EP2539935A2 - Lichtquelle mit array-leds zum direkten betrieb am wechselspannungsnetz und herstellungsverfahren hierfür - Google Patents
Lichtquelle mit array-leds zum direkten betrieb am wechselspannungsnetz und herstellungsverfahren hierfürInfo
- Publication number
- EP2539935A2 EP2539935A2 EP11710417A EP11710417A EP2539935A2 EP 2539935 A2 EP2539935 A2 EP 2539935A2 EP 11710417 A EP11710417 A EP 11710417A EP 11710417 A EP11710417 A EP 11710417A EP 2539935 A2 EP2539935 A2 EP 2539935A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- led
- leds
- light source
- array
- ali
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
- Y02B20/30—Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]
Definitions
- the invention relates to a light source according to the preamble of claim 1. Furthermore, the invention relates, according to claim 13, a manufacturing method for the light source with array LEDs, in particular a method for ensuring a shock protection for this purpose.
- a fast electronic switch is arranged in the circuit of the LEDs, which is connected to a pulse generator which supplies pulses with a repetition frequency of at least 70 Hz.
- the series resistor is smaller than it would be for constant current operation and the arrangement
- CONFIRMATION COPY tion is designed so that the plurality of LEDs is operated with pulsed current, wherein the current amplitude at the LEDs is greater than the maximum current allowed in constant operation.
- the current amplitude is preferably larger by more than a factor of 20 than the maximum current permissible for constant operation.
- the design rule is to select the pulses so short that the LED does not significantly heat up in the pulse duration and in particular that the heat dissipation away from the LED is so high that it does not come from period to period to a temperature increase in the LED.
- the pulse generator and the fast electronic switch are designed so that they cause a current limitation by the LEDs together with the series resistor.
- the rectifier circuit may be, for example, a one-way rectifier circuit or a bridge rectifier circuit, wherein it is preferably equipped with a smoothing capacitor to provide a substantially constant current.
- the electronic circuit of the pulse generator is connected in parallel to the circuit of the LEDs to the rectifier circuit.
- the electronic circuit, together with a plurality of LEDs, a fast electronic switch and a bias resistor, and in particular without the rectifier circuit for connection to the voltage of the public grid and without that the series resistor is substantially smaller than it is for the operation at constant Electricity would be required to be operated.
- the light source described ie the arrangement of LEDs, electrically fast switch, series resistor, pulse and rectifier circuit can be provided with a conventional mounting base, which can be used with a conventional mounting socket.
- this prior art teaches neither the use of at least two array LEDs, and further does not teach to dimension the sum of the forward voltages of these array LEDs (Ul ... Un) without electronic control such that the amplitude of the rectified ones AC voltage is within a certain narrow range of the nominal voltage.
- a Graetz rectifier can be used, the LED being connected to the DC voltage output of the Graetz rectifier, and the AC voltage input of the Graetz rectifier being connected directly to the AC voltage network via a capacitive series resistor.
- a capacitor can be switched parallel to the LED for even illumination.
- a light source with at least one LED chip and commercial socket for the operation of reflector lamps or halogen lamps with cold light mirror reflector is known in which the light source has a support for at least one LED chip and this support (eg SMD Housing) of the LED ('s) is installed opposite to the reflector.
- the lamp has a series resistor, one of the sockets of the types El 0; P13, 5S; BA9S; T5; T10; E5.5; GU10; GX 5.3; G 5.3; GU4; GY 6:35; G4, a glass or plastic body in ball or olive shape as protection against contact of the LED ('s) and possibly a rectifier.
- the LED illuminant has a base, a central area with the control electronics, at least one printed circuit board with LEDs (light emitting diodes), a glass bulb, and side slats on.
- the central area consists of all the control electronics for the LEDs and is preferably encapsulated in a housing to protect this electronics from external environment influences.
- an AC / DC converter or a DC / DC converter is provided in the sleeve or pipe, a power supply switching power supply, depending on the power supply for which the LED Illuminant is to be formed and how the LEDs should be supplied or controlled.
- a LED driver module supplied with the DC voltage generated by the AC / DC converter is configured to control or regulate the total current for the LEDs.
- This constant current source may in particular consist of transistors, diodes and control resistors for operating the preferably series-connected LEDs.
- a plurality of LED branches can be provided, in which case preferably different constant current sources control or supply the various branches.
- the LEDs are arranged in chip-on-board or flip-chip technology on the LED module, for a chip-on-board module, this preferably made of ceramic, metal or FR4 (epoxy + glass fiber fabric) with metal - Through contacts exists, so that an optimal thermal conductivity can be achieved.
- the LED module itself is arranged on a plate with good thermal conductivity.
- the plate is preferably made of one of these metals.
- a plurality of LED modules that is, a plurality of LED branches arranged side by side on the plate, wherein an insulating layer, but which is thermally conductive, for safety reasons, the LED module separates from the plate.
- the LEDs or the LED module are mounted on the plate in a known manner, preferably either glued or screwed thereon in order to achieve a good thermal connection.
- the carrier In addition to the plate shape for the carrier other forms of the carrier are conceivable, for example, tetrahedrons or other polyhedron forms, and it is also possible to arrange the LED modules not directly on the plate or on the insulating layer, but with a certain distance from the plate to fix on a support.
- the tube or the sleeve and the plate are held together and connected by pressing, screwing or soldering, so that the heat generated by the control electronics can thus be conducted via this connection to the plate.
- the dome-shaped glass bulb On the plate, for example by means of thermally conductive adhesive, the dome-shaped glass bulb is attached, which is designed as a transparent protective layer for the LEDs and possibly also as a light-collecting element for increasing the light intensity.
- cooling fins or cooling fins are formed on the external surface of the pipe.
- the invention is compared to the known LED bulbs the task of further developing them such that without a special Vorschalt- or driver electronics (power LED driver and voltage transformation) a direct connection to the 230V / 50Hz or 120 V / 60Hz AC mains, safe operation and easy adaptation to the user requirements in the construction of a light source is made possible. Furthermore, the invention has for its object to provide a cost-effective manufacturing process for the light source, in particular a method for ensuring a shock protection for this purpose.
- This AC-related pulsed operation allows for a given dimensioning a very good light output at about the same energy use as in DC operation.
- the LEDs can be driven at the same power consumption for the shorter current flow duration in pulsed operation (AC operation) with a higher current than in continuous DC operation, they are perceived as seemingly brighter.
- AC operation pulsed operation
- their flux voltage increases due to the higher current, which additionally increases the light efficiency, since at the same time the voltage across the series resistor as well as the current flow time and thus the power loss decreases.
- the light source according to the invention is suitable for different applications and can be easily attached to suitable locations, for example.
- the carrier heat sink / circuit board
- the carrier can be customized (customized) to the requirements for heat dissipation / thermal management.
- the carrier / heat sink is thus a functional component of the lamp (carrier, holder, mounting element, ..), realizes the required heat dissipation, is inexpensive to produce and can be mounted with little effort.
- a method for producing a light source according to claim 13 is achieved in that the light source modular of array LED strands, wherein the LED string has a series circuit of at least two array LEDs with a plurality of interconnected individual LEDs, can be built up and that to ensure a Protection against contact and to protect against moisture and contamination a LED module board of the array LED strand is partially transparent in a two-step process isolated by
- a transparent, electrically and climatically insulating protective layer is generated in the second process step by means of transparent encapsulant (for example silicone), wherein the encapsulation takes place by gravity and can cure both at room temperature or accelerated under UV irradiation
- transparent encapsulant for example silicone
- the manufacturing method according to the invention allows by the modular design both the fulfillment of user requirements, including ensuring contact protection on the top of the carrier board, protection against moisture and contamination of the LED module board and fulfillment of thermal operating conditions (by heat dissipation to the underside of the carrier board), as well - despite the versatility and suitability for a wide variety of applications - a cost-effective production.
- the carrier on its top and bottom depending on its entire extent reaching metallic surfaces, which are suitable for electrical contacting and which are electrically separated from each other by means of a corresponding layer but mechanically interconnected.
- the development according to claim 2 has the advantage that the protection of the required thermal operating conditions of the array LEDs in the array LED strand by a generously dimensioned cooling of the (respective) array LED carrier board takes place.
- the realization of the lighting circuit has proven to be advantageous on an aluminum core or aluminum-ceramic printed circuit board.
- To ensure the recommended by the array LED manufacturer operating temperature is preferably the cooling of the carrier board by thermally conductive assembly with appropriately sized heat sinks or directly on a heat dissipating metallic lamp housing.
- the array LEDs are formed as a matrix circuit with mixed series and parallel circuits of the individual LEDs.
- This embodiment of the invention has the advantages that the matrix circuit enables a different interconnection of the array LEDs from 2x2, 3x3 or even 4x4 existing LEDs. It can, in addition to the above array LED's, based on the inventive concept of self-regulation, i. There can never be a greater current in the LED string than defined by the flux-voltage / current characteristic and given by the "constant" mains voltage, in the invention also any single LED used (and electrically with the array LEDs connected), which can then be freely placed with respect to their arrangement on a carrier board, resulting in further constructive solutions for the lighting design (large distributions, letters, patterns up to very filigree linear arrangements eg filament imitations for design lights ).
- FIG. 1 the construction of a string of five 16-fold array LEDs
- FIG. 2 shows the construction of a ring of three strands according to FIG. 1,
- FIG. FIG. 3 shows the structure of a double bar of four strands according to FIG. 1,
- FIG. 4 shows the wiring diagram based on double terminals
- FIG. FIG. 5 shows the circuit board benefit from strings according to FIG. 1.
- FIG. 1 shown construction of a strand is the basis for an extremely cost and energy efficient power LED bulbs for direct connection to the AC voltage network.
- the in FIG. Characterized strand shown 1 that a series circuit of five array LEDs ALI, .., AL5 's and a resistor Rl are connected to a bridge rectifier GL with 16 LED, which on a plate-like, at least the array LEDs ALI. ., AL5 supporting and electrically contacting carrier T are arranged.
- the dimensioning of an LED string / number of LEDs, their cumulative voltage and series resistance will be described below using an example.
- a string was realized with 5 pieces of 16-array LED ALI, .., AL5 (see following table) and thus replaced 80 individual LEDs.
- the operating point of the series circuit can be adjusted so that the nominal electrical voltage (for example, 230 V) in the string corresponds to approximately 80-85% of the sum of the individual rated powers of the LEDs connected in the string.
- the sum of the forward voltages of all the LEDs located in the line is selected to be as high as possible so that it corresponds to at least 75%, better 80% and a maximum of 85% of the amplitude of the rectified AC voltage at nominal voltage. This ensures that in the series resistor Rl at rated voltage only a relatively low power is implemented. This is favored by the magnitude of the forward voltage, which is a function of the phase current. This means that the greater the sum of the flux voltages (80% of the amplitude of the rectified rated voltage), the shorter the current flow duration in the string.
- the nominal value of the resistance Rl in the LED string from the array LEDs ALI, .., AL5 dimensioned so that the stranded in the electrical power at rated voltage corresponds to only about 80-85% of the sum of the individual rated power of the LEDs used. In this way, safe operation is ensured even with overvoltage.
- the lighting circuit in the above example consists of a series resistor Rl (50 ohms) a bridge rectifier GL (1A / 600V) and 5 pieces of array LEDs ALI, .., AL5.
- the power consumption is about 9 watts, with the in the resistor Rl converted power account for only about 0.2 watts.
- a comparable system can also be realized with other array LEDs ALI,..., AL5 of different array size if the internal individual LEDs are connected in series and the dimensioning regulation according to the invention is used.
- the realization of the lighting circuit has proven to be advantageous on an aluminum core or aluminum ceramic printed circuit board.
- the cooling of the carrier circuit board T1 is possible by thermally conductive mounting with appropriately dimensioned heat sinks or directly on a heat-dissipating metallic luminaire housing.
- a series resistor Rl with a resistance of approximately 0 ⁇ can be used (or even completely omitted, see FIG LED's in each array LED ALI, .. are negligible or For example, the number of LED 's greater than the calculated value is selected.
- the at a magnification of the resistor Rl slightly lower light output is negligible due to the substantially low system costs (no ballast) and the resource savings.
- the operating temperature of the heat radiation of any light carrier, which simultaneously acts as a cooling surface, by the power loss of the built-LED modules is deliberately reduced so much in the context of the inventive concept that the in the luminaire housing emitted heat of the housing surface and their heat dissipation is adapted to the environment.
- the dome Dl, D2 which are used to attach the carrier boards, also act as heat sinks and thus support the heat dissipation of the array LED module on the heat sink to the outer shell of the luminaire housing.
- a comparable circuit for 120V can be realized with approx. 42 LEDs.
- a coating of the carrier T with protective lacquer is preferably provided, for example by casting.
- terminals in the form of double terminals DK1, DK2 are used (for reverse polarity protection the double terminal DK1 is used for 220 V and the double terminal DK2 is used for 0 V, see for example FIG 1), which on one side a cover and on the other side respectively have two locking clips for the connection wires of the mains voltage.
- the spatially designed carrier T in which the surfaces to be coated must extend over the assembled components, for example, to coat only the back of the connector can and to keep the front connector contacts coating-free, ie using a double terminal D 1, DK2 without lid (3rd dimension)) by wetting and exploiting the capillary pressure (for example, a capillary of 1 ⁇ m diameter produces a suction pressure of 2.8 bar, corresponding to a suction height for wetting water of 28 meters) or the adhesion force (ie force) acting between two substances, whereby, for example, the liquid rises on the wall of the component on the printed circuit board) are coated.
- the capillary pressure for example, a capillary of 1 ⁇ m diameter produces a suction pressure of 2.8 bar, corresponding to a suction height for wetting water of 28 meters
- the adhesion force ie force
- FIG. 2 is the construction of a round lamp, in particular a ring of three strands of FIG. 1
- FIG. 3 shows the structure of a rectangular lamp, in particular a double bar of four strands according to FIG. 1
- FIG. 4 shows the wiring diagram based on double terminals DK1, DK2
- FIG. 5 shows the circuit board benefit from strands of FIG. 1 shown.
- a carrier T which is designed meandering or sawtooth in the main direction of extension, a very good space utilization and a spatial distribution of the terminals of the mains voltage.
- this embodiment of the carrier T allows cost-effective production (manufacturing benefits with minimal material waste and separation with uniformly wide milling / punching channel) and a structural configuration of the light source according to the invention, especially taking into account the simple fulfillment of requirements for light brightness and operating temperature including structural design the lamp itself.
- Core idea of the inventive concept is the self-regulation in the LED strand ALI, AL2, ... with consistent use of the current / voltage characteristic of any LED by reversing the procedure, in the dimensioning of the operating point of an LED circuit from the current to the voltage.
- a light source that is to be designed for operation on mains voltage can now simply refer to the largely constant mains voltage as a reference with respect to its operating point in contrast to a light operated with a constant current regulated light source. Since the grid voltage tolerances are guaranteed by grid operators, they can be included as constants in the reference system and thus require no additional active current control, but uses the functional relationship of the U / l characteristic of the LED to stabilize the operating point on the basis of tolerance limits the applied mains voltage.
- a ceramic circuit board may be used for thermal coupling and isolation.
- the ceramic circuit board serves as a component carrier, as an insulator for receiving in the lamp and as a heat coupling part to the heat sink for heat dissipation.
- the electrical parts are completely encapsulated with plastic and meet the corresponding standards for insulation and creepage distances.
- the manufacturing method of the light source of the present invention can be described as follows.
- IMS aluminum substrate printed circuit board
- This board is like conventional PCB with SMD solder pads and traces fitted.
- the soldering points are printed by screen printing with solder paste.
- the subsequent assembly of the SMD components LEDs, resistors, diodes or rectifiers and contact elements (terminals) is carried out using SMD placement machines and is then soldered either using reflow technology or, if available, also with a vapor-phase soldering system Connection cable to be soldered directly to the corresponding connection pads of the circuit board / carrier T.
- the LED module board T is preferably isolated in a two-stage process (partially) transparent.
- a nontransparent encapsulation of the non-luminous components by means of a low-pressure injection molding process (for example, based on hot melt / hot melt adhesive is injected with approximately 10 bar in an aluminum hollow chamber tool).
- a transparent, electrically and climatically insulating protective layer is generated by means of a transparent casting agent (eg silicone) .
- a transparent casting agent eg silicone
- the casting takes place by gravity and can be carried out either at room temperature or accelerated
- the carrier board T on the underside as a metal plate, in particular aluminum plate for dissipating the heat from the arranged on the upper side array LEDs ALI, .. (if necessary, further individual LEDs) to the bottom (in particular).
- a simple function test is carried out to secure the desired electrical and optical parameters.
- the insulation / contact protection of the network-side connection cable and connector / double terminal DKL, DK2 done.
- the cables of the mains voltage supply are routed through a recess in the aluminum part / underside of the carrier board T and then cast or encapsulated the insulation is ensured, whereby the plug / double clamp DK1, DK2 is encapsulated on all sides with plastic.
- the connecting cables can also be installed in an insulation box, which can also be (mostly) poured out.
- the connecting cables are routed from below through the printed circuit board T and soldered on the surface to corresponding solder pads. By subsequent casting with appropriate transparent plastic (for example, weatherproof material such as solar cells), the insulation is ensured.
- the electrical contacting is usually carried out by a so-called diebond, which firstly attaches the chip to the carrier and secondly creates a first electrical contact, and by a so-called wire bond from the upper chip surface to a corresponding Contact point of the carrier plate T leads.
- diebond which firstly attaches the chip to the carrier and secondly creates a first electrical contact
- wire bond from the upper chip surface to a corresponding Contact point of the carrier plate T leads.
- Diebondes only one attachment of the chip, while the electrical contact is done with two wire bonds.
- the thin carrier T dissipates heat as well as possible.
- the carrier T it is advantageous to construct the carrier T so that it is metallic Carrier film or plate having a thin electrically insulating layer, so for example a few 10 ⁇ thick plastic layer, but better a 0.5 to 1 ⁇ thin silicon oxide or silicon nitride layer or a correspondingly thin, for example by means of sol-gel method applied glass - or ceramic layer.
- insulating layer On this, possibly locally open insulating layer is a next, structured metallic layer, which - possibly with the inclusion of the lower metallic carrier foil - the electrical contacting of the LED chip modules ALI, ..., possibly single LED chip allows. Due to the flexible support T, an adaptation to the lamp shape, for example staircase-shaped lamp, can be made possible
- the light source according to the invention allows a flexible adaptation to the individual requirements of the user, in particular with regard to contact protection and wall drainage, and is nevertheless inexpensive to produce.
- switch can the strand of array LED 's, a circuit module, such as a bridge or a transistor are connected upstream, so that functions such as dimming on / off or a complete light management with motion and / or brightness control or Timer function is enabled.
- a circuit module such as a bridge or a transistor are connected upstream, so that functions such as dimming on / off or a complete light management with motion and / or brightness control or Timer function is enabled.
- the invention has hitherto not been limited to the feature combination defined in claim 1, but may also be defined by any other combination of certain features of all disclosed individual features. This means that in principle virtually every single feature of patent claim 1 can be omitted or replaced by at least one individual feature disclosed elsewhere in the application.
Landscapes
- Circuit Arrangement For Electric Light Sources In General (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Devices (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102010008876.5A DE102010008876B4 (de) | 2010-02-22 | 2010-02-22 | Lichtquelle mit Array-LEDs zum direkten Betrieb am Wechselspannungsnetz und Herstellungsverfahren hierfür |
| PCT/EP2011/000836 WO2011101172A2 (de) | 2010-02-22 | 2011-02-22 | Lichtquelle mit array-leds zum direkten betrieb am wechselspannungsnetz und herstellungsverfahren hierfür |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP2539935A2 true EP2539935A2 (de) | 2013-01-02 |
Family
ID=44217490
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP11710417A Withdrawn EP2539935A2 (de) | 2010-02-22 | 2011-02-22 | Lichtquelle mit array-leds zum direkten betrieb am wechselspannungsnetz und herstellungsverfahren hierfür |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US8937432B2 (de) |
| EP (1) | EP2539935A2 (de) |
| DE (1) | DE102010008876B4 (de) |
| WO (1) | WO2011101172A2 (de) |
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| US8890427B2 (en) * | 2012-10-26 | 2014-11-18 | Liteideas, Llc | Apparatus and method of operation of a low-current LED lighting circuit |
| US9894759B2 (en) * | 2015-09-02 | 2018-02-13 | Ty Rock | Shaped substrate with arrangement of solid state light sources |
| EP3387888B1 (de) * | 2015-12-08 | 2019-07-24 | Signify Holding B.V. | Anordnung und beleuchtungsvorrichtung mit der anordnung |
| RU183335U1 (ru) * | 2018-02-02 | 2018-09-18 | Евгений Михайлович Силкин | Светодиодная филаментная лампа |
| KR102249553B1 (ko) * | 2018-09-30 | 2021-05-07 | 변동환 | Led 조명기판 및 그 제조방법 |
| KR102657119B1 (ko) * | 2018-11-02 | 2024-04-15 | 엘지이노텍 주식회사 | 노광기용 조명 장치 |
| DE102019101559A1 (de) | 2019-01-23 | 2020-07-23 | Dr. Schneider Kunststoffwerke Gmbh | Beleuchtungseinheit, beleuchtbares Bauteil und Verfahren zu dessen Herstellung |
| KR102290269B1 (ko) * | 2019-10-13 | 2021-08-17 | 변동환 | Led 조명기판 및 그 제조방법 |
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| CN217464162U (zh) * | 2022-06-22 | 2022-09-20 | 四川蓝景光电技术有限责任公司 | 一种可任意折弯扭曲的led灯具 |
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| JP4290753B2 (ja) | 2007-08-10 | 2009-07-08 | シャープ株式会社 | Led光源、led光源の製造方法、面光源装置、および映像表示装置 |
| DE102007041193A1 (de) * | 2007-08-31 | 2009-03-05 | Osram Gesellschaft mit beschränkter Haftung | Leuchtmodul für eine Beleuchtungseinrichtung und Beleuchtungseinrichtung |
| JP2009105234A (ja) * | 2007-10-24 | 2009-05-14 | Dreamex Co Ltd | Ledモジュール |
| JP5145146B2 (ja) | 2008-07-07 | 2013-02-13 | 昭和電工株式会社 | 照明システム |
| DE202008010709U1 (de) | 2008-08-12 | 2009-01-02 | Pinballcenter Marco Knauer & Holger Exner GbR (vertretungsberechtigte Gesellschafter: Marco Knauer, 86399 Bobingen und Holger Exner, 89077 Ulm) | LED Leuchtmittel für Spielautomaten |
| CN101650010A (zh) | 2008-08-14 | 2010-02-17 | 鸿富锦精密工业(深圳)有限公司 | Led光源模组及其应用的光机装置 |
| US8314564B2 (en) * | 2008-11-04 | 2012-11-20 | 1 Energy Solutions, Inc. | Capacitive full-wave circuit for LED light strings |
| DE102008064310B3 (de) * | 2008-12-20 | 2010-05-20 | Insta Elektro Gmbh | Elektrisches/elektronisches Installationsgerät |
| US8506127B2 (en) * | 2009-12-11 | 2013-08-13 | Koninklijke Philips N.V. | Lens frame with a LED support surface and heat dissipating structure |
-
2010
- 2010-02-22 DE DE102010008876.5A patent/DE102010008876B4/de not_active Expired - Fee Related
-
2011
- 2011-02-22 WO PCT/EP2011/000836 patent/WO2011101172A2/de not_active Ceased
- 2011-02-22 EP EP11710417A patent/EP2539935A2/de not_active Withdrawn
- 2011-02-22 US US13/580,586 patent/US8937432B2/en not_active Expired - Fee Related
Non-Patent Citations (2)
| Title |
|---|
| None * |
| See also references of WO2011101172A2 * |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2011101172A3 (de) | 2012-03-15 |
| US8937432B2 (en) | 2015-01-20 |
| DE102010008876B4 (de) | 2017-07-27 |
| US20120320595A1 (en) | 2012-12-20 |
| DE102010008876A1 (de) | 2011-08-25 |
| WO2011101172A2 (de) | 2011-08-25 |
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