WO2015076220A1 - 硬質皮膜および硬質皮膜形成用ターゲット - Google Patents
硬質皮膜および硬質皮膜形成用ターゲット Download PDFInfo
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- WO2015076220A1 WO2015076220A1 PCT/JP2014/080346 JP2014080346W WO2015076220A1 WO 2015076220 A1 WO2015076220 A1 WO 2015076220A1 JP 2014080346 W JP2014080346 W JP 2014080346W WO 2015076220 A1 WO2015076220 A1 WO 2015076220A1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0664—Carbonitrides
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D1/00—Coating compositions, e.g. paints, varnishes or lacquers, based on inorganic substances
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0641—Nitrides
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
- C23C14/325—Electric arc evaporation
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3435—Applying energy to the substrate during sputtering
- C23C14/345—Applying energy to the substrate during sputtering using substrate bias
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
- C23C30/005—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process on hard metal substrates
Definitions
- the present invention relates to a hard coating and a target for forming a hard coating.
- Patent Document 1 discloses a film in which Si is added to TiN or CrN to improve oxidation resistance
- Patent Document 2 discloses an oxidation resistance by adding Si to TiAlN.
- Patent Document 3 discloses a film in which Si is added to TiCrAlN to improve oxidation resistance.
- Patent Document 4 shows a film in which oxidation resistance is improved by adding Nb, Si, and B to CrAlN.
- at least one metal element M selected from Al, Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, and W, and C, N, and O are selected.
- a hard film which is a metal compound composed of at least one nonmetallic element X, a part of which is selected from Mn, Cu, Ni, Co, B, Si, S, Y, Ge, and Ga And those substituted with at least one additive element L.
- Patent Document 5 does not show the content of the additive element L alone, nor does it show an example using Ge, which is essential in the present invention.
- the present invention has been made by paying attention to the above-mentioned circumstances, and its object is to have particularly superior oxidation resistance and high hardness than conventional hard coatings such as TiSiN, TiAlSiN, TiCrAlSiN, and AlCrSiN. As a result, it is to realize a hard film exhibiting excellent wear resistance and a target used for forming the hard film.
- the hard coating of the present invention that has solved the above problems has a composition formula of (Ti ⁇ Cr 1- ⁇ ) 1-a Ge a (C 1-x N x ), and the atomic ratio of each element is 0 ⁇ It is characterized by satisfying ⁇ ⁇ 1, 0.010 ⁇ a ⁇ 0.20, and 0.5 ⁇ x ⁇ 1.
- the hard coating may be referred to as “(Ti, Cr, Ge) (C, N) coating”.
- Another hard coating that has solved the above problems has a composition formula of (Ti ⁇ Cr 1- ⁇ ) 1-ab Ge a Si b (C 1-x N x ), and the atomic ratio of each element is 0 ⁇ ⁇ ⁇ 1, 0.010 ⁇ a ⁇ 0.20, b ⁇ 0.29, a + b ⁇ 0.30, and 0.5 ⁇ x ⁇ 1.
- the hard coating may be referred to as “(Ti, Cr, Ge, Si) (C, N) coating”.
- Another hard coating that has solved the above problems has a composition formula of (Ti ⁇ Cr 1- ⁇ ) 1-ac Ge a Al c (C 1-x N x ), and the atomic ratio of each element is 0 ⁇ ⁇ ⁇ 1, 0.010 ⁇ a ⁇ 0.15, 0.40 ⁇ c ⁇ 0.70, and 0.5 ⁇ x ⁇ 1.
- the hard coating may be referred to as “(Ti, Cr, Ge, Al) (C, N) coating”.
- Another hard film was able to solve the above problems, a composition formula (Ti ⁇ Cr 1- ⁇ ) 1-abc Ge a Si b Al c (C 1-x N x), the atomic ratio of each element , 0 ⁇ ⁇ ⁇ 1, 0.010 ⁇ a ⁇ 0.10, b ⁇ 0.15, 0.40 ⁇ c ⁇ 0.70, and 0.5 ⁇ x ⁇ 1.
- the hard coating may be referred to as “(Ti, Cr, Ge, Si, Al) (C, N) coating”.
- the hard coating is one or more selected from the group consisting of Group 4 elements except Ti in the Periodic Table, Group 5 elements, Group 6 elements excluding Cr, Sc, Y, B, and rare earth elements.
- Element M may be contained in an atomic ratio of 0.20 or less in the total metal elements composed of Ti, Cr, elements M, Ge, Si, and Al.
- the present invention is a target used for forming the hard coating, wherein components other than C and N satisfy the component composition, are formed by powder metallurgy, and have a relative density of 92% or more.
- a target for forming a hard film having characteristics is also included.
- Ge in the component composition forms a compound with at least one element of Ti, Cr, Al and Si in the component composition, or is dissolved in the element preferable.
- a hard film that is particularly superior in oxidation resistance than conventional hard films such as TiSiN, TiAlSiN, etc., and as a result, exhibits excellent wear resistance. If this hard coating is formed on the surface of a cutting tool such as a chip, a drill or an end mill; or a jig, tool such as a press, a forging die or a punch, or a machine part; Increased dramatically.
- the present inventor is concerned with the additive elements based on the conventional hard film: TiCrN or the like described above.
- the conventional hard film TiCrN or the like described above.
- Ge in the film is preferentially oxidized by the frictional heat generated in a sliding environment such as cutting to become a protective film, and the film is oxidized. It has been found that progress can be suppressed and excellent oxidation resistance can be obtained.
- the hard film of the present invention that exhibits particularly excellent oxidation resistance including Ge as described above will be described.
- the atomic ratio of Ge in the metal elements (Ti, Cr, Ge), that is, the Ge amount a needs to be 0.010 or more.
- the Ge amount a is more preferably 0.030 or more, and further preferably 0.050 or more.
- Ge is an element that acts to make the film amorphous. If Ge is excessively contained, the film tends to soften. Therefore, the Ge amount a is set to 0.20 or less.
- the Ge amount a is preferably less than 0.15, more preferably less than 0.10.
- the present invention is characterized in that it contains a prescribed amount of Ge, and the base film is effective regardless of whether it is TiN, CrN, or TiCrN.
- the ratio ( ⁇ , 1- ⁇ ) of Ti and Cr in the hard coating may be arbitrary, in the present invention, the atomic ratio ⁇ of Ti in Ti and Cr is set to 0 ⁇ ⁇ ⁇ 1. From the viewpoint of ensuring the hardness of the coating, ⁇ is preferably 0.2 or more, and more preferably 0.5 or more.
- the hard coating of the present invention is based on nitride, but a part of nitrogen may be substituted with carbon.
- carbon is included within a range where the atomic ratio of C to C + N (1-x) does not exceed 0.5, that is, within a range where the atomic ratio x of N satisfies 0.5 ⁇ x ⁇ 1. That's fine.
- the Si amount b is set to 0.29 or less.
- the Si amount b is preferably less than 0.20.
- the total amount of Si and Ge (a + b) is set to 0.30 or less.
- the total amount (a + b) of Si and Ge is preferably 0.25 or less.
- the atomic ratio of Ge in the metal element that is, the Ge amount a needs to be 0.010 or more as in the case of the (Ti, Cr, Ge) (C, N) film.
- the Ge amount a is more preferably 0.030 or more, and further preferably 0.050 or more.
- Ge is an element that acts on amorphization of the film as described above, and when Ge is excessively contained, the film tends to soften. Therefore, the Ge amount a is set to 0.20 or less.
- the Ge amount a is preferably less than 0.15, more preferably less than 0.10.
- the ratio of Ti and Cr ( ⁇ , 1- ⁇ ) in the hard coating may be arbitrary, in the present invention, the atomic ratio ⁇ of Ti in Ti and Cr is set to 0 ⁇ ⁇ ⁇ 1. From the viewpoint of ensuring the hardness of the coating, ⁇ is preferably 0.2 or more, and more preferably 0.5 or more.
- This hard coating is also based on nitride, but a part of nitrogen may be substituted with carbon.
- carbon is included within a range where the atomic ratio of C to C + N (1-x) does not exceed 0.5, that is, within a range where the atomic ratio x of N satisfies 0.5 ⁇ x ⁇ 1. That's fine.
- the (Ti, Cr, Ge) (C, N) film and the (Ti, Cr, Ge, Si) (C, N) film are described. I found that the improvement of chemical efficiency. In the present invention, it has further been found that, by adding Ge and Si in combination, hardness, oxidation resistance and wear resistance are improved as a film characteristic due to a synergistic effect. The effects of Ge and Ge + Si are also exhibited when a (Ti, Cr, Al) (C, N) film is used as a base, as shown below.
- the (Ti, Cr) (C, N) film contains Al, (Ti, Al) (C, N) film, (Cr, Al) (C, N) film, or (Ti, Cr, Al) Even when a (C, N) film is used as a base, by adding Ge, oxidation resistance superior to that of the (Ti, Al) (C, N) film or the like can be obtained.
- the operational effects are as described for the (Ti, Cr, Ge) (C, N) film.
- the atomic ratio of Ge in the metal elements (Ti, Cr, Ge, Al), that is, the Ge amount a must be 0.010 or more.
- the Ge amount a is more preferably 0.030 or more, and further preferably 0.050 or more.
- Ge is an element that causes the film to become amorphous
- Al is an element that acts to soften the film. Therefore, in order to suppress softening of the film, the Ge amount a of this film is 0.15 or less, which is lower than 0.20 which is the upper limit of Ge amount of the (Ti, Cr, Ge) (C, N) film. To do.
- the Ge amount a is preferably less than 0.10.
- the ratio of Ti and Cr ( ⁇ , 1- ⁇ ) is arbitrary as in the case of the above-described (Ti, Cr, Ge) (C, N) film or (Ti, Cr, Ge, Si) (C, N) film. Therefore, in the present invention, the atomic ratio ⁇ of Ti to Ti and Cr is set to 0 ⁇ ⁇ ⁇ 1. In addition, from the viewpoint of ensuring the hardness of the coating, ⁇ is preferably 0.2 or more.
- the atomic ratio of Al in the metal element that is, the Al amount c is 0.40 or more, preferably 0.50 or more, 0.70 or less, preferably 0.65 or less from the viewpoint of ensuring high hardness and high oxidation resistance.
- this hard film is also based on nitride, Some may be substituted with carbon.
- carbon is included within a range where the atomic ratio of C to C + N (1-x) does not exceed 0.5, that is, within a range where the atomic ratio x of N satisfies 0.5 ⁇ x ⁇ 1. That's fine.
- the Si amount b is set to 0.15 or less.
- the Si amount b is preferably 0.10 or less.
- the total amount of Si and Ge (a + b) is preferably 0.20 or less.
- the total amount (a + b) of Si and Ge is more preferably 0.15 or less.
- the atomic ratio of Ge occupying the metal element that is, the Ge amount a needs to be 0.010 or more as in the case of the (Ti, Cr, Ge, Al) (C, N) film.
- the Ge amount a is more preferably 0.030 or more, and further preferably 0.050 or more.
- Ge is an element that acts on the amorphization of the film as described above. If Ge is excessively contained, the film tends to be softened. Therefore, the Ge amount a is set to 0.10 or less.
- the Ge amount a is preferably 0.08 or less.
- the ratio of Ti and Cr ( ⁇ , 1- ⁇ ) in the hard coating may be arbitrary, in the present invention, the atomic ratio ⁇ of Ti in Ti and Cr is set to 0 ⁇ ⁇ ⁇ 1. In addition, from the viewpoint of ensuring the hardness of the coating, ⁇ is preferably 0.2 or more.
- the atomic ratio of Al in the metal element that is, the Al amount c is 0.40 or more, preferably 0.50 or more, 0.70 or less, preferably 0.65 or less from the viewpoint of ensuring high hardness and high oxidation resistance.
- the hard coating of the present invention is based on nitride, but a part of nitrogen may be substituted with carbon.
- carbon is included in a range where the atomic ratio (1-x) of C in C + N does not exceed 0.5, that is, in a range where the atomic ratio x of N satisfies 0.5 ⁇ x ⁇ 1. Also good.
- Group 4 elements except for Ti in the periodic table Group 5 elements, Group 6 elements excluding Cr, Sc, Y , B, and one or more elements selected from the group consisting of rare earth elements, that is, “element M” is an atomic ratio in the total metal elements composed of Ti, Cr, elements M, Ge, Si, and Al of 0. It may contain 20 or less.
- the element M is an element that contributes to further increase in hardness and oxidation resistance.
- the atomic ratio can be set to 0.03 or more, and further 0.05 or more, for example.
- the rare earth elements include lanthanoid elements, that is, a total of 15 elements from La having atomic number 57 to Lu having atomic number 71 in the periodic table.
- the film thickness of the hard coating of the present invention is desirably in the range of 0.5 ⁇ m to 20 ⁇ m.
- the film thickness is less than 0.5 ⁇ m, the film thickness is too thin and it is difficult to provide excellent wear resistance.
- the film thickness exceeds 20 ⁇ m, film loss or peeling occurs during cutting. Because it does.
- the film thickness is more preferably 1 ⁇ m or more and 10 ⁇ m or less.
- a target used as a solid deposition source is evaporated or ionized, and a film is formed on a substrate to be processed in a gas containing nitrogen or hydrocarbon.
- arc ion plating An ion plating method such as an AIP or Arc Ion Platting method, or a PVD (Physical Vapor Deposition) reactive film formation such as a sputtering method is effective.
- Examples of the film forming conditions include the following conditions.
- the relative density of the target used for the formation of the hard film needs to be 92% or more in order to secure a stable discharge state in vacuum during film formation and to obtain a hard film with a small surface roughness.
- the relative density of the target is lower than 92%, more particles are scattered from the target during film formation, and the surface roughness of the hard coating formed is increased.
- a hard film having a large surface roughness is not preferred because the film has a low hardness and does not exhibit high wear resistance.
- the relative density is preferably 95% or more, more preferably 99% or more.
- the target of the present invention is a multi-component system, it is difficult to produce the target by a dissolution method.
- the target of the present invention can be obtained by mixing raw material powders, that is, formed by powder metallurgy. Then, by performing forging or HIP (Hot Isostatic Pressing) in the target manufacturing process, the relative density of the target can be increased and the above-mentioned relative density can be achieved.
- HIP Hot Isostatic Pressing
- the Ge constituting the target is an element that easily oxidizes. Therefore, as a Ge-containing raw material used for the production of the target, for example, Ge; and other elements contained in the target, that is, at least one element of Ti, Cr, Al and Si; Intrusion of impurities can be suppressed, and a high-purity target can be easily manufactured.
- Ge contained in the obtained target may form an element such as Ti and a compound, particularly an intermetallic compound, or may be dissolved in the element such as Ti.
- the “solid solution” includes the case of alloying with the element such as Ti.
- the target component composition determines the component composition of the formed film excluding C and N
- the target component composition is the same as the component composition of the target film excluding C and N It is good.
- Example 1 Evaluation of (Ti, Cr, Ge) (C, N) film and (Ti, Cr, Ge, Si) (C, N) film]
- a film was formed by the AIP method.
- a target containing elements necessary for film formation except for C and N that is, a target satisfying the composition of metal components of the film shown in Table 1, that is, Ti, Cr, elements M, Ge, and Si, is attached to the evaporation source.
- a cemented carbide chip, a cemented carbide, 10 mm diameter, 2-blade ball end mill, or a size for an oxidation test is 30 mm ⁇ 5 mm ⁇ 0.
- a platinum foil of 1 mmt was attached.
- the temperature of the substrate is heated to 500 ° C. with a heater in the chamber, and cleaning of the object to be processed with Ar ions is performed under an Ar atmosphere at a pressure of 0.6 Pa, a voltage of 500 V, The test was carried out for 5 minutes. Thereafter, nitrogen gas was introduced to bring the total pressure in the chamber to 4 Pa, arc discharge was performed, and a film having a film thickness of 3 ⁇ m having the component composition shown in Table 1 was formed on the surface of the substrate to obtain a test piece. . In addition, the blank in the component composition of the film
- methane gas was introduced into the film forming apparatus in a flow rate ratio of 5 to 50 vol% with respect to nitrogen gas.
- a bias voltage of 20 to 100 V was applied to the substrate so that the substrate had a negative potential with respect to the ground potential.
- the composition of the film and the Vickers hardness were measured by the methods shown below, and the oxidation resistance and wear resistance were evaluated.
- the oxidation resistance was evaluated by performing an oxidation test. Specifically, a test piece having a film formed on a platinum foil was used, mass measurement was performed while raising the temperature in artificial dry air, and the oxidation start temperature was determined from the mass increase curve. And oxidation resistance was evaluated at this oxidation start temperature. In the mass measurement, the temperature increase rate was 4 ° C./min, and the measurement was performed up to 1200 ° C.
- the wear resistance was evaluated by conducting a cutting test. Specifically, a cutting test was performed under the following conditions using a test piece in which a film was formed on a cemented carbide ball end mill. In this test, the cutting length until the side wear at the boundary reaches 100 ⁇ m was measured as the tool life. The wear resistance was evaluated based on the tool life.
- Cutting length Cutting length until side wear at the boundary reaches 100 ⁇ m Others: Down cut, dry cut, air blow only
- Table 1 shows the following. No. 1 TiN, and No. 1 No. 2 CrN contains no Ge, so the hardness of the film is low. No. 1 TiN had a low oxidation start temperature, and in all cases, the tool life was shortened, and excellent wear resistance could not be ensured.
- No. 3 contains Ge, but its content is insufficient. Although the oxidation start temperature was slightly higher than 1, and the tool life was also slightly higher, sufficient oxidation resistance could not be secured, and as a result, excellent wear resistance could not be obtained.
- No. 4 to 7 are (Ti, Cr, Ge) (C, N) films containing a predetermined amount of Ge. These coatings have high oxidation resistance, that is, high oxidation start temperature, hardness of 20 GPa or more, long tool life, and excellent wear resistance. In order to obtain higher hardness and excellent oxidation resistance and wear resistance, the Ge amount should be 0.030 or more, more preferably 0.050 or more, and particularly 0.10 or more. I know it ’s good.
- No. 11 and 12 are examples in which the ratio of C and N is changed.
- No. 13 is an example in which Ta is added as the element M to the (Ti, Cr, Ge) (C, N) film. Also in this case, it can be seen that it exhibits high hardness and high oxidation resistance and is excellent in wear resistance.
- No. Reference numerals 14 to 18 are examples related to the (Ti, Cr, Ge, Si) (C, N) film, in which the amount of Si is changed.
- the wear resistance was sufficiently increased by adding a small amount of Si.
- the oxidation start temperature is 950 ° C. or more
- the hardness is 25 GPa or more
- the tool life is 100 m or more
- excellent wear resistance Demonstrated sex.
- no. No. 18 has an excessive amount of Si, and the total amount of Ge and Si is also excessive. Therefore, the oxidation resistance is high, but the hardness is lowered, and as a result, excellent wear resistance cannot be obtained.
- No. 19 is an example in which Nb is added as the element M to the (Ti, Cr, Ge, Si) (C, N) film. Also in this case, it can be seen that it exhibits high hardness and high oxidation resistance and is excellent in wear resistance.
- Example 2 Evaluation of (Ti, Cr, Ge, Al) (C, N) film and (Ti, Cr, Ge, Si, Al) (C, N) film]
- a test piece was obtained by forming a film having the composition shown in Table 2 under the same conditions as in Example 1. Then, in the same manner as in Example 1, the component composition and Vickers hardness of the film were measured, and an oxidation test was performed to evaluate the oxidation resistance. Moreover, the cutting test was implemented on the following conditions, and the following "cutting length until side surface abrasion of a boundary part reaches 100 micrometers" was measured as a tool life. The wear resistance was evaluated based on the tool life. In addition, the blank in the component composition of the film
- Table 2 shows the following. No. Since 1 and 2 did not contain Ge, the tool life was low.
- No. Nos. 3 to 7 relate to the (Ti, Cr, Ge, Al) (C, N) film, and are examples in which the Ge amount is changed.
- No. No. 3 contains a specified amount of Ge, but since the Al amount is insufficient, the tool life is reduced.
- No. 4 to 6 are (Ti, Cr, Ge, Al) (C, N) films satisfying the prescribed component composition, they exhibited high hardness and high oxidation resistance, and excellent wear resistance was obtained.
- No. Nos. 8 to 11 are examples in which the Ge amount is constant, and in particular, the Al amount is changed.
- No. No. 8 had a short tool life due to insufficient Al content.
- No. 9 and 10 contain prescribed amounts of Ge and Al, a hard film having excellent wear resistance and oxidation resistance was obtained.
- No. No. 12 is an example containing Cr instead of Ti.
- 13 is an example containing Cr together with Ti. All of these examples exhibited high hardness and high oxidation resistance, and exhibited excellent wear resistance.
- No. 14 is an example in which Ta is added as an element M to a (Ti, Cr, Ge, Al) (C, N) film.
- the element M By adding the element M, a higher hardness and superior oxidation resistance were exhibited, a tool life of 50 m or more was achieved, and excellent wear resistance was exhibited.
- No. 15 to 20 show the results regarding the (Ti, Cr, Ge, Si, Al) (C, N) film further containing Si.
- No. 15 to 18 are amounts in which the Ge amount and the Al amount are made constant, and in particular, the Si amount is changed. No. From the results of 15 to 18, it can be seen that by including the prescribed amounts of Si and Ge, particularly excellent oxidation resistance is exhibited, and as a result, higher wear resistance is exhibited.
- No. No. 19 is an example containing Cr together with Ti.
- 20 is an example containing Cr instead of Ti. All of these examples exhibited high oxidation resistance and high oxidation resistance, and as a result, exhibited excellent wear resistance.
- No. Nos. 21 to 24 are examples in which Ta, W, Y, or B is added as the element M to the (Ti, Cr, Ge, Si, Al) (C, N) film.
- the element M was added, the hardness was as high as 35 GPa or more, the oxidation start temperature was 1150 ° C. or more, the tool life was 65 m or more, and excellent wear resistance was exhibited.
- No. 4 and no. No. 15 has a Ge amount of 0.05.
- No. 4 is no addition of Si. 15 is an example with Si addition.
- Si is added together with Ge. As a result, it can be seen that it exhibits superior oxidation resistance and exhibits superior wear resistance.
- No. 25 to 27 are examples in which Ni, B or Ga is added as an element other than the prescribed element M in place of the element M. From these examples, when an element other than the specified element M is added, the resulting film has low hardness, the oxidation start temperature is considerably low, and the oxidation resistance is poor. As a result, the tool life is remarkably shortened. It turns out that it is inferior to abrasion resistance.
- Example 3 Target evaluation
- a target having the same composition as that of the hard film to be deposited except for components was obtained by obtaining a powder compact by powder metallurgy and then solidifying and densifying it by HIP. For example, by changing the pressure at the time of HIP or the like as the conditions during the production, targets having different relative densities were obtained.
- No. The targets 1 to 6 were prepared using a metal Ge, that is, Ge alone, as a Ge raw material. No. in Table 3 No.
- the target 7 was prepared using a powder in which Ge and Si were alloyed as a Ge raw material.
- the target No. 8 was prepared by using a metal powder in which Ge was dissolved in Al and Ti as a Ge raw material. No. 1 of Table 3 obtained in this way.
- the targets 7 and 8 were in a state where Ge contained in the target was alloyed or dissolved.
- the relative density of the obtained target was measured by the Archimedes method. Further, using the obtained target, a film having a thickness of about 3 ⁇ m was formed on a mirror-finished cemented carbide under the same equipment and film formation conditions as in Example 1. And the surface roughness of the obtained film
- membrane was measured based on JIS. In this example, in order to remove the influence of the film thickness, a value obtained by dividing the measured value by the film thickness is shown in Table 3 as the surface roughness. These results are shown in Table 3.
- Table 3 shows the following. No. As shown in FIG. 1, when the relative density of the target was as low as 85%, abnormal discharge occurred and stable film formation was not possible. No. As shown in FIG. 2, when the relative density of the target was slightly lower than the specified lower limit value, although the film was formed, the surface of the obtained film became rough. In contrast, no. Nos. 3 to 8 were formed using a target having a specified relative density, so that a hard film having a small surface roughness was obtained. In particular, no. 7 and no. In No. 8, since a film was formed using a target in which Ge was alloyed or dissolved, a hard film having a sufficiently small surface roughness was obtained.
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Abstract
Description
まず(Ti,Cr)(C,N)皮膜をベースに、Geを添加した皮膜について説明する。上記Geによる効果として、特に前記保護皮膜形成による十分な保護性を発揮させるには、金属元素(Ti,Cr,Ge)に占めるGeの原子比、即ちGe量aを0.010以上とする必要がある。前記Ge量aは、より好ましくは0.030以上であり、更に好ましくは0.050以上である。一方、Geは皮膜の非晶質化に作用する元素であり、Geが過度に含まれると皮膜が軟質化する傾向にある。よって、前記Ge量aは0.20以下とする。前記Ge量aは、好ましくは0.15未満であり、より好ましくは0.10未満である。
(Ti,Cr)(C,N)皮膜に対し、Geと共にSiを添加すると、GeとSiの相乗効果により、Geのみを添加した場合、つまり前記の(Ti,Cr,Ge)(C,N)皮膜よりも耐酸化性が更に向上する。この効果を十分に発揮させるには、金属元素(Ti,Cr,Ge,Si)に占めるSiの原子比、即ちSi量bを0.01以上とすることが好ましい。前記Si量bは、より好ましくは0.05以上、更に好ましくは0.10以上である。一方、Siを過度に添加した場合、Geを過度に添加した場合と同じく皮膜の非晶質化を招く。よって前記Si量bは0.29以下とする。前記Si量bは、好ましくは0.20未満である。また、皮膜の非晶質化を抑える観点から、SiとGeの合計量(a+b)を0.30以下とする。上記SiとGeの合計量(a+b)は、好ましくは0.25以下である。
前記(Ti,Cr)(C,N)皮膜にAlが含まれる、(Ti,Al)(C,N)皮膜、(Cr、Al)(C,N)皮膜、または(Ti,Cr,Al)(C,N)皮膜をベースとした場合も、Geを添加することによって、上記(Ti,Al)(C,N)皮膜等よりも一層優れた耐酸化性を得ることができる。作用効果は、前記(Ti,Cr,Ge)(C,N)皮膜で述べた通りである。
(Ti,Al)(C,N)皮膜、(Cr、Al)(C,N)皮膜、または(Ti,Cr,Al)(C,N)皮膜をベースに、前記(Ti,Cr,Ge,Si)(C,N)皮膜と同じく、GeとSiを複合添加することによって、耐酸化性がより一層向上する。この効果を十分に発揮させるには、金属元素(Ti,Cr,Ge,Si,Al)に占めるSiの原子比、即ちSi量bを0.01以上とすることが好ましい。前記Si量bは、より好ましくは0.03以上である。一方、Siを過度に添加した場合、Geを過度に添加した場合と同じく皮膜の非晶質化を招く。よって前記Si量bは0.15以下とする。前記Si量bは、好ましくは0.10以下である。また、皮膜の非晶質化を抑える観点から、SiとGeの合計量(a+b)を0.20以下とすることが好ましい。該SiとGeの合計量(a+b)は、より好ましくは0.15以下である。
全圧力:AIP法の場合:0.5Pa以上4Pa以下、
スパッタリング法の場合:0.05Pa以上1Pa以下
成膜時の基板に印加するバイアス電圧:20~200V(アース電位に対してマイナス電位)
成膜時の基板温度:300℃以上800℃以下
成膜方法としてAIP法で成膜した。蒸発源に、C、Nを除き成膜に必要な元素を含有するターゲット、即ち、表1に示す皮膜の金属成分、即ち、Ti、Cr、元素M、GeおよびSiの組成を満たすターゲットを取り付け、支持台上には、被処理体である基板として、超硬合金製チップ、超硬合金製であって直径10mm、2枚刃のボールエンドミル、または酸化試験用のサイズが30mm×5mm×0.1mmtである白金箔を取り付けた。そして、チャンバー内を真空状態にした後、チャンバー内にあるヒーターで前記基板の温度を500℃に加熱し、Arイオンによる被処理体のクリーニングを、Ar雰囲気下、圧力0.6Pa、電圧500V、時間5分の条件で実施した。その後、窒素ガスを導入してチャンバー内の全圧力を4Paとし、アーク放電を行って、前記基板の表面に、表1に示す成分組成の膜厚3μmの皮膜を形成して試験片を得た。尚、表1の皮膜の成分組成における空欄は添加していないことを示す。
超硬合金製チップ上に皮膜を形成した試験片を用いて、前記皮膜の成分組成とビッカース硬度を調べた。前記皮膜のC、Nを含む成分組成はEPMA(Electron Probe MicroAnalyser)により測定した。前記ビッカース硬度は、マイクロビッカース硬度計にて測定荷重0.245N、測定時間15秒の条件で測定した。
耐酸化性は、酸化試験を行って評価した。具体的には、白金箔上に皮膜を形成した試験片を使用し、人工乾燥空気中で昇温させながら質量測定を行い、その質量増加曲線から酸化開始温度を求めた。そしてこの酸化開始温度で耐酸化性を評価した。前記質量測定では、昇温速度を4℃/分とし、1200℃まで測定を行った。
耐摩耗性は、切削試験を行って評価した。具体的には、超硬合金製ボールエンドミル上に皮膜を形成した試験片を用い、以下の条件で切削試験を行った。該試験では、境界部の側面摩耗が100μmに達するまでの切削長を工具寿命として測定した。そしてこの工具寿命で耐摩耗性の評価を行った。
実施例1における切削試験条件
被削材:JIS規格のSKD61(HRC55)
切削速度:500m/分
刃送り:0.06mm/刃
軸切り込み:5mm
径切り込み:0.6mm
切削長:境界部の側面摩耗が100μmに達するまでの切削長
その他:ダウンカット、ドライカット、エアブローのみ
実施例1と同じ条件で、表2に示す成分組成の皮膜を形成して試験片を得た。そして実施例1と同様にして、皮膜の成分組成とビッカース硬さを測定すると共に、酸化試験を行って耐酸化性を評価した。また、切削試験を下記の条件で実施し、下記の「境界部の側面摩耗が100μmに達するまでの切削長」を工具寿命として測定した。そしてこの工具寿命で耐摩耗性の評価を行った。尚、表2の皮膜の成分組成における空欄は添加していないことを示す。
実施例2における切削試験条件
被削材:JIS規格のSKD11(HRC60)
切削速度:150m/分
刃送り:0.04mm/刃
軸切り込み:4.5mm
径切り込み:0.2mm
切削長:境界部の側面摩耗が100μmに達するまでの切削長
その他:ダウンカット、ドライカット、エアブローのみ
Ti0.15Cr0.20Al0.50Si0.10Ge0.05の組成(下付の数字は、金属元素に占める原子比で表される割合)からなるターゲット、即ち、CおよびNを除く成分が成膜しようとする硬質皮膜の組成と同じターゲットを、粉末冶金法により粉末成形体を得た後、HIP法により固化・高密度化して作製した。該作製時の条件として例えばHIP時の圧力等を変えることによって、相対密度の異なるターゲットを得た。尚、表3のNo.1~6のターゲットは、Ge原料に金属Ge、即ちGe単体を用いて作製した。表3のNo.7のターゲットは、Ge原料としてGeとSiが合金化した粉末を用いて作製し、No.8のターゲットは、Ge原料としてGeがAlおよびTi内に固溶した金属粉末を用いて作製した。この様にして得られた表3のNo.7および8のターゲットは、該ターゲットに含まれるGeが合金化または固溶した状態であった。
Claims (10)
- 組成式が(TiαCr1-α)1-aGea(C1-xNx)であり、
各元素の原子比が、
0≦α≦1、
0.010≦a≦0.20、および
0.5≦x≦1
を満たすことを特徴とする硬質皮膜。 - 周期律表のTiを除く第4族元素、第5族元素、Crを除く第6族元素、Sc、Y、B、および希土類元素よりなる群から選択される1種以上の元素Mを、Ti、Cr、元素MおよびGeからなる全金属元素に占める原子比で0.20以下含む請求項1に記載の硬質皮膜。
- 組成式が(TiαCr1-α)1-a-bGeaSib(C1-xNx)であり、
各元素の原子比が、
0≦α≦1、
0.010≦a≦0.20、
b≦0.29、
a+b≦0.30、および
0.5≦x≦1
を満たすことを特徴とする硬質皮膜。 - 周期律表のTiを除く第4族元素、第5族元素、Crを除く第6族元素、Sc、Y、B、および希土類元素よりなる群から選択される1種以上の元素Mを、Ti、Cr、元素M、GeおよびSiからなる全金属元素に占める原子比で0.20以下含む請求項3に記載の硬質皮膜。
- 組成式が(TiαCr1-α)1-a-cGeaAlc(C1-xNx)であり、
各元素の原子比が、
0≦α≦1、
0.010≦a≦0.15、
0.40≦c≦0.70、および
0.5≦x≦1
を満たすことを特徴とする硬質皮膜。 - 周期律表のTiを除く第4族元素、第5族元素、Crを除く第6族元素、Sc、Y、B、および希土類元素よりなる群から選択される1種以上の元素Mを、Ti、Cr、元素M、GeおよびAlからなる全金属元素に占める原子比で0.20以下含む請求項5に記載の硬質皮膜。
- 組成式が(TiαCr1-α)1-a-b-cGeaSibAlc(C1-xNx)であり、
各元素の原子比が、
0≦α≦1、
0.010≦a≦0.10、
b≦0.15、
0.40≦c≦0.70、および
0.5≦x≦1
を満たすことを特徴とする硬質皮膜。 - 周期律表のTiを除く第4族元素、第5族元素、Crを除く第6族元素、Sc、Y、B、および希土類元素よりなる群から選択される1種以上の元素Mを、Ti、Cr、元素M、Ge、SiおよびAlからなる全金属元素に占める原子比で0.20以下含む請求項7に記載の硬質皮膜。
- 請求項1~8のいずれかに記載の硬質皮膜の形成に用いるターゲットであって、
CおよびNを除く成分組成が請求項1~8のいずれかに記載の成分組成を満たし、かつ粉末冶金法により形成され、かつ相対密度が92%以上であることを特徴とする硬質皮膜形成用ターゲット。 - 前記成分組成におけるGeは、前記成分組成におけるTi、Cr、AlおよびSiの少なくとも1種の元素と化合物を形成しているか、該元素に固溶している請求項9に記載の硬質皮膜形成用ターゲット。
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EP3072990A1 (en) | 2016-09-28 |
EP3072990A4 (en) | 2017-06-28 |
JP2015101736A (ja) | 2015-06-04 |
JP6059640B2 (ja) | 2017-01-11 |
US20160251748A1 (en) | 2016-09-01 |
KR20160073395A (ko) | 2016-06-24 |
KR101811972B1 (ko) | 2018-01-25 |
US9850567B2 (en) | 2017-12-26 |
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