TW201528563A - 用於線路電壓之具陶瓷電路板與驅動器模組的灌膠之ｌｅｄ模組 - Google Patents

用於線路電壓之具陶瓷電路板與驅動器模組的灌膠之ｌｅｄ模組 Download PDF

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TW201528563A
TW201528563A TW103140955A TW103140955A TW201528563A TW 201528563 A TW201528563 A TW 201528563A TW 103140955 A TW103140955 A TW 103140955A TW 103140955 A TW103140955 A TW 103140955A TW 201528563 A TW201528563 A TW 201528563A
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led module
led
carrier body
leds
ceramic
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TW103140955A
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Marco Heinrich
Anton Gschwaendler
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Ceramtec Gmbh
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/86—Ceramics or glass
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
    • F21V3/062—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being plastics
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F21V31/04—Provision of filling media
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F21V31/005—Sealing arrangements therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00—Point-like light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/30—Elongate light sources, e.g. fluorescent tubes curved
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10356—Cables

Abstract

一種LED模組(1)，具有一載體本體(2)，該載體本體(2)的表面設有鍍金屬區域(3)，形成一電路板，且其上設LED(4)，為了使該LED模組(1)可立即使用，亦即可直接地連接到一電源，故除了該等LED(4)外，其驅動器構件(5)也設在鍍金屬區域(3)，且至少該些具有驅動器構件(5)的LED(4)用一透光的材料蓋住，且電端子元件(7)與該些LED(4)或驅動器構件(3)連接且從該透光的材料(6)伸出來。 (圖1)

Description

用於線路電壓之具陶瓷電路板與驅動器模組的灌膠之LED模組
本發明關於一種一種LED模組，具有一載體本體，該載體本體的表面設有鍍金屬區域，形成一電路板，且其上設LED。
具有載體的及未澆鑄的蓋材料LED模組〔它們由塑膠或金屬(如鋁或鋼，例如用非導體如琺瑯質或陶瓷包圍者)構成〕，它們用係習知者(該蓋材料蓋在LED上)，驅動電路在空間上係隔開者。
本發明的目的將申請專利範圍第1項的引文的LED模組改善，使它可立即使用，亦即可直接連接到電源。
依本發明，此目的達成之道為：除了該些LED外，其驅動器構件也設在鍍金屬區域，且至少該些具有驅動器構件的LED用一透光的材料蓋住，且電端子元件與該些LED或驅動器構件接且從該透光的材料伸出來。
利用導電材料住，LED與驅動器構件受保護以防濕氣及環境影響，其中LED產生的光可近乎無阻地從LED模組出來，利用電端子元件，該LED模組可簡單地接到一電源，「用一透光材料蓋住」一詞亦可指「利 用一透光材料灌膠」。
載體本體(Trägerkörper，英：carrier body)宜設計成板形。在特別的實施例，載體本體也可設計成彎曲，例如，載體本體可呈管形。
載體本體宜由一陶瓷材料構成，它可為氧化鋁或氮化鋁。陶瓷材料具高抗打穿強度及充分的導熱性，在陶瓷材料的場合宜將構成電路板的鍍金屬區域隨載體本體燒結。為此，將鍍金屬區域印刷到坯件上，然後燒結，或將鍍金屬區域印刷到已燒結的載體本體上，然後作燒結。在這些二種情形，熱從LED及驅動器構件傳導到陶瓷中的效果都特別好。「驅動器構件」一詞係指所有用於將LED接到一電壓源所需的電氣或電子元件。
如不用此方式，載體本體也可由陶瓷複合材料、玻璃、玻璃陶瓷或高純度結晶陶瓷構成。鍍金屬區域宜軟銲、粘接到載體本體上或隨載體本體燒結。
電端子元件為端子線路或插接連接器，它們從具透光材料的蓋件穿透出來，「透光材料」指半透明材料，「蓋件」也可為一鑄造件。
透光材料宜蓋住載體本體的整個表面(LED和驅動器構件位在其上)，只有端子元件穿透出來。
因此本發明係一種LED模組，它可為平坦或彎曲者，它具有一個或數個LED或LED構件，它們隨相關的驅動器(一個或數個驅動器或驅動器+電阻器的元件)安裝到一電路板上，電路板由陶瓷或陶瓷複合材料或玻璃或玻璃陶瓷或高純度結晶陶瓷(可鍍以金屬)構成，安裝方法可為軟銲、粘合或燒結，然後再用一透光材料蓋住。此模組可有一插接連接器或與端子線路軟銲(或結合或用其他方式連接)，此模組可直接用一電 源插頭接到一電流線路/端子(例如110V或220V)。
優點：利用不導電的陶瓷或玻璃板可作較佳的保護避免觸電。保護方式IP44或更高的標準可達成。此LED模組可直接連接一家庭供電的電壓。在此可涵蓋亞洲、美洲及歐洲的家庭電壓。防塵密封性利用此蓋件達到(利用保護方式IP44蓋住)。此LED模組可用許多方式安裝(粘合、夾合、螺合、扣合)。
以下利用三個圖詳細說明本發明。
(1)‧‧‧LED模組
(2)‧‧‧載體本體
(3)‧‧‧鍍金屬區域
(4)‧‧‧LED
(5)‧‧‧驅動器構件
(6)‧‧‧透光材料
(7)‧‧‧端子元件
(8)‧‧‧燈
(9)‧‧‧燈泡接頭
(10)‧‧‧插銷
(12)‧‧‧玻璃頂罩
圖1係一本發明之圓形LED模組，圖2係一燈，其係建入具LED的本發明LED模組中，圖3係一方形LED模組。
圖1顯示一圓形LED模組(1)，它具有一圓形的載體本體(2)，其上有燒結的鍍金屬區域(3)，載體本體(2)和鍍金屬區域(3)形成一電路板，其上可設置或軟銲上圓形LED(4)及相關驅動器構件(5)。載體本體(2)的整個表面用一透光材料施覆住或蓋住，透光材料為一種塑膠。電端子電線〔當作端子元件(7)〕從透光材料穿出來。這些端子元件(7)與鍍金屬區域(3)連接成導電。要操作此LED模組(1)，只要將端子元件(7)與一供電網路連接。此處，端子元件(7)由側面在透光材料(6)下方(亦即在蓋件下方)穿出來。
圖2顯示一燈(8)，它係建入在具LED(4)的依本發明灌膠的LED模組，燈由一陶瓷燈泡接頭(9)(或其他材料構成者)構成，LED模組 (1)倚在該燈泡接頭上，端子元件(7)(此處為端子金屬絲)穿過燈泡接頭直到二根插銷(10)為止，可視需要將一玻璃頂罩(12)〔其內部有塗覆(轉換層)〕放在燈泡接頭(9)上，玻璃頂罩(12)將LED模組蓋住。
圖3顯示一方形LED模組(1)的例子，它具有多數安裝在鍍金屬區域(3)上的驅動器構件(5)和LED。載體本體(3)整個表面用透光材料(6)蓋住，端子元件(7)在透光材料(6)下方從LED模組側邊穿出來。
(1)‧‧‧LED模組
(2)‧‧‧載體本體
(3)‧‧‧鍍金屬區域
(4)‧‧‧LED
(5)‧‧‧驅動器構件
(6)‧‧‧透光材料
(7)‧‧‧端子元件

Claims (8)

  1. 一種LED模組(1)，具有一載體本體(2)，該載體本體(2)的表面設有鍍金屬區域(3)，形成一電路板，且其上設LED(4)，其特徵在：除了該等LED(4)外，其驅動器構件(5)也設在鍍金屬區域(3)，且至少該些具有驅動器構件(5)的LED(4)用一透光的材料蓋住，且電端子元件(7)與該些LED(4)或驅動器構件(3)連接且從該透光的材料(6)伸出來。
  2. 如申請專利範圍第1項之LED模組，其中：該載體本體(2)設計成彎曲，亦即非板形。
  3. 如申請專利範圍第1或第2項之LED模組，其中：該載體本體(2)由一陶瓷材料構成。
  4. 如申請專利範圍第1或第2項之LED模組，其中：該載體本體(2)由一陶瓷複合材料、玻璃、玻璃陶瓷或高純度結晶陶瓷構成。
  5. 如申請專利範圍第1~4項之任一項之LED模組，其中：將該鍍金屬區域(3)軟銲上去或粘上去或隨該載體本體作燒結。
  6. 如申請專利範圍第1~5項之任一項之LED模組，其中：該電端子元件(7)為端子線路或插接連接器。
  7. 如申請專利範圍第1~6項之任一項之LED模組，其中：該透光材料(6)蓋住該載體本體(2)的整個表面，該LED(4)及該驅動器構件(5)位在該表面上。
  8. 如申請專利範圍第1~7項之任一項之LED模組，其中： 該透光材料(6)為塑膠。
TW103140955A 2013-11-27 2014-11-26 用於線路電壓之具陶瓷電路板與驅動器模組的灌膠之ｌｅｄ模組 TW201528563A (zh)

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BR112013024771A2 (pt) * 2011-03-29 2019-08-13 Ceram Gmbh corpo de iluminação moldado por injeção com resfriadores cerâmicos e leds
DE102011001907A1 (de) * 2011-04-08 2012-10-11 Insta Elektro Gmbh Beleuchtungseinrichtung
JP3182073U (ja) * 2012-12-21 2013-03-07 黄顯榮 駆動メカニズムを統合したフルカラーｌｅｄパッケージ

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JP2016540384A (ja) 2016-12-22
EP3094922A1 (de) 2016-11-23

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