WO2015083409A1 - Matériau pâteux pour un remplissage de trou d'interconnexion et substrat multicouche - Google Patents

Matériau pâteux pour un remplissage de trou d'interconnexion et substrat multicouche Download PDF

Info

Publication number
WO2015083409A1
WO2015083409A1 PCT/JP2014/074097 JP2014074097W WO2015083409A1 WO 2015083409 A1 WO2015083409 A1 WO 2015083409A1 JP 2014074097 W JP2014074097 W JP 2014074097W WO 2015083409 A1 WO2015083409 A1 WO 2015083409A1
Authority
WO
WIPO (PCT)
Prior art keywords
via hole
resin
paste material
metal component
alloy
Prior art date
Application number
PCT/JP2014/074097
Other languages
English (en)
Japanese (ja)
Inventor
三島孝太郎
東克明
中野公介
釣賀大介
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Publication of WO2015083409A1 publication Critical patent/WO2015083409A1/fr

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113—Via provided in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/4617—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar single-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H05K2201/09527—Inverse blind vias, i.e. bottoms outwards in multilayer PCB; Blind vias in centre of PCB having opposed bottoms

Definitions

  • the present invention relates to, for example, a via hole filling paste material used for forming a via hole conductor disposed in a via hole provided in a ceramic multilayer substrate or the like, and a multilayer substrate including a via hole conductor formed using the paste material.
  • via holes are formed for interlayer connections between internal conductors arranged in multiple internal layers, and for interlayer connections between surface conductors and internal conductors formed on the substrate surface.
  • a conductor via hole conductor
  • One of the conductive pastes used to form such via-hole conductors is a conductive paste as described in Patent Document 1.
  • the conductive paste described in Patent Document 1 includes (A) 20 parts by weight or more of an epoxy resin having an epoxy equivalent in the range of 200 to 600 and a hydrolyzable chlorine concentration of less than 200 ppm. (B) at least one low melting point metal with a melting point of 180 ° C. or lower and a melting point of 800 ° C. or higher with respect to 100 parts by weight of the resin component whose total hydrolyzable chlorine concentration is less than 1000 ppm. 200 to 1800 parts by weight of metal powder composed of two or more metals including at least one refractory metal, (C) 3 to 20 parts by weight of a curing agent, and (D) 3 to 15 parts by weight of a flux. Is.
  • Patent Document 1 discloses a multilayer substrate provided with a via-hole conductor formed using this conductive paste.
  • the above-mentioned conductive paste has the characteristics that it has a viscosity suitable for filling via holes and has a long pot life, and the via hole of the multilayer substrate using this conductive paste.
  • a conductor it is said that a multilayer substrate having high moisture resistance, heat cycle performance, and thermal shock resistance can be obtained.
  • the amount of resin contained in the conductive paste increases (the calculated value is about 30 to 70 vol%).
  • the inside of the via-hole conductor is destroyed due to the expansion of the metal, the denseness is impaired, and the conductivity is lowered.
  • the metal filler becomes difficult to flow, a dense intermetallic compound cannot be formed, and the conductivity of the via-hole conductor is lowered.
  • the present invention solves the above problems, and when used for forming a via-hole conductor, it is possible to suppress the expansion of the resin in the step of curing the resin by heating, and it is dense and has good electrical conductivity. It is an object of the present invention to provide a via hole filling paste material capable of forming a via hole conductor having excellent adhesion to the via hole and a multilayer substrate having the via hole conductor formed using the same. .
  • a via hole filling paste material containing a metal filler, a resin, and a solvent A via hole filling paste material containing a metal filler, a resin, and a solvent,
  • the metal filler includes Sn or Sn alloy as the first metal component, and includes Cu or Cu alloy having a melting point higher than that of the first metal component as the second metal component, and the first metal component and the second metal component.
  • the metal component forms an intermetallic compound by being heated to a predetermined temperature
  • the resin occupies 1 to 12 vol% of the solid content in the via hole filling paste material, has a thermal decomposition start temperature of 280 ° C. or higher, and does not cause a crosslinking reaction by heating. .
  • the resin is at least one selected from the group consisting of bisphenol A type epoxy resin, phenoxy resin, novolac type phenol resin, polyamideimide resin, polyimide resin or modified resin thereof. It is preferable that it is included.
  • via-hole filling paste material having the above-described configuration, it is possible to more reliably form a highly reliable via-hole conductor that is dense and has good conductivity and excellent adhesion to the via-hole. It becomes possible.
  • the Sn alloy is made of Cu, Ni, Ag, Au, Sb, Zn, Pb, Bi, In, Ge, Al, Co, Mn, Fe, Cr, Mg, Pd, Si, Sr, Te, and P.
  • An alloy containing at least one selected from the group and Sn is preferable.
  • the via hole filling paste material having the above-described structure By using the via hole filling paste material having the above-described structure, an intermetallic compound is generated more reliably between the first metal component and the second metal component, and more reliably, dense and has good conductivity. In addition, it is possible to form a highly reliable via hole conductor having excellent adhesion to the via hole.
  • the Sn alloy contains 40% by mass or more of Sn.
  • an intermetallic compound is more reliably generated between the first metal component and the second metal component, and has a dense and good conductivity, and It becomes possible to form a highly reliable via hole conductor having excellent adhesion to the via hole.
  • the Cu alloy is preferably at least one selected from the group consisting of a CuAl alloy, a CuCr alloy, a CuNi alloy, and a CuMn alloy.
  • the via hole filling paste material having the above-described configuration, an intermetallic compound is more reliably generated between the first metal component and the second metal component, and the via hole is dense and has good electrical conductivity. It is possible to form a highly reliable via-hole conductor having excellent adhesion to the substrate.
  • the Cu alloy preferably contains Cu in the range of 70 to 95% by mass.
  • an intermetallic compound having a high melting point is more reliably generated between the first metal component and the second metal component, has a dense and good electrical conductivity, and has good adhesion to the via hole.
  • An excellent and highly reliable via-hole conductor can be formed.
  • the ratio of the second metal component in the total amount of the first metal component and the second metal component is 30 vol% or more.
  • the ratio of the second metal component By setting the ratio of the second metal component to 30 vol% or more, it becomes possible to generate an intermetallic compound having a high melting point, and the present invention can be clarified more effectively.
  • the multilayer substrate according to the present invention is characterized in that it includes a via hole conductor formed using the via hole filling paste material of the present invention.
  • the via-hole filling paste material of the present invention is a via-hole filling paste material containing a metal filler, a resin, and a solvent, wherein the metal filler is heated to a predetermined temperature to form an intermetallic compound.
  • the ratio of the metal component (Sn or Sn alloy which is a low melting point metal) and the second metal component (Cu or Cu alloy which is a high melting point metal) to the solid content in the paste material for filling via holes as a resin Is 1 to 12 vol%, the thermal decomposition starting temperature is 280 ° C. or higher, and a material that does not cause a crosslinking reaction by heating is used. Therefore, the via hole filling paste material of the present invention is used for forming a via hole conductor. Therefore, a highly reliable via-hole conductor that is dense and has good electrical conductivity (conductivity) and has excellent adhesion to the via-hole It is possible to formed.
  • the multilayer substrate according to the present invention includes a via-hole conductor formed using the via-hole filling paste material according to the present invention, and the via-hole conductor is dense and has good electrical conductivity, and Therefore, according to the present invention, it is possible to provide a highly reliable multi-layer substrate including a via hole conductor with good characteristics.
  • FIG. 2 It is front sectional drawing which shows the structure of the resin sheet (insulating layer) provided with the conductor wiring layer and the via hole used for preparation of the multilayer board
  • the via hole filling paste material of the present invention is a paste material containing at least a metal filler, a resin, and a solvent.
  • the metal filler constituting the via hole filling paste material of the present invention includes a first metal component (Sn or Sn alloy which is a low melting point metal) that forms an intermetallic compound when heated to a predetermined temperature, and a second metal.
  • a component (Cu or Cu alloy which is a high melting point metal having a higher melting point than the first metal component) is included.
  • the first metal component low melting point metal
  • examples of the Sn alloy include Cu, Ni, Ag, Au, Sb, Zn, Pb, Bi, In, Ge, Al, Co, Mn, Fe, and Cr. It is preferable to use an alloy containing Sn and at least one selected from the group consisting of Mg, Pd, Si, Sr, Te, and P.
  • the Sn alloy as the first metal component contains Sn in an amount of 40% by mass or more.
  • the second metal component (high melting point metal) is a Cu alloy
  • the proportion of Al, Cr, Ni, Mn in the Cu alloy as the second metal component is in the range of 5 to 30% by mass, that is, the proportion of Cu in the Cu alloy is 70 to 95% by mass. It is desirable to be in range.
  • the ratio of the 2nd metal component to the total amount of a 1st metal component and a 2nd metal component is 30 vol% or more.
  • the resin is used in a range of 1 to 12 vol% in the solid content in the via hole filling paste material.
  • solid content means a combination of a metal filler and a resin.
  • the resin those having a thermal decomposition starting temperature of 280 ° C. or higher and not causing a crosslinking reaction by heating are used.
  • “(resin) does not cause a crosslinking reaction due to heating” means that the resin undergoes a crosslinking reaction until thermal decomposition occurs, and the viscosity or solidification is hindered to prevent the metal filler from flowing. It means not occurring.
  • the resin it is desirable to use a resin containing at least one selected from the group consisting of bisphenol A type epoxy resin, phenoxy resin, novolac type phenol resin, polyamideimide resin, polyimide resin or modified resin thereof.
  • the type of solvent used in the via hole filling paste material of the present invention is not particularly limited, but is selected from the group consisting of alcohols, ketones, esters, ethers, aromatics, and hydrocarbons. It is preferable that it contains at least one kind.
  • the amount of resin in the conductive paste (via hole filling paste material) used to form the via hole conductors on the multilayer substrate becomes too large, the resin will expand when the via hole filling paste material is filled in the via holes. This is not preferable because the inside of the via-hole conductor is destroyed, the denseness is impaired and the conductivity is lowered.
  • the resin content in the solid content is regulated within the range of 1 to 12 vol%, thereby suppressing the expansion of the resin and destroying the inside of the via hole conductor to deteriorate the denseness. Therefore, the continuity is prevented from being lowered. As a result, it is possible to form a highly reliable via-hole conductor that is dense and has good electrical conductivity, has excellent adhesion to the via hole, and does not cause dropout from the via hole.
  • the ratio of the resin in the solid content is desirably in the range of 1 to 12 vol%.
  • a resin that does not cause a crosslinking reaction by heating is used, so that a via hole conductor having excellent electrical conductivity can be reliably formed.
  • the resin is not cured, so that an intermetallic compounding reaction between metal fillers easily proceeds during heating, and a dense intermetallic compound can be formed.
  • the resin used for the via hole filling paste material has low heat decomposability, thermal decomposition occurs during reflow, gas is generated, the inside of the via hole conductor is destroyed, the denseness is impaired, and the conductivity is lowered. Therefore, in the present invention, a resin having a high thermal decomposition resistance having a thermal decomposition start temperature of 280 ° C. or higher is used.
  • Example 1 the thermal decomposition start temperature of the resin was evaluated by TG (thermogravimetry). Specifically, 10 mg of resin was heated at a rate of temperature increase of 5 ° C./min under the condition of an air flow rate of 200 ml / min, and the temperature at the time when the weight decreased by 0.1 mass% was defined as the thermal decomposition start temperature.
  • a via hole filling paste material was prepared by mixing the first metal component and the second metal component constituting the metal filler, the resin, and the solvent.
  • Sn Sn powder
  • Cu Cu powder
  • the compounding ratio of the first metal component (Sn powder) and the second metal component (Cu powder) is a volume ratio, and the ratio of the first metal component and the second metal component is (first metal component / second metal component). It adjusted so that it might become 70/30.
  • the first metal component (Sn powder) and the second metal component (Cu powder) those having an average particle diameter of 5 ⁇ m were used.
  • the bisphenol A type epoxy resin (thermal decomposition start temperature 320 degreeC) solid at normal temperature was used. As shown in Table 1, the ratio of the resin in the solid content was 1 vol%, 4 vol%, 8 vol%, and 12 vol%. The resin was used in a state of being previously dissolved in a solvent. Diethylene glycol monobutyl ether acetate was used as the solvent.
  • a resin which is made of a thermoplastic resin and has a conductor wiring layer 1 made of Cu foil having a predetermined pattern on one side main surface 3a as shown in FIG. 1, and a via hole 2 is formed at a predetermined position.
  • a sheet (insulating layer) 3 was prepared.
  • Resin sheet 3 having a thickness of 50 ⁇ m was used.
  • the diameter of the via hole 2 was 100 ⁇ m.
  • the number of via holes 2 provided on the resin sheet 3 was 10,000.
  • the via hole 2 of the resin sheet 3 was filled with the via hole filling paste material 4 and heat-treated at 150 ° C. for 30 minutes to remove the solvent.
  • a pair of resin sheets (insulating layers) 3 and 3 are joined to the other side in order to join the fillers 4a obtained by drying the via hole filling paste material 4 filled in the via holes 2.
  • the main surfaces 3b and 3b were laminated so that they face each other, and pressure was applied while heating to a predetermined temperature, and the pair of resin sheets (insulating layers) 3 and 3 were thermocompression bonded.
  • the heating was performed so that the maximum temperature was 280 ° C. and maintained at the maximum temperature for a certain time (about 30 minutes). At this time, a pressure of about 4 MPa was applied from both main surface sides of the laminate 5 in which the resin sheets 3 were laminated.
  • the heat treatment is preferably performed under temperature conditions that reach 232 ° C. or higher for at least a certain time. When the temperature does not reach 232 ° C., Sn (melting point: 232 ° C.) in the first metal component does not enter a molten state, and an intermetallic compound cannot be generated.
  • the first metal component and the second metal component in the filler 4a are intermetallic compound, and the conductor wiring layers 1 and 1 are connected to each other in the via hole 2 by interlayer connection.
  • a multilayer substrate (samples 1 to 4 in Table 1) 10 in which the resin sheets 3 and 3 were joined together was obtained.
  • the multilayer substrate 10 was examined for initial conductivity, and the resistance value between the conductor wiring layers 1 and 1 connected via the via-hole conductor 14 after the reflow process was measured.
  • the reflow treatment was pretreated at MSL level 1 (85 ° C./85% RH, 168 h), and was performed 5 times under the condition that the peak temperature was 260 ° C.
  • As the resistance value a resistance value (average value of 10,000 resistance values) between the conductor wiring layers connected by the via hole conductors was adopted.
  • the measured conductivity was evaluated according to the following evaluation criteria. When the resistance value after reflow was less than 21.0 m ⁇ , the conductivity was determined to be particularly good ( ⁇ ). When the resistance value after reflow was 21.0 m ⁇ or more and less than 31.0 m ⁇ , the conductivity was determined to be good ( ⁇ ). Those having a resistance value after reflow of 31.0 m ⁇ or more were judged to have poor conductivity (x). The results are shown in Table 1.
  • sample numbers were obtained using paste materials for via-hole filling prepared in the same manner as the samples Nos. 1 to 4 except that the amount of resin in the solid content was 0.5 vol% and 15 vol%. Samples (multilayer substrates) as comparative examples 101 and 102 were produced.
  • a normal temperature solid bisphenol A type epoxy resin (thermal decomposition start temperature: 320 ° C.) is used as the resin, and a curing agent (here, 2-ethyl-4-methylimidazole which is an imidazole-based curing agent) is used for the resin.
  • a curing agent here, 2-ethyl-4-methylimidazole which is an imidazole-based curing agent
  • the paste material for via hole filling prepared in the same manner as the samples Nos. 1 to 4 except that the ratio of the solid content of the resin and the curing agent was 4 vol%.
  • a sample (multilayer substrate) as a comparative example of sample number 103 was produced.
  • the amount of the resin in the solid content is 1, 4, 8, 12 vol%, and the requirement of the present invention is that the room temperature solid bisphenol A type epoxy resin having a thermal decomposition start temperature of 320 ° C. is used as the resin.
  • the samples Nos. 1 to 4 provided samples according to the examples of the present invention, it was confirmed that a via-hole conductor excellent in conductivity was formed.
  • the substrate (resin sheet) is multilayered.
  • the filling formed by drying the paste was dropped. This is because the amount of resin in the solid content is as small as 0.5 vol%, and the adhesion strength between the via hole filling paste material and the inner peripheral surface of the via hole is insufficient.
  • the amount of resin in the solid content is 4 vol%, and a room temperature solid bisphenol A type epoxy resin having a thermal decomposition start temperature of 320 ° C. is used as the resin.
  • a room temperature solid bisphenol A type epoxy resin having a thermal decomposition start temperature of 320 ° C.
  • the metal filler (the first metal component and the second metal component is cured after the resin is cured). It is difficult for the metal component) to flow and a dense intermetallic compound cannot be formed. As a result, it is considered that the continuity of the via-hole conductor is insufficient.
  • Example 2 as a resin constituting the via hole filling paste material, (A) normal temperature solid bisphenol A type epoxy resin (thermal decomposition start temperature 280 ° C.) (sample number 5), (B) Phenoxy resin (thermal decomposition start temperature 300 ° C.) (sample number 6), (C) novolac type phenolic resin (pyrolysis start temperature 360 ° C.) (sample number 7), (D) Thermoplastic polyamideimide resin (pyrolysis start temperature 360 ° C.) (sample number 8), (E) Thermoplastic polyimide resin (pyrolysis start temperature 370 ° C.) (Sample No. 9) was used. In Example 2, the amount of resin in the solid content was 4 vol%.
  • diethylene glycol monobutyl ether acetate is used in the case of bisphenol A type epoxy resin (sample number 5), and diethylene glycol monobutyl ether acetate is used in the case of phenoxy resin (sample number 6) and novolac type phenol resin (sample number 7).
  • phenoxy resin examplesample number 6
  • novolac type phenol resin examplesample number 7
  • thermoplastic polyamideimide resin (sample number 8) and thermoplastic polyimide resin (sample number 9)
  • N-methylpyrrolidone was used.
  • the amount of resin in the solid content is 4 vol%
  • Samples Nos. 104 to 106 were prepared using the via-hole filling paste material produced in the same manner as the samples Nos. 5 to 9 described above except that was used. For these samples Nos. 104 to 106 (comparative examples), the continuity evaluation of the via-hole conductors was performed in the same manner as the samples Nos. 5 to 9. The results are also shown in Table 2.
  • the inside of the via-hole conductor is not destroyed by the expansion of the resin, the resin is thermally decomposed, and the denseness of the via-hole conductor is not impaired. Because it is not cured, the formation reaction of the intermetallic compound between the first metal component and the second metal component is likely to proceed during heating, and a dense intermetallic compound is formed.
  • Example 3 Sn is used as the first metal component constituting the via hole filling paste material, and Cu-15Al, Cu-15Cr, Cu-15Ni, Cu-15Mn is used as the second metal component, and the first metal is used.
  • the compounding ratio of the component and the second metal component that is, the first metal component / second metal component (volume ratio) was adjusted to 70/30.
  • the numeral 15 of the “Cu-15Al” indicates a mass% value of the component (in this case, Al). At this time, the ratio of Cu is 85% by mass. The same applies to other materials described in the same manner.
  • the first metal component and the second metal component those having an average particle diameter of 5 ⁇ m were used.
  • resin room temperature solid bisphenol A type epoxy resin (thermal decomposition start temperature 320 ° C.) was used, and the ratio in the solid content was 4 vol% (Table 3). In addition, resin was used in the state previously dissolved in the solvent. Diethylene glycol monobutyl ether acetate was used as the solvent.
  • the amount of the resin in the solid content is 4 vol%
  • a normal temperature solid bisphenol A type epoxy resin having a thermal decomposition start temperature of 320 ° C. is used as the resin
  • Cu-15Al, Cu— are used as the second metal component. It was confirmed that via hole conductors with excellent electrical conductivity were also formed in samples Nos. 10 to 13 using a via hole filling paste material using any one of 15Cr, Cu-15Ni, and Cu-15Mn. .
  • Example 4 any of Sn-3.5Ag, Sn-0.75Cu, and Sn-58Bi was used as the first metal component, and Cu was used as the second metal component.
  • Samples with sample numbers 14 to 16 shown in Table 4 were produced in the same manner as in Example 1 above using the via hole filling paste material produced in the same manner.
  • the amount of the resin in the solid content is 4 vol%
  • a room temperature solid bisphenol A type epoxy resin having a thermal decomposition start temperature of 320 ° C. is used as the resin
  • Sn-3.5Ag as the first metal component
  • the present invention is not limited to the above-described embodiments and examples.
  • the number of insulating layers constituting the multilayer substrate, the arrangement of internal conductors and surface conductor layers connected by via-hole conductors, and via-hole filling Various applications and modifications can be made within the scope of the invention with respect to the types of resin and metal filler constituting the paste material.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Conductive Materials (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

L'invention porte sur un matériau pâteux pour un remplissage de trou d'interconnexion, ledit matériau pouvant former de façon fiable un conducteur de trou d'interconnexion qui est dense et présente une bonne conductivité électrique et une excellente adhérence à un trou d'interconnexion ; et sur un substrat multicouche qui comprend un conducteur de trou d'interconnexion qui est formé à l'aide de ce matériau pâteux pour un remplissage de trou d'interconnexion. Un matériau pâteux pour un remplissage de trou d'interconnexion contient une charge métallique, une résine et un solvant. Ce matériau pâteux pour un remplissage de trou d'interconnexion est configuré pour satisfaire les exigences suivantes : la charge métallique contient de l'étain (Sn) ou un alliage d'étain (un premier composant métallique) et du cuivre (Cu) ou un alliage de cuivre (un second composant métallique) qui présente un point de fusion plus élevé que celui du premier composant métallique ; le premier composant métallique et le second composant métallique forment un composé intermétallique en étant chauffés à une température prédéterminée ; la résine représente entre 1 et 12 % en volume de la teneur en matière solide totale du matériau pâteux pour un remplissage de trou d'interconnexion ; et la résine comprend une température de début de décomposition thermique égale ou supérieure à 280 °C et ne provoque pas de réaction de réticulation par chauffage.
PCT/JP2014/074097 2013-12-05 2014-09-11 Matériau pâteux pour un remplissage de trou d'interconnexion et substrat multicouche WO2015083409A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013-251875 2013-12-05
JP2013251875 2013-12-05

Publications (1)

Publication Number Publication Date
WO2015083409A1 true WO2015083409A1 (fr) 2015-06-11

Family

ID=53273187

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2014/074097 WO2015083409A1 (fr) 2013-12-05 2014-09-11 Matériau pâteux pour un remplissage de trou d'interconnexion et substrat multicouche

Country Status (1)

Country Link
WO (1) WO2015083409A1 (fr)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010253507A (ja) * 2009-04-24 2010-11-11 Sekisui Chem Co Ltd 導電性微粒子、異方性導電材料、及び、接続構造体
JP2012182298A (ja) * 2011-03-01 2012-09-20 Murata Mfg Co Ltd 電子部品実装基板およびその製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010253507A (ja) * 2009-04-24 2010-11-11 Sekisui Chem Co Ltd 導電性微粒子、異方性導電材料、及び、接続構造体
JP2012182298A (ja) * 2011-03-01 2012-09-20 Murata Mfg Co Ltd 電子部品実装基板およびその製造方法

Similar Documents

Publication Publication Date Title
WO2013132954A1 (fr) Procédé de liaison, structure de liaison et procédé de fabrication associé
TWI335195B (en) Multilayer wiring board
JP6287682B2 (ja) 接合体及びパワーモジュール用基板
US20110290549A1 (en) Wiring board, wiring board manufacturing method, and via paste
US20110278051A1 (en) Multilayer wiring substrate and manufacturing method of multilayer wiring substrate
WO2012090402A1 (fr) Carte de connexion à couches multiples et procédé de fabrication d'une carte de connexion à couches multiples
WO2013132942A1 (fr) Procédé de liaison, structure de liaison et son procédé de fabrication
EP2563103A1 (fr) Substrat de connexion, procédé de fabrication d'un substrat de connexion et pâte pour trou métallisé
TW201242443A (en) Multilayered wiring board, production method therefor, and via paste
JP2009065008A (ja) 導電性ペースト組成物
JP4268476B2 (ja) 導電性ペースト及び配線基板並びにその製造方法
JP3634984B2 (ja) 配線基板
TW201915186A (zh) 無鉛焊料合金、電子電路基板及電子控制裝置
JP2004223559A (ja) 電極接続用金属粉体組成物、及び、電極の接続方法
JPWO2018174066A1 (ja) 導電性粒子、導電材料及び接続構造体
JP4468080B2 (ja) 多層配線基板用導電性ペースト組成物
JP2004234900A (ja) 導電性粒子を用いた導電性ペースト、及び、これを用いた接続用シート
WO2015083409A1 (fr) Matériau pâteux pour un remplissage de trou d'interconnexion et substrat multicouche
JP2012182390A (ja) リジッドフレキシブル基板およびその製造方法
JP2009059574A (ja) 導電ペースト及びこれを用いた多層配線基板
JP2017130623A (ja) 充填用ペースト材料、それを用いたビアホール導体の製造方法および多層基板の製造方法
JP2013065728A (ja) セラミック電子部品及びその製造方法
JP2013247339A (ja) 電子部品モジュールの製造方法
JP2009146839A (ja) 導電ペースト及びこれを用いた多層配線基板
JP4965102B2 (ja) ビアホール充填用導電性ペースト組成物

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 14866908

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 14866908

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: JP