WO2015078904A1 - Vergossenes led-modul mit keramikplatine und treibermodul für netzspannung - Google Patents
Vergossenes led-modul mit keramikplatine und treibermodul für netzspannung Download PDFInfo
- Publication number
- WO2015078904A1 WO2015078904A1 PCT/EP2014/075646 EP2014075646W WO2015078904A1 WO 2015078904 A1 WO2015078904 A1 WO 2015078904A1 EP 2014075646 W EP2014075646 W EP 2014075646W WO 2015078904 A1 WO2015078904 A1 WO 2015078904A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- led
- led module
- carrier body
- module according
- driver
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
- F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/86—Ceramics or glass
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
- F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
- F21V3/062—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being plastics
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V31/00—Gas-tight or water-tight arrangements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V31/00—Gas-tight or water-tight arrangements
- F21V31/04—Provision of filling media
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V31/00—Gas-tight or water-tight arrangements
- F21V31/005—Sealing arrangements therefor
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2101/00—Point-like light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
- F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
- F21Y2103/30—Elongate light sources, e.g. fluorescent tubes curved
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10287—Metal wires as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10356—Cables
Definitions
- the invention relates to an LED module with a carrier body on the surface metallization, forming a circuit board, arranged and on which LEDs ' are applied.
- LED modules with supports made of plastic or metals, such as aluminum or steel (eg coated with non-conductors such as enamel or ceramic) and with non-cast covering materials over the LED 's are known.
- the driver circuits are spatially separated.
- the invention has for its object to supplement an LED module according to the preamble of claim 1 so that it is ready for use immediately, i. can be connected directly to a power supply.
- this object is achieved in that in addition 'applied s well as their driver chips on the metallization, are preferably soldered and at least the LEDs to the LED s with the driver blocks are covered with a light-transmissive material, electrical connection elements with the LED's or driver components connected and led out of the translucent material.
- the LED's and the driver blocks By covering with the light-transmitting material, the LED's and the driver blocks against moisture and environmental influence, wherein the of the LED 's generated light can escape almost unimpeded from the LED module.
- the electrical connection elements make the LED module easy to connect to a power supply. Under "with a translucent Material covered are “also understood” are shed with a translucent material ".
- the carrier body may also be formed bent.
- the carrier body may be tubular shaped.
- the carrier body preferably consists of a ceramic material. This could be alumina or aluminum nitride. Ceramic materials have a high dielectric strength and sufficient heat dissipation.
- the metallization regions which form the printed circuit board are advantageously sintered to the carrier body. For this purpose, the metallization areas are printed on the green compact and then sintered, or the metallization areas are printed on the sintered or sintered carrier body and then sintered. In both cases, the heat dissipation from the LED 's and driver chips into the ceramic is extremely good. Under driver blocks all electrical and electronic components are understood, which are necessary for connecting the LEDs to a power supply.
- the carrier body can also consist of a ceramic composite, glass, glass ceramic or high-purity crystalline ceramics.
- the metallization areas are advantageously soldered to the carrier body, glued or sintered with the carrier body.
- the electrical connection elements are either leads or connectors that are led out of the cover with the translucent material. Under translucent material becomes a translucent Material understood. Under cover also a casting is understood.
- the translucent material preferably covers the entire surface of the support on which the s and the driver blocks LEDs are located. Only the connection elements are led out.
- the translucent material is a plastic or consists of a material based on plastic.
- the invention thus describes a LED module, flat or curved, with one or more LEDs or LED modules. These are mounted (soldered, glued, sintered) on a board made of ceramic or ceramic composites or glass or glass ceramic or high-purity crystalline ceramics (possibly metallized) together with the associated driver components (one or more components of drivers or drivers + resistors) and with a translucent Material coated (covered).
- the module may have a connector or be soldered (or bonded or otherwise connected) directly to leads.
- the module can be connected directly to a power line / connection with eg 1 10 or 220 V with a mains plug.
- the non-conductive ceramic or glass plate ensures high contact protection. Degree of protection IP44 or higher can be achieved.
- the electrical protection class II can be achieved.
- the LED module can be connected directly to a mains voltage. It covers both Asian, American and European grid voltages. Dust tightness is achieved through the cover (covered by IP44 protection).
- the LED module can be mounted in many ways (glued, clamped, screwed, clipped).
- connection elements 7 are electrically connected to the metallization regions 3. To start up the LED module 1 only the connection elements 7 must be connected to a power grid.
- the connecting elements 7 are here led out laterally under the light-transmitting material 6, ie the cover.
- FIG. 2 shows a lamp 8 in which the encapsulated LED module 1 according to the invention with the LED 's 4 is installed.
- the lamp consists of a ceramic lamp base 9 (or other materials) on which the LED module 1 rests.
- the connecting elements 7, here lead wires through the lamp base up to two pins 10.
- an optional glass dome 12 is placed with an inner coating (converter layer), which covers the LED module 1.
- FIG. 3 shows an example of a square LED module 1 with numerous driver components 5 and LED ' s 4 mounted on the metallization regions 3.
- the connecting elements 7 are led out laterally from the LED module under the transparent material.
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Led Device Packages (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/039,605 US20170211791A1 (en) | 2013-11-27 | 2014-11-26 | Encapsulated LED Module with Ceramic Circuit Board and Driver Module for Mains Voltage |
JP2016534985A JP2016540384A (ja) | 2013-11-27 | 2014-11-26 | 配電網電圧に対応した、セラミック基板とドライバモジュールとを備えている封止されたledモジュール |
EP14802683.4A EP3094922A1 (de) | 2013-11-27 | 2014-11-26 | Vergossenes led-modul mit keramikplatine und treibermodul für netzspannung |
KR1020167016882A KR20160091372A (ko) | 2013-11-27 | 2014-11-26 | 네트워크 전압에 대한 세라믹 기판 및 드라이버 모듈을 갖는 led 모듈 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102013224256.5 | 2013-11-27 | ||
DE102013224256 | 2013-11-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2015078904A1 true WO2015078904A1 (de) | 2015-06-04 |
Family
ID=51951817
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2014/075646 WO2015078904A1 (de) | 2013-11-27 | 2014-11-26 | Vergossenes led-modul mit keramikplatine und treibermodul für netzspannung |
Country Status (7)
Country | Link |
---|---|
US (1) | US20170211791A1 (de) |
EP (1) | EP3094922A1 (de) |
JP (1) | JP2016540384A (de) |
KR (1) | KR20160091372A (de) |
DE (1) | DE102014224128A1 (de) |
TW (1) | TW201528563A (de) |
WO (1) | WO2015078904A1 (de) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105065948A (zh) * | 2015-08-31 | 2015-11-18 | 漳州立达信光电子科技有限公司 | 集成式led灯及其制作方法 |
CN106322174A (zh) * | 2015-06-24 | 2017-01-11 | 宏力照明集团有限公司 | 一种高性能led光电引擎模块 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102009037249A1 (de) * | 2009-03-18 | 2010-11-11 | Kay Schumann | Stablampe |
US20110316420A1 (en) * | 2010-06-28 | 2011-12-29 | Chih-Yang Chang | Led light source module |
US20120113633A1 (en) * | 2010-11-05 | 2012-05-10 | Donald Bowen | LED Lighting Apparatus and Housing |
DE102012204851A1 (de) * | 2011-03-29 | 2012-10-04 | Ceram Tec Gmbh | Spritzguss-Lampenkörper mit keramischen Kühlern und LEDs |
EP2508796A2 (de) * | 2011-04-08 | 2012-10-10 | Insta Elektro GmbH | Beleuchtungseinrichtung |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008013454B4 (de) * | 2008-03-10 | 2012-05-31 | Vossloh-Schwabe Optoelectronic Gmbh & Co. Kg | LED-Baueinheit für Beleuchtungszwecke |
JP3182073U (ja) * | 2012-12-21 | 2013-03-07 | 黄顯榮 | 駆動メカニズムを統合したフルカラーledパッケージ |
-
2014
- 2014-11-26 DE DE102014224128.6A patent/DE102014224128A1/de not_active Withdrawn
- 2014-11-26 WO PCT/EP2014/075646 patent/WO2015078904A1/de active Application Filing
- 2014-11-26 US US15/039,605 patent/US20170211791A1/en not_active Abandoned
- 2014-11-26 KR KR1020167016882A patent/KR20160091372A/ko not_active Application Discontinuation
- 2014-11-26 EP EP14802683.4A patent/EP3094922A1/de not_active Withdrawn
- 2014-11-26 JP JP2016534985A patent/JP2016540384A/ja active Pending
- 2014-11-26 TW TW103140955A patent/TW201528563A/zh unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102009037249A1 (de) * | 2009-03-18 | 2010-11-11 | Kay Schumann | Stablampe |
US20110316420A1 (en) * | 2010-06-28 | 2011-12-29 | Chih-Yang Chang | Led light source module |
US20120113633A1 (en) * | 2010-11-05 | 2012-05-10 | Donald Bowen | LED Lighting Apparatus and Housing |
DE102012204851A1 (de) * | 2011-03-29 | 2012-10-04 | Ceram Tec Gmbh | Spritzguss-Lampenkörper mit keramischen Kühlern und LEDs |
EP2508796A2 (de) * | 2011-04-08 | 2012-10-10 | Insta Elektro GmbH | Beleuchtungseinrichtung |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106322174A (zh) * | 2015-06-24 | 2017-01-11 | 宏力照明集团有限公司 | 一种高性能led光电引擎模块 |
CN105065948A (zh) * | 2015-08-31 | 2015-11-18 | 漳州立达信光电子科技有限公司 | 集成式led灯及其制作方法 |
CN105065948B (zh) * | 2015-08-31 | 2018-08-14 | 漳州立达信光电子科技有限公司 | 集成式led灯及其制作方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2016540384A (ja) | 2016-12-22 |
US20170211791A1 (en) | 2017-07-27 |
DE102014224128A1 (de) | 2015-05-28 |
TW201528563A (zh) | 2015-07-16 |
KR20160091372A (ko) | 2016-08-02 |
EP3094922A1 (de) | 2016-11-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN104006321B (zh) | 一种3d cob led灯发光组件及led灯 | |
DE102014109718B4 (de) | Licht emittierende Vorrichtung und Beleuchtungseinrichtung unter Verwendung derselben | |
EP2539935A2 (de) | Lichtquelle mit array-leds zum direkten betrieb am wechselspannungsnetz und herstellungsverfahren hierfür | |
EP2732209B1 (de) | Leuchtmittel mit wenigstens einer organischen, licht emittierenden diode | |
WO2011144522A1 (de) | Leuchtvorrichtung | |
DE102012202354A1 (de) | Leuchtmodul | |
DE102008047933A1 (de) | Beleuchtungsvorrichtung mit einer Leuchtdiode | |
EP3094922A1 (de) | Vergossenes led-modul mit keramikplatine und treibermodul für netzspannung | |
EP2613079A1 (de) | LED-Leuchtmittel | |
DE102012218538A1 (de) | Verfahren zur Herstellung einer Lichterzeugungseinheit | |
EP1799019B1 (de) | Elektrischer Anschluss für einen Sockel | |
DE102009031586B3 (de) | Elektrisches Installationsgerät | |
EP1501125A3 (de) | Leistungshalbleitermodul mit skalierbarer Aufbautechnik | |
WO2009021496A2 (de) | Led-leuchtmittel in form einer glühlampe | |
EP2171352B1 (de) | Leuchtmittel | |
DE202015100715U1 (de) | Verkapselungs-Substrat für LEDs, dreidimensionale Verkapselung und Glühbirne mit der dreidimensionalen Verkapselung | |
DE102013221647A1 (de) | LED Modul mit Konverter-Schaltung | |
DE102012205179A1 (de) | LED-Lampe mit einer LED als Leuchtmittel und mit einem Lampenschirm aus Glas oder Kunststoff | |
DE202010000048U1 (de) | Wasserdichte Lampe | |
EP2150749B1 (de) | Beleuchtungsvorrichtung mit einer an einer oberfläche eines objekts anbringbaren schienenvorrichtung | |
EP2483593B1 (de) | Lampe mit variablem substrat als untergrund für lichtquelle | |
EP2206150B1 (de) | Anschlussfertiger led-modulkörper | |
EP0131886A1 (de) | Leuchte für eine Leuchtstofflampe | |
AT14221U1 (de) | Leuchtmittel mit LED und Verfahren zur Montage | |
DE102015205332A1 (de) | Transluzente mit LED bestückte Boards und/oder Kühlkörper |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 14802683 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 15039605 Country of ref document: US |
|
ENP | Entry into the national phase |
Ref document number: 2016534985 Country of ref document: JP Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
REEP | Request for entry into the european phase |
Ref document number: 2014802683 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2014802683 Country of ref document: EP |
|
ENP | Entry into the national phase |
Ref document number: 20167016882 Country of ref document: KR Kind code of ref document: A |