WO2015109909A1 - Pcb板磨板机 - Google Patents

Pcb板磨板机 Download PDF

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Publication number
WO2015109909A1
WO2015109909A1 PCT/CN2014/094353 CN2014094353W WO2015109909A1 WO 2015109909 A1 WO2015109909 A1 WO 2015109909A1 CN 2014094353 W CN2014094353 W CN 2014094353W WO 2015109909 A1 WO2015109909 A1 WO 2015109909A1
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WO
WIPO (PCT)
Prior art keywords
rails
rail
pcb board
grinding machine
guide
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PCT/CN2014/094353
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English (en)
French (fr)
Inventor
任小浪
陈蓓
樊光辉
曾志军
Original Assignee
广州兴森快捷电路科技有限公司
深圳市兴森快捷电路科技股份有限公司
宜兴硅谷电子科技有限公司
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Application filed by 广州兴森快捷电路科技有限公司, 深圳市兴森快捷电路科技股份有限公司, 宜兴硅谷电子科技有限公司 filed Critical 广州兴森快捷电路科技有限公司
Publication of WO2015109909A1 publication Critical patent/WO2015109909A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/02—Frames; Beds; Carriages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/07—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a stationary work-table

Definitions

  • the invention relates to a PCB board manufacturing technology, in particular to a PCB board grinding machine.
  • the outer circuit is usually obtained by the following process: electroplating ⁇ resin plug hole ⁇ grinding plate ⁇ thinning copper ⁇ outer layer circuit production, but the quality of the grinding plate in this process often becomes its popularization and application.
  • the traditional PCB grinding method is mainly to pass the PCB board from the oppositely set grinding and steel pressing, and polish the surface of the PCB board by grinding.
  • the conventional grinding method may cause problems such as the exposed substrate of the PCB after the grinding and polishing, or the resin is not completely worn off or the copper thickness uniformity is poor.
  • the present invention overcomes the defects of the prior art and provides a PCB board grinding machine, which aims to solve the problems that the PCB substrate or the resin is not completely worn off or the copper thickness uniformity is poor.
  • a PCB board grinding machine comprises a worktable, a first guide rail, two second guide rails, a third guide rail, a grinding plate assembly and a servo system, wherein the two second guide rails are arranged parallel to each other on both sides of the worktable, the first guide rail Across the two second rails and movable along the second rails, the third rails are vertically disposed on the first rails and movable along the first rails, and the grating assembly is disposed on the third rails. And movable up and down along the third rail, the servo system is used to control the first rail, the third rail, and the grinding plate assembly.
  • the PCB board grinding machine includes two first rails, and the two first rails are parallel to each other across the two On the two rails, and the two first rails are disposed at different heights of the same vertical plane, the two first rails can simultaneously move along the second rail, and the third rails are vertically disposed on the two first rails, and It can be moved along the first rail.
  • the PCB board grinding machine further includes two vertical columns, the two vertical columns are vertically disposed on the two second rails, and are movable along the second rail, and the two ends of the first rail are respectively connected with the two pillars.
  • the column is provided with a slider, and the slider is slidably mounted on the second rail.
  • the third rail is provided with a sliding seat that is matched with the two first guiding rails, and the sliding seat is mounted on the two first guiding rails.
  • the grinding plate assembly includes a rotating main shaft and a grinding brush.
  • the rotating main shaft is disposed on the third rail and movable up and down along the third rail.
  • the grinding brush is disposed at one end of the rotating main shaft near the working table.
  • the third rail is a screw rod, and the rotating main shaft is sleeved on the screw rod.
  • the brush front end is provided with a pressure sensor, and the pressure sensor is electrically connected to the servo system.
  • the rotating main shaft is provided with a coarse adjustment button and a fine adjustment knob, and the coarse adjustment button and the fine adjustment knob are electrically connected to the servo system.
  • a frame above the work surface is arranged around the workbench, and a guide groove is arranged between the frame and the workbench.
  • the above PCB board grinding machine has the advantages of simple structure and convenient operation.
  • the PCB board to be polished is placed on the worktable, and the third rail is controlled to move on the first rail by the servo system, and the first rail is controlled to move on the second rail.
  • the flexible adjustment of the grinding position of the PCB board is realized, the grinding plate assembly is controlled to move up and down on the third rail, the distance between the grinding plate assembly and the PCB board is adjusted, the grinding amount is adjusted, and the PCB board is appropriately polished at different heights. Therefore, the higher thickness of the PCB board is prevented from being excessively polished, the exposed substrate or the lower portion of the PCB board is not polished, and the resin is not completely worn off, or the copper thickness is evenly polished after the surface of the PCB board is uneven. Poor sex.
  • FIG. 1 is a front view of a PCB board grinding machine according to an embodiment of the present invention.
  • FIG. 2 is a top plan view of a PCB board grinding machine according to an embodiment of the present invention.
  • a PCB board grinding machine comprises a work table 100, a first guide rail 200, two second guide rails 300, a third guide rail 400, a grinding plate assembly 500, a servo system 600, and two second guide rails 300 are arranged in parallel with each other.
  • the first rail 200 spans the two second rails 300 and is movable along the second rail 300.
  • the third rail 400 is vertically disposed on the first rail 200 and is along the first rail 200.
  • the squeegee assembly 500 is disposed on the third rail 400 and is movable up and down along the third rail 400.
  • the servo system 600 is used to control the first rail 200, the third rail 400, and the squeegee assembly 500.
  • the PCB board grinding machine of the embodiment has a simple structure and convenient operation.
  • the PCB board to be polished is placed on the worktable 100, and the third rail 400 is controlled by the servo system 600 to move on the first rail 200, and the first control is performed.
  • the guide rail 200 moves on the second guide rail 300, thereby realizing flexible adjustment of the grinding position of the PCB board, controlling the grinding plate assembly 500 to move up and down on the third guide rail 400, adjusting the distance between the grinding plate assembly 500 and the PCB board, and realizing the adjustment of the grinding amount.
  • the PCB board can be properly polished at different heights, so as to avoid excessive polishing of the PCB board and expose the substrate or the lower part of the PCB board is not polished to the extent that the resin is not completely worn off, or The surface of the PCB board is uneven and there is a problem that the uniformity of copper thickness after polishing is poor.
  • the manner in which the PCB board is placed on the worktable 100 is not fixed or fixed.
  • the unfixed manner is to directly place the PCB board on the work surface.
  • the fixing manner can be as follows: 1. Vacuum suction plate, in The surface of the worktable 100 is provided with a suction hole communicating with the vacuum device, and is fixed by placing the PCB board on the suction hole; 2.
  • the upper fixing pin limits the degree of freedom of the PCB board on the surface of the worktable 100 by the fixing pin, and avoids the movement of the PCB board.
  • the PCB board grinding machine of the embodiment includes two first rails 200, and the two first rails 200 are flat with each other.
  • the rows straddle the two second rails 300, and the two first rails 200 are disposed at different heights of the same vertical plane.
  • the first rail 200 is perpendicular to the second rail 300, and the two first rails 200 can be simultaneously
  • the second rails 300 are moved, and the third rails 400 are vertically disposed on the two first rails 200 and are movable along the first rails 200.
  • the two first guide rails 200 are respectively located at a distance of about 30 cm and 50 cm above the workbench 100, and the third guide rails 400 are disposed at the same time by providing two first guide rails 200 at different heights of the same vertical plane.
  • the stability of the third rail 400 is improved, and the third rail 400 is prevented from shaking when moving along the first rail 200.
  • the PCB board grinding machine further includes two vertical columns 700.
  • the two vertical columns 700 are vertically disposed on the two second guiding rails 300, and are movable along the second guiding rail 300.
  • the two ends of the first guiding rail 200 are respectively Two columns 700 are connected.
  • the two first rails 200 are moved along the second rails 300 by the column 700 to improve the synchronization and stability of the operation of the two first rails 200.
  • the column 700 is provided with a slider, and the slider is slidably mounted on the second rail 300. The slider slides on the second rail 300 to drive the column 700 to move along the second rail 300.
  • the slider is electrically connected to the servo system 600, and the sliders on the two columns 700 are synchronously slid by the servo system 600 to make two
  • the column 700 drives the two ends of the first rail 200 to move synchronously.
  • the second rail 300 can also be configured as a screw structure.
  • the column 700 is provided with a nut structure matched with the screw structure, and the screw structure is controlled by the servo system 600. Rotating to drive the nut structure to move; the first rail 200 can also be moved along the second rail 300 by manual control.
  • the grinding plate assembly 500 includes a rotating spindle 510 disposed on the third rail 400 and movable up and down along the third rail 400.
  • the brush 520 is disposed on the rotating spindle 510 to work closely.
  • the rotation of the rotating spindle 510 is controlled by the servo system 600 to drive the brush 520 to rotate, thereby polishing the PCB, and moving the spindle 510 up and down along the third rail 400 to realize the adjustment of the grinding amount.
  • the rotating main shaft 510 moves up and down along the third guide rail 400, and can be manually adjusted and automatically adjusted into two types, manually adjusted to a coordinate control type, automatically adjusted to a pressure sensing type, and a pressure sensor is disposed at a front end of the brush 520.
  • the pressure sensor is electrically connected to the servo system 600.
  • the rotating spindle 510 is driven downward by the falling command from the servo system 600.
  • the front end of the brush 520 contacts the PCB board to generate pressure, and the pressure sensor senses the pressure.
  • the servo system 600 automatically stops the lowering of the rotating spindle 510.
  • waterless dry grinding and wet grinding can be used.
  • the wet grinding water can be tap water and DI water, and the water supply pipe is connected with the brush 520. When there is no production, the water supply is automatically stopped.
  • the rotary spindle 510 is provided with a coarse adjustment button and a fine adjustment knob, and the coarse adjustment knob and the fine adjustment knob are electrically connected to the servo system 600.
  • the coarse adjustment button By adjusting the coarse adjustment button, the adjustment of the large distance of the rising or falling motion of the rotating spindle 510 is realized, and the adjustment of the fine adjustment button is performed to adjust the small distance of the rising or falling motion of the rotating spindle 510, thereby realizing flexible adjustment of the amount of polishing of the PCB.
  • the third guide rail 400 is a screw rod, and the rotating main shaft 510 is sleeved on the screw rod.
  • the rotation of the screw rod is controlled by the servo system 600, thereby driving the rotating spindle 510 to move up and down along the screw rod, so that the distance between the grinding plate assembly 500 and the PCB board can be adjusted to achieve the adjustment of the grinding amount; the third rail 400 is provided with the same
  • the two first guide rails 200 are matched with the slides, and the slide seats are mounted on the two first guide rails 200.
  • the slide rail is controlled to slide on the first rail 200 by the servo system 600, thereby driving the third rail 400 to move along the first rail 200; according to actual needs, the first rail 200 can also be arranged as a screw structure, the slide setting The nut structure matched with the screw structure controls the rotation of the screw structure by the servo system 600, thereby driving the nut structure to move on the screw structure.
  • a table frame 800 is disposed around the table 100 and is disposed above the table surface, and a flow guiding groove is disposed between the frame 800 and the table 100.
  • Parameter setting adjust the speed of the brush 520, set the movement mode (manual or automatic) and moving speed of the first rail 200 and the third rail 400, and coarsely adjust the working height and the pressure of the brush 520 so that the brush 520 just touches the PCB. After the surface of the board, use fine adjustment to adjust the number of turns of the fine adjustment knob according to the thickness of the sanding.
  • Grinding plate production Turn on the grinding switch 520 rotary switch, alternately grinding back and forth along the direction of the first guide rail 200 or the second guide rail 300 until the PCB board surface is even, turn off the rotary spindle 510 switch, and the lower PCB board.
  • the copper plate thickness of the grinding plate is uniform, the substrate is not exposed, the residual plug resin is not good, and the scraping rate of the grinding plate is reduced; and the PCB grinding machine is The structure is simple and easy to operate, especially suitable for PCB model manufacturers.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)

Abstract

一种PCB板磨板机，包括工作台（100）、第一导轨（200）、两根第二导轨（300）、第三导轨（400）、磨板组件（500）、伺服系统（600），两根第二导轨（300）相互平行设置在工作台（100）两侧，第一导轨（200）横跨在两根第二导轨（300）上，且可沿第二导轨（300）移动，第三导轨（400）竖直设置在第一导轨（200）上，且可沿第一导轨（200）移动，所述磨板组件（500）设置在第三导轨（400）上，且可沿第三导轨（400）上下移动，所述伺服系统（600）用于控制第一导轨（200）、第三导轨（400）和磨板组件（500）。该PCB板磨板机结构简单、操作方便，可以灵活调节PCB板打磨位置，也可实现打磨量的调节，使PCB板不同高度处得到合适的打磨。

Description

PCB板磨板机 技术领域
本发明涉及PCB板制造技术，特别涉及一种PCB板磨板机。
背景技术
随着电子行业的发展，精密线路板、厚板背板、高阶HDI板等高端产品需求量日益增多，此类产品制造技术难点多、工艺流程控制方法复杂，其中外层线路制作是其中较为关键的技术难点之一，通常外层线路采用如下流程获得：电镀→树脂塞孔→磨板→减薄铜→外层线路方式制作，但此流程工艺中的磨板的品质往往成为其推广应用在厚板、高层、精细线路时的技术瓶颈，传统的PCB磨板方式主要是通过将PCB板从相对设置的磨辘与钢压辘之间穿过，通过磨辘对PCB板表面进行打磨，但是由于PCB板内图形多样化导致其压合后凹凸不平，传统的磨板方式会导致经磨辘打磨后的PCB板露基材或者树脂未完全被磨掉或铜厚均匀性差等问题。
发明内容
基于此，本发明在于克服现有技术的缺陷，提供一种PCB板磨板机,旨在解决PCB板露基材或者树脂未完全被磨掉或铜厚均匀性差等问题。
其技术方案如下：
一种PCB板磨板机，包括工作台、第一导轨、两根第二导轨、第三导轨、磨板组件、伺服系统，两根第二导轨相互平行设置在工作台两侧，第一导轨横跨在两根第二导轨上，且可沿第二导轨移动，第三导轨竖直设置在第一导轨上，且可沿第一导轨移动，所述磨板组件设置在第三导轨上，且可沿第三导轨上下移动，所述伺服系统用于控制第一导轨、第三导轨、磨板组件。
其进一步技术方案如下：
所述PCB板磨板机包括两根第一导轨，两根第一导轨相互平行横跨于两根第 二导轨上，且两根第一导轨设置在同一竖直平面的不同高度处，两根第一导轨可同时沿第二导轨移动，第三导轨同时竖直设置在两根第一导轨上，且可沿第一导轨移动。
所述PCB板磨板机还包括两根立柱，两根立柱分别竖直设置在两根第二导轨上，且可沿第二导轨移动，所述第一导轨两端分别与两根立柱连接。
所述立柱上设有滑块，所述滑块滑动安装在第二导轨上。
所述第三导轨上设有同时与两根第一导轨匹配的滑座，所述滑座安装在两根第一导轨上。
所述磨板组件包括旋转主轴、磨刷，所述旋转主轴设置在第三导轨上，且可沿第三导轨上下移动，所述磨刷设置在旋转主轴靠近工作台的一端。
所述第三导轨为丝杆，所述旋转主轴套设在丝杆上。
所述磨刷前端设有压力感应器，所述压力感应器与伺服系统电性连接。
所述旋转主轴上设有粗调按钮、微调旋钮，所述粗调按钮、微调旋钮均与伺服系统电性连接。
所述工作台四周设有高于工作台面的台框，且台框与工作台之间设有导流槽。
下面对前述技术方案的优点或原理进行说明：
上述PCB板磨板机，结构简单、操作方便，通过将需要打磨的PCB板放置在工作台上，通过伺服系统控制第三导轨在第一导轨移动，控制第一导轨在第二导轨上移动，从而实现对PCB板打磨位置的灵活调节，控制磨板组件在第三导轨上下移动，调节磨板组件与PCB板的距离，实现打磨量的调节，使PCB板不同高度之处得到合适的打磨，从而避免PCB板较高处被打磨过度而露基材或者PCB板较低处未被打磨到而出现树脂未完全被磨掉的情况，或者因PCB板表面凹凸不平而出现打磨后的铜厚均匀性差的问题。
附图说明
图1为本发明实施例所述的PCB板磨板机的主视示意图；
图2为本发明实施例所述的PCB板磨板机的俯视示意图；
附图标记说明：
100、工作台，200、第一导轨，300、第二导轨，400、第三导轨，500、磨板组件，510、旋转主轴，520、磨刷，600、伺服系统，700、立柱，800、台框。
具体实施方式
下面结合附图对本发明的实施例进行详细说明：
一种PCB板磨板机，包括工作台100、第一导轨200、两根第二导轨300、第三导轨400、磨板组件500、伺服系统600，两根第二导轨300相互平行设置在工作台100两侧，第一导轨200横跨在两根第二导轨300上，且可沿第二导轨300移动，第三导轨400竖直设置在第一导轨200上，且可沿第一导轨200移动，所述磨板组件500设置在第三导轨400上，且可沿第三导轨400上下移动，所述伺服系统600用于控制第一导轨200、第三导轨400、磨板组件500。
本实施例所述PCB板磨板机，结构简单、操作方便，通过将需要打磨的PCB板放置在工作台100上，通过伺服系统600控制第三导轨400在第一导轨200移动，控制第一导轨200在第二导轨300上移动，从而实现对PCB板打磨位置的灵活调节，控制磨板组件500在第三导轨400上下移动，调节磨板组件500与PCB板的距离，实现打磨量的调节，使PCB板不同高度之处得到合适的打磨，从而避免PCB板较高处被打磨过度而露基材或者PCB板较低处未被打磨到而出现树脂未完全被磨掉的情况，或者因PCB板表面凹凸不平而出现打磨后的铜厚均匀性差的问题。
所述PCB板放置在工作台100上的方式有不固定和固定两种，不固定方式是直接将PCB板放置于工作台面上，固定方式可采用以下几种方式：1、真空吸板，在工作台100表面设置连通真空装置的吸孔，通过将PCB板放置在吸孔上从而实现固定；2、上固定销钉，通过固定销钉限制PCB板在工作台100表面的自由度，避免PCB板移动；3、制作活动档板，通过活动挡板限制PCB板在工作台100表面的自由度等。
本实施例所述PCB板磨板机包括两根第一导轨200，两根第一导轨200相互平 行横跨于两根第二导轨300上，且两根第一导轨200设置在同一竖直平面的不同高度处，第一导轨200垂直于第二导轨300，两根第一导轨200可同时沿第二导轨300移动，第三导轨400同时竖直设置在两根第一导轨200上，且可沿第一导轨200移动。本实施例所述两根第一导轨200分别位于工作台100上方30cm、50cm左右距离处，通过在同一竖直平面的不同高度处设置两根第一导轨200，使第三导轨400同时设置在两根第一导轨200上，提高第三导轨400的稳定性，避免第三导轨400沿第一导轨200移动时出现晃动。
所述PCB板磨板机还包括两根立柱700，两根立柱700分别竖直设置在两根第二导轨300上，且可沿第二导轨300移动，所述第一导轨200两端分别与两根立柱700连接。通过立柱700带动两根第一导轨200沿第二导轨300移动，提高两根第一导轨200运行的同步性与稳定性。所述立柱700上设有滑块，所述滑块滑动安装在第二导轨300上。通过滑块在第二导轨300上滑动，从而带动立柱700沿第二导轨300移动；滑块与伺服系统600电性连接，通过伺服系统600控制两根立柱700上的滑块同步滑动，使两根立柱700带动第一导轨200两端同步移动；所述第二导轨300也可设置成丝杆结构，所述立柱700上设置与丝杆结构匹配的螺母结构，通过伺服系统600控制丝杆结构转动，从而带动螺母结构移动；也可以通过手动控制，使第一导轨200实现沿第二导轨300移动。
所述磨板组件500包括旋转主轴510、磨刷520，所述旋转主轴510设置在第三导轨400上，且可沿第三导轨400上下移动，所述磨刷520设置在旋转主轴510靠近工作台100的一端。通过伺服系统600控制旋转主轴510旋转，从而带动磨刷520旋转，实现对PCB打磨，通过旋转主轴510沿第三导轨400上下移动，实现打磨量的调节。旋转主轴510沿第三导轨400上下移动，可以通过手动调节与自动调节两种方式，手动调节为坐标控制式，自动调节为压力感应式，在所述磨刷520前端设有压力感应器，所述压力感应器与伺服系统600电性连接，旋转主轴510在伺服系统600发出的下降指令带动下向下运行，磨刷520前端接触到PCB板而产生压力，压力感应器感测所受压力，当所受压力超过预定值时，伺服系统600会自动停止旋转主轴510的下降。在磨板过程中可采用无水干磨和有水湿磨两种方式，湿磨所用水可为自来水、DI水，供水管为与磨刷520相连一起运行， 无生产时，自动停止供水。
所述旋转主轴510上设有粗调按钮、微调旋钮，所述粗调按钮、微调旋钮均与伺服系统600电性连接。通过调节粗调按钮实现对旋转主轴510上升或下降动作较大距离的调节，通过调节微调按钮实现对旋转主轴510上升或下降动作较小距离的调节，从而实现对PCB打磨量的灵活调节。
所述第三导轨400为丝杆，所述旋转主轴510套设在丝杆上。通过伺服系统600控制丝杆旋转，从而带动旋转主轴510沿丝杆上下移动，从而可调节磨板组件500与PCB板的距离，实现打磨量的调节；所述第三导轨400上设有同时与两根第一导轨200匹配的滑座，所述滑座安装在两根第一导轨200上。通过伺服系统600控制滑座在第一导轨200上滑动，从而带动第三导轨400沿第一导轨200移动；根据实际需求，也可以把第一导轨200设置成丝杆结构，所述滑座设置成与丝杆结构匹配的螺母结构，通过伺服系统600控制丝杆结构转动，从而带动螺母结构在丝杆结构上移动。
所述工作台100四周设有高于工作台面的台框800，且台框800与工作台100之间设有导流槽。通过设置台框800，防止磨板时水和碎屑的溢出，破坏环境，通过导流槽把水导出。
所述PCB板磨板机具体操作步骤如下：
1、生产准备：安装磨刷520于旋转主轴510上，开启磨板机电源，上PCB板，并将PCB板固定在工作台面上。
2、参数设置：调节磨刷520转速，设定第一导轨200、第三导轨400移动方式(手动或自动)和移动速度，粗调工作高度和磨刷520压力使磨刷520正好接触到PCB板上表面后，改用微调，根据打磨的厚度来调节微调旋钮的圈数。
3、磨板生产：开启磨刷520转动开关，沿第一导轨200方向或第二导轨300方向来回交替打磨，直到PCB板面均匀，关闭旋转主轴510开关，下PCB板。
通过使用本实施例所述的PCB磨板机，可以达到磨板铜厚均匀好，不露基材、无残留塞孔树脂的良好效果，降低了磨板报废率；并且此PCB磨板机的结构简单、操作方便，尤其适用于PCB样板生产厂家。
以上所述实施例仅表达了本发明的具体实施方式，其描述较为具体和详细， 但并不能因此而理解为对本发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。

Claims (10)

  1. 一种PCB板磨板机，其特征在于，包括工作台、第一导轨、两根第二导轨、第三导轨、磨板组件、伺服系统，两根第二导轨相互平行设置在工作台两侧，第一导轨横跨在两根第二导轨上，且可沿第二导轨移动，第三导轨竖直设置在第一导轨上，且可沿第一导轨移动，所述磨板组件设置在第三导轨上，且可沿第三导轨上下移动，所述伺服系统用于控制第一导轨、第三导轨、磨板组件。
  2. 根据权利要求1所述的PCB板磨板机，其特征在于，所述PCB磨板机包括两根第一导轨，两根第一导轨相互平行横跨于两根第二导轨上，且两根第一导轨设置在同一竖直平面的不同高度处，两根第一导轨可同时沿第二导轨移动，第三导轨同时竖直设置在两根第一导轨上，且可沿第一导轨移动。
  3. 根据权利要求1所述的PCB板磨板机，其特征在于，所述PCB磨板机还包括两根立柱，两根立柱分别竖直设置在两根第二导轨上，且可沿第二导轨移动，所述第一导轨两端分别与两根立柱连接。
  4. 根据权利要求1所述的PCB板磨板机，其特征在于，所述立柱上设有滑块，所述滑块滑动安装在第二导轨上。
  5. 根据权利要求1所述的PCB板磨板机，其特征在于，所述第三导轨上设有同时与两根第一导轨匹配的滑座，所述滑座安装在两根第一导轨上。
  6. 根据权利要求1所述的PCB板磨板机，其特征在于，所述磨板组件包括旋转主轴、磨刷，所述旋转主轴设置在第三导轨上，且可沿第三导轨上下移动，所述磨刷设置在旋转主轴靠近工作台的一端。
  7. 根据权利要求1所述的PCB板磨板机，其特征在于，所述第三导轨为丝杆，所述旋转主轴套设在丝杆上。
  8. 根据权利要求1所述的PCB板磨板机，其特征在于，所述磨刷前端设有压力感应器，所述压力感应器与伺服系统电性连接。
  9. 根据权利要求1所述的PCB板磨板机，其特征在于，所述旋转主轴上设有粗调按钮、微调旋钮，所述粗调按钮、微调旋钮均与伺服系统电性连接。
  10. 根据权利要求2～9任一项所述的PCB板磨板机，其特征在于，所述工作 台四周设有高于工作台面的台框，且台框与工作台之间设有导流槽。
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