealing plate 5 so as to be opposed to each other, and they are brought close to bring the sealing plate 5 into contact with the material of the sealing side wall 8.
  • the substrate 1 and the sealing plate 5 are temporarily bonded with the material of the sealing side wall 8.
  • the organic light emitting body 10 is disposed between the substrate 1 and the sealing plate 5.
  • the materials of the sealing side wall 8 and the filling material 6 may be disposed in the direction of the sealing plate 5 and then the substrate 1 and the sealing plate 5 may be bonded.
  • the material of the filler 6 is cured. It is preferable to cure the material of the sealing sidewall 8 simultaneously with the curing of the material of the filler 6.
  • an ultraviolet curable resin it can be cured by irradiation with ultraviolet light.
  • the resin can be efficiently cured.
  • the resin can be cured by heating to a thermosetting temperature. When the heating step is included, the organic EL element may be degraded depending on the temperature. Therefore, it is preferable to use a thermosetting resin having a curing property at a relatively low temperature, or to use an ultraviolet curable resin.
  • the material of the filler 6 is solidified to form a solid filler 6. Further, by curing the resin, the material of the sealing sidewall 8 is solidified to form a solid sealing sidewall 8.
  • a lighting device includes the above-described organic EL element. As a result, it is possible to obtain a highly reliable lighting device without temperature unevenness and luminance unevenness.
  • the illumination device may arrange a plurality of organic EL elements in a plane.
  • the lighting device may have a wiring structure for supplying power to the organic EL element.
  • the lighting device may include a housing that supports the organic EL element.
  • the lighting device may include a plug electrically connecting the organic EL element and the power source.
  • the lighting device can be configured in the form of a panel. Since the lighting device can be reduced in thickness, it is possible to provide a space-saving lighting fixture.
  • FIG. 7 An example of a lighting apparatus is shown in FIG.
  • the lighting device 100 of FIG. 7 includes the organic EL element 101.
  • the configuration indicated by the reference numerals described in FIG. 7 is similar to that described above.
  • the organic EL element 101 has the wiring 102.
  • the organic EL element 101 is connected to the external power supply 103 by a wire 102 connected to the electrode pad 9. Open arrows indicate the emission of light.

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

La présente invention concerne un élément à électroluminescence organique comprenant : un substrat (1) transmettant la lumière ; un corps électroluminescent organique (10) supporté par le substrat (1) ; une plaque d'étanchéité (5) disposée en regard du substrat (1) ; et un matériau de remplissage (6) disposé entre le substrat (1) et la plaque d'étanchéité (5). Le corps électroluminescent organique (10) comporte : une première électrode (2) transmettant la lumière ; une seconde électrode (4) formant une paire avec la première électrode (2) ; et une couche électroluminescente organique (3) disposée entre la première électrode (2) et la seconde électrode (4). La plaque d'étanchéité (5) recouvre et scelle hermétiquement le corps électroluminescent organique (10). Le matériau de remplissage (6) comporte des zones à haute conductivité thermique (6A) ayant une conductivité thermique supérieure à la conductivité thermique du substrat (1), au niveau de positions de sections de bord (3e) de la couche électroluminescente organique (3).
PCT/JP2015/000065 2014-02-10 2015-01-08 Élément à électroluminescence organique et dispositif d'éclairage WO2015118798A1 (fr)

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JP2014023446A JP2017068895A (ja) 2014-02-10 2014-02-10 有機エレクトロルミネッセンス素子及び照明装置
JP2014-023446 2014-02-10

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WO2018066038A1 (fr) * 2016-10-03 2018-04-12 シャープ株式会社 Dispositif d'affichage électroluminescent organique et procédé de fabrication de dispositif d'affichage électroluminescent organique
CN108628051A (zh) * 2017-03-22 2018-10-09 斯坦雷电气株式会社 光学元件

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US11121339B2 (en) * 2018-05-11 2021-09-14 Nanosys, Inc. Quantum dot LED design based on resonant energy transfer

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JP2010198980A (ja) * 2009-02-26 2010-09-09 Panasonic Electric Works Co Ltd 面状発光装置
JP2010205714A (ja) * 2009-02-03 2010-09-16 Jsr Corp 照明装置
JP2012119064A (ja) * 2010-11-29 2012-06-21 Rohm Co Ltd 有機発光素子
JP2013008484A (ja) * 2011-06-23 2013-01-10 Nippon Seiki Co Ltd 有機ｅｌパネル
JP2013012426A (ja) * 2011-06-30 2013-01-17 Nippon Seiki Co Ltd 有機ｅｌパネル及びその製造方法

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JP2010205714A (ja) * 2009-02-03 2010-09-16 Jsr Corp 照明装置
JP2010198980A (ja) * 2009-02-26 2010-09-09 Panasonic Electric Works Co Ltd 面状発光装置
JP2012119064A (ja) * 2010-11-29 2012-06-21 Rohm Co Ltd 有機発光素子
JP2013008484A (ja) * 2011-06-23 2013-01-10 Nippon Seiki Co Ltd 有機ｅｌパネル
JP2013012426A (ja) * 2011-06-30 2013-01-17 Nippon Seiki Co Ltd 有機ｅｌパネル及びその製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018066038A1 (fr) * 2016-10-03 2018-04-12 シャープ株式会社 Dispositif d'affichage électroluminescent organique et procédé de fabrication de dispositif d'affichage électroluminescent organique
CN108628051A (zh) * 2017-03-22 2018-10-09 斯坦雷电气株式会社 光学元件
CN108628051B (zh) * 2017-03-22 2022-08-19 斯坦雷电气株式会社 光学元件

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