WO2015096690A1 - 一种电容式触摸屏的fpc及其安装方法 - Google Patents

一种电容式触摸屏的fpc及其安装方法 Download PDF

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Publication number
WO2015096690A1
WO2015096690A1 PCT/CN2014/094619 CN2014094619W WO2015096690A1 WO 2015096690 A1 WO2015096690 A1 WO 2015096690A1 CN 2014094619 W CN2014094619 W CN 2014094619W WO 2015096690 A1 WO2015096690 A1 WO 2015096690A1
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WIPO (PCT)
Prior art keywords
line
driving
sensing
fpc
capacitive touch
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PCT/CN2014/094619
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English (en)
French (fr)
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柳微微
洪耀
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昆山维信诺显示技术有限公司
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Priority to US15/107,294 priority Critical patent/US10162455B2/en
Priority to EP14875332.0A priority patent/EP3089000B1/en
Priority to KR1020167018734A priority patent/KR101945040B1/ko
Priority to JP2016543200A priority patent/JP6731343B2/ja
Publication of WO2015096690A1 publication Critical patent/WO2015096690A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/052—Branched
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/055—Folded back on itself
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector

Definitions

  • the present invention relates to the field of flexible circuit board design, and in particular, to an FPC of a capacitive touch screen and a mounting method thereof.
  • the structure of the conventional capacitive touch screen is as shown in FIG. 1, and mainly includes a capacitive touch panel 1' and a flexible circuit board 2', and a cover 3' is covered above the flexible circuit board 2'.
  • the capacitive touch panel sensor includes an insulating transparent substrate, an inductive circuit layer, and a driving circuit layer.
  • the insulating transparent substrate is selected from one of a glass or a plastic film;
  • the sensing circuit layer is a light-transmitting conductive film or glass with an inductive line;
  • the driving circuit layer is a light-transmitting conductive film with a driving line or Glass, and the driving circuit layer and the sensing circuit layer are respectively stacked on both sides of the insulating transparent substrate.
  • the flexible circuit board referred to as a flexible board or FPC (Flexible Printed Circuit)
  • FPC Flexible Printed Circuit
  • the flexible circuit board is a highly reliable and excellent flexible printed circuit board made of polyimide or polyester film. It has the characteristics of free bending, strong bending performance, folding, winding, tear resistance, high wiring density, light weight and thin thickness.
  • the FPC structure of the existing capacitive touch screen is as shown in FIG. 2, and the flexible circuit board 2' has sensing respectively matched with the sensing circuit layer and the driving circuit layer of the capacitive touch panel 1'.
  • a line 5' and a driving line 6', the sensing line 5' and the driving line 6' are disposed perpendicular to each other, and the sensing line 5' and the driving line 6' have a sensing circuit layer and a
  • the drive circuit layer corresponds to a plurality of contacts 9' of the connection.
  • An IC driving chip 4' is disposed between the sensing line 5' and the driving line 6', and the IC driving chip 4' has a communication terminal 8', and the communication terminal 8' is connected to a communication device such as a mobile phone.
  • the sensing line 5' and the driving line 6' are respectively connected to the sensing circuit layer and the driving line of the capacitive touch panel 1', and are correspondingly connected.
  • the contacts are turned on.
  • the technical problem to be solved by the present invention is that the FPC of the capacitive touch screen occupies a large space in the prior art, which is disadvantageous for compact arrangement on the substrate, serious waste of the substrate, low utilization rate, and high cost, and provides a A FPC that saves space and can be compactly arranged on a substrate, greatly improves substrate utilization, and saves cost of a capacitive touch screen and a mounting method thereof.
  • An FPC of a capacitive touch screen includes an inductive line and a driving line respectively matched with a sensing circuit layer and a driving circuit layer of the capacitive touch panel, and the sensing circuit and the driving circuit respectively have the sensing line
  • the layer and the driving circuit layer are correspondingly connected to the plurality of contacts, and the IC driving chip is disposed between the sensing circuit and the driving circuit; the sensing circuit and the driving circuit are arranged parallel to each other or on the same straight line.
  • a bending zone is disposed on the sensing circuit or the driving circuit, and the sensing circuit or the driving circuit may be turned in a direction toward the driving circuit or the sensing circuit, so that the sensing circuit cooperates with the sensing circuit layer And the driving circuit cooperates with the driving circuit layer, and the bent portion after the turning is located in the bending region.
  • the sensing line and the driving line have the side edges of the contacts on the same straight line.
  • the bending region is disposed at the position of the driving circuit and close to the IC driving chip.
  • the contact portion does not have the contact.
  • the sensing lines and the driving lines are not provided with the sides of the contacts on different straight lines.
  • the sensing line is perpendicular to the driving line.
  • An installation method for assembling the above FPC to a capacitive touch screen comprising the following steps,
  • the flipped driving circuit or the sensing line is correspondingly laminated with the driving circuit layer or the sensing circuit of the capacitive touch panel, and thus the assembly of the FPC is completed.
  • the step of flattening the sensing line and the driving line is further included.
  • the sensing line and the driving line have the sides of the contacts on the same straight line; the sensing lines and the driving lines are not provided with the sides of the contacts on different straight lines.
  • the bending zone is disposed on the driving line and close to the position of the IC driving chip.
  • the FPC of the capacitive touch screen provided by the present invention has the sensing line and the driving line arranged parallel to each other or on the same straight line, and the sensing line or the driving line can be turned in the direction of the driving line or the sensing line to make the sensing line and the sensing line.
  • the layers cooperate and the drive lines cooperate with the drive line layers. Because the FPC circuit board has the characteristics of free bending, folding, winding, tear resistance, etc., when the product is fitted, the FPC can be arranged in any way according to the layout of the internal space of the product like a wire, which does not affect the normality of the line after the product is attached. At the same time, the FPC of this structure saves space, can be arranged compactly on the substrate during cutting, and greatly improves the utilization rate of the substrate, which can be increased by about 160%, which greatly saves production cost.
  • the FPC of the capacitive touch screen provided by the present invention has the sensing lines and the driving lines having the sides of the contacts on the same straight line, so that the product structure is regular, easy to cut, and can meet the product requirements of the capacitive touch screen. Make sure the contacts are in reliable contact.
  • the FPC of the capacitive touch panel provided by the present invention has a bending area disposed on the driving line and close to the position of the IC driving chip, and the FPC of the structure is easy to be bent and can meet the product requirements after bending, and the product is ensured. quality.
  • the FPC of the capacitive touch screen provided by the present invention does not have a contact on the bending area, and the contact area does not need to be in contact with the sensing circuit layer or the driving circuit layer of the capacitive touch panel.
  • the contact avoids material waste and saves cost.
  • the bending zone does not have a contact, which is also advantageous for the bending operation.
  • the method for installing the capacitive touch screen provided by the present invention only needs to flip the driving line or the sensing line in a direction perpendicular to the sensing line or the driving line, so that the form of the FPC can meet the product requirements of the capacitive touch screen, and the operation is simple. And it can reduce costs.
  • FIG. 1 is a schematic structural view of a conventional capacitive touch screen
  • FIG. 2 is a schematic structural diagram of an FPC in a conventional capacitive touch screen
  • FIG. 3 is a schematic view of a conventional capacitive touch panel FPC on a substrate
  • FIG. 4 is a schematic structural view of an FPC in a capacitive touch screen of the present invention.
  • FIG. 5 is a schematic structural view of the FPC in the capacitive touch screen of the present invention after being bent;
  • FIG. 6 is a schematic view of a row of plates of a capacitive touch screen FPC of the present invention on a substrate.
  • the reference numerals in the figure are: 1'-capacitive screen touch panel, 2, 2'-FPC (flexible circuit board), 3, 3'-cover, 4, 4'-IC driver chip, 5, 5' - Inductive line, 6, 6'-drive line, 7, - substrate, 8, - communication end, 9, 9'-contact, 10-bend area, 11-bend.
  • the flexible printed circuit is a flexible circuit board, or simply a soft board.
  • the FPC 2 includes an inductive line 5 and a driving line 6 respectively matched with a sensing circuit layer and a driving circuit layer of the capacitive touch panel, and the sensing circuit 5 and the driving circuit respectively have the sensing circuit layer,
  • the driving circuit layer is correspondingly connected with a plurality of contacts 9
  • the IC driving chip 4 is disposed between the sensing circuit 5 and the driving circuit 6
  • the IC driving chip 4 has a communication terminal 8
  • the communication terminal 8 is connected Communication equipment such as mobile phones.
  • the sensing line 5 and the driving line 6 are arranged parallel to each other or on the same straight line.
  • the sensing line 5 or the driving line 6 is provided with a bending area 10, which is the bending area in this embodiment. 10 is disposed on the driving circuit 6 at a position close to the IC driving chip 4, and the bending region 10 does not have the contact 9.
  • the sensing line 5 or the driving line 6 may be turned in the direction of the driving line 6 or the sensing line 5, so that the sensing line 5 cooperates with the sensing circuit layer and the driving line 6 and the driving The circuit layer cooperates, and the inverted bend 11 is located in the bending zone 10, as shown in FIG.
  • the sensing line 5 is perpendicular to the driving line 6, the sensing line 5 is disposed in the Y direction, and the driving line 6 is disposed in the X direction.
  • the sensing line 5 and the driving line 6 have the sides of the contacts 9 on the same straight line, while the sides of the contacts 9 are not provided on different straight lines.
  • the method for assembling the above FPC to the capacitive touch screen includes the following steps:
  • the driving circuit 5 or the driving circuit 6 is correspondingly laminated with the sensing circuit layer or the driving circuit of the capacitive touch panel of the capacitive touch screen.
  • the driving circuit 6 is first laminated with the sensing line of the capacitive touch panel.
  • the uncompressed drive line 6 or the induction line 5 is turned in a direction perpendicular to the induction line 5 or the drive line 6, and the inverted bend 11 is located in the bend area 10 Inside.
  • the sensing line 5 and the driving line 6 are sufficiently flat and will be uncompressed.
  • the sensing line 5 is turned in a direction perpendicular to the driving line 6, and the inverted portion 11 after being turned over is located in the bending portion 10.
  • the flipped driving circuit 6 or the sensing line 5 is correspondingly laminated with the driving circuit layer or the sensing circuit of the capacitive touch panel, and thus the FPC is completed. assembly.
  • the inverted sensing circuit 5 is correspondingly laminated with the driving circuit of the capacitive touch panel, and thus the assembly of the FPC is completed.
  • the step of flattening the sensing line 5 and the driving line 6 is performed, so that the sensing line 5 and the driving line 6 are located in the same plane as much as possible.
  • the position of the sensing line 5 and the driving line 6 is determined by a sample pattern of different product sensor panels, that is, after bending, the sensing line 5 can also be set in the X direction as needed, and the driving line 6 can also be set in the Y direction.
  • the bending zone 10 can also be disposed on the sensing line 5 and close to the IC driving chip 4 according to actual product requirements, as long as the product requirements can be met.

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  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Networks & Wireless Communication (AREA)
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Abstract

　一种电容式触摸屏的FPC及其安装方法，所述FPC包括具有分别与电容屏触控面板的感应线路层、驱动线路层匹配的感应线路和驱动线路，所述感应线路和所述驱动线路上具有分别与所述感应线路层、驱动线路层对应连接配合的若干触点，所述感应线路和所述驱动线路之间设置有IC驱动芯片；所述感应线路和所述驱动线路相互平行设置或位于同一条直线上，所述感应线路或所述驱动线路上设置有弯折区，所述感应线路或所述驱动线路可向所述驱动线路或所述感应线路方向翻转，使所述感应线路与所述感应线路层配合且所述驱动线路与所述驱动线路层配合。本发明电容式触摸屏的FPC能够在基材上紧凑排布，大幅提高基材利用率，节约成本。

Description

一种电容式触摸屏的FPC及其安装方法 技术领域
本发明涉及柔性电路板设计领域，尤其涉及一种电容式触摸屏的FPC及其安装方法。
背景技术
现有电容式触摸屏的结构如图1所示，主要包括电容屏触控面板1’和柔性电路板2’，在所述柔性电路板2’的上方覆盖有盖板3’。其中，所述电容屏触控面板(sensor)包括绝缘透明基板、感应线路层和驱动线路层。所述绝缘透明基板选自玻璃或塑料薄膜的其中一种；所述感应线路层为具感应线路的透光性导电薄膜或玻璃；所述驱动线路层为具驱动线路的透光性导电薄膜或玻璃，且所述驱动线路层和所述感应线路层分别叠置在该绝缘透明基板的两侧。所述柔性电路板，简称软板或FPC(Flexible Printed Circuit)，是以聚酰亚胺或聚酯薄膜为基材制成的一种具有高度可靠性，绝佳的可挠性印刷电路板，具备自由弯曲、弯折性能强、折叠、卷绕、抗撕裂、配线密度高、重量轻、厚度薄等特点。
现有的电容式触摸屏的FPC结构形式如图2所示，所述柔性电路板2’具有分别与所述电容屏触控面板1’的所述感应线路层、所述驱动线路层匹配的感应线路5’和驱动线路6’，所述感应线路5’和所述驱动线路6’相互垂直设置，所述感应线路5’和所述驱动线路6’上具有分别与所述感应线路层、所述驱动线路层对应连接配合的若干触点9’。在所述感应线路5’和所述驱动线路6’之间设置有IC驱动芯片4’，所述IC驱动芯片4’上具有通讯端8’，所述通讯端8’连接手机等通讯设备。所述感应线路5’、所述驱动线路6’分别与所述电容屏触控面板1’的感应线路层、驱动线路层压合连接，并使对应 触点接通。上述这种FPC在基材7’上进行裁切时，如图3所示，由于其感应线路5’和驱动线路6’相互垂直，占用空间大，不利于紧凑排布，基材浪费严重走，成本高。
发明内容
为此，本发明所要解决的技术问题在于现有技术中电容式触摸屏的FPC占用空间大，不利于在基材上紧凑排布，基材浪费情况严重、利用率低、成本高，而提供一种节约空间，能够在基材上紧凑排布，大幅提高基材利用率，节约成本的电容式触摸屏的FPC及其安装方法。
为解决上述技术问题，本发明采用的技术方案如下：
一种电容式触摸屏的FPC，包括具有分别与电容屏触控面板的感应线路层、驱动线路层匹配的感应线路和驱动线路，所述感应线路和所述驱动线路上具有分别与所述感应线路层、驱动线路层对应连接配合的若干触点，所述感应线路和所述驱动线路之间设置有IC驱动芯片；所述感应线路和所述驱动线路相互平行设置或位于同一条直线上，所述感应线路或所述驱动线路上设置有弯折区，所述感应线路或所述驱动线路可向所述驱动线路或所述感应线路方向翻转，使所述感应线路与所述感应线路层配合且所述驱动线路与所述驱动线路层配合，翻转后的弯折处位于所述弯折区内。
上述电容式触摸屏的FPC中，所述感应线路和所述驱动线路具有所述触点的侧边在同一条直线上。
上述电容式触摸屏的FPC中，所述弯折区设置于所述驱动线路且靠近所述IC驱动芯片的位置。
上述电容式触摸屏的FPC中，所述弯折区上不具有所述触点。
上述电容式触摸屏的FPC中，所述感应线路和所述驱动线路未设有所述触点的侧边在不同直线上。
上述电容式触摸屏的FPC中，所述感应线路或所述驱动线路翻转后，所述感应线路与所述驱动线路垂直。
一种将上述FPC装配到电容式触摸屏的安装方法，包括如下步骤，
①将所述FPC的感应线路或驱动线路对应地与所述电容式触摸屏的电容屏触控面板的感应线路层或驱动线路层压合在一起；
②将未压合的所述驱动线路或所述感应线路向垂直于所述感应线路或所述驱动线路方向翻转，并使翻转后的弯折处位于弯折区内；
③将翻转后的所述驱动线路或所述感应线路对应地与所述电容屏触控面板的所述驱动线路层或所述感应线路层压合在一起，至此完成了所述FPC的装配。
上述安装方法中，在所述步骤①之前，还包括将所述感应线路和所述驱动线路展平的步骤。
上述安装方法中，所述感应线路和所述驱动线路具有触点的侧边在同一条直线上；所述感应线路和所述驱动线路未设有所述触点的侧边在不同直线上。
上述安装方法中，所述弯折区设置于所述驱动线路上且靠近IC驱动芯片的位置。
本发明的上述技术方案相比现有技术具有以下优点：
(1)本发明提供的电容式触摸屏的FPC，其感应线路和驱动线路相互平行设置或位于同一条直线上，感应线路或驱动线路可向驱动线路或感应线路方向翻转，使感应线路与感应线路层配合且驱动线路与驱动线路层配合。由于FPC线路板具备自由弯曲、折叠、卷绕，抗撕裂等特点，产品贴合时，FPC可像导线一样按照产品内部空间的布局进行任意排布，既不影响产品贴合后线路的正常使用，同时这种结构的FPC节约空间，裁切时能够在基材上紧凑排布，大幅提高基材利用率，大约能提高160％左右，大大节省了生产成本。
(2)本发明提供的电容式触摸屏的FPC，其感应线路和驱动线路具有触点的侧边在同一条直线上，使得产品结构规整，易于裁切，而且能够满足电容式触摸屏的产品需求，确保触点可靠接触。
(3)本发明提供的电容式触摸屏的FPC，其弯折区设置于驱动线路上且靠近IC驱动芯片的位置，该结构的FPC易于弯折操作，而且弯折后能够满足产品需求，确保产品质量。
(4)本发明提供的电容式触摸屏的FPC，其弯折区上不具有触点，一方面由于弯折区无需和电容屏触控面板的感应线路层或驱动线路层进行接触配合，不设置触点，避免材料浪费，节约成本，另一方面弯折区不设置触点也有利于弯折操作。
(5)本发明提供的电容式触摸屏的安装方法，只需将驱动线路或感应线路向垂直于感应线路或驱动线路方向翻转，即可使FPC的形态满足电容式触摸屏的产品需求，操作简便，而且能降低成本。
附图说明
为了使本发明的内容更容易被清楚的理解，下面根据本发明的具体实施例并结合附图，对本发明作进一步详细的说明，其中
图1是现有电容式触摸屏的结构示意图；
图2是现有电容式触摸屏中FPC的结构示意图；
图3是现有电容式触摸屏FPC在基材上的排板示意图；
图4是本发明电容式触摸屏中FPC的结构示意图；
图5是本发明电容式触摸屏中FPC弯折后的结构示意图；
图6是本发明电容式触摸屏FPC在基材上的排板示意图。
图中附图标记表示为：1’-电容屏触控面板，2、2’-FPC(柔性电路板)，3、3’-盖板，4、4’-IC驱动芯片，5、5’-感应线路，6、6’-驱动线路，7、-基材，8、-通讯端，9、9’-触点，10-弯折区，11-弯折处。
具体实施方式
如图4所示，是本发明电容式触摸屏的FPC的优选实施例，FPC(Flexible Printed Circuit)即柔性电路板，或简称为软板。
所述FPC2包括具有分别与电容屏触控面板的感应线路层、驱动线路层匹配的感应线路5和驱动线路6，所述感应线路5、所述驱动线路上具有分别与所述感应线路层、驱动线路层对应连接配合的若干触点9，所述感应线路5和所述驱动线路6之间设置有IC驱动芯片4，所述IC驱动芯片4上具有通讯端8，所述通讯端8连接手机等通讯设备。
所述感应线路5和所述驱动线路6相互平行设置或在同一条直线上，所述感应线路5或所述驱动线路6上设置有弯折区10，在本实施例中所述弯折区10设置于所述驱动线路6上且靠近所述IC驱动芯片4的位置，所述弯折区10上不具有所述触点9。所述感应线路5或所述驱动线路6可向所述驱动线路6或所述感应线路5方向翻转，使所述感应线路5与所述感应线路层配合且所述驱动线路6与所述驱动线路层配合，翻转后的弯折处11位于所述弯折区10内，如图5所示。在本实施例中，进行弯折后所述感应线路5与所述驱动线路6垂直，所述感应线路5设置于Y方向上，所述驱动线路6设置于X方向上。
在本实施例中，所述感应线路5和所述驱动线路6具有所述触点9的侧边在同一条直线上，而未设有所述触点9的侧边在不同直线上。本发明的所述电容式触摸屏的FPC在进行裁切时，如图6所示，占用空间少，能够在基材7上紧凑排布，大大提高了基材裁切FPC的利用率，降低生产成本。
将上述FPC装配到电容式触摸屏的安装方法，包括如下步骤，
①将所述感应线路5或所述驱动线路6对应地与所述电容式触摸屏的所述电容屏触控面板的所述感应线路层或所述驱动线路层压合在一起。
在本实施例中，先将所述驱动线路6与所述电容屏触控面板的所述感应线路层压合在一起。
②将未压合的所述驱动线路6或所述感应线路5向垂直于所述感应线路5或所述驱动线路6方向翻转，并使翻转后的所述弯折处11位于弯折区10内。
在本实施例中，所述感应线路5和所述驱动线路6足够平展，将未压合 的所述感应线路5向垂直于所述驱动线路6方向翻转，并使翻转后的所述弯折处11位于弯折区10内。
③将翻转后的所述驱动线路6或所述感应线路5对应地与所述电容屏触控面板的所述驱动线路层或所述感应线路层压合在一起，至此完成了所述FPC的装配。
在本实施例中，将翻转后的所述感应线路5对应地与所述电容屏触控面板的所述驱动线路层压合在一起，至此完成了所述FPC的装配。
在其他实施例中，在所述步骤①之前，还包括将所述感应线路5和所述驱动线路6展平的步骤，尽量使所述感应线路5和所述驱动线路6位于同一平面内。
在其他实施例中，感应线路5和驱动线路6的设置位置，由不同产品sensor面板设计的样品图决定，即在进行弯折后，感应线路5也可以根据需要设置于X方向上，驱动线路6也可以设置于Y方向上。
在其他实施例中，根据实际产品需要，弯折区10也可设置于感应线路5上且靠近IC驱动芯片4的位置，只要能够满足产品要求即可。
显然，上述实施例仅仅是为清楚地说明所作的举例，而并非对实施方式的限定。对于所属领域的普通技术人员来说，在上述说明的基础上还可以做出其它不同形式的变化或变动。这里无需也无法对所有的实施方式予以穷举。而由此所引伸出的显而易见的变化或变动仍处于本发明创造的保护范围之中。

Claims (10)

  1. 一种电容式触摸屏的FPC，包括具有分别与电容屏触控面板的感应线路层、驱动线路层匹配的感应线路(5)和驱动线路(6)，所述感应线路(5)和所述驱动线路(6)上具有分别与所述感应线路层、驱动线路层对应连接配合的若干触点(9)，所述感应线路(5)和所述驱动线路(6)之间设置有IC驱动芯片(4)；其特征在于：所述感应线路(5)和所述驱动线路(6)相互平行设置或位于同一条直线上，所述感应线路(5)或所述驱动线路(6)上设置有弯折区(10)，所述感应线路(5)或所述驱动线路(6)可向所述驱动线路(6)或所述感应线路(5)方向翻转，使所述感应线路(5)与所述感应线路层配合且所述驱动线路(6)与所述驱动线路层配合，翻转后的弯折处(11)位于所述弯折区(10)内。
  2. 根据权利要求1所述的电容式触摸屏的FPC，其特征在于：所述感应线路(5)和所述驱动线路(6)具有所述触点(9)的侧边在同一条直线上。
  3. 根据权利要求2所述的电容式触摸屏的FPC，其特征在于：所述弯折区(10)设置于所述驱动线路(6)上且靠近所述IC驱动芯片(4)的位置。
  4. 根据权利要求3所述的电容式触摸屏的FPC，其特征在于：所述弯折区(10)上不具有所述触点(9)。
  5. 根据权利要求4所述的电容式触摸屏的FPC，其特征在于：所述感应线路(5)和所述驱动线路(6)未设有所述触点(9)的侧边在不同直线上。
  6. 根据权利要求1-5任一所述的电容式触摸屏的FPC，其特征在于：所述感应线路(5)或所述驱动线路(6)翻转后，所述感应线路(5)与所述驱动线路(6)垂直。
  7. 一种将上述权利要求1-6任一所述FPC装配到电容式触摸屏的安装方 法，其特征在于：包括如下步骤，
    ①将所述FPC的感应线路(5)或驱动线路(6)对应地与所述电容式触摸屏的电容屏触控面板的感应线路层或驱动线路层压合在一起；
    ②将未压合的所述驱动线路(6)或所述感应线路(5)向垂直于所述感应线路(5)或所述驱动线路(6)方向翻转，并使翻转后的弯折处(11)位于弯折区(10)内；
    ③将翻转后的所述驱动线路(6)或所述感应线路(5)对应地与所述电容屏触控面板的所述驱动线路层或所述感应线路层压合在一起，至此完成了所述FPC的装配。
  8. 根据权利要求7所述的安装方法，其特征在于：在所述步骤①之前，还包括将所述感应线路(5)和所述驱动线路(6)展平的步骤。
  9. 根据权利要求8所述的安装方法，其特征在于：所述感应线路(5)和所述驱动线路(6)具有触点(9)的侧边在同一条直线上；所述感应线路(5)和所述驱动线路(6)未设有所述触点(9)的侧边在不同直线上。
  10. 根据权利要求9所述的安装方法，其特征在于：所述弯折区(10)设置于所述驱动线路(6)上且靠近IC驱动芯片(4)的位置。
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