EP1501125A3 - Leistungshalbleitermodul mit skalierbarer Aufbautechnik - Google Patents
Leistungshalbleitermodul mit skalierbarer Aufbautechnik Download PDFInfo
- Publication number
- EP1501125A3 EP1501125A3 EP04014432A EP04014432A EP1501125A3 EP 1501125 A3 EP1501125 A3 EP 1501125A3 EP 04014432 A EP04014432 A EP 04014432A EP 04014432 A EP04014432 A EP 04014432A EP 1501125 A3 EP1501125 A3 EP 1501125A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- substrates
- power semiconductor
- semiconductor module
- base plate
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/547—Dispositions of multiple bond wires
- H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/547—Dispositions of multiple bond wires
- H10W72/5475—Dispositions of multiple bond wires multiple bond wires connected to common bond pads at both ends of the wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/921—Structures or relative sizes of bond pads
- H10W72/926—Multiple bond pads having different sizes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Combinations Of Printed Boards (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10333328 | 2003-07-23 | ||
| DE10333328A DE10333328B3 (de) | 2003-07-23 | 2003-07-23 | Leistungshalbleitermodul in skalierbarer Aufbautechnik |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP1501125A2 EP1501125A2 (de) | 2005-01-26 |
| EP1501125A3 true EP1501125A3 (de) | 2006-12-06 |
Family
ID=33483016
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP04014432A Withdrawn EP1501125A3 (de) | 2003-07-23 | 2004-06-19 | Leistungshalbleitermodul mit skalierbarer Aufbautechnik |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US7164201B2 (de) |
| EP (1) | EP1501125A3 (de) |
| JP (1) | JP2005045237A (de) |
| DE (1) | DE10333328B3 (de) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8279640B2 (en) | 2008-09-24 | 2012-10-02 | Teco-Westinghouse Motor Company | Modular multi-pulse transformer rectifier for use in symmetric multi-level power converter |
| US7830681B2 (en) | 2008-09-24 | 2010-11-09 | Teco-Westinghouse Motor Company | Modular multi-pulse transformer rectifier for use in asymmetric multi-level power converter |
| JP2010129867A (ja) * | 2008-11-28 | 2010-06-10 | Mitsubishi Electric Corp | 電力用半導体装置 |
| US7940537B2 (en) * | 2008-12-31 | 2011-05-10 | Teco-Westinghouse Motor Company | Partial regeneration in a multi-level power inverter |
| US8223515B2 (en) * | 2009-02-26 | 2012-07-17 | TECO—Westinghouse Motor Company | Pre-charging an inverter using an auxiliary winding |
| US8976526B2 (en) | 2009-06-30 | 2015-03-10 | Teco-Westinghouse Motor Company | Providing a cooling system for a medium voltage drive system |
| US8575479B2 (en) | 2009-06-30 | 2013-11-05 | TECO—Westinghouse Motor Company | Providing a transformer for an inverter |
| US8711530B2 (en) * | 2009-06-30 | 2014-04-29 | Teco-Westinghouse Motor Company | Pluggable power cell for an inverter |
| US8130501B2 (en) | 2009-06-30 | 2012-03-06 | Teco-Westinghouse Motor Company | Pluggable power cell for an inverter |
| US8254076B2 (en) | 2009-06-30 | 2012-08-28 | Teco-Westinghouse Motor Company | Providing modular power conversion |
| US8601190B2 (en) | 2011-06-24 | 2013-12-03 | Teco-Westinghouse Motor Company | Providing multiple communication protocols for a control system having a master controller and a slave controller |
| US9363930B2 (en) | 2013-03-11 | 2016-06-07 | Teco-Westinghouse Motor Company | Passive two phase cooling solution for low, medium and high voltage drive systems |
| US9153374B2 (en) | 2013-06-28 | 2015-10-06 | Teco-Westinghouse Motor Company | Cooling arrangements for drive systems |
| US12066780B2 (en) | 2022-05-23 | 2024-08-20 | Ricoh Company, Ltd. | Fixing device including nip formation plate having a plurality of protruding portions and image forming apparatus incorporating same |
| US12490400B2 (en) | 2023-04-11 | 2025-12-02 | Caterpillar Inc. | Flexible power electronics module |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5459356A (en) * | 1992-08-26 | 1995-10-17 | Eupec Europeische Gesellsch F. Leistungshalbleiter Mbh & Co., Kg. | Power semiconductor module having a plurality of semiconductor arrangements |
| DE19630902A1 (de) * | 1996-08-01 | 1998-02-05 | Ixys Semiconductor Gmbh | Einrichtung zur Temperaturüberwachung in einer leistungselektronischen Anordnung |
| WO2002054489A2 (en) * | 2000-12-29 | 2002-07-11 | Advanced Micro Devices, Inc. | Temperature measurement system and method |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3269745B2 (ja) * | 1995-01-17 | 2002-04-02 | 株式会社日立製作所 | モジュール型半導体装置 |
| JPH1197598A (ja) * | 1997-09-19 | 1999-04-09 | Toshiba Corp | 半導体装置 |
| DE10024516B4 (de) * | 2000-05-18 | 2006-03-09 | eupec Europäische Gesellschaft für Leistungshalbleiter mbH & Co. KG | Leistungshalbleitermodul |
| JP4089143B2 (ja) * | 2000-08-30 | 2008-05-28 | 三菱電機株式会社 | 電力用半導体装置 |
| JP4127641B2 (ja) * | 2001-10-23 | 2008-07-30 | 三菱電機株式会社 | 半導体装置 |
| DE10316355C5 (de) * | 2003-04-10 | 2008-03-06 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbeitermodul mit flexibler äusserer Anschlussbelegung |
-
2003
- 2003-07-23 DE DE10333328A patent/DE10333328B3/de not_active Expired - Fee Related
-
2004
- 2004-06-19 EP EP04014432A patent/EP1501125A3/de not_active Withdrawn
- 2004-07-12 JP JP2004204700A patent/JP2005045237A/ja active Pending
- 2004-07-23 US US10/897,720 patent/US7164201B2/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5459356A (en) * | 1992-08-26 | 1995-10-17 | Eupec Europeische Gesellsch F. Leistungshalbleiter Mbh & Co., Kg. | Power semiconductor module having a plurality of semiconductor arrangements |
| DE19630902A1 (de) * | 1996-08-01 | 1998-02-05 | Ixys Semiconductor Gmbh | Einrichtung zur Temperaturüberwachung in einer leistungselektronischen Anordnung |
| WO2002054489A2 (en) * | 2000-12-29 | 2002-07-11 | Advanced Micro Devices, Inc. | Temperature measurement system and method |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1501125A2 (de) | 2005-01-26 |
| JP2005045237A (ja) | 2005-02-17 |
| US7164201B2 (en) | 2007-01-16 |
| DE10333328B3 (de) | 2005-01-27 |
| US20050035439A1 (en) | 2005-02-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
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| AK | Designated contracting states |
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| AX | Request for extension of the european patent |
Extension state: AL HR LT LV MK |
|
| RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: SEMIKRON ELEKTRONIK GMBH & CO. KG |
|
| PUAL | Search report despatched |
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| AK | Designated contracting states |
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| AX | Request for extension of the european patent |
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| RIC1 | Information provided on ipc code assigned before grant |
Ipc: H01L 23/34 20060101ALN20061031BHEP Ipc: H01L 23/52 20060101ALI20061031BHEP Ipc: H01L 23/373 20060101ALI20061031BHEP Ipc: H01L 25/07 20060101AFI20061031BHEP |
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| 17P | Request for examination filed |
Effective date: 20061108 |
|
| 17Q | First examination report despatched |
Effective date: 20070307 |
|
| AKX | Designation fees paid |
Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PL PT RO SE SI SK TR |
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| STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
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| 18D | Application deemed to be withdrawn |
Effective date: 20150106 |